Susceptor Leveling System
The susceptor leveling assembly with dual positioning devices and leveling mechanisms addresses errors in conventional systems, providing precise and accurate susceptor leveling for improved reactor performance.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- ASM IP HLDG BV
- Filing Date
- 2025-12-15
- Publication Date
- 2026-06-30
AI Technical Summary
Conventional susceptor leveling systems in gas-phase reactors are prone to errors due to direct mechanical connections, necessitating the development of a more precise and accurate control system.
A susceptor leveling assembly with a first and second positioning device and corresponding leveling mechanisms, controlled by a controller, to adjust the susceptor leveler plate in multiple directions, enhancing precision and accuracy.
Enables precise and accurate susceptor leveling, reducing errors and improving the consistency of substrate processing in reactors.
Smart Images
Figure 2026108584000001_ABST
Abstract
Description
Technical Field
[0001] This disclosure generally relates to systems used in the formation of electronic devices. More specifically, this disclosure relates to systems suitable for leveling a susceptor before and after substrate processing.
Background Art
[0002] Gas-phase reactors such as chemical vapor deposition (CVD) reactors, atomic layer deposition (ALD) reactors, and the like can be used in various applications including the deposition of materials for forming films on substrates. For example, gas-phase reactors can be used to deposit layers on substrates to form devices such as semiconductor devices, flat panel display devices, photovoltaic devices, microelectromechanical systems (MEMS), and the like.
[0003] In some applications, the reactor includes one or more susceptors configured to hold the substrate during the deposition process. It may be desirable to have fine-tuning control of the reactor that may require precise leveling of the one or more susceptors. Some leveling devices use an assembly to level the susceptor, which includes a positioning device (e.g., micrometer) directly connected to the leveling plate. The direct link between the positioning device and the leveling plate is very sensitive and prone to errors. Therefore, it is desirable to develop and use a system with fewer errors in controlling the leveling of the susceptor.
[0004] Any discussion, including discussion of problems and solutions, set forth in this section is included in this disclosure only for the purpose of providing background to the disclosure, and it should not be assumed that any or all of the discussion was known at the time the invention was made or that they constitute prior art.
Summary of the Invention
Means for Solving the Problems
[0005] This summary of the invention may introduce selected concepts in a simplified form, which may be described in more detail below. This summary of the invention is not necessarily intended to identify any major or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.
[0006] Various embodiments of this disclosure relate to improved systems suitable for controlling susceptor leveling. While the various embodiments of this disclosure address the shortcomings of conventional systems and methods will be discussed in more detail below, generally speaking, the various embodiments of this disclosure provide systems that can be used, for example, to control susceptor leveling more precisely and accurately.
[0007] Examples of susceptor leveling assemblies are disclosed in the embodiments of this disclosure, as will be described in more detail below. The embodiments of this disclosure are conveniently described in relation to the leveling of susceptors in a reactor. However, unless otherwise noted, the examples of this disclosure are not limited in this way.
[0008] An additional embodiment of the present disclosure provides a susceptor leveling assembly. An exemplary susceptor leveling assembly includes a susceptor leveler plate and a first positioning assembly, the first positioning assembly comprising a first positioning device configured to move a pedestal vertically and a first leveling mechanism in contact with the first positioning device and the susceptor leveler plate. In various embodiments, the first positioning assembly is configured to adjust and angle the susceptor leveler plate in a first direction with respect to a first plane.
[0009] According to an embodiment of the embodiment, the first positioning assembly comprises a second positioning device and a second leveling mechanism that contacts the second positioning device and a susceptor leveler plate. In various embodiments, the second leveling mechanism is configured to adjust the angle of the susceptor leveler plate in a second direction with respect to a second plane. In various embodiments, the first and second positioning devices are coupled to a first adjustment mechanism frame. In various embodiments, at least one of the first and second positioning devices includes a micrometer. In various embodiments, the susceptor leveling assembly includes a controller that communicates with the first and second positioning devices. According to a further embodiment, the controller is configured to control the first positioning device to adjust the angle of the susceptor leveler plate in a first direction and / or a second direction.
[0010] Apparatus devices are provided according to additional embodiments of the present disclosure. Exemplary devices include pedestal and susceptor leveling assemblies described herein.
[0011] Additional embodiments of the present disclosure provide reactor systems. An exemplary reactor system includes a susceptor, pedestal, and susceptor-leveling assembly as described herein.
[0012] Those skilled in the art will readily see these embodiments and other embodiments from the following detailed description of certain embodiments with reference to the accompanying drawings, but the present invention is not limited to any particular embodiment disclosed. [Brief explanation of the drawing]
[0013] A more complete understanding of the exemplary embodiments of this disclosure can be obtained by referring to the “Modes for Carrying Out the Invention” and “Claims,” as considered in relation to the following exemplary figures.
[0014] [Figure 1] This is an isometric view of an assembly according to an exemplary embodiment of the present disclosure. [Figure 2] This is a cross-sectional view of a reactor system according to an exemplary embodiment of the present disclosure. [Figure 3A] This is a diagram of a positioning device according to an exemplary embodiment of the present disclosure. [Figure 3B] This is a diagram of a positioning device according to an exemplary embodiment of the present disclosure. [Figure 4A] This is a diagram of a susceptor leveling assembly according to an exemplary embodiment of the present disclosure. [Figure 4B] This is a diagram of a susceptor leveling assembly according to an exemplary embodiment of the present disclosure. [Figure 5A] This is a diagram of a susceptor leveling assembly according to a further exemplary embodiment of the present disclosure. [Figure 5B] This is a diagram of a susceptor leveling assembly according to a further exemplary embodiment of the present disclosure.
[0015] It should be understood that the elements in the figures are illustrated for simplification and clarity and are not necessarily drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to others to help improve understanding of the illustrated embodiments of this disclosure. [Modes for carrying out the invention]
[0016] While certain embodiments and examples are disclosed below, it will be understood by those skilled in the art that the scope of the invention extends beyond the specifically disclosed embodiments and / or uses of the invention, as well as their obvious modifications and equivalents. Therefore, the scope of the invention disclosed is not intended to be limited by the specific disclosed embodiments described below.
[0017] This disclosure relates, in general, to assemblies suitable for use in reactor systems. Such assemblies can be used to control the position and horizontal position of a susceptor.
[0018] As used herein, the term “substrate” can refer to any substrate material that can be used to form a device, circuit, or film, or on which a device, circuit, or film can be formed, by a method according to one embodiment of the present disclosure. The substrate may include a bulk material such as silicon (e.g., single-crystal silicon), another Group IV material such as germanium, or another semiconductor material such as Group II-VI or Group III-V semiconductor materials, and may include one or more layers on or below the bulk material. Furthermore, the substrate may have various shapes, such as recesses, protrusions, and the like, formed in or on at least a portion of the layers of the substrate.
[0019] As used herein, the term “deposition process” may refer to the process of introducing a precursor (and / or reactant) into a reaction chamber to deposit or form a layer on a substrate. This may include chemical vapor deposition ("CVD"), atomic layer deposition ("ALD"), CVD / ALD hybrid deposition, plasma-enhanced chemical vapor deposition ("PECVD"), plasma-enhanced atomic layer deposition ("PEALD"), and PECVD / PEALD hybrid deposition.
[0020] In the present disclosure, any two numbers of a variable can constitute the executable range of that variable, and any range shown can include or exclude endpoints. Additionally, in some embodiments, any value of a variable shown (regardless of whether they are shown with "about") can refer to an exact value or an approximate value, can include equivalents, and can refer to an average value, a median value, a representative value, a majority, etc. Further, in the present disclosure, the terms "including", "constituted by", and "having" and their synonyms can, in some embodiments, independently refer to "comprising", "consisting essentially of", or "consisting of". In the present disclosure, none of the defined meanings necessarily exclude the ordinary meaning and the customary meaning in some embodiments. Further, the term "about" can refer to + / −20, 10, 5, 2, 1, or 0.5 percent of a value, and any value described herein can be + / −20, 10, 5, 2, 1, or 0.5 percent of a value.
[0021] Turning now to the figures, FIG. 1 illustrates an assembly 100 according to an embodiment of the present disclosure. Further, FIG. 2 shows a reactor system 200 comprising the assembly 100. In various embodiments, the assembly 100 is configured to level the susceptor 130.
[0022] In various embodiments, the assembly 100 includes a susceptor leveling assembly 102, which includes a susceptor leveling plate 110 and a first positioning assembly 109(a). In various embodiments, the susceptor leveling plate 110 includes one or more positioning regions (e.g., 103(a), 103(b), and 103(c)) configured to receive leveling mechanisms (e.g., the first leveling mechanism 104(a) of the first positioning assembly 109(a), the first leveling mechanism 104(b) of the second positioning assembly 109(b), and the first leveling mechanism 104(c) of the third positioning assembly 109(c)). The leveling mechanism may be, for example, a lever arm and pivot, a wedge and pivot, a gear ratio, a hydraulic press, any combination thereof, or any other simple machine, or may include them. The susceptor leveling assembly 102 is illustrated with three positioning assemblies 109(a)-109(c), but any suitable number of positioning assemblies (e.g., one, two, three, four, etc.) may be used.
[0023] In various embodiments, the first positioning assembly 109(a) includes a first leveling mechanism 104(a) that contacts the susceptor leveling plate 110 and a first positioning device 106(a). The first positioning assembly 109(a) is configured to adjust the angle of the susceptor leveling plate 110 in a first direction (e.g., the x direction, the y direction, or the z direction) with respect to a first plane (e.g., the xz plane, the bonding plane, or the xy plane). In various embodiments, the first positioning device 106(a) can communicate with a controller (e.g., controller 205) that controls the movement of the first positioning device 106(a) to adjust the angle of the susceptor leveling plate 110 in the first direction.
[0024] In various embodiments, the first positioning assembly 109(a) further comprises a second positioning device 108(a) which can contact either the first leveling mechanism 104(a) or the second leveling mechanism which also contacts the susceptor leveler plate 110. The susceptor leveling assembly 102 is connected to a pedestal 120, which is connected to and supports a susceptor 130. The second positioning device 108(a) also communicates with a controller, which is configured to control the movement of the second positioning device 108(a) to adjust the angle of the susceptor leveler plate 110 in a second direction (e.g., x, y, z direction). In various embodiments, the first direction is different from the second direction.
[0025] In various embodiments, the susceptor leveling assembly 102 comprises a second positioning assembly 109(b) and a third positioning assembly 109(c). Each positioning assembly may comprise a first leveling mechanism (e.g., first leveling mechanisms 104(b), 104(c)), a first positioning device (e.g., first positioning device 106(b), 106(c)), and a second positioning device (e.g., second positioning device 108(b), 108(c)). In various embodiments, the second positioning assembly 109(b) and the third positioning assembly 109(c) also communicate with the controller 205 and operate in conjunction with the first positioning assembly 109(a) to control the angle of the susceptor 130.
[0026] Referring to Figure 2, the reactor system 200 may include a reactor 230 comprising an upper body 1600 and a lower body 1300. The upper body 1600 and the lower body 1300 may be connected to each other. More specifically, the upper body 1600 and the lower body 1300 of the reactor may form internal spaces 500 and 1000, while being in surface contact and surface sealing with each other. Within the reaction space 500 and the lower space 1000, the reactor 230 may include a substrate mounting unit 240 and a ring 800 surrounding the substrate mounting unit 240 and positioned between the substrate mounting unit 240 and the upper body 1600.
[0027] The reactor 230 may be configured to perform processing on an object to be processed, such as a substrate (e.g., a wafer). For example, the reactor 230 may be configured to perform heating, deposition, etching, cleaning, and / or other processing on the object to be processed. In some embodiments, the reactor 230 may be configured to perform functions such as moving the object to be processed, vacuum sealing, heating, evacuation, and / or other functions so that the object is processed within the reactor. In an optional embodiment, the reactor 230 may be a reactor on which an atomic layer deposition (ALD) or chemical vapor deposition (CVD) process, or other deposition process, is performed.
[0028] The upper body 1600 of the reactor may include a first gas inlet 225, a gas supply unit 210, an exhaust duct 600, and a ring 800. The lower body 1300 of the reactor may include a second gas inlet 900. The upper body 1600 and the substrate mounting unit 240 may form a reaction space 500. The lower body 1300 and the substrate mounting unit 240 may form a lower space 1000. A second gas generator 1900 may supply a second gas, which may be sent to the lower space 1000 through the second gas inlet 900.
[0029] The ring 800 may surround the substrate mounting unit 240 and may be positioned between the substrate mounting unit 240 and the upper body 1600. The ring 800 may generally have a circular ring shape, but is not limited thereto. For example, if the substrate mounting unit 240 has a rectangular shape, the ring 800 may have a rectangular ring shape. The ring 800 may be fixed to the upper body 1600. Alternatively, the ring 800 may be movably mounted on the upper body 1600.
[0030] The substrate mounting unit 240 may include a susceptor 130 for supporting the substrate and a heater (not shown) for heating the substrate supported by the susceptor 130. The heater may be embedded within the susceptor 130. The substrate mounting unit 240 may further include a pedestal 120 for supporting the susceptor 130. For loading / unloading the substrate, the substrate mounting unit 240 may be configured to be vertically movable.
[0031] The process gas introduced through the first gas inlet 225 may be supplied to the reaction space 500 and the substrate through a gas supply unit 210. The gas supply unit 210 may be a showerhead. The base of the showerhead may include a plurality of gas supply holes formed to discharge the process gas (for example, perpendicular to the substrate). The process gas supplied onto the substrate undergoes a chemical reaction with the substrate or a chemical reaction between the gases, which can then deposit a thin film on the substrate or etch the thin film. In the reaction space 500, residual gases or unreacted gases remaining after the chemical reaction with the substrate may be exhausted to the outside through an exhaust space 700 in an exhaust duct 600 and an exhaust pump (not shown). The exhaust method may be upper exhaust and / or lower exhaust as shown, so that one or more gases are exhausted through the exhaust duct 600.
[0032] It may be desirable to keep the distance between the lower surface of the gas supply unit 210 and the upper surface of the substrate on the susceptor 130 approximately constant or generally constant. In other words, it is desirable that the distance between the susceptor 130 and the gas supply unit 210 at one end of the susceptor 130 is approximately equal to the distance between the susceptor 130 and the gas supply unit 210 at the other end of the susceptor 130. Tilt adjustment and / or spacing adjustment may be performed while the substrate is being removed, for example, during idle periods. For example, fine calibration of the susceptor 130 may be performed automatically during idle periods of the process. For example, fine calibration of the susceptor 130 can be performed without an operator entering the reactor system 200 by remotely controlling the controller 205 during idle periods or substrate processing.
[0033] Referring to Figures 3A and 3B, a positioning device 300 is shown. The positioning device 300 can be used as any of the positioning devices described herein (e.g., first positioning devices 106(a) to (c) and second positioning devices 108(a) to (c)). In various embodiments, the positioning device 300 may comprise a rotating body 310 and a stationary body 320. For example, the rotating body 310 may comprise a micrometer and control the horizontal or vertical movement of the susceptor leveler plate 110 according to the corresponding rotational displacement and corresponding scale position of the rotating body 310 relative to the stationary body 320 with respect to a leveling mechanism (e.g., first leveling mechanism 104(a)). The stationary body 320 may be fixed to an adjustment mechanism frame (e.g., adjustment mechanism frame 107) so that multiple positioning devices 300 can be fixed to an adjustment mechanism frame (e.g., first positioning device 106(a) and second positioning device 108(a)). The rotating body 310 may be rotatable about the central axis of the stationary body 320. The adjustment mechanism may further include a ball bearing 325 located within the rotating body 310 and positioned on its central axis.
[0034] Referring to Figures 4A and 4B, alternative configurations of the susceptor leveling assembly 102 are illustrated. As shown in Figure 4A, exemplary embodiments of the present invention utilize the lever arm system as a first leveling mechanism 104 (e.g., first leveling mechanism 104(a)) to more precisely adjust the angle of the susceptor 130. For example, the first leveling mechanism 104 may be a pivot point 402 and a lever arm 404, or may include them. In various embodiments, the proximal end of the lever arm 404 is in contact with the susceptor leveler plate 110, and the distal end of the lever arm 404 is in contact with a positioning device 106. In the illustrated example, the positioning device 106 is configured to apply a force in the y-direction to the distal end of the lever arm 404. The pivot point 402 is configured to contact the lever arm 404 at a distance of X from the proximal end of the lever arm 404 and a distance of 10X from the distal end of the lever arm 404. In various embodiments, the distance from the distal end of the lever arm is approximately 5X to approximately 10X. Since the positioning device 106 needs to move a greater distance than the susceptor leveler plate moves, the greater the distance from the distal end of the lever arm 404, the more precise the adjustment of the susceptor 130 becomes. For example, if the distance from the distal end of the lever arm 404 is 10X and the positioning device 106 moves 3 centimeters in the positive y direction, the susceptor leveler plate 110 will move 3 millimeters in the negative y direction.
[0035] Figure 4B illustrates an exemplary embodiment of the present invention, in which a wedge system is used as a first leveling mechanism 104 (e.g., first leveling mechanism 104(a)) to provide more precise adjustment to the angle of the susceptor 130. For example, the first leveling mechanism 104 may be a pivot point 402 and a wedge 406, or may include both. In various embodiments, the proximal end of the wedge 406 is in contact with the susceptor leveler plate 110, and the distal end of the wedge 406 is in contact with a positioning device 106. The positioning device 106 is configured to apply a force in the x-direction to the distal end of the wedge 406. The pivot point 402 is configured to be in contact with the wedge 406, and the wedge 406 is positioned between the susceptor leveler plate 110 and the pivot point 402. In various embodiments, the height of the wedge 406 is X, and the width of the wedge 406 is approximately 5X to approximately 10X, or approximately 10X. The greater the width of the wedge 406 relative to its height, the more precise the adjustment of the susceptor 130 becomes.
[0036] Furthermore, referring to Figures 5A and 5B, alternative arrangements of the susceptor leveling assembly 102 are also shown. In Figure 5A, an exemplary embodiment of the present invention utilizes a gear system 502 as a first leveling mechanism 104 (e.g., first leveling mechanism 104(a)) to make more precise adjustments to the angle of the susceptor 130. For example, the first leveling mechanism 104 may comprise a first gear 504 and a second gear 506, the first gear 504 and the second gear 506 communicating with each other. In various embodiments, the first gear 504 contacts a positioning device 106. The positioning device 106 is configured to apply a gear force to the first gear 504, which translates that force to the second gear 506. The second gear 506 contacts a susceptor leveler plate 110, and the second gear is configured to apply a gear force to the susceptor leveler plate 110. In various embodiments, the gear ratio between the second gear 506 and the first gear 504 is approximately 5 to 10. The larger the gear ratio, the more the positioning device 106 needs to move to adjust the susceptor leveler plate 110, thus making the adjustment of the susceptor 130 more precise. For example, if the gear ratio is 10 and the positioning device 106 moves 3 centimeters, the susceptor leveler plate 110 moves 3 millimeters in the opposite direction.
[0037] In Figure 5B, an exemplary embodiment of the present invention utilizes a hydraulic system 512 as a first leveling mechanism 104 (e.g., first leveling mechanism 104(a)) to make more precise adjustments to the angle of the susceptor 130. For example, the first leveling mechanism 104 may comprise a first hydraulic piston 514 and a second hydraulic piston 516, the first and second hydraulic pistons 514 and 516 communicating with each other. In various embodiments, the first hydraulic piston 514 is in contact with a positioning device 106. The positioning device 106 is configured to apply force to the first hydraulic piston 514, which translates that force to the second hydraulic piston 516. The second hydraulic piston 516 is in contact with a susceptor leveler plate 110, and a second gear is configured to apply force to the susceptor leveler plate 110. In various embodiments, the hydraulic piston ratio (e.g., the ratio of the hydraulic volumes of each piston) between the second hydraulic piston 516 and the first hydraulic piston 514 is approximately 5 to 10. The larger the gear ratio, the more the positioning device 106 needs to move to adjust the susceptor leveler plate 110, thus making the adjustment of the susceptor 130 more precise. For example, if the hydraulic piston ratio is 10 and the positioning device 106 moves 3 centimeters, the susceptor leveler plate 110 moves 3 millimeters in the opposite direction.
[0038] The exemplary embodiments of this disclosure described above are merely examples of embodiments of the invention as defined by the appended claims and their legal equivalents, and do not limit the scope of the invention. Any equivalent embodiment is intended to fall within the scope of the invention. In fact, various modifications of this disclosure, in addition to those shown and described herein, such as alternative useful combinations of the described elements, may become apparent to those skilled in the art from the description. Such modifications and embodiments are also intended to fall within the scope of the appended claims. [Explanation of symbols]
[0039] 100 assemblies 102 Susceptor Leveling Assembly 104 First leveling mechanism 106 devices 107 Adjustment Mechanism Frame 108 devices 109 Assembly 110 Susceptor Leveler Plate 120 pedestals 130 Susceptors 200 Reactor System 205 Controller 210 Gas supply unit 225 First gas inlet 230 reactors 240 Substrate mounting unit 300 devices 310 Rotating bodies 320 Fixed body 325 Ball Bearings 402 Fulcrum 404 Lever Arm 500 reaction space, internal space 502 Gear System 504 First Gear 506 Second Gear 512 Hydraulic System 514 First hydraulic piston 516 Second hydraulic piston 600 Exhaust Duct 700 Exhaust Space 800 Rings 900 Second gas inlet 1000 Interior space, lower space 1300 Lower body 1600 Upper body 1900 Second gas generator
Claims
1. Susceptor leveler plate; A first positioning assembly comprising a first positioning device, wherein the first positioning device is configured to move a pedestal vertically; and, A first leveling mechanism in contact with the first positioning device and the susceptor leveler plate; A susceptor leveling assembly comprising, A susceptor leveling assembly in which the first positioning assembly is configured to adjust the angle of the susceptor leveler plate in a first direction with respect to a first plane.
2. The first positioning assembly is Second positioning device; and A second leveling mechanism, wherein the second leveling mechanism is in contact with the second positioning device and the susceptor leveler plate; Equipped with, The susceptor leveling assembly according to claim 1, wherein the second leveling mechanism is configured to adjust the angle of the susceptor leveler plate in a second direction with respect to a second plane.
3. The susceptor leveling assembly according to claim 2, wherein the first positioning device and the second positioning device are connected to a first adjustment mechanism frame.
4. The susceptor leveling assembly according to claim 3, wherein at least one of the first positioning device and the second positioning device comprises a micrometer.
5. The susceptor leveling assembly according to claim 4, further comprising a controller that communicates with the first positioning device and the second positioning device.
6. The susceptor leveling assembly according to claim 5, wherein the controller is configured to control the first positioning device to adjust the angle of the susceptor leveler plate in the first direction and / or the second direction.
7. The susceptor leveling assembly according to claim 1, wherein the first positioning assembly includes a pivot point that contacts the first leveling mechanism, and the pivot point is positioned between the proximal end and the distal end of the first leveling mechanism.
8. The susceptor leveling assembly according to claim 7, further comprising at least one of a second positioning assembly and a third positioning assembly.
9. Pedestal and; A susceptor leveling assembly, A susceptor leveler plate bonded to the pedestal; A first positioning assembly comprising a first positioning device, wherein the first positioning device is configured to move the pedestal vertically; and, A first leveling mechanism in contact with the first positioning device and the susceptor leveler plate; A susceptor leveling assembly comprising; A device equipped with, An apparatus in which the first positioning assembly is configured to adjust the angle of the susceptor leveler plate with respect to a first plane.
10. The first positioning assembly is With a second positioning device; The system comprises: the second positioning device and a second leveling mechanism in contact with the susceptor leveler plate; The apparatus according to claim 9, wherein the second leveling mechanism is configured to adjust the angle of the susceptor leveler plate with respect to the second plane.
11. The apparatus according to claim 10, wherein the first positioning device and the second positioning device are connected to the first adjustment mechanism frame.
12. The apparatus according to claim 11, wherein at least one of the first positioning device and the second positioning device comprises a micrometer.
13. The apparatus according to claim 12, wherein the susceptor leveling assembly further comprises a controller that communicates with the first positioning device and the second positioning device.
14. The apparatus according to claim 13, wherein the controller is configured to control the first positioning device to adjust the angle of the susceptor leveler plate.
15. The apparatus according to claim 9, wherein the first positioning assembly includes a pivot point that contacts the first leveling mechanism, and the pivot point is positioned between the proximal end and the distal end of the first leveling mechanism.
16. The apparatus according to claim 9, wherein the susceptor leveling assembly further comprises at least one of a second positioning assembly and a third positioning assembly.
17. Susceptor and; The pedestal attached to the susceptor; A susceptor leveling assembly, Susceptor leveler plate attached to the pedestal; A first positioning assembly comprising a first positioning device, wherein the first positioning assembly is configured to move the pedestal vertically; and, A first leveling mechanism in contact with the first positioning device and the susceptor leveler plate; A susceptor leveling assembly comprising; A reactor system comprising, A reactor system in which the first positioning assembly is configured to adjust the angle of the susceptor leveler plate with respect to a first plane.
18. The first positioning assembly is With a second positioning device; The second positioning device and the second leveling mechanism in contact with the susceptor leveler plate; Furthermore, The reactor system according to claim 17, wherein the second leveling mechanism is configured to adjust the angle of the susceptor leveler plate in a second direction with respect to a second plane.
19. The reactor system according to claim 18, wherein the first positioning assembly includes a pivot point that is in contact with the first leveling mechanism, and the pivot point is positioned between the proximal end and the distal end of the first leveling mechanism.
20. The reactor system according to claim 19, wherein the first positioning device comprises a first micrometer.