Systems and methods for reducing defects using data analysis

Abstract

A method for defect reduction is disclosed. The method can include receiving defect data for one or more defects in one or more samples. The defect data can include defect location, defect size, defect shape, or a relationship between the defect and a component of the one or more samples. The method can include identifying at least one defect as a disqualifying defect based on the received defect data and one or more predetermined thresholds. Upon identifying the defect as a disqualifying defect, the method can include generating a tool-readable index configured to cause one or more downstream manufacturing tools to adjust one or more downstream manufacturing processes corresponding to the disqualifying defect based on the generated tool-readable index. The method can include providing the generated tool-readable index to the one or more downstream manufacturing tools.

Description

[Technical Field]

[0001] The present invention relates generally to defect reduction, and more particularly to systems and methods for defect reduction using data analysis. [Background technology]

[0002] The ever-increasing demand for electronic circuits with ever-smaller device features continues to drive the need for improved defect reduction techniques for printed circuit boards (PCBs). Current printed circuit board defect reduction techniques utilize defect data to adjust one or more characteristics of a preceding PCB manufacturing process / tool. However, one or more downstream processes / tools may be affected by the defects, potentially leading to the creation of additional defects. For example, during PCB manufacturing, contamination of the developer solution can lead to the creation of additional defects because photosensitive materials can seep into the vias / trenches of the electrical circuitry. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] U.S. Patent No. 8,139,844 Summary of the Invention [Problem to be solved by the invention]

[0004] It would therefore be advantageous to provide a system and method for ameliorating the shortcomings of the above-identified approaches. [Means for solving the problem]

[0005] A system according to one or more embodiments of the present disclosure is disclosed. In an embodiment, the system includes a characterization subsystem configured to perform inspection of one or more samples to generate defect data for one or more defects in the one or more samples. In an embodiment, the system further includes one or more controllers communicatively coupled to the characterization subsystem, the one or more controllers including one or more processors configured to execute a set of program instructions stored in a memory, the set of program instructions causing the one or more processors to receive defect data from the characterization subsystem, the defect data including one of a defect location, a defect size, a defect shape, or a relationship between the defect and a component of the one or more samples, identify at least one of the one or more defects as a disqualifying defect based on the received defect data and one or more predetermined thresholds, generate a tool-readable index upon identifying the defect as a disqualifying defect, the tool-readable index being configured to cause one or more downstream manufacturing tools to adjust one or more downstream manufacturing processes corresponding to the disqualifying defect based on the generated tool-readable index, and provide the generated tool-readable index to the one or more downstream manufacturing tools.

[0006] A system according to one or more embodiments of the present disclosure is disclosed. In an embodiment, the system includes one or more controllers communicatively coupled to a characterization subsystem, the one or more controllers including one or more processors configured to execute a set of program instructions stored in a memory, the set of program instructions causing the one or more processors to receive defect data from the characterization subsystem, the defect data including one of a defect location, a defect size, a defect shape, or a relationship between the defect and a component of the one or more samples, identify at least one defect of the one or more defects as a disqualifying defect based on the received defect data and one or more predetermined thresholds, generate a tool-readable index upon identifying the defect as a disqualifying defect, the tool-readable index being configured to cause one or more downstream manufacturing tools to adjust one or more downstream manufacturing processes corresponding to the disqualifying defect based on the generated tool-readable index, and provide the generated tool-readable index to the one or more downstream manufacturing tools.

[0007] A method is disclosed according to one or more embodiments of the present disclosure. In an embodiment, the method includes receiving defect data for one or more defects of one or more samples from a characterization subsystem, the defect data including one of a defect location, a defect size, a defect shape, or a relationship between the defect and a component of the one or more samples. In an embodiment, the method includes identifying at least one defect of the one or more defects as a disqualifying defect based on the received defect data and one or more predetermined thresholds. In an embodiment, upon identifying the defect as a disqualifying defect, the method includes generating a tool-readable index, the generated tool-readable index being configured to cause one or more downstream manufacturing tools to adjust one or more downstream manufacturing processes corresponding to the disqualifying defect based on the generated tool-readable index. In an embodiment, the method includes providing the generated tool-readable index to the one or more downstream manufacturing tools.

[0008] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not necessarily restrictive of the invention as claimed. The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the general description, serve to explain the principles of the invention.

[0009] The many advantages of the present disclosure may be better understood by those skilled in the art by reference to the accompanying drawings. [Brief explanation of the drawings]

[0010] [Figure 1A] 1 illustrates a block diagram of a defect reduction system in accordance with one or more embodiments of the present disclosure. [Figure 1B] FIG. 1 shows a simplified schematic diagram of an inspection subsystem of a defect reduction system in accordance with one or more embodiments of the present disclosure. [Figure 2] 1 shows a flow diagram depicting a method for reducing defects in a system according to one or more embodiments of the present disclosure. [Figure 3] 1 illustrates a process flow diagram depicting a method for reducing defects in a system in accordance with one or more embodiments of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0011] The present disclosure has been particularly shown and described with respect to certain embodiments and specific features thereof. The embodiments described herein are to be considered illustrative and not limiting. It will be readily apparent to those skilled in the art that various changes and modifications in form and detail can be made therein without departing from the spirit and scope of the present disclosure. Reference will now be made in detail to the disclosed subject matter, which is illustrated in the accompanying drawings.

[0012]

[0001] Embodiments of the present disclosure relate to systems and methods for defect reduction using data analysis. In particular, embodiments of the present disclosure relate to systems and methods for preventing defect accumulation through defect detection. For example, the system can be configured to emit a tool-readable index that can be interpreted by the next tool in the process, and the next tool in the process can skip the defective area according to the emitted tool-readable index.

[0013] FIG. 1A shows a block diagram of a defect reduction system 100 in accordance with one or more embodiments of the present disclosure.

[0014] In an embodiment, system 100 includes a characterization subsystem 102 configured for defect inspection of one or more samples. It is noted herein that characterization subsystem 102 can include an inspection subsystem. Characterization subsystem 102 can include any inspection subsystem 102 known in the art, including, but not limited to, an automated optical inspection tool (AOI tool).

[0015] Automated optical inspection systems are generally discussed in U.S. Pat. No. 8,077,307, issued December 13, 2011, U.S. Pat. No. 7,203,355, issued April 10, 2007, and U.S. Pat. No. 7,206,443, issued April 17, 2007, each of which is incorporated herein by reference in its entirety.

[0016] The characterization subsystem 102 can provide various types of characterization data related to defects in one or more samples. For example, the characterization subsystem 102 can provide defect characterization data. For example, the characterization subsystem 102 can provide the location, size, shape, number, or type of defects in one or more samples. Additionally, the characterization subsystem 102 can provide an association between the defects and specific components of the samples. In doing so, as shown in FIG. 3 , a barcode 306 can be generated, which can include an association between the panel 300 and the defect 300 a, as further described herein.

[0017] In an embodiment, system 100 includes one or more fabrication subsystems 104 (e.g., one or more fabrication tools 104). Fabrication subsystems 104 may include any type of sample fabrication subsystem 104 known in the art, including, but not limited to, a photolithography tool, a laser direct imaging tool, an etching tool, a drilling tool (e.g., a laser drilling tool or a mechanical drilling tool), a solder mask printing tool, a computer-aided manufacturing (CAM) design tool, etc.

[0018] Manufacturing tools are generally discussed in U.S. Pat. No. 8,964,274, issued Feb. 24, 2015, and U.S. Pat. No. 7,058,474, issued June 6, 2006, both of which are incorporated herein by reference in their entireties.

[0019] In an embodiment, system 100 includes one or more controllers 106 communicatively coupled to characterization subsystem 102 and one or more manufacturing subsystems 104. Controller 106 includes one or more processors 108 configured to execute program instructions retained in memory medium 110 (memory 110). The one or more processors 108 of controller 106 may perform any of the various process steps described throughout this disclosure. Additionally, one or more processors 108 of controller 106 may be configured to receive data, including, but not limited to, image data associated with one or more samples 112, from inspection subsystem 102 (or an external characterization tool).

[0020] FIG. 1B is a conceptual diagram illustrating the characterization subsystem 102 in accordance with one or more embodiments of the present disclosure.

[0021] In an embodiment, the characterization subsystem 102 includes an inspection subsystem 102 configured to perform defect inspection of one or more samples 112. For example, the inspection subsystem 102 may be configured to acquire one or more inspection images 101 of one or more portions of the one or more samples 112. The samples may include any type of sample, including, but not limited to, printed circuit boards (PCBs), flat panel displays (FPDs), wafers, etc.

[0022] In an embodiment, to facilitate movement of the one or more samples 112, the one or more samples 112 are disposed on a sample stage mechanism 111. The sample stage mechanism 111 may include any stage mechanism 111 known in the art.

[0023] In an embodiment, the inspection subsystem 102 includes an illumination source 114 configured to generate one or more illumination beams 116. The illumination source 114 may be configured to emit the one or more illumination beams 116 of one or more selected wavelengths of light, including, but not limited to, vacuum ultraviolet (VUV), deep ultraviolet (DUV), ultraviolet (UV), visible light, or infrared (IR). In an embodiment, the illumination source 114 may include a spectrally tunable illumination source to generate the one or more illumination beams 116 having a tunable spectrum.

[0024] In an embodiment, the illumination source 114 directs an illumination beam 116 to one or more samples 112 via an illumination path 118. The illumination path 118 may include one or more lenses 120 or additional illumination optics 122 suitable for modifying and / or conditioning the illumination beam 116. For example, the one or more illumination optics 122 may include, but are not limited to, one or more polarizers, one or more filters, one or more splitters, one or more diffusers, one or more homogenizers, one or more apodizers, one or more shapers, one or more shutters (e.g., mechanical shutters, electro-optic shutters, acousto-optic shutters, etc.), one or more aperture stops, and / or one or more field stops.

[0025] In an embodiment, the inspection subsystem 102 includes an electro-optic modulator 126. The electro-optic modulator 126 may be positioned in an illumination path of the illumination beam 116 from the illumination source 114. The electro-optic modulator 126 may modulate one or more characteristics of the illumination beam 116. In operation, light is transmitted through a portion of the electro-optic modulator 126, and defects may be detected by observing changes in the reflected or transmitted light. Electro-optic modulators are generally discussed in U.S. Patent No. 7,817,333, issued October 19, 2019, which is incorporated by reference in its entirety.

[0026] In an embodiment, detector 128 is configured to capture emission light (e.g., sample light 113) emitted from one or more samples 112 and passing through collection path 130. For example, collection path 130 may, but is not required to, include electro-optic modulator 126, a collection lens (e.g., an objective lens), or one or more additional collection path lenses 132. Detector 128 can then receive emission light reflected or scattered (e.g., by specular reflection, diffuse reflection, etc.) from one or more samples 112 or generated by one or more samples 112 (e.g., luminescence associated with absorption of illumination 114, etc.).

[0027] The collection path 130 may further include any number of collection optics 134 for directing and / or modifying the illumination collected by the electro-optic modulator 126, including, but not limited to, one or more collection path lenses 132, one or more filters, one or more polarizers, or one or more blocks. Additionally, the collection path 130 may include a field stop to control the spatial extent of the sample imaged onto the detector 128 or an aperture stop to control the angular extent of illumination from the sample used to generate the image on the detector 128. In an embodiment, the collection path 130 includes an aperture stop positioned in a plane conjugate to the back focal plane of the optical elements to provide telecentric imaging of the sample. In an embodiment, the inspection subsystem 102 includes a beam splitter 124 oriented such that the electro-optic modulator 126 can simultaneously direct the illumination beam 116 to one or more samples 112 and collect emission light emitted from the one or more samples 112.

[0028] Detector 128 may include any type of optical detector suitable for measuring illumination received from panel 300. For example, detector 128 may include, but is not limited to, a charge-coupled device (CCD) detector, a time-delay-integration (TDI) detector, a photomultiplier tube (PMT), an avalanche photodiode (APD), a complementary metal-oxide semiconductor (CMOS) sensor, etc. In an embodiment, detector 128 may include a spectroscopic detector suitable for identifying wavelengths of light emitted from one or more samples 112.

[0029] Although embodiments of the present disclosure relate to a printed circuit board inspection system, it is contemplated that system 100 may also be implemented as a wafer inspection system or a wafer metrology system, and therefore the above description should not be construed as limiting the scope of the present disclosure. Wafer inspection / metrology systems are generally discussed in U.S. Pat. No. 9,279,774, issued March 8, 2016; U.S. Pat. No. 7,957,066, issued June 7, 2011; U.S. Pat. No. 7,345,825, issued March 18, 2008; U.S. Pat. No. 5,999,310, issued December 7, 1999; U.S. Pat. No. 7,525,649, issued April 28, 2009; U.S. Pat. No. 9,228,943, issued January 5, 2016; U.S. Pat. No. 5,608,526, issued March 4, 1997; and U.S. Pat. No. 6,297,880, issued October 2, 2001, each of which is incorporated herein by reference in its entirety.

[0030] Figure 2 shows a flow diagram illustrating a method 200 for defect detection using system 100, in accordance with one or more embodiments of the present disclosure. Figure 3 shows a process flow diagram illustrating a method 200 for defect detection using system 100, in accordance with one or more embodiments of the present disclosure.

[0031] In step 202, defect data may be acquired for one or more defects in one or more samples 112. For example, controller 106 may be configured to acquire one or more inspection images 101 of one or more samples 112 from inspection subsystem 102. For example, one or more inspection images 101 may include defect data such as, but not limited to, defect location, defect size, defect shape, and a relationship between the defect and a particular component of the sample.

[0032] Referring to FIG. 3 , in an embodiment, one or more samples 112 include a panel 300 including one or more arrays 302 of samples 304. For example, the panel 300 may include one or more arrays 302 of printed circuit boards (PCBs) 304. The one or more arrays 302 of PCBs 304 may be arranged in a column / row configuration. For example, as shown in FIG. 3 , the one or more arrays 302 of PCBs 304 may include a first column (e.g., column A) of PCBs, a second column (e.g., column B) of PCBs, a third column (e.g., column C) of PCBs, a fourth column (e.g., column D) of PCBs, a fifth column (e.g., column E) of PCBs, and so on, up to N columns of PCBs. Each column (e.g., columns A-E) may include five rows (e.g., rows 1-5) of PCBs. It should be noted that FIG. 3 is presented herein for illustrative purposes only and should not be construed as limiting the scope of the present disclosure.

[0033] In step 204, the one or more defects may be analyzed to determine whether the one or more defects are disqualifying defects. For example, the controller 106 may be configured to identify at least one of the one or more defects as a disqualifying defect (e.g., a killer defect) based on the received defect data and one or more predetermined thresholds. As another example, the controller 106 may be configured to identify at least one of the one or more defects as a non-disqualifying defect (e.g., a pass defect).

[0034] 3 , in a non-limiting example, the controller 106 can be configured to analyze the sample 304a located in column D / row 3 as a killer defect 300a, such that the defect 300a can disqualify the sample 304a located in column D / row 3 on the panel 300. Additionally, the controller 106 can be configured to analyze the sample 304b located in column E / row 4 as a pass defect 300b, such that the defect 300b does not disqualify the sample 304b located in column E / row 4 on the panel 300.

[0035] In an embodiment, the one or more predetermined thresholds may include one or more user-defined thresholds, such as, but not limited to, one or more user-defined limits for a minimum defect size, a defect location, a defect type, a critical design area, a critical design pattern, etc.

[0036] A tool-readable index may be generated upon identifying at least one defect as a disqualifying defect in step 206. For example, the controller 106 may be configured to generate the tool-readable index including, but not limited to, a unit number, a unit location, a panel serial number, a barcode identifier (ID), etc.

[0037] In an embodiment, the generated tool-readable index is configured to cause one or more downstream manufacturing subsystems 104 to adjust one or more downstream manufacturing processes to isolate the defective region from the one or more downstream manufacturing processes. For example, the one or more downstream manufacturing subsystems 104 can be configured to avoid applying one or more manufacturing processes to the defective region. As another example, the one or more downstream manufacturing subsystems 104 may be configured to modify the design of the specified panel that includes the defective region.

[0038] 3 , in a non-limiting example, the generated tool-readable index can be configured to cause one or more downstream manufacturing subsystems 104 to adjust one or more downstream manufacturing processes of the sample 304a that includes the disqualifying killer defect 300a, where the generated tool-readable index can cause the one or more downstream manufacturing subsystems 104 to adjust one or more processes based on the identified disqualifying defect, and the one or more downstream manufacturing subsystems 104 can isolate the sample 304a from the downstream manufacturing processes based on the generated tool-readable index.

[0039] The generated tool readable index may be provided to one or more downstream manufacturing subsystems in step 208. For example, the controller 106 may be configured to provide the generated tool readable index to one or more downstream manufacturing subsystems 104.

[0040] 3 , the controller 106 may be configured to provide the generated tool-readable index to a manufacturing controller communicatively coupled to one or more downstream manufacturing subsystems 104. For example, the manufacturing controller may be configured to generate one or more communication protocols configured to cause one or more downstream manufacturing tools to adjust one or more downstream manufacturing processes corresponding to the disqualifying defect based on the generated tool-readable index and the generated one or more communication protocols.

[0041] The one or more communication protocols may include, but are not limited to, one or more exposure files, one or more Transmission Control Protocol / Internet Protocol (TCP / IP), one or more table databases, one or more Secure File Transfer Protocols (SFTP), one or more Internet Message Access Protocols (IMAP), one or more Semiconductor Equipment Communication Standard / Generic Model for Communication and Control of Manufacturing Equipment (SECS / GEM) protocols, and the like.

[0042] In one non-limiting example, the controller 106 can be configured to provide the generated tool-readable index to a computer-aided machining (CAM) station located in front of one or more downstream manufacturing subsystems 104 (e.g., laser direct imaging (LDI) tools). In this example, the CAM controller can be configured to generate one or more exposure files configured to cause the LDI tool to adjust one or more downstream manufacturing processes corresponding to the disqualifying defects based on the generated tool-readable index and the generated one or more exposure files. In doing so, the CAM station can be configured to adapt the exposure file of the LDI tool. The adapted exposure file can be provided to the LDI tool to cause the LDI tool to modify the LDI process according to the particular tool-readable index, thereby isolating the defective samples from the LDI process. The adapted exposure file can include fully printed samples and fully blank samples. For example, as shown in FIG. 3 , a panel 300 can include an exposure region 308 and a blank exposure region 310 based on the tool-readable index. The blank exposure region 310 can then correspond to the location of the killer defect 300a on the disqualifying sample 304a. Exposure area 308 can include areas without defects and / or areas with passing defects (eg, exposure area 312 containing passing defects 300b).

[0043] Referring again to FIG. 1 , the one or more processors 108 of the controller 106 can include any processing element known in the art. In this sense, the one or more processors 108 can include any microprocessor-type device configured to execute algorithms and / or instructions. In one embodiment, the one or more processors 108 can comprise a desktop computer, a mainframe computer system, a workstation, an image computer, a parallel processor, or any other computer system (e.g., a networked computer) configured to execute programs configured to operate the system 100 as described throughout this disclosure. Furthermore, it is recognized that the term “processor” can be broadly defined to encompass any device having one or more processing elements that executes program instructions from a non-transitory memory medium 110. Therefore, the above description should not be construed as limiting on the present invention, but merely as illustrative.

[0044] The memory medium 110 may include any storage medium known in the art suitable for storing program instructions executable by the associated one or more processors 108. As a non-limiting example, the memory medium 110 may include a non-transitory memory medium. As a further non-limiting example, the memory medium 110 may include, but is not limited to, read-only memory, random access memory, magnetic or optical memory devices (e.g., disks), magnetic tape, solid-state drives, and the like. It is further noted that the memory 110 may be housed in a common controller housing with the one or more processors 108. In alternative embodiments, the memory 110 may be located remotely relative to the physical locations of the one or more processors 108 and the controller 106. For example, the one or more processors 108 of the controller 106 may access a remote memory (e.g., a server) accessible via a network (e.g., the Internet, an intranet, etc.).

[0045] It is further contemplated that each of the above method embodiments may include any other step(s) of any other method described herein. Additionally, each of the above method embodiments may be performed by any of the systems described herein.

[0046] Those skilled in the art will recognize that the operations of components, devices, purposes, and the accompanying explanations described herein are used as examples to clarify the concepts, and that various configurational variations are contemplated. Thus, as used herein, the specific examples described and the accompanying explanations are intended to be representative of their more general types. In general, the use of any specific example is intended to be representative of that type, and the absence of specific components, operations, devices, and purposes should not be considered limiting.

[0047] With respect to the use of any substantially plural and / or singular terms herein, those skilled in the art will be able to convert from the plural to the singular and / or from the singular to the plural as appropriate to the context and / or application. The various singular / plural permutations are not expressly set forth herein for the sake of clarity.

[0048] The subject matter described herein may illustrate various components contained within or related to other components. It should be understood that any such illustrated configurations are merely exemplary, and that in fact, many other configurations that achieve the same functionality may be implemented. In a conceptual sense, any arrangement of components to achieve the same functionality is effectively "associated" such that the desired functionality is achieved. Thus, any two components herein that are combined to achieve a particular function can be considered "associated" with each other such that the desired functionality is achieved, regardless of configuration or intermediate components. Similarly, any two components so associated can also be considered "connected" or "coupled" to each other to achieve the desired functionality, and any two components so associated can also be considered "couplable" to each other to achieve the desired functionality. Specific examples of combinable include, but are not limited to, physically interlockable and / or physically interacting components and / or wirelessly interlockable and / or wirelessly interacting components and / or logically interlocking and / or logically interacting components.

[0049] It should further be understood that the present invention is defined by the appended claims. In general, it will be understood by those skilled in the art that the words used herein, and particularly in the appended claims (e.g., the body of the appended claims), are generally intended as "open" words (e.g., the word "including" should be interpreted as "including but not limited to," the word "having" should be interpreted as "having at least," the word "including" should be interpreted as "including but not limited to," etc.). Where a claim set forth with a specific number of preambles is intended, such intention will be explicitly set forth in the claim; in the absence of such a preamble, it will be further understood by those skilled in the art that no such intention exists. For example, as an aid to understanding, the following appended claims may include the use of the preamble phrases "at least one" and "one or more" to preamble the claim set forth. However, the use of such phrases should not be construed as meaning that the preface of a claim recitation with the indefinite article "a" or "an" limits any particular claim that includes such a prefaced claim recitation to an invention that includes only one of such recitations, even if the same claim includes the prefaced phrase "one or more" or "at least one" and an indefinite article such as "a" or "an" (e.g., "a" and / or "an" should typically be interpreted to mean "at least one" or "one or more"). The same applies to the use of definite articles used to preface claim recitations. Moreover, even if a particular number of prefaced claim recitations is explicitly recited, those skilled in the art will recognize that such recitations typically mean at least the recited number (e.g., the recitation "two recitations" by itself, without any other modifiers, typically means at least two recitations, or more than two recitations).Furthermore, when formulas similar to "at least one of A, B, and C, etc." are used, generally such configurations are intended in the sense that one of ordinary skill in the art would understand the formula (e.g., "a system having at least one of A, B, and C" includes, but is not limited to, systems having A only, B only, C only, A and B together, A and C together, B and C together, and / or A, B, and C together, etc.). When formulas similar to "at least one of A, B, or C, etc." are used, generally such configurations are intended in the sense that one of ordinary skill in the art would understand the formula (e.g., "a system having at least one of A, B, or C" includes, but is not limited to, systems having A only, B only, C only, A and B together, A and C together, B and C together, and / or A, B, and C together, etc.). It will be further understood by those skilled in the art that any substantially disjunctive words and / or phrases presenting two or more alternative terms, whether in the specification, claims, or drawings, should be understood to contemplate the possibility of including one of the terms, either of the terms, or both terms. For example, the phrase "A or B" would be understood to include the possibilities of "A" or "B" or "A and B."

[0050] It will be apparent that the present disclosure and many of its attendant advantages will be understood from the foregoing description, and that various changes in form, construction and arrangement of elements can be made without departing from the disclosed subject matter or sacrificing all of its specific advantages. The described embodiments are merely illustrative, and it is intended that the following claims encompass all such modifications. It is further understood that the invention is defined by the appended claims.

Claims

1. 1. A system comprising: a characterization subsystem configured to perform inspection of one or more samples to generate defect data for one or more defects in the one or more samples; and one or more controllers communicatively coupled to the characterization subsystem, the one or more controllers including one or more processors configured to execute a set of program instructions stored in a memory, the set of program instructions causing the one or more processors to: receiving defect data from the characterization subsystem, the defect data including one of a defect location, a defect size, a defect shape, or a relationship between the defect and a component of the one or more samples; identifying at least one defect of the one or more defects as a disqualifying defect based on the received defect data and one or more predetermined thresholds; generating a tool-readable index configured, upon identifying the defect as the disqualifying defect, to cause one or more downstream manufacturing tools to adjust one or more downstream manufacturing processes corresponding to the disqualifying defect based on the generated tool-readable index; and providing the generated tool-readable index to the one or more downstream manufacturing tools; It is configured as follows: system.

2. The system of claim 1 , wherein the tool-readable index comprises an identifier configured to be decoded by the one or more downstream manufacturing tools.

3. The system of claim 2 , wherein the identifier comprises a bar code.

4. the one or more downstream manufacturing tools: Photolithography tools, laser direct imaging tools, etching tools, drilling tools, solder mask printing tools, or computer-aided manufacturing design tools The system of claim 1 , comprising at least one of:

5. providing the generated tool-readable index to the one or more downstream manufacturing tools; providing the generated tool-readable index to a manufacturing controller communicatively coupled to the one or more downstream manufacturing tools, the manufacturing controller configured to generate, based on the generated tool-readable index and the generated one or more communication protocols, the one or more communication protocols configured to cause the one or more downstream manufacturing tools to adjust the one or more downstream manufacturing processes corresponding to the disqualifying defects. The system of claim 4.

6. The system of claim 5 , wherein the one or more communication protocols include one or more exposure files, and the generated one or more exposure files include fully exposed areas and blank exposure areas.

7. The system of claim 1 , wherein the one or more predetermined thresholds include one or more user-defined thresholds.

8. The one or more user-defined thresholds may be: Minimum defect size, defect location, defect type, critical design area, or critical design pattern The system of claim 7 , comprising at least one of:

9. The system of claim 1 , wherein the one or more samples include one or more printed circuit boards.

10. The system of claim 9 , wherein the one or more printed circuit boards are arranged in one or more arrays on a panel.

11. The system of claim 1 , wherein the characterization subsystem comprises an inspection subsystem.

12. The system of claim 11 , wherein the inspection subsystem comprises an automated optical inspection subsystem.

13. 1. A system comprising: one or more controllers including one or more processors configured to execute a set of program instructions stored in a memory, the set of program instructions causing the one or more processors to: receiving defect data from a characterization subsystem, the defect data including one of a defect location, a defect size, a defect shape, or a relationship between the defect and one or more components of the sample; identifying at least one defect of the one or more defects as a disqualifying defect based on the received defect data and one or more predetermined thresholds; generating a tool-readable index configured, upon identifying the defect as the disqualifying defect, to cause one or more downstream manufacturing tools to adjust one or more downstream manufacturing processes corresponding to the disqualifying defect based on the generated tool-readable index; and providing the generated tool-readable index to the one or more downstream manufacturing tools. It is configured as follows: system.

14. The system of claim 13 , wherein the tool-readable index comprises an identifier configured to be deciphered by the one or more downstream manufacturing tools.

15. the downstream manufacturing tool Photolithography tools, laser direct imaging tools, etching tools, drilling tools, solder mask printing tools, or computer-aided manufacturing design tools The system of claim 13 , comprising at least one of:

16. providing the generated tool-readable index to the one or more downstream manufacturing tools; providing the generated tool-readable index to a manufacturing controller communicatively coupled to the one or more downstream manufacturing tools, the manufacturing controller configured to generate, based on the generated tool-readable index and the generated one or more communication protocols, the one or more communication protocols configured to cause the one or more downstream manufacturing tools to adjust the one or more downstream manufacturing processes corresponding to the disqualifying defects.

16. The system of claim 15.

17. The system of claim 13 , wherein the one or more predetermined thresholds include one or more user-defined thresholds.

18. The one or more user-defined thresholds may be: Minimum defect size, defect location, defect type, critical design area, or critical design pattern 20. The system of claim 17, comprising at least one of:

19. The system of claim 13 , wherein the one or more samples include one or more printed circuit boards arranged in one or more arrays on a panel.

20. 1. A method comprising: receiving defect data from a characterization subsystem for one or more defects in one or more samples, the defect data including one of a defect location, a defect size, a defect shape, or a relationship between the defect and a component of the one or more samples; identifying at least one defect of the one or more defects as a disqualifying defect based on the received defect data and one or more predetermined thresholds; generating a tool-readable index configured, upon identifying the defect as the disqualifying defect, to cause one or more downstream manufacturing tools to adjust one or more downstream manufacturing processes corresponding to the disqualifying defect based on the generated tool-readable index; and providing the generated tool-readable index to the one or more downstream manufacturing tools; A method comprising:

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