Imaging device

Abstract

To effectively cool the heat-generating elements within the imaging device. [Solution] The imaging device 1 includes an image sensor 22, a heat-generating element 96 different from the image sensor, and a duct 90 disposed between the image sensor and the heat-generating element, with a fluid channel formed inside. The duct is composed of a first duct member 90a thermally connected to the image sensor and having a first thermal conductivity, a second duct member 90b thermally connected to the heat-generating element and having a first thermal conductivity, and a first thermal resistance member 90c disposed between the first and second duct members and having a second thermal conductivity lower than the first thermal conductivity.

Description

Technical Field

[0001] The present invention relates to an imaging device having a heat dissipation structure.

Background Art

[0002] An imaging device is provided with an imaging element serving as a heat generating element, a processor element such as a CPU, and a display element, etc., and a heat dissipation structure for cooling these heat generating elements is provided inside the imaging device. Patent Document 1 discloses an imaging device in which the thermal conductivity of the material of the heat dissipation duct on the imaging element side inside the imaging device is increased and the thermal conductivity of the material of the heat dissipation duct on the circuit board side is decreased.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An imaging device that can more effectively cool each heat generating element serving as a heat source is desired.

Means for Solving the Problems

[0005] An imaging device according to one aspect of the present invention includes an imaging element, a heat generating element different from the imaging element, and a duct disposed between the imaging element and the heat generating element and having a flow path formed therein through which a fluid flows. The duct is thermally connected to the imaging element and includes a first duct member having a first thermal conductivity, a second duct member thermally connected to the heat generating element and having the first thermal conductivity, and a first thermal resistance member disposed between the first and second duct members and having a second thermal conductivity lower than the first thermal conductivity.

Effects of the Invention

[0006] According to the present invention, each heat-generating element in the imaging device can be cooled more effectively. [Brief explanation of the drawing]

[0007] [Figure 1] These are a front-side perspective view and a rear-side perspective view of the imaging device of Example 1. [Figure 2] This is a block diagram showing the configuration of the imaging device in Example 1. [Figure 3] This is an exploded perspective view of the imaging device 1 of Example 1. [Figure 4] This is a cross-sectional view of the imaging device of Example 1. [Figure 5] This figure shows a front side perspective view of the cooling structure and the fan in Example 1. [Figure 6] This is a rear perspective view of the cooling structure in Example 1. [Figure 7] These are a rear side perspective view and an exploded perspective view of the duct in Example 1. [Figure 8] These are a rear side perspective view and an exploded perspective view of the duct in Example 2. [Figure 9] These are a rear side perspective view and an exploded perspective view of the duct in Example 3. [Figure 10] These are a rear side perspective view and an exploded perspective view of the duct in Example 4. [Figure 11] This is a schematic diagram showing the B-B section of Figure 10. [Modes for carrying out the invention]

[0008] Hereinafter, embodiments of the present invention will be described with reference to the drawings. [Examples]

[0009] Figures 1(a) and 1(b) show the external appearance of the imaging device 1 as viewed from the oblique front and oblique rear, respectively. In these figures, the front-to-back (optical axis) direction of the imaging device 1 is the Z direction, the lateral (width) direction is the X direction, and the up-and-down (height) direction is the Y direction. A lens unit 84 housing the imaging lens is interchangeably mounted on the front of the imaging device 1. Figure 2 shows the optical and electrical configuration of the lens unit 84 and the imaging device 1. The imaging lens consists of multiple lenses (shown as one lens in the figure) 83 and an aperture 5. In addition, a grip portion is formed on the right side of the front of the imaging device 1 when viewed from the rear, for the user to hold the imaging device 1 with their right hand.

[0010] The top surface of the imaging device 1 is provided with a shutter button 61 operated by the user to give imaging instructions, a mode selector switch 60 operated to switch between various modes, and a main electronic dial 71 operated to change settings such as shutter speed and aperture value. The shutter button 61 is a two-stage switch; when the first stage switch SW1 is turned on, imaging preparation operations such as autofocus and automatic exposure are performed, and when the second stage switch SW2 is turned on, the imaging operation is performed.

[0011] Furthermore, the top surface of the imaging device 1 is provided with a power switch 72 for switching the power of the imaging device 1 on and off, a first sub-electronic dial 73a for operating to move the selection frame and advance images, and a video button 76 for instructing the start / stop of video recording. The operation unit 70 shown in Figure 2 includes the operation members provided on the top surface of the imaging device 1 as described above, as well as other operation members described later.

[0012] Furthermore, a sub-display unit 43 is provided on the top surface of the imaging device 1, which displays settings such as shutter speed and aperture value. The sub-display unit 43 is composed of a display element such as an LCD.

[0013] On the back of the imaging device 1, there is an eyepiece portion 16 of an eyepiece finder through which the user can look in and visually recognize the image and information displayed on the EVF (Electronic View Finder) unit 29 shown in FIG. 2. Inside the eyepiece portion 16, there is an eyepiece detection unit 57 that detects when the user is looking into the eyepiece portion 16. Also, on the back of the imaging device 1, there is a rear display portion 28 that is provided so as to be able to open, close, or rotate with respect to the back and displays images and various information. The rear display portion 28 and the EVF unit 29 are composed of display elements such as LCDs and organic ELs. The rear display portion 28 is provided with a touch panel (touch sensor) 70a that detects the user's touch operation on the display surface (operation surface).

[0014] Furthermore, on the back of the imaging device 1, there are a second sub-electronic dial 73b having the same function as the first sub-electronic dial 73a, a menu button 81 that is operated to display a menu screen for performing various settings on the rear display portion 28, and a multi-directional key 74. The multi-directional key 74 has keys in eight directions: up, down, left, right, diagonally upper right, diagonally lower right, diagonally lower left, and diagonally upper left, and in the imaging device 1, an operation corresponding to the operated key is performed.

[0015] Also, on the back of the imaging device 1, there are a SET button 75 that is mainly operated when determining a selected item, etc., an AE lock button 77 that is operated in the imaging standby state to fix the exposure state at the time of imaging, and a playback button 79 that is operated to switch between the imaging mode and the playback mode. When the playback button 79 is operated during the imaging mode, the imaging device 1 shifts to the playback mode, and the image recorded on the recording medium 85 shown in FIG. 2 can be displayed on the display portion 28.

[0016] The terminal cover 40 provided on the left side surface when the imaging device 1 is viewed from the back side is a cover for protecting the terminals (headphone terminal, USB terminal, HDMI (registered trademark) terminal, etc.) that connect the imaging device 1 and an external device. Also, the card cover 86 provided on the right side surface when the imaging device 1 is viewed from the back side is a cover for opening and closing the card slot that stores the recording medium 85.

[0017] In FIG. 2, the camera communication terminal 10 and the lens communication terminal 6 are provided for the camera control unit 50 in the imaging device 1 and the lens control unit 4 in the lens unit 84 to communicate with each other. The lens control unit 4 drives the aperture 5 via the aperture drive circuit 2 or moves the focus lens included in the lens 83 via the AF drive circuit 3 in response to an instruction from the camera control unit 50.

[0018] In the imaging device 1, the imaging element 22 is a photoelectric conversion element such as a CCD sensor or a CMOS sensor that converts an optical image (subject image) formed by the imaging lens into an electrical signal. The shutter 20 is a focal plane shutter that controls the exposure amount of the imaging element 22.

[0019] The A / D converter 23 converts the analog signal output from the imaging element 22 into a digital signal (imaging data). The image processing unit 24 performs resizing processing such as pixel interpolation and reduction and color conversion processing on the imaging data acquired directly from the A / D converter 23 or via the memory control unit 15 to generate image data. The image data is written into the memory 32 via the image processing unit 24 or via the memory control unit 15. Further, the image processing unit 24 performs various arithmetic processes using the image data.

[0020] The AE sensor 17 detects the luminance of the subject image using the imaging data from the imaging element 22. The focus detection unit 11 detects the defocus amount of the subject image using the imaging data. The camera control unit 50 performs an automatic exposure calculation to calculate the aperture value and the shutter speed based on the detected luminance, or calculates the lens drive amount for autofocus based on the detected defocus amount. Note that the imaging element 22 has a microlens and a plurality of photoelectric conversion units for each pixel and functions as an imaging surface phase difference sensor.

[0021] The D / A converter 19 converts the image data stored in the memory 32 into an analog signal and supplies it to the rear display unit 28 and the EVF unit 29. As a result, the image data stored in the memory 32 is displayed on the rear display unit 28 and the EVF unit 29. The display unit 28 and the EVF unit 29 display information on a display device such as an LCD or organic EL, according to the analog signal from the D / A converter 19.

[0022] The sub-display drive circuit 44 causes the sub-display unit 43 to display set values ​​such as shutter speed and aperture value. The non-volatile memory 56 is an electrically erasable and recordable memory, and is composed of an EEPROM or the like. Constants and programs for the operation of the camera control unit 50 are stored in the non-volatile memory 56.

[0023] The camera control unit 50 is composed of at least one processor and memory, and controls the entire imaging device 1. The system memory 52 is composed of RAM, etc., and stores constants and variables for the operation of the camera control unit 50, and loads programs read from the non-volatile memory 56. The system timer 53 counts the current time and measures the time used for various controls.

[0024] The power supply unit 30 is composed of a primary battery, a secondary battery, or an AC adapter, etc. The power control unit 80 is composed of a circuit for detecting whether a battery is installed, the type of battery, the remaining battery level, etc., a DC-DC converter, and a switch circuit for switching which block is powered. The power control unit 80 controls the DC-DC converter to supply the necessary voltage to each block, including the recording medium 85.

[0025] The recording medium I / F 18 is an interface with the recording medium 85. The recording medium 85 consists of a semiconductor memory, magnetic disk, etc., for recording image data. The communication unit 54 transmits and receives video signals and audio signals to and from the outside via wireless or wired communication.

[0026] The attitude detection unit 55 uses an acceleration sensor, a gyroscope, or the like to detect the attitude of the imaging device 1 relative to the direction of gravity. Based on the detected attitude, the camera control unit 50 determines whether the attitude of the imaging device 1 at the time of imaging is upright or vertical, and detects the movement of the imaging device 1 (pan, tilt, etc.).

[0027] The connection terminal 58 is provided to enable electrical communication with external devices that can be connected to (attached to) the imaging device 1.

[0028] The cooling device 100 is an example of an external device connected to the imaging device 1, and is an accessory that has an intake port and an exhaust port and a built-in fan, as shown in Figure 5. The cooling device 100 has a power supply 101, a control unit 110, a fan 120, and a connection terminal 130. The control unit 110 controls the drive of the fan 120 while communicating with the imaging device 1 via the connection terminal 130.

[0029] Figure 3 shows the imaging device 1 in an exploded view. Figure 4 shows a cross-section AA passing through the optical axis of the imaging lens of the imaging device 1 shown in Figure 1(b). Inside the housing, which is composed of the front body 82 and the rear cover 88, are arranged in order from the subject side: the shutter 20, the imaging unit 25 including the image sensor 22, the duct 90, the control board 51, and the EVF unit 29. Also inside the housing is a battery compartment 87 that houses the batteries that make up the power supply unit 30. The control board 51 is equipped with processor elements 96 such as the CPU, MPU, and IC that make up the camera control unit 50 and image processing unit 24 shown in Figure 2, as well as electrical components such as a card slot 95 on which the recording medium 85 is mounted.

[0030] The heat transfer members 97a, 97b, 97c, and 97d are materials with excellent heat transfer properties, such as TIM (thermal interface material). Details of these heat transfer members 97a to 97d will be described later.

[0031] As shown in Figure 4, the duct 90 is a component with an air passage 7 formed inside. The duct 90 has an intake port 91 and an exhaust port (second exhaust port) 93 that open on the exterior surface of the imaging device 1, and does not have any openings inside the housing. In other words, the air passage 7 is a passage that does not communicate with the internal space of the imaging device 1. The air passage 7 is a passage through which air as a fluid flows. Note that gases or liquids other than air may be used as the fluid.

[0032] The bottom surface of the imaging device 1 is formed in a flat shape, making it easy to form a wide intake port 91 for the duct 90. However, various operating members, terminal covers 40 and grip parts are provided on the exterior surfaces other than the bottom surface of the imaging device 1, making it difficult to provide an exhaust port 93 with approximately the same cross-sectional area as the intake port 91. For this reason, the duct 90 in this embodiment has an intake port 91 facing the bottom surface of the imaging device 1, a first exhaust port 92 facing the left side of the imaging device 1 when viewed from the rear, and a second exhaust port 93 facing the top surface of the imaging device 1.

[0033] In this embodiment, when the cross-sectional area of ​​the intake port 91 in the duct 90 is A1, and the sum of the cross-sectional areas of the first and second exhaust ports 92 and 93 is A2, 0.9 ≤ A1 / A2 ≤ 1.1 The following condition is satisfied: the cross-sectional area A1 of the intake port 91 and the sum of the cross-sectional areas A2 of the first and second exhaust ports 92 and 93 are approximately the same.

[0034] In Figure 3, a hole 92a is formed near the terminal cover 40 on the side of the imaging device 1. In addition, multiple holes 93a are formed on the top of the imaging device 1. Furthermore, multiple holes 91a are formed on the bottom surface of the rear cover 88. These holes 92a, 93a, and 91a are openings that penetrate the exterior members of the imaging device 1 and are connected to the first exhaust port 92, the second exhaust port 93, and the intake port 91 of the duct 90, respectively, in a way that prevents air leakage.

[0035] In this embodiment, a single exhaust port cannot secure a wide cross-sectional area like that of the intake port 91. However, multiple exhaust ports, such as the first exhaust port 92 and the second exhaust port 93, are provided, and their combined cross-sectional area is made equivalent to that of the intake port 91. This improves the heat dissipation efficiency of the duct 90.

[0036] Next, the main heat-generating elements in the imaging device 1 will be described. The imaging unit 25 in this embodiment is equipped with a vibration isolation mechanism to reduce image shake. The vibration isolation mechanism consists of a movable part including the image sensor 22 and a fixed part including an engaging part that engages with the front body 82. The movable part is pressed against the fixed part via a ball (not shown), allowing it to move in the X and Y directions perpendicular to the optical axis.

[0037] The image sensor 22 is a heat-generating element that generates heat during high-resolution imaging or long-duration imaging. The imaging unit 25 is equipped with an A / D converter 23, which is a heat-generating element that easily generates heat due to its high-speed conversion of a large amount of analog signals into digital signals. Therefore, in this embodiment, the imaging unit 25, including the image sensor 22 and the A / D converter 23, is cooled.

[0038] The processor element 96 mounted on the control board 51 is a first heat-generating element that generates heat through the control of the imaging device 1 and the generation of images using signals from the image sensor 22 (especially high-speed processing of the enormous amount of imaging data obtained by imaging). For this reason, in this embodiment, the processor element 96 is cooled.

[0039] The EVF unit 29 housed inside the upper part of the imaging device 1 has a display element (hereinafter referred to as the EVF display element) that displays image data, etc., and the EVF display element is the third heat-generating element. Therefore, in this embodiment, the EVF unit 29 including the EVF display element is cooled.

[0040] Furthermore, the control board 51 is equipped with a card slot 95 into which a recording medium 85 is mounted. The recording medium 85 is a third heat-generating element that generates heat according to the amount of data of the image data being recorded. The heat from the recording medium 85 may be transferred to the control board 51 via the card slot 95. For this reason, it is preferable to cool the card slot 95, including the recording medium 85, as will be explained in Embodiment 4 below.

[0041] In the imaging device 1 of this embodiment, the duct 90 is positioned between the imaging unit 25 and the control board 51 (i.e., between the image sensor 22 and the processor element 96) in order to efficiently cool the imaging unit 25 and the control board 51 using the duct 90. Furthermore, in order to efficiently cool the EVF unit 29, which is positioned above the imaging unit 25 and the control board 51 inside the imaging device 1, using the duct 90, the upper part of the duct 90 leading to the second exhaust port 93 is positioned along the EVF unit 29. Thus, the duct 90 is positioned between the imaging unit 25 and the control board 51 and the EVF unit 29.

[0042] Figure 4 shows the heat transfer members 97a, 97b, and 97c that transfer heat from the heating elements to the duct 90. The heat transfer members 97a, 97b, and 97c are positioned between the fixed part of the imaging unit 25 and the duct 90, between the control board 51 and the duct 90, and between the EVF unit 29 and the duct 90, respectively, and are thermally connected by contact with both the heating elements and the duct 90. In this case, considering the manufacturing variations of each component, it is preferable that the heat transfer members 97a, 97b, and 97c are elastically deformable and positioned in a compressed state so as not to separate from the contacted members. The heat transfer members 97a, 97b, and 97c may be elastic metal bodies or graphite sheets, etc., in addition to the TIM described above, and may be made to contact each member with curvature. Furthermore, if the heating elements and the duct 90 can be mechanically fixed with screws or the like, heat transfer members such as gap fillers that do not have elasticity may be used. By adopting this configuration, heat from each heat-generating element can be efficiently transferred to the duct 90.

[0043] By transferring heat from each heat-generating element to the duct 90, which does not communicate with the internal space of the imaging device 1, the temperature of the air inside the duct 90 rises. When the temperature of the air rises, buoyancy is generally generated. Therefore, as shown by the arrow F1 in Figure 4, outside air flows into the duct 90 from the intake port 91, while the heated air flows out from the first exhaust port 92 and the second exhaust port 93, which are located above the intake port 91. This allows for heat dissipation. In this way, the heat-generating elements inside the imaging device 1 can be efficiently cooled by natural air using the duct 90.

[0044] Figures 5(a), 5(b), and 5(6) show a cooling device 100 that is detachably attached to the imaging device 1. Figure 5(a) shows the external appearance of the cooling device 100 as seen from the oblique front side, and Figure 5(b) shows the cooling device 100 shown in Figure 5(a) and the fan 120 provided inside it. Figure 6 shows the cooling device 100 being attached to the imaging device 1.

[0045] As shown in Figure 5(a), the tripod screw 102 provided on the top surface of the cooling device 100 can be screwed into the tripod screw fastening portion 89 provided on the bottom surface of the imaging device 1 shown in Figure 6. The cooling device 100 can be attached to the bottom of the imaging device 1 by the user turning the operating member 103 provided on the cooling device 100. The cooling device 100 can house a power supply 101 inside. The cooling device 100 is provided with a protruding portion 100a that protrudes upward from its top surface. Connection terminals 130 are provided at the upper and lower parts of the protruding portion 100a. The protruding portion 100a is inserted into the battery compartment 87 of the imaging device 1 when the cooling device 100 is attached to the imaging device 1, and is connected to the communication terminal 58a of the imaging device 1 shown in Figure 2, enabling communication between the cooling device 100 and the imaging device 1.

[0046] As shown in Figure 5(b), the fan 120 located inside the cooling device 100 is controlled by the control unit 110 shown in Figure 2. The rotating fan 120 draws air in through the intake port 104 of the cooling device 100 and expels air through the exhaust port 105 of the cooling device 100, as indicated by arrow F2 in the figure.

[0047] When the cooling device 100 is attached to the imaging device 1, the exhaust port 105 of the cooling device 100 and the intake port 91 of the imaging device 1 are connected via a sealing member 106 provided around the exhaust port 105 of the cooling device 100. As a result, the air flowing out from the exhaust port 105 of the cooling device 100 can be allowed to flow into the air passage 7 in the duct 90 from the intake port 91 of the imaging device 1 without leaking between the imaging device 1 and the cooling device 100. This allows outside air to be forcibly drawn into the duct 90 while the air inside the duct 90, whose temperature has risen, is forcibly discharged, thereby forcibly cooling each heat-generating element in the imaging device 1.

[0048] Figures 7(a) and 7(b) show the configuration of the duct 90. Figure 7(a) shows the assembled duct 90 viewed from the diagonal rear side, and Figure 7(b) shows the duct 90 disassembled.

[0049] The duct 90 is composed of a first metal member 90a as a first duct member, a second metal member 90b as a second duct member, and a plurality of first thermal resistance members 90c. The first thermal resistance members 90c are positioned between the first metal member 90a on the front side and the second metal member 90b on the rear side. By fixing the first metal member 90a and the second metal member 90b in close contact with the first thermal resistance members 90c, an air passage 7 is formed inside the duct 90 that does not communicate with the internal space of the imaging device 1.

[0050] The first metal member 90a and the second metal member 90b are made of metals with high thermal conductivity. The first thermal resistance member 90c is a member that makes it difficult for heat to be transferred between the first metal member 90a and the second metal member 90b.

[0051] The first and second metal members 90a and 90b are formed from the same or similar metallic materials and have a first thermal conductivity. This first thermal conductivity generally indicates a high thermal conductivity, and materials such as copper, aluminum, aluminum alloys, and magnesium alloys can be used. Furthermore, "the first and second metal members have a first thermal conductivity" includes not only cases where the first and second metal members have the same thermal conductivity, but also cases where they have slight differences (no significant difference) within a range that can be considered identical. On the other hand, the first thermal resistance member 90c has a second thermal conductivity that is significantly lower than the first thermal conductivity, and materials such as aerogel, sealing materials, elastomers, and rubber can be used.

[0052] The aforementioned heat transfer member 97a contacts the lower outer surface of the first metal member 90a and also contacts the imaging unit 25. The heat transfer member 97b contacts the lower outer surface of the second metal member 90b and also contacts the processor element 96 mounted on the control board 51. Figures 7(a) and (b) show the case where two processor elements 96 are mounted on the control board 51, and the two heat transfer members 97b are in contact with these two processor elements 96 and the second metal member 90b. In addition, the heat transfer member 97c contacts the upper outer surface of the second metal member 90b and also contacts the EVF unit 29.

[0053] Furthermore, cooling materials other than heat transfer components, such as thermal grease or heat sinks, may be placed between each heat transfer component and the metal component and heating element in contact with it. In other words, each heat transfer component, metal component, and heating element do not need to be in direct contact with each other as long as they are thermally connected.

[0054] In the imaging device 1, the heat-generating elements that should be prioritized for heat dissipation (cooling) are the image sensor 22 and the processor element 96. If the duct 90, which is placed between the imaging unit 25 and the control board 51, is formed as a single metal component or by fastening multiple metal components together with screws, heat from the image sensor 22 will be transferred to the processor element 96 mounted on the control board 51 via the imaging unit 25 and the duct 90. Conversely, heat from the processor element 96 will be transferred to the image sensor 22 via the duct 90. As a result, heat from the component with a higher temperature will be transferred to the component with a lower temperature, which may cause the component with a lower temperature to become overheated (for example, exceed the maximum allowable temperature).

[0055] Therefore, in this embodiment, the duct 90 is formed by sandwiching a first thermal resistance member 90c between a first metal member 90a, which serves as a first duct member on the image sensor 22 side, and a second metal member 90b, which serves as a second duct member on the control board 51 side. With this configuration of the duct 90, heat is less likely to be transferred between the image sensor 22 and the processor element 96 through the duct 90, and the image sensor 22, the processor element 96, and the EVF display element can be cooled efficiently. [Examples]

[0056] Figures 8(a) and 8(b) show duct 200 as Example 2. Figure 8(a) shows duct 200 viewed from the diagonal rear side, and Figure 8(b) shows duct 200 disassembled. In Figures 8(a) and 8(b), the same reference numerals as those used in Example 1 (Figures 7(a) and 7(b)) are used for the same components.

[0057] In Embodiment 2, a processor element (first heat-generating element) 96a and a processor element (second heat-generating element) 96b, which have different operating temperatures, are mounted on the same plane (XY plane) of the control board 51. The second metal member on the control board 51 side of the duct 200 is divided into a second-first metal member (first member) 201, through which heat from the processor element 96a is transferred via the heat transfer member 97b1, and a second-second metal member (second member) 202, through which heat from the processor element 96b is transferred via the heat transfer member 97b2. Furthermore, a second thermal resistance member 203 is placed between the second-first metal member 201 and the second-second metal member 202. The second thermal resistance member 203 is made of the same material as the first thermal resistance member 90c and has the same second thermal conductivity as the first thermal resistance member 90c. However, the second thermal conductivity of the second thermal resistance member 203 and the second thermal conductivity of the first thermal resistance member 90c do not necessarily have to be the same; they just need to be lower than the first thermal conductivity.

[0058] The second-second metal member 202 is provided with a bent portion 205 for positioning the second thermal resistance member 203 between it and the second-first metal member 201, which will be explained later in Embodiment 4 using Figure 11. In addition, the heat transfer member 97c that contacts the EVF unit 29 is in contact with the second-first metal member 201.

[0059] This configuration of the duct 200 makes it difficult for heat to be transferred between the processor elements 96a and 96b on the control board 51 via the duct 200.

[0060] Furthermore, since the heat from the processor elements 96a and 96b is transferred to other mounted components on the control board 51, it is desirable to use thermal lands or thermal vias in the wiring on the control board 51 to make it difficult for the heat from the processor elements 96a and 96b to be transferred to other mounted components. [Examples]

[0061] Figures 9(a) and 9(b) show the duct 300 as Example 3. Figure 9(a) shows the duct 300 viewed from the diagonal rear side, and Figure 9(b) shows the duct 300 disassembled. In Figures 9(a) and 9(b), the same components as those shown in Example 1 (Figures 7(a) and 7(b)) are denoted by the same reference numerals as in Example 1.

[0062] In Embodiment 3, the second metal member on the control board 51 side and EVF unit 29 side of the duct 300 is divided into a second-first metal member 301 through which heat from the processor element 96 is transferred via the heat transfer member 97b, and a second-second metal member 302 through which heat from the EVF unit 29 is transferred via the heat transfer member 97c. Furthermore, a second thermal resistance member 303 is placed between the second-first metal member 301 and the second-second metal member 302. The second-second metal member 302 is provided with a bent portion 305 for positioning the second thermal resistance member 303 between it and the second-first metal member 301, which will be explained using Figure 11 in the next Embodiment 4.

[0063] This configuration of the duct 300 makes it difficult for heat to be transferred between the processor element 96 on the control board 51 and the EVF unit 29 via the duct 300. [Examples]

[0064] Figures 10(a) and (b) show the duct 400 as Example 4. Figure 10(a) shows the duct 400 viewed from the oblique rear side, and Figure 10(b) shows the duct 400 in an exploded view. In Figures 10(a) and (b), the same components as those shown in Example 1 (Figures 7(a) and (b)) are denoted by the same reference numerals as in Example 1. Figure 11 shows the BB cross section in Figure 10(a).

[0065] In Example 4, the duct 400 is used to cool the processor element 96 mounted on the surface of the control board 51 and the card slot 95 mounted on the back of the control board 51 where the recording medium 85 is installed.

[0066] In this embodiment, the second metal member of the duct 400 on the control board 51 side is divided into a second-first metal member 401 to which heat from the processor element 96 is transferred via the heat transfer member 97b, and a second-second metal member 402 to which heat from the card slot 95 is transferred. The second-second metal member 402 is provided with an extension 404 that is not used to form an air passage within the duct 400, and a heat transfer member 97d that contacts the card slot 95 is in contact with the extension 404. As a result, heat from the recording medium 85 is transferred to the second-second metal member 402 via the card slot 95 and the heat transfer member 97d.

[0067] A second thermal resistance member 403 is positioned between the second-first metal member 401 and the second-second metal member 402. The second-second metal member 402 is provided with a bent portion 405 for positioning the second thermal resistance member 403 between it and the second-first metal member 401.

[0068] This configuration of the duct 400 makes it difficult for heat to be transferred between the processor element 96 on the control board 51 and the recording medium 85 via the duct 400.

[0069] Using Figure 11, we will explain the details of the bent portion 405 (bent portions 205 and 305 in Figures 8 and 9). Note that the bent portion 205 shown in Figure 8 and the bent portion 405 shown in Figure 10(b) extend in the X and Y directions, while the bent portion 305 shown in Figure 9 extends only in the X direction, but their basic shapes are the same.

[0070] Increasing the width of the air passage 7 within the duct 400 in the Z direction increases the amount of air flowing through it, thereby enhancing the cooling effect. However, increasing the width of the duct 400 in the Z direction leads to an increase in the thickness of the imaging device 1 in the Z direction. Therefore, there are constraints on the width of the duct 400 in the Z direction.

[0071] Furthermore, if the bent portion 405 of the second-second metal member 402 is bent inward into the air passage 7, the cross-sectional area of ​​the air passage 7 becomes narrower, and the airflow resistance of the air passage 7 increases. As a result, the amount of air flowing through the air passage 7 decreases, and the heat dissipation efficiency decreases.

[0072] Therefore, by bending the bent portion 405 to the outside of the duct 400, which is on the opposite side of the air passage 7, the second thermal resistance member 403 can be placed between the second-first metal member 401 and the second-second metal member 402 without narrowing the cross-sectional area of ​​the air passage 7 or increasing the ventilation resistance. The bent portion may also be provided on the second-first metal member 401.

[0073] Furthermore, without providing the bent portion 405, the second thermal resistance member 403 may be positioned between the second-first metal member 401 and the second-second metal member 402 by providing grooves at both ends of the second thermal resistance member 403 in the X and Y directions, such as grooves into which the second-first metal member 401 and the second-second metal member 402 fit.

[0074] Next, we will explain why the extension portion 404 is not used to form the air passage 7. As shown in Figure 3, a grip portion is provided on the right side of the imaging device 1 when viewed from the rear. As shown in Figure 11, the grip portion between the front body 82 and the rear cover 88 houses several components arranged in the Z direction, such as the battery storage portion 87, part of the control board 51, and the card slot 95. Therefore, it is difficult to secure space to place a duct with an air passage within the grip portion.

[0075] Therefore, the extension portion 404 of the second-second metal member 402 that forms the duct 400, which is not used to form the air passage 7 (and does not come into contact with the air passage 7), is extended into the grip portion, and the extension portion 404 is thermally connected to the card slot 95 via a heat transfer member 97d. Alternatively, the card slot 95 may be in direct contact with the extension portion 404.

[0076] With this configuration, even without placing a duct with an internal air passage within the grip portion, heat from the card slot 95 can be transferred via the extension portion 404 to the region 402a of the second-second metal member 402 that is in contact with the air passage 7. In other words, the card slot 95 can be cooled efficiently.

[0077] The extension portion 404 may be thermally connected to a third heat-generating element other than the card slot 95, such as a component mounted on the control board 51 or the EVF unit 29. The extension portion may also be provided on the second-first metal member, or on both the second-first and second-second metal members.

[0078] The above embodiments include the following configuration.

[0079] (Composition 1) Image sensor and A heating element different from the image sensor, It has a duct positioned between the image sensor and the heating element, with a fluid channel formed inside through which fluid flows, The aforementioned duct is, A first duct member is thermally connected to the image sensor and has a first thermal conductivity, A second duct member is thermally connected to the heating element and has the first thermal conductivity, An imaging device characterized by comprising a first thermal resistance member disposed between the first and second duct members and having a second thermal conductivity lower than the first thermal conductivity. (Configuration 2) The imaging apparatus according to configuration 1, characterized in that the first and second duct members are made of metal. (Composition 3) The heating element comprises a first heating element and a second heating element. The imaging apparatus according to configuration 1 or 2, characterized in that the second duct member comprises a first member thermally connected to the first heating element, a second member thermally connected to the second heating element, and a second thermal resistance member disposed between the first and second members and having the second thermal conductivity. (Composition 4) The imaging apparatus according to configuration 3, characterized in that a bent portion is formed on one of the first and second members, which is bent outwards from the duct, and the second thermal resistance member is arranged between the bent portion and the other of the first and second members. (Composition 5) The imaging apparatus according to configuration 3 or 4, characterized in that the first heating element and the second heating element are processor elements that control the imaging apparatus or generate an image using signals from the imaging element. (Composition 6) The first heating element is a processor element that controls the imaging device or generates an image using signals from the image sensor. The imaging apparatus according to configuration 3 or 4, characterized in that the second heating element is a display element for displaying the image. (Composition 7) The aforementioned duct is, An air intake port connected to an opening provided on the bottom surface of the imaging device, An imaging device according to any one of configurations 1 to 6, characterized in that it has a first exhaust port and a second exhaust port connected to a first opening provided on the side of the imaging device and a second opening provided on the top surface of the imaging device, respectively. (Composition 8) When the cross-sectional area of ​​the intake port is A1, and the sum of the cross-sectional areas of the first and second exhaust ports is A2, 0.9 ≤ A1 / A2 ≤ 1.1 The imaging apparatus according to configuration 7, characterized by satisfying the following conditions. (Composition 9) At least one of the first and second duct members has an extension that is not used to form the flow path, The imaging apparatus according to any one of configurations 1 to 8, characterized in that the extension portion is thermally connected to the third heating element as the heating element. (Composition 10) The imaging apparatus according to configuration 9, characterized in that the extension portion and the third heating element are arranged inside the grip portion of the imaging apparatus. (Composition 11) The imaging apparatus according to configuration 9 or 10, characterized in that the third heating element is a recording medium. (Composition 12) The imaging apparatus according to any one of configurations 1 to 11, characterized in that a cooling device for supplying the fluid is attached to the intake port of the duct.

[0080] The embodiments described above are merely representative examples, and various modifications and changes can be made to each embodiment when implementing the present invention. [Explanation of Symbols]

[0081] 1. Imaging device 7 Airflow channels 22 Imaging elements 25 Imaging Unit 29 EVF Unit 51 Control board 90,200,300,400 ducts 90c, 203, 303, 403 Thermal resistance material 95 card slots 97a~97d Heat transfer components 96 processors 91 Air intake 92, 93 Exhaust vents

Claims

1. Image sensor and A heating element different from the image sensor, It has a duct positioned between the image sensor and the heating element, with a fluid channel formed inside through which fluid flows, The aforementioned duct is, A first duct member is thermally connected to the image sensor and has a first thermal conductivity, A second duct member is thermally connected to the heating element and has the first thermal conductivity, An imaging device characterized by comprising a first thermal resistance member disposed between the first and second duct members and having a second thermal conductivity lower than the first thermal conductivity.

2. The imaging apparatus according to claim 1, characterized in that the first and second duct members are made of metal.

3. The heating element comprises a first heating element and a second heating element. The imaging apparatus according to claim 1, characterized in that the second duct member comprises a first member thermally connected to the first heating element, a second member thermally connected to the second heating element, and a second thermal resistance member disposed between the first and second members and having the second thermal conductivity.

4. The imaging apparatus according to claim 3, characterized in that a bent portion is formed on one of the first and second members, which is bent outwards from the duct, and the second thermal resistance member is disposed between the bent portion and the other of the first and second members.

5. The imaging apparatus according to claim 3, characterized in that the first heating element and the second heating element are processor elements that control the imaging apparatus or generate an image using signals from the imaging element.

6. The first heating element is a processor element that controls the imaging device or generates an image using a signal from the image sensor. The imaging apparatus according to claim 3, characterized in that the second heating element is a display element for displaying the image.

7. The aforementioned duct is, An air intake port connected to an opening provided on the bottom surface of the imaging device, The imaging device according to claim 1, characterized in that it has a first exhaust port and a second exhaust port connected to a first opening provided on the side of the imaging device and a second opening provided on the top surface of the imaging device, respectively.

8. When the cross-sectional area of ​​the intake port is A1, and the sum of the cross-sectional areas of the first and second exhaust ports is A2, 0.9 ≤ A1 / A2 ≤ 1.1 The imaging apparatus according to claim 7, characterized in that it satisfies the following conditions.

9. At least one of the first and second duct members has an extension that is not used to form the flow path, The imaging apparatus according to claim 1, characterized in that the extension portion is thermally connected to the third heating element as the heating element.

10. The imaging device according to claim 9, characterized in that the extension portion and the third heating element are arranged inside the grip portion of the imaging device.

11. The imaging apparatus according to claim 9, characterized in that the third heating element is a recording medium.

12. The imaging apparatus according to claim 1, characterized in that a cooling device for supplying the fluid is attached to the intake port of the duct.

Images