Processing unit

Abstract

The present invention provides a processing device that can pick up elements without damaging them and perform processing using those elements. [Solution] The processing apparatus 1 picks up elements C from an element holding member 10 that holds multiple elements C and performs predetermined processing, comprising a processing unit 40 that performs predetermined processing on the elements C, a pickup unit 20 that picks up some of the elements C from the element holding member 10, and a transport unit 30 that transports the elements C picked up by the pickup unit 20 to the processing unit 40, wherein the pickup unit 20 has an irradiation unit 23 that changes the holding state of some of the elements C by irradiating the element holding member 10 with an active energy ray L, and a pickup head 22 that receives the elements C whose holding state has changed from the element holding member 10.

Description

Technical Field

[0005] , ,

[0001] The present invention relates to a processing apparatus that picks up elements one by one and performs predetermined processing.

Background Art

[0002] For example, in a conventional mounting apparatus such as Patent Document 1, when mounting a plurality of semiconductor chips formed by dicing a semiconductor wafer on a dicing tape onto a circuit board, a method is generally used in which some of the semiconductor chips on the dicing tape are picked up and passed to a bonding head, and the bonding head thermocompression-bonds the semiconductor chips to the circuit board.

[0003] In this mounting apparatus, when picking up a semiconductor chip, a needle pushes up the dicing tape from the back to form a convex shape in a part of the dicing tape, making it easier to pick up the semiconductor chip held in that part.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] To solve the above problems, the present invention provides a processing apparatus that picks up elements from an element holding member that holds a plurality of elements and performs predetermined processing, comprising: a processing unit that performs predetermined processing on the elements; a pickup unit that picks up some of the elements from the element holding member; and a transport unit that transports the elements picked up by the pickup unit to the processing unit, wherein the pickup unit is characterized by comprising: an irradiation unit that changes the holding state of some of the elements by irradiating the element holding member with active energy rays; and a pickup head that receives the elements whose holding state has changed from the element holding member.

[0008] According to the processing apparatus of the present invention, by changing the holding state of the element by irradiation with active energy rays and then picking it up, damage to the element can be reduced and the risk of breakage can be reduced compared to the conventional method of lifting the element with a needle.

[0009] Furthermore, the irradiation unit is preferable in which a blister is formed on the element holding member by irradiation with active energy rays, thereby changing the holding position of the element in the blister formation region and reducing the contact area between the element holding member and the element.

[0010] By doing this, the holding state of the element can be changed by irradiation with active energy rays so that a specific element can be picked up.

[0011] Furthermore, the irradiation unit may change the holding position of a predetermined element by forming multiple blisters in the holding region of one element in the element holding member.

[0012] By doing this, the possibility of deformation and damage to the element during pickup can be reduced compared to the case where the element is lifted using only one blister.

[0013] Furthermore, the irradiation unit may separate the predetermined elements by causing the element holding member to disappear through irradiation with active energy rays.

[0014] This prevents the element from remaining attached to the element holder due to excessive holding force during pickup.

[0015] Furthermore, the surface of the pickup head facing the element may be flexible to reduce the impact on the element when it is received.

[0016] This prevents the elements from being damaged by impact during pickup.

[0017] Furthermore, the processing unit may include a mounting head for mounting elements onto a substrate.

[0018] Furthermore, in order to solve the above problems, the present invention provides a processing apparatus that picks up elements from an element holding member that holds multiple elements and performs predetermined processing, comprising a processing unit that performs predetermined processing on the elements, and a pickup unit that picks up some of the elements from the element holding member, wherein the pickup unit has an irradiation unit that changes the holding state of some of the elements by irradiating the element holding member with active energy rays, and the processing unit is characterized in that it directly receives the elements whose holding state has changed from the element holding member and performs predetermined processing.

[0019] According to the processing apparatus of the present invention, by changing the holding state of the element by irradiation with active energy rays and then picking it up, damage to the element can be reduced and the risk of breakage can be reduced compared to the conventional method of lifting the element with a needle. [Effects of the Invention]

[0020] The processing device of the present invention can pick up an element without damaging it and perform processing using the element.

Brief Description of the Drawings

[0021] [Figure 1] It is a diagram showing a schematic configuration of the processing device of the present invention. [Figure 2] It is a diagram showing the process in which an element is processed in the processing device of the present invention. [Figure 3] It is a diagram showing the process in which an element is processed in the processing device of the present invention. [Figure 4] It is a diagram showing an example of a form in which an element is picked up from an element holding member in the processing device of the present invention. [Figure 5] It is a diagram showing an example of a form in which an element is picked up from an element holding member in the processing device of the present invention. [Figure 6] It is a diagram showing a schematic configuration of a processing device in another embodiment of the present invention. [Figure 7] It is a diagram showing an example of a form in which an element is picked up from an element holding member in the processing device of the present invention. [Figure 8] It is a diagram showing an example of a form in which an element is picked up from an element holding member in the processing device of the present invention.

Embodiments for Carrying Out the Invention

[0022] Hereinafter, the processing device of the present invention will be described based on the drawings.

[0023] FIG. 1 is a perspective view showing a schematic configuration of a mounting device which is an example of the processing device of the present invention.

[0024] The mounting apparatus 1 shown in Figure 1 has a pickup unit 20, a transport unit 30, and a processing unit 40. The pickup unit 20 picks up some of the elements C from the element holding member 10 which holds multiple elements C, and the transport unit 30 transports the elements C picked up by the pickup unit 20 to the processing unit 40. The processing unit 40 receives the elements C from the transport unit 30 and performs a predetermined process on the elements C (mounting onto a circuit board W in this embodiment). The operation of the pickup unit 20, transport unit 30, and processing unit 40 is controlled by the control unit 50.

[0025] The element holding member 10 is a member that holds a plurality of elements C arranged at predetermined intervals. The portion of the element holding member 10 that holds the elements C is a resin sheet such as PET (polyethylene terephthalate), PVC (polyvinyl chloride), or PES (polyethersulfone), which holds the elements C by adhesive force and has flexibility that allows it to deform when irradiated with active energy rays from the irradiation unit described later. In this embodiment, the element holding member 10 is composed only of a resin sheet, but it may also be a configuration in which a resin sheet is attached to a material such as light-transmitting glass.

[0026] Element C is, for example, a semiconductor chip, and multiple elements C are formed by dicing a single semiconductor wafer.

[0027] The pickup unit 20 is a device that picks up some of the multiple elements C held by the element holding member 10, and has a table 21, a pickup head 22, and an irradiation unit 23. In this embodiment, the pickup unit 20 picks up one element C in a single operation.

[0028] Table 21 is a table that holds the element holding member 10 in a predetermined position during the pickup operation, and in this embodiment, the element holding member 10 is held by reduced pressure suction.

[0029] Since the active energy rays emitted from the irradiation unit 23 pass through the table 21 and irradiate the element holding member 10, at least the portion of the table 21 through which these active energy rays pass is made of a light-transmitting material such as glass, or is hollow.

[0030] The pickup head 22 is a mechanism that receives element C from the element holding member 10 whose holding position has changed due to irradiation with active energy rays. The pickup head 22 contacts the surface of element C that is in contact with the element holding member 10 (referred to as surface a) and the surface opposite to it (referred to as surface b), and holds element C. In this embodiment, element C is held by reduced pressure adsorption.

[0031] In this embodiment, the holding portion 22a, which is the part of the pickup head 22 that contacts the element C, is flexible. This allows the holding portion 22a to absorb the impact generated when the pickup head 22 receives the element C, thereby reducing the possibility of damage to the element C.

[0032] Furthermore, the portion of the pickup head 22 including this holding part 22a is in the form of a detachable and replaceable attachment tool, and the attachment tool is replaced according to the shape of element C.

[0033] The irradiation unit 23 is a device that emits laser light L, such as an excimer laser, which is an active energy ray, and is fixedly mounted on the pickup unit 20. In this embodiment, the irradiation unit 23 irradiates a spot-shaped laser beam L, and the spot shape and irradiation angle of the laser beam L are adjusted by a reflective mirror or lens (not shown), and it passes through the table 21 and irradiates a predetermined position on the element holding member 10. Specifically, the laser beam L is a pulsed laser, and lasers with wavelengths such as 248 nm, 266 nm, 355 nm, and 1064 nm are used.

[0034] When the laser beam L is incident on the element holding member 10, ablation occurs at the interface between the table 21 and the element holding member 10 due to the application of activation energy (light energy), and a blister B is formed.

[0035] The formation of this blister B changes the holding position of element C, and in this embodiment, the holding height becomes lower compared to other elements. At the same time, the contact area between the element holding member 10, which has become non-planar due to the formation of blister B, and element C is reduced, and the adhesive holding force of element C by the element holding member 10 is reduced, making element C more likely to peel off from the element holding member 10. The pickup head 22 receives this element C.

[0036] The transport unit 30 is a mechanism that transports the element C received by the pickup head 22 of the pickup unit 20 to the processing unit 40 and entrusts it to the processing unit 40, and includes a pickup head moving mechanism 31, a flipper moving mechanism 32, and a flipper 33.

[0037] In this embodiment, the pickup head moving mechanism 31 is a linear stage that is movable at least in the X-axis direction, and moves the pickup head 22 in the X-axis direction. This pickup head moving mechanism 31 causes the pickup head 22 to reciprocate between the position where it receives the element C from the element holding member 10 and the position where it places the element C on the flipper 33.

[0038] In this embodiment, the flipper movement mechanism 32 is a linear stage that can move at least in the X-axis direction, and moves the flipper 33 in the X-axis direction. This flipper movement mechanism 32 causes the flipper 33 to reciprocate between the receiving position of the element C from the pickup head 22 and the deposit position of the element C to the mounting head 41 of the processing unit 40, which will be described later.

[0039] The flipper 33 has a holding surface that attracts and holds element C, receives element C from the pickup head 22, and also places element C on the mounting head 41 of the processing unit 40.

[0040] Furthermore, the device has a rotation axis in the Y-axis direction as shown in Figure 1, and by rotating at least 180 degrees, the holding surface changes from facing downwards to facing upwards. Also, the holding surface changes from facing upwards to facing downwards.

[0041] The presence or absence of this flipper 33 changes the orientation of element C, which is passed to the mounting head 41, by 180 degrees.

[0042] Furthermore, the part of the flipper 33 that includes the holding surface is in the form of a detachable and replaceable attachment tool, and the attachment tool is replaced according to the shape of element C.

[0043] The processing unit 40 is a mechanism that performs a predetermined process (mounting onto a circuit board W in this embodiment) on the received element C, and in this embodiment it has a mounting head 41 and a board stage 42.

[0044] The mounting head 41 has a holding surface on its lower surface for adsorbing and holding the element C, and mounts the element C onto the circuit board W by holding the element C received from the flipper 33 and pressing it in a parallel position to the circuit board W held on the substrate stage 42. The mounting head 41 is connected to a lifting unit and is movable in the Z-axis direction.

[0045] Furthermore, the mounting head 41 has a heating function provided by a heater section (not shown) to heat the element C. The lower part of the mounting head 41 is in the form of a detachable and replaceable attachment tool, and the attachment tool is replaced according to the shape of the element C.

[0046] The substrate stage 42 consists of a stage movement mechanism and a suction table. The suction table holds the circuit board W placed on its surface by adsorption, and the suction table can be moved in the in-plane direction (XY axis direction) of the circuit board W while holding the circuit board W by the stage movement mechanism. In this embodiment, the lifting unit of the mounting head 41 is fixed in the horizontal direction (XY direction), and the mounting head 41 does not move in the XY axis direction. Therefore, the stage movement mechanism is a mounting position movement mechanism (processing position movement mechanism) that can sequentially move the multiple mounting locations provided on the circuit board W directly below the mounting head 41. In addition, the substrate stage 42 is also provided with a heater section (not shown), and heating is also performed from the circuit board W side.

[0047] The control unit 50 includes, for example, a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), and GPU (Graphics Processing Unit) as processors, and performs various controls and calculations by executing programs (software). The control unit 50 is also provided with storage for saving data, and the storage stores recipe data related to the operation of the pickup unit 20, transport unit 30, and processing unit 40. The storage includes, for example, an HDD (Hard Disk Drive) and an SSD (Solid State Drive).

[0048] Figures 2 and 3 show the process by which element C is processed in the processing apparatus 1 with the above configuration.

[0049] First, as shown in Figure 2(a), when the table 21 of the pickup unit 20 holds the element holding member 10, the irradiation unit 23 emits laser light L, causing a portion of the element holding member 10 to be irradiated with laser light L and a blister B to form. This blister B causes one element C to protrude downward, while the adhesive holding force of the element holding member 10 decreases. The pickup head 22 then holds this element C by suction, completing the pickup of one element C by the pickup head 22.

[0050] Here, assuming that the a-side of element C is exposed when held by the element holding member 10, when held by the pickup head 22, element C takes a configuration in which the b-side is exposed.

[0051] In this embodiment, the element C comes into contact with the pickup head 22 while the blister B is growing. Here, the holding portion 22a of the pickup head 22 is flexible, so that it absorbs the impact when the element C comes into contact with it and prevents damage to the element C. In addition, by having the pickup head 22 receive the element C while the blister B is growing in this way, the cycle time required to pick up the element C can be shortened.

[0052] Next, as shown in Figure 2(b), the pickup head 22 is moved by the pickup head moving mechanism 31, and the element C is transferred to the flipper 33. When the flipper 33 holds the element C, the element C has its a-side exposed, and immediately after receiving it from the pickup head 22, the a-side is facing downwards.

[0053] Next, as shown in Figure 2(c), the flipper 33 rotates 180 degrees, and the element C is held by the flipper 33 in a configuration where the exposed surface a faces upward.

[0054] Next, as shown in Figure 3(a), the flipper 33 is moved by the flipper movement mechanism 32 to directly below the mounting head 41, and the element C is transferred between the mounting head 41 and the flipper 33. When the mounting head 41 holds the element C, the b-side of the element C is exposed.

[0055] Next, as shown in Figure 3(c), the mounting head 41 descends and approaches the circuit board W on the substrate stage 42. At this point, the mounting head 41 descends further, applying pressure to the substrate stage 42 via the element C, and the mounting head 41 is heated by a heater (not shown), so the element C is mounted to the circuit board W by thermocompression bonding. This completes the processing of one element C by the processing unit 40.

[0056] In this case, when element C is mounted on the circuit board W, side a of element C is exposed. That is, the same side that is exposed when the element holding member 10 is holding element C is exposed. Conversely, if it is desired that element C be mounted so that the side exposed when the element holding member 10 is holding element C faces the circuit board W, then it is preferable to pass element C directly from the pickup head 22 to the mounting head 41 without going through the flipper 33.

[0057] In the above-described processing apparatus 1, since the pickup of element C in the pickup unit 20 is performed via irradiation with laser light L, stress does not concentrate on a part of element C as in the conventional case where element C is lifted with a needle. Therefore, damage to element C is reduced, and the risk of element C breakage is reduced.

[0058] In the processing apparatus 1 shown in Figure 1, the pickup unit 20 irradiates a laser beam L from above via the table 21 to make a predetermined element C protrude downward. However, as shown in Figure 4, it may also be configured to irradiate a laser beam L from below to make the predetermined element C protrude upward.

[0059] Next, Figure 5 shows the pickup configuration of element C in another embodiment.

[0060] If element C is thin, when blister B is formed by irradiation with laser light L, element C may deform to follow the surface shape of blister B, as shown in Figure 5(a). After that, it may peel off from the edges and element C may return to its original shape, but if element C is brittle, there is a risk that element C will break.

[0061] In that case, as shown in Figure 5(b), it is preferable to irradiate the holding area of ​​one element C with multiple small-diameter laser beams to form multiple blisters B and change the holding position of element C. Since deformation of element C that follows the shape of such small blisters B is unlikely to occur, damage due to deformation of element C can be prevented.

[0062] When irradiating with multiple small-diameter laser beams L in this manner, the laser beams L may be irradiated sequentially as shown in Figure 5(b), or multiple small-diameter laser beams L may be irradiated simultaneously. Furthermore, when irradiating with multiple small-diameter laser beams L in this manner, known technologies such as galvanometer mirrors, polygon mirrors, DOE (Diffractive Optical Element), and GLV (Grating Light Valve, registered trademark) are preferably used.

[0063] Next, Figure 6 shows the processing unit 1 in another embodiment. In this embodiment, there is no transport unit as in Figure 1, and the mounting head 41 constituting the processing unit 40 has not only a lifting mechanism but also an XY axis axis movement mechanism. As a result, the mounting head 41 moves to the pickup unit 20, directly receives a predetermined element C picked up by the pickup unit 20, and then moves above the substrate stage 42 to mount the element C onto the circuit board W. At this time, the pickup unit 20 pushes the element C upward in the same direction as in Figure 4.

[0064] In the processing apparatus 1 of this embodiment, since the pickup of element C in the pickup 20 is performed by irradiation with laser light L, stress does not concentrate on a part of element C as in the conventional case where element C is lifted with a needle, thus reducing damage to element C and lowering the risk of element C breakage. At this time, the mounting head 41 attracts and holds element C at its tip, but the tip may be flexible in order to reduce damage to element C during contact.

[0065] The above processing device makes it possible to pick up elements without damaging them and to perform processing using those elements.

[0066] Here, the processing device is not limited to the form described above, but may be of other forms within the scope of the present invention. For example, in the above description, the processing device is a mounting device having a mounting head, but it may be any other processing device that processes elements individually.

[0067] Furthermore, in the above description, the pickup head 22 receives the element C while the blister B is growing, but it is not limited to this, and the element C may be received after the formation of the blister B is complete. In that case, for example, the pickup head 22 may be provided with a lifting mechanism, and before receiving the element C, it may be in a position retracted from the element holding member 10 and the element C as shown in Figure 7(a), and when receiving the element C, the pickup head 22 may rise and make contact with the element C as shown in Figure 7(b). Similarly, the flipper 33 may also have a lifting mechanism, and this lifting mechanism may be activated when the element C is handed over.

[0068] Furthermore, while the pickup head 22 and flipper 33 are described above as holding element C by reduced pressure adsorption, element C may be held by other means, such as electrostatic adsorption.

[0069] Furthermore, in the above explanation, the holding position of the element C changes and the holding force is reduced when a blister B is generated on the element holding member 10 by irradiation with laser light L. However, the explanation is not limited to this, and as shown in Figure 8, the element holding member 10 may be made to disappear when irradiated with laser light L. This completely separates the element C from the element holding member 10, preventing the element C from remaining on the element holding member 10 side due to excessive holding force during pickup of the element C.

[0070] Furthermore, although the above description states that the element holding member 10 is irradiated with laser light L from above or below, the laser light L is not limited to this and may be irradiated from the side.

[0071] Furthermore, in the above description, the element holding member 10 is a resin sheet that forms a blister B by irradiation with laser light L, but it is not limited to this and may be composed of a material such as RibaAlpha (registered trademark) whose adhesive strength is reduced by heating by irradiation with infrared laser light. [Explanation of Symbols]

[0072] 1 Processing Unit 10 Element holding member 20 Pickup section 21 Tables 22 Pickup heads 22a Holding part 23 Irradiation area 30 Conveying section 31. Pickup head movement mechanism 32 Flipper movement mechanism 33 Flippers 40 Processing Unit 41 Mounting Head 42 PCB stage 50 Control Unit B Blister C element L Laser light W Circuit Board

Claims

1. This is a processing device that picks up elements from an element holding member that holds multiple elements and performs predetermined processing. A processing unit that performs a predetermined process on the element, A pickup unit for picking up some elements from the element holding member, A transport unit that transports the element picked up by the pickup unit to the processing unit, Equipped with, The apparatus is characterized in that the pickup unit includes an irradiation unit that changes the holding state of some elements by irradiating the element holding member with an active energy ray, and a pickup head that receives the elements whose holding state has changed from the element holding member.

2. The processing apparatus according to claim 1, characterized in that the irradiation unit changes the holding position of the element in the blister formation region and reduces the contact area between the element holding member and the element by irradiating it with an active energy ray.

3. The processing apparatus according to claim 2, characterized in that the irradiation unit changes the holding position of a predetermined element by forming a plurality of blisters in the holding region of one element in the element holding member.

4. The processing apparatus according to claim 1, characterized in that the irradiation unit separates predetermined elements by causing the element holding member to disappear through irradiation with an active energy ray.

5. The apparatus according to claim 1, characterized in that the surface of the pickup head facing the element is flexible, thereby reducing the impact on the element when receiving the element.

6. The processing apparatus according to claim 1, characterized in that the processing unit includes a mounting head for mounting elements onto a substrate.

7. This is a processing device that picks up elements from an element holding member that holds multiple elements and performs predetermined processing. A processing unit that performs a predetermined process on the element, A pickup unit for picking up some elements from the element holding member, Equipped with, The apparatus is characterized in that the pickup unit has an irradiation unit that changes the holding state of some elements by irradiating the element holding member with an active energy ray, and the processing unit directly receives the elements whose holding state has changed from the element holding member and performs predetermined processing.

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