Substrate transport apparatus, exposure apparatus, and article manufacturing method

Abstract

This technology offers advantages in suppressing the generation of shocks caused by gaps in the guides. [Solution] The substrate transport device comprises a first guide having a first guide surface including a first horizontal plane of a first height extending in the horizontal direction, a second guide surface including a second horizontal plane of a second height extending in the horizontal direction, a movable structure including a holding part capable of holding an object, and a plurality of follow parts fixed to the movable structure, moving along the first guide surface and moving along the second guide surface, wherein the first guide has a first end facing the second guide, the second guide has a second end facing the first guide, there is a gap between the first end and the second end, the first guide surface has an inclined surface between the first end and the first horizontal plane that is inclined to mitigate the height difference between the first height and the second height, or the second guide surface has an inclined surface between the second end and the second horizontal plane that is inclined to mitigate the height difference between the first height and the second height.

Description

Technical Field

[0001] The present invention relates to a substrate transfer device, an exposure device, and an article manufacturing method.

Background Art

[0002] Patent Document 1 describes a substrate stage having a transfer mechanism for transferring a substrate. The transfer mechanism has a drive unit that drives a holding unit that holds the substrate. The transfer mechanism also has a first cam follower that slides on the sliding surfaces of the first guide and the second guide as the holding unit is driven by the drive unit, and a second cam follower that slides on the sliding surface of the third guide so that the first cam follower moves from the sliding surface of the first guide to the sliding surface of the second guide.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In a substrate transfer mechanism, if there is a gap in a guide that guides a follower (tracking part) such as a cam follower, an impact may occur when the follower passes through a discontinuous part, reducing the lifespan of the substrate transfer mechanism, vibrating the substrate, or reducing the positional accuracy of the substrate.

[0005] An object of the present invention is to provide an advantageous technique for suppressing the occurrence of impact due to the gap in the guide.

Means for Solving the Problems

[0006] One aspect of the present invention relates to a substrate transport device for transporting an object horizontally, the substrate transport device comprising: a first guide having a first guide surface including a first horizontal plane of a first height extending in the horizontal direction; a second guide having a second guide surface including a second horizontal plane of a second height extending in the horizontal direction; a movable structure including a holding part capable of holding the object; and a plurality of follow parts fixed to the movable structure, moving along the first guide surface and moving along the second guide surface, wherein the first guide has a first end facing the second guide, the second guide has a second end facing the first guide, there is a gap between the first end and the second end, the first guide surface has an inclined surface between the first end and the first horizontal plane that is inclined to mitigate the height difference between the first height and the second height, or the second guide surface has an inclined surface between the second end and the second horizontal plane that is inclined to mitigate the height difference between the first height and the second height. [Effects of the Invention]

[0007] According to the present invention, an advantageous technique is provided for suppressing the generation of shock due to gaps in the guide. [Brief explanation of the drawing]

[0008] [Figure 1] A schematic diagram showing the substrate unloading section and substrate stage of the first embodiment viewed from the side. [Figure 2A] A diagram illustrating the substrate ejection operation of the substrate ejection unit in the first embodiment. [Figure 2B] A diagram illustrating the substrate ejection operation of the substrate ejection unit in the first embodiment. [Figure 2C] A diagram illustrating the substrate ejection operation of the substrate ejection unit in the first embodiment. [Figure 2D] A diagram illustrating the substrate ejection operation of the substrate ejection unit in the first embodiment. [Figure 2E] A diagram illustrating the substrate ejection operation of the substrate ejection unit in the first embodiment. [Figure 2F] A diagram illustrating the substrate ejection operation of the substrate ejection unit in the first embodiment. [Figure 2G]A diagram for explaining the substrate unloading operation of the substrate unloading unit of the first embodiment. [Figure 2H] A diagram for explaining the substrate unloading operation of the substrate unloading unit of the first embodiment. [Figure 2I] A diagram for explaining the substrate unloading operation of the substrate unloading unit of the first embodiment. [Figure 2J] A diagram for explaining the substrate unloading operation of the substrate unloading unit of the first embodiment. [Figure 2K] A diagram for explaining the substrate unloading operation of the substrate unloading unit of the first embodiment. [Figure 2L] A diagram for explaining the substrate unloading operation of the substrate unloading unit of the first embodiment. [Figure 2M] A diagram for explaining the substrate unloading operation of the substrate unloading unit of the first embodiment. [Figure 3] A schematic diagram of the substrate unloading unit of the first embodiment as viewed from above. [Figure 4] A schematic diagram showing the configuration of the cam follower in the substrate unloading unit of the first embodiment. [Figure 5] A schematic diagram showing the configuration of the cam follower in the substrate unloading unit of the first embodiment. [Figure 6A] A diagram for explaining the substrate unloading operation of the substrate unloading unit of the second embodiment. [Figure 6B] A diagram for explaining the substrate unloading operation of the substrate unloading unit of the second embodiment. [Figure 6C] A diagram for explaining the substrate unloading operation of the substrate unloading unit of the second embodiment. [Figure 6D] A diagram for explaining the substrate unloading operation of the substrate unloading unit of the second embodiment. [Figure 6E] A diagram for explaining the substrate unloading operation of the substrate unloading unit of the second embodiment. [Figure 6F] A diagram for explaining the substrate unloading operation of the substrate unloading unit of the second embodiment. [Figure 6G] A diagram for explaining the substrate unloading operation of the substrate unloading unit of the second embodiment. [Figure 6H] A diagram for explaining the substrate unloading operation of the substrate unloading unit of the second embodiment. [Figure 6I] A diagram for explaining the substrate unloading operation of the substrate unloading unit of the second embodiment. [Figure 6J]A diagram illustrating the substrate ejection operation of the substrate ejection unit in the second embodiment. [Figure 6K] A diagram illustrating the substrate ejection operation of the substrate ejection unit in the second embodiment. [Figure 6L] A diagram illustrating the substrate ejection operation of the substrate ejection unit in the second embodiment. [Figure 6M] A diagram illustrating the substrate ejection operation of the substrate ejection unit in the second embodiment. [Figure 7] A schematic top view showing the circuit board placed on the buffer stand. [Figure 8] A schematic top view showing the substrate ejection section and the ωz stopper. [Figure 9] A flowchart illustrating the operation of the exposure apparatus. [Modes for carrying out the invention]

[0009] The embodiments will be described in detail below with reference to the attached drawings. Note that the following embodiments do not limit the invention as defined in the claims. While the embodiments describe multiple features, not all of these features are essential to the invention, and the features may be combined in any way. Furthermore, in the attached drawings, identical or similar configurations are given the same reference numerals, and redundant descriptions are omitted.

[0010] Figure 1 is a schematic diagram showing the configuration of the substrate unloading device 40 and substrate stage mechanism STG of the first embodiment as viewed from the side. Here, the substrate unloading device 40 and substrate stage mechanism STG applied to an exposure apparatus for transferring a pattern from a master plate onto a large substrate such as a glass substrate for manufacturing display devices are described. Also, in this specification and the accompanying drawings, directions are indicated according to the XYZ coordinate system. The XY plane is parallel to the horizontal plane, and the upward direction in the vertical direction is the positive direction of the Z axis. In the following description, the X-axis direction, Y-axis direction, and Z-axis direction are directions parallel to the X, Y, and Z axes, respectively. The X-axis direction includes the -X direction and the +X direction, the Y-axis direction includes the -Y direction and the +Y direction, and the Z-axis direction includes the -Z direction and the +Z direction.

[0011] First, the components of the substrate unloading device 40 and the substrate stage mechanism STG will be described. The substrate P is the object to be transported and is mounted on the mounting platform 20. The X movable part 30 is positioned on the Y movable part 50 via an air bearing 301 and is driven in the X-axis direction by an actuator such as a linear motor (not shown). The mounting platform 20 is fixed to the X movable part 30 by mounting platform supports 201 and 202. The Y movable part 50 is positioned on the Y guide 60 via an air bearing 501 and is driven in the Y-axis direction by an actuator such as a linear motor (not shown). The substrate unloading device 40 is a substrate transport device configured to unload the substrate P after exposure and is positioned on the X movable part 30. The substrate unloading device 40 performs the operation of unloading the substrate P from the mounting platform 20 to the buffer platform 70. The buffer platform 70 has a base plate 701 and buffer pins 702 and is configured to receive the substrate P unloaded from the substrate unloading device 40 with the buffer pins 702. The substrate ejection device 40 is driven by the drive unit 80.

[0012] Next, the components of the substrate unloading device 40 of the first embodiment will be described with reference to Figure 2A. The Y guide 401 is positioned on the X movable part 30, and the Y sliding part 402 moves in the Y axis direction along the Y guide 401. The Z guide 403 is connected to the Y sliding part 402, and the Z sliding part 404 moves in the Z axis direction along the Z guide 403. The Z sliding part 404 is connected to the unloading base 406 via the rotating guide part 405. The unloading base 406 is rotatable around the X axis with respect to the Z sliding part 404, with respect to the rotating guide part 405.

[0013] Cam followers 409, 410, 411, 412, and 413 are connected to the discharge base 406, and each cam follower is positioned at a distance from each other with respect to the X and Y axes. Cam followers 409 and 410 are in contact with guide rails 414, 415, and 416. Cam followers 411 and 412 are in contact with guide rails 417, 418 and guide rails 703 and 704.

[0014] Guide rail 418 can be understood as a first guide having a first guide surface G1 including a first horizontal plane 421 of a first height extending horizontally. Guide rail 703 can be understood as a second guide having a second guide surface G2 including a second horizontal plane 422 of a second height extending horizontally. Cam followers 411, 412 are fixed to a movable structure MB including holding parts 408, 419 and an unloading base 406 capable of holding the substrate P. Cam followers 411, 412 can be understood as a plurality of follower parts that move along the first guide surface G1 of guide rail 418 (first guide) and along the second guide surface G2 of guide rail 704 (second guide). The follower parts may be, for example, roller followers, air bearings, etc. Guide rail 418 (first guide) has a first end E1 facing guide rail 703 (second guide), and guide rail 703 (second guide) has a second end E2 facing guide rail 418 (first guide). There is a discontinuity 10 (gap) between the first end E1 and the second end E2. The first guide surface G1 has an inclined surface 431 between the first end E1 and the first horizontal surface 421 that is inclined to mitigate the height difference between the first height and the second height. Here, inclining to mitigate the height difference means that if the first height is higher than the second height, the surface inclins downward from the first guide surface G1 towards the second guide surface G2. Conversely, if the first height is lower than the second height, inclining to mitigate the height difference means that the surface inclins upward from the first guide surface G1 towards the second guide surface G2. The movable structure MB can be driven by a drive unit 80 so that the cam followers 411 and 412 move along the first guide surface G1 and then along the second guide surface G2. The spacing between the cam followers 411 and 412 as multiple followers is greater than the discontinuity 10 (gap). Also, the spacing between the cam followers 411 and 412 is greater than the sum of the length of the inclined surface 431 in the Y-axis direction (horizontal direction) and the discontinuity 10 (gap).

[0015] Cam follower 413 contacts guide rail 705. Guide rails 414-418 are installed on X movable part 30, and guide rails 703-705 are installed on buffer base 70. The discharge base 406 receives a force in the +Z direction from compression spring 407. As a result, the contact surfaces of cam followers 409, 410 and guide rails 414-416 receive a force in the +Z direction from cam followers 409, 410, allowing cam followers 409-410 to move along the shape of guide rails 414-416. In addition, the portion of the discharge base 406 that is away from the rotation guide part 405 and compression spring 407 in the -Y direction (specifically, the portion where cam followers 411, 412, and 413 are installed in Figure 2A) receives a force due to its weight in the -Z direction with the rotation guide part 405 as the center of rotation. However, the weight of the unloading base 406 is supported by the contact surfaces between the cam followers 411, 412, and 413 and the guide rails 417, 418, 703, 704, and 705. This configuration allows the cam followers 411, 412, and 413 to be driven along the shape of the guide rails 417, 418, 703, 704, and 705. With this configuration, the unloading base 406 is supported at both ends by any two of the cam followers 409 to 413, thus reducing vibration in the Z-axis direction during the period when the unloading base 406 is unloading substrates.

[0016] However, a discontinuity 10 (gap) exists between the guide rails 417 and 418 installed on the X movable part 30 and the guide rails 703 and 704 installed on the buffer stand 70. In addition, although the buffer stand 70 can be positioned and installed relative to the substrate unloading device 40 and the substrate stage mechanism STG, a step difference may occur between the guide rails 417 and 418 and the guide rails 703 and 704 due to processing errors or installation errors. This step difference may cause the cam follower 412 and the guide rail 703 to collide and generate an impact force, which may cause vibrations in the Y and Z directions in the unloading base 406, potentially reducing the durability of the substrate unloading device 40 and the positional accuracy of substrate transport.

[0017] In this embodiment, the substrate unloading device 40 is configured such that even if processing errors or installation errors exist as described above, the horizontal planes of the guide rails 703 and 704 are positioned lower than the horizontal planes of the guide rails 417 and 418. In this embodiment, an inclined surface 431 is provided at the downstream end of the guide rail 418 (the end on the buffer stand 70 side), and as described later, the impact force can be reduced by the cam follower 411 moving along the inclined surface 431. Preferably, the shape of the inclined surface 431 of the guide rail 418 satisfies the condition that the inclination angle is 1 degree or more and 5 degrees or less, in which case the cam follower 411 moves along the inclined surface 431 of the guide rail 418.

[0018] Alternatively, let Z be the height difference between the first horizontal plane 421 of the guide rail 418 and the second horizontal plane 422 of the guide rail 703, let v be the velocity of the movable structure MB, and let Y be the length of the inclined surface 431 in the Y-axis direction (horizontal direction). Also, let y (0 ≤ y ≤ Y) be the distance traveled by the movable structure MB at time t, let z be the height of the inclined surface 431 at position y, and let g be the acceleration due to gravity. In this case, the shape of the inclined surface 431 of the guide rail 418 is: z≧1 / 2×g×(y / v) 2 It is preferable that the curved shape satisfies the following condition. This curved shape is a curve that shows the horizontal projection of the cam follower 411. Here, the height of the cam follower 411 at position y (=v × t) is z = 1 / 2 × gt 2 As shown, if the inclined surface 431 of the guide rail 418 is at a position lower than z, the cam follower 411 will not move along the inclined surface 431. Therefore, the cam follower 413 and the guide rail 703 may collide.

[0019] Returning to the description of the components of the substrate unloading device 40, the holding parts 408 and 419 are configured to hold the substrate P and are positioned on the upper surface of the unloading base 406. Since the substrate unloading device 40 drives the substrate P in the horizontal direction with high acceleration, it is preferable that the holding parts 408 and 419 generate a high frictional force against the substrate P to prevent the substrate P from slipping on the holding parts 408 and 419.

[0020] Figure 3 shows the positional relationship in the X direction of the cam followers 409-413 and the guide rails 414-418, 703-705. Figure 3 is a schematic diagram of the substrate unloading device 40 viewed from the +Z direction. As shown in Figure 3, the cam followers 411 and 412, 413 are positioned at a distance from each other in the X-axis direction, and the cam followers 409 and 410 are also positioned at a distance from each other in the X-axis direction. In this embodiment, the cam followers 412, 413 are positioned further in the -X direction than the cam follower 411, and the cam follower 410 is positioned further in the -X direction than the cam follower 409. The guide rails 417, 418 have wide sliding surfaces in the X-axis direction so as to contact both the cam followers 411, 412, while the guide rails 703, 704 have sliding surfaces that contact only the cam follower 412. Furthermore, guide rail 705 has a sliding surface that contacts only cam follower 413. Guide rail 414 has a wide sliding surface in the X-axis direction so as to contact both cam followers 409 and 410, guide rail 415 has a sliding surface that contacts only cam follower 409, and guide rail 416 has a sliding surface that contacts only cam follower 410.

[0021] Before describing the loading operation of the substrate loading device 40, the roles and details of the cam followers 409 to 413 will be explained. Cam follower 410 is responsible for moving the loading base 406 in the -Z direction, as shown in Figure 2G, and cam follower 409 is responsible for maintaining the position of the loading base 406 in the Z direction, as shown in Figure 2H. In the state shown in Figure 2G, cam follower 409 is in contact with the upper surface of the guide rail 415, but as will be described later, cam follower 409 avoids the guide rail 415 and is configured not to hinder the movement of the loading base 406 in the -Z direction. Furthermore, as will be described later, cam follower 409 operates in a way that prevents the loading base 406 from moving in the Z-axis direction without guidance.

[0022] Figure 4 shows the detailed configuration of the cam follower 409 and cam follower 410 in this embodiment. As shown in Figure 4(a), the cam follower 409 is connected to the deflection Z movable part 409a. The deflection Z movable part 409a moves in the Z-axis direction along the deflection Z guide 409b, which is fixed to the discharge base 406. One end of the deflection compression spring 409c is connected to the discharge base 406, and the other end is connected to the deflection Z movable part 409a. The Z stopper 409d is also fixed to the discharge base 406 and is positioned so that the upper surface of the Z stopper 409d and the lower surface of the deflection Z movable part 409a are in contact. In this configuration, as shown in Figure 4B, when an external force in the +Z direction is applied to the cam follower 409, the deflection compression spring 409c is compressed, and the cam follower 409 and the deflection Z movable part 409a move in the +Z direction along the deflection Z guide 409b. On the other hand, when the external force is removed, the cam follower 409 and the deflection Z movable part 409a move in the -Z direction due to the repulsive force of the deflection compression spring 409c. As a result, as shown in Figure 4(a), the cam follower 409 and the deflection Z movable part 409a come to rest at the position where the mechanical stopper 409d and the deflection Z movable part 409a come into contact. In this way, the Z-direction position of the cam follower 409 and the deflection Z movable part 409a always returns to the same position even when subjected to an external force.

[0023] As shown in Figure 4(a), the cam follower 410 is connected to the deflection Z movable part 410a. The deflection Z movable part 410a moves in the Z direction along the deflection Z guide 410b, which is fixed to the discharge base 406. One end of the deflection tension spring 410c is connected to the discharge base 406, and the other end is connected to the deflection Z movable part 410a. The mechanical stoppers 410d and 410e are also fixed to the discharge base 406, and are positioned so that the upper surface of the mechanical stopper 410d is in contact with the lower surface of the deflection Z movable part 410a, and the lower surface of the mechanical stopper 410e is in contact with the upper surface of the deflection Z movable part 410a. In this configuration, as shown in Figure 4(b), when an external force in the -Z direction is applied to the cam follower 410, the deflection tension spring 410c is pulled, and the cam follower 410 and the deflection Z movable part 410a move in the -Z direction along the deflection Z guide 410b. On the other hand, when the external force is removed, the cam follower 410 and the deflection Z movable part 410a move in the +Z direction due to the repulsive force of the deflection compression spring 410c. As a result, as shown in Figure 4(a), the cam follower 410 and the deflection Z movable part 410a come to rest at the position where the mechanical stopper 410e and the deflection Z movable part 410a are in contact. In this way, the Z-axis position of the cam follower 410 and the deflection Z movable part 410a always returns to the same position even when subjected to an external force. With this configuration, as shown in Figures 2B to 2H, when the guide rail 414 and the cam follower 410 come into contact, the state shown in Figure 4(b) is reached, and the force of the compression spring 407 can be received at the contact point between the mechanical stopper 410d and the deflection Z movable part 410a.

[0024] Cam follower 412 supports the weight of the loading base 406 when the loading device 40 is positioned on the loading stage mechanism STG side and the buffer stand 70 side. When cam follower 412 passes through the discontinuity section 10, cam follower 411 supports the weight of the loading base 406. With this configuration, even when cam followers 411 and 412 pass through the discontinuity section 10, either cam follower 411 or 412 can support the weight of the loading base 406. In the state shown in Figure 2L, cam follower 412 contacts the lower surface of the guide rail 418, but the configuration described below avoids the guide rail 418 and does not obstruct the movement of the loading base 406 in the -Z direction. Furthermore, cam follower 413 has the configuration described below to prevent unguided driving in the Z-axis direction when the loading device 40 performs a loading operation, as shown in Figures 2F to 2G.

[0025] Figure 5 shows the details of the configuration of the cam follower 412 and cam follower 413 in this embodiment. As shown in Figure 5(a), the cam follower 412 is connected to the deflection Z movable part 412a. The deflection Z movable part 412a moves in the Z-axis direction along the deflection Z guide 412b, which is fixed to the discharge base 406. One end of the deflection tension spring 412c is connected to the discharge base 406, and the other end is connected to the deflection Z movable part 412a. The mechanical stopper 412d is also fixed to the discharge base 406 and is positioned so that the lower surface of the mechanical stopper 412d and the upper surface of the deflection Z movable part 412a are in contact. With this configuration, as shown in Figure 5(b), when an external force in the -Z direction is applied to the cam follower 412, the deflection tension spring 412c is pulled, and the cam follower 412 and the deflection Z movable part 412a move in the -Z direction along the deflection Z guide 412b. On the other hand, when the external force is removed, the cam follower 412 and the deflection Z movable part 412a move in the -Z direction due to the repulsive force of the deflection compression spring 412c. As a result, as shown in Figure 5(a), the cam follower 412 and the deflection Z movable part 412a come to rest at the position where the mechanical stopper 412d and the deflection Z movable part 412a come into contact. In this way, the Z-axis position of the cam follower 412 and the deflection Z movable part 412a always returns to the same position even when subjected to an external force.

[0026] As shown in Figure 5(a), the cam follower 413 is connected to the deflection Z-movable part 413a. The deflection Z-movable part 413a moves in the Z-axis direction along the deflection Z-guide 413b, which is fixed to the discharge base 406. One end of the deflection compression spring 413c is connected to the discharge base 406, and the other end is connected to the deflection Z-movable part 413a. The mechanical stoppers 413d and 413e are also fixed to the discharge base 406, and are positioned so that the upper surface of the mechanical stopper 413d is in contact with the lower surface of the deflection Z-movable part 413a, and the lower surface of the mechanical stopper 413e is in contact with the upper surface of the deflection Z-movable part 413a. With this configuration, as shown in Figure 5(b), when an external force in the +Z direction is applied to the cam follower 413, the deflection tension spring 413c is compressed, and the cam follower 413 and the deflection Z movable part 413a move in the +Z direction along the deflection Z guide 413b. On the other hand, when the external force is removed, the cam follower 413 and the deflection Z movable part 413a move in the -Z direction due to the repulsive force of the deflection compression spring 413c. As a result, as shown in Figure 5(a), the cam follower 413 and the deflection Z movable part 413a come to rest at the position where the mechanical stopper 413d and the deflection Z movable part 413a are in contact. In this way, the Z-axis position of the cam follower 413 and the deflection Z movable part 413a always returns to the same position even when subjected to an external force. Furthermore, with this configuration, when the guide rail 705 and the cam follower 413 come into contact, as shown in Figures 2E to 2G, the state shown in Figure 5(b) is reached, and the weight of the transport base 406 is supported by the contact between the mechanical stopper 413e and the deflection Z movable part 413a.

[0027] The substrate unloading operation of the substrate unloading device 40 in this embodiment, particularly the position of the substrate unloading device 40 when it moves, will be described below with reference to Figures 2A-2M. Figure 2A shows the substrate unloading device 40 in its home position. At this time, the substrate unloading device 40 is in a standby position, and the upper surfaces of the holding parts 408 and 419 are lower than the upper surface of the mounting base 20. When the substrate unloading operation starts, the Y sliding part 402 moves in the -Y direction along the Y guide 401, as shown in Figure 2A. Along with this, the Z guide 403, Z sliding part 404, unloading base 406, and cam followers 409-413 connected to the Y sliding part 402 also move in the -Y direction. Cam followers 409 and 412 move along the sliding surfaces of the guide rail 414 and guide rail 418, respectively.

[0028] As shown in Figure 2B, when the Y-sliding part 402 moves further in the -Y direction, the cam followers 412 and 409 move in the +Z direction along the guide rails 418 and 414, respectively. Then, the unloading base 406 and Z-sliding part 404, which are connected to the cam followers 412 and 409, move in the +Z direction along the Z-guide 403. The amount of movement in the Z-axis direction at this time depends on the shape of the guide rails 418 and 414, and the upper surfaces of the holding parts 408 and 419 become higher than the upper surface of the mounting base 20. Furthermore, when the substrate unloading device 40 unloads the substrate P, the shape of the guide rails 418 and 414 can be designed so that the substrate P and the mounting base 20 do not come into contact due to the Z-direction deflection of the substrate P. When the upper surfaces of the holding parts 408 and 419 come into contact with the lower surface of the substrate P, the substrate P is held by the holding parts 408 and 419, and the substrate P is lifted in the +Z direction according to the amount of movement of the guide rails 418 and 414 in the Z-axis direction.

[0029] As shown in Figure 2C, as the Y-sliding section 402 moves further in the -Y direction, the cam followers 409, 410, and 412 move along the sliding surfaces of the guide rails 414 and 418. This causes the transport base 406 and the holding sections 408 and 419 to move in the -Y direction while maintaining the height shown in Figure 2C. The cam follower 412 then passes through the discontinuity 10, but the weight of the transport base 406 is supported by the contact between the cam follower 411 and the guide rail 418. The shape of the guide rail 418 and the spacing between the cam followers 411 and 412 can be designed so that the cam follower 411 moves along the smooth sliding surface of the guide rail 418 before the cam follower 413 leaves the sliding surface of the guide rail 418 and reaches above the discontinuity 10. Furthermore, in order to prevent the substrate P from shifting horizontally, the acceleration of the Y sliding part 402 can be set such that the frictional force at the contact surface between the substrate P and the holding parts 408 and 419 is greater than the inertial force associated with the movement.

[0030] As shown in Figure 2D, when the Y-sliding part 402 moves further in the -Y direction, the cam follower 411 moves along the sliding surface of the guide rail 418. When moving on the inclined surface 431 at the downstream end of the guide rail 418, the discharge base 406 rotates around the X axis by the rotating guide part 405 and tilts in a counterclockwise direction, allowing the cam follower 411 to move along the inclined surface 431 of the guide rail 418. In addition, the height of the downstream end of the guide rail 418 (the end of the inclined surface 431) can be made lower than the height of the guide rail 703. This allows the cam follower 411 to move along the sliding surface of the guide rail 418 until it comes into contact with the guide rail 703, and reduces the impact when the cam follower 412 and the guide rail 703 come into contact.

[0031] As shown in Figure 2E, when the Y sliding part 402 moves further in the -Y direction, the cam follower 412 moves along the sliding surface of the guide rail 703, and the unloading base 406 and the holding parts 408 and 419 move in an oblique position, similar to the state in Figure 2D. As a result, the cam follower 413 and the guide rail 705 come into contact. At this time, the configuration shown in Figure 5 allows the guide rail 705 to be avoided without hindering the movement of the substrate unloading device 40. In addition, when the cam follower 413 is in the state shown in Figure 5(b), the weight of the unloading base 406 can be supported at the contact point between the mechanical stopper 413e and the Z movable part 413a for avoidance.

[0032] As shown in Figure 2F, when the Y-sliding part 402 moves further in the -Y direction, the cam follower 412 disengages from the sliding surface of the guide rail 703, so that the cam follower 413 supports the weight of the transport base 406.

[0033] As shown in Figure 2G, when the Y-sliding part 402 moves further in the -Y direction, the cam followers 413 and 409 move in the -Z direction along the sliding surfaces of the guide rails 414 and 705, respectively. As a result, the unloading base 406, the holding parts 408, 419, and the Z-sliding part 404 move in the -Z direction along the Z-guide 403. At this time, the upper surfaces of the holding parts 408 and 419 become lower than the upper surface of the buffer pin 702, and the substrate P is transferred from the holding parts 408 and 419 of the substrate unloading device 40 to the buffer stand 70. While the holding parts 408 and 419 are holding the substrate P, the substrate P, the unloading base 406, and the Z-sliding part 404 move with acceleration in the -Z direction, so the normal force acting on the substrate P is reduced, and the frictional force is also reduced. Therefore, the acceleration of the Y-sliding part 402 can be set so that the substrate P does not move horizontally on the holding parts 408 and 419. Furthermore, as the unloading base 406 moves in the -Z direction, the cam follower 412 comes into contact with the guide rail 704, causing the cam follower 412 to support the weight of the unloading base 406.

[0034] As shown in Figure 2H, when the Y sliding part 402 moves further in the -Y direction, the cam follower 413 falls off the sliding surface of the guide rail 705, and the cam follower 412 supports the weight of the unloading base 406. The height of the guide rail 704 is set so that the sliding surface of the cam follower 412 and the guide rail 704 come into contact before the cam follower 413 falls off the sliding surface of the guide rail 705. Furthermore, the mechanism shown in Figure 5 causes the cam follower 413 to move in the -Z direction until the lower surface of the deflection Z movable part 413a comes into contact with the upper surface of the mechanical stopper 413. As a result, even when the substrate unloading device 40 moves in the +Y direction and returns to the substrate stage mechanism STG, the cam follower 413 and the guide rail 705 do not come into contact.

[0035] As shown in Figure 2I, when the Y-sliding part 402 moves in the +Y direction, the cam followers 409 and 412 move along the sliding surfaces of the guide rails 415 and 704, respectively, and the transport base 406 and holding parts 408 and 419 move while maintaining the height shown in Figure 2H. Then, the cam follower 411 comes into contact with the guide rail 417 and moves along the sliding surface of the guide rail 417. Here, as shown in Figure 2I, by providing an inclined surface 431 at the downstream end of the guide rail 417, the impact force when the cam follower 411 comes into contact with the guide rail 417 can be reduced. The spacing between the cam followers 411 and 412, and the spacing between the guide rails 417 and 705 can be designed so that the cam follower 411 moves along the sliding surface of the guide rail 417 before the cam follower 412 falls from the guide rail 704 and passes through the discontinuity 10.

[0036] As shown in Figures 2J and 2K, as the Y-sliding portion 402 moves further in the +Y direction, the cam follower 411 or 412 moves along the sliding surface of the guide rail 417. The shape of the guide rail 417 can be designed such that the retaining portions 408 and 419 are at a height that prevents them from contacting the substrate P.

[0037] As shown in Figure 2L, when the Y sliding part 402 moves further in the +Y direction, the cam follower 411 moves along the sliding surface of the guide rail 417, and therefore the cam follower 411 moves in the +Z direction. However, since the cam follower 409 is in contact with the sliding surface of the guide rail 414, the unloading base 406 tilts around the rotating guide part 405. At this time, the cam follower 412 comes into contact with the lower surface of the guide rail 418, but the configuration shown in Figure 5 allows it to avoid the guide rail 418 without interfering with the driving of the substrate unloading device 40.

[0038] As shown in Figure 2M, when the Y-sliding part 402 moves in the -Y direction, the cam follower 409 moves along the sliding surface of the guide rail 414, and the cam follower 411 moves along the sliding surface of the guide rail 417. At this time, the cam follower 411 falls off the sliding surface of the guide rail 417, but it can return to the origin position shown in Figure 2(a) by contact between the cam follower 412 and the sliding surface of the guide rail 418. The spacing between the cam followers 411 and 412, and the spacing between the guide rails 417 and 418 can be designed to enable this.

[0039] According to this embodiment, an inclined surface 431 is provided at the downstream end of the guide rail 418, and the cam follower 411 moves along the inclined surface 431, thereby reducing the impact force when the cam follower 412 passes through the discontinuity 10 and comes into contact with the guide rail 703. This prevents a decrease in the durability of the substrate unloading device 40 and the positional accuracy of the transport of the substrate P.

[0040] The drive unit 80 can drive the substrate unloading device 40 by means of, for example, a linear motor, a ball screw, or a wire drive. By holding the substrate P with the holding parts 408 and 419 having a high coefficient of friction, vacuum suction is not required, and thus tubes are also not required, which reduces the design difficulty and the risk of dust generation.

[0041] The substrate unloading device 40 of the second embodiment will be described below. Matters not mentioned in the description of the second embodiment may be the same as those of the first embodiment. Figures 6A to 6M are diagrams showing the substrate unloading operation of the substrate unloading device 40 of the second embodiment. Components that operate in the same way as in the first embodiment are given the same numbers and their descriptions are omitted. In the second embodiment, the substrate unloading device 40 is configured such that even if there are processing errors or installation errors, the horizontal planes of the guide rails 703 and 704 are installed at a higher position than the horizontal planes of the guide rails 417 and 418. In addition, in the second embodiment, an inclined surface 432 is provided at the upstream end (the end on the substrate stage mechanism STG side) of the guide rails 703 and 704. In addition, in the second embodiment, the second guide surface G2 has an inclined surface 432 between the second end E2 and the second horizontal plane 422 that is inclined to mitigate the height difference between the first height of the first horizontal plane 421 and the second height of the second horizontal plane 422. The spacing between the cam followers 411 and 412 is greater than the sum of the length of the inclined surface 432 and the discontinuity 10 (gap) in the Y-axis direction (horizontal direction).

[0042] The substrate removal operation shown in Figures 6A and 6B is the same as the substrate removal operation shown in Figures 2A and 2B of the first embodiment. After the state shown in Figure 6B, when the Y sliding part 402 moves further in the -Y direction as shown in Figure 6C, the cam follower 412 passes through the discontinuity 10 and comes into contact with the inclined surface 432 of the guide rail 703, thereby reducing the impact force at the time of contact. The inclination angle of the inclined surface 432 is preferably, for example, 1 degree or more and 5 degrees or less.

[0043] The substrate unloading operation shown in Figure 6D is similar to the operation shown in Figure 2I of the first embodiment. However, in the second embodiment, the horizontal plane of the guide rail 703 is higher than the horizontal plane of the guide rail 418. Therefore, when the cam follower 412 moves along the horizontal plane of the guide rail 703, the unloading base 406 is tilted clockwise around the X axis by the rotating guide 405.

[0044] The substrate removal operation shown in Figures 6E to 6G is the same as the operation shown in Figures 2E to 2G of the first embodiment. The substrate removal operation shown in Figure 6I is similar to the operation shown in Figure 6I of the first embodiment. However, in the second embodiment, the cam follower 412 moves along the inclined surface 432 of the guide rail 704, thereby reducing the impact force when the cam follower 411 contacts the sliding surface of the guide rail 417.

[0045] The substrate removal operation shown in Figures 6J to 6M is the same as the substrate removal operation shown in Figures 2J to 2M of the first embodiment.

[0046] The following are supplementary details to the descriptions of the first and second embodiments.

[0047] The cam followers 411 and 412 may move along different running surfaces rather than the same running surface. For example, the guide rail for cam follower 411 and the guide rail for cam follower 412 may be positioned at different heights from each other.

[0048] If the cam followers 409-413 and guide rails 414-418, 703-705 are positioned on only one side of the center of the Y-axis of the unloading base 406, a moment is generated due to the load of the compression spring 407 and the weight of the unloading base 406. This causes the unloading base 406 to tilt in the ωy direction (direction of rotation around the Y-axis). This tilt applies a force in the ωy direction to the Z guide 403 and the Y sliding part 402, which may reduce their durability. Therefore, it is preferable to position the cam followers 409-413 and guide rails 414-418, 703-705 symmetrically with respect to an axis passing through the X-axis of the center of the Y-axis of the unloading base 406, thereby suppressing the tilt of the unloading base 406 in the ωy direction.

[0049] Figure 7 shows an example of the configuration of the substrate unloading device 40 and the substrate stage mechanism STG as viewed from above when the substrate P is placed on the buffer stand 70. As shown in Figure 7, the mounting stand 20 is divided into multiple parts that are separated from each other in the X direction, and the substrate unloading device 40 can be configured to move in the Z direction through the gaps in the divided mounting stand 20. When the substrate P is unloaded by the substrate unloading device 40, the amount of deformation of the substrate P in the Z direction may depend on the number of substrate unloading devices 40 and their positions in the X and Y directions, the number of holding parts 408 and 419, the contact area between the holding parts 408 and 419 and the substrate P, and their positions in the X and Y directions. The amount of movement of the unloading base 406 and the Z sliding part 404 in the Z direction may be set to be greater than the amount of deformation of the substrate P.

[0050] As illustrated in Figure 8, the X movable part 30 can be in standby position at its furthest point in the +X direction. An X mechanical stopper can be positioned to prevent the X movable part 30 from moving in the +X direction in the standby position. By performing the substrate ejection operation of the substrate ejection device 40 in the standby position, even if the substrate stage mechanism STG malfunctions due to an error, the substrate P and the X bar mirror 90 will not interfere with each other. Therefore, the transfer position of the substrate P in the Y direction may be set to coincide with the Y direction position of the X bar mirror 90. By determining the transfer position in this way, the drive stroke in the Y-axis direction of the substrate ejection device 40 can be reduced, and an increase in the Y-direction external size of the X movable part 30 can be avoided.

[0051] When the unloading base 406 and the Z-sliding part 404 are fixed only to the Z-guide 403, their rigidity in the ωz direction (rotational direction around the Z-axis) is low. Therefore, when transporting substrates at high speed, the acceleration and disturbances cause ωz rotation of the unloading base 406 and the Z-sliding part 404, which can lead to collisions between the unloading base 406 and the mounting platform 20, resulting in the risk of component damage and dust generation. To prevent such collisions, it is advisable to install an ωz stopper 100 on the substrate stage mechanism STG and the buffer platform 70, as shown in Figure 8(a). The clearance between the ωz stopper 100 and the end face of the unloading base 406 should be smaller than the clearance between the end face of the unloading base 406 and the end face of the mounting platform 20. As a result, even if the discharge base 406 and the Z sliding part 404 rotate in the ωz direction due to an external force, the discharge base 406 and the Z sliding part 404 will not collide with the mounting base 20, but will collide with the ωz stopper 100. The ωz stopper 100 is preferably a rotating body such as a roller, and the surface (contact surface) of the ωz stopper 100 is preferably made of a low-dusting material such as ultra-high molecular weight polyethylene. In order to mitigate the impact force in the collision between the discharge base 406 and the ωz stopper 100, the tip shape of the discharge base 406 in the -Y direction is preferably tapered as shown in Figure 8(b).

[0052] Figure 9 illustrates the operation after the exposure of one substrate P is completed in an exposure apparatus equipped with a substrate unloading device 40 and a substrate stage mechanism STG according to the first and second embodiments. When the exposure of the substrate P is completed in step S901, in step S902 the substrate stage mechanism STG moves the substrate P to the substrate unloading position. Next, in step S903 the substrate is unloaded onto the buffer table 70 by the substrate unloading device 40 as described above. Next, in step S904 the substrate unloading device 40 is stored in the substrate stage mechanism STG. After that, in step S905 the next substrate P is loaded onto the mounting table 20, and in step S906 the next substrate P is exposed. It is possible.

[0053] The following describes a method for manufacturing articles using the above-described exposure apparatus. The article manufacturing method may include an exposure step of exposing a substrate P with the above-described exposure apparatus, an unloading step of unloading the substrate P that has undergone the exposure step from the exposure apparatus, and a processing step of obtaining an article by processing the substrate P that has undergone the unloading step. The substrate P unloaded in the unloading step may be transported to, for example, a developing apparatus, where a developing step may be performed. The processing step may include, for example, a developing step, and may also include an etching step, a sealing step, a dicing step, and so on.

[0054] The present invention and its specification may include the following disclosures: (Item 1) A substrate transport device that transports objects in a horizontal direction, A first guide having a first guide surface including a first horizontal plane of a first height extending in the horizontal direction, A second guide having a second guide surface including a second horizontal plane with a second height extending in the horizontal direction, A movable structure including a holding portion capable of holding the aforementioned object, The movable structure comprises a plurality of follow-up parts that are fixed to the movable structure, move along the first guide surface, and move along the second guide surface, The first guide has a first end facing the second guide, and the second guide has a second end facing the first guide, with a gap between the first end and the second end. The first guide surface has an inclined surface between the first end and the first horizontal plane that is inclined to mitigate the height difference between the first height and the second height, or the second guide surface has an inclined surface between the second end and the second horizontal plane that is inclined to mitigate the height difference between the first height and the second height. A substrate transport device characterized by the following features. (Item 2) The first height is higher than the second height. The first guide surface has the inclined surface, A substrate transport apparatus as described in item 1, characterized by the features described herein. (Item 3) The movable structure is driven such that the plurality of tracking parts move along the first guide surface and then move along the second guide surface. A substrate transport apparatus as described in item 2, characterized by the features described herein. (Item 4) When the velocity of the movable structure is v, the length of the inclined surface in the horizontal direction is Y, the distance traveled by the movable structure in the horizontal direction is y (0 ≤ y ≤ Y), the height of the inclined surface at position y is z, and the acceleration due to gravity is g, the shape of the inclined surface is: z ≤ 1 / 2 × g × (y / v)² It is a surface that satisfies the following conditions: A substrate transport apparatus as described in item 3, characterized by the features described herein. (Item 5) The angle of the aforementioned inclined surface is 1 degree or more and 5 degrees or less. A substrate transport apparatus as described in item 3, characterized by the features described herein. (Item 6) The aforementioned inclined surface is a plane. A substrate transport apparatus as described in item 5, characterized by the features described herein. (Item 7) The second height is higher than the first height. The second guide surface has the inclined surface, A substrate transport apparatus as described in item 1, characterized by the features described herein. (Item 8) The movable structure is driven such that the plurality of tracking parts move along the first guide surface and then move along the second guide surface. A substrate transport apparatus as described in item 7, characterized by the features described herein. (Item 9) The angle of the aforementioned inclined surface is 1 degree or more and 5 degrees or less. A substrate transport apparatus as described in item 8, characterized by the features described herein. (Item 10) The aforementioned inclined surface is a plane. A substrate transport apparatus as described in item 9, characterized by the features described herein. (Item 11) The spacing between the plurality of tracking parts is greater than the gap. A substrate transport apparatus according to any one of items 1 to 10, characterized by the features described herein. (Item 12) The spacing between the plurality of tracking parts is greater than the sum of the length of the inclined surface in the horizontal direction and the gap. A substrate transport apparatus according to any one of items 1 to 10, characterized by the features described herein. (Item 13) The aforementioned plurality of tracking units are cam followers. A substrate transport apparatus according to any one of items 1 to 12, characterized by the features described herein. (Item 14) The substrate, as the aforementioned object, is configured to be transported to a buffer stage. A substrate transport apparatus according to any one of items 1 to 13, characterized by the features described herein. (Item 15) An exposure apparatus characterized by comprising a substrate transport device as described in any one of items 1 to 14. (Item 16) An exposure process in which the substrate is exposed using the exposure apparatus described in item 15, A discharge step of discharge the substrate that has undergone the exposure step from the exposure apparatus, A processing step to obtain an article by processing the substrate that has undergone the aforementioned unloading step, A method for manufacturing articles, characterized by including the following: (others) The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of Symbols]

[0055] P: Substrate (object), MB: Movable structure, 10: Discontinuity (gap), 40: Substrate unloading section (substrate transport device), 411, 412, 413: Cam follower (following section), 417, 418: Guide rail (guide), 703, 704, 705: Guide rail (guide), 431, 432: Inclined surface, G1: First guide surface, G2: Second guide surface, 421: First horizontal surface, 422: Second horizontal surface

Claims

1. A substrate transport device that transports objects in a horizontal direction, A first guide having a first guide surface including a first horizontal plane with a first height extending in the horizontal direction, A second guide having a second guide surface including a second horizontal plane with a second height extending in the horizontal direction, A movable structure including a holding portion capable of holding the aforementioned object, The movable structure comprises a plurality of follow-up parts that are fixed to the movable structure, move along the first guide surface, and move along the second guide surface, The first guide has a first end facing the second guide, and the second guide has a second end facing the first guide, with a gap between the first end and the second end. The first guide surface has an inclined surface between the first end and the first horizontal plane that is inclined to mitigate the height difference between the first height and the second height, or the second guide surface has an inclined surface between the second end and the second horizontal plane that is inclined to mitigate the height difference between the first height and the second height. A substrate transport device characterized by the following features.

2. The first height is higher than the second height. The first guide surface has the inclined surface, The substrate transport apparatus according to feature 1.

3. The movable structure is driven such that the plurality of tracking parts move along the first guide surface and then move along the second guide surface. The substrate transport apparatus according to feature 2.

4. When the velocity of the movable structure is v, the length of the inclined surface in the horizontal direction is Y, the distance traveled by the movable structure in the horizontal direction is y (0 ≤ y ≤ Y), the height of the inclined surface at position y is z, and the acceleration due to gravity is g, the shape of the inclined surface is: z≦1 / 2×g×(y / v) ２ 、 It is a surface that satisfies the following conditions: The substrate transport apparatus according to feature 3.

5. The angle of the inclined surface is 1 degree or more and 5 degrees or less. The substrate transport apparatus according to feature 3.

6. The aforementioned inclined surface is a plane. The substrate transport apparatus according to feature 5.

7. The second height is higher than the first height. The second guide surface has the inclined surface, The substrate transport apparatus according to feature 1.

8. The movable structure is driven such that the plurality of tracking parts move along the first guide surface and then move along the second guide surface. The substrate transport apparatus according to feature 7.

9. The angle of the inclined surface is 1 degree or more and 5 degrees or less. The substrate transport apparatus according to feature 8.

10. The aforementioned inclined surface is a plane. The substrate transport apparatus according to feature 9.

11. The spacing between the plurality of tracking parts is greater than the gap. The substrate transport apparatus according to feature 1.

12. The spacing between the plurality of tracking parts is greater than the sum of the length of the inclined surface in the horizontal direction and the gap. The substrate transport apparatus according to feature 1.

13. The aforementioned plurality of tracking units are cam followers. The substrate transport apparatus according to feature 1.

14. The substrate, as the aforementioned object, is configured to be transported to a buffer stage. The substrate transport apparatus according to feature 1.

15. An exposure apparatus characterized by comprising a substrate transport device according to any one of claims 1 to 14.

16. An exposure step of exposing a substrate with the exposure apparatus described in claim 15, A discharge step of discharge the substrate that has undergone the exposure step from the exposure apparatus, A processing step to obtain an article by processing the substrate that has undergone the aforementioned unloading step, A method for manufacturing articles, characterized by including the following:

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