High Voltage Feed-Through Device

The high-voltage feedthrough device with a partition and offset, high-aspect-ratio first wall, and protrusions addresses the issue of vacuum seal compromise during welding, enhancing reliability and longevity by reducing thermal and mechanical stress.

JP2026501019APending Publication Date: 2026-01-13VAREX IMAGING CORP
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Patent Information

Application Number
JP2025538424
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-12-31
Filing Date
2024-02-28
Publication Date
2026-01-13

AI Technical Summary

Technical Problem

Welding high-voltage feedthroughs to vacuum enclosures can compromise the vacuum seal integrity due to thermal and mechanical stresses, leading to device failure and reduced lifespan.

Method used

A high-voltage feedthrough device with a partition and first and second walls, where the first wall has a high aspect ratio and is offset from the partition, reducing thermal and mechanical stress transfer, and includes protrusions for structural stability, ensuring a robust vacuum seal.

Benefits of technology

The solution significantly reduces failure rates and extends the device's lifespan by minimizing stress on the vacuum seal during welding and maintaining vacuum integrity.

✦ Generated by Eureka AI based on patent content.

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Abstract

Some embodiments include an apparatus comprising: a partition; a feedthrough extending through the partition and hermetically sealed to the partition, the feedthrough having a longitudinal axis; a first wall extending from the partition in a first direction along the longitudinal axis; and a second wall extending from the partition in a second direction opposite the first direction along the longitudinal axis, the second wall forming a connector interface with the feedthrough; and a ratio of a length of the first wall to a thickness of the first wall greater than or equal to 3:1.
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Description

[Technical Field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to U.S. Patent Application No. 18 / 149,107, filed December 31, 2022, the entire disclosure of which is incorporated herein by reference. [Background technology]

[0002] The x-ray source includes a vacuum enclosure. Electrical connections to components within the vacuum enclosure may include feedthroughs that penetrate the vacuum enclosure. To maintain a vacuum within the vacuum enclosure, the feedthroughs must maintain a vacuum seal. [Brief explanation of the drawings]

[0003] [Figure 1] FIG. 1 is a block diagram of a high voltage feedthrough device according to some embodiments.

[0004] [Figure 2] FIG. 1 is a block diagram of a high voltage feedthrough device with protrusions according to some embodiments.

[0005] [Figure 3] FIG. 1 is a block diagram of a high voltage feedthrough arrangement having multiple feedthroughs according to some embodiments.

[0006] [Figure 4] FIG. 1 is a block diagram of a high voltage feedthrough device having walls with different thicknesses according to some embodiments.

[0007] [Figure 5] FIG. 1 is a block diagram of a high-voltage feedthrough device having walls and protrusions with different thicknesses according to some embodiments.

[0008] [Figure 6]FIG. 1 is a block diagram of a high voltage feedthrough apparatus including a vacuum enclosure according to some embodiments.

[0009] [Figure 7] 1A-1C are block diagrams of a high voltage feedthrough device including a vacuum enclosure in different mounting positions according to some embodiments. [Figure 8] 1A-1C are block diagrams of a high voltage feedthrough device including a vacuum enclosure in different mounting positions according to some embodiments.

[0010] [Figure 9] FIG. 1 is a block diagram of a high voltage feedthrough apparatus including a vacuum enclosure and keying structure according to some embodiments. [Figure 10] FIG. 1 is a block diagram of a high voltage feedthrough apparatus including a vacuum enclosure and keying structure according to some embodiments.

[0011] [Figure 11] FIG. 1 is a block diagram of a high voltage feedthrough device including another key structure according to some embodiments.

[0012] [Figure 12] FIG. 1 is a block diagram of a high voltage feedthrough device including multiple keying structures according to some embodiments.

[0013] [Figure 13] FIG. 1 is a block diagram of an X-ray imaging system according to some embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0014] Embodiments include feedthroughs, and in particular high-voltage feedthroughs for vacuum enclosures. A multi-beam x-ray source includes multiple emitters. The multiple emitters use multiple electrical connections that electrically isolate them from each other and from the vacuum enclosure. Each electrical connection passes through a feedthrough into the vacuum enclosure. Multiple feedthroughs may be integrated into a single structure that may be welded to the vacuum enclosure. However, welding may involve temperature and / or heat transfer that may affect the integrity of the vacuum seal formed by the feedthroughs, resulting in failure and a shortened device life. As described in more detail below, the structure may reduce the impact of the weld, reducing failure and extending the device life.

[0015] 1 is a block diagram of a high voltage feedthrough device according to some embodiments. In some embodiments, the device 100a includes a membrane or partition 102, a feedthrough 104, a first wall 106, and a second wall 108.

[0016] The divider 102 is a structure configured to receive the feedthrough 104. The divider 102 may include a vacuum-compatible material such as stainless steel, nickel (Ni), copper (Cu), a nickel-iron (Ni-Fe) alloy, a nickel-cobalt-iron (Ni-Co-Fe) alloy, molybdenum (Mo), aluminum (Al), or the like. The divider 102 may include an opening in which the feedthrough 104 is disposed. The feedthrough 104 penetrates and extends through the divider 102. The feedthrough 104 is hermetically sealed to the divider 102.

[0017] The feedthrough 104 includes an insulator 104a, a conductor 104b, and a brazing ring 104c. The insulator 104a may be made of ceramic, including machinable ceramics, alumina or aluminum oxide (Al2O3), steatite (hydrous magnesium silicate Mg3SiO4O 10The conductor 104b may comprise a vacuum-compatible electrically insulating material such as copper, steel including stainless steel, aluminum, iron-nickel-cobalt alloy (e.g., KOVAR), nickel-iron alloy, or the like. The brazing ring 104c is hermetically attached to the insulator 104a. The brazing ring 104c may comprise any brazing alloy suitable for joining the partition to the insulator, such as a silver-copper (Ag-Cu) alloy (e.g., CuSil), copper, a silver-copper-indium (Ag-Cu-In) alloy (e.g., InCuSil), or the like. The brazing ring 104c is hermetically sealed to the partition 102 and the insulator 104a. For example, the brazing ring 104c may be brazed to the partition 102. The feedthrough 104 has a long axis parallel to the conductor 104b. In this example, the long axis is parallel to the X-axis. The conductor 104b may be hermetically sealed to the insulator 104a.

[0018] The first wall 106 extends from the partition 102 in a first direction along the long axis or X-axis. In this example, the first wall 106 extends from the partition 102 in the negative X-direction.

[0019] The second wall 108 extends from the partition 102 in a second direction opposite the first direction along the major axis, in this example, the second wall 108 extends from the partition 102 in the positive X direction.

[0020] The first wall 106 and the second wall 108 may be formed from the same or similar material as the divider 102. The divider 102, the first wall 106, and the second wall 108 may be integrated as a single unit.

[0021] In some embodiments, the second wall 108 and the feedthrough 104 form a connector interface. For example, the conductor 104b and the insulator 104a may extend from the partition 102 in the positive X direction. The conductor 104b may form a pin of a plug. The second wall 108 may form a housing for the plug. An opening between the feedthrough 104 and the second wall 108 may be configured to receive a receptacle. Although a plug is used as an example of the connector interface formed by the second wall 108 and the feedthrough 104, in other embodiments, the connector interface may take a different form. For example, the connector interface may form a receptacle. The conductor 104b may include a female contact configured to connect to a male contact of a plug.

[0022] In some embodiments, the ratio of the length 110 of the first wall 106 to the thickness 112 of the first wall 106 is greater than or equal to 3:1 or 5:1. In some embodiments, the thickness 112 is about 1 millimeter (mm) to about 3 mm. The lengths 110 may be greater than about 5 mm to about 10 mm, respectively. In some embodiments, the length 110 is the distance from the partition 102 to the end of the first wall 106. However, in other embodiments, as described in more detail below, other structures may be disposed between the first wall 106 and the partition 102. The length 110 may be the distance from the structure to the end of the first wall 106. In some embodiments, the thickness 112 of the first wall 106 may be greater than the thickness 114 of the partition 102. In some embodiments, the partition 102 has a thickness 114 of about 1 millimeter (mm) to about 3 mm. Such a thickness 114 allows the divider 102 to be thin enough to be easily brazed to the feedthrough 104, yet thick enough to withstand a vacuum and prevent leakage through the divider 102. A divider 102 that is too thick can cause a mismatch in coefficient of thermal expansion (CTE) at the interface between the insulator 104a and the divider 102 via the braze ring 104c, reducing the reliability of the braze joint as a vacuum seal. A divider 102 that is thinner than the first wall 106 or the second wall 108 can cause distortion of the divider 102 during welding or as a result of pressure differences between the internal and external vacuums.

[0023] The structure of the first wall 106 may protect the connection between the partition 102 and the feedthrough 104. For example, the feedthrough 104 may be brazed to the partition 102. As described in more detail below, the first wall 106 may be welded to a housing, such as a vacuum enclosure 140 (FIGS. 6-8 and 12), at temperatures of about 1500 degrees Celsius (°C) or higher (for typical vacuum enclosure and wall materials). As the weld is formed, heat may be conducted from the weld to the braze joint between the partition 102 and the feedthrough 104. The braze joint may be formed at a temperature between about 600°C and about 900°C. Heat from the weld may weaken the braze joint and / or cause deformation of the partition 102. Such stresses may cause the hermetic seal at the interface between the feedthrough 104 and the partition 102 to fail.

[0024] In certain examples, when heat is transferred to the divider 102, the heat can cause the divider 102 to expand. The expansion of the divider 102 can cause the interfacial bond with the feedthrough 104 to fail. The additional heat can also weaken or cause the braze joint between the divider 102 and the feedthrough 104 to fail. In another example, when heat is applied to the vacuum enclosure 140 during welding, the vacuum enclosure 140 can expand. If that expansion is transferred to the divider 102, the interfacial bond with the feedthrough 104 can also fail. Modifications to the welding process cannot alleviate these stresses. For example, welding in a slower and more controlled manner, welding a small section at a time and allowing the section to cool, laser welding, heat sinking, or similar welding may not adequately prevent the stresses. The interfacial bond may still fail or the failure rate may be too high, especially when multiple feedthroughs 104 may be used with the divider 102.

[0025] However, the structure of the first wall 106 may sufficiently reduce the failure rate. For example, the aspect ratio of the first wall 106 may increase the thermal resistance between the weld and the partition 102. That is, a relatively thin first wall 106 may conduct less heat over the welding time, reducing failures due to stresses from the heat applied to the partition 102.

[0026] Additionally, movement of the vacuum enclosure 140 due to expansion during the welding process can be absorbed or accommodated by the first wall 106. The weld to the first wall 106 can be made at a location along the first wall 106 that is offset from the partition 102, such as at the distal end 144 of the first wall 106. A significant portion of that offset is parallel to the plane of the partition 102 and the feedthrough 104. The expansion in the YZ plane due to welding can deform the first wall 106. The partition 102 is at least partially isolated from the stress. At least a portion of the expansion is absorbed by the deformation of the first wall 106, such that less deformation or stress is transferred to the partition 102. These reductions in stress can significantly reduce or eliminate the failure rate of the device 100a after welding.

[0027] A relatively thin first wall 106 may also increase ease of manufacturing. For example, a relatively thin first wall 106 may require less power input to weld the first wall 106 to the vacuum enclosure 140. The reduced power may result in less heat and correspondingly less stress on the divider 102.

[0028] In some embodiments, the minimum wall thickness 112 may be large enough to prevent diffusion through the wall from affecting the vacuum over the lifetime of the device 100a. The thickness of the first wall 106 may be selected based on a range between a minimum thickness that sufficiently prevents diffusion and maintains the vacuum, and a maximum thickness that sufficiently limits heat transfer to the partition 102 and the feedthrough 104, which could damage the joint between the partition 102 and the feedthrough 104. The minimum thickness may also depend on desired structural rigidity, expected impacts, or the like. For example, the device 100a may extend outward from the vacuum enclosure 140, where the device 100a may be subjected to impacts during normal use. The minimum thickness may be such that the force of the expected impact does not significantly deform the first wall 106 to the point where it significantly affects operation. In some embodiments, the minimum thickness may be approximately 1 millimeter (mm).

[0029] Although the brazing ring 104c is used as an example of a structure for attaching the insulator 104a to the partition 102, in other embodiments, the insulator 104a may be attached to the partition 102 using vacuum-compatible techniques other than brazing, such as welding, epoxy, or the like.

[0030] In some embodiments, the feedthrough insulator 104a may extend a length 115 from the partition 102. This may separate the conductor 104b and the partition 102 by a distance that may prevent or reduce the possibility of arcing between the conductor 104b and the partition 102. For example, the distance may be sufficient to reduce the possibility of arcing at voltage differences between adjacent structures of 1 kilovolt (kV) to 3 kV or more.

[0031] In some embodiments, the length of the second wall 108 at the exterior 140b (air side or non-vacuum side) exceeds the length of the feedthrough 104, particularly the conductor 104b, at the exterior 140b, protecting the feedthrough 104 from accidental contact, impact, or the like, which may cause bending of the conductor 104b or damage to the insulator 104a.

[0032] 2 is a block diagram of a high-voltage feedthrough device with a protrusion according to some embodiments. In some embodiments, device 100b may be similar to device 100a or the like. However, device 100b includes a protrusion 120. Protrusion 120 is disposed within first wall 106 and is coupled to first wall 106 and partition 102. Protrusion 120 may have a thickness 116 that is at least twice the thickness 112 of first wall 106.

[0033] The protrusions 120 may add structural stability to the divider 102. The protrusions 120 may add rigidity to the divider 102. The protrusions 120 may be continuous along the first wall 106. However, in other embodiments, the protrusions 120 may include discontinuous structures, such as ribs along the first wall 106. As shown in FIG. 5, the protrusions 120 are rectangular. In other embodiments, the protrusions may have a chamfer, a bevel, a fillet (concave function), a radius (convex function), or the like.

[0034] In some embodiments, the structural stability provided by the protrusion 120 may be opposed to the flexibility provided by the first wall 106. While the first wall 106 may be thin enough to be flexible in the YZ plane, that flexibility may be significantly reduced or eliminated by the protrusion 120. This prevents the flexibility of the first wall 106 from being transferred to the partition 102 and the joint between the partition 102 and the feedthrough 104.

[0035] In some embodiments, protrusion 120 may be positioned on the opposite side of divider 102 from first wall 106, as shown by protrusion 120'. In other embodiments, both protrusions 120 and 120' may be coupled to divider 102.

[0036] In some embodiments, the length 110 of the first wall 106 can extend from the protrusion 120. The aspect ratio of the length 110 from the protrusion 120 to the thickness 112 of the first wall 106 can be greater than 3:1 or 5:1.

[0037] FIG. 3 is a block diagram of a high-voltage feedthrough apparatus having multiple feedthroughs, according to some embodiments. In some embodiments, apparatus 100c may be similar to apparatuses 100a-b or the like. However, apparatus 100c includes multiple feedthroughs 104. Here, two feedthroughs 104-1 and 104-2 are illustrated; however, any number of feedthroughs 104 greater than one may be present. Each of the feedthroughs 104 may be similar to the feedthroughs 104 described above and may be attached to the partition 102 in a similar manner. In some embodiments, the number of feedthroughs 104 may be greater than 5, 10, 15, 20, 50, 100, or more.

[0038] The addition of more feedthroughs 104 may make the partition 102 relatively less structurally robust. With more feedthroughs 104, the partition 102 necessarily has more penetrations and may be larger in size, including multiple rows and / or columns of feedthroughs 104. Separating the feedthroughs 104 by a distance may prevent or reduce the possibility of arcing between the feedthroughs 104 and the first wall 106 and / or the second wall 108. For example, the distance may be sufficient to reduce the possibility of arcing when the voltage difference between adjacent structures is 1 kV to 3 kV or more. Additionally, the presence of multiple feedthroughs 104 adds more points of failure. Accordingly, a device 100c with multiple feedthroughs 104 may have a greater need for the advantages of the first wall 106, protrusions 120, distances, thicknesses, ratios, or the like, as described herein, than a device with only one feedthrough 104.

[0039] 4 is a block diagram of a high-voltage feedthrough device having walls with different thicknesses according to some embodiments. In some embodiments, device 100d may be similar to devices 100a-c or the like. However, device 100d may include a first wall 106 in which the ratio of the length 110 of first wall 106 to the thickness 112 of first wall 106 is greater than or equal to 3:1 or 5:1, and the thickness 122 of second wall 108 is greater than the thickness 112 of first wall 106. In a particular example, the thickness 112 of first wall 106 may be approximately 1 mm, and the thickness 122 of second wall 108 may be approximately 2 mm or greater.

[0040] In some embodiments, as described above, the second wall 108 and the feedthrough 104 may form a connector interface. The thickness, shape, length, or the like of the second wall 108 may be greater in the area to form the connector interface.

[0041] 5 is a block diagram of a high-voltage feedthrough device having walls and protrusions with different thicknesses according to some embodiments. In some embodiments, device 100e may be similar to devices 100a-d or the like. However, device 100e includes a protrusion 120 similar to device 100b. Thickness 116 of protrusion 120 may be similar to or different from thickness 122 of second wall 108. As shown, thickness 122 is less than thickness 116; however, in other embodiments, thickness 122 may be greater.

[0042] 6 is a block diagram of a high-voltage feed-through apparatus including a vacuum enclosure according to some embodiments. In some embodiments, apparatus 100f may include a structure similar to apparatus 100a-e or the like. A structure similar to apparatus 100a is used as an example; in other embodiments, a different structure may be used.

[0043] In some embodiments, the apparatus 100f includes a vacuum enclosure 140. For clarity, only a portion of the vacuum enclosure 140 is shown. The vacuum enclosure 140 divides the vacuum into an interior 140a and an exterior 140b.

[0044] The vacuum enclosure 140 includes an opening 140′. The first wall 106 is disposed in the opening 140′. In some embodiments, the first wall 106 is welded to the vacuum enclosure 140 at the opening 140′. The first wall 106 may be welded to the vacuum enclosure 140 substantially at a distal end 144 of the first wall 106. The first wall 106 may extend through the opening 140′ a sufficient amount to allow the first wall 106 to be welded to the vacuum enclosure 140. Because the weld 142 is at the distal end 144 of the first wall 106, the associated welding operation may be offset from the partition 102.

[0045] The weld 142 may be located on the interior 140a of the vacuum enclosure 140. However, in other embodiments, the weld 142 may be located on the exterior 140b of the vacuum enclosure 140. The weld 142' represents the location of this weld on the exterior 140b. The weld 142 or 142' may be located at a position along the first wall 106 that is a length 110' from the partition 102. The length 110' may be long enough that the aspect ratio of the length 110' to the thickness 112 of the first wall 106 is greater than 3:1 or 5:1. That is, the first wall 106 may be longer than the length 110' and therefore have an even greater aspect ratio. However, the length 110' of the portion of the first wall 106 from the weld 142 or 142' to the partition still meets the minimum aspect ratio of 3:1 or 5:1.

[0046] In some embodiments, the thermal resistance of the vacuum enclosure 140 at the opening 140′ may be less than that of the first wall 106. For example, the thickness 143 of the vacuum enclosure 140 at the opening 140′ may be greater than the thickness 112 of the first wall 106. As a result, heat may be conducted much more into the wall of the vacuum enclosure 140, away from the weld 142, than into the first wall 106. This difference in thermal resistance may further reduce the probability of failure, as heat is conducted more away from the weld 142 and the divider 102.

[0047] Although welding is used as an example of a technique used to attach the first wall 106 to the vacuum enclosure 140, in other embodiments, different techniques may be used. For example, the first wall 106 may be brazed to the vacuum enclosure 140. Traditionally, brazing is used early in the manufacturing process to heat the entire assembly of parts, while welding is used later in the manufacturing process to heat segments of the parts and join the parts together.

[0048] 7-8 are block diagrams of high-voltage feed-through devices including vacuum enclosures in different mounting positions according to some embodiments. Referring to FIG. 7, in some embodiments, device 100g may be similar to device 100f or the like, and if device 100a is used as an example, may include a structure similar to devices 100a-e or the like. However, a weld 142 where vacuum enclosure 140 is welded to the first wall 106 is offset from a distal end 144 of first wall 106. A length 110' from the proximal side of weld 142 to partition 102 may be long enough so that the aspect ratio of length 110' to thickness 112 of first wall 106 is greater than 3:1 or 5:1. Similarly, if protrusion 120 is present, length 110' to protrusion 120 may be long enough to meet or exceed the aspect ratio.

[0049] 8 , in some embodiments, apparatus 100h may be similar to apparatuses 100f-g or the like, and if apparatus 100a is used as an example, may include a structure similar to apparatuses 100a-e or the like. However, second wall 108 is disposed within interior 140a of vacuum enclosure 140. First wall 106 may be further attached to vacuum enclosure 140. Length 110′ may be from partition 102 to vacuum enclosure 140 when weld 142 is on the opposite side of vacuum enclosure 140. First wall 106 may have a length sufficient to further satisfy the minimum aspect ratio of 3:1 or 5:1, as described above.

[0050] 9-10 are block diagrams of high-voltage feedthrough devices including a vacuum enclosure and keyed structures according to some embodiments. FIG. 9 is a diagram of a feedthrough 104 and a first wall 106, showing the keyed structure. FIG. 10 is a diagram of a vacuum enclosure 140 and an opening 140′, showing the matching keyed structure. Referring to FIGS. 9 and 10, in some embodiments, device 100i may be similar to devices 100f-g or the like. However, first wall 106 includes the keyed structure. In this example, first wall 106 has a first end 150 with rounded corners. Second end 152 includes squared corners.

[0051] Opening 140' of vacuum enclosure 140 includes matching keying features. A first end 160 of opening 140' includes rounded corners and a second end 162 includes squared corners that correspond to similar features of first wall 106. The keying features of first wall 106 and opening 140' are complementary such that first wall 106 can be inserted into opening 140' in only one orientation.

[0052] In some embodiments, only one orientation may be associated with the side of the vacuum enclosure 140 into which the first wall 106 is inserted. For example, the first wall 106 may be intended to be inserted from the exterior 140b of the vacuum enclosure 140 in only one orientation. While the first wall 106 may be insertable from the interior 140a, the first wall 106 is insertable from the exterior 140b side of the vacuum enclosure 140 in only one orientation.

[0053] In other embodiments, keying features on first wall 106 and opening 140' may prevent insertion in any orientation other than one, regardless of the insertion direction. For example, corners 150' and 160' of first wall 106 and opening 140', respectively, may allow first wall 106 to be inserted in only one orientation, regardless of the side of vacuum enclosure 140 into which insertion is attempted.

[0054] 11 is a block diagram of a high-voltage feed-through device including another keying structure according to some embodiments. In some embodiments, device 100j may be similar to devices 100a-i or the like. However, device 100j includes a second wall 108 having a keying structure. The keying structure allows insertion of the connector in only one orientation.

[0055] FIG. 12 is a block diagram of a high-voltage feedthrough apparatus including multiple keying structures according to some embodiments. In some embodiments, the keying structure of the second wall 108 of apparatus 100j can be used in conjunction with the keying structure of the first wall 106 and opening 140′ of apparatus 100i. The combination of keying structures results in the feedthrough 104 being positioned in a predetermined physical location. Within interior 140a of vacuum enclosure 140, electrical connections are made with various devices. Here, grid 170 and radiator 172 are used as examples of such devices. Another such device (not shown) may be a focusing aperture. In another embodiment (not shown), feedthrough 104 may have multiple connections to the grid, radiator, and / or focusing aperture.

[0056] In some embodiments, grid 170 and emitters 172 are disposed within vacuum enclosure 140 at predetermined locations. Electrical connections 174-1 and 174-2 electrically connect grid 170 and emitters 172 to corresponding feedthroughs 104-1 and 104-2. Due to the keying of first wall 106 and opening 140′, the physical location of feedthrough 104-1 corresponds to the physical location of grid 170, and the physical location of feedthrough 104-2 corresponds to the physical location of emitters 172.

[0057] In other embodiments, grid 170 and radiators 172 may not be in predetermined locations. However, the predetermined locations of feedthroughs 104 remain relative to the device. That is, the physical location of feedthrough 104-1 corresponds to electrical connection 174-1 that connects to grid 170, and the physical location of feedthrough 104-2 corresponds to electrical connection 174-2 that connects to radiators 172.

[0058] Due to the keying structure of the second wall 108, the connector 176 can be inserted in only one orientation. The connector 176 includes contacts 178-1 and 178-2. The contacts 178-1 and 178-2 contact only the feedthroughs 104-1 and 104-2, respectively. The keying structure of the first wall 106, the opening 140′, and the second wall 108 allows only the orientation in which the wire 180-1 of the cable 182 is electrically connected to the grid 170 and the wire 180-2 of the cable 182 is electrically connected to the radiator 172.

[0059] 13 is a block diagram of an X-ray imaging system according to some embodiments. The X-ray imaging system 1300 includes an X-ray source 1302 and a detector 1310. The X-ray source 1302 may include the apparatus 100 described above or similar. The X-ray source 1302 is positioned relative to the detector 1310 such that X-rays 1320 are generated, pass through a sample 1322, and can be detected by the detector 1310. In some embodiments, the detector 1310 is part of a medical imaging system. In other embodiments, the X-ray imaging system 1300 may include a security or industrial scanning system, as part of a baggage scanning system or a part inspection system, respectively. The system 1300 may be any system that may include an X-ray detector.

[0060] Some embodiments include devices 100, 100a-100k comprising: a partition 102; a feedthrough 104 extending through and hermetically sealed to the partition 102, the feedthrough 104 having a longitudinal axis; a first wall 106 extending from the partition 102 in a first direction along the longitudinal axis; and a second wall 108 extending from the partition 102 in a second direction opposite the first direction along the longitudinal axis, the second wall 108 forming a connector interface with the feedthrough 104; and wherein the ratio of the length of the first wall 106 to the thickness of the first wall 106 is greater than or equal to 3:1.

[0061] In some embodiments, the thickness of the second wall 108 is greater than the thickness of the first wall 106 .

[0062] In some embodiments, the device 100, 100a-100k further comprises a protrusion 120 disposed within the first wall 106 and coupled to the first wall 106 and the partition 102.

[0063] In some embodiments, the thickness of the protrusion 120 is at least twice the thickness of the first wall 106 .

[0064] In some embodiments, the apparatus 100, 100a-100k further comprises a vacuum enclosure 140 having an opening 140'; the first wall 106 is disposed within the opening 140'.

[0065] In some embodiments, the first wall 106 is welded to the vacuum enclosure 140 at a distal end of the first wall 106 .

[0066] In some embodiments, the first wall 106 includes a first key structure; the opening 140′ includes a second key structure; and the first key structure and the second key structure are complementary such that the first wall 106 can be inserted into the opening 140′ in only one orientation.

[0067] In some embodiments, the second wall 108 includes a third key structure.

[0068] In some embodiments, the thickness of the first wall 106 is from about 1 millimeter (mm) to about 3 mm.

[0069] In some embodiments, the feedthrough 104 is one of a plurality of feedthroughs 104 s that extend through and are hermetically sealed to the partition 102 .

[0070] Some embodiments include devices 100, 100a-100k comprising a partition 102; a feedthrough 104 extending through and hermetically sealed to the partition 102, the feedthrough 104 having a longitudinal axis; a first wall 106 extending from the partition 102 in a first direction along the longitudinal axis; and a second wall 108 extending from the partition 102 in a second direction opposite the first direction along the longitudinal axis; a ratio of the length of the first wall 106 to the thickness of the first wall 106 being greater than or equal to 3:1; and the first wall 106 including a first key structure.

[0071] In some embodiments, the second wall 108 forms a connector interface with the feedthrough 104 .

[0072] In some embodiments, the device 100, 100a-100k further comprises a protrusion 120 disposed within the first wall 106 and coupled to the first wall 106 and the partition 102.

[0073] In some embodiments, the thickness of the second wall 108 is at least twice the thickness of the first wall 106 .

[0074] In some embodiments, the apparatus 100, 100a-100k further comprises a vacuum enclosure 140 having an opening 140'; the first wall 106 is welded to the vacuum enclosure 140 at the opening 140'.

[0075] In some embodiments, the opening 140' includes a second key structure; the first key structure and the second key structure are complementary such that the first wall 106 can be inserted into the opening 140' in only one orientation.

[0076] In some embodiments, the second wall 108 includes a third key structure.

[0077] In some embodiments, the thickness of the first wall 106 is from about 1 millimeter (mm) to about 3 mm.

[0078] Some embodiments include an apparatus comprising: means for supporting an electrical connection; means for sealingly passing the electrical connection through the means for supporting the electrical connection; means for maintaining a vacuum; and means for sealingly connecting the means for supporting the electrical connection to the means for maintaining a vacuum, including means for limiting the transfer of thermal and mechanical stresses from the means for maintaining a vacuum to the means for supporting the electrical connection.

[0079] Examples of means for supporting electrical connections include dividers 102 or the like.

[0080] Examples of means for sealingly passing an electrical connection to a means for supporting the electrical connection include a feedthrough 104 or the like.

[0081] Examples of means for maintaining a vacuum include a vacuum enclosure 140 or the like.

[0082] Examples of means for sealingly connecting the means for supporting the electrical connection to the means for maintaining a vacuum include first wall 106, welds 142, or the like.

[0083] Examples of means for limiting the transfer of thermal and mechanical stresses from the means for maintaining a vacuum to the means for supporting an electrical connection include first wall 106 or the like, as explained above, having an aspect ratio greater than 3:1. Below this aspect ratio, the transfer of thermal and mechanical stresses may not be sufficient to maintain the vacuum.

[0084] In some embodiments, the apparatus further comprises means for strengthening a connection between the means for supporting the electrical connection and the means for sealingly connecting the means for supporting the electrical connection to the means for maintaining a vacuum.

[0085] An example of a means for strengthening the connection between the means for supporting the electrical connection and the means for sealingly connecting the means for supporting the electrical connection to the means for maintaining a vacuum includes protrusion 120.

[0086] While structures, devices, methods, and systems according to specific embodiments have been described, those skilled in the art will readily recognize that many variations to the specific embodiments are possible, and therefore, any variations should be considered within the spirit and scope of what is disclosed herein. Accordingly, many modifications may be made by those skilled in the art without departing from the spirit and scope of what is set forth in the appended claims.

[0087] The claims that follow this written disclosure are hereby expressly incorporated into this written disclosure, with each claim standing on its own as a separate embodiment. The present disclosure includes all permutations of independent claims with their dependent claims. Furthermore, additional embodiments that are derivable from the following independent and dependent claims are also expressly incorporated into this written specification. These additional embodiments are determined by replacing the dependency of a given dependent claim with the phrase "any of the claims beginning with claim [x] and ending with the claim immediately preceding this claim," where the bracketed term "[x]" is replaced with the number of the most recently described independent claim. For example, with respect to a first set of claims beginning with independent claim 1, claim 4 may depend on either claims 1 and 3, and these separate dependencies result in two separate embodiments; claim 5 may depend on any one of claims 1, 3 or 4, and these separate dependencies result in three separate embodiments; claim 6 may depend on any one of claims 1, 3, 4 or 5, and these separate dependencies result in four separate embodiments; and so on.

[0088] The recitation in a claim of the term "first" with respect to a feature or element does not necessarily imply the presence of a second or additional such feature or element. Pursuant to 35 U.S.C. §112(f), an element specifically recited in means-plus-function form shall be construed to cover the corresponding structure, material, or acts described in the specification, if any, and equivalents thereof. The embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows:

Claims

1. partition; a feedthrough extending through said partition and hermetically sealed to said partition, said feedthrough having a longitudinal axis; a first wall extending from the partition in a first direction along the longitudinal axis; and a second wall extending from the partition in a second direction opposite the first direction along the longitudinal axis, the second wall forming a connector interface with the feedthrough; Equipped with The apparatus, wherein a ratio of the length of the first wall to the thickness of the first wall is greater than or equal to 3:

1.

2. The device of claim 1 , wherein the thickness of the second wall is greater than the thickness of the first wall.

3. The apparatus of claim 1 , further comprising a protrusion disposed within the first wall and coupled to the first wall and the partition.

4. The device of claim 3 , wherein the thickness of the protrusion is at least twice the thickness of the first wall.

5. a vacuum enclosure having an opening; Furthermore, The apparatus of claim 1 , wherein the first wall is disposed within the opening.

6. The apparatus of claim 5 , wherein the first wall is welded to the vacuum enclosure at a distal end of the first wall.

7. the first wall includes a first key structure; the opening includes a second key structure; 6. The device of claim 5, wherein the first key structure and the second key structure are complementary such that the first wall can be inserted into the opening in only one orientation.

8. The apparatus of claim 7 , wherein the second wall includes a third key structure.

9. The device of claim 1 , wherein the first wall has a thickness of about 1 millimeter (mm) to about 3 mm.

10. 10. The apparatus of claim 1, wherein the feedthrough is one of a plurality of feedthroughs that pass through and are hermetically sealed to the partition.

11. partition; a feedthrough extending through said partition and hermetically sealed to said partition, said feedthrough having a longitudinal axis; a first wall extending from the partition in a first direction along the longitudinal axis; and a second wall extending from the partition in a second direction opposite the first direction along the longitudinal axis; Equipped with a ratio of the length of the first wall to the thickness of the first wall greater than or equal to 3:1; The first wall includes a first key structure.

12. The apparatus of claim 11 , wherein the second wall forms a connector interface with the feedthrough.

13. The apparatus of claim 11 , further comprising a protrusion disposed within the first wall and coupled to the first wall and the partition.

14. 12. The device of claim 11, wherein the thickness of the second wall is at least twice the thickness of the first wall.

15. a vacuum enclosure having an opening; Furthermore, The apparatus of claim 11 , wherein the first wall is welded to the vacuum enclosure at the opening.

16. the opening includes a second key structure; 16. The device of claim 15, wherein the first key structure and the second key structure are complementary such that the first wall can be inserted into the opening in only one orientation.

17. The apparatus of claim 16 , wherein the second wall includes a third key structure.

18. 12. The device of claim 11, wherein the thickness of the first wall is from about 1 millimeter (mm) to about 3 mm.

19. means for supporting the electrical connection; means for sealingly passing said electrical connection through said means for supporting said electrical connection; means for maintaining a vacuum; and means for hermetically connecting said means for supporting said electrical connection to said means for maintaining said vacuum, including means for limiting the transfer of thermal and mechanical stresses from said means for maintaining said vacuum to said means for supporting said electrical connection; An apparatus comprising:

20. 20. The apparatus of claim 19, further comprising means for strengthening a connection between the means for supporting the electrical connection and the means for sealingly connecting the means for supporting the electrical connection to the means for maintaining the vacuum.