Semiconductor equipment
The semiconductor device's innovative groove structure separates IGBT and FRD regions, addressing electrostatic protection failures and improving reliability by preventing interference during manufacturing.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- HISENSE HOME APPLIANCES GRP CO LTD
- Filing Date
- 2024-12-06
- Publication Date
- 2026-07-01
AI Technical Summary
Existing semiconductor devices with stripe-shaped grooves face electrostatic protection failures at the groove edges, leading to low stability and reliability.
The semiconductor device incorporates a unique groove structure with multiple first and second grooves, connection grooves, and dummy gate grooves to separate the insulated gate bipolar transistor (IGBT) and fast recovery diode (FRD) regions, ensuring they do not interfere during manufacturing, thereby maintaining performance and reliability.
The groove structure effectively prevents interference between IGBT and FRD regions, ensuring consistent performance and enhancing the overall reliability of the semiconductor device.
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