O-ring visual inspection apparatus and O-ring visual inspection method

The O-ring inspection apparatus uses an adhesive body on a rotatable head to securely hold O-rings for accurate and efficient inspection, addressing the challenge of inspecting mirror-like O-rings for shallow defects without deformation or contamination, enhancing inspection accuracy and efficiency.

JP2026109437APending Publication Date: 2026-07-01DAIICHI JITSUGYO VISWILL

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
DAIICHI JITSUGYO VISWILL
Filing Date
2024-12-19
Publication Date
2026-07-01

AI Technical Summary

Technical Problem

Existing O-ring inspection methods struggle to accurately inspect mirror-like O-rings for shallow defects like scratches and abrasions while maintaining the O-ring's position without deformation, contamination, or increased inspection time, especially in applications requiring high airtightness.

Method used

An O-ring inspection apparatus and method using an adhesive body on a rotatable head to securely hold the O-ring in place, ensuring a large exposed area for imaging, while minimizing physical load and maintaining orientation changes.

Benefits of technology

The solution allows for accurate and efficient inspection of O-rings by preventing deformation and contamination, ensuring a large exposed area for imaging, and improving inspection accuracy and efficiency despite individual differences in O-rings.

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Abstract

The present invention aims to provide an O-ring visual inspection device and an O-ring visual inspection method that can improve the accuracy and efficiency of visual inspection by holding the O-ring in an accurate axial position regardless of individual differences, without causing deformation, scratches, or deposits. [Solution] The O-ring appearance inspection device 1 of the present invention comprises a holding device 10 having a head portion 14 and an adhesive body 16 provided on the head portion 14 and having physical adhesive properties, and a camera 20 for imaging the O-ring K. The device is characterized by bringing the mounting surface 2 on which the O-ring K is placed and the head portion relatively close together to press the O-ring K against the adhesive body 16, holding the O-ring K in close contact with the adhesive body 16, moving the O-ring K to an imaging position P while holding the O-ring K, and imaging the O-ring K by rotating the head portion 14 around the axis C1 at the imaging position P.
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