Methods and apparatus for temperature distribution

Abstract

The present invention provides a method and apparatus for improving temperature distribution through radiation shielding. [Solution] The system includes a susceptor on which a wafer is placed and a radiation shield 130. The radiation shield 130 comprises a body 235 having a plurality of notches 200 arranged in a plurality of circular zones, and a plurality of removable segments 205, each segment being positioned in one of the plurality of notches 200.

Description

Technical Field

[0001] This disclosure generally relates to methods and apparatus for temperature distribution. More specifically, this disclosure relates to a radiation shield disposed below a susceptor within a lower chamber of a reactor.

Background Art

[0002] Non-uniformity patterns in films on wafers can be caused, in part, by temperature gradients within a reactor. In many cases, a susceptor heats a wafer during processing, but heat loss in the susceptor can create undesirable temperature non-uniformities across the susceptor and the wafer.

Summary of the Invention

Means for Solving the Problems

[0003] Various embodiments of the present technology may provide a radiation shield formed from a body having a plurality of cutouts. The radiation shield may also include a plurality of removable segments shaped to be disposed within the cutouts.

[0004] According to one aspect, an apparatus includes a body having a plurality of cutouts disposed within a plurality of circular zones, and a plurality of removable segments, each segment being disposed within one of the plurality of cutouts.

[0005] In one embodiment, the plurality of circular zones includes at least two circular zones.

[0006] In one embodiment, the apparatus further includes a plurality of stabilizers disposed on a bottom surface of the body, the stabilizers extending toward the cutouts.

[0007] In one embodiment, the plurality of removable segments directly contact at least one of the stabilizers from the plurality of stabilizers.

[0008] In one embodiment, the body is formed from a metallic material containing at least one of aluminum, nickel, or tungsten.

[0009] In one embodiment, the number of removable segments is in the range of 20 to 48 segments.

[0010] In one embodiment, each segment from a plurality of removable segments comprises a first surface having a first emissivity and a second opposite surface having a second emissivity.

[0011] In one embodiment, the first emissivity is different from the second emissivity.

[0012] In one embodiment, the number of notches is equal to the number of removable segments.

[0013] In one embodiment, each notch includes an edge facing the interior, which includes a groove.

[0014] In one embodiment, each segment has an outer edge with a projection sized to fit into a groove.

[0015] In one embodiment, the main body has a height in the range of 1 mm to 2 mm, and each segment also has a height in the range of 1 mm to 2 mm.

[0016] In another embodiment, the system comprises a reaction chamber having a support assembly, the support assembly comprising a pedestal and a susceptor connected to the pedestal; and a plate connected to the support assembly, the plate comprising a body having pockets and a plurality of removable segments arranged within the pockets.

[0017] In one embodiment, each segment comprises a main body and a lip extending outward from the main body.

[0018] In one embodiment, the lip of one segment overlaps with the lip of an adjacent segment.

[0019] In one embodiment, a first segment from a plurality of removable segments has a first emissivity, and a second segment from a plurality of removable segments has a second emissivity.

[0020] In one embodiment, the plate has a height in the range of 1 mm to 2 mm.

[0021] In another embodiment, the system comprises a reaction chamber having a support assembly, the support assembly comprising a pedestal and a susceptor connected to the pedestal; and a plate connected to the support assembly, the plate comprising a body having a plurality of notches, the first notch being located at the geometric center of the plate and the second notch being located adjacent to the first notch and having an arch shape, and at least one region on the upward-facing surface of the body having a different emissivity from the rest of the upward-facing surface.

[0022] In one embodiment, the plate has a thickness in the range of 1 mm to 2 mm.

[0023] In one embodiment, the notch has a width in the range of 5 mm to 30 mm. [Brief explanation of the drawing]

[0024] A more complete understanding of this technology may be obtained by referring to embodiments for carrying out the invention, as considered in relation to the following illustrative drawings. In the following drawings, similar reference numerals refer to similar elements and processes throughout the drawings.

[0025] [Figure 1] A typical diagram of a system according to an embodiment of this technology. [Figure 2] This is a top view of a radiation shield according to an embodiment of this technology. [Figure 3] Perspective view of a radiation shield according to an embodiment of the present technology. [Figure 4] Bottom view of a part of a radiation shield according to an embodiment of the present technology. [Figure 5] Partial cross-sectional view of a radiation shield according to an embodiment of the present technology. [Figure 6A] Cross-sectional view of a radiation shield according to an embodiment of the present technology. [Figure 6B] Partial cross-sectional view of a radiation shield according to an embodiment of the present technology. [Figure 7A] Perspective view of a radiation shield according to an embodiment of the present technology. [Figure 7B] Perspective view of a radiation shield according to an embodiment of the present technology. [Figure 8] Perspective view of a radiation shield according to an embodiment of the present technology.

Mode for Carrying Out the Invention

[0026] The present technology may be described with respect to components of functional blocks and various processing steps. Such functional blocks may be implemented by any number of components configured to perform a specified function and to achieve various results. For example, the present technology may employ various reaction chambers, vessels, and susceptors.

[0027] Referring to FIG. 1, an exemplary system 100 may include a reactor 105 configured to perform a process on a substrate 135, such as an object to be processed, such as a wafer. For example, the reactor 105 may be configured to perform heating, deposition, etching, polishing, ion implantation, and / or other processes on the object to be processed. In some embodiments, the reactor 105 may be configured to perform a moving function, a vacuum sealing function, and an exhaust function. In some embodiments, the reactor 105 may perform an atomic layer deposition (ALD) process or a chemical vapor deposition (CVD) process.

[0028] In various embodiments, the reactor 105 may comprise a reaction chamber 110 and a showerhead 115. The reaction chamber 110 may comprise side walls forming a lower chamber volume 140. The showerhead 115 may be configured to deliver steam into the reaction chamber 110. Specifically, the showerhead 115 may be configured to deliver steam into a reaction space 145 in which the substrate 135 is positioned during the deposition process or other process. Together with the reaction chamber 110, the showerhead 115 forms an enclosed space including the lower chamber volume 140 and the reaction space 145.

[0029] In various embodiments, the shower head 115 may be positioned on the upper surface of the reaction chamber 110. In some embodiments, the shower head 115 may be fixed to the side wall, but in other embodiments, the shower head 115 may simply be placed on the side wall of the reaction chamber 110.

[0030] In various embodiments, the system 100 may further include a support assembly located within the reactor 105. The support assembly may include a susceptor 120 having a surface for supporting the substrate 135, and a pedestal 125 connected to the susceptor 120. In various embodiments, the susceptor 120 may include a heating element 150 for heating the substrate 225. For example, the heating element 150 may be a resistance heating element or any other suitable heating element. The heating element 150 may be embedded within the susceptor 120.

[0031] For loading / unloading the substrate 135, the support assembly may be configured to be movable vertically (up and down) by being connected to a drive unit (not shown). For example, the pedestal 125 may be connected to a drive unit, thereby moving the pedestal 125 and the susceptor 120 together.

[0032] In various embodiments, the support assembly may be located within the lower chamber 140 of the reaction chamber 110. For example, the pedestal 125 may be located within the lower chamber 140, while the susceptor 120 may be exposed to both the lower chamber 140 and the reaction space 145, depending on the position of the support assembly. Figure 1 illustrates the support assembly at the processing position, which is the position of the support assembly and susceptor 120 during the deposition process.

[0033] In addition, the reaction space 145 may be formed by the susceptor 120 and the showerhead 115 when the susceptor 120 is in the processing position. In some embodiments, the reaction space 145 may also be formed by a portion of the reaction chamber 110, such as the side walls of the reaction chamber 110, and / or other components within the reaction chamber 110, such as a spacer plate (not shown) or a flow control ring (not shown).

[0034] In various embodiments, and also with reference to Figures 1 to 7, the system 100 may further include a radiant shield 130 for providing temperature distribution and regulation to the susceptor 120. The radiant shield 130 may be formed from a metallic material such as aluminum, nickel, tungsten, or a metal alloy. The radiant shield 130 may be located in the lower chamber 140 of the reaction chamber 110, opposite the reaction space 145 and adjacent to the bottom surface of the susceptor 120. In addition, the radiant shield 130 may be connected to a support assembly. For example, the radiant shield 130 may be fixed to the susceptor 120 and / or pedestal 125 using bolts or similar. The radiant shield 130 may have a height in the range of 1 mm to 2 mm.

[0035] In various embodiments, the radiation shield 130 may have a top surface 250 and a bottom surface 400. The top surface 250 may face the bottom surface of the susceptor 120. In various embodiments, the radiation shield 130 may have a region having a different texture from the rest of the body 235. For example, the body 235 may have a region 700 having a different texture to change the emissivity of that region. For example, region 700 may be polished or textured / roughened to change the emissivity of that region. Polishing may decrease the emissivity, while textured / roughened may increase the emissivity. Region 700 may be located adjacent to the central opening 210 and may have any surface area. The surface area of ​​region 700 may be selected based on the desired temperature control. For example, region 700 in Figure 7A is smaller than region 700 in Figure 8, and each pattern provides a desired temperature gradient to the wafer 135.

[0036] In various embodiments, the radiation shield 130 may comprise a body 235 and a plurality of notches 200 or openings within the body 235. For example, the radiation shield 130 may have a central opening 210 at the geometric center of the radiation shield 130. The central opening 210 may be used to receive a pedestal 125. In other words, the pedestal 125 may be inserted into the central opening 210. The body 235 may have a height H1 in the range of 1 mm to 2 mm. The body 235 may have a diameter in the range of 300 mm to 500 mm, more specifically in the range of 380 mm to 420 mm. The body 235 may be formed from a metallic material such as aluminum, nickel, tungsten, or a metal alloy.

[0037] In various embodiments, the notches 200 may be arranged within multiple zones and in a circular pattern. For example, the radiation shield 130 may have one or more notches 200 in a first zone 215, a second zone 220 concentric with the first zone 215, a third zone 225 concentric with the second zone 220, and a fourth zone 230 concentric with the third zone 225. Each zone may be concentric with the central opening 210. The notches 200 may be any desired shape or size. In some embodiments, the notches 200 may have a width in the range of 5 mm to 30 mm, and more specifically, 9 mm to 24 mm. The width of the notches 200 may be selected based on the number of zones, as a larger number of zones results in a smaller width.

[0038] In various embodiments, the radiation shield 130 may further comprise a plurality of removable segments 205. Each removable segment 205 may be shaped to be positioned within a single notch 200 from a plurality of notches. Each removable segment 205 may have a height H2 in the range of 1 mm to 2 mm. The removable segments 205 may be formed from a metallic material such as aluminum, nickel, tungsten, or a metal alloy. Each segment 205 may have a different emissivity than adjacent segments. For example, the top surface of a segment 205 may have a different emissivity than the bottom surface of the same segment 205. Emissivity may be altered by polishing (for a decrease in emissivity) or texture / roughening (for an increase in emissivity).

[0039] In various embodiments, the radiation shield 130 may further comprise a plurality of stabilizers 405 disposed on the bottom surface 400 of the main body 235. The stabilizers 405 may extend inward toward the notches 200. Each notch 200 may have a plurality of stabilizers 405, with one stabilizer along each edge of the notch 200. The stabilizers 405 may support removable segments 205. For example, the removable segment 205 may be in direct contact with the stabilizers 405 when the removable segment is placed within the notch 200. The stabilizers 405 may be of any size or shape suitable for supporting the removable segment 205. In some embodiments, the stabilizers 405 may have a length L1 in the range of 2 mm to 6 mm.

[0040] In various embodiments, each notch 200 may have an inward-facing edge 500 having a groove. The removable segment 205 may have an outer edge 520 that fits into the groove.

[0041] In some embodiments, and also with reference to Figures 6A-6B, the radiation shield 130 may include a pocket 605. In this embodiment, a plurality of removable segments 205(a), 205(b) may be arranged within the pocket 605 and supported by a body 235, the portion of the body 235 supporting the removable segments 205 being a solid continuous material. In this embodiment, the removable segment 205 may comprise a main body 605 and a lip 600. In this example, the lip 600 may extend outward from the main body 605 such that the removable segment 205 forms an L-shape. In this example, the body 235 may be formed from a metallic material such as aluminum, nickel, tungsten, or a combination thereof. Furthermore, the removable segments 205(a), 205(b) may be formed from a metallic material such as aluminum, nickel, tungsten, or a metal alloy.

[0042] In the preceding descriptions, the technology is described with reference to specific exemplary embodiments. The specific embodiments shown and described are illustrative of the technology and its best form, and are not intended to limit the scope of the technology in any way or otherwise. In fact, for the sake of brevity, conventional manufacturing, connection, preparation, and other functional aspects of methods and systems may not be described in detail. Furthermore, the connection lines shown in various figures are intended to represent exemplary functional relationships and / or processes between various elements. Many alternative or additional functional relationships or physical connections may exist in actual systems.

[0043] This technology has been described with reference to specific exemplary embodiments. However, various modifications and changes may be made without departing from the scope of this technology. The descriptions and drawings are not restrictive but are considered illustrative, and all such modifications are intended to fall within the scope of this technology. Consequently, the scope of the technology should be determined not merely by the specific examples described above, but by the general embodiments described and their legal equivalents. For example, the steps enumerated in any embodiment of a method or process may be performed in any order unless otherwise expressly specified, and are not limited to the express order presented in a particular embodiment. Furthermore, the components and / or elements enumerated in any embodiment of a device may be assembled in various permutations or configured to operate in other ways to produce substantially the same results as in this technology, and are therefore not limited to the specific configurations enumerated in a particular embodiment.

[0044] Benefits, other advantages, and solutions to problems have been described above in relation to specific embodiments. Any element that may cause or make more prominent any benefit, advantage, solution to a problem, or any element that may cause any particular benefit, advantage, or solution, is not construed as an important, required, or essential feature or component.

[0045] The terms “comprises,” “comprising,” or any other variation thereof are intended to refer to non-restrictive inclusion, such that a process, method, article, component, or apparatus comprising a list of elements may include not only those elements listed, but also other elements not explicitly listed or specific to such process, method, article, component, or apparatus. In addition to those not specifically listed, other combinations and / or modifications of the above-mentioned structures, arrangements, uses, proportions, elements, materials, or components used in the practice of this art may be modified or otherwise specifically adapted to a particular environment, manufacturing specification, design parameter, or other operating requirement without deviating from their general principles.

[0046] The present technology has been described above with reference to exemplary embodiments. However, modifications and alterations may be made to the exemplary embodiments without departing from the scope of the present technology. These and other modifications are intended to be within the scope of the present technology as expressed in the following claims. [Explanation of Symbols]

[0047] 100 Systems 105 Reactor 110 Reaction Chamber 115 Shower Head 120 Susceptors 125 Pedestal 130 Radiation Shield 135 Substrates, wafers 140 Lower Chamber 145 Reaction space 150 heating element 205 segments 210 Central opening 215 Zone 1 220 Second Zone 225 The third zone 230 Zone 4 235 Main Unit 250 Top 400 base 405 Stabilizer 500 edge 520 Outer edge 600 Lip 605 Main Unit 605 pockets 700 areas

Claims

1. A main body having multiple notches arranged within multiple circular zones, A plurality of removable segments, each segment being positioned in one of the plurality of notches, A device equipped with the following features.

2. The apparatus according to claim 1, wherein the plurality of circular zones comprises at least two circular zones.

3. The apparatus according to claim 1, further comprising a plurality of stabilizers disposed on the bottom surface of the main body, wherein the stabilizers extend toward the notch.

4. The apparatus according to claim 3, wherein the plurality of removable segments are in direct contact with at least one of the stabilizers from the plurality of stabilizers.

5. The apparatus according to claim 1, wherein the main body is formed from a metallic material containing at least one of aluminum, nickel, or tungsten.

6. The apparatus according to claim 1, wherein the plurality of removable segments are within the range of 20 to 48 segments.

7. The apparatus according to claim 1, wherein each segment from the plurality of removable segments comprises a first surface having a first emissivity and a second opposite surface having a second emissivity.

8. The apparatus according to claim 1, wherein the first emissivity is different from the second emissivity.

9. The apparatus according to claim 1, wherein the number of notches is equal to the number of removable segments.

10. The apparatus according to claim 1, wherein each notch has an edge facing the interior which has a groove.

11. The apparatus according to claim 10, wherein each segment has an outer edge with a projection sized to fit into the groove.

12. The apparatus according to claim 1, wherein the main body has a height in the range of 1 mm to 2 mm, and each segment has a height in the range of 1 mm to 2 mm.

13. A reaction chamber comprising a support assembly, wherein the support assembly comprises a pedestal and a susceptor connected to the pedestal, A plate connected to the aforementioned support assembly, The main body has pockets, Multiple removable segments arranged within the aforementioned pocket, A plate equipped with, A system equipped with these features.

14. The reactor according to claim 13, wherein each segment comprises a main body and a lip extending outward from the main body.

15. The reactor according to claim 14, wherein the lip of one segment overlaps with the lip of an adjacent segment.

16. The reactor according to claim 13, wherein a first segment from the plurality of removable segments has a first emissivity, and a second segment from the plurality of removable segments has a second emissivity.

17. The reactor according to claim 13, wherein the plate has a height in the range of 1 mm to 2 mm.

18. A reaction chamber comprising a support assembly, wherein the support assembly comprises a pedestal and a susceptor connected to the pedestal, A plate connected to the aforementioned support assembly, The main body, A plurality of notches, wherein the first notch is located at the geometric center of the plate, and the second notch is located adjacent to the first notch and has an arch shape, On the upward-facing surface of the main body, at least one region having a different emissivity from the rest of the upward-facing surface, A main unit equipped with A plate equipped with, A system equipped with these features.

19. The system according to claim 18, wherein the plate has a thickness in the range of 1 mm to 2 mm.

20. The system according to claim 18, wherein the notch has a width in the range of 5 mm to 30 mm.

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