Manufacturing equipment and manufacturing method for semiconductor devices

Abstract

The present invention provides a semiconductor device and manufacturing method that can clean semiconductor devices. [Solution] The semiconductor device manufacturing apparatus 1 comprises a dicing unit 10 that dices a semiconductor wafer WF to separate it into multiple semiconductor devices CH, a hydrogen water supply unit 33 that supplies hydrogen water HW to the multiple semiconductor devices CH for transport, a transport unit 31 that transports the multiple semiconductor devices CH immersed in the hydrogen water HW supplied by the hydrogen water supply unit 33 from the dicing unit 10, and a cleaning unit 20 that cleans the multiple semiconductor devices CH transported by the transport unit 31.

Description

Technical Field

[0001] The present invention relates to a manufacturing apparatus and a manufacturing method for semiconductor devices.

Background Art

[0002] When dicing a semiconductor wafer into a plurality of individual semiconductor devices, for example, the semiconductor wafer is attached to a dicing tape and cut by a dicing blade. At this time, the plurality of semiconductor devices are washed to remove the chips generated from the semiconductor wafer and the dicing tape.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] For example, Patent Document 1 discloses a semiconductor chip cleaning apparatus including a gas-dissolved water nozzle that injects gas-dissolved water onto the surface of a semiconductor chip and a wiping arm that wipes the surface of the semiconductor chip, and the wiping arm is provided with a cleaning liquid nozzle that flows a cleaning liquid onto the surface of the semiconductor chip.

[0005] By the way, when a semiconductor wafer is diced, cooling water such as pure water or carbonated water is sprayed onto the semiconductor wafer and the dicing blade. Therefore, the semiconductor device immediately after dicing is wet with the cooling water, but when the cooling water dries, the chips may adhere to the semiconductor device and become difficult to remove by washing.

[0006] The present invention has been made in view of such circumstances, and an object thereof is to provide a manufacturing apparatus and a manufacturing method for semiconductor devices capable of purifying semiconductor devices. [Means for solving the problem]

[0007] A semiconductor device manufacturing apparatus according to one aspect of the present invention comprises a dicing unit that dices a semiconductor wafer to divide it into a plurality of semiconductor devices, a hydrogen water supply unit that supplies hydrogen water to the plurality of semiconductor devices, a transport unit that transports the plurality of semiconductor devices immersed in the hydrogen water supplied by the hydrogen water supply unit from the dicing unit, and a cleaning unit that cleans the plurality of semiconductor devices transported by the transport unit.

[0008] A method for manufacturing a semiconductor device according to one aspect of the present invention includes: dicing a semiconductor wafer in a dicing unit to separate it into a plurality of semiconductor devices; transporting the plurality of semiconductor devices immersed in hydrogen water from the dicing unit to a cleaning unit; and cleaning the plurality of semiconductor devices in the cleaning unit. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a semiconductor device manufacturing apparatus and manufacturing method that can clean semiconductor devices. [Brief explanation of the drawing]

[0010] [Figure 1] This is a schematic diagram showing the configuration of a semiconductor chip manufacturing apparatus according to the first embodiment. [Figure 2] This is a flowchart showing a method for manufacturing a semiconductor chip according to the first embodiment. [Figure 3] This is a schematic diagram showing one step in the semiconductor chip manufacturing method according to the first embodiment. [Figure 4] This is a schematic diagram showing one step in the semiconductor chip manufacturing method according to the first embodiment. [Figure 5] This is a schematic diagram showing one step in the semiconductor chip manufacturing method according to the first embodiment. [Figure 6] This is a schematic diagram showing one step in the semiconductor chip manufacturing method according to the first embodiment. [Figure 7] This is a schematic diagram showing one step in the semiconductor chip manufacturing method according to the first embodiment. [Figure 8] This is a schematic diagram showing the configuration of a semiconductor chip manufacturing apparatus according to the second embodiment. [Figure 9] This is a schematic diagram showing one step in the semiconductor chip manufacturing method according to the third embodiment. [Figure 10] This figure shows the transport method in the semiconductor chip manufacturing method according to the fourth embodiment. [Figure 11] This figure shows the transport method in the semiconductor chip manufacturing method according to the fifth embodiment. [Modes for carrying out the invention]

[0011] Embodiments of the present invention are described below. In the following drawings, identical or similar components are represented by identical or similar reference numerals. The drawings are illustrative, and the dimensions and shapes of each part are schematic; the technical scope of the present invention should not be interpreted as being limited to these embodiments.

[0012] <First Embodiment> Figure 1 is a schematic diagram showing the configuration of a semiconductor chip manufacturing apparatus according to the first embodiment. The manufacturing apparatus 1 integrates a dicing apparatus for dicing semiconductor wafers WF and a cleaning apparatus for cleaning semiconductor chips CH. The semiconductor chip CH is an example of a semiconductor device. The manufacturing apparatus 1 includes a dicing unit 10, a cleaning unit 20, a transport mechanism 30, a water supply mechanism 40, and a housing 50.

[0013] The semiconductor wafer WF is provided to be transportable by a dicing tape DT and a dicing ring DR. The dicing tape DT is provided by a film-shaped base member and an adhesive member laminated on the base member. The semiconductor wafer WF is held on the base member of the dicing tape DT by the adhesive member of the dicing tape DT. The base member of the dicing tape DT is held by the dicing ring DR by the adhesive member of the dicing tape DT. The dicing ring DR surrounds the semiconductor wafer WF and stretches the dicing tape DT. The thickness of the dicing ring DR is larger than the thickness of the semiconductor wafer WF.

[0014] When the semiconductor wafer WF is cut by dicing, at least the base member of the dicing tape DT is not cut. The semiconductor chips CH individualized by dicing are held on the base member of the dicing tape DT by the adhesive member of the dicing tape DT, similarly to the semiconductor wafer. For this reason, the semiconductor chips CH do not scatter due to the dicing of the semiconductor wafer WF or the cleaning of the semiconductor chips CH.

[0015] The dicing unit 10 dices the semiconductor wafer WF to individualize it into semiconductor chips CH. The dicing unit 10 has a dicing stage 11, a dicing water supply unit 12, and a dicing blade 13.

[0016] The dicing stage 11 fixes the semiconductor wafer WF via the dicing ring DR. The dicing blade 13 dices the semiconductor wafer WF and individualizes it into a plurality of semiconductor chips CH.

[0017] The dicing water supply unit 12 supplies carbonated water CW used for dicing to the semiconductor wafer WF and the dicing blade 13. The dicing water supply unit 12 has a water discharge nozzle that discharges the carbonated water CW. The carbonated water CW functions as cooling water for removing the frictional heat between the dicing blade 13 and the semiconductor wafer WF. Also, the carbonated water CW suppresses the adhesion of particles such as chips to the semiconductor chip CH by reducing the charging of the semiconductor wafer WF, and also suppresses the electrostatic breakdown of the semiconductor chip CH.

[0018] Note that the water supplied by the dicing water supply unit 12 is not limited to carbonated water. The water supplied by the dicing water supply unit 12 may be, for example, hydrogen water, ammonia water, ozone water, oxygen water, chlorine water, nitrogen water, hydrogen peroxide water, carbonated water, pure water, ultrapure water, helium water, argon water, or a mixed water thereof. From the viewpoint of reducing the charging of the semiconductor wafer WF, it is desirable that the water supplied by the dicing water supply unit 12 is functional water whose specific resistance value can be adjusted.

[0019] The cleaning unit 20 cleans the semiconductor chips CH singulated in the dicing unit 10 and removes particles such as chips generated by dicing. The cleaning unit 20 has a cleaning stage 21 and a cleaning water supply unit 22.

[0020] The cleaning stage 21 fixes a plurality of semiconductor chips CH via a dicing ring DR. The cleaning stage 21 is a rotating stage and cleans the semiconductor chips CH by spin cleaning. Also, the cleaning stage 21 dries the semiconductor chips CH by spin drying.

[0021] The cleaning water supply unit 22 supplies hydrogen water HW for cleaning to multiple semiconductor chips CH. The cleaning water supply unit 22 has a discharge nozzle for discharging hydrogen water HW. The hydrogen water HW functions as a cleaning solution for cleaning the semiconductor chips CH. When cleaning the semiconductor chips CH, the hydrogen radicals in the hydrogen water HW give the semiconductor chips CH an electrical potential, causing particles to be pulled away from the semiconductor chips CH by electrical repulsion. For this reason, when hydrogen water HW is used as the cleaning solution, the cleaning effect of the semiconductor chips CH is improved compared to when pure water is used as the cleaning solution. In addition, the hydrogen radicals in the hydrogen water HW also give an electrical potential to the pulled-away particles, suppressing the re-adhesion of particles to the semiconductor chips CH. Secondarily, the generation of watermarks on the surface of the semiconductor chips CH is suppressed. Since hydrogen water HW hardly corrodes semiconductors and organic materials, when hydrogen water HW is used as the cleaning solution, damage to the semiconductor chips CH and dicing tape DT during the cleaning process is suppressed. Furthermore, when hydrogen water (HW) is used as the cleaning solution, oxidation of semiconductor chips (CH) during the cleaning process is suppressed. Since ultrapure water rinsing is unnecessary after cleaning with hydrogen water (HW), the rinsing step required when using a general cleaning solution can be omitted.

[0022] The water supplied by the cleaning water supply unit 22 is not limited to hydrogen water. The water supplied by the cleaning water supply unit 22 may be, for example, hydrogen water, ammonia water, ozonated water, oxygenated water, chlorinated water, nitrogen water, hydrogen peroxide water, carbonated water, pure water, ultrapure water, helium water, argon water, or a mixture thereof. When ammonia-added hydrogen water is used, the cleaning effect of the semiconductor chip CH is improved compared to cleaning with hydrogen water.

[0023] Furthermore, an ultrasonic oscillator may be provided in the cleaning water supply unit 22. The ultrasonic oscillator ultrasonically vibrates the water supplied by the cleaning water supply unit 22. When the oscillation frequency of the ultrasonic oscillator is around 10kHz to 100kHz, the ultrasonic oscillator generates fine bubbles originating from the cavitation phenomenon. The impact of these fine bubbles bursting removes particles from the surface of the semiconductor chip CH.

[0024] The transport mechanism 30 transports multiple semiconductor chips CH, along with the dicing tape DT and dicing ring DR, from the dicing unit 10 to the washing unit 20. The transport mechanism 30 includes a transport section 31, a drive section 32, and a hydrogen water supply section 33.

[0025] The transport unit 31 transports multiple semiconductor chips CH, which are immersed in hydrogen water HW supplied by the hydrogen water supply unit 33, from the dicing unit 10 to the washing unit 20. The transport unit 31 has a robotic arm that lifts the dicing ring DR. The mechanism for holding the dicing ring DR by the robotic arm is not particularly limited and may include, for example, a vacuum chuck, an electrostatic chuck, or a mechanical chuck. The drive unit 32 drives the transport unit 31 and moves it between the dicing stage 11 and the washing stage 21. The drive mechanism of the drive unit 32 is not particularly limited and may include, for example, an electric slider.

[0026] The hydrogen water supply unit 33 supplies hydrogen water HW to be used for transporting multiple semiconductor chips CH. The hydrogen water supply unit 33 has a discharge nozzle for discharging hydrogen water HW. The hydrogen water supply unit 33 supplies hydrogen water HW to multiple semiconductor chips CH that have been diced from a semiconductor wafer WF, immersing the multiple semiconductor chips CH in the hydrogen water HW. The hydrogen water supply unit 33 enables the semiconductor chips CH to transition from the dicing process to the washing process while remaining immersed in hydrogen water HW without drying out. The hydrogen water supply unit 33 is provided in the transport unit 31 and is configured to be movable together with the multiple semiconductor chips CH being transported.

[0027] Furthermore, the hydrogen water supply unit 33 may be equipped with an ultrasonic oscillator. The water supplied by the hydrogen water supply unit 33 may be mixed water to which additives have been added, to the extent that they do not impair the reducing power of the hydrogen water. For example, the water supplied by the hydrogen water supply unit 33 may be ammonia-added hydrogen water.

[0028] The water supply mechanism 40 supplies carbonated water CW to the dicing water supply unit 12, hydrogen water HW to the washing water supply unit 22, and hydrogen water HW to the hydrogen water supply unit 33. The water supply mechanism 40 includes an ultrapure water generation unit 41, a carbonated water generation unit 42, and a hydrogen water generation unit 43.

[0029] The ultrapure water generation unit 41 removes impurities from raw water to produce ultrapure water PW, and supplies the produced ultrapure water PW to the carbonated water generation unit 42 and the hydrogen water generation unit 43. The carbonated water generation unit 42 dissolves carbon dioxide gas in the ultrapure water PW supplied from the ultrapure water generation unit 41 to produce carbonated water CW, and supplies the produced carbonated water CW to the dicing water supply unit 12. The hydrogen water generation unit 43 dissolves hydrogen gas in the ultrapure water PW supplied from the ultrapure water generation unit 41 to produce hydrogen water HW, and supplies the produced hydrogen water HW to the washing water supply unit 22 and the hydrogen water supply unit 33.

[0030] The housing 50 forms the internal space of the dicing unit 10 and the internal space of the cleaning unit 20. The housing 50 has an outer wall 51 and a movable partition wall 52. The outer wall 51 isolates the dicing unit 10 and the cleaning unit 20 from the outside and prevents particles from flying onto the semiconductor wafer WF and semiconductor chip CH from the outside. The internal space of the dicing unit 10, which is covered by the outer wall 51, and the internal space of the cleaning unit 20, which is also covered by the outer wall 51, are configured to be connectable to each other. The movable partition wall 52 prevents particles from scattering from one of the dicing unit 10 and the cleaning unit 20 to the other. The movable partition wall 52 is configured to be switchable between an open state and a closed state. When the movable partition wall 52 is in the open state, the internal space of the dicing unit 10 and the internal space of the cleaning unit 20 are connected, and when the movable partition wall 52 is in the closed state, the internal space of the dicing unit 10 and the internal space of the cleaning unit 20 are isolated.

[0031] Next, a method for manufacturing a semiconductor chip CH using the manufacturing apparatus 1 according to the first embodiment will be described with reference to Figures 2 to 7. Figure 2 is a flowchart of the method for manufacturing a semiconductor chip according to the first embodiment. Figures 3 to 7 are schematic diagrams showing one step in the method for manufacturing a semiconductor chip according to the first embodiment.

[0032] In the manufacturing of the semiconductor chip CH, carbonated water CW and hydrogen water HW are first produced (S10). Specifically, as shown in Figure 3, ultrapure water PW is supplied from the ultrapure water generation unit 41 to the carbonated water generation unit 42 and the hydrogen water generation unit 43. Based on the supplied ultrapure water PW, carbonated water CW is produced in the carbonated water generation unit 42 and hydrogen water HW is produced in the hydrogen water generation unit 43.

[0033] Next, the semiconductor wafer WF, which has been wetted with carbonated water CW, is diced (S20). Specifically, as shown in Figure 3, carbonated water is first supplied from the dicing water supply unit 12 to the semiconductor wafer WF and the dicing blade 13. Next, the dicing blade 13, which has been wetted with carbonated water CW, is pressed against the semiconductor wafer WF, which has been wetted with carbonated water CW, to cut the semiconductor wafer WF. At this time, the movable partition wall 52 is closed to prevent carbonated water CW and particles generated by dicing from scattering into the cleaning unit 20. Carbonated water CW is continuously supplied during dicing. As shown in Figure 4, the multiple diced semiconductor chips CH are immersed in the carbonated water CW accumulated inside the dicing ring DR.

[0034] Next, the semiconductor chip CH is immersed in hydrogen water HW (S30). Specifically, as shown in Figure 4, the movable partition wall 52 is opened and the transport unit 31 is moved onto the dicing stage 11. At this time, the dicing water supply unit 12 and the dicing blade 13 are moved away from the dicing stage 11. Hydrogen water HW is supplied from above the carbonated water CW accumulated inside the dicing ring DR by the hydrogen water supply unit 33, replacing the water used to immerse the semiconductor chip CH from carbonated water CW to hydrogen water HW. As a result, the semiconductor chip CH is immersed in hydrogen water HW without coming into contact with air.

[0035] Next, the semiconductor chip CH is transported (S40). Specifically, first, as shown in Figure 5, the robot arm of the transport unit 31 is lowered to hold the dicing ring DR. Then, as shown in Figure 6, the transport unit 32 drives the transport unit 31 to transport the semiconductor chip CH from the dicing unit 10 to the washing unit 20. During this transport, the hydrogen water supply unit 33 continues to supply hydrogen water HW to prevent the semiconductor chip CH from drying out.

[0036] Next, the semiconductor chip CH is washed with hydrogen water HW (S50). Specifically, as shown in Figure 7, hydrogen water HW is supplied from the washing water supply unit 22, and the washing stage 21 is rotated to spin-wash the semiconductor chip CH. At this time, the movable partition wall 52 is closed to prevent particles removed from the hydrogen water HW and semiconductor chip CH from scattering onto the dicing unit 10.

[0037] Next, the semiconductor chip CH is dried (S60). Specifically, the cleaning stage 21 is rotated to spin-dry the semiconductor chip CH. Note that the semiconductor chip CH may also be dried by drying methods other than spin drying, such as blow drying, or by combining multiple drying methods.

[0038] As described above, the semiconductor chip CH manufacturing apparatus 1 according to one aspect of the present invention comprises a dicing unit 10 that dices a semiconductor wafer WF to form a plurality of semiconductor chips CH, a hydrogen water supply unit 33 that supplies hydrogen water HW to be used for transporting the semiconductor chips CH, a transport unit 31 that transports the plurality of semiconductor chips CH immersed in the hydrogen water HW supplied by the hydrogen water supply unit 33 from the dicing unit 10, and a cleaning unit 20 that cleans the plurality of semiconductor chips CH transported by the transport unit 31.

[0039] According to this, the semiconductor chip CH being transported from the dicing unit 10 to the washing unit 20 is immersed in hydrogen water HW and does not dry out, thus suppressing the adhesion of particles to the semiconductor chip CH. In addition, because the semiconductor chip CH is immersed in hydrogen water HW, which has reducing power, oxidation of the semiconductor chip CH can be suppressed during transport.

[0040] Furthermore, in this embodiment, the hydrogen water supply unit 33 is provided in the transport unit 31 and is configured to be movable together with the multiple semiconductor chips CH being transported.

[0041] According to this method, hydrogen water HW can be continuously supplied to the semiconductor chip CH while it is being transported. Therefore, oxidation of the semiconductor chip CH due to the degradation of hydrogen water HW can be suppressed. Furthermore, even if hydrogen water HW spills during transport, more hydrogen water HW can be added, further suppressing the drying of the semiconductor chip CH during transport.

[0042] Furthermore, in this embodiment, the manufacturing apparatus 1 is further equipped with a washing water supply unit 22 that supplies hydrogen water HW used for washing to a plurality of semiconductor chips CH.

[0043] According to this, using hydrogen water HW to clean semiconductor chips CH can improve the cleaning effect compared to cleaning with pure water. Furthermore, by providing a separate cleaning water supply unit 22 in addition to the hydrogen water supply unit 33, the arrangement and configuration of the hydrogen water supply unit 33 can be optimized for transport purposes, and the arrangement and configuration of the cleaning water supply unit 22 can be optimized for cleaning purposes.

[0044] Furthermore, in this embodiment, the manufacturing apparatus 1 further includes a dicing water supply unit 12 that supplies carbonated water CW used for dicing to a semiconductor wafer WF, and a hydrogen water supply unit 33 that replaces the carbonated water CW that comes into contact with a plurality of semiconductor chips CH with hydrogen water HW.

[0045] According to this, by using carbonated water (CW) as the cooling water during dicing of semiconductor wafers (WF), electrostatic discharge (ESD) of semiconductor chips (CH) can be suppressed. Furthermore, by replacing carbonated water (CW) with hydrogen water (HW), the semiconductor chips (CH) are immersed in the hydrogen water (HW) without coming into contact with air. Therefore, the adhesion of particles to the semiconductor chips (CH) due to drying can be further suppressed.

[0046] In this embodiment, the transport unit 31 holds the dicing ring DR and transports a plurality of semiconductor chips CH, and the hydrogen water supply unit 33 stores hydrogen water HW inside the dicing ring DR.

[0047] According to this, by using a dicing ring DR as a dam to hold back the hydrogen water HW, it is not necessary to prepare a water tank for immersing the semiconductor chip CH in the hydrogen water HW during transport. Furthermore, it is not necessary to prepare a transport unit having a chuck to hold such a water tank, and a conventional transport unit that holds the dicing ring DR can be used. As a result, the increase in the manufacturing cost of the manufacturing apparatus 1 can be suppressed, and the increase in the manufacturing cost of the semiconductor chip CH manufactured by the manufacturing apparatus 1 can also be suppressed.

[0048] Furthermore, a method for manufacturing a semiconductor chip CH according to one aspect of the present invention includes: dicing a semiconductor wafer WF in a dicing unit 10 to separate it into a plurality of semiconductor chips CH; transporting the plurality of semiconductor chips CH immersed in hydrogen water HW from the dicing unit 10 to a washing unit 20; and washing the plurality of semiconductor chips CH in the washing unit 20.

[0049] According to this, the semiconductor chip CH being transported from the dicing unit 10 to the washing unit 20 is immersed in hydrogen water HW and does not dry out, thus suppressing the adhesion of particles to the semiconductor chip CH. In addition, because the semiconductor chip CH is immersed in hydrogen water HW, which has reducing power, oxidation of the semiconductor chip CH can be suppressed during transport.

[0050] Other embodiments are described below. Components identical or similar to those shown in the first embodiment are denoted by the same or similar reference numerals, and their descriptions are omitted as appropriate. Furthermore, similar effects and benefits from similar components are not mentioned sequentially.

[0051] <Second Embodiment> Referring to Figure 8, the configuration of the semiconductor chip CH manufacturing apparatus 2 according to the second embodiment will be described. Figure 8 is a schematic diagram showing the configuration of the semiconductor chip manufacturing apparatus according to the second embodiment.

[0052] The hydrogen water supply unit 233 of the manufacturing apparatus 2 is located in the dicing unit 210, and the transport unit 231 of the transport mechanism 230 transports the semiconductor chip CH independently of the hydrogen water supply unit 233.

[0053] This allows for a simplification of the transport unit 231's configuration and improves the maintainability of the transport mechanism 230. Furthermore, it enables the supply of hydrogen water HW to the semiconductor chip CH to begin after dicing without waiting for the transport unit 231 to arrive.

[0054] Furthermore, the hydrogen water supply unit may be provided in both the transport unit and the dicing unit. This allows the hydrogen water supply units in the transport unit and the dicing unit to be differentiated according to their respective applications. For example, by providing a hydrogen water supply unit with a large water supply capacity in the dicing unit, the efficiency of replacing carbonated water with hydrogen water can be improved. Alternatively, by providing a hydrogen water supply unit in the transport unit that allows for fine adjustment of the supply amount and has high adjustment accuracy, the oversupply of hydrogen water can be suppressed. This prevents the dicing ring from falling out of the transport unit due to the weight of the hydrogen water and reduces the amount of hydrogen water discharged outside the dicing ring.

[0055] <Third Embodiment> Referring to Figure 9, the configuration of the semiconductor chip CH manufacturing apparatus 3 according to the third embodiment will be described. Figure 9 is a schematic diagram showing the configuration of the semiconductor chip manufacturing apparatus according to the third embodiment.

[0056] In the manufacturing apparatus 3, the washing water supply unit of the washing unit 320 is omitted, and the hydrogen water supply unit 333 of the transport mechanism 330 also supplies hydrogen water HW used for washing to multiple semiconductor chips CH.

[0057] According to this, the supply line of hydrogen water HW from the hydrogen water generation unit 343 in the water supply mechanism 340 can be unified, simplifying the water supply mechanism 340 and improving the maintainability of the water supply mechanism 340.

[0058] Furthermore, hydrogen water for cleaning may be supplied to multiple semiconductor chips from both the hydrogen water supply unit and the cleaning water supply unit. This improves the cleaning efficiency of the semiconductor chips.

[0059] <Fourth Embodiment> Referring to Figure 10, the configuration of the semiconductor chip CH manufacturing apparatus 4 according to the fourth embodiment will be described. Figure 10 is a diagram showing the transport method in the semiconductor chip manufacturing method according to the fourth embodiment.

[0060] In the manufacturing apparatus 4, the transport section 431 of the transport mechanism 430 holds and transports a transport water tank PL containing multiple semiconductor chips CH together with their dicing rings DR and dicing tapes DT. The transport water tank PL is a box-shaped container with an open top, and the depth of the internal space of the transport water tank PL is greater than the combined thickness of the dicing tapes DT and dicing rings DR. The hydrogen water supply section 433 stores hydrogen water HW inside the transport water tank PL and immerses the multiple semiconductor chips CH together with their dicing rings DR and dicing tapes DT in the hydrogen water HW.

[0061] According to this, the amount of hydrogen water HW in which the semiconductor chip CH is immersed becomes larger, which further effectively suppresses the drying of the semiconductor chip CH due to spillage or evaporation of the hydrogen water HW.

[0062] <Fifth Embodiment> Referring to Figure 11, the configuration of the semiconductor chip CH manufacturing apparatus 5 according to the fifth embodiment will be described. Figure 11 is a diagram showing the transport method in the semiconductor chip manufacturing method according to the fifth embodiment.

[0063] In the manufacturing apparatus 5, the transport unit 531 transports semiconductor chips CH that have been wetted with hydrogen water HW, which forms a film on its surface. The hydrogen water supply unit 533 supplies an amount of hydrogen water HW sufficient to wet the surface of the semiconductor chip CH, but less than the amount needed to fill the space inside the dicing ring DR. When the surface of the semiconductor chip CH is hydrophilic, the hydrogen water HW spreads and wets the entire surface of the semiconductor chip CH, and a small amount of hydrogen water HW can wet the entire surface of the semiconductor chip CH. At this time, by adjusting the amount of hydrogen water HW supplied, the hydrogen water HW forms a water film on the surface of the semiconductor chip CH. Therefore, compared to supplying hydrogen water HW to create a water depth exceeding the total height of the semiconductor chip CH, supplying enough hydrogen water HW to form a water film on the surface of the semiconductor chip CH can reduce the consumption of hydrogen water HW.

[0064] Some or all embodiments of the present invention are described below. However, the present invention is not limited to the embodiments described below.

[0065] [Note 1] A dicing unit that dices a semiconductor wafer to separate it into multiple semiconductor devices, A hydrogen water supply unit that supplies hydrogen water to multiple semiconductor devices, A transport unit that transports multiple semiconductor devices immersed in hydrogen water supplied by a hydrogen water supply unit from a dicing unit, A cleaning unit that cleans multiple semiconductor devices transported by the transport unit, Equipped with, Manufacturing equipment for semiconductor devices.

[0066] [Note 2] The hydrogen water supply unit is located in the transport unit and is configured to be movable together with the multiple semiconductor devices being transported. Manufacturing equipment for semiconductor devices as described in [Note 1].

[0067] [Note 3] The hydrogen water supply unit is located in the dicing unit. The transport unit transports multiple semiconductor devices independently of the hydrogen water supply unit. The manufacturing apparatus described in [Appendix 1] or [Appendix 2].

[0068] [Note 4] It further includes a cleaning water supply unit that supplies hydrogen water for cleaning to multiple semiconductor devices. A manufacturing apparatus described in any one of the following [Appendix 1] to [Appendix 3].

[0069] [Note 5] The hydrogen water supply unit also supplies hydrogen water for cleaning to multiple semiconductor devices. A manufacturing apparatus described in any one of the following: [Appendix 1] to [Appendix 4].

[0070] [Note 6] It further includes a dicing water supply unit that supplies carbonated water for dicing semiconductor wafers, The hydrogen water supply unit replaces the carbonated water in contact with multiple semiconductor devices with hydrogen water. A manufacturing apparatus as described in any one of the following: [Appendix 1] to [Appendix 5].

[0071] [Note 7] The transport unit holds the dicing ring and transports multiple semiconductor devices. The hydrogen water supply unit stores hydrogen water inside the dicing ring. A manufacturing apparatus described in any one of the following [Appendix 1] to [Appendix 6].

[0072] [Note 8] The transport unit holds and transports a transport water tank containing multiple semiconductor devices along with their dicing rings and dicing tapes. The hydrogen water supply unit stores hydrogen water inside the transport water tank and immerses multiple semiconductor devices, along with their dicing rings and dicing tapes, in the hydrogen water. A manufacturing apparatus described in any one of the following [Appendix 1] to [Appendix 6].

[0073] [Note 9] The transport unit transports multiple semiconductor devices whose surfaces are wetted with a film-like hydrogen water solution. A manufacturing apparatus described in any one of the following [Appendix 1] to [Appendix 6].

[0074] [Note 10] The dicing unit and the washing unit are configured so that their internal spaces can be connected to each other. A manufacturing apparatus described in any one of the following [Appendix 1] to [Appendix 9].

[0075] [Note 11] In a dicing unit, a semiconductor wafer is diced to separate it into multiple semiconductor devices, The process involves transporting multiple semiconductor devices immersed in hydrogen water from a dicing unit to a cleaning unit, The cleaning unit cleans multiple semiconductor devices, including, A method for manufacturing a semiconductor device.

[0076] As described above, according to one embodiment of the present invention, it is possible to provide a semiconductor device manufacturing apparatus and manufacturing method that can clean semiconductor devices.

[0077] The embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit its interpretation. The elements, arrangement, materials, conditions, shapes, and sizes of the embodiments are not limited to those exemplified and can be modified as appropriate. Furthermore, it is possible to partially substitute or combine the configurations shown in different embodiments. [Explanation of Symbols]

[0078] 1...Manufacturing equipment 10…Dicing Unit 11…Dicing Stage 12…Dicing water supply unit 13…Dicing Blade 20... Washing unit 21…Washing stage 22...Water supply unit for washing 30…Conveying mechanism 31…Conveyor Unit 32…Drive unit 33…Hydrogen water supply unit 40...Water supply mechanism 41...Ultra pure water generation section 42...Carbonated water generating unit 43…Hydrogen water generation unit 50…Cabinet 51…Exterior wall 52…Movable bulkhead DT... Dicing Tape DR... Dicing Ring WF… Semiconductor wafer CH... Semiconductor chip PW…Ultra pure water CW... Carbonated water HW... Hydrogen water

Claims

1. A dicing unit that dices a semiconductor wafer to separate it into multiple semiconductor devices, A hydrogen water supply unit that supplies hydrogen water to the plurality of semiconductor devices, A transport unit that transports the plurality of semiconductor devices immersed in hydrogen water supplied by the hydrogen water supply unit from the dicing unit, A cleaning unit for cleaning the plurality of semiconductor devices transported by the transport unit, Equipped with, Manufacturing equipment for semiconductor devices.

2. The hydrogen water supply unit is provided in the transport unit and is configured to be movable together with the plurality of semiconductor devices being transported. The apparatus for manufacturing a semiconductor device according to claim 1.

3. The hydrogen water supply unit is provided in the dicing unit, The transport unit transports the plurality of semiconductor devices independently of the hydrogen water supply unit. The apparatus for manufacturing a semiconductor device according to claim 1.

4. The system further includes a cleaning water supply unit that supplies hydrogen water for cleaning to the plurality of semiconductor devices. The apparatus for manufacturing a semiconductor device according to claim 1.

5. The hydrogen water supply unit also supplies hydrogen water to be used for cleaning the plurality of semiconductor devices. The apparatus for manufacturing a semiconductor device according to claim 1.

6. The system further comprises a dicing water supply unit that supplies carbonated water for dicing the semiconductor wafer, The hydrogen water supply unit replaces the carbonated water in which the plurality of semiconductor devices are immersed with hydrogen water. The apparatus for manufacturing a semiconductor device according to claim 1.

7. The transport unit transports the plurality of semiconductor devices while holding the dicing ring. The hydrogen water supply unit stores hydrogen water inside the dicing ring. A semiconductor device manufacturing apparatus according to any one of claims 1 to 6.

8. The transport unit holds and transports the plurality of semiconductor devices together with their dicing rings and dicing tapes in a transport water tank. The hydrogen water supply unit stores hydrogen water inside the transport water tank and immerses the multiple semiconductor devices together with the dicing ring and dicing tape in the hydrogen water. A semiconductor device manufacturing apparatus according to any one of claims 1 to 6.

9. The transport unit transports the plurality of semiconductor devices whose surfaces are wetted with hydrogen water in a film-like form. A semiconductor device manufacturing apparatus according to any one of claims 1 to 6.

10. The dicing unit and the washing unit are configured so that their internal spaces can be connected to each other. A semiconductor device manufacturing apparatus according to any one of claims 1 to 6.

11. In a dicing unit, a semiconductor wafer is diced to separate it into multiple semiconductor devices, The process involves transporting the plurality of semiconductor devices immersed in hydrogen water from the dicing unit to the cleaning unit, The cleaning unit cleans the plurality of semiconductor devices, including, A method for manufacturing a semiconductor device.

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