Component mounting apparatus and component mounting method

Abstract

Position the support pins correctly. [Solution] The component mounting apparatus comprises a mounting head having a support surface facing the lower surface of a substrate placed at a mounting processing position and on which support pins supporting the lower surface of the substrate are arranged, a nozzle that releasably holds components to be mounted on the upper surface of the substrate, a first holding member that releasably holds the support pins, and a second holding member that releasably holds the support pins.

Description

Technical Field

[0001] The technology disclosed in this specification relates to a component mounting device and a component mounting method.

Background Art

[0002] In the technical field related to component mounting devices, support pins as disclosed in Patent Document 1 are known. The support pins support the lower surface of a substrate on which components are mounted. By supporting the substrate with the support pins, the deflection of the substrate is suppressed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] If the support pins are not arranged at appropriate positions, it may be difficult to sufficiently suppress the deflection of the substrate.

[0005] The technology disclosed in this specification aims to arrange the support pins at appropriate positions.

Means for Solving the Problems

[0006] This specification discloses a component mounting device. The component mounting device includes a mounting head having a support surface facing the lower surface of a substrate arranged at a mounting processing position and on which support pins for supporting the lower surface of the substrate are arranged, a nozzle for releasably holding a component mounted on the upper surface of the substrate, a first holding member for releasably holding the support pins, and a second holding member for releasably holding the support pins.

Effects of the Invention

[0007] According to the technology disclosed herein, the support pins are positioned appropriately. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a schematic side view showing a component mounting apparatus according to an embodiment. [Figure 2] Figure 2 is a schematic top view showing a parts supply device according to an embodiment. [Figure 3] Figure 3 is a schematic perspective view showing the support pin housing member according to the embodiment. [Figure 4] Figure 4 is a schematic front view showing the mounting head according to the embodiment. [Figure 5] Figure 5 is a schematic top view showing the mounting head according to the embodiment. [Figure 6] Figure 6 is a side view showing the support pins according to the embodiment. [Figure 7] Figure 7 shows a holding member and an air cylinder according to an embodiment. [Figure 8] Figure 8 shows a method for fixing the retaining member and the support pin according to an embodiment. [Figure 9] Figure 9 is a schematic top view showing a substrate transport apparatus according to an embodiment. [Figure 10] Figure 10 is a block diagram showing the controller of a component mounting device according to an embodiment. [Figure 11] Figure 11 is a flowchart showing a method for transporting support pins according to an embodiment. [Figure 12] Figure 12 is a diagram illustrating a method for transporting support pins according to an embodiment. [Figure 13] Figure 13 is a diagram illustrating a method for transporting support pins according to an embodiment. [Figure 14] Figure 14 is a diagram illustrating a method for transporting support pins according to an embodiment. [Figure 15] Figure 15 is a diagram illustrating a method for transporting support pins according to an embodiment. [Figure 16] FIG. 16 is a diagram for explaining the state of the support pin arranged at the target position by the first placement operation according to the embodiment. [Figure 17] FIG. 17 is a diagram for explaining the first placement operation according to the embodiment. [Figure 18] FIG. 18 is a diagram for explaining the second placement operation according to the embodiment. [Figure 19] FIG. 19 is a flowchart showing a method of arranging support pins according to the embodiment. [Figure 20] FIG. 20 is a diagram showing support pins for supporting the lower surface of the substrate according to the embodiment.

Mode for Carrying Out the Invention

[0009] The component mounting apparatus 1 according to the embodiment will be described with reference to the drawings. In the embodiment, an XYZ orthogonal coordinate system is set in the component mounting apparatus 1, and the positional relationship of each part will be described while referring to this XYZ orthogonal coordinate system. The direction parallel to the X-axis (first axis) of a predetermined plane is defined as the X-axis direction (first axis direction). The direction parallel to the Y-axis (second axis) orthogonal to the X-axis on the predetermined plane is defined as the Y-axis direction (second axis direction). The direction parallel to the Z-axis (third axis) orthogonal to the predetermined plane is defined as the Z-axis direction (third axis direction). The rotational direction or tilting direction centered on the X-axis is defined as the θX direction. The rotational direction or tilting direction centered on the Y-axis is defined as the θY direction. The rotational direction or tilting direction centered on the Z-axis is defined as the θZ direction. The predetermined plane including the X-axis and the Y-axis is appropriately referred to as the XY plane. In the embodiment, the XY plane is parallel to the horizontal plane. The X-axis direction may be regarded as the left-right direction. It may be considered that the +X side is the right side and the -X side is the left side. The Y-axis direction may be regarded as the front-back direction. It may be considered that the +Y side is the front side and the -Y side is the back side. The Z-axis direction may be regarded as the up-down direction. It may be considered that the +Z side is the upper side and the -Z side is the lower side.

[0010] [Component Mounting Apparatus] FIG. 1 is a side view schematically showing a component mounting apparatus 1 according to an embodiment. The component mounting apparatus 1 mounts a component C on a substrate P. The component mounting apparatus 1 includes a base 2, a component supply device 3 that supplies the component C, a substrate transfer device 4 that transfers the substrate P, a support pin 5 that supports the lower surface of the substrate P, a mounting head 6 that mounts the component C on the upper surface of the substrate P, an arrangement unit 7 that arranges the support pin 5 on the upper surface of the base 2, and a controller 8.

[0011] FIG. 2 is a top view schematically showing the component supply device 3 according to the embodiment. As shown in FIGS. 1 and 2, the component supply device 3 has a carriage 9, a reel holding mechanism 10, a feeder bank 11, a reel 12, and a component feeder 13.

[0012] The carriage 9 supports each of the reel holding mechanism 10 and the feeder bank 11. The reel holding mechanism 10 supports the reel 12. The feeder bank 11 supports the component feeder 13. The reel holding mechanism 10 is arranged on the -Y side with respect to the feeder bank 11. The base 2 is arranged on the +Y side with respect to the component supply device 3. The feeder bank 11 is connected to the base 2.

[0013] The reel 12 is rotatably supported by the reel holding mechanism 10. The component feeder 13 is attached to the feeder bank 11. A carrier tape 14 is wound around the reel 12. The carrier tape 14 holds a plurality of components C. The component feeder 13 is a tape feeder. The carrier tape 14 is supplied from the reel 12 to the component feeder 13. The component feeder 13 supplies the component C held by the carrier tape 14 to the mounting head 6. An opening 13A is provided at the +Y side end of the upper surface of the component feeder 13. The component feeder 13 sends the component C held by the carrier tape 14 to the opening 13A. The mounting head 6 can hold and transfer the component C sent to the opening 13A.

[0014] The feeder bank 11 has multiple mounting slots 15 into which component feeders 13 are inserted. Multiple mounting slots 15 are provided at equal intervals in the X-axis direction. One component feeder 13 is inserted into one mounting slot 15. Multiple component feeders 13 are arranged in the X-axis direction in the feeder bank 11.

[0015] The component mounting device 1 includes a housing member 16 that accommodates a plurality of support pins 5. The housing member 16 is mounted on a feeder bank 11. The housing member 16 is inserted into a mounting slot 15. The mounting head 6 can hold and transport the support pins 5 housed in the housing member 16.

[0016] Figure 3 is a schematic perspective view showing the support pin 5 housing member 16 according to the embodiment. As shown in Figures 2 and 3, the housing member 16 holds a plurality of support pins 5. The plurality of support pins 5 are housed in the housing member 16.

[0017] The storage member 16 is mounted on the feeder bank 11. The outer shape of the storage member 16 is the same as at least a portion of the outer shape of the parts feeder 13. In this embodiment, the dimensions of the storage member 16 in the X-axis direction are larger than the dimensions of the parts feeder 13 in the X-axis direction.

[0018] The housing member 16 has a body portion 28 positioned on the -Y side of the feeder bank 11, a handle portion 29 positioned on the upper part of the body portion 28, and a housing portion 30 positioned on the +Z side of the feeder bank 11. The housing portion 30 has housing holes 31 into which the support pins 5 are inserted. Multiple housing holes 31 are provided in both the X-axis direction and the Y-axis direction. The multiple housing holes 31 are provided at equal intervals in the X-axis direction and the Y-axis direction. In this embodiment, 20 housing holes 31 are provided. One support pin 5 is inserted into one housing hole 31. 20 support pins 5 are housed in the housing portion 30.

[0019] The housing hole 31 is provided so as to be recessed downward from the upper surface of the housing portion 30. The support pin 5 is inserted into the housing hole 31 through an opening at the upper end of the housing hole 31. As will be described later, the support pin 5 has a base portion 51, a shaft portion 52 extending upward from the base portion 51, and a support portion 53 connected to the upper end of the shaft portion 52. The lower parts of the base portion 51 and the shaft portion 52 are positioned inside the housing hole 31. The upper parts of the support portion 53 and the shaft portion 52 are positioned outside the housing hole 31.

[0020] A shaft 32 is provided on the upper surface of the housing section 30. The shaft 32 is cylindrical. The shaft 32 protrudes upward from the upper surface of the housing section 30. The shaft 32 is positioned adjacent to a plurality of housing holes 31 (support pins 5). The shaft 32 is positioned on the -Y side of the plurality of housing holes 31 (support pins 5). The shaft 32 is fixed to the housing section 30. A mark 33 is provided on the upper end of the shaft 32.

[0021] Based on the mounting conditions for components C on the substrate P, the position of the component feeder 13 in the feeder bank 11 is determined. The position of the component feeder 13 in the feeder bank 11 is optimized so that components C are efficiently mounted on the substrate P. After the position of the component feeder 13 in the feeder bank 11 is determined, the position of the storage member 16 in the feeder bank 11 is determined. In the example shown in Figure 2, multiple component feeders 13 are arranged adjacent to each other in the X-axis direction. The component feeders 13 are arranged in the range from the area on the -X side to the +X side of the center of the feeder bank 11 in the X-axis direction. The storage member 16 is arranged on the -X side of the center of the feeder bank 11 in the X-axis direction. In the example shown in Figure 2, the storage member 16 is arranged at the -X side end of the feeder bank 11.

[0022] The substrate transport device 4 is supported by the base 2. The substrate transport device 4 transports the substrate P in the X-axis direction. The substrate transport device 4 transports the substrate P from the entrance position Q1 to the mounting processing position Q2 (see Figure 9). The mounting processing position Q2 is the position where the mounting process of mounting components C onto the substrate P is performed. The entrance position Q1 is the position where the loading process of bringing the substrate P into the mounting processing position Q2 is performed. The entrance position Q1 is located on the -X side of the mounting processing position Q2. The substrate transport device 4 transports the substrate P to the +X side.

[0023] Figure 4 is a schematic front view showing the mounting head 6 according to the embodiment. Figure 5 is a schematic top view showing the mounting head 6 according to the embodiment. The mounting head 6 has a nozzle 20 for holding the component C and a placement unit 7 for positioning support pins 5 on the upper surface of the base 2. The mounting head 6 is movable in both the X-axis direction and the Y-axis direction.

[0024] As shown in Figure 1, the mounting head 6 is movably supported on a support member 21. The support member 21 includes a column 21A supported on a base 2 and a beam 21B extending horizontally from the top of the column 21A. The support member 21 includes a mounting head moving device 22 that can move the mounting head 6 in the X-axis direction and the Y-axis direction, respectively. The mounting head moving device 22 includes an X-axis guide mechanism that guides the mounting head 6 in the X-axis direction, a Y-axis guide mechanism that guides the mounting head 6 in the Y-axis direction, an X-axis actuator that generates power to move the mounting head 6 in the X-axis direction, and a Y-axis actuator that generates power to move the mounting head 6 in the Y-axis direction.

[0025] The mounting head 6 mounts the component C held by the nozzle 20 onto the upper surface of the substrate P located at the mounting processing position Q2. The nozzle 20 holds the component C to be mounted on the upper surface of the substrate P in a releaseable manner. The nozzle 20 holds the component C supplied from the component feeder 13. After holding the component C supplied from the component feeder 13, the nozzle 20 transports it to the mounting processing position Q2 and mounts it onto the upper surface of the substrate P. After the component C is mounted on the upper surface of the substrate P, the nozzle 20 releases the component C.

[0026] In this embodiment, the nozzle 20 is a suction nozzle that attracts part C. An opening is provided at the tip of the nozzle 20. The opening of the nozzle 20 is connected to a vacuum system. With the tip of the nozzle 20 in contact with part C, a suction operation is performed from the opening of the nozzle 20, causing part C to be attracted and held at the tip of the nozzle 20. When the suction operation from the opening of the nozzle 20 is released, part C is released from the nozzle 20. The nozzle 20 may also be a chuck nozzle that grips part C.

[0027] Multiple nozzles 20 are provided on the mounting head 6. Multiple nozzles 20 are arranged in the X-axis direction on the mounting head 6. In one embodiment, eight nozzles 20 are provided. The eight nozzles 20 are arranged at intervals in the X-axis direction.

[0028] The mounting head 6 supports the nozzle 20 so as to be movable in the Z-axis direction and the θZ direction. The mounting head 6 has a nozzle moving device 23 that can move the nozzle 20 in the Z-axis direction and the θZ direction, respectively. The nozzle moving device 23 includes a Z-axis actuator that generates power to move the nozzle 20 in the Z-axis direction and a θZ actuator that generates power to rotate the nozzle 20 in the θZ direction. The nozzle 20 is connected to a shaft 24. The nozzle moving device 23 moves the nozzle 20 in the Z-axis direction and the θZ direction by moving the shaft 24 in the Z-axis direction and the θZ direction.

[0029] In this embodiment, the nozzle 20 is movable in four directions: the X-axis direction, the Y-axis direction, the Z-axis direction, and the θZ direction, by the mounting head moving device 22 and the nozzle moving device 23. Alternatively, the nozzle 20 may be movable in six directions: the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction.

[0030] The nozzle 20 holds component C in a releaseable manner. The nozzle 20 holds component C supplied from component feeder 13 at the opening 13A of component feeder 13. After holding component C supplied from component feeder 13, the nozzle 20 transports it to the mounting processing position Q2 and mounts it on the upper surface of substrate P. After component C is mounted on the upper surface of substrate P, the nozzle 20 releases component C.

[0031] The placement unit 7 places the support pins 5 on the upper surface of the base 2. The support pins 5 are placed in at least a portion of the upper surface of the base 2. The support pins 5 are placed in a portion of the upper surface of the base 2 that faces the lower surface of the substrate P, which is placed at the mounting processing position Q2. In the following description, the portion of the upper surface of the base 2 that faces the lower surface of the substrate P, which is placed at the mounting processing position Q2, will be appropriately referred to as the support surface 2S. The support pins 5 are placed on the support surface 2S. The support surface 2S is parallel to the XY plane (a predetermined plane).

[0032] Furthermore, a support table, which is a separate component from the base 2, may be placed on the upper surface of the base 2. The support table may be provided with a support surface 2S for supporting the support pin 5.

[0033] The placement unit 7 places support pins 5 on the support surface 2S. The placement unit 7 includes a holding member 25, a camera 26, a laser sensor 27, a sleeve 34, and an air cylinder 35. In this embodiment, the placement unit 7 includes a first placement unit 7L positioned on the -X side of the nozzle 20 and a second placement unit 7R positioned on the +X side of the nozzle 20. The first placement unit 7L is attached to the first side of the mounting head 6 on the -X side of the nozzle 20. The first side of the mounting head 6 faces the -X side. The second placement unit 7R is attached to the second side of the mounting head 6 on the +X side of the nozzle 20. The second side of the mounting head 6 faces the +X side.

[0034] The retaining member 25 holds the upper end of the support pin 5. The retaining member 25 holds the support pin 5 in a releasable manner. The retaining member 25 includes a first retaining member 25L and a second retaining member 25R. Each of the first retaining member 25L and the second retaining member 25R holds the support pin 5 in a releasable manner. In the X-axis direction, the first retaining member 25L is positioned -X side of the nozzle 20, and the second retaining member 25R is positioned +X side of the nozzle 20. The first retaining member 25L is attached to the first side of the mounting head 6 on the -X side of the nozzle 20. The second retaining member 25R is attached to the second side of the mounting head 6 on the +X side of the nozzle 20. The first placement unit 7L includes the first retaining member 25L. The second placement unit 7R includes the second retaining member 25R.

[0035] Camera 26 images the support pin 5 from above. Camera 26 detects the position of the upper end surface of the support pin 5 in the X-axis and Y-axis directions. Camera 26 includes a first camera 26L and a second camera 26R. In the X-axis direction, the first camera 26L is positioned -X side of the nozzle 20, and the second camera 26R is positioned +X side of the nozzle 20. The first camera 26L is positioned on the +Y side of the first retaining member 25L and is attached to the outer circumferential surface of the first retaining member 25L. The second camera 26R is positioned on the +Y side of the second retaining member 25R and is attached to the outer circumferential surface of the second retaining member 25R. The first placement unit 7L includes the first camera 26L. The second placement unit 7R includes the second camera 26R.

[0036] The laser sensor 27 irradiates the upper end surface of the support pin 5 from above. The laser sensor 27 detects the position of the upper end surface of the support pin 5 in the Z-axis direction. The laser sensor 27 includes a first laser sensor 27L and a second laser sensor 27R. In the X-axis direction, the first laser sensor 27L is positioned -X side of the nozzle 20, and the second laser sensor 27R is positioned +X side of the nozzle 20. The first laser sensor 27L is positioned on the +Y side of the first camera 26L and is attached to the body of the first camera 26L. The second laser sensor 27R is positioned on the +Y side of the second camera 26R and is attached to the body of the second camera 26R. The first placement unit 7L includes the first laser sensor 27L. The second placement unit 7R includes the second laser sensor 27R.

[0037] The sleeve 34 is fixed to the upper surface of the retaining member 25 and to the side surface of the mounting head 6. The sleeve 34 includes a first sleeve 34L and a second sleeve 34R. The first sleeve 34L is fixed to the upper surface of the first retaining member 25L and to the first side surface of the mounting head 6. The second sleeve 34R is fixed to the upper surface of the second retaining member 25R and to the second side surface of the mounting head 6. The first placement unit 7L includes the first sleeve 34L. The second placement unit 7R includes the second sleeve 34R.

[0038] The air cylinder 35 secures the retaining member 25 and the support pin 5 held by the retaining member 25. At least a portion of the air cylinder 35 is positioned above the retaining member 25. The cylinder tube of the air cylinder 35 is fixed to the side of the mounting head 6. The rod of the air cylinder 35 is inserted inside the sleeve 34. The rod of the air cylinder 35 is guided in the sleeve 34 in the Z-axis direction. The lower end of the rod of the air cylinder 35 enters inside the retaining member 25. The air cylinder 35 includes a first air cylinder 35L and a second air cylinder 35R. In the X-axis direction, the first air cylinder 35L is positioned -X side of the nozzle 20, and the second air cylinder 35R is positioned +X side of the nozzle 20. The cylinder tube of the first air cylinder 35L is positioned on the +Z side of the first retaining member 25L and is fixed to the first side of the mounting head 6. The rod of the first air cylinder 35L is inserted inside the first sleeve 34L and guided in the Z-axis direction. The rod of the first air cylinder 35L enters inside the first retaining member 25L so that it is fixed to the first retaining member 25L and the support pin 5 held by the first retaining member 25L. The cylinder tube of the second air cylinder 35R is positioned on the +Z side of the second retaining member 25R and fixed to the second side of the mounting head 6. The rod of the second air cylinder 35R is inserted inside the second sleeve 34R and guided in the Z-axis direction. The rod of the second air cylinder 35R enters inside the second retaining member 25R so that it is fixed to the second retaining member 25R and the support pin 5 held by the second retaining member 25R. The first placement unit 7L includes the first air cylinder 35L. The second placement unit 7R includes the second air cylinder 35R.

[0039] Figure 6 is a side view showing a support pin 5 according to an embodiment. The support pin 5 supports the lower surface of the substrate P on which the component C is mounted. The support pin 5 supports the lower surface of the substrate P from below. The support pin 5 supports the lower surface of the substrate P located at the mounting processing position Q2. By supporting the substrate P from below with the support pin 5, the deflection of the substrate P located at the mounting processing position Q2 is suppressed.

[0040] The support pin 5 is long in the vertical direction. The support pin 5 has a base portion 51, a shaft portion 52 extending upward from the base portion 51, and a support portion 53 connected to the upper end of the shaft portion 52. The base portion 51 is cylindrical. The shaft portion 52 is cylindrical. The diameter of the base portion 51 is greater than the diameter of the shaft portion 52. The length of the shaft portion 52 is longer than the length of the base portion 51.

[0041] The base portion 51 includes the lower end of the support pin 5. The base portion 51 is installed on the support surface 2S of the base 2. The base portion 51 is supported by the base 2. The lower surface of the base portion 51 is in contact with the support surface 2S. A magnet 54 is provided on the base portion 51. The magnet 54 is located inside the base portion 51. The base 2 is made of metal. The magnet 54 generates a magnetic force to fix the support pin 5 and the base 2. The magnetic force generated by the magnet 54 fixes the base portion 51 and the base 2.

[0042] The support portion 53 includes the upper end of the support pin 5. The support portion 53 supports the lower surface of the substrate P on which the component C is mounted. The support portion 53 is in contact with the lower surface of the substrate P. The support portion 53 has an upper end surface that is in contact with the lower surface of the substrate P. Examples of materials for the support portion 53 include metal, synthetic resin, and rubber. Examples of metals include iron, aluminum, and stainless steel.

[0043] Figure 7 shows the holding member 25 and air cylinder 35 according to the embodiment. The structure of the first holding member 25L and the structure of the second holding member 25R are the same. The structure of the first air cylinder 35L and the structure of the second air cylinder 35R are the same.

[0044] The retaining member 25 has a recess 25E into which the support portion 53, which is the upper end of the support pin 5, is inserted. The recess 25E is formed by cutting upward from the lower surface of the retaining member 25. In Figure 7, the lower surface of the retaining member 25, the +X side of the retaining member 25, and the -X side of the retaining member 25 are each cut out. Openings are provided on the lower surface of the retaining member 25, the +X side of the retaining member 25, and the -X side of the retaining member 25. The support portion 53 of the support pin 5 is inserted into the recess 25E from the +X side opening or the -X side opening of the retaining member 25. The support portion 53, which is located inside the recess 25E, is removed from the recess 25E from the +X side opening or the -X side opening of the retaining member 25.

[0045] The recess 25E has a narrow portion 25A, a wide portion 25B, and a guide hole 25C. The narrow portion 25A is provided at the lower end of the recess 25E. The wide portion 25B is provided above the narrow portion 25A. The upper part of the narrow portion 25A and the lower part of the wide portion 25B are connected. The dimension of the narrow portion 25A in the Y-axis direction is smaller than the dimension of the wide portion 25B. That is, the distance between a pair of opposing faces of the narrow portion 25A is shorter than the distance between a pair of opposing faces of the wide portion 25B. An opposing surface 25D is provided at the boundary between the narrow portion 25A and the wide portion 25B. The opposing surface 25D faces upward. The guide hole 25C is formed to penetrate the upper surface of the retaining member 25 and the ceiling surface of the recess 25E.

[0046] The support portion 53 has a lower rod portion 53A extending upward from the upper end of the shaft portion 52, a flange portion 53B positioned above the lower rod portion 53A, and an upper rod portion 53C extending upward from the upper end of the flange portion 53B. The lower rod portion 53A is cylindrical. The thickness of the lower rod portion 53A is thinner than the thickness of the shaft portion 52. The flange portion 53B is substantially disc-shaped. The diameter of the flange portion 53B is larger than the diameter of the lower rod portion 53A. The flange portion 53B has a lower surface 53D that faces the opposing surface 25D. The upper rod portion 53C is cylindrical. The thickness of the upper rod portion 53C is thinner than the thickness of the lower rod portion 53A.

[0047] The support portion 53 of the support pin 5 is inserted into the recess 25E through the +X side opening or the -X side opening of the retaining member 25. With the +X side opening or the -X side opening of the retaining member 25 facing the support portion 53, the retaining member 25 and the support portion 53 move relative to each other in the X-axis direction, thereby inserting the support portion 53 into the recess 25E.

[0048] As shown in Figure 7, the lower rod portion 53A is positioned in the narrow portion 25A. The flange portion 53B and the upper rod portion 53C are positioned in the wide portion 25B. With the support portion 53 inserted into the recess 25E, a gap is formed between the outer surface of the support portion 53 and the inner surface of the recess 25E. A gap is also formed between the lower surface 53D of the flange portion 53B and the opposing surface 25D. Since the internal space of the recess 25E is larger than the external dimensions of the support portion 53, the support portion 53 is smoothly inserted into the recess 25E. The support portion 53 is smoothly removed from the recess 25E.

[0049] The sleeve 34 is fixed to the upper surface of the retaining member 25 and to the side of the mounting head 6. The air cylinder 35 has a cylinder tube 35A and a rod 35B that is movably supported in the cylinder tube 35A. The cylinder tube 35A is fixed to the side of the mounting head 6. The rod 35B protrudes downward from the cylinder tube 35A. The rod 35B is elongated in the Z-axis direction. The rod 35B moves in the Z-axis direction.

[0050] A portion of the rod 35B is inserted inside the sleeve 34. The lower end of the rod 35B is inserted into the guide hole 25C of the retaining member 25. The rod 35B is guided in the Z-axis direction by the sleeve 34 and the guide hole 25C.

[0051] Figure 8 shows a method for fixing the retaining member 25 and the support pin 5 according to the embodiment. As shown in Figure 7, after the support portion 53 of the support pin 5 is inserted into the recess 25E, the air cylinder 35 is operated so that the rod 35B moves downward. When the rod 35B moves downward, the lower end surface of the rod 35B comes into contact with the upper end surface of the upper rod portion 53C. With the lower end surface of the rod 35B and the upper end surface of the upper rod portion 53C in contact, as the rod 35B moves downward, the support portion 53 moves downward relative to the retaining member 25. As the support portion 53 moves downward relative to the retaining member 25, the lower surface 53D of the flange portion 53B comes into contact with the opposing surface 25D of the retaining member 25. As the rod 35B, which has come into contact with the upper end surface of the upper rod portion 53C, moves downward, the lower surface 53D of the flange portion 53B is pressed against the opposing surface 25D of the retaining member 25. As a result, the support pin 5 is fixed to the retaining member 25. After the support pin 5 is fixed to the holding member 25, the mounting head 6 moves, thereby transporting the support pin 5. The support pin 5 is transported while fixed to the holding member 25. The rod 35B of the air cylinder 35 functions as a moving member that moves the support portion 53, which is inserted into the recess 25E, so that the lower surface 53D of the flange portion 53B is pressed against the opposing surface 25D of the holding member 25.

[0052] To release the fixation between the retaining member 25 and the support pin 5, the air cylinder 35 is activated so that the rod 35B moves upward. As the rod 35B moves upward so as to move away from the upper rod portion 53C, a gap is formed between the outer surface of the support portion 53 and the inner surface of the recess 25E, as described with reference to Figure 7, and the fixation between the retaining member 25 and the support pin 5 is released. After the fixation between the retaining member 25 and the support pin 5 is released, the mounting head 6 moves in the X-axis direction so that the support portion 53 is removed from the inside of the recess 25E, thereby releasing the support pin 5 from the retaining member 25.

[0053] Figure 9 is a schematic top view showing a substrate transport device 4 according to an embodiment. As shown in Figures 1 and 9, the substrate transport device 4 is supported by a base 2. The substrate transport device 4 transports the substrate P from the entrance position Q1 to the mounting processing position Q2. The mounting processing position Q2 is the position where mounting processing is performed to mount components C onto the substrate P. The entrance position Q1 is the position where loading processing is performed to bring the substrate P into the mounting processing position Q2. The entrance position Q1 is located on the -X side of the mounting processing position Q2. The substrate transport device 4 transports the substrate P to the +X side.

[0054] The top surface and bottom surface of the substrate P are substantially parallel. The substrate transport device 4 supports the substrate P so that its bottom surface is parallel to the XY plane. The substrate transport device 4 transports the substrate P while maintaining the state in which its bottom surface is parallel to the XY plane. In this embodiment, the dimensions of the substrate P in the X-axis direction are greater than the dimensions of the substrate P in the Y-axis direction. In this embodiment, the outer shape of the substrate P is a rectangle that is elongated in the X-axis direction. The substrate transport device 4 transports the substrate P in the longitudinal direction of the substrate P.

[0055] The substrate transport device 4 includes a pair of guide members 17 that guide the substrate P, and a pair of transport belts 18 that support and transport both ends of the substrate P in the Y-axis direction. The guide members 17 are long in the X-axis direction. One guide member 17 and the other guide member 17 are spaced apart in the Y-axis direction. The guide members 17 guide the substrate P in the X-axis direction. The transport belts 18 are annular. The transport belts 18 are endless belts. One transport belt 18 and the other transport belt 18 are spaced apart in the Y-axis direction. One transport belt 18 supports the +Y side end of the lower surface of the substrate P from below. The other transport belt 18 supports the -Y side end of the lower surface of the substrate P from below. The transport belts 18 are supported by a plurality of pulleys (not shown). At least one of the plurality of pulleys is a drive pulley that is rotated by a transport motor. The drive pulley rotates by the rotational force generated by the transport motor while supporting the transport belts 18. The drive pulley rotates, causing the conveyor belt 18 to rotate. The substrate P is conveyed in the X-axis direction by the rotation of the conveyor belt 18.

[0056] The component mounting apparatus 1 has a substrate holding device 19 that holds a substrate P transported to the mounting processing position Q2. The substrate holding device 19 includes a clamping mechanism that clamps both ends of the substrate P in the Y-axis direction. The substrate holding device 19 fixes the substrate P at the mounting processing position Q2. The support pins 5 support the lower surface of the substrate P located at the mounting processing position Q2. The support pins 5 support the lower surface of the substrate P held by the substrate holding device 19. The support pins 5 support the lower surface of the substrate P to suppress bending of the substrate P held by the substrate holding device 19.

[0057] The mounting head 6 is movable in the XY plane, including above the component feeder 13, above the storage member 16, and above the substrate P located at the mounting processing position Q2. The mounting head 6 mounts the component C held by the nozzle 20 onto the upper surface of the substrate P held by the substrate holding device 19. The mounting head 6 holds the component C supplied from the component feeder 13 with the nozzle 20 and mounts it onto the upper surface of the substrate P.

[0058] [controller] Figure 10 is a block diagram showing the controller 8 of the component mounting apparatus 1 according to an embodiment. The controller 8 outputs control commands for controlling the component mounting apparatus 1. The controller 8 controls the supply of components C by the component supply device 3, the transport of the substrate P by the substrate transport device 4, the holding of the substrate P by the substrate holding device 19, the movement of the mounting head 6 in the X-axis and Y-axis directions, the movement of the nozzle 20 in the Z-axis and θZ directions, the holding and release of components C by the nozzle 20, and the holding and release of support pins 5 by the holding member 25.

[0059] The controller 8 includes a computer. The controller 8 has a processor 8A, main memory 8B, storage 8C, and an input / output interface 8D. The processor 8A includes a CPU (Central Processing Unit) or an MPU (Micro Processing Unit). The main memory 8B includes non-volatile memory such as ROM (Read Only Memory) or volatile memory such as RAM (Random Access Memory). The storage 8C is a tangible, non-temporary storage medium. Examples of storage 8C include magnetic disks, magneto-optical disks, or semiconductor memory. The input / output interface 8D includes input / output circuits. The functions of the controller 8 are stored in the storage 8C as computer programs. The processor 8A reads the computer programs from the storage 8C, loads them into the main memory 8B, and executes processing according to the computer programs. The computer programs may be distributed to the controller 8 via a network.

[0060] The processor 8A is connected to the component supply device 3, the board transport device 4, the board holding device 19, the mounting head 6, the air cylinder 35, the camera 26, and the laser sensor 27 via the input / output interface 8D.

[0061] Storage 8C has a production data storage unit 86. The production data storage unit 86 stores production data indicating the operating conditions of the component mounting device 1. The production data includes data used for the mounting process of component C. The production data includes substrate data relating to the substrate P on which component C is mounted, and target position data indicating the target position of component C to be mounted on the substrate P. The substrate data includes the size, thickness, and flexibility of the substrate P. If component C is already mounted on the lower surface of the substrate P, the substrate data includes the position, number, and size of component C mounted on the lower surface of the substrate P. The production data includes the temporary placement position Pt and target position Pg of the support pins 5 on the support surface 2S. If component C is already mounted on the lower surface of the substrate P, the target position Pg of the support pins 5 used to support the substrate P is predetermined based on the position, number, and size of component C mounted on the lower surface of the substrate P. In addition, the target position Pg of the support pins 5 used to support the substrate P is predetermined based on the size, thickness, and flexibility of the substrate P.

[0062] The processor 8A includes a determination unit 81 and a control unit 82. The determination unit 81 recognizes the position of the upper end surface of the support pin 5 in the X-axis and Y-axis directions based on image data of the support pin 5 captured by the camera 26. The determination unit 81 also recognizes the position of the upper end surface of the support pin 5 in the Z-axis direction based on detection data from a laser sensor 27 that irradiates the support pin 5 with laser light. The control unit 82 outputs control commands for controlling the components of the component mounting device 1.

[0063] [Method for transporting support pins] Figure 11 is a flowchart illustrating a method for transporting support pins 5 according to an embodiment. Figures 12, 13, 14, and 15 are diagrams illustrating a method for transporting support pins 5 according to an embodiment. In this embodiment, the support pins 5 housed in the housing member 16 are transported from the housing member 16 to the base 2 by a holding member 25 of the mounting head 6. The mounting head 6 having the holding member 25 can unload at least one support pin 5 from the housing member 16. The mounting head 6 having the holding member 25 can place the support pin 5 unloaded from the housing member 16 on the support surface 2S of the base 2.

[0064] As shown in Figure 12, if the housing member 16 is positioned -X side of the center of the feeder bank 11 in the X-axis direction, the second holding member 25R of the second placement unit 7R may have difficulty approaching the housing member 16. As shown in Figure 12, for example, if the housing member 16 is positioned at the -X end of the feeder bank 11, even if the mounting head 6 moves to the -X end of the mounting head 6's range of motion, the second holding member 25R may have difficulty approaching the housing member 16. In other words, even when the mounting head 6 is positioned at the -X end of the range of motion in the X-axis direction, if the second holding member 25R is positioned +X side of the housing member 16, the second holding member 25R may not be able to hold the support pin 5 housed in the housing member 16.

[0065] If the second retaining member 25R has difficulty holding the support pin 5 housed in the housing member 16, the control unit 82 controls the mounting head 6 so that the support pin 5 housed in the housing member 16 is held by the first retaining member 25L of the first placement unit 7L, as shown in Figure 12.

[0066] In this embodiment, the control unit 82 moves the mounting head 6 so that the first placement unit 7L is positioned above the housing member 16, and then outputs a control command for the first camera 26L of the first placement unit 7L to capture an image of the mark 33. The determination unit 81 can recognize the approximate position of the housing member 16 based on the image data of the mark 33.

[0067] After the approximate position of the housing member 16 is recognized, the control unit 82 outputs a control command for the first camera 26L to image the support pins 5 housed in the housing member 16. The determination unit 81 can recognize the position of the support pins 5 based on the image data of the support pins 5.

[0068] Based on the position of the support pin 5 recognized by the determination unit 81, the control unit 82 moves the mounting head 6 in the X-axis direction so that one of the support pins 5 housed in the housing member 16 is inserted into the recess 25E from the X-side opening of the first holding member 25L. After the support portion 53 of the support pin 5 is inserted into the recess 25E, the control unit 82 operates the first air cylinder 35L so that the support pin 5 is fixed to the first holding member 25L. As described with reference to Figure 8, with the support portion 53 inserted into the recess 25E, the rod 35B of the first air cylinder 35L moves downward, thereby fixing the support pin 5 to the first holding member 25L (step SA1).

[0069] After the support pin 5 is held by the first holding member 25L, the control unit 82 controls the mounting head 6 so that the support pin 5 held by the first holding member 25L is discharged from the housing member 16 (step SA2).

[0070] The control unit 82 controls the mounting head 6 so that the support pins 5 are transported to a pre-set temporary placement position Pt on the support surface 2S of the base 2. The temporary placement position Pt is set on the upper surface of the base 2 within the movable range of the mounting head 6 in the X-axis and Y-axis directions. The temporary placement position Pt is a position where the first holding member 25L and the second holding member 25R can each be approached as the mounting head 6 moves. The temporary placement position Pt is predetermined. The temporary placement position Pt is stored in advance in the production data storage unit 86. The control unit 82 controls the mounting head 6 so that the support pins 5 are transported from the housing member 16 to the temporary placement position Pt. The temporary placement position Pt may be set, for example, in the center of the support surface 2S.

[0071] After the support pin 5 is transported to the temporary position Pt on the support surface 2S by the first holding member 25L, the control unit 82 controls the air cylinder 35 so that the fixing between the first holding member 25L and the support pin 5 is released. The fixing between the first holding member 25L and the support pin 5 is released as the rod 35B of the air cylinder 35 moves upward. After the fixing between the first holding member 25L and the support pin 5 is released, the control unit 82 moves the mounting head 6 in the X-axis direction so that the support portion 53 of the support pin 5 is removed from the recess 25E of the first holding member 25L. As shown in Figure 13, the support pin 5 is placed in the temporary position Pt as the support portion 53 of the support pin 5 is removed from the recess 25E of the first holding member 25L (step SA3).

[0072] Next, as shown in Figure 14, the control unit 82 controls the mounting head 6 so that the support pins 5 positioned at the temporary placement position Pt are held by the second holding member 25R of the second placement unit 7R.

[0073] In this embodiment, the control unit 82 moves the mounting head 6 so that the second placement unit 7R is positioned above the support pin 5 which is located at the temporary placement position Pt, and then outputs a control command for the second camera 26R of the second placement unit 7R to image the support pin 5. The determination unit 81 can recognize the position of the support pin 5 based on the image data of the support pin 5.

[0074] Based on the position of the support pin 5 recognized by the determination unit 81, the control unit 82 moves the mounting head 6 in the X-axis direction so that the support pin 5, which is positioned at the temporary placement position Pt, is inserted into the recess 25E from the X-side opening of the second holding member 25R. After the support portion 53 of the support pin 5 is inserted into the recess 25E, the control unit 82 operates the second air cylinder 35R so that the support pin 5 is fixed to the second holding member 25R. With the support portion 53 inserted into the recess 25E, the rod 35B of the second air cylinder 35R moves downward, thereby fixing the support pin 5 to the second holding member 25R (step SA4).

[0075] After the support pin 5 is held by the second holding member 25R, the control unit 82 controls the mounting head 6 so that the support pin 5 is ejected from the temporary placement position Pt (step SA5).

[0076] The control unit 82 controls the mounting head 6 so that the support pin 5 is transported to a target position Pg that is set in advance on the support surface 2S of the base 2. The target position Pg is set on the upper surface of the base 2 within the movable range of the mounting head 6 in the X-axis direction and the Y-axis direction. The target position Pg is a position +X side of the temporary placement position Pt. The target position Pg is a position that the second holding member 25R can approach as the mounting head 6 moves. The target position Pg is predetermined. The target position Pg is stored in advance in the production data storage unit 86. The control unit 82 controls the mounting head 6 so that the support pin 5 is transported from the temporary placement position Pt to the target position Pg.

[0077] As shown in Figure 15, if the target position Pg is located +X side of the center of the feeder bank 11 in the X-axis direction, the first retaining member 25L of the first placement unit 7L may have difficulty approaching the target position Pg. As shown in Figure 15, for example, if the target position Pg is set at the +X side end of the support surface 2S, even if the mounting head 6 moves to the +X side end of the mounting head 6's range of motion, the first retaining member 25L may have difficulty approaching the target position Pg. In other words, even when the mounting head 6 is located at the +X side end of the range of motion in the X-axis direction, if the first retaining member 25L is located -X side of the target position Pg, the first retaining member 25L may have difficulty positioning the support pin 5 at the target position Pg.

[0078] If it is difficult for the first holding member 25L to position the support pin 5 at the target position Pg, the control unit 82 controls the mounting head 6 so that the support pin 5 is transported to the target position Pg by the second holding member 25R of the second placement unit 7R, as shown in Figure 15.

[0079] After the support pin 5 is transported to the target position Pg on the support surface 2S by the second holding member 25R, the control unit 82 controls the air cylinder 35 so that the fixing between the second holding member 25R and the support pin 5 is released. The fixing between the second holding member 25R and the support pin 5 is released as the rod 35B of the air cylinder 35 moves upward. After the fixing between the second holding member 25R and the support pin 5 is released, the control unit 82 moves the mounting head 6 in the X-axis direction so that the support portion 53 of the support pin 5 is removed from the recess 25E of the second holding member 25R. As shown in Figure 15, the support pin 5 is positioned at the target position Pg as the support portion 53 of the support pin 5 is removed from the recess 25E of the second holding member 25R (step SA6).

[0080] After the support pin 5 is positioned at the target position Pg by the second holding member 25R, the control unit 82 causes the second camera 26R and the second laser sensor 27R of the second placement unit 7R to detect the coordinates of the upper end surface of the support pin 5 positioned at the target position Pg.

[0081] When multiple support pins 5 are placed on the support surface 2S, the processes from step SA1 to step SA6 described above are repeated. After each of the multiple support pins 5 is placed at the target position Pg, the substrate P is transported to the mounting processing position Q2. The support pins 5 placed at the target position Pg support the lower surface of the substrate P transported to the mounting processing position Q2. The control unit 82 controls the mounting head 6 and nozzle 20 so that components C are mounted on the upper surface of the substrate P supported by the support pins 5.

[0082] The above describes an example in which the support pin 5 is transported from the housing member 16 to a temporary placement position Pt set on the support surface 2S by the first holding member 25L, and then transported from the temporary placement position Pt to a target position Pg set on the support surface 2S by the second holding member 25R. For example, if the housing member 16 is positioned on the + side of the center of the feeder bank 11 in the X-axis direction, and the target position Pg is set at the -X end of the support surface 2S, the control unit 82 controls the mounting head 6 and the placement unit 7 so that the support pin 5 is transported from the housing member 16 to a temporary placement position Pt set on the support surface 2S by the second holding member 25R, and then transported from the temporary placement position Pt to a target position Pg set on the support surface 2S by the first holding member 25L.

[0083] [Repositioning action] As described above, the support pin 5 is positioned at the target position Pg set on the support surface 2S by the holding member 25. In the following description, the operation in which the holding member 25 first positions the support pin 5 at the target position Pg on the support surface 2S will be referred to as the initial placement operation. The holding member 25 unloads the support pin 5 from the housing member 16 and performs the initial placement operation. The holding member 25 performs the initial placement operation to transport the support pin 5 so that it is positioned at the target position Pg set on the support surface 2S.

[0084] Figure 16 is a diagram illustrating the state of the support pin 5 positioned at the target position Pg by the initial placement operation according to the embodiment. As shown in Figure 16, when the support surface 2S of the base 2 is parallel to the horizontal plane, the coordinates of the upper end surface of the support pin 5 coincide with the target coordinates when the support pin 5 is positioned at the target position Pg on the support surface 2S. When the coordinates of the upper end surface of the support pin 5 coincide with the target coordinates, the support pin 5 is positioned on the support surface 2S in a normal state.

[0085] The target coordinates of the upper end surface of the support pin 5 are predetermined. The target coordinates of the upper end surface of the support pin 5 are stored in the production data storage unit 86 in advance.

[0086] If the support surface 2S of the base 2 is non-planar, even if the support pin 5 is positioned at the target position Pg on the support surface 2S, the coordinates of the upper end surface of the support pin 5 may deviate from the target coordinates. If the coordinates of the upper end surface of the support pin 5 and the target coordinates are misaligned, the support pin 5 will be positioned abnormally on the support surface 2S. Being non-planar on the support surface 2S includes being inclined from a horizontal plane and including a curved surface.

[0087] Even if the support surface 2S of the base 2 is parallel to the horizontal plane, if foreign matter is present between the support pin 5 and the support surface 2S, the coordinates of the upper end surface of the support pin 5 may deviate from the target coordinates. If the coordinates of the upper end surface of the support pin 5 and the target coordinates are misaligned, the support pin 5 will be positioned abnormally on the support surface 2S. An example of foreign matter is a component C that has fallen from the substrate P.

[0088] In this embodiment, the camera 26 and the laser sensor 27 detect the coordinates of the upper end surface of the support pin 5 placed on the support surface 2S during the initial placement operation. The camera 26 and the laser sensor 27 function as detection devices that detect the coordinates of the upper end surface of the support pin 5 placed on the support surface 2S. The camera 26 detects the X coordinate, which is the coordinate of the upper end surface of the support pin 5 in the X-axis direction, and the Y coordinate, which is the coordinate of the upper end surface of the support pin 5 in the Y-axis direction. The laser sensor 27 detects the Z coordinate, which is the coordinate of the upper end surface of the support pin 5 in the Z-axis direction.

[0089] The determination unit 81 determines whether the difference between the detected coordinates of the upper end surface of the support pin 5, detected by the camera 26 and the laser sensor 27, and the target coordinates is greater than or equal to a predetermined value. If the determination unit 81 determines that the difference between the detected coordinates and the target coordinates is greater than or equal to the predetermined value, the control unit 82 outputs a control command to cause the holding member 25 to perform a repositioning operation, which involves moving the support pin 5 away from the support surface 2S and then repositioning it on the support surface 2S.

[0090] The camera 26 and laser sensor 27 detect the coordinates of the upper end surface of the support pin 5 after it has been placed on the support surface 2S by the repositioning operation. The determination unit 81 determines whether the difference between the detected coordinates of the upper end surface of the support pin 5 detected by the camera 26 and laser sensor 27 and the target coordinates is greater than or equal to a specified value. After it is determined that the difference between the detected coordinates and the target coordinates has fallen below the specified value due to the repositioning operation, the substrate P is transported to the mounting processing position Q2. After it is determined that the difference between the detected coordinates and the target coordinates has fallen below the specified value due to the repositioning operation, the mounting head 6 mounts the component C onto the upper surface of the substrate P placed at the mounting processing position Q2.

[0091] In this embodiment, the repositioning operation includes a first repositioning operation in which the support pin 5 is repositioned to the target position Pg on the support surface 2S, and a second repositioning operation in which it is positioned at a corrected position Pc calculated based on the difference between the detected coordinates and the target coordinates.

[0092] Figure 17 is a diagram illustrating the first placement operation according to the embodiment. As shown in Figure 17, when the support surface 2S of the base 2 is parallel to the horizontal plane, the coordinates of the upper end surface of the support pin 5, which is placed at the target position Pg by the initial placement operation, may shift from the target coordinates in the X-axis or Y-axis direction, but are unlikely to shift in the Z-axis direction. As described above, the dimensions of the internal space of the recess 25E of the holding member 25 are larger than the external dimensions of the support portion 53. When the support portion 53 is inserted into the recess 25E, a gap is formed between the outer surface of the support portion 53 and the inner surface of the recess 25E. Due to the gap between the outer surface of the support portion 53 and the inner surface of the recess 25E, the relative position between the holding member 25 and the support portion 53 may change after the support portion 53 is held by the holding member 25. Therefore, even if the support pin 5 is positioned on the support surface 2S with the holding member 25 and the target position Pg set on the support surface 2S aligned in the XY plane, fluctuations in the relative position between the holding member 25 and the support part 53 may cause the support pin 5 to be positioned at a location shifted from the target position Pg in the X-axis direction or the Y-axis direction. In this case, the X-coordinate of the upper end surface of the support pin 5 may deviate from the target coordinate. On the other hand, since the support surface 2S is parallel to the horizontal plane, the central axis of the support pin 5 positioned on the support surface 2S is parallel to the Z-axis. Therefore, the Z-coordinate of the upper end surface of the support pin 5 is less likely to deviate from the target coordinate.

[0093] Thus, if the difference between the detected coordinate and the target coordinate in at least one direction in the X-axis and Y-axis directions (the difference between the X-coordinate or Y-coordinate and the target coordinate) is greater than or equal to a specified value, and the difference between the detected coordinate and the target coordinate in the Z-axis direction (the difference between the Z-coordinate and the target coordinate) is less than a specified value, the control unit 82 outputs a control command to perform a first repositioning operation to reposition the support pin 5 to the target position Pg.

[0094] The first repositioning operation includes the operation in which the support pin 5 is placed on the support surface 2S by the initial placement operation, the holding member 25 is separated from the support pin 5, and then the holding member 25 repositions itself to hold the support pin 5. As the holding member 25 repositions itself to hold the support pin 5, the relative positional fluctuation between the holding member 25 and the support part 53 caused by the gap between the outer surface of the support part 53 and the inner surface of the recess 25E may be improved. After the holding member 25 repositions itself to hold the support pin 5, the position of the holding member 25 and the target position Pg are aligned in the XY plane, and the support pin 5 is repositioned to the target position Pg, which may cause the difference between the detected coordinates of the upper end surface of the support pin 5 and the target coordinates (the difference between the X coordinate or Y coordinate and the target coordinates) to fall below a specified value.

[0095] Figure 18 is a diagram illustrating the second placement operation according to the embodiment. As shown in Figure 18, if the support surface 2S is non-planar or if foreign matter is present between the support pin 5 and the support surface 2S, the coordinates of the upper end surface of the support pin 5, which is placed at the target position Pg by the initial placement operation, may be shifted from the target coordinates in the X-axis direction or the Y-axis direction, and may also be shifted in the Z-axis direction. That is, at least the Z coordinate of the upper end surface of the support pin 5 may be shifted from the target coordinates. In addition, the X-coordinates, X-coordinates, and Z-coordinates of the upper end surface of the support pin 5 may each be shifted from the target coordinates.

[0096] Thus, if the difference between the detected coordinate and the target coordinate in at least one of the X-axis, Y-axis, and Z-axis directions (the difference between at least one of the X-axis, Y-axis, and Z-axis coordinates and the target coordinate) is greater than or equal to a specified value, the control unit 82 outputs a control command to perform a second repositioning operation to place the support pin 5 at the corrected position Pc on the support surface 2S.

[0097] When performing the second repositioning operation, the control unit 82 calculates the correction position Pc to be set on the support surface 2S based on the difference between the detected coordinates and the target coordinates. The control unit 82 calculates the correction position Pc for positioning the support pin 5 on the support surface 2S such that the difference between the X coordinate of the upper end of the support pin 5 detected by the camera 26 and laser sensor 27 and the target coordinate is less than a specified value, the difference between the Y coordinate of the upper end of the support pin 5 and the target coordinate is less than a specified value, and the difference between the Z coordinate of the upper end of the support pin 5 and the target coordinate is less than a specified value. The control unit 82 performs the second repositioning operation so that the support pin 5 is positioned at the correction position Pc on the support surface 2S. As a result of the second repositioning operation, the base portion 51 of the support pin 5 is positioned at the correction position Pc, which is shifted from the target position Pg, but the upper end surface of the support pin 5 is positioned at the target coordinates. The support pin 5 is positioned in a normal state.

[0098] In this embodiment, the determination unit 81 determines whether or not to perform a second repositioning operation after performing a first repositioning operation. If the first repositioning operation is performed, the camera 26 and laser sensor 27 detect the coordinates of the upper end surface of the support pin 5 after the first repositioning operation is performed. The determination unit 81 determines whether or not the difference between the detected coordinates and the target coordinates of the upper end surface of the support pin 5 after the first repositioning operation is greater than or equal to a predetermined value. If the determination unit 81 determines that the difference between the detected coordinates and the target coordinates is less than the predetermined value, it is determined that the state of the support pin 5 has improved, and therefore the second repositioning operation is not performed. If the determination unit 81 determines that the difference between the detected coordinates and the target coordinates is greater than or equal to the predetermined value, the control unit 82 calculates a correction position Pc based on the difference between the detected coordinates and the target coordinates. The control unit 82 calculates a correction position Pc such that the second repositioning operation is performed if the difference between the detected coordinates and the target coordinates in at least one direction of the X-axis, Y-axis, and Z-axis is greater than or equal to the predetermined value. The control unit 82 performs a second repositioning operation so that the support pin 5 is positioned at the correction position Pc.

[0099] Figure 19 is a flowchart showing the method for positioning the support pin 5 according to the embodiment. The support pin 5 is positioned at the target position Pg by the initial positioning operation (step SB1). The process of step SB1 is the same as the process of step SA6 described with reference to Figure 11.

[0100] After the initial placement operation positions the support pin 5 at the target position Pg, the camera 26 and laser sensor 27 detect the coordinates of the upper end surface of the support pin 5 (step SB2). The coordinates of the support pin 5 include the X, Y, and Z coordinates.

[0101] The determination unit 81 determines whether the detected coordinates of the upper end surface of the support pin 5, detected by the camera 26 and the laser sensor 27, deviate from the target coordinates. The determination unit 81 determines whether the difference between the detected coordinates of the upper end surface of the support pin 5 and the target coordinates is greater than or equal to a specified value (step SB3).

[0102] The determination unit 81 calculates the X error, which is the difference between the X detection coordinate, which is the detected coordinate in the X-axis direction, and the X target coordinate, which is the target coordinate in the X-axis direction. The determination unit 81 calculates the Y error, which is the difference between the Y detection coordinate, which is the detected coordinate in the Y-axis direction, and the Y target coordinate, which is the target coordinate in the Y-axis direction. The determination unit 81 calculates the Z error, which is the difference between the Z detection coordinate, which is the detected coordinate in the Z-axis direction, and the Z target coordinate, which is the target coordinate in the Z-axis direction.

[0103] As default values, a default value for the X-axis direction, a default value for the Y-axis direction, and a default value for the Z-axis direction are predetermined. The default values ​​for X, Y, and Z may be the same or different. The default values ​​may also be expressed as a specified numerical range. Being greater than or equal to the default value may mean being outside the numerical range, and being less than the default value may mean being within the numerical range. For example, the default value for X (X numerical range) and the default value for Y (Y numerical range) may be between -0.3 mm and +0.3 mm, and the default value for Z (Z numerical range) may be between -0.3 mm and +0.2 mm.

[0104] The determination unit 81 determines whether the X error is greater than or equal to the specified X value. The determination unit 81 determines whether the Y error is greater than or equal to the specified Y value. The determination unit 81 determines whether the Z error is greater than or equal to the specified Z value.

[0105] In step SB3, if it is determined that the difference between the detected coordinates and the target coordinates is less than a specified value, that is, if it is determined that the X error is less than the specified X value, the Y error is less than the specified Y value, and the Z error is less than the specified Z value (step SB3: No), the repositioning operation is not performed. The transport of the next support pin 5 from the housing member 16 begins.

[0106] In step SB3, if it is determined that the difference between the detected coordinates and the target coordinates is greater than or equal to a specified value (step SB3: Yes), the determination unit 81 determines whether the X error is greater than or equal to the specified X value or the Y error is greater than or equal to the specified Y value and the Z error is less than the specified Z value (step SB4).

[0107] In step SB4, if it is determined that the X error is greater than or equal to the specified X value, or the Y error is greater than or equal to the specified Y value, and the Z error is less than the specified Z value (step SB4: Yes), the control unit 82 outputs a control command to perform the first repositioning operation. That is, the control unit 82 outputs a control command to reposition the support pin 5 to the target position Pg (step SB5).

[0108] After the first repositioning operation places the support pin 5 at the target position Pg, the camera 26 and laser sensor 27 detect the coordinates of the upper end surface of the support pin 5 (step SB6).

[0109] The determination unit 81 determines whether the detected coordinates of the upper end surface of the support pin 5, detected by the camera 26 and the laser sensor 27, deviate from the target coordinates. The determination unit 81 determines whether the difference between the detected coordinates of the upper end surface of the support pin 5 and the target coordinates is greater than or equal to a specified value (step SB7).

[0110] In step SB7, if it is determined that the difference between the detected coordinates and the target coordinates is less than a specified value, that is, if it is determined that the condition of the support pin 5 has improved due to the first repositioning operation (step SB7: No), the second repositioning operation is not performed. The transport of the next support pin 5 from the housing member 16 begins.

[0111] In step SB7, if it is determined that the difference between the detected coordinates and the target coordinates is greater than or equal to a specified value (step SB7: Yes), the determination unit 81 determines whether the X error, Y error, and Z error are within a predetermined tolerance range (step SB8).

[0112] The tolerance range for step SB8 is a value greater than the specified value mentioned above. For example, the tolerance range for step SB8 is between -1.0 mm and +1.0 mm.

[0113] In step SB8, if the X error, Y error, and Z error are all within the acceptable range (step SB8: Yes), the control unit 82 calculates the correction position Pc based on the difference between the detected coordinates and the target coordinates, and then outputs a control command to perform the second repositioning operation. The control unit 82 outputs a control command to reposition the support pin 5 to the correction position Pc (step SB9).

[0114] After the support pin 5 is positioned at the correction position Pc by the second repositioning operation, the camera 26 and laser sensor 27 detect the coordinates of the upper end surface of the support pin 5 (step SB10).

[0115] The determination unit 81 determines whether the detected coordinates of the upper end surface of the support pin 5, detected by the camera 26 and the laser sensor 27, deviate from the target coordinates. The determination unit 81 determines whether the difference between the detected coordinates of the upper end surface of the support pin 5 and the target coordinates is greater than or equal to a specified value (step SB10).

[0116] In step SB10, if it is determined that the difference between the detected coordinates and the target coordinates is less than a specified value, that is, if it is determined that the condition of the support pin 5 has improved due to the second repositioning operation (step SB10: No), the transport of the next support pin 5 from the housing member 16 is started.

[0117] In step SB4, if it is determined that the Z error is greater than or equal to the specified Z value (step SB4: No), in step SB8, if at least one of the X error, Y error, and Z error is outside the acceptable range (step SB8: No), and in step SB10, if it is determined that the difference between the detected coordinate and the target coordinate is less than the specified value (step SB10: Yes), the control unit 82 outputs an alarm indicating that the support pin 5 is in an abnormal state (step SB12).

[0118] Figure 20 shows a support pin 5 that supports the lower surface of the substrate P according to the embodiment. Multiple support pins 5 are installed on the support surface 2S of the base 2. The support pins 5 are installed at positions facing the lower surface of the substrate P, which is located at the mounting processing position Q2. The support pins 5 support the lower surface of the substrate P from below in order to suppress the bending of the substrate P. The support pins 5 support the lower surface of the substrate P, which is held by the substrate holding device 19 at the mounting processing position Q2. With the support pins 5 supporting the lower surface of the substrate P, the mounting head 6 mounts components C to the upper surface of the substrate P.

[0119] As shown in Figure 20, there are cases where a component C is already mounted on the underside of the substrate P. When the underside of the substrate P on which component C is already mounted is supported by support pins 5, it is preferable to suppress contact between the support pins 5 and component C.

[0120] In this embodiment, the upper end surface of the support pin 5, which contacts the lower surface of the substrate P, is positioned at a target coordinate. For example, the target coordinate of the upper end surface of the support pin 5 is predetermined based on the position of a component C already mounted on the lower surface of the substrate P. For example, the target coordinate of the upper end surface of the support pin 5 is predetermined so that the component C mounted on the lower surface of the substrate P does not come into contact with the support pin 5. By positioning the upper end surface of the support pin 5 at the target coordinate, the bending of the substrate P is suppressed while preventing contact between the component C mounted on the lower surface of the substrate P and the support pin 5.

[0121] [effect] As described above, according to the embodiment, the mounting head 6 is provided with a first holding member 25L and a second holding member 25R that releasably hold the support pin 5. Even if it is difficult for the second holding member 25R to remove the support pin 5 from the housing member 16, the first holding member 25L can remove the support pin 5 from the housing member 16. Even if it is difficult for the first holding member 25L to position the support pin 5 at the target position Pg, the second holding member 25R can position the support pin 5 at the target position Pg. As a result, the support pin 5 is positioned at the correct position on the support surface 2S.

[0122] The support pins 5 are transported from the housing member 16 to the temporary placement position Pt by the first holding member 25L provided on the mounting head 6. The support pins 5 are transported from the temporary placement position Pt to the target position Pg by the second holding member 25R provided on the mounting head 6. The substrate P is transported to the mounting processing position Q2 so that the lower surface of the substrate P is supported by the support pins 5 positioned at the target position Pg. The component C is mounted on the upper surface of the substrate P positioned at the mounting processing position Q2 by the nozzle 20 provided on the mounting head 6. Since the substrate P is supported by the support pins 5 positioned at the appropriate positions on the support surface 2S, the deflection of the substrate P is suppressed, and the component C is mounted on the upper surface of the substrate P.

[0123] An initial placement operation is performed to position the support pin 5, which has been removed from the housing member 16, at the target position Pg on the support surface 2S. After the initial placement operation is performed, the coordinates of the upper end surface of the support pin 5 are detected. The target coordinates of the upper end surface of the support pin 5 are predetermined. As explained with reference to Figure 20, for example, the target coordinates of the upper end surface of the support pin 5 are predetermined based on the position of a component C already mounted on the lower surface of the substrate P. For example, the target coordinates of the upper end surface of the support pin 5 are predetermined so that the component C mounted on the lower surface of the substrate P does not come into contact with the support pin 5. If it is determined that the difference between the detected coordinates and the target coordinates of the upper end surface of the support pin 5 is greater than or equal to a predetermined value, a repositioning operation of the support pin 5 is performed. As a result, the support pin 5 is positioned in the correct position on the support surface 2S.

[0124] A target position Pg is set on the support surface 2S facing the lower surface of the substrate P, which is placed at the mounting processing position Q2. An initial placement operation is performed to place the support pins 5 that support the lower surface of the substrate P at the target position Pg. The position of the upper end of the support pins 5 placed on the support surface 2S is detected by the initial placement operation. If the difference between the detected coordinates of the upper end of the support pin 5 and the target coordinates is greater than or equal to a predetermined value, a repositioning operation is performed to move the support pins 5 away from the support surface 2S and then place them back on the support surface 2S. After the difference becomes less than the predetermined value by the repositioning operation, component C is mounted on the upper surface of the substrate P, which is placed at the mounting processing position Q2. Since the substrate P is supported by the support pins 5 placed in the correct position on the support surface 2S, the bending of the substrate P is suppressed, and component C is mounted on the upper surface of the substrate P. [Explanation of Symbols]

[0125] 1...Component mounting device, 2...Base, 2S...Support surface, 3...Component supply device, 4...Board transport device, 5...Support pin, 6...Mounting head, 7...Placement unit, 7L...First placement unit, 7R...Second placement unit, 8...Controller, 8A...Processor, 8B...Main memory, 8C...Storage, 8D...Input / output interface, 9...Cart, 10...Reel holding mechanism, 11...Feeder bank, 12...Reel, 13...Component feeder 13A…Opening, 14…Carrier tape, 15…Mounting slot, 16…Housing member, 17…Guide member, 18…Conveyor belt, 19…Substrate holding device, 20…Nozzle, 21…Support member, 21A…Support column, 21B…Beam, 22…Mounting head moving device, 23…Nozzle moving device, 24…Shaft, 25…Holding member, 25L…First holding member, 25R…Second holding member, 25A…Narrow section, 25B…Wide section, 25C…Ga 25D…Opposite surface, 25E…Recess, 26…Camera, 26L…First camera, 26R…Second camera, 27…Laser sensor, 27L…First laser sensor, 27R…Second laser sensor, 28…Body part, 29…Handle part, 30…Housing part, 31…Housing hole, 32…Shaft, 33…Mark, 34…Sleeve, 34L…First sleeve, 34R…Second sleeve, 35…Air cylinder, 35L…First air cylinder, 3 5R...Second air cylinder, 35A...Cylinder tube, 35B...Rod, 51...Base part, 52...Shaft part, 53...Support part, 53A...Lower rod part, 53B...Flange part, 53C...Upper rod part, 53D...Bottom surface, 54...Magnet, 81...Determination part, 82...Control unit, 86...Production data storage unit, C...Component, P...Substrate, Pc...Correction position, Pg...Target position, Pt...Temporary placement position, Q1...Inlet position, Q2...Mounting processing position.

Claims

1. A support surface facing the lower surface of the substrate placed at the mounting processing position, on which support pins supporting the lower surface of the substrate are arranged, The mounting head includes a nozzle for releasably holding a component mounted on the upper surface of the substrate, a first holding member for releasably holding the support pin, and a second holding member for releasably holding the support pin. Component mounting equipment.

2. The mounting head moves in a first axial direction on a predetermined plane parallel to the support surface. In the first axial direction, the first retaining member is positioned on one side of the nozzle, and the second retaining member is positioned on the other side of the nozzle. The component mounting apparatus according to claim 1.

3. The substrate transport device is provided for transporting the substrate to the mounting processing position. The substrate transport device transports the substrate in the first axial direction, The dimensions of the substrate in the first axial direction are greater than the dimensions of the substrate in the second axial direction perpendicular to the first axial direction on the predetermined surface. The component mounting apparatus according to claim 2.

4. The first retaining member is attached to the first side surface of the mounting head on one side of the nozzle, The second retaining member is attached to the second side surface of the mounting head on the other side of the nozzle. The component mounting apparatus according to claim 2.

5. It comprises a housing member for housing the support pin, The support pin is transported by the first holding member from the housing member to a temporary position set on the support surface, and then transported by the second holding member from the temporary position to a target position set on the support surface. The support pins positioned at the target location support the lower surface of the substrate. The component mounting apparatus according to claim 2.

6. The system includes a feeder bank on which a parts feeder for supplying the aforementioned parts is mounted, The aforementioned housing member is attached to the feeder bank. The component mounting apparatus according to claim 5.

7. Multiple component feeders are arranged in the first axial direction, The housing member is positioned to one side of the center of the feeder bank in the first axial direction. The component mounting apparatus according to claim 6.

8. When the mounting head is positioned at one end of the first axial range of motion, the second holding member is positioned on the other side of the housing member. When the mounting head is positioned at the other end of the first axial range of motion, the first holding member is positioned to one side of the target position. The component mounting apparatus according to claim 7.

9. Each of the first retaining member and the second retaining member is, A recess into which the upper end of the support pin is inserted, The recess is provided and has an opposing surface that faces the lower surface of the flange portion provided at the upper end, The system includes a movable member that moves the upper end portion, which is inserted into the recess, so that the lower surface of the flange portion is pressed against the opposing surface. The component mounting apparatus according to claim 1.

10. Setting a temporary placement position and a target position on the support surface opposite to the lower surface of the substrate to be placed at the mounting processing location, The support pin is transported from the housing member to the temporary placement position by a first holding member provided on the mounting head, The support pin is transported from the temporary position to the target position by a second holding member provided on the mounting head. The substrate is transported to the mounting processing position such that the lower surface of the substrate is supported by the support pins positioned at the target position, This includes mounting a component onto the upper surface of the substrate positioned at the mounting processing location using a nozzle provided on the mounting head. Component mounting method.

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