Printed circuit board

Abstract

This document discloses a printed circuit board that incorporates countermeasures against CAF-induced failures. [Solution] The printed circuit board 1 includes a fiber-containing insulating plate 11 containing a fibrous substrate and a CAF-resistant wiring structure. The CAF-resistant wiring structure includes a ground conductor 17, a first conductor 13a included in the power wiring, and a second conductor 15a included in the signal wiring. The first conductor 13a and the second conductor 15a are located in a range where they can be short-circuited by a conductive anode filament. Furthermore, the ground conductor 17, the first conductor 13a, and the second conductor 15a are arranged in the order of first conductor 13a, ground conductor 17, and second conductor 15a in the direction in which the fibrous substrate extends.

Description

Technical Field

[0001] The present disclosure relates to a printed wiring board that takes measures against failures caused by CAF (Conductive Anodic Filament).

Background Art

[0002] In recent years, oil wells are being drilled deeper and longer. For example, oil well drilling may reach a depth of 5 km and a distance of 10 km. In order to succeed in such severe drilling, it is important to know whether the drilling trajectory follows the planned trajectory while withstanding vibration, impact, and high-temperature environments (the temperature at the location where the drill bit searches for oil fields is usually over 150 degrees Celsius and sometimes exceeds 200 degrees Celsius). There is known a MWD (Measurement While Drilling) method in which drilling is advanced while measuring the orientation (usually the inclination angle and azimuth angle) of the drill bit in real time. According to the MWD method, a device called a directional module including an acceleration sensor and a magnetic sensor for measuring the orientation of the drill bit is attached near the drill bit. Refer to Non-Patent Document 1 for the directional module.

[0003] Inside the directional module, a printed wiring board is usually incorporated. Printed components or electronic components are mounted on the printed wiring board. Double-sided boards and multi-layer boards are known as the structures of the printed wiring board. Since the structure of the printed wiring board is well known, there is no need to cite literature.

[0004] Incidentally, terminology related to printed circuits is defined in standards such as International Electrotechnical Commission (IEC) 60194:2015 and Japanese Industrial Standards (JIS) C 5603. However, in reality, there is not always a common understanding of the definitions and usage of these terms among all those skilled in the art. For example, in JIS C 5603, "conductor pattern" is defined as "a figure formed by a conductive material," but many people skilled in the art use "conductor pattern" without explanation to refer to "the conductor itself with a specific shape" rather than a "figure." Furthermore, in JIS C 5603, "via" is defined as "a hole solely for interlayer connection," but many people skilled in the art use "via" without explanation even to refer to holes solely for mounting components. As the applicant is a Japanese limited company, this specification will conform to JIS C 5603 "as much as possible." However, the aforementioned realities should be fully considered when interpreting the terms used in this specification, and in particular, interpretations that focus on the nuances of the wording, or interpretations that are detrimental to the technology disclosed herein, should not be made. Applicants may use conventionally used terminology as needed. Furthermore, to avoid restrictive interpretations that do not align with the applicant's intent, applicants may use non-conventional terminology not explicitly defined in the standard. In such cases, non-restrictive examples of terms defined in the standard or conventional terminology are provided to aid in understanding terms not defined in the standard or non-conventional terminology.

[0005] A double-sided substrate, also known as a two-layer substrate, has a structure in which one insulating plate (the insulating plate is generally called the core) and an electrical conductor with a predetermined pattern (the electrical conductor is usually a metal, especially a metal foil) are arranged on both sides of the insulating plate. The "layer" in a two-layer substrate is the "conductor layer," that is, the area where the electrical conductor can be placed (in other words, the surface of the insulating plate).

[0006] A multilayer substrate has a structure in which two or more insulating plates (which are generally classified as a core and a prepreg) and an electrical conductor with a predetermined pattern (the electrical conductor is usually a metal, especially a metal foil) are arranged alternately. The "layers" of a multilayer substrate are "conductor layers," that is, the places where electrical conductors can be placed (in other words, the surfaces of the two outermost insulating plates and the boundaries between adjacent insulating plates). The inner conductor layers that serve as boundaries between adjacent insulating plates are called "inner layers."

[0007] The electrical conductor pattern of each conductor layer (i.e., the conductor pattern) generally includes all or some traces, lands, and planes. Traces are thin conductive paths that connect different locations within the conductor pattern to each other, and are also called tracks or lines. Lands are parts of the conductor pattern used for mounting or connecting components. In particular, lands used for soldering surface-mount components are also called pads. Planes are relatively large areas of the conductor pattern and are mainly used for power or ground. Hereafter, these terms traces, lands, and planes will be used not only to mean "part of the pattern," but also to mean "part of the electrical conductor that forms the conductor pattern." The electrical conductors of each conductor layer are electrically connected to each other as needed by plated through holes. Plated through holes are holes that extend in the direction that penetrates the insulating plate, i.e., in the thickness direction of the insulating plate, and the inside of the plated through hole is lined with electrical conductor, and lands are usually formed on both ends of the plated through hole.

[0008] With the recent advancements in high-density wiring technology for printed circuit boards, insulation degradation due to migration—the movement of electrical conductors used in printed circuit boards on or along the insulator—has become recognized as a problem. Migration based on electrolytic phenomena is called ion migration and is classified into several types depending on its location and appearance. In particular, when the insulator is a fibrous substrate, the type in which metal is deposited along the fibrous substrate from the anode to the cathode is called CAF (Conductive Anodic Filaments). For more information on CAF, please refer to Non-Patent Document 2, for example. Known factors contributing to CAF generation include the properties of the metal used in the printed circuit board, electric field strength, ambient temperature, and ambient humidity.

[0009] Incidentally, examples of printed circuit boards containing insulating plates with fibrous substrates include paper phenolic substrates made by impregnating paper with phenolic resin, paper epoxy substrates made by impregnating paper with epoxy resin, glass composite substrates made by impregnating cut glass fibers with epoxy resin, glass epoxy substrates made by impregnating glass fiber cloth with epoxy resin, and composite substrates which are a composite structure of glass epoxy substrates and paper epoxy substrates. Hereinafter, these substrates will be referred to as fiber substrates. Fiber substrates can take the form of either double-sided substrates or multilayer substrates.

[0010] With respect to these fiber substrates, CAF tends to occur between plated through-holes in double-sided substrates, and in multilayer substrates, it tends to occur both between plated through-holes and between plated through-holes and between plated through-holes and electrical conductors placed in the inner layer (hereinafter, electrical conductors placed in the inner layer will be referred to as inner layer conductors). [Prior art documents] [Non-patent literature]

[0011] [Non-Patent Document 1] Hirofumi Arita et al., "Development of a Digital Directional Module," [online], March 2017, Aviation Electronics Technology Report No. 39, [Retrieved November 20, 2024], Internet<URL:https: / / www.jae.com / corporate / rd / tech-report / 39 / > [Non-Patent Document 2] Laura J. Turbini, "Conductive anodic filament (CAF) formation: an historic perspective", Circuit World, Vol. 32 No. 3, pp. 19-24. https: / / doi.org / 10.1108 / 03056120610700892 [Overview of the project] [Problems that the invention aims to solve]

[0012] Since the causes of CAF are the properties of the metal used in the printed circuit board, electric field strength, ambient temperature, and ambient humidity, to avoid failure of the printed circuit board due to CAF, 1) Use materials that are less likely to generate CAF. 2) Reduce the ambient temperature, 3) Reduce environmental humidity, 4) Ensure sufficient distance between plated through-holes. 5) Ensure sufficient distance between the plated through-hole and the inner layer conductor. 6) Ensure sufficient distance between the high-potential plated through-hole and the ground. 7) Do not place two or more plated through-holes in the direction in which the fibrous substrate extends. These are some known countermeasures.

[0013] As mentioned above, the directional module, which incorporates the printed circuit board, is mounted near the drill bit. From a cost perspective, it is difficult to adopt measure 1). Since the drill bit digs deep underground, measure 2) is impossible or impractical. The directional module is sealed in a pressure housing and is therefore less affected by ambient humidity, but strict humidity control is not always carried out during the assembly of the pressure housing. In fact, from a cost perspective, it is difficult to implement strict humidity control. Even if strict humidity control is carried out, it is difficult to completely remove humidity. Once the directional module is sealed in the pressure housing, it is exposed to the ambient humidity during assembly for a long time. Therefore, measure 3) cannot be expected to be sufficiently effective. Since the directional module is mounted near the drill bit, there are limitations on the size of the directional module. Therefore, there are limitations on the size of the printed circuit board incorporated inside the directional module. In other words, measures 4) to 7) are difficult due to design constraints. Thus, with regard to printed circuit boards incorporated into directional modules, the above-mentioned measures known to avoid CAF failure of printed circuit boards cannot often be adopted.

[0014] In light of these technical challenges, we disclose a printed circuit board that incorporates countermeasures against CAF failures, particularly a printed circuit board having a CAF-resistant wiring structure in which two different electrical conductors are located within a range where the two electrical conductors can be short-circuited by a conductive anode filament, and are arranged in the direction in which the fibrous substrate extends. [Means for solving the problem]

[0015] The technical matters described herein are not for explicitly or implicitly limiting the invention described in the claims of the patent, nor for enabling a person other than those who benefit from the present invention (for example, the applicant and the patentee) to limit the invention described in the claims of the patent. They are merely provided for facilitating the understanding of the gist of the present invention. The outline of the present invention from other viewpoints can be understood, for example, from the claims of this patent application at the time of filing. The printed wiring board of the present disclosure includes a fiber-containing insulating plate including a fibrous base material and a CAF-resistant wiring structure. The CAF-resistant wiring structure includes a ground conductor, a first electric conductor included in a power supply wiring, and a second electric conductor included in a signal wiring. The first electric conductor and the second electric conductor are present in a range where the first electric conductor and the second electric conductor can be short-circuited with each other by a conductive anode filament. Further, the ground conductor, the first electric conductor, and the second electric conductor are arranged in this order: the first electric conductor, the ground conductor, and the second electric conductor in the direction in which the fibrous base material extends. Thus, the printed wiring board of the present disclosure is characterized in that a ground conductor is deliberately arranged near the first electric conductor included in the power supply wiring. Thus, the printed wiring board of the present disclosure has a feature contrary to the countermeasure of 6) above.

Effect of the Invention

[0016] The disclosed printed wiring board has resistance to failures due to CAF.

Brief Description of the Drawings

[0017] [Figure 1] Embodiment (First Example) of the Printed Wiring Board. [Figure 2] Embodiment (Second Example) of the Printed Wiring Board. [Figure 3] Embodiment (Third Example) of the Printed Wiring Board. [Figure 4] Embodiment (Fourth Example) of the Printed Wiring Board. [Figure 5] Embodiment (Fifth Example) of the Printed Wiring Board. [Figure 6]Embodiment of a printed circuit board (6th example). [Figure 7] Embodiment of a printed circuit board (7th example). [Figure 8] Embodiment of a printed circuit board (8th example). [Figure 9] Embodiment of a printed circuit board (9th example). [Figure 10] Embodiment of a printed circuit board (10th example). [Figure 11] Embodiment of a printed circuit board (11th example). [Figure 12] Embodiment of a printed circuit board (12th example). [Figure 13] Embodiment of a printed circuit board (13th example). [Figure 14] Embodiment of a printed circuit board (14th example). [Figure 15] Embodiment of a printed circuit board (15th example). [Figure 16] Embodiment of a printed circuit board (16th example). [Figure 17] Embodiment of a printed circuit board (17th example). [Figure 18] Embodiment of a printed circuit board (18th example). [Figure 19] Embodiment of a printed circuit board (19th example). [Figure 20] Embodiment of a printed circuit board (20th example). [Modes for carrying out the invention]

[0018] Embodiments of the disclosed printed circuit board will be described with reference to the drawings. The drawings are for understanding the embodiments, and the dimensions of the illustrated components are not necessarily the same as the actual dimensions. Also, in order to clarify the essential points of the embodiments, components that are actually necessary or may be necessary but are considered non-essential in the embodiments (such as the solder resist layer and silk) are omitted from the illustration and description. In each figure, for the sake of clarity, only some of the two or more identical components are labeled with reference numerals. Hereinafter, N is a predetermined positive integer.

[0019] The printed circuit board 1 of the embodiment (see Figures 1 to 20) is a component of a circuit device (e.g., the directional module described above) for measuring the orientation of a drill bit used for underground excavation, and is a printed circuit board that operates in a temperature environment of at least 150 degrees Celsius and up to 200 degrees Celsius. The printed circuit board 1 includes N insulating plates 11, power wiring 13, signal wiring 15, and a ground conductor 17.

[0020] When N=1, the printed circuit board 1 includes one insulating plate 11 and is a double-sided board. This one insulating plate 11 is a fiber-containing plate containing a fibrous substrate 11a. When N≧2, the printed circuit board 1 includes N insulating plates 11 and is a multilayer board. Examples of multilayer boards include through-hole multilayer boards (specifically, multilayer boards in which two or more specific layers are connected to each other using plated through-holes and lands that penetrate from the top layer to the bottom layer), IVH (Interstitial Via Hole) multilayer boards (specifically, multilayer boards in which two or more specific layers are connected to each other using interstitial via holes), and build-up boards (specifically, multilayer boards manufactured by repeating processes such as forming insulating layers and conductive layers, drilling holes, and forming wiring). At least one of the N insulating plates 11 is a fiber-containing plate containing a fibrous substrate 11a. The fibrous substrate 11a is, for example, paper or glass fiber. The above-mentioned example of a fiber board can be used as the printed circuit board 1. Figure 1 schematically shows a printed circuit board 1 which is a glass epoxy substrate, and Figures 2 to 20 each schematically show a printed circuit board 1 which includes an insulating plate 11 made by impregnating a glass fiber cloth with epoxy resin.

[0021] The power wiring 13 is an electrical conductor for supplying power from a DC power supply (not shown) to be mounted on the printed circuit board 1 to electronic components (not shown) to be mounted on the printed circuit board 1. The power wiring 13 includes all or some interlayer connecting conductors, traces, lands, and planes. The material of the power wiring 13 is generally copper. The power wiring 13 includes a first conductor 13a that is an interlayer connecting conductor that penetrates the fiber-containing plate (i.e., an insulating plate 11 containing a fibrous substrate 11a) when N=1, and an interlayer connecting conductor that penetrates the fiber-containing plate or an inner layer conductor on the fiber-containing plate when N≧2.

[0022] The signal wiring 15 is an electrical conductor for the flow of current signals from or to electronic components (not shown) that are to be mounted on the printed circuit board 1. The signal wiring 15 includes all or some interlayer connecting conductors, traces, and pads. The material of the signal wiring 15 is generally copper. The signal wiring 15 includes an interlayer connecting conductor that penetrates the fiber-containing plate (i.e., the insulating plate 11 containing the fibrous substrate 11a) when N=1, and a second conductor 15a that is an interlayer connecting conductor that penetrates the fiber-containing plate or an inner layer conductor on the fiber-containing plate when N≧2.

[0023] The ground conductor 17 is an interlayer connecting conductor that penetrates the fiber-containing plate (i.e., the insulating plate 11 containing the fibrous substrate 11a) when N=1, and an interlayer connecting conductor that penetrates the fiber-containing plate or an inner layer conductor on the fiber-containing plate when N≧2.

[0024] Examples of interlayer connecting conductors mentioned above include plated through-holes for inserting terminals of electronic components for soldering, landless through-holes, via holes which are plated through-holes for electrically connecting electrical conductors of two or more layers to each other, conformal vias, filled vias, staggered vias, stacked vias, skip vias, plugged base vias, and landless vias. Examples of via holes include through-hole vias that penetrate all layers and all insulating plates 11, and interstitial via holes. Examples of interstitial via holes include blind vias and buried vias. Furthermore, the interior of a plated through-hole may be a void, filled with an electrical conductor, or filled with an insulator.

[0025] An example of an inner layer conductor as the first conductor 13a or ground layer 17 includes traces, lands, and planes arranged in the inner layer. An example of an inner layer conductor as the second conductor 15a includes traces and lands arranged in the inner layer.

[0026] As described above, the printed circuit board 1 is characterized by having a CAF-resistant wiring structure in which a first conductor 13a belonging to power wiring and a second conductor 15a belonging to signal wiring are located within a range in which the first conductor 13a and the second conductor 15a can be short-circuited by CAF, and are arranged in the direction in which the fibrous substrate 11a extends. In other words, the shortest distance D between the first conductor 13a and the second conductor 15a is the distance D from the first conductor 13a to the second conductor 15a that the CAF can reach. CAF It is shorter than that. In particular, the shortest distance D is the distance D over which the CAF can extend from the first conductor 13a before the required service life of the printed circuit board 1 is reached. useful It is much shorter than that. Furthermore, the ground conductor 17, the first conductor 13a, and the second conductor 15a are arranged in the direction in which the fibrous substrate 11a extends. CAF resistance in a wiring structure that thus allows for the occurrence and growth of CAF is achieved by arranging the ground conductor 17, the first conductor 13a, and the second conductor 15a in the direction in which the fibrous substrate 11a extends, in the order of first conductor 13a, ground conductor 17, and second conductor 15a. Considering the possibility of CAF growing from the second conductor 15a toward the ground conductor 17, it is desirable that the ground conductor 17 be closer to the first conductor 13a than to the second conductor 15a.

[0027] The applicant conducted an accelerated degradation test under conditions equivalent to a DC power supply voltage of 28 volts, an electronic component drive voltage of 3.3 volts, an ambient temperature of 185 degrees Celsius, and a total energizing time of 2000 hours, and determined the distance D over which CAF can reach from the first conductor 13a to the second conductor 15a. CAF I confirmed that it was 4mm.

[0028] In the CAF-resistant wiring structure, the CAF extending from the first conductor 13a belonging to the power wiring eventually reaches the ground conductor 17, causing the first conductor 13a and the ground conductor 17 to short-circuit each other. Generally, since CAF is very thin, the CAF burns out the moment the first conductor 13a and the ground conductor 17 short-circuit. This instantaneous phenomenon does not cause a significant voltage drop to the driving voltage of electronic components powered by the DC power supply. Therefore, the circuit device for measuring the orientation of a drill bit used in underground excavation (e.g., the directional module described above) can continue to operate normally. To burn out the CAF instantaneously, it is preferable that the potential difference between the first conductor 13a and the ground conductor 17 is 24 volts or more, in other words, the power supply voltage of the DC power supply is 24 volts or more. Furthermore, since the ground conductor 17 prevents the CAF from reaching the second conductor 15a belonging to the signal wiring, the short-circuit current generated by the short-circuit between the first conductor 13a and the second conductor 15a does not enter the electronic components. In other words, malfunctions of electronic components caused by short-circuit current acting as noise are prevented, and furthermore, damage to electronic components caused by short-circuit current is prevented, thus extending the lifespan of the printed circuit board 1. While the service life of the prior art printed circuit board (i.e., the period during which the printed circuit board does not fail due to CAF) was 1000 hours, according to the aforementioned accelerated degradation test, the service life of the disclosed printed circuit board 1 is 2000 hours.

[0029] From the standpoint of inhibiting CAF growth, it is desirable that the size of the ground conductor 17 in the direction perpendicular to the direction passing through the first conductor 13a and the second conductor 15a be larger than the size of the first conductor 13a or the size of the second conductor 15a that is not smaller.

[0030] Since it is not practical to comprehensively illustrate all possible structural types of the printed circuit board 1, several embodiments are shown in Figures 1 to 20. Figure 1 shows an example when N=1, and Figures 2 to 20 show examples when N≧2. In Figures 2 to 20, the insulating plate 11 in which the fibrous substrate 11a is not shown may be a fiber-containing plate or a fiber-free plate. There are no restrictions on the position or pattern of the power wiring 13. There are no restrictions on the position or pattern of the signal wiring 15.

[0031] In the example shown in Figure 1, the first conductor 13a is a through-hole via, the second conductor 15a is a through-hole via, and the ground conductor 17 is a through-hole via. In the example shown in Figure 2, the first conductor 13a is a buried via, the second conductor 15a is a buried via, and the ground conductor 17 is a buried via. In the example shown in Figure 3, the first conductor 13a is a buried via, the second conductor 15a is an inner layer trace, and the ground conductor 17 is a buried via. In the example shown in Figure 4, the first conductor 13a is a buried via, the second conductor 15a is a buried via, and the ground conductor 17 is an inner layer trace. When the first conductor 13a is a via and the ground conductor 17 is an inner layer trace, it is preferable that the ground conductor 17 includes at least two inner layer traces. In particular, it is preferable that the at least two inner layer traces are located on both sides of the insulating plate 11 containing the fibrous substrate 11a and are positioned at the same location in the thickness direction of the insulating plate 11. This technical matter also applies to other examples where the first conductor 13a is a via and the ground conductor 17 is an inner layer trace.

[0032] In the example in Figure 5, the first conductor 13a is a buried via, the second conductor 15a is an inner layer trace, and the ground conductor 17 is an inner layer trace. In the example in Figure 6, the first conductor 13a is an inner layer trace, the second conductor 15a is a buried via, and the ground conductor 17 is a buried via. In the example shown in Figure 7, the first conductor 13a is an inner layer trace, the second conductor 15a is an inner layer trace, and the ground conductor 17 is a buried via. In the example shown in Figure 8, the first conductor 13a is an inner layer trace, the second conductor 15a is a buried via, and the ground conductor 17 is an inner layer trace. In the example shown in Figure 9, the first conductor 13a is an inner layer trace, the second conductor 15a is an inner layer trace, and the ground conductor 17 is an inner layer trace.

[0033] In the example shown in Figure 10, the first conductor 13a is a blind via land, the second conductor 15a is a blind via land, and the ground conductor 17 is a blind via land. If the insulating plate 11 located at the top of the printed circuit board 1 shown in Figure 10 also includes a fibrous substrate 11a, then, from the perspective of the insulating plate 11 located at the top of the printed circuit board 1, the first conductor 13a is a blind via, the second conductor 15a is a blind via, and the ground conductor 17 is a blind via. Thus, the interpretations of the first conductor 13a, the second conductor 15a, and the ground conductor 17 are not unambiguous. In the example shown in Figure 11, the first conductor 13a is a buried via, the second conductor 15a is a land for a blind via, and the ground conductor 17 is a buried via. In the example shown in Figure 12, the first conductor 13a is a blind via land, the second conductor 15a is a blind via land, and the ground conductor 17 is an inner layer trace.

[0034] In the example shown in Figure 13, the first conductor 13a is a through-hole via, the second conductor 15a is a through-hole via, and the ground conductor 17 is a through-hole via. When all insulating plates 11 include a fibrous substrate 11a, the embodiment shown in Figure 13 is the simplest example. In the example shown in Figure 14, the first conductor 13a is a through-hole via, the second conductor 15a is a land for a blind via, and the ground conductor 17 is a land for a blind via. In the example shown in Figure 15, the first conductor 13a is a blind via, the second conductor 15a is a land for a blind via, and the ground conductor 17 is a land for a blind via. In the example in Figure 16, the first conductor 13a is a buried via, the second conductor 15a is a land for a blind via, and the ground conductor 17 is a land for a blind via.

[0035] In the example in Figure 17, the first conductor 13a is a through-hole via, the second conductor 15a is a blind via and a buried via, and the ground conductor 17 is a blind via and a buried via. Thus, the first conductor 13a, the second conductor 15a, and the ground conductor 17 are not necessarily single electrical conductors. In particular, there are no limitations on the shape and number of ground conductors 17, as long as the growth of CAF from the first conductor 13a to the second conductor 15a can be inhibited. In the example shown in Figure 18, the first conductor 13a is a through-hole via, the second conductor 15a is a blind via and a buried via, and the ground conductor 17 is a through-hole via. In the example shown in Figure 19, the first conductor 13a consists of a blind via and a buried via, the second conductor 15a consists of a blind via and a buried via, and the ground conductor 17 is a buried via. In the example shown in Figure 20, the first conductor 13a consists of a blind via and a buried via, the second conductor 15a consists of a blind via and a buried via, and the ground conductor 17 consists of two buried vias.

[0036] <Addendum 1> The technical features disclosed in the various embodiments and their variations described above are not necessarily mutually exclusive. To the extent that they do not contradict each other from a technical standpoint, the technical features of one embodiment or its variation may be applied to the technical features of another embodiment or its variation.

[0037] The claims set forth in the claims of this application at the time of filing do not necessarily claim all inventions disclosed in this specification. In this regard, the applicant of this application should not be understood or interpreted as having waived the right to obtain a patent for inventions not claimed at the time of filing. To the extent permitted by the laws or treaties of the country or region that receives this application, the applicant reserves the right to obtain a patent for inventions not claimed in this application, the right to file a divisional application for such inventions, the right to claim such inventions by amendment, and all other rights. However, this shall not apply if the applicant of this application expresses an explicit and definitive contrary intention.

[0038] The claimed printed wiring board does not exclude printed circuit boards from its scope of protection. A printed circuit board is generally a designation for a printed wiring board on which printed components or electronic components are mounted. In other words, a printed circuit board includes a printed wiring board and printed components or electronic components mounted on the printed wiring board. Therefore, a printed circuit board including the printed wiring board disclosed herein is implementing the printed wiring board disclosed herein.

[0039] An example of a summary of this disclosure from a different perspective is as follows:

[0040] A printed circuit board based on the first perspective is, N insulating plates, where N is a predetermined positive integer, and when N=1 the printed circuit board is a double-sided board, and when N≧2 the printed circuit board is a multilayer board, and at least one of the N insulating plates is a fiber-containing plate containing a fibrous substrate. A power supply wiring, which is an electrical conductor for supplying power from a DC power supply to be mounted on the printed circuit board to electronic components to be mounted on the printed circuit board, A signal wire which is an electrical conductor for the flow of current signals from or to the aforementioned electronic component, When N=1, it is an interlayer connecting conductor that penetrates the fiber-containing plate, and when N≧2, it is a ground conductor that is either an interlayer connecting conductor that penetrates the fiber-containing plate or an inner layer conductor on the fiber-containing plate. Includes, The power wiring includes a first conductor which is an interlayer connecting conductor that penetrates the fiber-containing plate when N=1, and an interlayer connecting conductor that penetrates the fiber-containing plate or an inner layer conductor on the fiber-containing plate when N≧2. The signal wiring includes a second conductor which is an interlayer connecting conductor that penetrates the fiber-containing plate when N=1, and which is an interlayer connecting conductor that penetrates the fiber-containing plate or an inner layer conductor on the fiber-containing plate when N≧2. The shortest distance between the first conductor and the second conductor is shorter than the distance from which the conductive anode filament can reach the second conductor from the first conductor. The ground conductor, the first conductor, and the second conductor are arranged in the order of the first conductor, the ground conductor, and the second conductor in the direction in which the fibrous substrate extends. It is a printed circuit board.

[0041] A printed circuit board based on the second perspective is a printed circuit board based on the first perspective, The distance over which the conductive anode filament can reach from the first conductor to the second conductor is 4 mm. This is a printed circuit board characterized by the following features.

[0042] A printed circuit board based on the third perspective is a printed circuit board based on the first or second perspective, The power supply voltage of the DC power supply is 24 volts or higher. This is a printed circuit board characterized by the following features.

[0043] A printed circuit board based on the fourth perspective is a printed circuit board based on either the first or third perspective, The size of the ground conductor in a direction perpendicular to the direction passing through the first conductor and the second conductor is greater than the size of the first conductor and the size of the second conductor that is not smaller. This is a printed circuit board characterized by the following features.

[0044] A printed circuit board based on the fifth perspective is a printed circuit board based on either the first or fourth perspective, The ground conductor is closer to the first conductor than the second conductor. This is a printed circuit board characterized by the following features.

[0045] A printed circuit board based on the sixth perspective is a printed circuit board based on either the first or fifth perspective, The aforementioned printed circuit board is a printed circuit board that operates in a temperature environment of at least 150 degrees Celsius or more and 200 degrees Celsius or less. This is a printed circuit board characterized by the following features.

[0046] A printed circuit board based on the seventh perspective is a printed circuit board based on either the first or sixth perspective, The aforementioned printed circuit board is a component of a circuit device for measuring the orientation of a drill bit. This is a printed circuit board characterized by the following features.

[0047] <Addendum 2> While the present invention has been described with reference to exemplary embodiments, those skilled in the art will understand that various modifications can be made and elements can be replaced with equivalents without departing from the scope of the invention. Furthermore, many modifications can be made to adapt a particular system, device, or component thereof to the teachings of the invention without departing from the essential scope of the invention. Accordingly, the present invention is not limited to the specific embodiments disclosed for the purpose of carrying out the invention, but includes all embodiments contained in the appended claims.

[0048] Furthermore, the use of terms such as “first,” “second,” etc., when used herein and / or in the appended claims, does not indicate order or importance, but rather the terms such as “first,” “second,” etc., are used to distinguish elements. The terms used herein are for the purpose of describing embodiments and are not intended in any way to limit the invention. The terms “including” and their variations, when used herein and / or in the appended claims, indicate the existence of the mentioned features, steps, operations, elements, and / or components, but do not exclude the existence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof. The terms “and / or” include, if any, one or any combination of the listed elements relating thereto. In the claims and specification, unless otherwise specifically stated, “connected,” “joined,” “joined,” “linked,” or their synonyms, and all their forms, do not necessarily negate the existence of one or more intermediate elements between two that are, for example, “connected” or “joined” or “linked” to one another. In the claims and specification, the term “arbitrary” should be understood as having the same meaning as the universal quantifier ∀, if any, unless otherwise specified. For example, the expression “for any X” is the same as “for all X” or “for each X.” Expressions such as “at least one of A, B, and C” (for example in English “at least one of A, B and C”, “at least one of A, B or C”, “at least one of A, B and / or C”) should be understood as having the same meaning as the power set 2 of the set S which contains all the listed elements, if any, unless otherwise specified. S This means arbitrarily selecting an element from the set P obtained by removing the empty set φ from the set. In this example, S={A,B,C},2 S={φ,{A},{B},{C},{A,B},{A,C},{B,C},{A,B,C}},P={{A},{B},{C},{A,B},{A,C},{B,C},{A,B,C}}, and this example means that one element (for example, {A,C}) can be arbitrarily selected from the set P.

[0049] Unless otherwise specified, all terms used herein (including technical and scientific terms) have the same meaning as those generally understood by those skilled in the art to which the present invention pertains. Furthermore, terms such as those defined in commonly used dictionaries should be construed to have the meaning consistent with their meanings in the relevant art and in the context of this disclosure, and should not be construed ideally or excessively formally unless expressly defined.

[0050] It will be understood that many techniques and steps are disclosed in the description of this invention. Each of these has its own advantages, and each can be used in combination with one or more, or possibly all, of the other disclosed techniques. Therefore, to avoid complexity, this specification refrains from describing every possible combination of individual techniques or steps. Nevertheless, the specification and claims should be read with the understanding that such combinations are entirely within the scope of the invention and claims.

[0051] In the following claims, all corresponding structures, materials, actions, and equivalents of functional elements combined with means or steps are intended to include structures, materials, or actions for performing a function in combination with other elements, if any.

[0052] While embodiments of the present invention have been described above, the present invention is not limited to these embodiments. Various modifications and variations are permitted without departing from the spirit of the invention. The selected and described embodiments are for illustrating the principles of the present invention and its practical applications. The present invention can be used in various embodiments with various modifications and variations, and the various modifications and variations will be determined according to the expected use. All such modifications and variations are intended to fall within the scope of the present invention as defined by the appended claims and are intended to be granted the same protection when interpreted in accordance with the fair, lawful and equitable breadth. [Explanation of symbols]

[0053] 1 Printed circuit board 11 Insulating plate 11a Fibrous substrate 13 Power wiring 13a First conductor 15 Signal Wiring 15a Second conductor 17 Ground conductor

Claims

1. Printed wiring board, N insulating plates, where N is a predetermined positive integer, and when N = 1, the printed circuit board is a double-sided board, and when N ≥ 2, the printed circuit board is a multilayer board, and at least one of the N insulating plates is a fiber-containing plate containing a fibrous substrate. A power supply wiring, which is an electrical conductor for supplying power from a DC power supply to be mounted on the printed circuit board to electronic components to be mounted on the printed circuit board, A signal wire which is an electrical conductor for the flow of current signals from or to the aforementioned electronic component, When N=1, it is an interlayer connecting conductor that penetrates the fiber-containing plate, and when N≧2, it is a ground conductor that is either an interlayer connecting conductor that penetrates the fiber-containing plate or an inner layer conductor on the fiber-containing plate. Includes, The power wiring includes a first conductor which is an interlayer connecting conductor that penetrates the fiber-containing plate when N=1, and an interlayer connecting conductor that penetrates the fiber-containing plate or an inner layer conductor on the fiber-containing plate when N≧2. The signal wiring includes a second conductor which is an interlayer connecting conductor that penetrates the fiber-containing plate when N=1, and which is an interlayer connecting conductor that penetrates the fiber-containing plate or an inner layer conductor on the fiber-containing plate when N≧2. The shortest distance between the first conductor and the second conductor is shorter than the distance from which the conductive anode filament can reach the second conductor from the first conductor. The ground conductor, the first conductor, and the second conductor are arranged in the order of the first conductor, the ground conductor, and the second conductor in the direction in which the fibrous substrate extends. Printed circuit board.

2. In the printed wiring board according to claim 1, The distance over which the conductive anode filament can reach from the first conductor to the second conductor is 4 mm. A printed circuit board characterized by the following features.

3. In the printed wiring board according to claim 1, The power supply voltage of the DC power supply is 24 volts or higher. A printed circuit board characterized by the following features.

4. In the printed wiring board according to claim 1, The size of the ground conductor in a direction perpendicular to the direction passing through the first conductor and the second conductor is greater than the size of the first conductor and the size of the second conductor that is not smaller. A printed circuit board characterized by the following features.

5. In the printed wiring board according to claim 1, The ground conductor is closer to the first conductor than the second conductor. A printed circuit board characterized by the following features.

6. In the printed wiring board according to claim 1, The aforementioned printed circuit board is a printed circuit board that operates in a temperature environment of at least 150 degrees Celsius to 200 degrees Celsius. A printed circuit board characterized by the following features.

7. In the printed wiring board according to claim 1, The aforementioned printed circuit board is a component of a circuit device for measuring the orientation of a drill bit. A printed circuit board characterized by the following features.

Images