Structure on a substrate, method for manufacturing a structure on a substrate, and apparatus for manufacturing a structure on a substrate

JP2026100980APending Publication Date: 2026-06-22MITSUBISHI ELECTRIC CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
MITSUBISHI ELECTRIC CORP
Filing Date
2024-12-10
Publication Date
2026-06-22

AI Technical Summary

Technical Problem

The contact between copper and polyimide materials leads to decreased heat resistance and peel strength due to oxidative decomposition and copper diffusion, which is not effectively addressed by existing anti-rust agents applied via spin coater or CVD methods, resulting in high costs and limited applicability.

Method used

A substrate structure is developed with a cap film containing a diffusion-preventing component over the copper plating layer, followed by a resin film, using immersion in a solution containing organic or inorganic inhibitors to form the cap film, allowing for mass production and improved reliability.

Benefits of technology

The cap film prevents copper diffusion and resin peeling, enhancing the substrate's reliability and reducing production costs by simplifying the processing equipment and methods.

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Abstract

This invention provides a substrate-mounted structure that enhances reliability by suppressing the peeling of the protective film. [Solution] The substrate structure according to this disclosure comprises a substrate, a copper plating layer provided on the substrate, a cap film covering the copper plating layer and containing a diffusion-preventing component to prevent the diffusion of copper, and a resin film provided on the cap film.
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