Method and apparatus for determining positioning error of a pickable part

Abstract

A method and apparatus are provided for determining positioning error of a pickable part, the apparatus 100 including a part holder 130 for releasably attaching to a part 600, the method including creating a first image 720 of a first part mark using an overhead camera 410 at a part exchange position, attaching the part to a gripper 160, releasing the part, creating a second image 730 of a second part mark using the overhead camera, and using the second image in conjunction with the first image to determine the position error.

Description

[Technical Field]

[0001] The present disclosure relates to an apparatus or method for determining the positioning error of one or more pickable components, such as dies or electrical components, prior to placement on one or more substrates. Optionally, picking can occur prior to bonding with one or more substrates in a bonding apparatus. [Background technology]

[0002] Similar devices and components are known from the state of the art, as described in U.S. Patent Application Publication No. 2009 / 0070992 A1. This patent application describes a semiconductor placement device including a pick-and-place system with a bonding head, the device having a first drive system and a second drive system for displacing the bonding head in a predetermined direction. The first drive system has a first pivot arm and a drive unit located at a first fixed position, and is used to pivot the pivot arm back and forth within a predetermined pivot range. The second drive system is attached to the pivot arm and includes an electric motor located at a fixed position.

[0003] During semiconductor assembly, components are often transferred and exchanged between manipulators and actuators configured to move the components between stations for loading, unloading, or processing. One or more inspection cameras are typically provided to detect the location of the components at these stations, and measurements made with the cameras are used to determine where the manipulator or actuator should move to pick up or place the component. However, unexpected position errors still frequently occur, affecting the quality of semiconductor assemblies. Summary of the Invention [Problem to be solved by the invention]

[0004] It is an object of the present invention to improve the positioning accuracy of a component relative to a substrate by determining the position error of the component during exchange into a component gripper.

[0005] Determining the position error of a pickable part allows for increased positioning accuracy of the device in the event of a position error that may occur during part picking. [Means for solving the problem]

[0006] In a first aspect, a method is provided for determining a positioning error of a pickable component before the component is placed on a substrate using an apparatus, the component including one or more component marks and a mounting surface suitable for attachment to the substrate. The component includes an additional gripping surface disposed opposite the mounting surface. The apparatus includes a pick-and-place actuator configured to be provided at a placement position and a component exchange position. The pick-and-place actuator includes a gripper for releasably attaching to the gripping surface of the component. The apparatus includes a component holder for releasably attaching to the mounting surface of the component and at least one overhead camera configured to generate at least one overhead image of at least a portion of the mounting surface of the component. The method includes the steps of attaching a mounting surface of a component to a component holder, moving the component holder with the attached component to a component exchange position, creating at least one first overhead image of a first component mark using at least one overhead camera at the component exchange position, moving a pick and place actuator to the component exchange position, attaching a gripping surface of the component to a gripper and releasing the mounting surface of the component from the component holder, creating at least one second overhead image of a second component mark using at least one overhead camera at the component exchange position, and determining a position error of the component using the at least one second overhead image and the at least one first overhead image.

[0007] By using the corresponding part marks to determine the position error, the accuracy of the error determination can be increased. This can be advantageous for picking parts with less accurate part marks, such as picking tips with rough and irregular edges due to imprecise sawing. This can be advantageous for flip-chip parts.

[0008] In one optional aspect of the method, the apparatus includes at least one overhead camera configured to create at least one overhead image of at least a portion of a grip surface of the part, and the method includes creating at least one first overhead image of the third part mark using the at least one overhead camera at the part exchange location.

[0009] In one optional aspect of the method, the method includes providing a substrate to a placement location, moving a pick-and-place actuator with the attached component to the placement location, and placing the component onto the substrate at the placement location.

[0010] In one optional aspect of the method, the method includes at least partially correcting the positional error of the component by correcting one or more positions and / or orientations selected from the group including component rotation, component misalignment, component tilt, substrate rotation, substrate misalignment, substrate tilt, pick and place actuator rotation, pick and place actuator misalignment, pick and place actuator tilt, gripper rotation, gripper misalignment, gripper tilt, component holder rotation, component holder misalignment, component holder tilt, or any combination thereof.

[0011] In one optional aspect of the method, the apparatus includes a part loading position, and the method includes providing a part to the part loading position, moving a part holder to the part loading position, attaching the part to the part holder, and moving the part holder with the attached part to a part exchange position.

[0012] In one optional aspect of the method, the substrate includes at least one substrate mark.

[0013] In one optional aspect of the method, the method includes creating at least one second overhead image of a portion of the substrate and / or at least one substrate mark using at least one overhead camera at an installation location, and determining a fourth position and / or orientation of the substrate using the at least one second overhead image.

[0014] Similarly, an apparatus is provided for picking a component before the component is placed on a substrate for attachment, the component including one or more component marks and an attachment surface suitable for attachment to the substrate. The component includes a gripping surface disposed opposite the attachment surface. The apparatus includes a pick-and-place actuator configured to be provided at an installation position and a component exchange position, the pick-and-place actuator including a gripper for releasably attaching to the gripping surface of the component.

[0015] The apparatus includes a component holder for releasably attaching to a mounting surface of the component, and at least one overhead camera configured to generate at least one overhead image of at least a portion of the mounting surface of the component.

[0016] The apparatus is configured to attach the mounting surface of the component to the component holder and to move the component holder with the attached component to a component exchange position.

[0017] The at least one overhead camera is configured to create at least one first overhead image of the first part mark at the part exchange location, and the apparatus is configured to move the pick and place actuator to the part exchange location.

[0018] The apparatus is further configured to attach the gripping surface of the part to the gripper and to release the attachment surface of the part from the part holder, and the at least one overhead camera is configured to create at least one second overhead image of the second part mark at the part exchange position, and the apparatus is additionally configured to determine a position error of the part using the at least one second overhead image and the at least one first overhead image.

[0019] In one optional aspect of the apparatus, the apparatus includes at least one overhead camera configured to create at least one overhead image of at least a portion of a grip surface of the part, and the at least one overhead camera configured to create at least one first overhead image of a third part mark at the part exchange location.

[0020] In one optional aspect of the apparatus, the component holder includes a receiving surface having a component-holding area.

[0021] The component-holding area is adapted to receive and hold at least a portion of the mounting surface of the component.

[0022] In one optional aspect of the device, the part holder includes a rear surface positioned as the surface opposite the receiving surface and one or more radiation windows configured to allow illumination radiation to pass between the receiving surface and the rear surface, and the at least one overhead camera is configured to create at least one first overhead image and / or at least one second overhead image using illumination radiation passing between the receiving surface and the rear surface.

[0023] In one optional aspect of the device, the one or more radiation windows include one or more apertures and / or one or more regions that are at least partially transparent to the illumination radiation.

[0024] In one optional aspect of the device, the one or more emission windows are at least partially configured within the component-holding area.

[0025] In one optional aspect of the apparatus, the at least one part mark is selected from the group including one or more physical features of at least a portion of the part, one or more optical properties of at least a portion of the part, at least a portion of a fiducial on the part, or any combination thereof.

[0026] In one optional aspect of the apparatus, the at least one overhead camera is configured to create at least one second overhead image of the at least one substrate mark at the installation position, and the apparatus is configured to determine a fourth position and / or orientation of the substrate using the at least one second overhead image.

[0027] In one optional aspect of the apparatus, the at least one overhead camera and / or the at least one top-view camera are configured to illuminate at least a portion of a surface of the part.

[0028] In one optional aspect of the apparatus, the apparatus includes a part loading position, and the apparatus is configured to provide a part to the part loading position, move a part holder to the part loading position, attach the part to the part holder, and move the part holder with the attached part to the part exchange position.

[0029] In one optional aspect of the apparatus, the substrate includes at least one substrate mark.

[0030] In one optional aspect of the apparatus and method, the at least one substrate mark is selected from the group including one or more physical features of at least a portion of the substrate, one or more optical properties of at least a portion of the substrate, at least a portion of a fiducial on the substrate, or any combination thereof.

[0031] In one optional aspect of the apparatus, the at least one overhead camera is configured to create at least one second overhead image of the at least one substrate mark at the installation position, and the apparatus is configured to determine a fourth position and / or orientation of the substrate using the at least one second overhead image.

[0032] In one optional aspect of the apparatus and method, the component is selected from the group including one or more dies, one or more semiconductor packages, one or more chips, one or more flip chips, one or more integrated circuits, one or more further substrates, one or more optical elements, one or more electronic elements, one or more electro-optical elements, or any combination thereof.

[0033] In one optional aspect of the apparatus, the apparatus additionally includes at least one overhead camera configured to generate at least one overhead image of at least a portion of the grip surface of the part.

[0034] In one optional aspect of the apparatus, the at least one overhead camera is additionally configured to create at least one first overhead image of the first part mark at the part exchange location.

[0035] In one optional aspect of the apparatus, the at least one overhead camera is configured to create at least one second overhead image of the third part mark at the part replacement position, and the apparatus is configured to determine a position error of the part using the at least one second overhead image and the at least one first overhead image.

[0036] In one optional aspect of the apparatus and method, the first part mark and the second part mark are physically different, physically similar, physically the same, physically identical, optically different, optically similar, optically the same, optically identical, or any combination thereof.

[0037] Further advantages and properties emerge from the following drawings. [Brief explanation of the drawings]

[0038] [Figure 1] 1 depicts a schematic cross-sectional side view of relevant parts of an apparatus for picking one or more components and placing the one or more components onto one or more substrates for attachment. [Figure 2A] 1 illustrates selected steps in a method for picking components and placing the components on a substrate. [Figure 2B] 1 illustrates selected steps in a method for picking components and placing the components on a substrate. [Figure 2C] 1 illustrates selected steps in a method for picking components and placing the components on a substrate. [Figure 2D] 1 illustrates selected steps in a method for picking components and placing the components on a substrate. [Figure 3A] 1 illustrates selected steps in an improved method for placing components on a substrate for picking and attaching the components. [Figure 3B] 1 illustrates selected steps in an improved method for placing components on a substrate for picking and attaching the components. [Figure 3C] 1 illustrates selected steps in an improved method for placing components on a substrate for picking and attaching the components. [Figure 3D] 1 illustrates selected steps in an improved method for placing components on a substrate for picking and attaching the components. [Figure 4A] 1 depicts an embodiment of an improved apparatus for picking components prior to placing the components on a substrate for attachment. [Figure 4B] 1 depicts an embodiment of an improved apparatus for picking components prior to placing the components on a substrate for attachment. [Figure 5A] 1 depicts an embodiment of an improved part holder for releasably attaching to a part. [Figure 5B] 1 depicts an embodiment of an improved part holder for releasably attaching to a part. DETAILED DESCRIPTION OF THE INVENTION

[0039] Detailed Description of the Drawings In the drawings, a first axis 910, a second axis 920, and a third axis 930 are depicted to facilitate a person skilled in the art in associating different perspectives and different components together. The first axis 910 is perpendicular to the second axis 920, and the third axis 930 is perpendicular to both the first axis 910 and the second axis 920. In use, it is assumed that the first axis 910 is in the Y direction, the second axis 920 is in the X direction, and the third axis 930 is in the Z direction. By convention, in use, the Y axis 910 and the X axis 920 are substantially horizontal, horizontal, or nearly horizontal. Functionally, the X axis 920 and the Y axis 910 are interchangeable. By convention, in use, the Z axis 930 is substantially vertical, vertical, or nearly vertical. For clarity in describing the different components, the drawings depict the components in these orientations. In keeping with this convention, some relative terms such as top, bottom, upper, side, and base are used to clarify the description of the different parts.

[0040] The devices described in this disclosure can be configured by those skilled in the art to operate at different orientations and deviations from the nominal coordinate axes.

[0041] FIG. 1 depicts a schematic cross-sectional side view of relevant portions of an apparatus 100 suitable for picking one or more components 600 at a component exchange location 810 before the components 600 are placed on one or more substrates 300 according to any of the methods disclosed herein. In the example depicted in FIG. 1, the apparatus 100 is suitable for placing one or more components 600 on one or more substrates 300 for attachment at a component placement location 800 according to any of the methods disclosed herein. More specifically, the apparatus 100 is viewed as viewed toward a plane containing an X-axis 920, nominally depicted as having a positive direction from left to right, and a Z-axis 930, nominally depicted as having a positive direction from bottom to top. A Y-axis 910 is nominally depicted as having a positive direction, pointing toward the viewer.

[0042] For example, the apparatus 100 can be a component (or die) pick-and-place system. For example, the apparatus 100 can be a component (or die) bonding apparatus. Typically, the die is rectangular in shape, although circular shapes are also possible.

[0043] It may be advantageous to configure the apparatus to place one or more components 600 onto one or more substrates 300 with precision in the micrometer or sub-micrometer range.

[0044] As described below, the apparatus 100 is configured to determine one or more positional errors to monitor and optionally reduce misalignment between components after placement on a substrate. Generally, the actual and / or predicted degree of misalignment can be corrected using any means suitable for providing at least a small degree of movement of the component and / or substrate in one or more directions. One or more of these corrections can be provided at any convenient moment, such as during loading, unloading, transfer between stations, during the initial stages of placing the component on the substrate, and / or after placement of the component on the substrate. The one or more corrections can actually be implemented using substantially linear motion along one or more axes 910, 920, 930 and / or substantially rotational motion about one or more axes 910, 920, 930. Differences in orientation may also be described as differences in tilt.

[0045] The methods and apparatus described herein for picking one or more components 600 are not limited to dies, and the one or more components 600 can be selected from the group including one or more dies, one or more semiconductor packages, one or more chips, one or more flip chips, one or more integrated circuits, one or more further substrates 300, one or more optical elements, one or more electronic elements, one or more electro-optical elements, or any combination thereof. For example, one component 600 can be placed on one substrate 300, one or more components 600 can be placed on one substrate 300, or one component 600 can be placed on one or more substrates 300.

[0046] The one or more parts 600 include one or more part marks optically detectable, for example, by one or more inspection cameras, and configured to assist in determining one or more positions and / or orientations of the one or more parts 600. The one or more parts 600 include a mounting surface 601 suitable for mounting to the one or more substrates 300 and include an opposing gripping surface suitable for mounting to the gripper 160.

[0047] Optionally, the part replacement location 810 may include one or more replacement location marks.

[0048] Optionally, the one or more substrates 300 may include at least one substrate mark (or substrate alignment target) detectable by the one or more inspection cameras and configured to assist in determining one or more positions and / or orientations of the one or more substrates 300. The at least one substrate mark may be any suitable alignment target. For example, the substrate mark may be selected from the group including one or more physical features of at least a portion of the substrate 300, one or more optical properties of at least a portion of a fiducial on the substrate, or any combination thereof.

[0049] Optionally, the placement location 800 may include one or more placement position marks or one or more nominal substrate location marks.

[0050] The one or more substrates 300 may be any object having at least one attachable surface at an installation location, the attachable surface of the one or more substrates 300 being suitable for receiving the attachment surface 601 of the one or more components 600. For example, the one or more substrates 300 may be selected from the group including one or more metal substrates, one or more substrate strips, one or more lead frames, one or more wafers, one or more further components 600, or any combination thereof. The one or more substrates 300 may also be described as one or more media.

[0051] 1 depicts an apparatus 100 including a pick-and-place actuator 150, an optional component feeder (or feeding unit) 120 for providing one or more components 600, and an optional substrate feeder (or feeding unit) 140 for providing one or more substrates 300. The optional component feeder 120 is positioned at a component loading position (loading position) 820 and may include an optional component handling system such as a wafer, tray, waffle pack, or tape. A component exchanger 170 is configured (not depicted in FIG. 1 ) to hold one or more components in a holder (not shown) and move the one or more held components 600 to a component exchange position 810. The substrate feeder 140 is positioned at a component placement position (placement position) 800.

[0052] Alternatively, the apparatus can be configured as a bonding system that includes a bond head instead of a pick and place actuator.

[0053] 1 illustrates an example of a pick-and-place drive including a first drive system 210 and a second drive system 220 for a pick-and-place actuator 150. The second drive system 220 is attached to the first drive system 210 in any suitable manner. Any suitable drive configuration may be included in the apparatus 100. For example, the first drive system 210 may be configured to move the pick-and-place actuator 150 positively and negatively along an X-axis 920, and the second drive system 220 may be configured to move the pick-and-place actuator 150 positively and negatively along a Y-axis 910, thereby moving the pick-and-place actuator 150 between a component replacement position 810 and a component placement position 800.

[0054] 1, the apparatus includes at least one top-view (i.e., looking up from below) camera 410 and, optionally, at least one top-view (i.e., looking down from above) camera 510. In the context of this disclosure, a camera is an optical system configured to capture an image. In the context of this disclosure, top-view means that the camera is oriented generally in the positive direction of the Z axis 930. In the context of this disclosure, top-view means that the camera is oriented generally in the negative direction of the Z axis 930.

[0055] The at least one top-view camera 410 is configured to create at least one top-view image of the one or more parts 600. In the example depicted in FIG. 1 , the at least one top-view camera 410 is configured to create at least one top-view image of the surface of the part 600 at the part exchange position 810. Optionally, the at least one top-view camera 410 may include an illumination source suitable for illuminating a portion of the surface of the part 600. Additionally or alternatively, one or more illumination sources not included in the at least one top-view camera 410 may be provided. It may also be advantageous for the at least one top-view camera 410 to include a direct illumination source and for optional indirect illumination to be provided using one or more illumination sources not included in the at least one top-view camera 410.

[0056] Optionally, at least one overhead camera 510 can be configured to generate at least one overhead image of one or more parts 600. In the example depicted in FIG. 1 , at least one overhead camera 510 is configured to generate at least one overhead image of a surface of part 600 at part exchange location 810.

[0057] Optionally, at least one overhead camera 510 may include an illumination source suitable for illuminating a portion of a surface of part 600. Additionally or alternatively, one or more illumination sources may be provided that are not included in at least one overhead camera 510. It may also be advantageous for at least one overhead camera 510 to include a direct illumination source, and for optional indirect illumination to be provided using one or more illumination sources that are not included in at least one overhead camera 510.

[0058] Optionally, at least one overhead camera 510 is configured to create at least one overhead image of the surface of the substrate 300 at the component placement location 800 .

[0059] Each of the cameras 410 and 510 includes one or more image sensors (not shown) and one or more optical elements (not shown). The image sensor(s) may use any suitable optical detection technique, such as CMOS. If necessary, the beam path may be diverted using one of several appropriately configured deflection mirrors (not shown).

[0060] In the example depicted in FIG. 1, at least one overhead camera 510 is attached to the pick and place actuator 150 .

[0061] 1 , pick-and-place actuator 150 includes a part gripper 160 that, during use, is releasably attached to gripper face 602 of part 600 and configured to hold the fixture during movement of pick-and-place actuator 150 and / or gripper 160. Gripper 160 may be vacuum-activated, for example, such that a degree of suction force may be used to hold part 600 in gripper 160. Gripper 160 is configured to be rotatable about Z-axis 930.

[0062] 1, apparatus 100 is configured to provide at least a portion of an installation process at installation location 800. During at least a portion of the installation process, mounting surfaces 601 of one or more components 600 contact one or more substrates 300 such that one or more installation operations can be performed on at least a portion of mounting surfaces 601. Mounting surfaces 601 are typically at least a portion of the mutual area of ​​contact between the components and the substrate.

[0063] 1 , the first drive system 210 is configured to transport the pick-and-place actuator 150 over a relatively long distance, i.e., from a part exchange position 810, where the pick-and-place actuator 150 and gripper 160 receive a part 600 from a part exchanger 170, to a placement position 800, where the pick-and-place actuator 150 and gripper 160 place the part 600 on a substrate 300. The requirements for the positional accuracy of the first drive system 210 may be relatively moderate, with a positional accuracy of + / −2 μm typically being sufficient. In the example depicted in FIG. 1 , the first drive system 210 is designed as a so-called “gantry” with two or more mechanically highly stable motion axes, two of which enable movement of the pick-and-place actuator 150 along two axes 910, 920 extending perpendicular to each other.

[0064] Typically, movement of the pick-and-place actuator 150 along the Z-axis 930 is required to remove the component 600 from the component exchanger unit 170 and place the component 600 at its intended placement location on the substrate 300. This movement along the Z-axis 930 can be accomplished in many different ways, such as by providing the first drive system 210 with a third stable or highly stable axis of motion configured to provide movement of the pick-and-place actuator along the Z-axis 930. Additionally or alternatively, the second drive system 220 can be provided with an additional precision drive configured to provide movement of the pick-and-place actuator 150 along the Z-axis 930. Additionally or alternatively, the pick-and-place actuator 150 can include a precision drive configured to provide movement of the gripper 160 along the Z-axis 930. The apparatus 100 can include only one, two, or all three of the above motion axes / drives for movement along the Z-axis 930.

[0065] In the example depicted in FIG. 1, the second drive system 220 is configured to move the pick-and-place actuator 150 between processing positions and further to enable the pick-and-place actuator 150 to make highly accurate corrective movements in two different directions 910, 920.

[0066] In the example depicted in FIG. 1, the pick-and-place actuator 150 optionally includes a drive for rotating the part gripper 160 about the Z-axis 930 .

[0067] Additionally or alternatively, the part exchanger 170 may be configured to rotate one or more parts 600 about the Z axis 930 to reduce or eliminate at least some angular error.

[0068] Additionally or alternatively, the substrate feeder 140 may be configured to rotate one or more substrates 300 about the Z-axis 930 to reduce or eliminate at least some angular error.

[0069] 1, the range of motion of the second drive system 220 is typically small or very small compared to the range of motion of the first drive system 210. The second drive system 220 is configured to move the pick-and-place actuator 150 to one or more processing locations and is configured to provide highly accurate, corrective movement of the pick-and-place actuator 150 in two different directions 910, 920.

[0070] One or more components 600 include a first surface, nominally described as a top surface, using the orientation depicted in FIG. 1 . The first surface is suitable for releasably attaching to gripper 160 and is therefore also described as gripper surface 602. One or more components 600 include a second surface, nominally described as a bottom surface, using the orientation depicted in FIG. 1 . The second surface is suitable for attaching to a substrate and is therefore also described as attachment surface 601. The second surface is suitable for releasably attaching to component holder 130.

[0071] The apparatus 100 is configured to move the part 600 attached to the gripper 160 at the part exchange position 810 along the Z axis 930 away from the holder 130 .

[0072] The apparatus 100 described above in connection with FIG. 1, and all variations and embodiments described herein, are suitable for carrying out the improved methods disclosed herein.

[0073] 2A-2D depict selected steps of a method for picking components and placing the components on a substrate. The apparatus depicted in FIG. 1 can be modified to perform the method using modified components and modules. The modified components and modules depicted in FIGS. 2A-2D, which have the same reference numbers, function similarly to, but are not identical to, the corresponding components and modules in FIG. 1. The modules and components in FIGS. 2A-2D are shown in schematic cross-sectional side views during picking and placing. More specifically, the components and modules are viewed as viewed toward a plane containing an X-axis 920, nominally depicted as having a positive direction from left to right, and a Z-axis 930, nominally depicted as having a positive direction from bottom to top. The Y-axis 910 is nominally depicted as having a positive direction, pointing outward from the viewer.

[0074] 2A, a part exchanger 9170 holds a part 600 on a part holder 9130 at a part exchange position 9810. At the part exchange position 9810, an overhead camera 9510 is used to create an image of the part 600 positioned within a field of view 9515 of the overhead camera 9510. The image is then used to determine the position of the part 600.

[0075] After creating the image, the pick and place actuator 150 is moved to the part replacement position 9810 .

[0076] As depicted in Figure 2B, the pick-and-place actuator 150 is positioned so that the gripper 160 faces the part 600 and so that the gripper 160 is proximate to the part 600. The pick-and-place actuator 150 places the part 600 at the part exchange position 9810 as depicted in Figure 2B.

[0077] After attaching the gripper 160 to the part 600, the part holder 9130 releases the part 600.

[0078] As depicted in FIG. 2C, the pick-and-place actuator 150 is moved away from the part holder 9130 while the part 600 is held by the gripper 160, thereby creating a gap for further movement of the part 600 to the placement position 800.

[0079] After sufficient clearance is created, the pick-and-place actuator 150 and component 600 are moved to the component placement position 800 .

[0080] As depicted in Figure 2D, apparatus 100 provides substrate 300 to component placement location 800. As depicted in Figure 2D, pick-and-place actuator 150 is moved so that component 600 is adjacent to substrate 300. Component 600 is placed by gripper 160, which releases component 600 at placement location 800, as depicted in Figure 2D.

[0081] A disadvantage of the picking method is that any significant deflection errors that occur when component 600 is attached to gripper 160 are never detected or measured during the picking step. For example, significant deflection errors may be up to several microns. For example, significant deflection errors may be up to 5 microns (μm). This often results in unrecognized alignment errors between component 600 and substrate 300 at component placement location 800. In other words, there may be unrecognized position and / or orientation errors between component 600 and substrate 300 at component placement location 800 prior to placement.

[0082] To reduce the risk of unrecognized alignment errors, improved methods for picking are described herein. These improved alignment methods may also reduce the extent of any unrecognized alignment errors. For example, significant deflection errors may be reduced to less than 1 micron (μm). For example, significant deflection errors may be reduced to less than 500 nanometers (nm). For example, significant deflection errors may be reduced to a range of approximately 100 nm to 500 nm.

[0083] 3A-3D depict selected steps of the improved method. The apparatus depicted in FIG. 1 is suitable for performing the improved method for picking components 600 and placing the components on a substrate 300. Components and modules depicted in FIGS. 3A-3D with the same reference numerals function similarly to the corresponding components and modules in FIG. 1. The modules and components in FIGS. 3A-3D are shown in schematic cross-sectional side views during picking and placing. More specifically, the components and modules are viewed as viewed toward a plane containing an X-axis 920, nominally depicted as having a positive direction from left to right, and a Z-axis 930, nominally depicted as having a positive direction from bottom to top. A Y-axis 910 is nominally depicted as having a positive direction, pointing outward from the viewer.

[0084] As depicted in FIG. 3A , the part exchanger 170 holds the part 600 on the receiving surface 131 of the part holder 130 at the part exchange position 810. The receiving surface 131 of the part holder 130 is suitable for receiving and holding at least a portion of the mounting surface 601 of the part 600. In the example depicted in FIG. 3A , the mounting surface 601 of the part 600 is received by the receiving surface 131 of the part holder 130. In the example depicted in FIG. 3A , the part holder 130 includes a rear surface 132 disposed as the surface opposite the receiving surface 131.

[0085] 3A, the at least one overhead camera 510 is configured to create at least one overhead image of at least a portion of the grip surface 602 of the part 600 at the part exchange location 810. In the example depicted in FIG. 3A, the at least one overhead camera 510 is used to create at least one first overhead image 710 of a first part mark included on the part 600. The at least one first overhead image 710 can optionally be used to determine a position error of the part 600. The at least one first overhead image 710 can optionally be used to determine a first position and / or orientation of the part 600.

[0086] In the example depicted in Figure 3A, the at least one top view camera 410 is configured to create at least one top view image of at least a portion of the mounting surface 601 of the part 600 at the part replacement location 810. In the example depicted in Figure 3A, the at least one top view camera 410 is used to create at least one first top view image 720 of a second part mark included on the part. The at least one first top view image 720 is then used to determine a position error of the part 600. The at least one first top view image 720 can optionally be used to determine a second position and / or orientation of the part 600.

[0087] Any suitable part mark may be used. For example, the one or more marks may be selected from the group including one or more physical features of at least a portion of part 600, one or more optical properties of at least a portion of part 600, at least a portion of a fiducial on the part, or any combination thereof. The physical features may include, for example, one or more edges, one or more corners, one or more facets. The second part mark may include, for example, at least a portion of an edge, such as a saw blade. The part marks may be physically different, physically similar, physically the same, physically identical, optically different, optically similar, optically the same, optically identical, or any combination thereof. For example, the same physical part mark may appear as a different part mark when viewed in one or more different optical configurations and / or orientations.

[0088] It may be advantageous if the second part mark and the third part mark include at least a portion of an active die structure included in gripper face 602 of the part, as greater accuracy may be achieved.

[0089] In the example depicted in FIG. 3A, the part exchanger 170 is positioned so that at least one overhead camera 510 faces the receiving surface 131 of the part holder 130.

[0090] In the example depicted in FIG. 3A, the part exchanger 170 is positioned such that at least one overhead camera 510 faces the gripper face 602 of the part 600, thereby creating one or more overhead images from one or more first part marks.

[0091] In the example depicted in FIG. 3A, the part exchanger 170 is positioned so that at least one top-view camera 410 faces the rear surface 132 of the part holder 130 .

[0092] In the example depicted in FIG. 3A, the part holder 130 is positioned such that at least one overhead camera 410 faces at least a portion of the mounting surface 601 of the part 600, thereby creating one or more overhead images from one or more second part marks.

[0093] For example, one or more radiation windows (not shown) may be provided in the component holder 130 and configured to allow illumination radiation to pass between the receiving surface 131 and the rear surface 132 of the component holder.

[0094] For example, the component holder may be a transparent plate, such as a glass plate, with vacuum holes that provide a relatively large exit window, which may be advantageous as it allows for some degree of simultaneous surface inspection.

[0095] For example, one or more exit windows may be located at one or more corners of the component. For example, one or more exit windows may be located approximately in the center of one or more sides of the component.

[0096] After creating at least one first overhead image 710 and creating at least one first top-view image 720, the apparatus moves the pick-and-place actuator 150 to the part replacement position 810. Optionally, a predetermined relative position and / or orientation between the pick-and-place actuator 150 and the overhead camera 510 can be used to affect the accuracy of the movement. Additionally or alternatively, the at least one first overhead image 710 can be used to determine a first position and / or orientation of the part 600 to affect the accuracy of the movement.

[0097] 3B, the pick-and-place actuator 150 is positioned so that the gripper 160 faces the gripper surface 602 of the part 600 and so that the gripper 160 is adjacent to the gripper surface 602 of the part 600. As depicted in FIG. 3B, the gripper 160 is attached to the gripper surface 602 of the part 600 at the part exchange position 810.

[0098] After gripper 160 is attached to gripper surface 602 of part 600 , receiving surface 131 of part holder 130 releases attachment surface 601 of part 600 .

[0099] As depicted in FIG. 3C , the pick-and-place actuator 150 is moved away from the component holder 130 along a Z-axis 930 away from the receiving surface 131 of the component holder 130 while the component 600 is held by the gripper 160. After being released by the component holder 130 and moved along the Z-axis 930, the component 600 is positioned at a further inspection position 932. In the example depicted in FIG. 3C , the mounting surface 601 of the component 600 is positioned at the further inspection position 932. In the example depicted in FIG. 3C , the mounting surface 601 of the component 600 is maintained in the field of view 415 of the at least one top-view camera 410. In the example depicted in FIG. 3C , the proximity between the mounting surface 601 of the component 600 and the receiving surface 131 of the holder 130 is maintained while at least one second top-view image 730 is created. In the context of this disclosure, proximity means that the average separation distance between the mounting surface 601 of the component 600 and the receiving surface 131 of the holder 130 may be in the range of 10 to 200 μm.

[0100] At the part exchange position 810, the top view camera 410 is used to create at least one second top view image 730 of the third part mark at a further inspection position 932.

[0101] The further inspection position 932 of the part 600 may be advantageously configured to maintain the mounting surface 601 of the part 600 within an optimal imaging range of the top-view camera 410, such as within a depth of focus configured to produce at least one first top-view image 720 depicted in FIG. 3A and at least one second top-view image 730 depicted in FIG. 3C . This may result in greater accuracy when comparing the position and / orientation of the third part mark with the position and / orientation of the second part mark due to reduced differences in optical paths and optical configurations. Additionally or alternatively, the focus of the top-view camera 410 may be modified to capture the at least one third image 730 within the optimal imaging range. Optionally, the third part mark and the second part mark may share one or more of the same physical features of the part, such as one or more edges. Additionally or alternatively, the third part mark and the second part mark may share one or more of the same optical characteristics of the part. Additionally or alternatively, the third part mark and the second part mark may be included on the same side of the part. Additionally or alternatively, the third part mark and / or the second part mark may be included on the mounting surface 601 of the part 600.

[0102] At least one second top-view image 730 and at least one first top-view image 720 are used to determine a position error of the part 600. For example, a second position and / or orientation of the part 600 can be determined using the at least one first top-view image 720. For example, a third position and / or orientation of the part 600 can be determined using the at least one second top-view image 730. For example, a position error of the part 600 can be determined using the third position and / or orientation together with the second position and / or orientation. The position error of the part 600 corresponds to a difference between a second part position (attached to the part holder 130) and a third part position (attached to the gripper 160 after being released from the part holder 130) caused by a shift of the part during release from the part holder 130.

[0103] Additionally or alternatively, the position error of the component 600 determined after the steps depicted in FIG. 3C can be at least partially corrected before placing the component 600 on the substrate 300 at the component placement location 800.

[0104] Optionally, at least a partial correction can be retained for one or more subsequent parts. For example, a position error of part 600 can be at least partially corrected by correcting one or more appropriate positions and / or orientations selected from the group including rotation of part 600, misalignment of part 600, tilt of part 600, rotation of substrate 300, misalignment of substrate 300, tilt of substrate 300, rotation of pick-and-place actuator 150, misalignment of pick-and-place actuator 150, tilt of pick-and-place actuator 150, rotation of gripper 160, misalignment of gripper 160, tilt of gripper 160, or any combination thereof.

[0105] Additionally or alternatively, the expected positional error of the subsequent part can be at least partially corrected by correcting one or more appropriate positions and / or orientations selected from the group including rotation of the part holder 130, misalignment of the part holder 130, tilt of the part holder 130, or any combination thereof.

[0106] Optionally, after the step depicted in Figure 3C, if the clearance for further movement is too small, the apparatus moves pick-and-place actuator 150 further away from component holder 130 while component 600 is held by gripper 160. After sufficient clearance is created, pick-and-place actuator 150 and component 600 are moved by the apparatus to component placement position 800.

[0107] As depicted in Figure 3D, apparatus 100 provides substrate 300 to placement location 800. As depicted in Figure 3D, the apparatus moves pick-and-place actuator 150 so that mounting surface 601 of component 600 is adjacent to substrate 300 and / or component placement location 800, optionally at least partially correcting one or more positional errors of component 600. As depicted in Figure 3D, apparatus 100 then places mounting surface 601 of component 600 onto substrate 300 by gripper 160 releasing gripper surface 602 of component 600 at component placement location 800.

[0108] The example depicted in FIGS. 4A and 4B illustrates an embodiment of the improved apparatus depicted in FIG. 1. Components and modules depicted in FIGS. 4A and 4B having the same reference numerals function similarly to corresponding components and modules in FIG. 1 and FIGS. 3A-3D. The example depicted in FIGS. 4A and 4B also illustrates optional method steps that may be performed before the step depicted in FIG. 3A above to provide a component 600 held on the receiving surface 131 of the component holder 130 at the component exchange position 810. The components and modules in FIGS. 4A and 4B are shown in a schematic cross-sectional side view during component loading and before component exchange. More specifically, the components and modules are viewed along a plane containing an X-axis 920, nominally depicted as having a positive direction from left to right, and a Z-axis 930, nominally depicted as having a positive direction from bottom to top. The Y-axis 910 is nominally depicted as having a positive direction, pointing from the drawing toward the viewer.

[0109] As depicted in FIG. 4A, the part exchanger 170 is configured to receive the part 600 from the optional part feeder 120 at the part loading position 820 and to hold the part 600 in the part holder 130.

[0110] As depicted in FIG. 4B, the part exchanger 170 is configured to hold the part 600 in the part holder 130 at the part exchange position 810 and to release the part 600 to a pick-and-place actuator (not shown). Optionally, the part feeder 120 can be configured to hold and release the part. Any suitable part exchanger 170 can be used in the apparatus depicted in FIG.

[0111] 4A and 4B, a flip-unit type part exchanger 170 can be provided that includes a part holder 130, includes means (not shown) for rotating 240 the exchanger in both directions about a first axis (Y-axis) 910, and includes an exchanger member 175 connecting the part holder 130 to the means (not shown) for rotating the exchanger. In the example depicted in Figures 4A and 4B, the part exchanger 170 is configured to rotate 240 approximately in a semicircle in a clockwise and counterclockwise direction between a part loading position 820 depicted in Figure 4A and a part exchange position 810 depicted in Figure 4B.

[0112] In the example depicted in FIG. 4A, the part exchanger 170 rotates 240 counterclockwise about the first axis (Y) 910, the receiving surface 131 of the part holder 130 is moved adjacent to the mounting surface 601 of the part 600, and the mounting surface 601 of the part 600 is attached to the receiving surface 131 of the part holder 130.

[0113] After receiving the part 600 at the part loading position 820 , the part exchanger 170 rotates clockwise about the first axis (Y) 910 to the part exchange position 810 .

[0114] In the example depicted in FIG. 4B , the part exchanger 170 holds the part 600 on the receiving surface 131 of the part holder 130 at the part exchange position 810. In the example depicted in FIG. 4B , the part exchanger 170 is positioned such that the at least one top-view camera 410 faces the rear surface 132 of the part holder 130. In the example depicted in FIG. 4B , the mounting surface 601 of the part 600 is maintained in the field of view 415 of the at least one top-view camera 410. In the example depicted in FIG. 4B , the at least one top-view camera 410 faces at least a portion of the mounting surface 601 of the part 600, thereby creating one or more top-view images from the one or more second part marks. In the example depicted in FIG. 4B , one or more radiation windows (not shown) are provided in the part holder 130 and configured to allow illumination radiation to pass between the receiving surface 131 and the rear surface 132 of the part holder 130.

[0115] The part exchanger 170 depicted in FIG. 4B after holding the part 600 on the receiving surface 131 of the part holder 130 at the part exchange position 810 is suitable for performing the steps of the improved method depicted in FIGS. 3A-3D and described above. In particular, the part exchanger 170 depicted in FIGS. 4A and 4B is suitable for performing the steps depicted in FIG. 3C, in which the mounting surface 601 of the part 600 is maintained in a further inspection position (not shown) while at least one second top-view image (not shown) is generated. The part exchanger 170 depicted in FIGS. 4A and 4B is suitable for performing the steps depicted in FIG. 3C, in which the mounting surface 601 of the part 600 is maintained in the field of view 415 of the at least one top-view camera 410.

[0116] FIGS. 5A and 5B depict an embodiment of an improved part holder 130 for releasably attaching to a part. The example depicted in FIGS. 5A and 5B is suitable for use with the part exchanger 170 depicted in FIGS. 3A-3D. Parts and modules depicted in FIGS. 5A and 5B having the same reference numbers function similarly to corresponding parts and modules in FIGS. 1, 3A-3D, and 4A-4B. The example depicted in FIGS. 5A and 5B is suitable for use with the part exchanger 170 depicted in FIGS. 4A-4B. The modules and parts in FIGS. 5A and 5B are shown in a schematic overhead plan view, as viewed from above. More specifically, the parts and modules are displayed as viewed toward a plane containing an X-axis 920, nominally depicted as having a positive direction from left to right, and a Y-axis 910, nominally depicted as having a positive direction from top to bottom. The Z axis 930 is nominally depicted as having a positive direction, pointing out of the drawing towards the viewer.

[0117] In the example depicted in FIG. 5A , the mounting surface 131 of the component holder 130 is depicted in the plane of the drawing without a component (not shown). In the example depicted in FIG. 5A , the extent of the component-holding area 137 is indicated and provides a nominal location for receiving and releasably attaching a component (not shown), but the extent of the component-holding area 137 is predetermined and / or controlled to correspond to the expected dimensions and orientation of the received component (not shown). In the example depicted in FIG. 5A , the component holder 130 further includes one or more emission windows 135 configured to allow illumination radiation to pass between the receiving surface 131 and a rear surface (not shown) of the component holder 130. In the example depicted in FIG. 5A , the one or more emission windows 135 are configured at least partially within the component-holding area 137. In the example depicted in FIG. 5A , the one or more emission windows 135 are provided adjacent to a location where a corner of a component (not shown) is expected to be positioned during use. In the example depicted in Figure 5A, one or more exit windows 135 are provided at the location where an edge of a part (not shown) is expected to be positioned during use.

[0118] In the example depicted in FIG. 5A , at least one overhead camera (not shown) is positioned directly behind the component holder 130, and the range of the field of view 415 of the at least one overhead camera (not shown) is also displayed. In the example depicted in FIG. 5A , one or more emission windows 135 are at least partially located within the field of view 415 of the at least one overhead camera (not shown). In the example depicted in FIG. 5A , one or more emission windows 135 are substantially located within the field of view 415 of the at least one overhead camera (not shown). In the example depicted in FIG. 5A , one or more emission windows 135 are completely located within the field of view 415 of the at least one overhead camera (not shown). In the example depicted in FIG. 5A , the range of the component holding area 137 is at least partially located within the field of view 415 of the at least one overhead camera (not shown). In the example depicted in FIG. 5A , the range of the component holding area 137 is substantially located within the field of view 415 of the at least one overhead camera (not shown). In the example depicted in Figure 5A, the field of view 415 of at least one overhead camera (not shown) is positioned symmetrically around the extent of the component-holding area 137. In the example depicted in Figure 5A, the extent of the component-holding area 137 is positioned entirely within the field of view 415 of the at least one overhead camera (not shown). In the example depicted in Figure 5A, the field of view 415 of the at least one overhead camera (not shown) is positioned to surround at least a portion of the component-holding area 137.

[0119] The example depicted in FIG. 5B is the same as the example depicted in FIG. 5A except for the following five differences: Difference 1: The part 600 is depicted held on the mounting surface 131; Difference 2: The part 600 is depicted held within a part holding area (not shown). Difference 3: Part 600 is depicted with one negative Y / negative X corner adjacent to one or more exit windows 135; Difference 4: Part 600 is depicted with a portion of its negative X-direction edge within one or more exit windows 135; Difference 5: Part 600 is depicted with a portion of its negative Y edge within one or more exit windows 135.

[0120] Optionally, the part holder 130 can include means for releasing and / or holding the part, such as a channel and a vacuum source.

[0121] Optionally, the part holder 130 can be configured for one or more part dimensions and / or one or more part orientations.

[0122] Optionally, one or more exit windows 135 may be symmetrically positioned within the component-holding area 137 .

[0123] Optionally, one or more exit windows 135 may include one or more openings.

[0124] Optionally, the one or more emission windows 135 may include one or more areas that are at least partially transparent to the illumination radiation, such as a glass or plastic window within the metal component holder 130. For example, the one or more emission windows may be provided in an opaque material.

[0125] Optionally, the field of view 415 of at least one overhead camera (not shown) may be positioned to surround a portion of the part-holding area 137 .

[0126] Optionally, the field of view 415 of at least one overhead camera (not shown) may be positioned asymmetrically around the extent of the part-holding area 137 .

[0127] Optionally, at least a portion of one or more exit windows 135 may be provided in symmetrical locations within component-holding area 137 .

[0128] Optionally, at least a portion of one or more exit windows 135 may be provided in an asymmetrical position within component-holding area 137 .

[0129] Optionally, one or more exit windows 135 may be provided adjacent to where corners of a component (not shown) are expected to be positioned during use.

[0130] Optionally, one or more exit windows 135 may be provided at locations where multiple edges of a part (not shown) are expected to be positioned during use.

[0131] In summary, therefore, there is provided a method and apparatus for determining positioning error of a pickable part, the apparatus 100 including a part holder 130 for releasably attaching to a part 600, the method including creating a first image 720 of a first part mark using an overhead camera 410 at a part exchange position, attaching the part to a gripper 160, releasing the part, creating a second image 730 of a second part mark using the overhead camera, and using the second image in conjunction with the first image to determine the position error.

[0132] By using the corresponding part marks to determine the position error, the accuracy of the error determination can be increased. This can be advantageous for picking parts with less accurate part marks, such as picking tips with rough and irregular edges due to imprecise sawing. This can be advantageous for flip-chip parts.

[0133] Optionally, during one or more steps of the methods described herein, the device may be pre-configured to perform one or more predetermined operations to improve throughput. Additionally or alternatively, the device may be pre-configured to control one or more operations during use.

[0134] Although many functions and features included in, attached to, or associated with the pick and place actuator are described in this disclosure, these should be construed as examples only, and one skilled in the art could configure and arrange one or more of these functions and features to be only partially included in, attached to, or associated with the pick and place actuator.

[0135] In the embodiments described herein, the one or more position errors may be determined using one or more images. However, all of the embodiments described and disclosed herein may also provide similar benefits by using any convenient form of position recognition and / or detection, such as image analysis, line scanning, or position sensing. Similarly, in the embodiments described herein, the one or more images may be created using one or more cameras. However, all of the embodiments described and disclosed herein may also provide similar benefits by using any convenient optical system or position recognition or detection device, such as a camera, line scanner, or position sensitive device (PSD).

[0136] For example, one or more elevation-looking cameras may be positioned at approximately a 90 degree angle and a reflector, such as a mirror, may be provided to redirect the light path.

[0137] For example, one or more overhead cameras may be positioned with two or more 45 degree reflectors, such as mirrors, to configure the one or more overhead cameras as one or more elevation cameras.

[0138] For example, one or more overhead cameras may be positioned at approximately a 90 degree angle and a reflector, such as a mirror, may be provided to redirect the light path.

[0139] For example, one or more overhead cameras may be positioned with two or more 45 degree reflectors, such as mirrors, to configure the one or more overhead cameras as one or more overhead cameras. [Explanation of symbols]

[0140] Reference Code List 100 Pick and Place Device 120 Parts feeder or feeding unit 130 Parts holder 131 Reception area 132 rear surface 135 Radiation window 137 Parts holding area 140 Substrate feeder or feeding unit 150 Pick and Place Actuator 160 Part Gripper 170 Parts Exchanger 175 Exchanger Components 210 First Drive System 220 Second Drive System 240 Exchanger Rotation 300 boards 410 Elevation Camera 415 Field of view of an upward-looking camera 510 Bird's-eye view camera 515 Bird's-eye view camera field of view 520 Optical axis of overhead camera 600 parts 601 Mounting surface 602 Gripper surface 710 First overhead image 720 First upward-looking image 730 Second upward-looking image 800 Parts installation position 810 Parts replacement position 820 Parts Loading Position 910 First axis (Y) 920 Second Axis (X) 930 Third Axis (Z) 932 Further Testing Locations 9130 Parts Holder 9170 Parts Exchanger 9510 Bird's-eye view camera 9515 Bird's-eye view camera field of view 9810 Parts replacement position

Claims

1. 1. A method for determining a positioning error of a pickable component (600) before the component (600) is placed on a substrate (300) using an apparatus (100), comprising: the part (600) includes one or more part marks; the component (600) includes a mounting surface (601) suitable for mounting to the substrate (300) and a gripping surface (602) disposed opposite the mounting surface (601); The device (100) a pick and place actuator (150) arranged to be provided at a placement position (800) and a part exchange position (810), the pick and place actuator (150) including a gripper (160) for releasably attaching to the gripping surface of the part (600); a component holder (130) for releasably attaching to the mounting surface (601) of the component (600); at least one top-view camera (410) configured to generate at least one top-view image of at least a portion of the mounting surface (601) of the component; Including, The method comprises: Attaching the mounting surface (601) of the component (600) to the component holder (130); moving the part holder (130) with the attached part (600) to the part exchange position (810); creating at least one first elevated image (720) of a first part mark using the at least one elevated camera (410) at the part exchange location (810); moving the pick and place actuator (150) to the part exchange position (810); Attaching the gripping surface of the part (600) to the gripper (160) and releasing the attachment surface of the part (600) from the part holder (130); creating at least one second elevated view image (730) of a second part mark using the at least one elevated view camera (410) at the part exchange location (810); determining a position error of the part (600) using the at least one second top-view image (730) and the at least one first top-view image (720); A method comprising:

2. The device, at least one overhead camera (510) configured to generate at least one overhead image of at least a portion of the grip surface (602) of the part (600); The method comprises:

2. The method of claim 1, comprising creating at least one first overhead image (710) of a third part mark using the at least one overhead camera (510) at the part exchange location (810).

3. providing the substrate (300) at the installation location (800); moving the pick-and-place actuator (150) with the attached component (600) to the placement position (800); placing the component (600) on the substrate (300) at the placement position (800); 3. The method of claim 1 or 2, comprising:

4. 4. The method of claim 1, comprising at least partially correcting the position error of the component by correcting one or more positions and / or orientations selected from the group consisting of: rotation of the component, misalignment of the component, tilt of the component, rotation of the substrate, misalignment of the substrate, tilt of the substrate, rotation of the pick-and-place actuator, misalignment of the pick-and-place actuator, tilt of the pick-and-place actuator, rotation of the gripper, misalignment of the gripper, tilt of the gripper, rotation of the component holder, misalignment of the component holder, tilt of the component holder, or any combination thereof.

5. the apparatus (100) includes a part loading position (820); The method comprises: providing the part (600) to the part loading location (820); moving the component holder (130) to the component loading position (820); attaching the component (600) to the component holder (130); moving the part holder (130) with the attached part (600) to the part exchange position (810); The method according to any one of claims 1 to 4, comprising:

6. The method of any one of claims 1 to 5, wherein the substrate (300) comprises at least one substrate mark (340).

7. generating at least one second overhead image of a portion of the substrate and / or at least one substrate mark (340) using the at least one overhead camera (510) at the installation location (800); determining a fourth position and / or orientation of the substrate (300) using the at least one second overhead image; The method of claim 6, comprising:

8. 1. An apparatus for picking a component (600) before the component (600) is placed on a substrate (300) for attachment, comprising: the part (600) includes one or more part marks; the component (600) includes a mounting surface (601) suitable for mounting to the substrate (300) and a gripping surface (602) disposed opposite the mounting surface (601); The device (100) a pick and place actuator (150) configured to be provided at a placement position (800) and a part exchange position (810), the pick and place actuator (150) including a gripper (160) for releasably attaching to the gripping surface of the part (600); a component holder (130) for releasably attaching to the mounting surface (601) of the component (600); at least one top-view camera (410) configured to generate at least one top-view image of at least a portion of the mounting surface (601) of the component (600); Including, the device (100) is configured to attach the mounting surface (601) of the part (600) to the part holder (130) and move the part holder (130) together with the attached part (600) to the part exchange position (810); the at least one elevation camera (410) is configured to create at least one first elevation image (720) of a first part mark at the part exchange location (810); the apparatus (100) is configured to move the pick-and-place actuator (150) to the part exchange position (810); the device (100) is configured to attach the gripping surface of the part (600) to the gripper (160) and to release the attachment surface of the part (600) from the part holder (130); the at least one elevation camera (410) is configured to create at least one second elevation image (730) of a second part mark at the part exchange location (810); The apparatus (100) is configured to determine a position error of the part (600) using the at least one second top-view image (730) and the at least one first top-view image (720).

9. at least one overhead camera (510) configured to generate at least one overhead image of at least a portion of the grip surface of the part (600); 9. The apparatus (100) of claim 8, wherein the at least one overhead camera (510) is configured to create at least one first overhead image (710) of a third part mark at the part exchange location (810).

10. The part holder (130) a receiving surface (131) having a component-holding area (137) adapted to receive and hold at least a portion of the mounting surface (601) of the component (600); a rear surface (132) disposed opposite said receiving surface (131); one or more radiation windows (135) configured to allow illumination radiation to pass between said receiving surface (131) and said rear surface (132); Including, 10. The apparatus of claim 8 or 9, wherein the at least one top-view camera (410) is configured to create the at least one first top-view image (720) and / or the at least one second top-view image (730) using illumination radiation passing between the receiving surface (131) and the rear surface (132).

11. The apparatus of claim 10 , wherein the one or more radiation windows (135) comprise one or more openings and / or one or more areas that are at least partially transparent to illumination radiation.

12. 12. The apparatus of claim 10 or 11, wherein the one or more emission windows (135) are at least partially configured within the component-holding area (137).

13. At least one part mark is The apparatus of any one of claims 8 to 12, wherein the at least one optical characteristic is selected from the group comprising one or more physical characteristics of at least a portion of the part (600), one or more optical characteristics of at least a portion of the part (600), at least a portion of a fiducial on the part (600), or any combination thereof.

14. The device comprises: providing the substrate (300) at the installation position (800); moving the pick-and-place actuator (150) with the attached component (600) to the placement position (800); and The component (600) is placed on the substrate (300) at the placement position (800), The device (100) according to any one of claims 8 to 13, configured as follows.

15. 15. The apparatus of claim 8, wherein the first part mark and the second part mark share one or more of the same physical features of the part (600) and / or share one or more of the same optical properties of the part (600).

16. The apparatus of any one of claims 8 to 15, wherein the at least one overhead camera (510) and / or the at least one top-view camera (410) are configured to illuminate at least a portion of a surface of the part (600).

17. The apparatus (100) according to any one of claims 8 to 16, wherein the apparatus (100) includes a part loading position (820), and the apparatus (100) is configured to provide the part (600) to the part loading position (820), move the part holder (130) to the part loading position (820) and attach the part (600) to the part holder (130), and move the part holder (130) together with the attached part (600) to the part exchange position (810).

18. The apparatus of any one of claims 8 to 17, wherein the substrate (300) comprises at least one substrate mark (340).

19. 20. The apparatus of claim 18, wherein the at least one substrate mark (340) is selected from the group comprising one or more physical features of at least a portion of the substrate (300), one or more optical properties of at least a portion of the substrate (300), at least a portion of a fiducial on the substrate, or any combination thereof.

20. the at least one overhead camera (510) is configured to create at least one second overhead image of the at least one substrate mark (340) at the installation location (800); 20. The apparatus of claim 18 or 19, wherein the apparatus is configured to determine a fourth position and / or orientation of the substrate (300) using the at least one second overhead image.

21. The part (600) 21. The device of any one of claims 8 to 20, selected from the group comprising one or more dies, one or more semiconductor packages, one or more chips, one or more flip chips, one or more integrated circuits, one or more further substrates (300), one or more optical elements, one or more electronic elements, one or more electro-optical elements, or any combination thereof.

22. 22. The apparatus of claim 8, additionally comprising at least one overhead camera (510) configured to generate at least one overhead image of at least a portion of the grip surface (602) of the part (600).

23. 23. The apparatus of claim 8, wherein the at least one overhead camera is additionally configured to create at least one first overhead image of a first part mark at the part exchange location.

24. the at least one elevation camera (410) is configured to create at least one second elevation image (730) of a third part mark at the part exchange location (810); The apparatus (100) according to any one of claims 8 to 23, wherein the apparatus (100) is configured to determine a position error of the part (600) using the at least one second top-view image (730) and the at least one first top-view image (720).

25. 25. The apparatus of any one of claims 8 to 24, wherein the first part mark and the second part mark are physically different, physically similar, physically the same, physically identical, optically different, optically similar, optically the same, optically identical, or any combination thereof.

Images