Equipment, electronic devices, and vehicles including at least one data processing unit for cooling

Abstract

The present invention provides equipment for cooling a data processing unit with a cooling fluid, an electronic device including said equipment, and a vehicle including said electronic device. [Solution] The device 10 for cooling one data processing unit includes an inlet 12 for receiving a cooling fluid and an outlet 14 for discharging a cooling fluid, an internal cavity 16 that fluidly connects the inlet and outlet, one or more thermally conductive plates 18 extending along the sides of the internal cavity and containing a thermally conductive material, and a plurality of individual thermally conductive objects 20, each of which contains a thermally conductive material and is arranged in a pattern within the internal cavity, each of which thermally conductive objects is in contact with one or more other thermally conductive objects within the internal cavity, one or more of which thermally conductive objects are in thermal contact with one or more thermally conductive plates, and the plurality of thermally conductive objects are arranged within the internal cavity such that the cooling fluid surrounds the thermally conductive objects at least partially when the device is in a fluid cooling operation.

Description

Technical Field

[0001] The present invention relates to cooling at least one data processing unit of an electronic device such as an electronic control unit (ECU) of a vehicle with at least one cooling fluid.

[0002] Vehicles increasingly include electronic devices such as ECUs that contain one or more data processing units such as CPUs or GPUs. For these electronic devices to operate reliably, it is important to prevent excessive heat generation of one or more data processing units during operation by efficient cooling.

[0003] Conventional cooling devices are known in the art, for example, as described in JP-A-2023-011395, JP-A-2013-165120, and Utility Model Registration No. 3093727.

[0004] Patent Document 1 (JP-A-2023-011395) describes a heat dissipation member. The heat dissipation member extends in a first direction along the flow direction of the refrigerant and a second direction orthogonal to the first direction, and has a plate-shaped base portion having a thickness in a third direction orthogonal to both the first direction and the second direction; and at least one fin loop composed of a plurality of pin fins protruding columnarly from one side of the base portion in the third direction. The surface area of the pin fins that can be contacted by the refrigerant is defined as the surface area of the pin fins. The surface area of the pin fins arranged in at least one region is larger than the surface area of the pin fins arranged in another region.

[0005] Patent Document 2 (JP-A-2013-165120) describes a cooling member having spindle-shaped fins having one end and the other end in the longitudinal direction. In this fin, the width of the central portion in the longitudinal direction is wider than the width of other portions, and the cross-sectional shape parallel to the longitudinal direction is substantially spindle-shaped. Such fins are erected in a row in a direction orthogonal to the longitudinal direction on the surface of the heat generating element.

[0006] Patent Document 3 (Utility Model Registration No. 3093727) describes a heat dissipation structure that includes a heat-absorbing base and one or more hollow heat-dissipating pillars provided on the upper surface of the heat-absorbing base. With this heat dissipation structure, the thermal energy generated by the heat-generating element is quickly conducted to the upper part of the heat-dissipating pillars, enabling rapid heat dissipation. [Prior art documents] [Patent Documents]

[0007] [Patent Document 1] Japanese Patent Publication No. 2023-011395 [Patent Document 2] Japanese Patent Publication No. 2013-165120 [Patent Document 3] Utility Model Registration No. 3093727 Gazette [Overview of the project] [Problems that the invention aims to solve]

[0008] Accordingly, an object of the present invention is to provide an improved device for cooling at least one data processing unit with at least one cooling fluid, an electronic device including such a device, and a vehicle including such an electronic device. [Means for solving the problem]

[0009] This disclosure relates to equipment for cooling at least one data processing unit with at least one cooling fluid, electronic devices including such equipment, and vehicles including such electronic devices, as per the appended claims. Embodiments are disclosed in the respective dependent claims.

[0010] According to one aspect of the present invention, a device is provided for cooling at least one data processing unit with at least one cooling fluid. The device includes: an inlet for receiving the cooling fluid; an outlet for discharging the cooling fluid; an internal cavity positioned between the inlet and the outlet and fluidly connecting the inlet and the outlet; at least one thermally conductive plate extending along the side of the internal cavity and comprising a thermally conductive material and configured to be in thermal contact with at least one data processing unit; and a plurality of individual thermally conductive objects; each thermally conductive object comprising a thermally conductive material and arranged in a pattern within the internal cavity. Each of the plurality of thermally conductive objects is in contact with at least one other thermally conductive object among the plurality of thermally conductive objects in the internal cavity. At least one thermally conductive object among the plurality of thermally conductive objects is in thermal contact with at least one thermally conductive plate. The plurality of thermally conductive objects are arranged within the internal cavity such that the cooling fluid at least partially surrounds the thermally conductive objects when the device is in a fluid cooling operation.

[0011] Advantageously, the present invention provides a more efficient and compact device for fluid cooling of at least one data processing unit, which may include, or could include, a CPU and / or a GPU. The present invention further offers the advantage that by arranging multiple thermal conductive objects, the total thermal mass of the thermal conductive objects in a device including at least one thermal conductive plate and multiple thermal conductive objects that transfer heat from at least one data processing unit to a cooling fluid during the cooling operation of the device can be increased. Furthermore, the heat transfer area of ​​the thermal conductive objects can be increased. Heat from at least one data processing unit in thermal contact with the thermal conductive plate can be transferred more efficiently into the cooling fluid through the thermal conductive plate and multiple thermal conductive objects. The device according to the present invention allows heat dissipation to the cooling fluid in any spatial direction. Furthermore, the arrangement of thermal conductive objects causes the cooling fluid to flow turbulently rather than laminarly, making the cooling more effective and beneficial. Advantageously, the present invention can improve the cooling effect and / or performance of the cooling fluid flowing through the device. Furthermore, the device according to the present invention can have a simpler and more flexible structure or design. By arranging multiple heat-conducting objects, cooling performance and / or heat conduction performance can be adjusted to meet technical needs.

[0012] According to various embodiments, at least one cooling fluid is a liquid such as water, or contains this liquid, and may contain one or more additives. According to further embodiments, at least one cooling fluid is a gaseous fluid (or simply a gas) such as air or another suitable gas, or contains this gas, and may contain one or more additives.

[0013] According to one embodiment, the cooling fluid inlet and outlet are openings and / or passages located in the device, respectively. Through the inlet, the cooling fluid can be introduced into an internal cavity. Through the outlet, the cooling fluid can be discharged from the internal cavity. According to one embodiment, the device includes a housing that contains an internal cavity, in which the inlet and outlet are located.

[0014] According to one embodiment, at least one thermal conductive plate is at least part of the wall and / or cover of the internal cavity. The at least one thermal conductive plate may be a seal of the internal cavity. The at least one thermal conductive plate may be an integral part of the housing of the equipment or may be a separate element.

[0015] In this specification, the expressions "thermally in contact with" or "thermally in contact with" may include direct contact between two parts, for example, by screwing or mounting one part onto the other part, or by pressing them together, and / or indirect contact between two parts, for example, through a thermally conductive adhesive, paste, resin, or other thermally conductive element present between the two parts, thereby transferring heat from one part to the other.

[0016] For example, at least one data processing unit may be attached to at least one thermally conductive plate by a thermally conductive interface material (TIM), such as a thermally conductive adhesive.

[0017] In this specification, the term “individual” means individual and / or independent objects that are separated when the equipment is not assembled. Individual objects are objects that are not formed integrally with each other and with at least one thermally conductive plate.

[0018] In one embodiment, each of the heat-conducting objects in contact with at least one heat-conducting plate is in contact with at least one other heat-conducting object from a plurality of heat-conducting objects.

[0019] In one embodiment, during the cooling operation of the equipment, the cooling fluid surrounds at least some of the heat-conducting objects among a plurality of heat-conducting objects. The cooling fluid can surround each of the heat-conducting objects or all of the heat-conducting objects among the plurality of heat-conducting objects. During the cooling operation of the equipment, the cooling fluid can surround the heat-conducting objects almost completely, except for the contact area of ​​the heat-conducting objects.

[0020] A "contact region" refers to the region in which thermally conductive objects are in contact with each other, and / or the region in contact with at least one thermally conductive plate. In the contact region, at least some or each of the multiple thermally conductive objects may be provided with a thermally conductive interface material (TIM). This can further improve heat transfer from one thermally conductive object to another, or from each thermally conductive object to at least one thermally conductive plate.

[0021] In this specification, the term “cooling operation” includes an operating state of the device in which the inlet may be connected to a cooling fluid source and the outlet may be connected to a cooling fluid outlet, and once the flow of cooling fluid is initiated, the cooling fluid flows from the inlet into the internal cavity and out to the outlet. As the cooling fluid flows around a thermally conductive object, it can absorb heat from at least one data processing unit through at least one thermally conductive plate and thermally conductive object.

[0022] In one embodiment, multiple heat-conducting objects are arranged in a certain pattern. For example, this may include precisely positioning multiple heat-conducting objects within an internal cavity to control the flow rate of the cooling fluid and its flow characteristics such as back pressure and turbulence.

[0023] According to one embodiment, at least a portion of a plurality of thermally conductive objects is arranged in at least one layer or lattice pattern. In the case of a lattice pattern, at least a portion of the thermally conductive objects can be arranged at respective sites or nodes of the lattice. A plurality of thermally conductive objects or all thermally conductive objects can be arranged at the sites or nodes of the lattice respectively. The thermally conductive objects of at least one layer pattern can be arranged in a part of the lattice pattern. Therefore, the device can have a design with improved cooling performance, especially a compact design.

[0024] According to one embodiment, at least a portion of the thermally conductive object is a convex body. Each of the thermally conductive objects can be a convex body. Therefore, by expanding the heat conduction area of the thermally conductive object, the heat transfer from the thermally conductive object to the cooling fluid can be improved, and thus the cooling performance can be improved.

[0025] In a further embodiment, at least a portion of the thermally conductive object is a sphere and / or a polygonal element. For example, at least a portion of the thermally conductive object is a sphere and / or a polyhedron. Each thermally conductive object of a plurality of thermally conductive objects can be a sphere or a polyhedron. These shapes are particularly beneficial with respect to heat transfer to the cooling fluid and thus cooling performance. This is because more thermally conductive objects can be arranged within the internal cavity, thereby further increasing the heat mass and heat dissipation.

[0026] According to one embodiment, at least a portion of the heat-conducting objects are deformed and / or compressed spheres and / or polyhedra. When assembling the device, at least one heat-conducting plate can be pressed against the heat-conducting objects, causing at least a portion of the heat-conducting objects to be crushed against each other, thereby deforming and / or compressing them in the contact area. Each of the multiple heat-conducting objects may be a deformed and / or compressed sphere or polyhedron. By deforming and / or compressing the heat-conducting objects, the heat transfer area between the heat-conducting objects can be increased. Depending on the shape of each heat-conducting object, the compression and / or deformation of the heat-conducting objects may vary in the same heat transfer. For example, a polyhedron may require less compression and / or deformation than a sphere to achieve similar heat transfer.

[0027] According to one embodiment, the average diameter of the thermally conductive object, particularly at least part or all of it, is in the range of approximately 1 mm to approximately 10 mm. More specifically, the average diameter of the thermally conductive object, particularly at least part or all of it, is in the range of approximately 1 mm to approximately 3 mm. Thus, the thermally conductive object has an optimized surface area-to-volume ratio. This size range achieves a balance that avoids excessive bulk while ensuring sufficient surface area for efficient heat transfer. Depending on technical requirements, sizes exceeding 10 mm in diameter are also possible.

[0028] According to one embodiment, the thermal conductive material of a plurality of thermal conductive objects and / or at least one thermal conductive plate includes at least one of copper, aluminum, silver, boron arsenide, and thermal conductive polymers, or any combination thereof, or is them themselves.

[0029] Copper has the highest thermal conductivity of any commercially available metal (approximately 398 W / mK at room temperature, i.e., approximately 20°C), making it excellent for heat transfer in the context of this invention. Copper has excellent mechanical strength, can withstand stress, and can maintain its shape even under thermal cycling, making it suitable for high-performance applications. Due to its malleability, copper can be precisely molded into complex shapes such as hot spheres and polyhedra as described herein, improving thermal performance. To reduce or prevent corrosion, copper can be further treated by pre-oxidation to form a protective layer, protective coating, such as a nickel coating or surface passivation.

[0030] Although aluminum has a lower thermal conductivity than copper (approximately 237 W / mK at room temperature), it is still very effective and sufficient for heat dissipation applications from the perspective of this invention. Aluminum is also significantly lighter than copper (density approximately 2.7 g / cm³). 3 Copper has a concentration of approximately 8.96 g / cm³. 3 Therefore, it is ideal for applications where weight is a critical factor, such as vehicles. Aluminum is generally cheaper than copper, resulting in lower manufacturing costs for equipment. Aluminum is easier to machine and process into complex shapes than copper, reducing manufacturing costs and time. Aluminum is highly recyclable, and has a lower environmental impact during extraction and recycling compared to copper.

[0031] Silver also has a high thermal conductivity at room temperature, with a thermal conductivity of approximately 429 W / mK. Boron arsenide has an even higher thermal conductivity, ranging from approximately 1000 to 1300 W / mK.

[0032] According to one embodiment, multiple thermally conductive objects are arranged in a multilayer structure, with at least one layer in thermal contact with at least one thermally conductive plate, and the at least one layer in thermal contact with the at least one thermally conductive plate in contact with another layer of the multilayer structure. By arranging multiple thermally conductive objects in layers, a compact design with improved heat dissipation capacity can be achieved.

[0033] According to one embodiment, at least some of the thermally conductive objects among a plurality of thermally conductive objects, in particular each or all of them, have 2, 3, 4, 5, 6, 8, or 12 nearest thermally conductive objects, or a combination thereof.

[0034] Here, the nearest neighbor object is defined as the object that is closest to another object either by the minimum spatial distance between them or within the entire object system.

[0035] The configuration having 12 nearest heat conductors is particularly advantageous because it allows a large number of heat conductors to be placed within the internal cavity of the device.

[0036] According to one embodiment, at least one thermal conductive plate includes two thermal conductive plates, the two thermal conductive plates are arranged facing each other with respect to an internal cavity, and each of the two thermal conductive plates is configured to be in thermal contact with at least one data processing unit. This has the advantage that a double-chip configuration can be cooled with only one device. The device can be used in a small space and the data processing units can be flexibly positioned.

[0037] According to one embodiment, the device further includes at least one support bar positioned at the inlet and / or outlet to prevent at least some of the thermally conductive objects from shifting within and / or detaching from the internal cavity. The at least one support bar may be an integral part of the housing of the device.

[0038] According to one embodiment, the device further includes at least one support recess configured to receive at least one of a plurality of thermally conductive objects, the at least one support recess located within an internal cavity. During the assembly of the device, the at least one support recess helps to align the plurality of thermally conductive objects, simplifying the arrangement of the plurality of thermally conductive objects and the manufacture of the device. Furthermore, the at least one support recess helps to prevent one or more thermally conductive objects received in the at least one support recess from coming out of the internal cavity.

[0039] This at least one support recess may be formed within the housing of the device. This at least one support recess may include a plurality of support recesses, which may have an egg box shape. The at least one thermal conductive plate may also include at least one support recess configured to receive and hold at least one thermal conductive object from a plurality of thermal conductive objects in place. The at least one support recess may be located on the side of the at least one thermal conductive plate facing the internal cavity.

[0040] According to one embodiment, the device includes at least one support pin positioned within an internal cavity and configured to align at least one of a plurality of thermal conductive objects. Furthermore, the at least one support pin is configured to prevent at least some of the plurality of thermal conductive objects from coming out of the internal cavity. During the assembly of the device, the at least one support pin helps to align the plurality of thermal conductive objects and prevents them from coming out of the internal cavity, thereby simplifying the arrangement of the plurality of thermal conductive objects and the manufacture of the device.

[0041] At least one support pin may have a cylindrical shape. At least one support pin may be formed in the housing of the device. At least one of the multiple heat-conducting objects may include a through hole, the inner diameter of which coincides with the outer circumference of at least one support pin. At least one support pin may be an integral part of the housing of the device.

[0042] At least one thermal conductive plate may include at least one support pin. The at least one support pin may be located on the side of the at least one thermal conductive plate facing the internal cavity. The at least one thermal conductive plate may have at least one receiving recess that matches the outer shape of the at least one support pin and is configured to receive at least a portion of the at least one support pin.

[0043] In one embodiment, the device is configured for use in a vehicle's electronic control unit (ECU). The device has the advantage of being compact in size, thereby enabling efficient cooling of the electronic control unit while reducing the mechanical energy required for the flow of the cooling fluid.

[0044] The cooling fluid may contain or be a liquid such as water, or it may contain or be a gas such as air. The cooling fluid may contain any suitable coolant, or a mixture of several coolants, or a combination thereof, and / or additional additives.

[0045] In another embodiment, the internal cavity is a pocket inside the equipment, within which multiple thermal conductive objects can be added in multiple layers and custom positions. The height of the layers may be only a few millimeters higher than the height of the pocket. By placing one of at least one thermal conductive plate on top of the multiple thermal conductive objects and pressing it against them, the thermal conductive objects can be slightly deformed, increasing the contact area between the thermal conductive objects and between the thermal conductive objects and the equipment housing. An increase in contact area can lead to an increase in the thermal mass through which the cooling fluid can flow. The cooling fluid can flow through the gaps between the thermal conductive objects.

[0046] In another embodiment, the housing of the device and one of at least one thermal conductive plate, particularly the lower thermal conductive plate, can be pre-assembled. A gap of 0.5 to 0.75 mm is provided so that the thermal conductive material can be deformed later. Next, multiple thermal conductive materials can be added to the pocket. Then, another thermal conductive plate, particularly the upper thermal conductive plate, can be added. Next, all the parts may be crushed together with a hydraulic press. The height of the thermal conductive material layer may initially be greater than the height of the pocket inside the device. In this way, the multiple thermal conductive materials can be deformed and crushed against each other and against the housing of the device.

[0047] According to another aspect of the present invention, an electronic device is provided. This electronic device includes at least one data processing unit and the device according to the present invention as described herein. The at least one data processing unit is in thermal contact with at least one thermally conductive plate.

[0048] All the features, embodiments, advantages, and further descriptions of the equipment described above also apply to this electronic device.

[0049] According to one embodiment, at least one data processing unit includes a first data processing unit and a second data processing unit, and at least one thermal conductive plate includes a first thermal conductive plate and a second thermal conductive plate. The first data processing unit is in thermal contact with the first thermal conductive plate, and the second data processing unit is in thermal contact with the second thermal conductive plate. The first and second thermal conductive plates are arranged facing each other with respect to an internal cavity.

[0050] In this way, two data processing units can be efficiently cooled in a single device with a compact design. This device can be used in applications or situations where only limited space is available, such as inside a vehicle.

[0051] The first and second data processing units can each be mounted on a corresponding thermal conductive plate. The first and second thermal conductive plates may be arranged substantially parallel to each other.

[0052] According to one embodiment, the electronic device is part of, includes, or is an electronic control unit (ECU) of a vehicle.

[0053] A vehicle's ECU (Electronic Control Unit) generally refers to a control unit that can be configured to manage vehicle functions such as engine performance, fuel injection, ignition timing, and emissions to ensure optimal efficiency and regulatory compliance. The ECU may be configured to control the gear shifts of an automatic transmission for smooth and efficient driving. The ECU may be configured to control anti-lock braking systems (ABS) and electronic stability control to improve safety. The ECU manages electrical systems such as lighting, wipers, windows, and door locks. The ECU may be configured to activate airbags and seatbelt pretensioners in the event of a collision. Furthermore, the ECU may be configured to manage vehicle connectivity, GPS navigation, emergency communication systems, and / or entertainment / audio systems. The ECU may be configured to control autonomous driving functions and / or features, as well as the detection of the surrounding environment, using systems such as LiDAR, cameras, and other sensors.

[0054] In one embodiment, one or more data processing units include or are a CPU (Central Processing Unit) and / or a GPU (Graphics Processing Unit).

[0055] According to yet another aspect of the present invention, the vehicle includes the electronic devices described herein.

[0056] All features, embodiments, advantages, and further descriptions of equipment and electronic devices described herein also apply to vehicles.

[0057] In one embodiment, the vehicle is a smart car. A smart car can generally refer to a technologically advanced vehicle designed to improve efficiency, safety, and convenience through features such as connectivity, advanced driver-assistance systems (ADAS), and environmentally friendly powertrains. A smart car can refer to any vehicle that includes intelligent systems such as AI-powered navigation, autonomous driving functions, and real-time diagnostics. Smart cars are often integrated with smartphones and the internet, providing remote access, personalized settings, and over-the-air updates. [Brief explanation of the drawing]

[0058] The embodiments of the present invention will be described below with reference to the drawings. The embodiments shown in the drawings can be combined to form further embodiments. [Figure 1] Various diagrams of equipment for fluid cooling at least one data processing unit according to aspects and embodiments of the present invention are shown. [Figure 2] This is a perspective view of equipment for fluid cooling at least one data processing unit according to one embodiment. [Figure 3] Various diagrams of equipment for fluid cooling at least one data processing unit according to one embodiment are shown. [Figure 4] The diagram shows components of equipment for fluid cooling at least one data processing unit according to one embodiment. [Figure 5] Various diagrams of equipment for fluid cooling at least one data processing unit according to one embodiment are shown. [Figure 6] Various lattice arrangements of thermally conductive objects according to the embodiment are shown. [Figure 7] Various lattice arrangements of thermally conductive objects according to the embodiment are shown. [Figure 8] Various lattice arrangements of thermally conductive objects according to the embodiment are shown. [Figure 9] Various lattice arrangements of thermally conductive objects according to the embodiment are shown. [Figure 10] Various shapes of thermally conductive objects and cooling fluid flows according to the embodiment are shown. [Figure 11] This shows an electronic device according to an embodiment of the present invention. [Figure 12] This shows a vehicle based on one embodiment of the present invention. [Modes for carrying out the invention]

[0059] Figure 1 shows various diagrams of equipment for cooling at least one data processing unit with at least one cooling fluid according to an aspect of the present invention. Figure 1a) shows a perspective view of equipment 10 for fluid cooling at least one data processing unit 102a, 102b (shown in Figure 11). Equipment 10 includes an inlet 12 for a cooling fluid CL (shown in Figure 10), such as a coolant or gas; an outlet 14 for the cooling fluid CL; an internal cavity 16 positioned between the inlet 12 and the outlet 14 and fluidly connecting the inlet 12 and the outlet 14; at least one thermally conductive plate 18a, 18b extending along the side of the internal cavity 16 and comprising a thermally conductive material and configured to be in thermal contact with the at least one data processing unit 102a, 102b; and a plurality of individual thermally conductive objects 20, each thermally conductive object 20 comprising a thermally conductive material comprising copper and / or aluminum, or which may comprise copper and / or aluminum, and positioned within the internal cavity 16. Each of the multiple thermal conductive objects 20 is in contact with at least one other thermal conductive object 20 within the internal cavity 16. At least one of the multiple thermal conductive objects 20 is in thermal contact with at least one thermal conductive plate 18a, 18b. Furthermore, the multiple thermal conductive objects 20 are arranged within the internal cavity 16 such that the cooling fluid CL at least partially surrounds the thermal conductive objects 20 when the device 10 is in a fluid cooling operation.

[0060] The device may include a housing 28. An internal cavity 16 may be located within the housing 28. The housing 28 may be molded to form the internal cavity 16. The housing 28 may enclose the internal cavity 16. The housing 28 may have a rectangular parallelepiped shape. The housing 28 may include a polymer material or may be formed from a polymer material. The housing 28 may include a metallic material. The housing 28 may include a combination of polymer and metal. The housing 28 may include the same material as at least one thermal conductive plate 18a, 18b or may be formed from the same material. The housing 28 may include at least one thermal conductive plate 18a, 18b.

[0061] The device 10 may include at least one thermal conductive plate, in this embodiment two thermal conductive plates 18a, 18b. The two thermal conductive plates 18a, 18b may be positioned facing each other relative to the internal cavity 16 and / or housing 28. Each of the two thermal conductive plates 18a, 18b may be configured to be in thermal contact with at least one data processing unit 102a, 102b. The two thermal conductive plates 18a, 18b may include a first, in particular upper thermal conductive plate 18a and a second, in particular lower thermal conductive plate 18b. The first and second thermal conductive plates 18a, 18b may be positioned parallel to each other in the housing 28.

[0062] The inlet 12 and outlet 14 may be located in the housing 28 and / or formed within the housing 28. The inlet 12 and outlet 14 may be located on the opposite side of the device 10, particularly on the front side opposite the housing 28.

[0063] In general, the multiple thermal conductive objects 20 may be arranged in at least one layer or grid pattern, or in a layer or grid arrangement. In this specification, the terms “pattern” and “arrangement” are used interchangeably for each arrangement of the thermal conductive objects 20. Such at least one layer or grid pattern may include one or more layers and / or one or more grids of patterned thermal conductive objects 20. The multiple thermal conductive objects 20 may be arranged (arranged) in multiple layers 20a, 20b. The first layer, in particular the upper layer 20a, may be in thermal contact with the first thermal conductive plate 18a. The second layer, in particular the lower layer 20b, may be in thermal contact with the second thermal conductive plate 18b. Both the first layer 20a and the second layer 20b may be in contact with each other, or there may be one or more layers of thermal conductive objects 20 between the first layer 20a and the second layer 20b. The multiple thermal conductive objects 20 may be spherical.

[0064] Multiple thermally conductive objects 20 can be arranged to form parallel and / or intersecting fluid channels 30 through which the cooling fluid CL flows from the inlet 12 to the outlet 14 during the cooling operation of the equipment 10. The fluid channels 30 can extend from one side of the housing 28, particularly from the wall to the other side, and / or from the first thermally conductive plate 18a to the second thermally conductive plate 18b. The fluid channels 30 can extend horizontally, obliquely, and / or vertically.

[0065] Figure 1b) shows a side view of the device 10 in Figure 1a) as seen from the inlet 12. The inlet 12 and outlet 14 (not shown) may also be openings in the housing 28, and the remaining portion of the housing 28 around the openings forms a barrier to prevent the multiple heat-conductive objects 20 from shifting position and / or coming out of the internal cavity 16.

[0066] Figure 1c) is a perspective view of the apparatus 10 of Figure 1a), with the first or upper thermal conductive plate 18a removed or unassembled. A grid-like arrangement of multiple thermal conductive objects 20, particularly the first or upper layer 20a of the thermal conductive objects 20, can be observed. Each of the multiple thermal conductive objects may be placed at any position or node of a particular grid. The grid may be, for example, a cubic grid. The thermal conductive objects 20 may be arranged side by side, vertically and horizontally.

[0067] Figure 1d) is a perspective view of the apparatus 10 shown in Figure 1a), in which the multiple heat-conducting objects 20 and the upper heat-conducting plate 18a have been removed or are not yet assembled. The housing 28 with an empty internal cavity 16 and the lower heat-conducting plate 18b can be seen.

[0068] Figure 2 shows a perspective view of a device 10 for fluid cooling of at least one data processing unit according to one embodiment. The device 10 can be designed similarly to, or identically to, the device shown in Figure 1. The device 10 may further include support bars 22. The support bars 22 may be positioned at the inlet 12 and / or outlet 14 (not shown). The support bars 22 can prevent the thermal conductive object 20, in particular the intermediate layer of the thermal conductive object 20, from shifting within the internal cavity 16 and / or coming out of the internal cavity 16. The support bars 22 may be horizontal bars or barriers. The support bars 22 may be an integral part of the housing 28. The support bars 22 may divide the inlet 12 to form a double inlet. The support bars 22 may divide the outlet 14 to form a double outlet.

[0069] Figure 3 shows various diagrams of a device 10 for fluid cooling of at least one data processing unit according to one embodiment. Figure 3a) is a top view of the device 10, in which the internal cavity 16 and housing 28 can be observed because the upper thermal conductive plate 18a has been removed or has not yet been assembled. The device 10 may have the features of the device of Figure 1. The device 10 may further include a plurality of support pins 26 positioned on the edge of the internal cavity 16 adjacent to the inlet 12 and outlet 14. The support pins 26 may be formed integrally with the housing 28. The support pins 26 may extend from one side of the housing 28, for example, from the bottom. The support pins 26 may be configured to align at least some of the thermal conductive objects 20 and prevent them from coming out of the internal cavity 16. To align at least some of the thermal conductive objects 20, the objects may have through holes that match the outer shape, in particular the diameter, of the support pins 26. The inner shape of the through-hole may be slightly larger than the outer shape of the support pin 26.

[0070] Figure 3b) shows a cross-section of the device 10 along line AA in Figure 3a). The device may have a single upper thermal conductive plate 18 covering the internal cavity 16. Support pins 26 extend from the bottom of the housing 28 toward the thermal conductive plate 18. The thermal conductive plate 18 may have a plurality of receiving recesses 25 configured to receive the ends of the support pins 26. The shape of the receiving recesses 25 matches the outer shape of the ends of the support pins 26. This improves the rigidity of the device 10 when the thermal conductive plate 18 is assembled.

[0071] Figure 4 shows components of a device 10 for fluid cooling at least one data processing unit according to one embodiment. Figure 4a) is a perspective view of the housing 28. The housing 28 may include support recesses 24, each of which is configured to receive a single thermal conductive object 20 and prevent the thermal conductive object 20 from moving in and out of the internal cavity 16, and may be molded to match the outer shape of each thermal conductive object 20. The support recesses 24 may be located on one or more side walls of the housing 28 and / or on the lower part of the housing 28.

[0072] Figure 4b) shows a perspective view of the thermal conductive plate 18 rotated 180°, showing the side of the thermal conductive plate facing the internal cavity 16 and / or thermal conductive object 20 when the device 10 is assembled. The thermal conductive plate 18 may have a plurality of support recesses 24. These support recesses may have the same or identical support recess features as described above with respect to Figure 4a) and the housing 28.

[0073] The housing 28 and the thermal conductive plate 18 may have interlocking geometric shapes to ensure proper positioning of the thermal conductive object 20.

[0074] Figure 4c) shows a perspective view of the housing 28 similar to that in Figure 4a), in which a polygonal or polyhedral thermal conductive object 20 is placed inside the internal cavity 16.

[0075] Figure 4d) shows a perspective view of an assembled device 10 for fluid cooling of at least one data processing unit, using polygonal elements or polyhedra instead of spheres as the thermal conductive object 20.

[0076] Figure 5 shows various diagrams of a device 10 for fluid cooling of at least one data processing unit according to one embodiment. Figure 5a) shows a cross-section of the device 10 similar to Figure 3b). The thermal conductive object 20 is formed as a sphere. The contact area between the spheres may depend on the deformation that occurs when the thermal conductive plate 18 is attached.

[0077] Figure 5b) shows a cross-section of the same apparatus 10 as in Figure 4d) along a row of thermal conductive objects 20. The thermal conductive objects 20 are formed as polygonal elements or polyhedra. The contact area between polygonal elements is customizable, and the size can be controlled during the design phase. The total contact area (contact area with all adjacent elements) can be larger compared to a spherical design.

[0078] Figure 6 shows various grid patterns or arrangements of the thermally conductive object 20 according to various embodiments. Figure 6a) shows the arrangement of one layer 20a of spherical thermally conductive objects 20 arranged in a square grid, and shows an arrangement in which the maximum number of interconnections between one object and other objects 20, or the maximum number of nearest neighbor objects 20, or the maximum coordination number may be 4.

[0079] Figure 6b) shows the arrangement of two layers 20a and 20b of spherical thermal conductive objects 20 arranged in a square grid, and shows an arrangement in which the maximum number of interconnections between one object and another object 20, or the maximum number of nearest neighbor objects 20, or the maximum coordination number can be 5.

[0080] Figure 6c) shows the arrangement of three layers 20a, 20b, and 20c of spherical thermal conductive objects 20 arranged in a square grid, and shows an arrangement in which the maximum number of interconnections between one object and other objects 20, or the maximum number of nearest neighbor objects 20, or the maximum coordination number can be 6.

[0081] Figure 7 shows various grid patterns or arrangements of the thermal conductive object 20 according to various embodiments. Figure 7a) shows an arrangement of three layers 20a, 20b, and 20c of spherical thermal conductive objects 20 arranged in a square grid, showing an arrangement where the maximum number of interconnections between one object and other objects 20, or the maximum number of nearest neighbor objects 20, or the maximum coordination number may be 6. Compared to Figure 6c), one layer or adjacent rows within one layer may be offset from one another. One layer or adjacent rows within one layer may be offset from one another, or they may be staggered.

[0082] Figure 7b) shows an arrangement of three layers 20a, 20b, and 20c of spherical thermal conductive objects 20 arranged in a square grid, where the maximum number of interconnections between one object and other objects 20, or the maximum number of nearest neighbor objects 20, or the maximum coordination number may be 8. Adjacent layers may be offset from each other. Adjacent layers may be offset from each other or arranged alternately. The grid arrangement or grid pattern shown in Figure 7 can increase turbulence (e.g., liquid flow or gas flow) compared to Figure 6.

[0083] Figure 8 shows various grid patterns or grid arrangements of the thermally conductive object 20 according to various embodiments. Figure 8a) shows the arrangement of one layer 20a of polygonal thermally conductive objects 20 arranged in a square grid, and shows an arrangement in which the maximum number of interconnections between one object and other objects 20, or the maximum number of nearest neighbor objects 20, or the maximum coordination number may be 4.

[0084] Figure 8b) shows the arrangement of two layers 20a and 20b of polygonal heat-conductive objects 20 arranged in a square grid, and represents an arrangement in which the maximum number of interconnections between one object and another object 20, or the maximum number of nearest neighbor objects 20, or the maximum coordination number can be 5.

[0085] Figure 8c) shows the arrangement of three layers 20a, 20b, and 20c of polygonal heat-conductive objects 20 arranged in a square grid, and represents an arrangement in which the maximum number of interconnections between one object and other objects 20, or the maximum number of nearest neighbor objects 20, or the maximum coordination number can be 6.

[0086] Figure 9 shows various grid patterns or arrangements of the thermal conductive object 20 according to various embodiments. Figure 9a) shows an arrangement of three layers 20a, 20b, and 20c of polygonal thermal conductive objects 20 arranged in a square grid, which can result in a maximum number of interconnections between one object and other objects 20, or a maximum number of nearest neighbor objects 20, or a maximum coordination number of 8. Adjacent layers of thermal conductive objects may be offset from each other. Adjacent layers may be arranged offset from each other or in an alternating pattern.

[0087] Figure 9b) shows a three-layer pattern 20a, 20b, and 20c of the same or the same height as in Figure 8c), with an intermediate layer added by further widening the horizontal spacing of the thermal conductive objects 20. In Figure 9, the pitch between vertical rows is larger compared to Figure 8. In Figure 9b), the density of the thermal conductive objects 20 is increased.

[0088] From a different perspective, Figure 9b) shows the arrangement of six layers 20a, 20b, 20c, 20d, 20e, and 20f of polygonal thermal conductive objects 20 arranged in a square grid, and shows an arrangement where the maximum number of interconnections between one object and other objects 20, or the maximum number of nearest neighbor objects 20, or the maximum coordination number can be 12. Adjacent layers of thermal conductive objects may be offset from each other. Adjacent layers may be offset from each other or arranged alternately.

[0089] Increasing the number of nearby heat-conducting objects increases the heat conduction paths between the heat-conducting objects 20 (spheres or other polygonal shapes). Polygonal heat-conducting objects can have more and larger contact surfaces with adjacent objects. However, because the cooling fluid cannot flow as smoothly as with a spherical arrangement, polygonal heat-conducting objects can slightly increase the pressure drop of the cooling fluid flow. On the other hand, the flow is more prone to turbulence compared to a spherical design, which can improve cooling performance.

[0090] According to one embodiment, at least a portion of each thermal conductive object 20 includes an additional thermal conductive layer on at least a portion of the outer surface of each thermal conductive object 20. The thermal conductive layer may include, for example, a thermal conductive adhesive or a thermal conductive adhesive. When assembling the device 10, at least a portion of the thermal conductive objects 20 can be brought into contact with each other by the thermal conductive layer. That is, at least a portion of the thermal conductive objects can be bonded to each other and arranged as a whole within the internal cavity 16.

[0091] According to one embodiment, at least a portion of the thermally conductive object 20 can be placed one by one within the internal cavity 16.

[0092] Figure 10 shows the flow of a cooling fluid CL with a heat-conducting object 20 of a different shape. Figure 10a) shows the flow behavior of the cooling fluid CL, i.e., the flow F, with respect to a polygonal heat-conducting object 20. The object 20 has multiple planes, and the flowing cooling fluid CL is positioned to collide with one of the planes, thereby causing vortices, i.e., turbulence F, to form in the flow F. This design promotes the formation of turbulence F within the internal cavity 16 of the device 10 itself. Because the cooling fluid is turbulent, it can absorb heat more efficiently from the heat-conducting object 20.

[0093] Figure 10b) shows the flow behavior of a cooling fluid CL, i.e., the flow F, in relation to a polygonal heat-conducting object 20 with a different design from Figure 10a). The object 20 has multiple planes and inclined sections 21. The object 20 is positioned so that the flowing cooling fluid CL strikes the inclined sections 21, allowing for the formation of a smooth flow F. This design can help reduce back pressure. Because the inclined sections 21 can be designed as sharp tips, the cooling fluid CL can flow more smoothly around the object 20. As a result, this design can achieve a pressure drop similar to that of a spherical design. However, this object 20 can come into contact with up to 12 other heat-conducting objects, resulting in higher cooling performance than the spherical design, whereas the spherical design can come into contact with up to 8 adjacent heat-conducting objects.

[0094] Figure 11 shows an embodiment of an electronic device 100 according to an aspect of the present invention. The electronic device 100 may include at least one data processing unit 102a and / or 102b and the equipment 10 described herein. At least one data processing unit 102a and / or 102b may be in thermal contact with at least one thermally conductive plate 18a and / or 18b of the equipment 10. The data processing units 102a and / or 102b may be other electronic data processing units such as a CPU, GPU, or an integrated circuit of a known type.

[0095] Figure 11a) shows an electronic device 100 which may include a first data processing unit 102a and a second data processing unit 102b, and a first thermal conductive plate 18a and a second thermal conductive plate 18b. The first data processing unit 102a may be in thermal contact with the first thermal conductive plate 18a, and the second data processing unit 102b may be in thermal contact with the second thermal conductive plate 18b. The first and second thermal conductive plates 18a and 18b may be arranged facing each other with respect to the housing 28 and / or the internal cavity 16 of the device.

[0096] One or both of the first and second data processing units 102a and 102b may be in direct contact with the first and second thermal conductive plates 18a and 18b, respectively. One or both of the data processing units 102a and 102b may be attached to the respective thermal conductive plates 18a and 18b by screws (not shown) or by a thermal conductive interface material (TIM) such as a thermal conductive adhesive or glue.

[0097] Therefore, heat and / or thermal energy can be released from both sides. Only one cooling chamber is required. A compact design is possible.

[0098] Figure 11b) shows an electronic device 100 according to one embodiment configured to cool one data processing unit. The electronic device 100 has one data processing unit 102b located on the bottom surface of the device 10. The data processing unit 102b is placed on a lower thermal conductive plate 18b. Plate 18a may be a thermal conductive plate having the same or the same thermal conductivity as plate 18b on which the data processing unit 102b is placed, or it may be a plate with a lower thermal conductivity than plate 18b.

[0099] Figure 12 shows a vehicle 1000 according to an embodiment of the present invention. The vehicle 1000 may be any passenger car, in particular a smart car. The vehicle 1000 includes electronic devices 100 according to various embodiments described herein. The electronic devices 100 may be, for example, an electronic control unit (ECU) installed in the trunk of the vehicle.

[0100] This invention offers the advantage of improved cooling performance in a compact package. It can cool two CPU and / or GPU packages simultaneously. By creating turbulent flow in the cooling fluid, a high Reynolds number can be achieved. Thus, heat transfer can be improved. The power efficiency of the equipment can be improved. Because the water flow can be kept low, the lifespan of the water pump is extended and operating noise is reduced. Furthermore, the equipment can withstand high compressive forces due to its internal structure and the arrangement of thermally conductive materials.

[0101] In particular, water pumps installed in vehicles, for example, can consume less power and operate quietly because the surface area of ​​the heatsink can be increased according to the thermal requirements. This is because the water flow within the heatsink becomes turbulent. A large thermal mass is obtained from the numerous contact surfaces between thermally conductive objects, ensuring a stable cooling temperature, which is especially beneficial in vehicle applications where space and cooling capacity are limited.

[0102] In particular, aspects of the present invention provide an improved method for forming a three-dimensional internal structure of a heat sink. In fin-shaped or pin-shaped heat sink designs, as described in the known prior art referred to in the introduction of this specification, the flow of the cooling fluid occurs basically only in two dimensions (i.e., laminar flow), whereas in the heat sink design including thermal conductive objects proposed in the present invention, the cooling fluid flows in three-dimensional space, which is converted into three-dimensional turbulent flow, i.e., flow in the horizontal and vertical planes. Such three-dimensional turbulence is very beneficial for improving heat transfer from the heat sink to the cooling fluid. In particular, the convex body shape and the position of the thermal conductive objects are also beneficial factors that provide flexibility depending on the application. Furthermore, the new heat sink design improves multi-directional heat dissipation through contact surfaces between thermal conductive objects and between thermal conductive objects and the heat sink body (e.g., one or more thermal conductive plates). [Explanation of symbols]

[0103] List of reference codes 10:Equipment 12:Entrance 14:Exit 16: Internal cavity 18, 18a, 18b: Thermally conductive plates 20: Thermally conductive objects 21: Inclined part 20a, 20b, 20c: Thermally conductive material layer 20d, 20e, 20f: Thermally conductive material layer 22: Support bar 24: Support recess 25: Receptive recess 26: Support pin 28: Housing 30: Fluid Channel 100:Electronic equipment 102, 102a, 102b: Data processing units 1000 vehicles F: Flow of cooling fluid CL: Cooling fluid

Claims

1. A device (10) for cooling at least one data processing unit (102) with at least one cooling fluid, the device comprising: An inlet (12) for receiving the cooling fluid, An outlet (14) for discharging the cooling fluid, An internal cavity (16) is positioned between the inlet (12) and the outlet (14) and fluidly connects the inlet (12) and the outlet (14), Extending along the side surface of the internal cavity (16), at least one thermally conductive plate (18) comprising a thermally conductive material and configured to be in thermal contact with the at least one data processing unit (102), It includes a plurality of individual thermally conductive objects (20), each thermally conductive object (20) containing a thermally conductive material and arranged in a pattern within the internal cavity (16), Each of the plurality of thermal conductive objects (20) is in contact with at least one other thermal conductive object (20) within the internal cavity (16), At least one of the plurality of heat-conductive objects (20) is in thermal contact with the at least one heat-conductive plate (18), The plurality of heat-conductive objects (20) are arranged within the internal cavity (16) such that the cooling fluid surrounds the heat-conductive objects (20) at least partially when the device (10) is performing a fluid cooling operation. Equipment (10).

2. The apparatus (10) according to claim 1, wherein at least a portion of the plurality of heat-conductive objects (20) are arranged in at least one layer or grid pattern.

3. The apparatus (10) according to claim 1 or 2, wherein at least a portion of the thermally conductive object (20) is a convex body.

4. The apparatus (10) according to claim 3, wherein at least a portion of the heat-conductive object (20) is a spherical and / or polygonal element.

5. The apparatus (10) according to claim 3 or 4, wherein the average diameter of the heat-conductive object (20) is in the range of about 1 mm to about 10 mm.

6. The apparatus (10) according to any one of claims 1 to 5, wherein the thermal conductive material of the plurality of thermal conductive objects (20) includes at least one of copper, aluminum, silver, boron arsenide, a thermal conductive polymer, or any combination thereof.

7. The apparatus (10) according to any one of claims 1 to 6, wherein the plurality of thermally conductive objects (20) are arranged in a multilayer (20a, 20b, 20c), at least one of the layers (20a) is in thermal contact with the at least one thermally conductive plate (18), and at least one of the layers (20a) that is in thermal contact with the at least one thermally conductive plate (18) is in contact with another layer (20b) of the multilayer (20a, 20b, 20c).

8. The apparatus (10) according to any one of claims 1 to 6, wherein at least some of the plurality of thermal conductive objects (20) have two, three, four, five, six, eight, or twelve nearest thermal conductive objects, or a combination thereof.

9. The apparatus (10) according to any one of claims 1 to 8, wherein the at least one thermal conductive plate (18) comprises two thermal conductive plates (18a, 18b), the two thermal conductive plates (18a, 18b) are arranged facing each other with respect to the internal cavity (16), and each of the two thermal conductive plates (18a, 18b) is configured to be in thermal contact with at least one data processing unit (102).

10. The apparatus (10) according to any one of claims 1 to 9, further comprising at least one support bar (22) positioned at the inlet (12) and / or outlet (14) to prevent at least some of the plurality of thermal conductive objects (20) from shifting position within the internal cavity (16) and / or from coming out of the internal cavity (16).

11. The device (10) further includes at least one support recess (24) configured to receive at least one of the plurality of heat-conductive objects (20), the at least one support recess (24) being located within the internal cavity (16), and / or The apparatus (10) according to any one of claims 1 to 10, further comprising at least one support pin (26) disposed within the internal cavity (16) and configured to align at least one of the plurality of thermal conductive objects (20) and to prevent at least some of the plurality of thermal conductive objects (20) from coming out of the internal cavity (16).

12. The apparatus (10) according to any one of claims 1 to 12, wherein the at least one cooling fluid is a liquid or a gas, or includes a liquid or a gas.

13. The apparatus (10) according to claim 12, wherein the at least one cooling fluid is water or contains water, or the at least one cooling fluid is air or contains air.

14. An electronic device (100), wherein the electronic device (100) is At least one data processing unit (102) and The apparatus (10) described in any one of claims 1 to 11, The at least one data processing unit (102) is in thermal contact with the at least one thermally conductive plate (18). Electronic equipment (100).

15. The at least one data processing unit (102) includes a first data processing unit (102a) and a second data processing unit (102b), and the at least one thermal conductive plate (18) includes a first thermal conductive plate (18a) and a second thermal conductive plate (18b), The first data processing unit (102a) is in thermal contact with the first thermal conductive plate (18a), and the second data processing unit (102b) is in thermal contact with the second thermal conductive plate (18b). The electronic device (100) according to claim 14, wherein the first and second heat-conducting plates (18a, 18b) are arranged facing each other with respect to the internal cavity (16).

16. The electronic device (100) according to claim 14 or 15, wherein the electronic device (100) is part of the vehicle's electronic control unit, includes the vehicle's electronic control unit, or is the vehicle's electronic control unit.

17. A vehicle (1000) comprising an electronic device (100) according to any one of claims 14 to 16.

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