Apparatus for manufacturing a display device, and method for manufacturing a display device.

Abstract

To provide a long-life display device that can prevent the penetration of oxygen and moisture. [Solution] The display device has a first display area, an opening area arranged inside the first display area, A peripheral region and the peripheral area arranged to surround at least a portion of the opening region. A substrate having a second display area connected from the area to the edge of the first display area, and Displaced on the substrate, at least one first opening located in the first display area, and A pixel definition film having at least one second aperture arranged in the second display area, and A first common layer is placed in the first opening, and a second common layer is placed in the second opening. Including the thickness of the first common layer and the thickness of the second common layer, they are either the same as each other or They are different.

Description

[Technical Field]

[0001] The present invention relates to a method and apparatus, and more particularly to an apparatus for manufacturing a display device and a display device. This relates to a method for manufacturing this product. [Background technology]

[0002] Recently, the applications of display devices have become more diverse. Also, the thickness of display devices has decreased. It is lightweight and has a wide range of applications.

[0003] In display devices, the area occupied by the display area is expanding, and the display device is being integrated or connected to it. A variety of functions have been added, such as connectivity. While the area has been expanded, a variety of functions have been added. As a way to add this, a display device that can arrange various components in the display area Research is being conducted. [Overview of the project] [Problems that the invention aims to solve]

[0004] The present invention has a display area within which various components can be arranged. A device for manufacturing a display device including a display panel, and a device for manufacturing the same. We can provide a manufacturing method. However, such challenges are illustrative and not representative of the actual challenges. This does not limit the scope of the present invention. [Means for solving the problem]

[0005] One embodiment of the present invention includes a first display area, an opening area disposed within the first display area, A peripheral region and the peripheral area arranged to surround at least a portion of the opening region. A substrate having a second display area connected from the area to the edge of the first display area, and Displaced on the substrate, at least one first opening located in the first display area, and A pixel definition film having at least one second aperture arranged in the second display area, and A first common layer is placed in the first opening, and a second common layer is placed in the second opening. Including the thickness of the first common layer and the thickness of the second common layer, they are either the same as each other or Different display devices may be disclosed.

[0006] In this embodiment, the first common layer and the second common layer are at least among the intermediate layers It may include at least one of a single layer and a counter electrode.

[0007] In this embodiment, the edge of the first display area is rectangular, and the second display area These may be positioned diagonally so as to be opposite one vertex of the first display area.

[0008] In this embodiment, the thickness of the first common layer is greater than the thickness of the second common layer. That's fine.

[0009] In this embodiment, the thickness of the second common layer is from the edge of the second common layer, The common layer can be thinner towards the center.

[0010] In this embodiment, a through hole may be provided in the opening region.

[0011] Another embodiment of the present invention is a chamber in which a display substrate and a mask assembly are arranged , a first support portion for fixing the display substrate, and a portion facing the display substrate In addition, a second support portion for fixing the mask assembly, and a portion facing the mask assembly. A source unit configured to supply a deposition material to the display substrate, and including the mask The assembly includes a mask sheet having an opening through which the deposition material passes, and the mask sheet has a body portion having the opening, a rib connected to the body portion and dividing the opening into two regions having different areas from each other and a shielding portion connected to the rib and protruding from one surface of the rib toward the source unit side to block the deposition material, and discloses a manufacturing apparatus for a display device including the same In the present embodiment, the opening may be formed in a quadrilateral shape, and the rib may be disposed obliquely so as to face the vertex of the opening In the present embodiment, a first distance from one surface of the shielding portion facing the display substrate to one surface of the rib facing the display substrate may be 2.7×10

[0012] times or more of a second distance from the source unit to one surface of the rib facing the source unit In the present embodiment, at least one of the body portion, the rib, and the shielding portion may include carbon fiber

[0013] In the present embodiment, the rib and the shielding portion include carbon fiber, and the rib may be attached to the body portion by an adhesive material In the present embodiment, the body portion may include a mounting groove in which the rib is inserted and mounted In the present embodiment, the deposition material is at least one of the intermediate layers of the display substrate -4 times or more It may be

[0014] In the present embodiment, at least one of the body portion, the rib, and the shielding portion may include carbon fiber It may include carbon fiber

[0015] In the present embodiment, the rib and the shielding portion include carbon fiber, and the rib may be attached to the body portion by an adhesive material In the present embodiment, the body portion may include a mounting groove in which the rib is inserted and mounted

[0016] In the present embodiment, the body portion may include a mounting groove in which the rib is inserted and mounted It may be

[0017] In the present embodiment, the deposition material is at least one of the intermediate layers of the display substrate At least one of the following may be formed: one layer and a counter electrode.

[0018] In this embodiment, the mask sheet further comprises the magnetic material disposed in the body portion It may be included.

[0019] In yet another embodiment of the present invention, a display substrate and a mask assembly are placed inside the chamber. The steps include: arranging the display substrate and the mask assembly, and A deposition material is supplied to the mask assembly, passed through it, and deposited onto the display substrate. The process includes the step of supplying a substance, wherein the vapor-deposited substance passes through the opening of the mask assembly. At that time, a certain area is blocked, forming an opening region in the display substrate, and the opening region In the removed portion of the display substrate, there are first display regions and where the thickness of the deposited material differs from one another. A method for manufacturing a display device that forms two display areas is disclosed.

[0020] In this embodiment, the thickness of the vapor-deposited material in the first display area is the thickness of the second display area The thickness may be greater than the thickness of the aforementioned vapor-deposited material.

[0021] In this embodiment, the thickness of the vapor-deposited material in the second display area is the thickness of the vapor-deposited material in the second display area It may be variable along the width direction.

[0022] In this embodiment, the thickness of the vapor-deposited material in the second display area is the thickness of the vapor-deposited material in the second display area The thickness may increase from the edge towards the center of the second display area.

[0023] In this embodiment, the first display area forms a rectangle, and the second display area is front The elements may be arranged diagonally, facing the vertices of the first display area.

[0024] In this embodiment, the mask assembly includes a mask sheet including an opening, and the mask The scrap sheet comprises a body portion having the opening, and a portion connected to the body portion, the opening A rib that divides the area into two regions having different areas from each other, and connected to the rib, The rib includes a shielding portion that protrudes from one surface toward the source portion and blocks the deposited material. That's good too.

[0025] Other aspects, features, and advantages not mentioned above are described in the following drawings, claims, and inventions. This will become clear from the detailed explanation.

[0026] Such general and specific aspects are found in systems, methods, and computer programs. , or any combination of systems, methods, or computer programs used It is possible to implement it. [Effects of the Invention]

[0027] The display device according to an embodiment of the present invention has a uniform surface and prevents the penetration of oxygen and moisture. This extends the lifespan.

[0028] The method for manufacturing a display device according to an embodiment of the present invention is to prevent defects in the display device during manufacturing. This can be minimized. Furthermore, the method for manufacturing a display device according to an embodiment of the present invention is It is possible to manufacture display devices with extended lifespans. [Brief explanation of the drawing]

[0029] [Figure 1] This is a perspective view showing a display device according to one embodiment of the present invention. [Figure 2] This is a simplified cross-sectional view showing a display device according to one embodiment of the present invention. [Figure 3] This is a simplified cross-sectional view showing a display device according to another embodiment of the present invention. [Figure 4] This is a plan view of a display panel according to an embodiment of the present invention. [Figure 5] This is an equivalent circuit diagram showing a single pixel in a display panel according to an embodiment of the present invention. [Figure 6] This is a cross-sectional view showing a display panel according to one embodiment of the present invention. [Figure 7] This is a cross-sectional view showing the first display area of ​​the display panel illustrated in Figure 4. [Figure 8] This is a cross-sectional view showing the second display area of ​​the display panel illustrated in Figure 4. [Figure 9] This is a cross-sectional view showing a display panel according to another embodiment of the present invention. [Figure 10] This is a cross-sectional view showing a display panel according to yet another embodiment of the present invention. [Figure 11] This is a cross-sectional view showing a display panel according to yet another embodiment of the present invention. [Figure 12] This is a cross-sectional view showing the display panel illustrated in Figure 11. [Figure 13] This is a cross-sectional view showing a display panel according to yet another embodiment of the present invention. [Figure 14] This is a cross-sectional view showing a display panel according to yet another embodiment of the present invention. [Figure 15] This is a cross-sectional view showing a manufacturing apparatus for a display device that manufactures a display device according to an embodiment of the present invention. [Figure 16] Figure 15 is a perspective view showing the mask assembly illustrated in the diagram. [Figure 17] This is a cross-sectional view taken along the line C-C' in Figure 16. [Figure 18] Figure 15 is a cross-sectional view showing another embodiment of the mask sheet illustrated. [Figure 19] Figure 15 is a cross-sectional view showing yet another embodiment of the mask sheet illustrated. [Figure 20]Figures 17 to 19 are cross-sectional views showing how the deposition material passes through the ribs and is deposited onto the display substrate. [Modes for carrying out the invention]

[0030] The present invention can be subjected to various transformations and can have a variety of embodiments. However, specific embodiments are illustrated in the drawings and described in detail in the detailed description. Effects of the present invention, Features and methods for achieving them are described in detail later with reference to embodiments, accompanied by drawings. This will become clear. However, the present invention is limited to the embodiments disclosed below. It can be realized not only as a physical object, but also through diverse forms.

[0031] The embodiments of the present invention will be described in detail below with reference to the attached drawings. When describing them, identical or corresponding components are denoted by the same reference numeral in the drawings. I will omit any redundant explanations related to that.

[0032] In the following embodiments, terms such as "first" and "second" are not limited in meaning, but rather refer to one or more specific concepts. It was used to distinguish one component from another.

[0033] In the following embodiments, singular expressions are plural unless the context clearly indicates otherwise. This includes the expression.

[0034] In the following embodiments, terms such as “including” or “having” are used in the specification. This means that the described features or components exist, and one or more others This does not preclude the possibility that additional features or components may be added.

[0035] In the following embodiments, a part such as a membrane, region, or component is located on or above another part. If it is located there, it is not only directly above other parts, but also in between other membranes, regions This includes cases where components or other elements are involved.

[0036] In drawings, for the sake of explanation, the size of the components may be exaggerated or reduced. For example, the dimensions and thickness of each component shown in the drawing are for the convenience of explanation. Therefore, since the illustrations are shown at will, the present invention is not necessarily limited to what is shown. isn't it.

[0037] In the following embodiments, the x-axis, y-axis, and z-axis are limited to three axes on a Cartesian coordinate system. Rather, it can be interpreted in a broader sense that includes them. For example, the x-axis, y-axis, and z-axis are mutually exclusive. They can be orthogonal to each other, but they can also not be orthogonal to each other and point in different directions.

[0038] If a different embodiment is feasible, the specific sequence of steps may differ from the sequence described. It may be carried out in a manner in which two steps described consecutively are carried out substantially simultaneously. It may be done in the reverse order of the explanation, or it may be done in the reverse order of the explanation.

[0039] Figure 1 is a perspective view showing a display device according to one embodiment of the present invention.

[0040] Referring to Figure 1, the display device reduces the aperture region OP, which is the first region. It is connected to the first display area DA1, which is a second area that partially surrounds it, and the opening area OP. The display device 1 includes a second display area DA2. By utilizing the light emitted from multiple pixels arranged in 2, a predetermined image can be provided. Yes, it is possible. Figure 1 shows a configuration where one opening region OP is placed inside the first display region DA1. The diagram shows that the opening region OP is entirely surrounded by the first display region DA1. The OP region is also the area where the components described later, as shown in Figure 2, are located.

[0041] Between the opening region OP and the second region, the first display region DA1, there is a third region, Two non-display areas NDA2 are placed, and the first display area DA1 is the fourth area, the first non-display area It may be surrounded by area NDA1. Also, the first non-display area NDA1 is the second display area Area DA2 may be connected to the second display area DA2. That is, the second display area DA2 is connected to the first non-display area NDA It is connected from edge 1 to the edge of the first display area DA1. The second non-display area NDA2 and The first non-display area NDA1 may be a type of non-display area where no pixels are placed. The second non-display area NDA2 is entirely composed of the first display area DA1 and the second display area DA2. Surrounded by the first display area DA1, the entire display area DA1 is taken over by the first non-display area NDA1. It is enclosed. The edges of the first display area DA1 may be rectangular. Also, the second display area DA2 is positioned so as to be opposite one vertex of the first display area DA1, along the length of the first display area DA1. Even if they are positioned diagonally with respect to the direction (X-axis direction in Figure 1) or the shorter direction (Y-axis direction in Figure 1) good.

[0042] In the following, an organic light-emitting display device is used as an example of a display device 1 according to one embodiment of the present invention. As will be explained, the present invention's display device is not limited thereto. Other embodiments For example, quantum dot light emitter Other types of display devices, such as ng display, may also be used.

[0043] Figure 1 shows that there is one opening region OP, which is depicted as being approximately circular. The invention is not limited thereto. The number of opening regions OP may be two or more. Each shape is diverse, such as circular, elliptical, polygonal, star-shaped, and diamond-shaped. It goes without saying that this will also be changed.

[0044] Figure 2 is a simplified cross-sectional view showing a display device according to one embodiment of the present invention. Figure 3 is a simplified cross-sectional view showing the present invention. This is a simplified cross-sectional view showing a display device according to another embodiment of Akira's work.

[0045] Referring to Figures 2 and 3, the display device 1 is located on a display panel 10. It may also include an input sensing layer 40 and an optical function layer 50, which are connected to the window 60. Therefore, it is also covered. Display device 1 is a mobile phone, notebook It could be a variety of electronic devices, such as a personal computer or a smartwatch.

[0046] The display panel 10 can display an image. The display panel 10 has a first display area It includes pixels arranged in area DA1 and a second display area (not shown). The pixels are display elements, The display element may also include a pixel circuit connected to the display element. The display element is an organic light-emitting diode. Alternatively, it may include quantum dot organic light-emitting diodes, etc.

[0047] The input sensing layer 40 acquires coordinate information from external inputs, such as touch events. The input sensing layer 40 has a sensing electrode (or touch electrode). (electrode), and trace line connected to the sensing electrode. e) may be included. The input sensing layer 40 may be located on the display panel 10. The intelligent layer 40 receives external input using a mutual capping method and / or a self-capping method. It can be detected.

[0048] The input sensing layer 40 is formed directly on the display panel 10 or separately. Furthermore, an adhesive layer such as an optical clear adhesive. They may be coupled via a process. For example, the input sensing layer 40 is part of the process of forming the display panel 10. Furthermore, they may be formed continuously, in which case the input sensing layer 40 is part of the display panel 10. Even if it is understood that there is no adhesive layer between the input sensing layer 40 and the display panel 10 Figure 2 shows that the input sensing layer 40 is interposed between the display panel 10 and the optical function layer 50. Although illustrated as such, in another embodiment, the input sensing layer 40 is on the optical functional layer 50. It may be placed in [location].

[0049] The optical functional layer 50 may include an anti-reflective layer. The anti-reflective layer is provided via the window 60. This reduces the reflectivity of light (external light) incident on the display panel 10 from the outside. This can be achieved. The anti-reflective layer includes a phase delay element and a polarizer. It may include a zer. The phase delay element may be of film type or liquid crystal coated type. It may be a phase delay and may include a λ / 2 phase delay and / or a λ / 4 phase delay. The polarizer can also be a film type or a liquid crystal coated type. The film type is , comprising a stretched synthetic resin film, the liquid crystal coating type is arranged in a predetermined arrangement Liquid crystal may be included. The phase delay element and polarizer may further include a protective film. i. The phase delay element and polarizer themselves, or the protective film, are fixed to the base layer of the anti-reflective layer. It may be justified.

[0050] In another embodiment, the anti-reflective layer is a black matte layer and a color filter. It may include. The color filter is the light emitted from each pixel of the display panel 10. They may be arranged considering the hue. In yet another embodiment, the anti-reflective layer is offset Interference structures may be included. These interfering structures include first reflections arranged on different layers. It may include a layer and a second reflection layer. Reflected in the first reflection layer and the second reflection layer, respectively. The first and second reflected light cancel each other out through interference, thereby reducing the external light reflectivity.

[0051] The optical functional layer 50 may include a lens layer. The lens layer is emitted from the display panel 10. The light emission efficiency of the light being emitted can be improved, or the color deviation can be reduced. The lens layer includes a layer having a lens shape that is concave or convex, and / or It may include multiple layers with different refractive indices. The optical functional layer 50 includes the aforementioned anti-reflective layer and It may include both the lens layer and the lens layer, or it may include one of them.

[0052] In one embodiment, the optical functional layer 50 is located in the display panel 10 and / or the input sensing layer 40. After the process of forming the optical functional layer 50, the display panel may be formed continuously. No adhesive layer is interposed between 10 and / or the input sensing layer 40.

[0053] The display panel 10, input sensing layer 40, and / or optical functional layer 50 may include apertures. In connection with that, Figure 2 shows the display panel 10, the input sensing layer 40, and the optical function layer 50. Each includes a first opening 10H, a second opening 40H, and a third opening 50H, and the first opening 10H, The diagram shows how the second opening 40H and the third opening 50H overlap each other. First opening 10H The second opening 40H and the third opening 50H are positioned to correspond to the opening area OP. As an embodiment, one of the display panel 10, input sensing layer 40, and optical function layer 50 or Beyond that, the aperture is not included. For example, the display panel 10, the input sensing layer 40, and the optical functional layer. One or two of the 50 components selected do not contain an opening. Or, The display panel 10, input sensing layer 40, and optical function layer 50 are as shown in Figure 3. Does not include the opening.

[0054] As mentioned above, the aperture region OP is a component for adding various functions to the display device 1. A type of component area where Nent 30 is located (e.g., sensor area, camera area, speaker) It may also be the area (such as the C region). Component 30 is as shown in Figure 2, It can be located within the first opening 10H, the second opening 40H, and the third opening 50H. Component 30 is located below the display panel 10, as illustrated in Figure 3. It's okay.

[0055] Component 30 may include electronic elements. For example, component 30 may include light It may also be an electronic element that utilizes sound. For example, the electronic element may be an infrared sensor. A sensor that outputs and / or receives light, and a camera that receives light and captures an image. A sensor that emits light or sound to sense, measure distance, recognize fingerprints, and emit light This may include a small lamp that emits light, or a speaker that emits sound. In the case of sub-elements, it is possible to utilize light in a variety of wavelength ranges, such as visible light, infrared light, and ultraviolet light. This is possible. In some embodiments, the opening region OP is accessible from the component 30 to the outside. The force applied, or the transmission of light and / or sound traveling from the outside toward an electronic element. It can also be understood as a transmission area where this is possible.

[0056] In another embodiment, the display device 1 may be used in a smartwatch or a vehicle instrument panel. Component 30 is like a clock hand or a hand that indicates predetermined information (e.g., vehicle speed). It may also be a component. If the display device 1 includes a clock hand or a vehicle instrument panel, the component T30 is also exposed to the outside by penetrating window 60, and window 60 has an opening region O It may include an opening corresponding to P.

[0057] As described above, component 30 includes components related to the functions of the display panel 10. Or, it may include components such as accessories that enhance the aesthetic appeal of the display panel 10. That is also acceptable. Although not shown in Figures 2 and 3, the window 60 and the optical functional layer 50 A layer containing an optically transparent adhesive or the like can be positioned between them.

[0058] Figure 4 is a plan view of a display panel according to an embodiment of the present invention. Figure 5 is an embodiment of the present invention. This is an equivalent circuit diagram showing a single pixel in a display panel.

[0059] Referring to Figures 4 and 5, the display panel 10 consists of a first region, which is the opening region OP, and a second region The first display area DA1 and the second display area DA2 are areas, and the third area is the second non-display area N. It may also include DA2 and the fourth region, which is the first non-display region NDA1.

[0060] The display panel 10 has multiple images arranged in the first display area DA1 and the second display area DA2. It includes an element P. Each pixel P is a pixel circuit PC and a pixel circuit P, as shown in Figure 5. The display element connected to C may include an organic light-emitting diode (OLED). Pixel circuit The PC consists of a first thin-film transistor T1, a second thin-film transistor T2, and storage capacity It may include Cst. Each pixel P is transmitted via an organic light-emitting diode (OLED), for example, It emits red, green, or blue light, or it emits red, green, blue, or white light. It can be released.

[0061] The second thin-film transistor T2 is a switching thin-film transistor, and is a scanline transistor. Switching connected to SL and data line DL, with input from scan line SL. Based on the voltage, the data voltage input from the data line DL is processed by the first thin-film transistor. The storage capacitor Cst can be transmitted to the second thin-film transistor T1. It is connected to the drive voltage line PL and the voltage transmitted from the second thin-film transistor T2, and the drive The voltage corresponding to the difference between the first power supply voltage ELVDD supplied to the dynamic voltage line PL is to be stored. It is possible.

[0062] The first thin-film transistor T1 is a driving thin-film transistor, and the driving voltage line PL and the strain The storage capacitor Cst is connected to the voltage value stored in the storage capacitor Cst. This allows for the control of the drive current flowing from the drive voltage line PL to the organic light-emitting diode (OLED). This is possible. Organic light-emitting diodes (OLEDs) emit light with a predetermined brightness based on the driving current. It can be output. The counter electrode (e.g., cathode) of an organic light-emitting diode (OLED) has the following Two power supply voltages, ELVSS, are supplied.

[0063] Figure 5 shows that the pixel circuit PC consists of two thin-film transistors and one storage capacitor. Although the description includes, the present invention is not limited thereto. Thin film transient The number of sta and storage capacitors varies considerably depending on the design of the pixel circuit PC. It may be modified. For example, the pixel circuit PC may have four thin-film transistors in addition to the two thin-film transistors mentioned above. It may further include five or more thin-film transistors.

[0064] The first non-display area NDA1 contains a scan driver 1 that provides a scan signal to each pixel P. 100, a data driver 1200 that provides a data signal to each pixel P, and a first power supply voltage and Main power supply wiring (not shown) for providing a second power supply voltage may also be provided. Figure 5 shows that the data driver 1200 is positioned adjacent to one side of the substrate 100. The diagram illustrates where it is located, but according to other embodiments, the data driver 1200 is located on the display panel. A pad located on one side of the 10 and electrically connected FPCB (flexible p It may be placed on a rinted circuit board.

[0065] For example, the first non-display area NDA1 contains the first display area DA1 and the second display area DA2. Wiring sections that supply various signals and / or power may be arranged. The wiring section may also include a drive circuit. For example, the drive The drive circuit consists of a scan drive circuit (not shown), a terminal section (not shown), and drive power supply wiring (Figure). (Not shown) and may include at least one of the second wiring, within the first display area DA1 and Thin-film transistors are used to control the electrical signals applied within the second display area DA2. It may also be included. In addition, the first non-display area NDA1 is included when manufacturing the display device. Partitions or trenches used to block the flow of organic membranes, etc. It may be placed.

[0066] Referring again to Figure 4, the second non-display area NDA2 is the opening area OP on the plane. It can surround the second non-display area NDA2 and the aperture area OP, which emit light. This is a region where no display elements such as light-emitting diodes are placed, and is the second non-display region (ND). A2 contains signal lines that provide signals to pixels P located around the aperture region OP. It is possible.

[0067] In addition to signal lines, the second non-display area NDA2, as mentioned above, is shown in the diagram. Although not provided, special grooves may be provided. In this case, multiple grooves may be provided. The grooves may be arranged so as to be separated from each other in the second non-display area NDA2.

[0068] Figure 6 is a cross-sectional view showing a display panel according to one embodiment of the present invention. Figure 7 is a cross-sectional view of Figure 4. This is a cross-sectional view showing the first display area of ​​the display panel shown. Figure 8 shows the display shown in Figure 4. This is a cross-sectional view showing the second display area of ​​the panel.

[0069] Referring to Figures 6 to 8, the display panel 10 is a display layer 200 placed on the substrate 100. This includes the first display area DA1 and the second display area DA2. It may be placed.

[0070] The substrate 100 may contain glass material or polymer resin. It may be formed in multiple layers. For example, the substrate 100 may be as shown in the enlarged view of Figure 6. , first base layer 100-1, first barrier layer 100-2, second base layer 100-3 and second A barrier layer 100-4 may also be included.

[0071] The first base layer 100-1 and the second base layer 100-3 each contain a polymer resin. This is also acceptable. For example, the first base layer 100-1 and the second base layer 100-3 are polyether Sulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene Tylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, poly Even if it contains polymer resins such as carbonate or cellulose acetate propionate. That's fine. The aforementioned polymer resin may also be transparent.

[0072] The first barrier layer 100-2 and the second barrier layer 100-4 prevent the penetration of external foreign matter. It is the rear layer, and is silicon nitride (SiN x ), silicon oxide (SiO x )of It may be a single layer or multiple layers containing such inorganic materials.

[0073] The display layer 200 comprises multiple pixels. The display layer 200 comprises a display arranged for each pixel. The display element layer 200A includes a display element, and each pixel includes a pixel circuit and an insulating layer. It may also include a pixel circuit layer 200B. Each pixel circuit includes a thin-film transistor and storage Capacitors may be included, and each display element may include an organic light-emitting diode (OLED). good.

[0074] The display elements of the display layer 200 are covered by a sealing member such as a thin film sealing layer 500. Also, the thin film sealing layer 500 comprises at least one inorganic sealing layer and at least one organic sealing layer. It may also include a sealing layer. The display panel 10 is a substrate 100 containing a polymer resin, and an inorganic sealing layer. When the display panel 10 is equipped with a thin film sealing layer 500 including an organic sealing layer, the flexibility (fle It can improve xibility.

[0075] The display panel 10 may include a first opening 10H that penetrates the display panel 10. Mouth 10H can be located in the opening region OP, in which case the opening region OP is a kind of H It may also be a . Figure 6 shows the substrate 100 and the thin film sealing layer 500 as display panels. The diagram shows the through holes 100H and 500H, which correspond to the first opening 10H of 10. The display layer 200 may also include through-holes 200H corresponding to the opening area OP.

[0076] The display panel 10 includes a base including a first display area DA1, a second display area DA2, and a non-display area. The plate 100, and the thin seal that seals the first display area DA1, the second display area DA2, and the non-display area. It includes a film-encapsulating layer 500. At this time, the display panel 10 is thinly coated with the display layer 200 as described above. It may also include a film-encapsulating layer 500.

[0077] The buffer layer 101 is located on the substrate 100 and protects the substrate 100 from foreign matter, moisture and This can reduce or block the penetration of outside air and provide a flat surface on the substrate 100. It is possible. The buffer layer 101 is made of an inorganic material such as an oxide or nitride, or an inorganic material. It may include materials or inorganic-organic composites, and may have a single-layer or multi-layer structure of inorganic and organic materials. It can even be structured.

[0078] The first thin-film transistor T1 consists of a semiconductor layer A1, a first gate electrode G1, and a source electrode S1. The second thin-film transistor T2 includes a drain electrode D1, a semiconductor layer A2, and a second gate electrode. Includes G2, source electrode S2, and drain electrode D2.

[0079] In the following, thin-film transistors T1 and T2 are of the top-gate type. The diagram shows the case of type e. However, this embodiment is not limited to that. Rather, a variety of bottom gate types Thin-film transistors of a certain type may be used.

[0080] Furthermore, the following diagrams illustrate the case where there are two thin-film transistors T1 and T2. However, it is not limited thereto. In embodiments of the present invention, the display device is Two or more thin-film transistors T1 and T2 can be used for a single pixel. In the configuration, thin-film transistors T1 and T2 are arranged in groups of 6 or 7 for each pixel. It can be modified in various ways to be adopted.

[0081] Semiconductor layers A1 and A2 may contain amorphous silicon or polycrystalline silicon. Good. In another embodiment, semiconductor layers A1 and A2 are indium (In) and gallium (G) a) Tin (Sn), Zirconium (Zr), Vanadium (V), Hafnium (Hf), Cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc It may contain oxides of at least one substance selected from the group including (Zn). Semiconductor layers A1 and A2 have a channel region and a region with a higher carrier concentration than the channel region. It may also include a source area and a drain area.

[0082] A first gate electrode G1 is placed on the semiconductor layer A1, with a first gate insulating layer 103 in between. The first gate electrode G1 is made of molybdenum (Mo), aluminum (Al), copper (Cu), It may contain titanium (Ti) or other materials and consist of a single layer or multiple layers. For example, the first gate Electrode G1 may be a single layer of Mo.

[0083] The first gate insulating layer 103 is for insulating the semiconductor layer A1 from the first gate electrode G1. Therefore, silicon oxide (SiO2), silicon nitride (SiN x ), silicon oxynitriding Substances (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tan Talc oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO2) ) may also be included.

[0084] On semiconductor layer A2, sandwiched between the first gate insulating layer 103 and the second gate insulating layer 105 The second gate electrode G2 is positioned. The second gate electrode G2 is made of molybdenum (Mo) and aluminum. It may also contain conductive materials such as nium (Al), copper (Cu), and titanium (Ti), as described above. It may be formed in a multilayer or monolayer containing the material. As an example, the second gate electrode G2 is It may be a single layer of Mo, or a multilayer structure of Mo / Al / Mo.

[0085] The second gate insulating layer 105 may contain an inorganic material including an oxide or nitride. For example, The second gate insulating layer 105 is made of silicon oxide (SiO2) and silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or sub It may also contain lead oxide (ZnO2), etc.

[0086] The source electrodes S1, S2 and drain electrodes D1, D2 are arranged on the interlayer insulating layer 107. The source electrodes S1, S2 and drain electrodes D1, D2 are made of molybdenum (Mo) and aluminum. It may also contain conductive materials such as nium (Al), copper (Cu), and titanium (Ti), as described above. It may be formed by a multilayer or monolayer containing the material. As an example, source electrode S1, S2 and the drain electrodes D1 and D2 may consist of a Ti / Al / Ti multilayer structure.

[0087] The interlayer insulating layer 107 is made of silicon oxide (SiO x ), silicon nitride (SiN x ), Shi Lyconoxide nitride (SiON), aluminum oxide (Al2O3), titanium oxide (Ti O2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide It may contain substances such as ZnO2.

[0088] As mentioned above, the first gate electrode G1 of the first thin-film transistor T1 and the second thin-film transistor The second gate electrode G2 of T2 may be placed on different layers. Adjust the drive ranges of thin-film transistor T1 and second thin-film transistor T2 to be different. It is possible.

[0089] The first electrode CE1 of the storage capacitor Cst is in the same layer as the first gate electrode G1. It may be formed from the same material. The second electrode CE2 of the storage capacitor Cst is The second electrode CE2 is placed on the second gate insulating layer 105 and superimposed on the first electrode CE1. The second gate electrode G2 may be formed in the same layer and of the same material.

[0090] In Figures 7 and 8, the storage capacitor Cst is connected to the first thin-film transistor T1 and It is illustrated so as not to overlap with the second thin-film transistor T2. However, it is not limited to that. It is not something that can be done. For example, the storage capacitor Cst is connected to the first thin-film transistor T1 They may be arranged in superimposition. In some embodiments, the storage capacitor Cst The first electrode CE1 may be formed integrally with the first gate electrode G1. That is, the first thin film The first gate electrode G1 of transistor T1 is connected to the first electrode CE of storage capacitor Cst. It can perform the function described in 1.

[0091] A planarization layer 109 is located on top of the source electrodes S1, S2 and the drain electrodes D1, D2. A planarized layer 109 can be used to position an organic light-emitting element (OLED) 300. The chemical layer 109 may be a film made of an organic substance, formed in a single layer or multiple layers. These are general-purpose high-grade materials such as polymethyl methacrylate (PMMA) and polystyrene (PS). Molecules, polymer derivatives having phenolic groups, acrylic polymers, imide polymers, ants Ether polymers, amide polymers, fluorine polymers, p-xylene polymers, vinyl It may also contain alcohol-based polymers and blends thereof. 9 may be formed by a composite laminate of an inorganic insulating film and an organic insulating film.

[0092] On the planarization layer 109 within the first display area DA 1 and the second display area DA2 of the substrate 100, An organic light-emitting element 300 may be arranged. The organic light-emitting element 300 may include a common layer. i. At this time, the common layer is formed in common in the first display area DA1 and the second display area DA2. It may be a layer that is a common layer. For example, the common layer may be at least one of the intermediate layers 320 (for example In the intermediate layer 320, one of the remaining layers excluding the light-emitting layer 322, and the counter electrode 3 It may also include 30. The organic light-emitting element 300 as described above has a pixel electrode 310 and a counter electrode 3 The material may include 30 and an intermediate layer 320 interposed between them.

[0093] The pixel electrode 310, through an opening formed in the planarization layer 109, etc., first thin film transient Contact is made with either the source electrode S1 or the drain electrode D1 of the starter T1, It is electrically connected to the thin-film transistor T1. The pixel electrode 310 is a reflective electrode. Good. For example, the pixel electrode 310 is made of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, A reflective film formed on Ir, Cr, and their compounds, and a transparent film formed on the reflective film. Alternatively, it may comprise a translucent electrode layer. The transparent or translucent electrode layer is made of oxide Indium tin (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), zinc oxide Indium (In2O3), indium gallium oxide (IGO), and aluminum-doped acid It comprises at least one selected from the group including zinc oxide (AZO). It is possible.

[0094] A pixel definition film 112 may be placed on top of the planarization layer 109. 2 exposes the aperture corresponding to each subpixel, i.e., at least the central part of the pixel electrode 310. It has an opening that allows it to define pixels. The opening to be placed is called the first opening. The opening placed in the second display area DA2 is called the second opening. This is called the part. Also, the pixel definition film 112 is located on the edge of the pixel electrode 310 and on the top of the pixel electrode 310. By increasing the distance to the counter electrode 330 located in the part, the edge of the pixel electrode 310 This prevents the generation of arcs and other phenomena in the pixel. Such a pixel definition film 112 is made of poly Formed by organic compounds such as mid or hexamethyldisiloxane (HMDSO) That's good too.

[0095] The intermediate layer 320 includes a light-emitting layer 322. The light-emitting layer 322 emits red, green, and blue light. It may be formed by an organic material containing a fluorescent or phosphorescent substance, and the first display area In DA1 and the second display area DA2, patterning may be applied in accordance with the pixel P. The intermediate layer 320 is a first functional layer 321 interposed between the light-emitting layer 322 and the pixel electrode 310. and at least of the second functional layer 323 interposed between the light-emitting layer 322 and the counter electrode 330 It may also include any one of the functional layers.

[0096] The first functional layer 321 includes a hole injection layer (HIL) and / or a hole transport layer (HTL). But that's fine.

[0097] The hole injection layer facilitates the release of holes to the anode, and the hole transport layer is the hole injection layer The holes are transmitted to the light-emitting layer.

[0098] The hole injection layer is made of phthalocyanine compounds such as copper phthalocyanine, N,N'-di Phenyl-N,N'-bis-[4-(phenyl-m-tolyl-amino)-phenyl]-bis Phenyl-4,4'-diamine (DNTPD), 4,4',4”-tris(3-methylphenyl Phenylphenylamino)triphenylamine (m-MTDATA), 4,4',4”-T RIS(N,N-diphenylamino)triphenylamine (TDATA), 4,4',4” -Tris{N-(2-naphthyl)-N-phenylamino}-triphenylamine(2T- NATA), 4,4',4”-Tris{N-(2-naphthyl)-N-phenylamino}- Triphenylamine), poly(3,4-ethylenedioxythiophene) / poly(4-ethylenedioxythiophene) Lenosulfonate (PEDOT / PSS), Polyaniline / Dodecylbenzenesulfone Acid (Pani / DBSA), Polyaniline / Camphor Sulfonic Acid (Pani / CSA) Or containing polyaniline / poly(4-styrene sulfonate (PANI / PSS), etc.) That's fine, but it's not limited to those.

[0099] The hole transport layer is made of carbazoles such as N-phenylcarbazole and polyvinylcarbazole. Zole derivatives; N,N'-bis(3-methylphenyl)-N,N'-diphenyl-[1, 1-biphenyl]-4,4'-diamine (TPD), N,N'-di(1-naphthyl)-N ,N'-diphenylbenzidine (NPB), 4,4',4”-tris(N-carbazolyl It may also contain triphenylamine-based substances such as triphenylamine (TCTA). However, it is not limited to those.

[0100] The second functional layer 323 includes an electron transport layer (ETL) and / or an electron injection layer (EIL). But that's fine.

[0101] The electron injection layer allows electrons to be easily emitted from the cathode, and the electron transport layer is the electron injection layer To ensure that electrons are transmitted to the light-emitting layer.

[0102] The electron transport layer is Alq3,2,9-dimethyl-4,7-diphenyl-1,10-fe Nanthroline (BCP), 4,7-diphenyl-1,10-phenanthroline (Bphe n), 3-(4-biphenylyl)-4-phenyl-5-tert-butylphenyl-1, 2,4-Triazole (TAZ), 4-(naphthalene-1-yl)-3,5-diphenyl -4H-1,2,4-triazole (NTAZ), 2-(4-biphenylyl)-5-(4 -tert-butylphenyl)-1,3,4-oxadiazole (tBu-PBD), S(2-methyl-8-quinolinolate-N1,O8)-(1,1'-biphenyl-4-O) (RAH) Aluminum (BAlq), Beryllium bis(benzoquinoline-10-oleate) (Bebq2), 9,10-di(naphthalene-2-yl)anthracene (ADN), etc. It may include, but is not limited to, those.

[0103] The electron injection layer is made of materials such as LiF, NaCl, CsF, Li2O, BaO, and Liq. It may contain, but is not limited to, certain substances.

[0104] Here, the intermediate layer 320 is not necessarily limited to those, but has a variety of structures. It goes without saying that this is also possible. And the intermediate layer 320 contains multiple images It may also include a layer that is integrated across the elementary electrode 310, and each of the multiple pixel electrodes 310 It may include layers patterned to correspond to the following. For the sake of explanation below, Therefore, the light-emitting layer 322 is patterned to correspond to each of the multiple pixel electrodes 310. The first functional layer 321 and the second functional layer 323 are connected across multiple pixel electrodes 310. This will be explained in detail, focusing on the case where the device is placed on a substrate 100 within the body.

[0105] The opposing electrode 330 is positioned above the first display area DA1 and the second display area DA2. As shown in Figures 7 and 8, the first display area DA1 and the second display area DA2 are They may be positioned to cover. That is, the counter electrode 330 is positioned over multiple organic light-emitting elements. They may be integrally formed and correspond to multiple pixel electrodes 310. The opposing electrode 330 is located above the first display area DA1, above the second display area DA2, and off-display. It is also possible to position it so as to cover the upper part of a portion of the display area. In the following description... For convenience, the opposing electrode 330 is located above the first display area DA1 and above the second display area DA2. This section will explain in detail the case where the element is positioned to cover the upper part of the section and part of the hidden area.

[0106] The counter electrode 330 may be a translucent electrode. For example, the counter electrode 330 may be transparent or The electrodes may be translucent, and include Li, Ca, LiF / Ca, LiF / Al, Al, Ag It may be formed by a thin metal film with a low work function, containing Mg and their compounds. Also, on a thin metal film, TCO(t) such as ITO, IZO, ZnO, or In2O3 is applied. Even if a transparent conductive oxide film is further arranged... stomach.

[0107] The pixel electrode 310 is provided by a reflective electrode, and the counter electrode 330 is provided by a translucent electrode. As a result, the light emitted from the intermediate layer 320 is emitted towards the opposing electrode 330, resulting in front emission. It may also be a type. However, this embodiment is not limited thereto, and the intermediate layer 32 The light emitted from 0 may also be a back-emitting type, where the light is emitted towards the substrate 100. In total, the pixel electrode 310 is composed of a transparent or translucent electrode, and the counter electrode 330 is It may be composed of reflective electrodes. Furthermore, the display device of this embodiment has both a front and a back. It may also be a double-sided light-emitting type that emits light in one direction.

[0108] A capping layer 400 may be placed on top of the counter electrode 330. The capping layer 400 can directly contact the counter electrode 330. 00 has a refractive index lower than that of the counter electrode 330 and a refractive index higher than that of the first inorganic sealing layer 510. It can have. The capping layer 400 emits light from the intermediate layer 320, which includes the light-emitting layer 322. By reducing the proportion of generated light that is totally reflected and not emitted to the outside, the light efficiency can be improved. can.

[0109] The thickness of the first common layer located in the first display area DA1 as described above, and the thickness of the second display area DA The thicknesses of the second common layers placed in 2 may be different from each other. More specifically, the first The thickness of the first common layer located in the display area DA1, and the second common layer located in the second display area DA2. It may be thicker than the thickness of the through layer. For example, the first functional layer 321, the light-emitting layer 322, and the second functional layer 323, the thickness of one of the counter electrode 330 or the capping layer 400 is shown in Figure 6. The first display area DA1 and the second display area DA2 may be different from each other. For example, the first functional layer 321, the light-emitting layer 322, and the second functional layer are arranged in the first display area DA1. 323, the thickness of one of the counter electrode 330 or the capping layer 400 is the second display area The DA2 consists of a first functional layer 321, a light-emitting layer 322, a second functional layer 323, and a counter electrode 33. It may be 0 or one of the capping layers 400 or more in thickness. In particular, the first display area A first functional layer 321, a light-emitting layer 322, a second functional layer 323, and a counter electrode 3 are arranged in region DA1. One of the 30 or capping layer 400 completely covers the open portion of the mask described later. On the other hand, the vapor-deposited material can be deposited by passing through the second display area DA2. The first functional layer 321, light-emitting layer 322, second functional layer 323, counter electrode 330 or cap One of the ping layers 400 may be partially blocked by the mask's ribs.

[0110] Furthermore, the first functional layer 321, the light-emitting layer 322, and the second functional layer are located in the second display area DA2. 323, the thickness of one of the counter electrode 330 or the capping layer 400 is the second display area It may be different with respect to the width direction of DA2. In this case, the width direction of the second display area DA2 is The direction may be between the X and Y axes in Figure 4. In particular, the width of the second display area DA2 is The measurement may be taken perpendicular to the edge of the 2 display area DA2. In the case described above, 2 Display area DA2 consists of a first functional layer 321, a light-emitting layer 322, a second functional layer 323, and The thickness of either the direct electrode 330 or the capping layer 400 is the width of the second display area DA2. It is thinnest at any point in the direction. At this time, it is located in the second display area DA2. First functional layer 321, light-emitting layer 322, second functional layer 323, counter electrode 330 or capping One of the thicknesses of the 400 layers is the first functional layer 3, which is arranged in the width direction of the second display area DA2. 21, light-emitting layer 322, second functional layer 323, counter electrode 330 or capping layer 400 From one point in the second display area DA2, which has the thinnest thickness, the edge of the second display area DA2 It increases linearly as you move towards the edge. In particular, the first unit located at the edge of the second display area DA2 Functional layer 321, light-emitting layer 322, second functional layer 323, counter electrode 330 or capping layer 4 One of the thicknesses of 00 is the first functional layer 321 and the light-emitting layer 3 located in the first display area DA1. 22, the thickness of one of the following: second functional layer 323, counter electrode 330, or capping layer 400 It is identical or nearly identical to the above. In the case described above, the first functional layer 321, the light-emitting layer 32 2. The thickness of one of the second functional layer 323, the counter electrode 330, or the capping layer 400 is The thinnest point in the second display area DA2 is also the center of the width of the second display area DA2. That is, the first functional layer 321, the light-emitting layer 322, the second functional layer 323, the counter electrode 330 or The thickness of one of the capping layers 400 is measured from the center of the width of the second display area DA2 to the second The thickness increases towards the edges of the second display area DA2. Therefore, the thickness of the second common layer is the second The thickness can decrease from the edge of the common layer towards the center of the second common layer.

[0111] The thin film sealing layer 500 covers the first display area DA1, the second display area DA2, and the non-display area. This prevents the penetration of external moisture and oxygen. The thin film sealing layer 500 is at least It may comprise one organic encapsulation layer and at least one inorganic encapsulation layer. (Figures 7 and 7) 8 consists of two inorganic encapsulation layers 510 and 530 and one organic encapsulation layer 5 An example including 20 is shown, but the stacking order and number of stacks are shown in Figures 7 and 8. This is not limited to the embodiments.

[0112] The first inorganic encapsulation layer 510 covers the counter electrode 330 and consists of silicon oxide and silicon nitrile. It may also contain toride and / or silicon oxynitride, etc. Here, if necessary Therefore, as described above, capping occurs between the first inorganic sealing layer 510 and the counter electrode 330. It goes without saying that other layers, such as layer 400, are interposed. The sealing layer 510 is formed along the structure below it, as shown in Figures 7 and 8. As shown, its upper surface is no longer flat.

[0113] The organic encapsulation layer 520 covers the first inorganic encapsulation layer 510, but unlike the first inorganic encapsulation layer 510 It may have a nearly flat top surface. Specifically, the organic sealing layer 520 has a first display area DA The portion corresponding to 1 may have a substantially flat upper surface. Such an organic sealing layer 520 These are polyethylene terephthalate, polyethylene naphthalate, polycarbonate, and poly Imide, polyethylene sulfonate, polyoxymethylene, polyarylate, hexamethylene The second inorganic sealing layer may contain one or more materials selected from the group consisting of ludisiloxanes. 530 covers the organic encapsulation layer 520 with silicon oxide, silicon nitride and / Alternatively, it may contain silicon oxynitride or the like.

[0114] Thus, the thin film encapsulation layer 500 consists of a first inorganic encapsulation layer 510, an organic encapsulation layer 520 and a second Although it includes an inorganic encapsulation layer 530, through such a multilayer structure, clumps within the thin film encapsulation layer 500 Even if a leak occurs, it will be between the first inorganic sealing layer 510 and the organic sealing layer 520, or between the organic sealing layers. Such cracks do not connect between the sealing layer 520 and the second inorganic sealing layer 530. Therefore, external moisture and oxygen, etc., affect the first display area DA1, the second display area DA2 and This can prevent or minimize the formation of paths that penetrate into hidden areas. The second inorganic sealing layer 530, as shown above, is located outside the first display area DA1 and the second display area DA2. At the edge where it is located, by making contact with the first inorganic sealing layer 510, organic The sealing layer 520 is not exposed to the outside.

[0115] A partition wall 120 is placed in the non-display area of ​​the substrate 100.

[0116] The partition wall 120 is a thin film sealing layer 500 for sealing the first display area DA1 and the non-display area. When forming the organic sealing layer 520, the organic material is prevented from flowing towards the edge side of the substrate 100. This prevents the formation of edge tails in the organic encapsulation layer 520.

[0117] The partition wall 120 described above may be provided in at least one form. If there are multiple 0s, the multiple partition walls 120 are separated from each other by the first partition wall 120A or including a second bulkhead 120B.

[0118] At least one of the first partition wall 120A and the second partition wall 120B is formed in multiple layers. This is also acceptable. In Figure 7, the first partition wall 120A is formed from the same material as the planarization layer 109. The first layer 121A and the second layer 123A, which is made of the same material as the pixel definition film 112, are stacked. shown as the formed structure, the second partition wall 120B is made of the same material as the planarization layer 109 The first layer 121B formed from, and the second layer 12 formed from the same material as the pixel defining film 112 are shown as a stacked structure. However, it is not limited thereto. One of the first partition wall 120A and the second partition wall 120B may be formed as a single layer, or both may have a two-layer structure, or both may have a three-layer structure, so various modifications are possible Further partition walls arranged separately from the first partition wall 120A and the second partition wall 120B may be further included.

[0119] Although not shown in FIGS. 7 and 8, the spacer may be disposed on a flat portion of the pixel defining film 112 and protrude from the flat surface of the pixel defining film 112 to the thin film encapsulation layer 500. The spacer may be formed of an organic material such as polyimide or hexamethyldisiloxane (HMDSO).

[0120] When a plurality of partition walls are included in the partition wall 120, it is possible to more effectively prevent the overflow of the organic material when the organic encapsulation layer 520 is formed.

[0121] FIG. 9 is a cross-sectional view showing a display panel according to another embodiment of the present invention.

[0122] Referring to FIG. 9, the substrate 100 may not include a through hole corresponding to the opening region OP. The display layer 200 may include a through hole 200H corresponding to the opening region OP. The thin film encapsulation layer 500 may not include a through hole corresponding to the opening region OP. At this time, the insulating film may not be disposed in the opening region OP.

[0123] ​​​​​In such a case, the display panel 10 may include a first display area DA1, a second display area DA2, a first non-display area NDA1, and a second non-display area NDA2. At this time, the first display area DA1, the second display area DA2, the first non-display area NDA1, and the second non-display area NDA2 are the same as or similar to those described in FIGS. 1 to 8 above, so detailed description thereof will be omitted. The first non-display area NDA1 and the second non-display area NDA2 may be included. At this time, the first display area DA1, the second display area DA2, the first non-display area NDA1, and the second non-display area NDA2 are the same as or similar to those described in FIGS. 1 to 8 above, so detailed description thereof will be omitted. The first display area DA1, the second display area DA2, the first non-display area NDA1, and the second non-display area NDA2 are the same as or similar to those described in FIGS. 1 to 8 above, so detailed description thereof will be omitted. Detailed description will be omitted.

[0124] FIG. 10 is a cross-sectional view showing a display panel according to still another embodiment of the present invention.

[0125] Referring to FIG. 10, the display layer 200 may not include the through hole 200H corresponding to the opening region OP, and the display element layer 200A may not be located in the opening region OP. At this time, in the opening region OP, the pixel circuit layer 200B may be disposed in the display layer 200, or an insulating film may be disposed in the pixel circuit layer 200B. As another embodiment, it is also possible that no separate layer is disposed in the opening region OP other than the substrate 100. The display layer 200 may not include the through hole 200H corresponding to the opening region OP, and the display element layer 200A may not be located in the opening region OP. At this time, in the opening region OP, the pixel circuit layer 200B may be disposed in the display layer 200, or an insulating film may be disposed in the pixel circuit layer 200B. As another embodiment, it is also possible that no separate layer is disposed in the opening region OP other than the substrate 100. At this time, in the opening region OP, the pixel circuit layer 200B or an insulating film may be disposed in the pixel circuit layer 200B in the display layer 200. As another embodiment, it is also possible that no separate layer is disposed in the opening region OP other than the substrate 100. As another embodiment, it is also possible that no separate layer is disposed in the opening region OP other than the substrate 100. Other than the substrate 100, it is also possible that no separate layer is disposed in the opening region OP.

[0126] In such a case, the display panel 10 may include a first display area DA1, a second display area DA2, a first non-display area NDA1, and a second non-display area NDA2. At this time, the first display area DA1, the second display area DA2, the first non-display area NDA1, and the second non-display area NDA2 are the same as or similar to those described in FIGS. 1 to 8 above, so detailed description thereof will be omitted. The first non-display area NDA1 and the second non-display area NDA2 may be included. At this time, the first display area DA1, the second display area DA2, the first non-display area NDA1, and the second non-display area NDA2 are the same as or similar to those described in FIGS. 1 to 8 above, so detailed description thereof will be omitted. The first display area DA1, the second display area DA2, the first non-display area NDA1, and the second non-display area NDA2 are the same as or similar to those described in FIGS. 1 to 8 above, so detailed description thereof will be omitted. Detailed description will be omitted.

[0127] FIG. 11 is a cross-sectional view showing a display panel according to still another embodiment of the present invention. FIG. 12 is a cross-sectional view showing the display panel illustrated in FIG. 11. FIG. 12 is a cross-sectional view showing the display panel illustrated in FIG. 11.

[0128] Referring to Figures 11 and 12, the aforementioned display panel 10, which includes a thin film sealing layer 500, Unlike the others, the display panel 10' shown in Figures 11 and 12 is connected to the sealing substrate 500A and the sealing substrate. It may also include a ring portion 700.

[0129] One or more of the substrate 100, display layer 200, and sealing substrate 500A have an opening region It can be equipped with through-holes 100H, 200H, and 500AH corresponding to the area OP. The display element layer 200A does not necessarily have to be placed in the aperture region OP.

[0130] The substrate 100 may contain glass or a polymer resin. The polymer resin is a polyethylene resin. Sulfone, polyacrylate, polyetherimide, polyethylene naphthalate, poly Ethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, Contains polymer resins such as recarbonate or cellulose acetate propionate. Alternatively, the substrate 100 is a multilayer including a layer containing the aforementioned polymer resin and an inorganic layer (not shown). It is also a structure. In the following explanation, for the sake of convenience, the substrate 100 is formed of glass. We will explain in detail, focusing on the cases where this occurs.

[0131] The sealing portion 700 may be positioned between the substrate 100 and the sealing substrate 500A. The ring portion 700 may be located in the opening region OP and the second non-display region NDA2. In this case, the sealing portion 700 may be located in the second non-display area NDA2, and the second non-display area The sealing portion 700 located in the indicated area NDA2 completely surrounds the opening area OP. It may be placed in [location].

[0132] The sealing substrate 500A may be arranged to face the substrate 100. In such a case , the sealing substrate 500A may be the same as or formed of a similar material as the substrate 100. In particular, the sealing substrate 500A may be formed of glass. In other embodiments , the sealing substrate 500A may include plastic. At this time, the sealing substrate 500 A may include at least one layer including at least one resin.

[0133] <照れ The dummy wiring 220 can be arranged in the first non-display area NDA1 and the second non-display area NDA2 during the manufacture of the source electrodes S1, S2 and / or the drain electrodes D1, D2. In particular , the dummy wiring 220 may be arranged in a part of the substrate 100 where the sealing part 700 is arranged . In such a case as described above, the sealing part 700 can firmly bond the substrate 100 and the sealing substrate 500A.

[0134] In such a case as described above, the first display area DA1, the second display area DA2, the first non-display area NDA 1 and the second non-display area NDA2 are similar to those described in FIGS. 1 to 8 above, and detailed description thereof will be omitted.

[0135] In such a case as described above, the first display area DA1, the second display area DA2, the first non-display area NDA 1 and the second non-display area NDA2 are similar to those described in FIGS. 1 to 8 above, and detailed description thereof will be omitted. [[ID=照れ32]]<照れ

[0136] FIG. 13 is a cross-sectional view showing a display panel according to still another embodiment of the present invention.

[0137] Referring to FIG. 13, the display panel 10' can also form through holes MH 500 AH only in the sealing substrate 500A. At this time, a separate display element layer 20 0A may not be arranged in the opening area OP. Also, a pixel circuit layer 200B is formed in the opening area OP It is not necessary. In this case, the through-hole 500AH of the sealing substrate 500A does not include a drill, etc. It can be formed via a removal section.

[0138] In the case described above, the first display area DA1, the second display area DA2, and the first non-display area NDA The first and second non-display areas NDA2 are similar to those described in Figures 1 to 8 above. I will omit the detailed explanation.

[0139] Figure 14 is a cross-sectional view showing a display panel according to yet another embodiment of the present invention.

[0140] Referring to Figure 14, the display panel 10' includes a separate through-hole in the opening area OP. It is not necessary. In such cases, the pixel circuit layer 200B is placed in the aperture region OP, and the surface The display element layer 200A does not need to exist. In this case, the aperture region OP is within the display layer 200. A pixel circuit layer 200B, or an insulating film, may be placed in the pixel circuit layer 200B. In one embodiment, no additional layer other than the substrate 100 may be placed in the opening region OP. It is possible. Also, even if the sealing portion 700 is placed only in the first non-display area NDA1 good.

[0141] In the case described above, the first display area is DA1, the second display area is DA2, and the first non-display area is NDA1. The second non-display area NDA2 is similar to the one described in Figures 1 to 8 above. Detailed explanations will be omitted.

[0142] Figure 15 shows a cross-section of a manufacturing apparatus for a display device according to an embodiment of the present invention. This is a diagram. Figure 16 is a perspective view showing the mask assembly shown in Figure 15. Figure 17 is This is a cross-sectional view taken along the line C-C' in Figure 16.

[0143] Referring to Figures 15 to 17, the manufacturing apparatus 800 for the display device consists of a chamber 810 and a first support Holding part 820, second support part 830, mask assembly 840, source part 860, pressure adjustment part 87 It may also include 0 and the vision section 880.

[0144] Chamber 810 has a space formed inside it where deposition takes place. At this time, chamber 81 An open portion is formed in 0, and a gate valve 811 is located in such an open portion. The positioned and open sections can be shielded or opened.

[0145] The first support portion 820 is located inside the chamber 810 and supports the display substrate D. It is possible. The display board D is shown in Figures 7, 8 and 12 above. sea ​​urchin, substrate 100, buffer layer 101, first gate insulating layer 103, second gate insulating layer 10 5. Interlayer insulating layer 107, planarization layer 109, pixel definition film 112, pixel electrode 310, first thin film Includes transistor T1, second thin-film transistor T2, and storage capacitor Cst That's good too.

[0146] The first support portion 820 may have a variety of shapes. For example, the first support portion 820 may be a cha The display board D may be fixed inside the rmb 810, and the first support portion 820 is mounted on the display board D. In another embodiment, the first support portion 820 moves linearly within the chamber 810. It may have a movable shuttle shape. In yet another embodiment, the first support portion 820 is , positioned inside the chamber 810 and having a clamp shape for gripping the display substrate D This is also acceptable. In yet another embodiment, the first support portion 820 is located in the chamber 810. This may include an electrostatic chuck or an adhesive chuck for securing the display substrate D. At that time, the first support portion 820 is not limited to the above, but is also a display substrate This may include all devices and structures supporting D. However, in the following, For the convenience of the present, the first support part 820 is fixed inside the chamber 810, and the display This section will provide a detailed explanation, focusing primarily on the case where substrate D is mounted.

[0147] The second support section 830 is where the mask assembly 840 is placed and supports the mask assembly 840. This can be done. At this time, the second support part 830 adjusts the position of the mask assembly 840. This is possible. For example, the second support part 830 raises and lowers the mask assembly 840 by a certain distance. It may be rotated or moved linearly in one direction.

[0148] The mask assembly 840 can selectively allow the vapor-deposited material to pass through. The assembly 840 may include at least one opening 842a-1. For example, In one embodiment, the mask assembly 840 has one opening 842a-1 through which the vapor-deposited material passes It can be equipped with the following. At this time, the deposited material that has passed through the opening 842a-1 is dis It can be deposited on one area of ​​the play board D to form one display area. Other embodiments In its configuration, the mask assembly 840 has multiple openings 842a-1 through which the vapor-deposited material passes. It may be provided. In such a case, the display substrate D is divided into multiple regions, each The deposition material that passes through opening 842a-1 is deposited on each region of the display substrate D, One display area can be formed in the region. In particular, in such cases, the display base Each region of plate D may be separated from each other after the deposition of the vapor-deposited material, thereby creating a single display. The device may be manufactured. In the following, for the sake of explanation, the mask assembly 840 is This will be explained in detail, focusing on the case involving multiple openings 842a-1.

[0149] In one embodiment, the mask assembly 840 may include a mask sheet 842. As an embodiment, the mask assembly 840 comprises a mask frame 841 and a mask sheet 842. It may include. In the following, for the sake of explanation, the mask assembly 840 is a mask This will be explained in detail, focusing on the case where frame 841 and mask sheet 842 are included.

[0150] The mask frame 841 may have an opening 841a in the center. 41 may have a shape similar to a window frame.

[0151] The mask sheet 842 may be placed on the mask frame 841. One or more masks Mask sheet 842 may be included. If multiple mask sheets 842 are included, multiple sheets The mask sheet 842 is formed in a plate shape and is arranged adjacent to each other, mask frame They may be arranged in frame 841. For example, mask sheet 842 may be in mask frame 841. The longitudinal direction (for example, the X-axis direction in Figure 10), or the width direction of the mask frame 841 (for example) Alternatively, they can be arranged so as to be separated from each other in the Y-axis direction (as shown in Figure 10). However, as follows... Therefore, for the sake of explanation, we will focus on the case where the mask sheet 842 is formed from a single sheet in detail. explain.

[0152] The mask sheet 842 includes a body portion 842a, a shielding portion 842b, and ribs 842c. That's good too.

[0153] The body portion 842a is arranged in multiple units corresponding to each region of the display substrate D. It may be provided with an opening 842a-1. The opening 842a-1 is a display base The plate D may have a shape corresponding to the display area of ​​each region. In this case, the opening 842a-1 The vapor-deposited material that passes through is deposited onto each region of the display substrate D, forming the display region. This can be done. At this time, multiple display areas can be formed in each region of the display substrate D. Afterward, the display substrates D may be separated from each other to manufacture a single display panel. In another embodiment, the body portion 842a includes one opening 842a-1 and one It is also possible to manufacture a single display panel by guiding the vapor-deposited material onto the display area of ​​the display substrate D. It is possible. In the following explanation, for the sake of convenience, the body portion 842a has multiple openings This will be explained in detail, focusing on cases that include 842a-1.

[0154] The shielding portion 842b is connected to the rib 842c so as to protrude toward the display substrate D side. It is also acceptable. One side of the shielding portion 842b (or the end of the shielding portion 842b) of the rib 842c It may be positioned to be even further away from the source section 860 than one side. The shielding portion 842b may have a planar shape corresponding to the shape of the opening region described above. For example, If the opening region to be formed is circular, the shielding portion 842b shall have a circular planar shape. It may be formed as follows. In another embodiment, if the opening region to be formed is polygonal, The shielding portion 842b may be formed to have a polygonal planar shape. The planar shape of 842b is not limited to what has been described above, but rather depends on the shape of the opening region. Furthermore, it may be formed to correspond to the shape of the opening region.

[0155] One surface of the shielding portion 842b facing the display substrate D as described above is disposed closer to the display substrate D than one surface of the body portion 842a facing the display substrate D. It may be disposed. In such a case, the shielding portion 842b may be in complete contact with the display substrate D.

[0156] The rib 842c may extend obliquely with respect to the longitudinal direction of the mask sheet 842 (for example, one direction of the X-axis direction or the Y-axis direction in FIG. 16). At this time, the rib 842c may be disposed inside the opening 842a-1. That is, the rib 842c may be disposed so as to cross the opening 842a-1.

[0157] In the case as described above, the first distance I1 from one surface of the rib 842c facing the display substrate D to one surface of the shielding portion 842b facing the display substrate D may be 2.7×10 times or more of the second distance I2 from one surface of the rib 842c facing the source portion 860 to the source portion 860. At this time, when the first distance I1 is less than 2.7×10 times of the second distance I2, a deposition substance is deposited on the portion of the display substrate D disposed on the back surface of the shielding portion 842b, so that one of the first functional layer 321, the light emitting layer 322, the second functional layer 323, the counter electrode 330 or the capping layer 400 is formed in the opening region as described above, and the transmittance in the opening region is reduced. -4 -4

[0158] The mask frame 841 and / or the mask sheet 842 further includes a magnetic body 843. But that's fine. In this case, if the mask frame 841 includes the magnetic material 843, the mask frame 841 itself can also be formed from a magnetic material, as illustrated in Figure 10. Multiple magnetic materials 843 are provided and arranged on the mask frame 841 so as to be separated from each other. It is also possible to place it. In addition, if the mask sheet 842 contains a magnetic material 843, It is also possible to form the sheet 842 itself from a magnetic material. As illustrated in Figure 10. Therefore, multiple magnetic materials 843 are provided and arranged in the body portion 842a so as to be separated from each other. It is also possible to place it. In the following, for the sake of explanation, mask sheet 842 This will be explained in detail, focusing on the case where the magnetic material 843 contains multiple magnetic materials.

[0159] The mask frame 841 and / or mask sheet 842 described above are made of carbon fiber It may also include. In one embodiment, the mask sheet 842 is formed of carbon fiber. Furthermore, the mask frame 841 can also be shaped by magnetic material or Invar material. This is accomplished. In another embodiment, the mask frame 841 and the body portion 842a are made of a magnetic material. Alternatively, it may be formed of Invar material, with ribs 842c and shielding portion 842b made of carbon fiber. It is also possible to form it by the following. In such a case, the rib 842c is the body portion 84 2a is fixed by bolts or screws, or by a separate adhesive (for example) , such as VAC seals (high vacuum leak sealants) It can also be fixed to the body portion 842a by a seal. The mask frame 841, body portion 842a and rib 842c are made of magnetic material or It is formed from bar material, with only the shielding portion 842b being formed from carbon fiber. This is also possible. Furthermore, in other embodiments, a mask frame 841 and a mask sheet 84 Both of the two can also be formed from carbon fiber. The following explanation will be provided. For the convenience of the present, the mask sheet 842 is integrally formed, and the mask sheet 842 is made of carbon fiber We will explain in detail the case where it is formed by fiber.

[0160] The display device manufacturing apparatus 800 further includes a magnetic field generating unit 850 located in the chamber 810. It may include. In this case, the magnetic force generating unit 850 is provided in the form of a mask assembly 840. It may be provided, but it is not required. In the following, for the sake of explanation, a display device will be used. The manufacturing apparatus 800 will be described in detail, focusing primarily on the case where it includes a magnetic field generating unit 850.

[0161] The magnetic field generating unit 850 is located inside the chamber 810 and displays the mask assembly 840. It can be brought into close contact with the substrate D side. In such a case, the magnetic force generating unit 850 generates a magnetic force It may include at least one of the magnets and electromagnets that are generated.

[0162] The source section 860 houses the vapor-deposited material and sublimes or vaporizes the vapor-deposited material. This can be done. At this time, the source section 860 is equipped with a heater to apply heat to the deposited material. It is possible. In addition, the source section 860 is designed to house the vapor-deposited material. , may include a crucible. The source section 860 as described above is stopped inside the chamber 810. Either it is performing linear movement and reciprocating movement in one direction within the chamber 810. This is possible. When the source unit 860 moves, the chamber 810 contains the source A source drive unit (not shown) may be provided to move the 860 linearly and reciprocally. In such cases, the source drive unit may include a linear motor. However, in the following cases... For the sake of explanation, this will focus on the case where the source unit 860 is fixed inside the chamber 810. I will explain in detail below.

[0163] The vision unit 880 is located in the chamber 810 and is used for the display substrate D and mask assembly. At least one of the body 840 can be photographed. The image taken by the vision unit 880 Based on the data, the display board D and the mask assembly 840 can be aligned.

[0164] The pressure regulating unit 870 is connected to the chamber 810 and regulates the pressure inside the chamber 810. It is possible. The pressure regulating unit 870 has a guide pipe 871 connected to the chamber 810, Includes a vacuum pump 872 located in the guide piping 871, which regulates the pressure inside the chamber 810. That's fine. In such a case, the operation of the vacuum pump 872 will remove the air inside the chamber 810. The body can be expelled to the outside, or another gas can be supplied into the chamber 810. Cut.

[0165] A place where a display device (not shown) is manufactured via the aforementioned display device manufacturing apparatus 800. In total, the display board D can be placed inside the chamber 810. At this time, The assembly 840 can be placed inside the chamber 810.

[0166] In the case described above, the display substrate D is placed on the first support portion 820 and the mask assembly is performed. Body 840 may be placed on the second support portion 830.

[0167] As mentioned above, once the display board D and the mask assembly 840 are in place, the vision Through part 880, the alignment marks of the display substrate D and the mask assembly 840 By photographing and comparing the alignment marks of the display board D and the mask assembly, The body 840 can be aligned with the second support part 830. It is possible to make fine adjustments to the position of 40.

[0168] The magnetic force generating unit 850 can apply magnetic force to the mask assembly 840. As shown above, when the magnetic force generating unit 850 applies magnetic force, the mask assembly 840 is the display base It can be moved to the side of board D.

[0169] In the case described above, the shielding portion 842b is in complete contact with the display substrate D. or in contact with one side of the display substrate D, or in close proximity to the display substrate D It is possible.

[0170] The source unit 860 is activated, allowing the deposition material to be supplied into the chamber 810. In this case, the deposited material passes through the opening 842a-1 and is deposited on the display substrate D. Good. In such a case, the deposited material that has passed through opening 842a-1 will be displayed as described above. The first display area (not shown) and the second display area (not shown) of the substrate D may be deposited with a vapor deposition film.

[0171] In the case described above, a portion of the display substrate D is exposed through the opening 842a-1. The part is exposed, and the other part of the display substrate D does not have an opening 842a-1 formed therein. The mask sheet portion 842, the rib 842c, and the shielding portion 842b are not exposed to the outside. It is not necessary. In this case, the vapor-deposited material is deposited on a part of the exposed display substrate D. It's okay.

[0172] As mentioned above, while the deposition material is being deposited, the deposition material is also blocked by rib 842c. However, the deposited material ejected from the source unit 860 is incident on the display substrate D. Because the incident angles are diverse, some of the deposited material is directed towards the display opposite rib 842c. It is also deposited on substrate D. That is, among the deposition material sprayed from source section 860, vapor The angle between one surface of the display substrate D on which the deposition material is deposited and the deposited material is greater than a certain angle. In the case of a vapor-deposited material, by incident on one surface of the display substrate D at an angle... This allows it to be attached to the display board D portion located on the back of rib 842c. Of the deposited material sprayed from the source section 860, the deposited material that avoids the rib 842c Even when ribs 842c are placed by being deposited onto the display substrate D, the ribs A vapor deposition material is deposited onto the display area of ​​the display substrate D located on the back of the 842c. In such cases, rib 842c is positioned to be separated from the display substrate D to some extent. As a result, the vapor-deposited material is deposited on the display substrate D portion located on the back of rib 842c. It does not interfere with the deposition process.

[0173] In such cases, when the vapor deposition material is deposited, the shielding portion 842b, as described above, displays The shielding portion 842b is positioned on the display substrate, which is in complete contact with the ray substrate D. No vapor deposition material is deposited in area D. Therefore, in the display substrate D, the display area A vapor-deposited material is deposited in the remaining area of ​​the display region after removing the shielding portion 842b. Because no vapor deposition material is deposited in the area where the covering portion 842b is located, the display A second non-display region and an opening region can be formed on the substrate D where no deposition material is deposited.

[0174] While the aforementioned work is being carried out, the vacuum pump 872 operates, and inside the chamber 810 It is possible to release the gas to the outside.

[0175] Once the aforementioned process is complete, the mask assembly 840 is pulled out of the chamber 810. This can be done. At this time, the vacuum pump 872 operates, and the pressure inside the chamber 810 increases. It can be adjusted to be the same as, or similar to, atmospheric pressure.

[0176] Subsequently, the display board D can be discharged to the outside of the chamber 810, and a new D After inserting the spray substrate D into the chamber 810, the above-described process is repeated. Yes, it is possible. As mentioned above, the display substrate D on which the vapor-deposited material has been deposited has a ray in the aperture region. By irradiating with a laser or through mechanical wear, holes are formed or parts of the layer are removed. It is possible.

[0177] Once the aforementioned process is complete, a thin film encapsulation layer is formed on the display substrate D on which the deposition material has been deposited. It is possible to form this.

[0178] Therefore, the display device manufacturing apparatus 800 and the method for manufacturing the display device are formed in which an opening region is formed It is possible to manufacture a display device. Also, a display device manufacturing apparatus 800 and a display device The manufacturing method of the device prevents the deposition material from being applied to the opening region through a simple structure. This minimizes the amount of foreign matter generated during the formation of the opening region.

[0179] Figure 18 is a cross-sectional view showing another embodiment of the mask sheet illustrated in Figure 15.

[0180] Referring to Figure 18, the mask assembly 840 may include a mask sheet 842. At that time, the mask sheet 842 consists of the body portion 842a, the shielding portion 842b, and the ribs 842c. It may include. In this case, the body portion 842a, the shielding portion 842b and the rib 842c are as described above. Since this is similar to what is explained in Figures 15 to 17, a detailed explanation will be omitted.

[0181] One side of the shielding portion 842b facing the display substrate D, and the other side facing the display substrate D One side of the body portion 842a is separated from the display substrate D by the same distance. This is also acceptable. In such a case, the mask sheet 842 will be in complete contact with the display substrate D. This minimizes deformation of the mask sheet 842 even when external force is applied. This is possible. In particular, in the mask sheet 842, it is applied to the display substrate D side. The force applied prevents the mask sheet 842 from being deformed. By adhering closely to the spray substrate D, the high-temperature vapor-deposited material causes the mask sheet 842 to screw. This can reduce deformation of the mask sheet 842 caused by such factors.

[0182] Figure 19 is a cross-sectional view showing yet another embodiment of the mask sheet shown in Figure 15. .

[0183] Referring to Figure 19, the mask assembly 840 may include a mask sheet 842. At that time, the mask sheet 842 consists of the body portion 842a, the shielding portion 842b, and the ribs 842c. It may include. In this case, the body portion 842a, the shielding portion 842b and the rib 842c are as described above. Since this is similar to what is explained in Figures 15 to 17, a detailed explanation will be omitted.

[0184] The body portion 842a and the rib 842c may be formed to be separated from each other. In this case, the body portion 842a and the rib 842c may be formed from different materials. Example For example, the body portion 842a may contain a magnetic material or Invar, and the rib 842c is It may be formed of carbon fiber. In this case, the shielding portion 842b may also be made of carbon fiber. It may be formed in this way.

[0185] In the case described above, the body portion 842a has a mounting groove 8 on which the end of the rib 842c is placed. 42d may be formed. In this case, there is contact between the rib 842c and the body portion 842a. Adhesive 844 may be placed. In this case, the adhesive 844 is a tall seal as described above. It may include.

[0186] In the case described above, one side of the shielding portion 842b facing the display substrate D and the body portion One side of 842a may be arranged at the same distance from the display substrate D, and They may be placed at different distances. In such cases, the display board D is located away from the display The distance from the display substrate D to one side of the shielding portion 842b facing the substrate D is the distance from the display substrate D to the body The distance to one surface of section 842a may be less than or equal to the distance to one surface of section 842a.

[0187] Therefore, in the case described above, the vapor-deposited material is deposited on the display substrate D via the shielding portion 842b. This can prevent deposition on certain areas.

[0188] Figure 20 shows the deposited material that has passed through the ribs shown in Figures 17 to 19 onto the display substrate. This is a cross-sectional view showing the deposition process.

[0189] Referring to Figure 20, vapor deposition occurs via the mask assembly 840 shown in Figures 15 to 19. When material DM is deposited onto the display substrate D, the display substrate facing the rib 842c In the portion of plate D, a part of the vapor-deposited material DM is blocked by the rib 842c.

[0190] In such cases, the vapor-deposited material DM supplied from the source unit (not shown) is delivered at various angles. Alternatively, by directing light from various directions onto one surface of the display substrate D, other vapor deposition materials DM can be deposited. A portion of it is not blocked by rib 842c and is positioned opposite rib 842c. The vapor-deposited material DM can be deposited on the display substrate D.

[0191] In the case described above, the deposited material DM that has passed through the edge portion of rib 842c is deposited into rib 842 The center line CL portion passing through the center of c can reach the display substrate D portion, and rib 8 The deposited material DM, which travels from the edge of 42c to the center of rib 842c, is shielded by rib 842c. It may be refused.

[0192] In such cases, the thickness of the deposited material DM deposited on the display substrate D is rib 842 The further away from the center line CL passing through the center of c, the thicker it becomes linearly. That is, Dis Thickness of the vapor-deposited material in the second display area DA2 formed by vapor deposition of the vapor-deposited material DM onto the play board D. The width may be variable along the width direction of the second display area DA2. Specifically, the second display area The thickness of the deposited material in DA2 is determined at any point in the second display area DA2 (for example, the center point) or Furthermore, the edges of the second display area DA2 (for example, the first display area DA1 and the second display area DA2) The thickness increases linearly as you approach the boundary. Also, the deposition at the edge of the second display area DA2 The thickness of the material is approximately the same as, or identical to, the thickness of the deposited material in the first display area DA1. It will become.

[0193] The present invention has been described above with reference to an embodiment illustrated in the drawings, but these are illustrative examples. These are merely analogous to such things, and anyone skilled in the art in that field can derive various variations and implementations from them. It will be understood that the state can be transformed. Therefore, the true scope of technical protection of the present invention The scope is determined by the technical idea of ​​the patent claims. [Explanation of Symbols]

[0194] 1...Display device 10,10'...Display panel 30 components 40. Input sensing layer 50...Optical functional layer 60... windows 100... circuit board 101...Buffer layer 103...First gate insulating layer 105...Second gate insulating layer 107...Interlayer insulating layer 109...flattening layer 112... Pixel definition film 120...Bulkhead 200...display layer 200A...Display element layer 200B... Pixel circuit layer 220...Dummy wiring 300... Organic light-emitting element 310... Pixel electrodes 320...Middle class 321...1st functional layer 322...Luminous layer 323...2nd functional layer 330... Counter electrode 400... Capping layer 500...Thin film sealing layer 510...first inorganic sealing layer 520...Organic sealing layer 530...Second inorganic sealing layer 700···Sealing part 800... Manufacturing equipment for display devices 810... Chamber 820...1st support part 830...Second support part 840... Mask assembly 841... Mask frame 842... Mask Sheet 842a...Body part 842b...Shielding part 842c... Rib 843...Magnetic material 844... Adhesive 850...Magnetic force generation unit 860...Source section 870... Pressure regulating unit 871... Guide piping 872... Vacuum pump 880...Vision Department 1100... Scan Driver 1200...Data Driver

Claims

1. A first display area, an opening area located within the first display area, and at least one of the opening areas A peripheral region is arranged to surround a portion of it, and from the peripheral region, the first display area A substrate having a second display area that extends to the edge of the area, At least one first opening is placed on the substrate and positioned in the first display area. , and a pixel definition film having at least one second aperture arranged in the second display area and, Displaced in the first opening, commonly formed in the first display area, and containing a vapor-deposited material. The first common layer, Displaced in the second opening, commonly formed in the second display area, and containing a vapor-deposited material. The second common layer includes, The second display area is positioned opposite one vertex of the first display area They are arranged diagonally in a linear fashion with respect to one direction of the region. With respect to the width direction of the second display area, the thickness of the second common layer is equal to the thickness of the first common layer. It becomes thinner, and the thickness increases from the edge of the second display area towards the center of the second display area. the law of nature, The aforementioned opening region does not contain vapor-deposited material. Display device.

2. The first common layer and the second common layer are At least one of the intermediate layers interposed between the pixel electrode and the counter electrode, and the counter electrode The display device according to claim 1, comprising at least one of the following.

3. The display device according to claim 1, wherein the edge of the first display area is rectangular.

4. The display device according to claim 1, wherein a through hole is provided in the opening region.

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