Wiring board and method for manufacturing the same

Abstract

The present invention provides a wiring board with a structure that prevents stress concentration at the point where the resin portion covering the electronic components placed inside the cavity and the insulating layer located beneath the resin portion come into contact. [Solution] The wiring board comprises a core layer, a first wiring layer formed on the upper surface of the core layer, a first insulating layer formed on the upper surface of the core layer and covering the first wiring layer, a second wiring layer formed on the lower surface of the core layer, a second insulating layer formed on the lower surface of the core layer and covering the second wiring layer, a cavity penetrating the core layer, an electronic component disposed within the cavity, and a resin portion covering the entire upper surface and a portion of the side surface of the electronic component within the cavity. The lower surface of the resin portion is located above the lower surface of the core layer, and a portion of the second insulating layer extends into the cavity and contacts the lower surface of the resin portion.

Claims

1. The core layer, A first wiring layer formed on the upper surface of the core layer, A first insulating layer formed on the upper surface of the core layer and covering the first wiring layer, A second wiring layer formed on the lower surface of the core layer, A second insulating layer is formed on the lower surface of the core layer and covers the second wiring layer, A cavity penetrating the aforementioned core layer, Electronic components arranged within the cavity, The cavity contains a resin portion that covers the entire upper surface and a portion of the side surface of the electronic component, A wiring board in which the lower surface of the resin portion is located above the lower surface of the core layer, and a portion of the second insulating layer extends into the cavity and contacts the lower surface of the resin portion.

2. The wiring board according to claim 1, wherein the inner wall surface of the cavity has a portion in contact with the resin portion and a portion in contact with the second insulating layer.

3. The wiring board according to claim 1, wherein the upper surface of the resin portion is flush with the upper surface of the core layer, or is located at a lower position than the upper surface of the core layer.

4. The electronic component has an electrode-forming surface on which electrodes are formed, and the electrodes are arranged in the cavity facing the second wiring layer. The electrode forming surface is in contact with the second insulating layer, The wiring board according to any one of claims 1 to 3, wherein in the second insulating layer, the position in contact with the lower surface of the resin portion is above the position in contact with the electrode forming surface.

5. A step of preparing a core layer having a first wiring layer on the upper surface and a second wiring layer on the lower surface, A step of forming a cavity that penetrates the core layer, The process of placing electronic components in the cavity, The steps include: placing a resin film on the upper surface of the electronic component; A step of placing a first insulating layer that covers the first wiring layer and the resin film on the upper surface of the core layer, pressing the first insulating layer toward the core layer to deform the resin film, and forming a resin portion that covers the entire upper surface and a part of the side surface of the electronic component, The process includes the step of placing a second insulating layer that covers the second wiring layer on the lower surface of the core layer, In the process of forming the resin portion, the lower surface of the resin portion is located above the lower surface of the core layer. A method for manufacturing a wiring board, wherein in the step of arranging the second insulating layer, a portion of the second insulating layer enters the cavity and comes into contact with the lower surface of the resin portion.

6. The method for manufacturing a wiring board according to claim 5, wherein in the step of arranging the resin film, the resin film is arranged so as to protrude from the upper surface of the core layer.

7. The method for manufacturing a wiring board according to claim 6, wherein in the step of arranging the resin film, the resin film is arranged so as to be separated from the inner wall surface of the cavity.

8. In the step of arranging the resin film, a semi-cured resin film is arranged. A method for manufacturing a wiring board according to any one of claims 5 to 7, wherein in the step of forming the resin portion, an uncured first insulating layer is placed, the first insulating layer is pressed toward the core layer to deform the resin film, a resin portion for covering the electronic component is formed, and then the resin portion and the first insulating layer are cured.

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