Load lock apparatus and substrate processing apparatus equipped with microwave heaters for desorption of moisture

Abstract

To provide a load lock device that improves the moisture desorption efficiency in semiconductor manufacturing tools. [Solution] In a substrate processing apparatus 20 equipped with a load lock device, the load lock device 1 comprises a load lock chamber body 2 that defines a load lock chamber 3, a substrate holder 8 that holds one or more substrates 9 in the load lock chamber, and a microwave heater 10 for desorbing moisture adsorbed from one or more substrates.

Description

Technical Field

[0001] The present disclosure generally relates to the fields of microfabrication and nanofabrication. In particular, the present disclosure relates to the field of semiconductor manufacturing technologies, such as the manufacture of integrated circuits.

Background Art

[0002] There is a continuing interest in improving the efficiency and quality of thin film deposition in semiconductor manufacturing. It is generally recognized that moisture adsorption on incoming wafers can significantly affect the film quality of process tools. Moisture on the wafer surface can, for example, interfere with good adhesion during film formation and increase the risk of oxidation and inadequate resistivity performance on metal films. A monolayer of moisture can easily accumulate on the wafer surface during transport from a Front Opening Unified Pod (FOUP) to a load lock vacuum chamber as the wafer passes through the air flow environment within an Equipment Front End Module (EFEM) space.

[0003] However, conventional solutions for wafer degassing, such as conductive, convection, and infrared radiation methods, are time-consuming and otherwise occupy valuable space that could be used for wafer processing. Despite the importance of efficient moisture desorption, limited innovation has been focused on addressing these issues. In view of the above, it may be desirable to develop new solutions related to improving moisture desorption efficiency in semiconductor manufacturing tools.

[0004] Any discussion, including discussion of problems and solutions described in this section, is included in this disclosure only for the purpose of providing context for the present disclosure. Such discussion should not be construed as an admission that any or all of the information was known at the time the invention was made or otherwise constitutes prior art.

Summary of the Invention

Means for Solving the Problems

[0005] This summary of the invention is provided to present a simplified selection of concepts. These concepts are described in more detail below in the detailed description of the exemplary embodiments of the present disclosure. This summary is not intended to identify any major or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0006] According to a first embodiment, a load lock device is provided. The load lock device comprises a load lock chamber body having a first surface configured to define a load lock chamber and to connect to a transport module, and a second surface configured to connect to a vacuum chamber. The load lock device further comprises a substrate holder for holding one or more substrates within the load lock chamber, and a microwave heater for desorbing adsorbed moisture from one or more substrates.

[0007] According to a second embodiment, a substrate processing apparatus is provided that includes a load lock device according to the first embodiment.

[0008] In some embodiments, the load lock chamber body includes a viewport, and the microwave heater is configured to transmit microwave radiation into the load lock chamber through the viewport.

[0009] In some embodiments, the microwave heater includes a magnetron microwave source.

[0010] In some embodiments, the microwave heater is equipped with a microwave mode stirrer.

[0011] In some embodiments, the microwave heater is configured to generate microwave radiation within a wavelength range of 1 cm to 30 cm, 3 cm to 25 cm, 5 cm to 20 cm, 10 cm to 15 cm, or 11 cm to 13 cm.

[0012] In some embodiments, the microwave heater is configured to generate microwave radiation with a microwave output of 25W or more, or 50W or more, or 100W or more, or 200W or more, or 500W or more, or 1kW or more, and / or 2kW or less, or 3kW or less, or 4kW or less, or 5kW or less, or 10kW or less.

[0013] In some embodiments, the load lock chamber body is provided with one or more exhaust ports for exhausting the load lock chamber.

[0014] In some embodiments, the load lock chamber body further defines a second load lock chamber for substrate transfer between the transport module and the vacuum chamber.

[0015] In some embodiments, the substrate holder is configured to hold one or more substrates in a stacked arrangement at multiple substrate positions and to maintain a minimum distance between adjacent substrate positions at the multiple substrate positions of at least 1 cm, or at least 2 cm, or at least 3 cm, or at least 4 cm, or at least 5 cm, or at least 6 cm, or at least 7 cm, or at least 8 cm, or at least 9 cm, or at least 10 cm, or at least 11 cm, or at least 12 cm.

[0016] In some embodiments, the load lock device is configured to accommodate up to two substrates within the load lock chamber.

[0017] In some embodiments, the load lock device is configured to accommodate up to one substrate within the load lock chamber.

[0018] In some embodiments, the substrate processing apparatus includes a transport module connected to a load lock device.

[0019] In some embodiments, the substrate processing apparatus includes a vacuum chamber connected to a load lock device.

[0020] In some embodiments, the substrate processing apparatus includes a vacuum pump fluidly connected to the load lock chamber to evacuate the load lock chamber.

[0021] In some embodiments, the substrate processing apparatus includes one or more deposition chambers connected to the vacuum chamber.

[0022] A more complete understanding of the embodiments of the present disclosure may be obtained by reference to the detailed description and the claims when considered in connection with the following exemplary drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] [Figure 1] FIG. 1 is a diagram illustrating a substrate processing apparatus and a load lock apparatus. [Figure 2] FIG. 2 is a diagram showing another load lock apparatus. DETAILED DESCRIPTION OF THE INVENTION

[0024] It will be understood that the elements in the figures are illustrated for simplicity and clarity and are not necessarily drawn to scale. For example, some dimensions of the elements in the figures may be exaggerated relative to other elements to assist in improving the understanding of the illustrated embodiments of the present disclosure.

[0025] The examples presented herein are not meant to be the actual form of any particular material, structure, or device, but are merely idealized representations used to describe embodiments of the present disclosure.

[0026] For clarity and simplicity, consistent reference numbers may be used throughout the figures for corresponding, similar, and / or identical elements.

[0027] Although certain embodiments and examples are disclosed below, it will be understood by those skilled in the art that the present invention extends beyond the specifically disclosed embodiments and / or uses of the present invention, as well as their obvious modifications and equivalents. Accordingly, it is intended that the scope of the disclosed invention should not be limited by the specific disclosed embodiments described below.

[0028] The specific implementations illustrated and described are examples of the present invention and its best mode, and are not intended to limit the scope of aspects and implementations at all. In fact, for the sake of brevity, conventional manufacturing, related, preparation, and other functional aspects of the system may not be described in detail or may be omitted entirely. Additionally, the connecting lines shown in the various figures are intended to represent examples of the functional relationships and / or physical connections between the various elements. Many alternative or additional functional relationships, or physical connections, may exist in the actual system and / or may not exist in some embodiments.

[0029] The configurations and / or approaches described herein are essentially examples, and it should be understood that these specific embodiments or examples should not be considered in a limiting sense because numerous variations are possible. The specific routines or methods described herein may represent one or more of any number of processing strategies. Accordingly, the various operations illustrated may be performed in the order illustrated, in other orders, or may be omitted in some cases.

[0030] The subject matter of this disclosure includes all novel and non-obvious combinations and sub-combinations of the various processes, systems, and configurations, as well as other features, functions, operations, and / or characteristics disclosed herein, and any and all equivalents thereof.

[0031] Throughout this specification, “chamber” may refer to an enclosed space suitable for, or configured to, contain and / or process one or more substrates. Additionally or alternatively, a chamber may refer to an enclosed space suitable for, or configured to contain and / or process one or more substrates under controlled conditions. Additionally or alternatively, a chamber may refer to an enclosed space suitable for, or configured to be isolated from the external environment in order to maintain certain environmental conditions such as pressure, temperature, and / or gas composition. In some embodiments, a chamber may refer to an internal cavity defined by an outer wall and / or one or more doors or ports to allow substrates to enter and / or exit the cavity.

[0032] In this disclosure, “load lock chamber” may refer to a chamber suitable for, or configured for, transporting a substrate between different environments, for example, between a high vacuum environment and an atmospheric pressure or low vacuum environment. Additionally or alternatively, a load lock chamber may refer to a chamber suitable for, or configured for, loading and / or unloading a substrate into and / or out of a processing chamber. Additionally or alternatively, a load lock chamber may refer to a chamber suitable for, or configured for, accommodating pressure differences between different environments during substrate transport. Additionally or alternatively, a load lock chamber may refer to a chamber suitable for, or configured for, accommodating its interior from the external environment in order to maintain specific environmental conditions, such as pressure, temperature, and / or gas composition, during substrate transport.

[0033] In this specification, “load lock chamber body” may refer to a structure that forms the outer wall of a load lock chamber. Additionally or alternatively, the load lock chamber body may refer to a structure that provides mechanical support and / or fluid isolation to the load lock chamber. In some embodiments, the load lock chamber body may comprise one or more materials suitable for maintaining the structural integrity and / or environmental isolation of the load lock chamber. Such materials may include, but are not limited to, metals such as stainless steel or aluminum, and quartz. In some embodiments, the load lock chamber body may comprise one or more ports or openings for installing pumps, valves, sensors, and / or other components necessary or beneficial for the operation of the load lock chamber. In some embodiments, the load lock chamber body may be designed to withstand a variety of environmental conditions, such as vacuum, high temperature, and / or exposure to reactive gases. In some embodiments, the load lock chamber body may be integrated with one or more structural supports, such as a frame or bracket, to provide additional mechanical stability.

[0034] Throughout this disclosure, “vacuum” may refer to an environment having a pressure significantly lower than atmospheric pressure. Additionally or alternatively, vacuum may refer to an environment exhibiting low vacuum conditions (e.g., 100 kPa or less and greater than 100 Pa), medium vacuum conditions (e.g., 100 Pa or less and greater than 0.1 Pa), high vacuum conditions (e.g., 0.1 kPa or less and greater than 1 μPa), ultra-high vacuum conditions (e.g., 1 μPa or less and greater than 1 nPa), or extremely high vacuum conditions (e.g., 1 nPa or less).

[0035] In this specification, the term “module” may refer to a self-contained unit or component that performs a specific function within a larger system. Additionally or alternatively, a module may refer to a subsystem that can be integrated with other subsystems to form a complete system. Furthermore, a “transport module” may refer to a module suitable for, or configured to transport, a substrate between separate locations within a substrate processing environment. Additionally or alternatively, a transport module may refer to a module suitable for, or configured to maintain, a controlled environment to prevent contamination of the substrate during transport. In some embodiments, a transport module may include fluid circulation means and / or filtration means to ensure the cleanliness of the environment inside the transport module. In some embodiments, a transport module may include one or more fluid circulation systems suitable for, or configured to circulate, clean air or other gases within the transport module to prevent contamination of the substrate. In some embodiments, a transport module may include one or more filtration systems suitable for, or configured to remove, particles, contaminants, and / or other impurities from the environment inside the transport module. In some embodiments, the transport module may include one or more robotic arms or other mechanical means suitable for, or configured to, move a substrate between different locations within the transport module. In some embodiments, the transport module may be implemented as an Equipment Front End Module (EFEM).

[0036] Throughout this specification, “vacuum chamber” may refer to a chamber suitable for, or configured for, containing, conveying, and / or processing one or more substrates under vacuum. Additionally or alternatively, “vacuum chamber” may refer to a chamber suitable for, or configured for, carrying, one or more processes that require a vacuum environment, such as deposition, etching, and / or other semiconductor manufacturing processes. In some embodiments, the vacuum chamber may be implemented as a wafer conveying chamber. In some embodiments, the vacuum chamber may include a substrate conveying robot that enables conveying of substrates between different components, such as a load locking device and one or more substrate processing chambers. In some embodiments, the vacuum chamber may be fluidly coupled to one or more pumps to evacuate the vacuum chamber to achieve and maintain a vacuum environment. In some embodiments, the vacuum chamber may include one or more valves suitable for, or configured for, controlling the flow of gas into and / or out of the vacuum chamber. In some embodiments, the vacuum chamber may include one or more sensors, such as one or more pressure sensors and / or one or more temperature sensors, to monitor and control environmental conditions within the vacuum chamber.

[0037] In this disclosure, “Substrate” may mean any one or more substrate materials that can be used to form a device, circuit, or film, or any one or more substrate materials on which a device, circuit, or film can be formed. Additionally or alternatively, the Substrate may mean any material that provides a basis for the manufacture of a microelectronic device, optoelectronic device, or optical element. Additionally or alternatively, the Substrate may mean an object comprising a bulk material such as silicon (e.g., single-crystal silicon), another Group IV material such as germanium, or a compound semiconductor material such as GaAs, and one or more optional layers that cover or lie beneath the bulk material and / or various structures such as recesses, vias, lines, etc., formed in or on the layers of the Substrate. In some embodiments, the Substrate may include a semiconductor wafer. In some embodiments, the substrate may have a layered structure including, but not limited to, a silicon-on-insulator (SOI) structure, where a thin layer of silicon is separated from the bulk silicon layer by an insulating layer, and an epitaxial structure in which one or more epitaxial layers are grown on the bulk material layer.

[0038] Throughout this specification, “substrate holder” may refer to a device or structure suitable for, or configured for, holding one or more substrates within a load lock chamber. Additionally or alternatively, a substrate holder may refer to a device or structure suitable for, or configured for, holding one or more substrates in a particular arrangement within a load lock chamber, for example, to facilitate the transport and / or processing of the substrates. In some embodiments, a substrate holder may be configured to hold a single substrate, while in other embodiments, a substrate holder may be configured to hold multiple substrates, e.g., two, three, four, five, and so on. In other embodiments, a substrate holder may be configured to hold multiple substrates in a stacked arrangement at multiple substrate positions. In some embodiments, the substrate holder may be configured to hold the substrates in a vertically stacked arrangement, with each substrate extending laterally and facing vertically at the operating position of the load lock device; or to hold the substrates in a laterally stacked arrangement, with each substrate extending vertically and facing laterally at the operating position of the load lock device; or to hold the substrates in an inclined stacked arrangement, with each substrate positioned at an angle to the vertical. In some embodiments, the substrate holder may include one or more mechanical components, such as clamps, brackets, or shelves, for fixing the substrates in place. In some embodiments, the substrate holder may include one or more alignment features, such as grooves or notches, to ensure the precise positioning of the substrates. In some embodiments, automatic substrate transfer to and from the substrate holder can be achieved using one or more robotic arms or other mechanical substrate transfer means.

[0039] In this disclosure, “heater” may mean a device or apparatus suitable for or configured to generate heat or thermal energy. Furthermore, “microwave heater” may mean a heater suitable for or configured to heat and / or process a material by generating and transmitting microwave radiation. Additionally or alternatively, a microwave heater may mean a heater that generates heat through the use of microwave radiation. Additionally or alternatively, a microwave heater may mean a heater that delivers microwave radiation to a particular area or chamber to achieve a heating effect. Additionally or alternatively, a microwave heater may mean a heater suitable for or configured to generate microwave radiation to desorb adsorbed moisture from one or more substrates. In some embodiments, a microwave heater may include a microwave source such as a magnetron microwave source or a solid-state microwave source. In some embodiments, a microwave heater may include a microwave mode stirrer. In some embodiments, a microwave heater may include a microwave waveguide. In some embodiments, a microwave heater may be configured to generate microwave radiation within one or more specific wavelength or frequency ranges. In some embodiments, the microwave heater may be configured to generate microwave radiation within a wavelength range of 1 cm to 30 cm and / or a frequency range of 1 GHz to 30 GHz. In some embodiments, the microwave heater may be configured to generate microwave radiation at a specific power level. In some embodiments, the microwave heater may be configured to generate microwave radiation at an output of 25 W or more and / or 10 kW or less. In some embodiments, the microwave heater may operate with a vacuum pump to evacuate the load lock chamber while generating microwave radiation to desorb adsorbed moisture from one or more substrates. Additionally or alternatively, the microwave heater may be used with other components, such as a fluid-sealed window made of a microwave-permeable material, to ensure efficient transmission of microwave radiation into the load lock chamber.

[0040] In this specification, “chemical vapor deposition chamber” or “CVD chamber” may refer to a chamber in which one or more gaseous compounds decompose and deposit a layer on a substrate. Furthermore, “cyclic chemical vapor deposition chamber” or “cyclic CVD chamber” may refer to a CVD chamber in which precursors and / or reactants and / or active species are sequentially and / or periodically supplied to deposit a layer on the substrate.

[0041] Throughout this specification, “atomic layer deposition chamber” or “ALD chamber” may refer to a cyclic CVD chamber configured to be purged between the delivery of precursors and / or reactants and / or active species. Typically, purging can be achieved by flowing an inert gas through the ALD chamber or its process station. Additionally or alternatively, an atomic layer deposition chamber may refer to a cyclic CVD chamber suitable for or configured to deposit conformal layers on a substrate, for example, layers having a step coverage (SC) of at least 95%, 99%, or about 100% for features having an aspect ratio (AR) of 3:1, 5:1, or 10:1.

[0042] Furthermore, “temporal atomic layer process” or “temporal ALD process” may refer to an ALD process in which the process of purging the process station includes a temporal purging step while the supply of precursors and / or reactants and / or active species is discontinued. Additionally or alternatively, “temporal atomic layer process” or “temporal ALD process” may refer to an ALD process in which the substrate on which the layer is deposited is held immobile during deposition.

[0043] In some embodiments, the methods, devices, and apparatus described herein may be useful in the fields of microfabrication and nanofabrication. In some embodiments, the methods, devices, and apparatus described herein may be useful in the fields of micro-electromechanical systems, microsystems, photonics, solar power generation, display devices, and / or semiconductor manufacturing technologies. In some embodiments, the methods, devices, and apparatus described herein may be beneficial for handling and / or processing substrates, such as semiconductor wafers or solid-state devices, during manufacturing. In some embodiments, they may be applied to substrate processing apparatuses comprising multiple workstations. In some embodiments, they may contribute to sustainable manufacturing practices in semiconductor production. In some embodiments, the methods, devices, and apparatus described herein may be useful for increasing throughput and / or reducing electricity consumption and / or reducing process gas consumption of modular substrate processing apparatuses and / or improving the quality of films manufactured using substrate processing apparatuses.

[0044] Figure 1 schematically illustrates a substrate processing apparatus 20 equipped with a load lock device 1 according to one embodiment. Other embodiments may be identical or similar to the embodiment in Figure 1.

[0045] The load lock device 1 in the embodiment of Figure 1 comprises a load lock chamber body 2 defining a load lock chamber 3. The substrate processing apparatus 20 in the embodiment of Figure 1 comprises a transport module 22 and a vacuum chamber 23, and the load lock chamber body 2 comprises a first surface 4 configured to connect to the transport module 22 and a second surface 5 configured to connect to the vacuum chamber 23. The load lock device 1 further comprises a substrate holder 8 for holding one or more substrates 9 in the load lock chamber 3 and a microwave heater 10 for desorbing adsorbed moisture from one or more substrates 9. In some embodiments, such load lock devices can increase throughput and / or reduce electricity consumption and / or reduce process gas consumption of the substrate processing apparatus.

[0046] Even if not explicitly shown in Figure 1, the substrate processing apparatus may generally include any suitable number of load lock devices according to the first embodiment, e.g., one or more load lock devices, two or more load lock devices, three or more load lock devices, etc. Any or all of these load lock devices may include any suitable number of microwave heaters, and any two individual microwave heaters of a load lock device may be associated with separate load lock chambers or the same load lock chamber.

[0047] In the embodiment shown in Figure 1, the load lock chamber body 2 includes a viewport 6, and the microwave heater 10 is configured to transmit microwave radiation into the load lock chamber 3 via the viewport 6. In some embodiments, a microwave heater configured to transmit microwave radiation into the load lock chamber via the viewport can reduce modifications to existing load lock chamber designs and facilitate the desorption of adsorbed moisture from one or more substrates within the load lock chamber, thereby facilitating the retrofitting of a load lock device to existing substrate processing equipment according to this specification. Additionally or alternatively, in some embodiments, a microwave heater configured to transmit microwave radiation into the load lock chamber via the viewport can facilitate the maintenance of cleanliness in the load lock chamber. In other embodiments, the microwave heater may or may not be configured to transmit microwave radiation into the load lock chamber via the viewport.

[0048] The viewport 6 in the embodiment of Figure 1 includes a fluid-seal window 7 formed of a microwave-permeable or microwave-transparent material such as fused silica. In other embodiments, where the load lock chamber body includes a viewport and a microwave heater is configured to transmit microwave radiation into the load lock chamber through the viewport, the microwave radiation can be transmitted in any suitable manner. In some of these embodiments, the viewport may include a fluid-seal window formed of a microwave-permeable or microwave-transparent material such as glass material such as borosilicate glass, quartz glass, or fused silica glass.

[0049] In the embodiment shown in Figure 1, the viewport 6 is positioned above the load lock chamber 3 when the load lock device 1 is operating. In some embodiments, where the load lock chamber body includes a viewport and a microwave heater is configured to transmit microwave radiation into the load lock chamber through the viewport, the viewport positioned above the load lock chamber at the operating position of the load lock device may allow for a more compact load lock device and / or improved uniformity of the desorption of adsorbed moisture from one or more substrates. In other embodiments, where the load lock chamber body includes a viewport(s) and a microwave heater is configured to transmit microwave radiation into the load lock chamber through the viewport(s), the viewport(s) may be positioned at the operating position of the load lock device in any suitable manner relative to the load lock chamber, for example, adjacent to, above, below, and / or laterally to the load lock chamber.

[0050] In the embodiment shown in Figure 1, the microwave heater 10 comprises a magnetron microwave source 12. In some embodiments, a microwave heater including a magnetron microwave source can facilitate the formation of microwave radiation of a suitable wavelength for desorbing adsorbed moisture at a higher output. Additionally or alternatively, in some embodiments, a microwave heater including a magnetron microwave source can facilitate the formation of microwave radiation of a suitable wavelength for desorbing adsorbed moisture while reducing the footprint of the substrate processing apparatus. In other embodiments, the microwave heater may or may not include a magnetron microwave source. In other embodiments, the microwave heater may include, in addition to or as an alternative to, a magnetron microwave source, any suitable type of microwave source, such as a solid-state microwave source.

[0051] In the embodiment shown in Figure 1, the microwave heater 10 includes a microwave mode agitator 13. In some embodiments, a microwave heater with a microwave mode agitator can facilitate the more uniform and / or faster desorption of adsorbed moisture from one or more substrates. In other embodiments, the microwave heater may or may not include a microwave mode agitator.

[0052] In the embodiment shown in Figure 1, the microwave heater 10 includes a microwave waveguide 14 for guiding microwave radiation from a magnetron microwave source 12 into the load lock chamber 3 via a viewport 6. In other embodiments in which the microwave heater includes a microwave source, for example, a magnetron microwave source, the microwave radiation may be guided from the microwave source into the load lock chamber in any suitable manner, for example, via a viewport using a microwave waveguide.

[0053] The microwave heater 10 in the embodiment of Figure 1 may be configured to generate microwave radiation having a wavelength of at least about 12 cm and / or a frequency of about 2.45 GHz. In other embodiments, the microwave heater may be configured to generate microwave radiation having any suitable wavelength and / or frequency. For example, in some embodiments, the microwave heater may be configured to generate microwave radiation in the wavelength range of 1 cm to 30 cm, or 3 cm to 25 cm, or 5 cm to 20 cm, or 10 cm to 15 cm, or 11 cm to 13 cm. In some embodiments, the microwave heater may be configured to generate microwave radiation in the frequency range of 1 GHz to 30 GHz, or 1.2 GHz to 20 GHz, or 1.5 GHz to 10 GHz, or 1.7 GHz to 5 GHz, or 2 GHz to 3 GHz. In some embodiments, a microwave heater configured to generate microwave radiation within one or more of these wavelength and / or frequency ranges may facilitate more efficient desorption of adsorbed moisture from one or more substrates.

[0054] The microwave heater 10 in the embodiment of Figure 1 may be configured to generate microwave radiation at a microwave output of approximately 1000 W. In other embodiments, the microwave heater may be configured to generate microwave radiation at any preferred output(s). For example, in some embodiments, the microwave heater may be configured to generate microwave radiation at a microwave output of 25 W or more, or 50 W or more, or 100 W or more, or 200 W or more, or 500 W or more, or 1 kW or more, and / or 2 kW or less, or 3 kW or less, or 4 kW or less, or 5 kW or less, or 10 kW or less. In some embodiments, a microwave heater configured to generate microwave radiation at one or more of these microwave output ranges may enable efficient desorption of adsorbed moisture from one or more substrates without inadvertently damaging one or more substrates. Additionally or alternatively, a microwave heater configured to generate microwave radiation at one or more of these microwave output ranges may enable desorption of adsorbed moisture from one or more substrates using a simpler power supply.

[0055] In the embodiment shown in Figure 1, the load lock chamber body 2 includes one or more exhaust ports 16 for exhausting the load lock chamber 3. In some embodiments, the load lock device includes a microwave heater for desorbing adsorbed moisture from one or more substrates placed in the load lock chamber defined by the load lock chamber body. The load lock chamber body further includes one or more exhaust ports for exhausting the load lock chamber, which can enable simultaneous desorption of adsorbed moisture from one or more substrates and exhaust of the load lock chamber, thereby increasing the throughput of the substrate processing device equipped with such a load lock device. In other embodiments, the load lock chamber body may or may not include one or more exhaust ports for exhausting the load lock chamber. For example, in some embodiments, the transport module and / or vacuum chamber may be configured to be pressurized and / or evacuated to facilitate the transport of substrates using the load lock device.

[0056] In the embodiment shown in Figure 1, the load lock chamber body 2 further defines a second load lock chamber 19 for substrate transport between the transport module 22 and the vacuum chamber 23. The substrate processing apparatus 20 is configured to utilize the load lock chamber 3 for substrate transport from the transport module 22 to the vacuum chamber 23 and the second load lock chamber 19 for substrate transport from the vacuum chamber 23 to the transport module 22. In other embodiments, the load lock chamber body can define any appropriate number of load lock chambers, for example, one or more load lock chambers, two or more load lock chambers, three or more load lock chambers, and so on. In some embodiments, where the load lock device includes a microwave heater for desorbing moisture adsorbed from one or more substrates held within the load lock chamber, the load lock chamber body may define a load lock chamber, a second load lock chamber positioned below the load lock chamber in the operating position of the load lock device, a third load lock chamber positioned laterally adjacent to the load lock chamber in the operating position, and a fourth load lock chamber positioned laterally adjacent to the second load lock chamber and below the third load lock chamber in the operating position. In some such embodiments, the load lock chamber, the second load lock chamber, the third load lock chamber, and the fourth load lock chamber may be arranged in a rectangular configuration when viewed from the opposite side of the first surface and / or the opposite side of the second surface. Furthermore, in some such embodiments, the load lock device may include a second microwave heater for desorbing moisture adsorbed from the substrate(s) held within the third load lock chamber.

[0057] The load lock device 1 in the embodiment of Figure 1 is configured to accommodate up to one substrate in the load lock chamber 3. In the embodiment of Figure 1, one or more substrates 9 held in the substrate holder 8 consist of up to one substrate, and the load lock device 1 includes the substrate holder 8 when there is no other substrate holding means for holding further substrates in the load lock chamber 3. In some embodiments, a load lock device configured to accommodate up to one substrate in the load lock chamber may allow for more rapid and / or more uniform desorption of adsorbed moisture from up to one substrate, which in turn may increase the throughput of a substrate processing apparatus equipped with such a load lock device. In other embodiments, the load lock device may or may not be configured to accommodate up to one substrate in the load lock chamber.

[0058] In the embodiment shown in Figure 1, the substrate processing apparatus 20 includes one or more load ports 26 configured to connect to one or more substrate carriers 27, such as Front Opening Unified Pods (FOUPs) or similar. The one or more load ports 26 are connected to the transport module 22 for transporting substrates between the one or more substrate carriers 27 and the transport module 22. In other embodiments, the substrate processing apparatus may or may not include such one or more load ports.

[0059] The transport module 22 in the embodiment of Figure 1 may be implemented as an Equipment Front End Module (EFEM). The transport module 22 is configured to maintain a clean environment inside the transport module 22 in order to avoid contamination of the substrate during transport of the substrate through the transport module 22. Although not shown in Figure 1, the transport module 22 may be equipped with fluid circulation means and / or filtration means to ensure the cleanliness of the environment inside the transport module 22. In other embodiments, the transport module may be implemented in any suitable manner.

[0060] The transport module 22 in the embodiment of Figure 1 includes one or more substrate cooling stages 29 to facilitate substrate cooling after substrate processing, and a front-end substrate transport robot 28 that enables substrate transport between one or more load ports 26, one or more substrate cooling stages 29, and load locking device 1. In other embodiments, the transport module may or may not include one or more substrate cooling stages. In such other embodiments, the transport module may include one or more front-end substrate transport robots or similar to enable substrate transport between any suitable substrate locations, for example, between one or more load ports, one or more substrate cooling stages, and load locking device.

[0061] In the embodiment shown in Figure 1, the load lock device 1 includes a plurality of gate valves 30 for providing fluid-sealing between the load lock chamber 3 and each of the transport module 22 and the vacuum chamber 23, and between the second load lock chamber 19 and each of the transport module 22 and the vacuum chamber 23. In other embodiments, the load lock device may or may not include one or more gate valves suitable for providing fluid-sealing between the load lock chamber and one or more of the transport module and the vacuum chamber, and / or between the second load lock chamber and one or more of the transport module and the vacuum chamber, and / or configured to provide fluid-sealing. In other embodiments, the load lock device may or may not include any suitable number of gate valves for providing fluid-sealing for any one or more load lock chambers defined by the load lock chamber body.

[0062] In the embodiment shown in Figure 1, the substrate processing apparatus 20 includes a vacuum pump 21 fluidly coupled to the load lock chamber 3 for exhausting the load lock chamber 3. The vacuum pump 21 in the embodiment of Figure 1 is coupled to one or more exhaust ports 16 and is configured to exhaust the load lock chamber 3 while a microwave heater 10 generates microwave radiation for desorbing adsorbed moisture from one or more substrates 9. In some embodiments, a substrate processing apparatus having a vacuum pump fluidly coupled to the load lock chamber for exhausting the load lock chamber can facilitate simultaneous desorption of adsorbed moisture from one or more substrates and exhaust of the load lock chamber, which in turn can increase the throughput of a substrate processing apparatus having such a vacuum pump. In other embodiments, the substrate processing apparatus may or may not include a vacuum pump fluidly coupled to the load lock chamber for exhausting the load lock chamber. In embodiments in which the substrate processing apparatus has such a vacuum pump, the vacuum pump may be fluidly coupled to any suitable number of further chambers and / or modules for exhausting them.

[0063] In some embodiments, the substrate processing apparatus may be configured such that a microwave heater influences the exhaust of the load lock chamber while generating microwave radiation for desorbing adsorbed moisture from one or more substrates. In some embodiments, the load lock chamber of the substrate processing apparatus may be fluidly coupled to an external exhaust source located away from the substrate processing apparatus for exhausting the load lock chamber. In some such embodiments, the substrate processing apparatus may be configured to exhaust the load lock chamber using the external exhaust source while a microwave heater generates microwave radiation for desorbing adsorbed moisture from one or more substrates. In other embodiments, where the substrate processing apparatus includes a vacuum pump fluidly coupled to the load lock chamber for its exhaust, the vacuum pump may or may not be coupled to one or more exhaust ports, and / or the vacuum pump may or may not be configured to exhaust the load lock chamber while a microwave heater generates microwave radiation for desorbing adsorbed moisture from one or more substrates.

[0064] In the embodiment shown in Figure 1, the substrate processing apparatus 20 comprises one or more deposition chambers 24 connected to a vacuum chamber 23. Although a single deposition chamber of one or more deposition chambers 24 is illustrated in Figure 1, the substrate processing apparatus 20 in the embodiment of Figure 1 may comprise any preferred number of deposition chambers connected to the vacuum chamber 23, for example, one or more, two or more, three or more, etc. In some embodiments, a load lock device comprising a microwave heater for desorbing adsorbed moisture from one or more substrates may improve the quality and / or adhesion properties of films deposited by one or more deposition chambers of the substrate processing apparatus, such as conductive films and / or metal films. Furthermore, even if not shown in Figure 1, the substrate processing apparatus may comprise any appropriate number of other types of substrate processing chambers, such as pre-washing chambers, pre-treatment chambers, etching chambers, and post-treatment chambers, in addition to or as an alternative to one or more deposition chambers.

[0065] In the embodiment of Figure 1, at least a portion of one or more deposition chambers 24 may be implemented as chemical vapor deposition chambers, such as cyclic chemical vapor deposition chambers, or atomic layer deposition chambers. In other embodiments, where the substrate processing apparatus comprises one or more deposition chambers connected to a vacuum chamber, any of the one or more deposition chambers may be implemented in any preferred manner, for example, as a chemical vapor deposition chamber, such as an atomic layer deposition chamber; a physical vapor deposition chamber, such as a sputtering chamber and / or an electron beam evaporation chamber, a spin coating chamber, and / or a spray pyrolysis chamber.

[0066] In the embodiment shown in Figure 1, the vacuum chamber 23 may be implemented as a wafer transport chamber. The vacuum chamber 23 includes a back-end substrate transport robot 31 for enabling substrate transport between at least one load lock device 1 and one or more deposition chambers 24. In other embodiments, the vacuum chamber may or may not include any suitable substrate transport means, such as one or more back-end substrate transport robots. In some embodiments in which the substrate processing apparatus includes a vacuum chamber connected to a load lock device, the vacuum chamber may be implemented as a substrate processing chamber, such as a deposition chamber or etching chamber.

[0067] Figure 2 schematically illustrates a load lock device 1 according to one embodiment. The load lock device 1 of the embodiment in Figure 2 may include any features of load lock devices disclosed herein, even if not shown in Figure 2. Other embodiments may be identical or similar to the embodiment in Figure 2.

[0068] The load lock device 1 in the embodiment shown in Figure 2 comprises a load lock chamber body 2 defining a load lock chamber 3, and includes a first surface 4 configured to be connected to a transport module and a second surface 5 configured to be connected to a vacuum chamber. The load lock device 1 further includes a substrate holder 8 for holding one or more substrates 9 within the load lock chamber 3, and a microwave heater 10 for desorbing moisture adsorbed from one or more substrates 9.

[0069] In the embodiment shown in Figure 2, the substrate holder 8 is configured to hold one or more substrates 9 in a stacked arrangement across multiple substrate positions, maintaining a minimum distance d between adjacent substrate positions at the multiple substrate positions to approximately 6 cm. In other embodiments in which the substrate holder is configured to hold one or more substrates in a stacked arrangement across multiple substrate positions, the substrate holder may be configured to maintain any suitable minimum distance between adjacent substrate positions at the multiple substrate positions, for example, at least 1 cm, or at least 2 cm, or at least 3 cm, or at least 4 cm, or at least 5 cm, or at least 6 cm, or at least 7 cm, or at least 8 cm, or at least 9 cm, or at least 10 cm, or at least 11 cm, or at least 12 cm. In some embodiments in which the substrate holder is configured to hold one or more substrates in a stacked arrangement across multiple substrate positions, maintaining a sufficient minimum distance between adjacent substrate positions at the multiple substrate positions can increase the throughput and / or uniformity of desorption of moisture adsorbed from one or more substrates.

[0070] In the embodiment shown in Figure 2, the substrate holder 8 is configured to hold one or more substrates 9 in a vertically stacked arrangement, where each of the one or more substrates 9 extends laterally and faces vertically at the operating position of the load lock device 1. In some embodiments, a substrate holder configured to hold one or more substrates in a vertically stacked arrangement at the operating position of the load lock device may enable the transport of substrates without tilting them, which in turn may increase the throughput of the substrate processing device. In other embodiments in which the substrate holder is configured to hold one or more substrates in a stacked arrangement at multiple substrate positions, the substrate holder may be configured to hold one or more substrates in any suitable stacked arrangement, for example, a vertically stacked arrangement, or a laterally stacked arrangement where each of the one or more substrates extends vertically and faces laterally at the operating position of the load lock device, or an inclined stacked arrangement where each of the one or more substrates is arranged in an inclined arrangement relative to the vertical at the operating position of the load lock device.

[0071] The load lock device 1 in the embodiment of Figure 2 is configured to accommodate up to two substrates in the load lock chamber 3. In the embodiment of Figure 1, one or more substrates 9 held in the substrate holder 8 consist of up to two substrates, and the load lock device 1 includes the substrate holder 8 when there is no other substrate holding means for holding further substrates in the load lock chamber 3. In some embodiments, a load lock device configured to accommodate up to two substrates in the load lock chamber may allow for more rapid and / or more uniform desorption of adsorbed moisture from up to two substrates, which in turn may increase the throughput of a substrate processing device equipped with such a load lock device. In other embodiments, the load lock device may or may not be configured to accommodate up to two substrates in the load lock chamber.

[0072] The exemplary embodiments of this disclosure described above are merely examples of embodiments of the invention as defined by the appended claims and their legal equivalents, and do not limit the scope of the invention. Any equivalent embodiment is intended to fall within the scope of the invention. In fact, various modifications of this disclosure, in addition to those shown and described herein, such as alternative useful combinations of the described elements, may become apparent to those skilled in the art from the description. Such modifications and embodiments are also intended to fall within the scope of the appended claims. [Explanation of symbols]

[0073] 1. Load lock device 2 Load lock chamber body 3 Load Lock Chamber 4. First side 5. The second side 6 Viewports 7 Fluid sealing window 8. Substrate holder 9 Base material 10 Microwave heater 12 Magnetron Microwave Source 13. Microwave Mode Stirrer 14. Microwave waveguides 16 exhaust ports 19. Second load lock chamber 20 Substrate Processing Equipment 21 Vacuum pump 22 Transport Modules 23 Vacuum Chamber 24 Deposition Chamber 26 Load Ports 27 Substrate Carrier 28 Front-end substrate handling robot 29 Substrate cooling stage 30 Gate valve 31. Backend substrate transport robot

Claims

1. A load lock chamber body comprising a first surface configured to define the load lock chamber and connect to a transport module, and a second surface configured to connect to a vacuum chamber, A substrate holder for holding one or more substrates within the load lock chamber, A load lock device comprising, A load lock device comprising a microwave heater for desorbing moisture adsorbed from one or more substrates.

2. The load lock device according to claim 1, wherein the load lock chamber body is provided with a viewport, and the microwave heater is configured to transmit microwave radiation into the load lock chamber through the viewport.

3. The load lock device according to claim 1, wherein the microwave heater comprises a magnetron microwave source.

4. The load lock device according to claim 1, wherein the microwave heater comprises a microwave mode stirrer.

5. The load lock device according to claim 1, wherein the microwave heater is configured to generate microwave radiation in a wavelength range of 1 cm to 30 cm.

6. The load lock device according to claim 1, wherein the microwave heater is configured to generate microwave radiation with a microwave output of 25 W or more and 10 kW or less.

7. The load lock device according to claim 1, wherein the load lock chamber body is provided with one or more exhaust ports for exhausting the load lock chamber.

8. The load lock device according to claim 1 or later, wherein the load lock chamber body further defines a second load lock chamber for transporting a substrate between the transport module and the vacuum chamber.

9. The load lock device according to claim 1, wherein the substrate holder is configured to hold one or more substrates in a stacked arrangement at a plurality of substrate positions, and maintains a minimum distance of at least 1 cm between adjacent substrate positions at the plurality of substrate positions.

10. The load lock device according to claim 1, wherein the load lock device is configured to accommodate up to two substrates in the load lock chamber.

11. The load lock device according to claim 1, wherein the load lock device is configured to accommodate a maximum of one substrate in the load lock chamber.

12. A substrate processing apparatus comprising a load lock device according to any one of claims 1 to 11.

13. The substrate processing apparatus according to claim 12, wherein the substrate processing apparatus comprises a transport module connected to the load lock device.

14. The substrate processing apparatus according to claim 12, wherein the substrate processing apparatus comprises a vacuum chamber connected to the load lock device.

15. The substrate processing apparatus according to claim 12, wherein the substrate processing apparatus comprises a vacuum pump fluidly connected to the load lock chamber for exhaust.

16. The substrate processing apparatus according to claim 12, wherein the substrate processing apparatus comprises one or more deposition chambers connected to the vacuum chamber.

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