Heat dissipation assembly and electronic device

Abstract

A heat dissipation assembly and an electronic device, the heat dissipation assembly including an evaporator (21) and a condenser (22), the evaporator (21) including a first passage (23), the condenser (22) including a plurality of condensing fins, a plurality of steam pipes (25), and a plurality of liquid pipes (26), each condensing fin including a second passage (24), the first passage (23) and each second passage (24) being in communication with one steam pipe (25) and one liquid pipe (26), and the first passage ( The liquid working medium sealed in the first passage (23) of the evaporator (21) is evaporated by the heat of the heat source to become a gaseous working medium, which passes through the plurality of vapor pipes (25) into the corresponding second passages (24) of the condenser fins and condenses to become a liquid working medium, which then flows back to the first passage (23) of the evaporator (21) through the plurality of liquid pipes (26). This solves the problem that the heat dissipation assemblies of the related art require the installation of many support columns, which result in complex and unreliable welding, and eliminates the need for many support columns, reducing processing costs and improving product reliability.

Description

[Technical Field]

[0001] [CROSS-REFERENCE TO RELATED APPLICATIONS] This disclosure is based on and claims priority from Chinese patent application CN2023101395661, filed on February 10, 2023, entitled "Heat Dissipation Assembly and Electronic Device," the entire contents of which are incorporated herein by reference.

[0002] The present disclosure relates to the field of heat dissipation, and more particularly to heat dissipation assemblies and electronic devices. [Background technology]

[0003] With the rapid development of information technology, chip integration density is becoming higher and higher, and power consumption is becoming increasingly higher. To prevent chip failure, heat dissipation devices are typically installed to dissipate heat. Related technologies typically use the following two methods for heat dissipation: 1. Active heat dissipation is achieved by installing a fan, but many systems or devices have limited internal space and are not suitable for installing a fan. Furthermore, the presence of forced flow components such as fans causes problems with noise, safety, reliability, and lifespan. 2. Natural convection heat dissipation is achieved by adding heat dissipation fins, but the heat dissipation effect is affected by the thermal conductivity of the material itself.

[0004] Currently, 3D vacuum chamber heat sink technology (Vapor Chamber, or VC) has become a key focus for solving these heat dissipation problems. Figure 1 shows a schematic diagram of a 3D VC heat sink substrate in the related art. As shown in Figure 1, a 3D VC heat sink typically includes a substrate 11, which is equipped with multiple support columns 12. A heat dissipation fin array is typically mounted on the upper side of the substrate. The fins must be tightly attached to the substrate's cover plate, and the fins and substrate must be connected by welding at multiple locations. This necessitates the use of multiple support columns to ensure strength and pressure resistance. However, the use of multiple support columns complicates the manufacturing process of current 3D VC heat sinks, complicates welding, and reduces reliability due to the increased number of welding points.

[0005] As mentioned above, the heat dissipation assemblies in the related art require the arrangement of a large number of support columns, and there is no good solution to the problem that the welding is complicated and unreliable. Summary of the Invention [Problem to be solved by the invention]

[0006] The embodiments of the present disclosure provide a heat dissipation assembly and an electronic device to at least solve the problems that the heat dissipation assemblies in the related art require the arrangement of a large number of support pillars, and the welding is complicated and unreliable. [Means for solving the problem]

[0007] According to one embodiment of the present disclosure, there is provided a heat dissipation assembly, comprising: the evaporator includes a first passage; the condenser includes a plurality of condensing fins, a plurality of steam pipes, and a plurality of liquid pipes; each of the condensing fins includes a second passage; the first passage and each of the second passages are connected by one of the steam pipes and one of the liquid pipes; and the first passage and the second passage each consist of a plurality of passages connected to each other; A heat dissipation assembly is provided in which the liquid working medium sealed in the first passage of the evaporator is evaporated by heat from a heat source to become a gaseous working medium, the gaseous working medium passes through the plurality of vapor pipes and enters the second passages of the corresponding condensing fins, where it condenses to become a liquid working medium, and the liquid working medium returns to the first passage of the evaporator through the plurality of liquid pipes.

[0008] According to another embodiment of the present disclosure, there is further provided an electronic device including a heat source device and the heat dissipation assembly according to any of the above-described embodiments, wherein the heat source device is provided on a side of the evaporator away from the condenser. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic diagram of a substrate of a 3D VC heat sink in the related art. [Figure 2] 1 is a structural diagram of a heat dissipation assembly according to an embodiment of the present disclosure. [Figure 3] 1 is a schematic partial cross-sectional view of an evaporator according to an embodiment of the present disclosure. [Figure 4] 1 is a schematic partial cross-sectional view of a condensation fin according to an embodiment of the present disclosure. [Figure 5] FIG. 1 is a schematic structural diagram of an evaporator according to an embodiment of the present disclosure. [Figure 6] FIG. 2 is a schematic diagram of an arc-shaped branch passage of an evaporator according to an embodiment of the present disclosure. [Figure 7] FIG. 2 is a schematic partial cross-sectional view of an evaporator according to another embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, the embodiments of the present disclosure will be described in detail based on the examples with reference to the drawings.

[0011] It should be noted that terms such as "first" and "second" in the specification and claims of this disclosure and the above drawings are used to distinguish between similar items, but are not necessarily used to describe a particular order or priority.

[0012] According to an embodiment of the present disclosure, a heat dissipation assembly is provided. FIG. 2 is a structural diagram of the heat dissipation assembly according to the embodiment of the present disclosure. As shown in FIG. 2, the heat dissipation assembly includes: The structure includes an evaporator 21 and a condenser 22.

[0013] In this embodiment, the evaporator 21 includes a first passage 23, the condenser 22 includes a plurality of condensing fins, a plurality of steam pipes 25, and a plurality of liquid pipes 26, each of the condensing fins includes a second passage 24, the first passage 23 and each of the second passages 24 are connected by one of the steam pipes 25 and one of the liquid pipes 26, and each of the first passage 23 and the second passage 24 consists of a plurality of passages that are connected to each other.

[0014] In this embodiment, the evaporator 21 is used to evaporate a liquid working medium sealed in the first passage 23 of the evaporator to obtain a gaseous working medium, and the gaseous working medium passes through the vapor pipe 25 and enters the second passage 24 of the condenser.

[0015] In this embodiment, a condenser 22 is used to condense the gaseous working medium to obtain the liquid working medium, which passes through the liquid piping 26 and enters the first passage 23 of the evaporator.

[0016] In this embodiment, the gas working medium and the liquid working medium are two forms of phase change of the same working medium.

[0017] Specifically, the phase-change type heat dissipation assembly utilizes the working medium's phase change principle to realize heat dissipation through natural convection, and effectively removes heat from an external heat source through the working medium's phase change. The heat dissipation assembly can be attached to an external heat source, and heat enters the evaporator 21 through the base, causing the heat-dissipating working medium in the evaporator 21 to evaporate from liquid to gas. The gaseous working medium then enters the vapor pipe 25 and transfers heat to the condenser 22, removing the heat through natural convection. The gaseous working medium then cools and becomes liquid, and flows back into the multiple passages of the evaporator 21 through the liquid pipe 26 under the force of gravity, circulating in this manner.

[0018] In this embodiment, the first pipe of the evaporator and the second pipe of each condenser fin are connected by steam pipe 25 and liquid pipe 26, which simplifies the welding tools and reduces the number of welding points. Furthermore, the steam pipe 25 and liquid pipe 26 can be processed as an integrated part of the condenser fin, which reduces the welding process and improves the reliability of the heat dissipation assembly.

[0019] In this embodiment, the evaporator 21 may specifically further include a liquid reflux zone, a phase change heat exchange zone, and a vapor escape zone.

[0020] Specifically, the liquid reflux zone includes a plurality of liquid communication grooves, the vapor escape zone includes a plurality of vapor communication grooves, the first passage 23 communicates with one of the liquid pipes via one of the liquid communication grooves, and the first passage 23 communicates with one of the vapor pipes via one of the vapor communication grooves.

[0021] In this embodiment, the liquid working medium sealed in the first passage of the evaporator is evaporated by the heat of the heat source to become a gaseous working medium, and the gaseous working medium passes through the multiple vapor pipes and enters the second passages of the corresponding condensing fins, where it condenses to become a liquid working medium, and the liquid working medium returns to the first passage of the evaporator through the multiple liquid pipes.

[0022] In this embodiment, the gas working medium and the liquid working medium are two forms of phase change of the same working medium.

[0023] Specifically, the phase-change type heat dissipation assembly utilizes the working medium's phase change principle to realize heat dissipation through natural convection, and effectively removes heat from the heat source through the working medium's phase change. The heat dissipation assembly can be attached to the heat source, and after the evaporator 21 absorbs heat from the heat source, the internal heat-dissipating working medium evaporates from liquid to gas. The gaseous working medium enters the vapor pipe and transfers heat to the condenser, where it removes heat through natural convection or the outside air. The gaseous working medium then cools and becomes liquid, and flows back into the multiple passages of the evaporator through the liquid pipe under the action of gravity, thus circulating.

[0024] In this embodiment, the liquid pipe can be connected by directly inserting it into the liquid communication groove, simplifying the installation steps and further reducing the number of welding points.Similarly, the steam pipe can be connected by directly inserting it into the steam communication groove.

[0025] Furthermore, because the liquid pipes and liquid communication grooves generally contain a liquid working medium, and the steam pipes and vapor communication grooves generally contain a gas working medium, when the heat dissipation assembly is installed, the steam pipes and vapor communication grooves are positioned higher than the liquid pipes and liquid communication grooves.

[0026] In this embodiment, the phase change heat exchange zone includes a plurality of arcuate branch passages, each of which includes a left arcuate passage and a right arcuate passage.

[0027] Specifically, when the phase-change working medium in the arc-shaped branch passage rises due to heat, part of the working medium vaporizes after absorbing heat from the heat source, and the generated gas bubbles move upward along the right-hand arc-shaped passage and the left-hand arc-shaped passage, respectively, which can further increase the liquid level and better strengthen the fluid turbulence of the working medium, thereby improving the heat transfer capacity of the phase-change heat exchange zone.

[0028] In this embodiment, the evaporator 21 may further include a first plate and a second plate, which are combined by a roll pressing process, and the first passage is located between the first plate and the second plate.

[0029] In this embodiment, the evaporator 21 may further include a first plate, a second plate, and a solder layer, and the first plate and the second plate are welded and combined by the solder layer, and the first passage is located between the first plate and the second plate.

[0030] In this embodiment, the evaporator 21 may further include a first plate, a second plate, a first intermediate plate, and a solder layer, the first intermediate plate being located between the first plate and the second plate, the first plate, the second plate, and the first intermediate plate being welded and combined by the solder layer, and the first passage being located between the first plate and the second plate.

[0031] In this embodiment, the evaporator is constructed from two or three plates, which allows one or both surfaces of the evaporator to be flat, and the evaporator can serve as the base of the entire heat dissipation assembly, eliminating the need for multiple support columns, significantly reducing the number of parts, and simplifying the processing.In addition, the top and bottom surfaces of the evaporator, which is constructed from three plates, can be flattened, making installation easier.

[0032] In this embodiment, the condensation fin may further include a third plate and a fourth plate, which are combined by a roll-pressing process, and the second passage is located between the third plate and the fourth plate.

[0033] In this embodiment, the condensation fin may further include a third plate, a fourth plate, and a solder layer, the third plate and the fourth plate being welded together by the solder layer, and the second passage being located between the third plate and the fourth plate.

[0034] In this embodiment, the condensation fin may further include a third plate, a fourth plate, a second intermediate plate, and a solder layer, the second intermediate plate being located between the third plate and the fourth plate, the third plate, the fourth plate, and the second intermediate plate being welded together by the solder layer, and the second passage being located between the third plate and the fourth plate.

[0035] In this embodiment, the condensation fins are made up of two or three plates, which simplifies the structure, saves processing steps and manufacturing costs, and significantly reduces the processing costs of the heat dissipation assembly.

[0036] Furthermore, the steam pipe and the liquid pipe can be processed as an integral part of the condensing fin, and the steam pipe and the liquid pipe are positioned between the third plate member and the fourth plate member, similar to the second passage.

[0037] In this embodiment, the evaporator and the condenser may be made of a blow-up plate or a brazing plate, which has a simple structure and is also inexpensive.

[0038] In this embodiment, a folded metal sheet may be further disposed in the first passage of the evaporator, and the folded metal sheet may be located between the first plate and the second plate of the evaporator. Specifically, the folded metal sheet may be a thin aluminum sheet.

[0039] In this embodiment, a folded thin aluminum sheet is inserted into the piping of the evaporator to increase the disturbance of the working medium, improve the heat dissipation performance of the heat dissipation assembly, and increase the pressure resistance of the piping.

[0040] FIG. 3 is a schematic partial cross-sectional view of an evaporator according to an embodiment of the present disclosure. As shown in FIG. 3, the evaporator 21 may be composed of a first plate material 31 and a second plate material 32 combined by a roll pressing process or a similar processing method.

[0041] In this embodiment, the gap between the first plate 31 and the second plate 32 constitutes the first passage, and the second plate 32 can ensure the flatness of the underside of the evaporator. Furthermore, the evaporator can be directly attached to the surface of the heat source as the substrate of the entire heat dissipation assembly.

[0042] Furthermore, the condensation fins 22 may be attached to the evaporator 21 so as to be perpendicular to the evaporator 21, but the present disclosure is not limited to this method. The specific number of condensation fins can be selected according to the actual heat dissipation demand.

[0043] FIG. 4 is a schematic partial cross-sectional view of a condensation fin according to an embodiment of the present disclosure. As shown in FIG. 4, the condensation fin may specifically include a third plate member 41 and a fourth plate member 42.

[0044] In this embodiment, the third plate and the fourth plate are combined by a roll pressing process, and the gap between the third plate and the fourth plate forms the second passage of the condensing fin, and the specific shape of the passage can be set according to the heat dissipation demand.

[0045] Specifically, the third plate material and the fourth plate material may be blown-up plates or brazing plates.

[0046] In this embodiment, the condenser fin or evaporator is made of two plates, which simplifies the processing process and saves production costs and assembly processes.

[0047] 5 is a schematic structural diagram of an evaporator according to an embodiment of the present disclosure. As shown in FIG. 5, the evaporator specifically includes: The structure may include vapor communication grooves 51, liquid communication grooves 52, liquid reflux zones 53, phase change heat exchange zones 54, vapor relief zones 55, and arcuate branch passages 56.

[0048] In this embodiment, the vapor communication groove 51 is located in the vapor escape zone 55, the liquid communication groove 52 is located in the liquid reflux zone 53, and the arc-shaped branch passage 56 is located in the phase change heat exchange zone 54.

[0049] Furthermore, there is a one-to-one correspondence between the vapor communication grooves and the liquid communication grooves, and the specific number is determined by the number of condensation fins, with each condensation fin corresponding to one vapor communication groove and one liquid communication groove.

[0050] In this embodiment, the vapor communication grooves and liquid communication grooves can be formed in the shape of long, thin strips, which further increases the number of condensation fins that can be attached to the evaporator.

[0051] In this embodiment, the liquid reflux zone 53 is located at the bottom of the evaporator, the phase change heat exchange zone 54 is located at the middle of the evaporator, and the vapor relief zone 55 is located at the top of the evaporator.

[0052] In this embodiment, the phase-change working medium in the liquid reflux zone 53 is normally liquid, the phase-change working medium in the vapor escape zone 55 is normally gas, and the phase-change working medium in the phase-change heat exchange zone 54 evaporates from liquid to gas by absorbing heat from an external heat source.

[0053] 6 is a schematic diagram of the arc-shaped branch passages of the evaporator according to an embodiment of the present disclosure. As shown in FIG. 6, each arc-shaped branch passage includes a right arc-shaped passage 61 and a left arc-shaped passage 62.

[0054] In this embodiment, the phase change heat exchange zone of the evaporator includes a plurality of arc-shaped branch passages, each of which consists of one right-side arc-shaped passage 61 and one left-side arc-shaped passage 62.

[0055] In this embodiment, when the liquid working medium rises due to heat, part of the liquid working medium vaporizes after absorbing heat from the heat source, and the generated gas bubbles move upward along the right-hand arc-shaped passage 61 and the left-hand arc-shaped passage 62. This embodiment can raise the liquid level more significantly and better strengthen the turbulence of the working medium flow, thereby improving the heat transfer capacity of the phase change heat exchange zone.

[0056] 7 is a schematic partial cross-sectional view of an evaporator according to another embodiment of the present disclosure. As shown in FIG. 7, the evaporator may further include a first plate 71, a second plate 72, and a folded metal sheet 73.

[0057] In this embodiment, the folded metal sheet 73 is located between the first plate member 71 and the second plate member 72 .

[0058] Specifically, the folded metal sheet 73 is placed in a first passage of the evaporator, and this first passage is formed by the gap between a first plate member 71 and a second plate member 72 .

[0059] Furthermore, the folded metal sheet 73 may be a thin aluminum sheet, and may be folded in a Z-shape or an S-shape.

[0060] In this embodiment, by inserting a folded thin aluminum sheet into the piping of the evaporator, the turbulence of the working medium can be increased, the heat dissipation performance of the heat dissipation assembly can be improved, and the pressure resistance of the piping can be increased.

[0061] According to another embodiment of the present disclosure, there is further provided an electronic device, the electronic device including a heat source device and the heat dissipation assembly described in any of the above-described embodiments, wherein the heat source device is provided on a side of the evaporator away from the condenser.

[0062] In this embodiment, the electronic device may be an active antenna unit (AAU for short), a radio remote unit (RRU for short), a building baseband unit (BBU for short), or the like.

[0063] Specifically, the heat source device may be a chip, and the embodiments of the present disclosure can improve the heat dissipation capability of the heat source device and further improve the processing performance of the heat source device such as a chip.

[0064] Specific examples in this embodiment are described in the examples described in the above-mentioned embodiments and exemplary embodiments, and the description thereof will be omitted here in this embodiment.

[0065] It will be apparent to those skilled in the art that each module or step of the present disclosure described above can be implemented by a general-purpose computing device, or can be integrated into a single computing device or distributed across a network of multiple computing devices, or can be implemented by program code executable by a computing device, which can be stored in a storage device and executed by a computing device, and in some cases, the illustrated or described steps can be executed in a different order from that shown here, or each can be fabricated as an integrated circuit module, or multiple modules or steps can be fabricated as a single integrated circuit module. Thus, the present disclosure is not limited to any specific combination of hardware and software.

[0066] The above is merely a preferred embodiment of the present disclosure and is not intended to limit the present disclosure. Those skilled in the art can make various modifications and variations to the present disclosure. Any modifications, equivalent replacements, improvements, etc. within the principle of the present disclosure should be included within the protection scope of the present disclosure.

Claims

1. 1. A heat dissipation assembly comprising: the evaporator includes a first passage; the condenser includes a plurality of condensing fins, a plurality of steam pipes, and a plurality of liquid pipes; each of the condensing fins includes a second passage; the first passage and each of the second passages are connected by one of the steam pipes and one of the liquid pipes; and the first passage and the second passage each consist of a plurality of passages connected to each other; A heat dissipation assembly in which a liquid working medium sealed in a first passage of the evaporator is evaporated by heat from a heat source to become a gaseous working medium, the gaseous working medium passes through the plurality of vapor pipes and enters the second passages of the corresponding condensing fins, where it condenses to become a liquid working medium, and the liquid working medium returns to the first passage of the evaporator through the plurality of liquid pipes.

2. The first passage is 2. The heat dissipation assembly of claim 1, comprising a liquid return zone, a phase change heat exchange zone, and a vapor relief zone, wherein the liquid return zone comprises a plurality of liquid communication grooves, and the vapor relief zone comprises a plurality of vapor communication grooves, wherein the plurality of liquid communication grooves communicate with a corresponding plurality of the liquid pipes, and the plurality of vapor communication grooves communicate with a corresponding plurality of the vapor pipes.

3. The heat dissipation assembly of claim 2 , wherein the phase change heat exchange zone includes a plurality of arcuate branch passages, each arcuate branch passage including a left arcuate passage and a right arcuate passage.

4. The evaporator comprises:

2. The heat dissipation assembly of claim 1, comprising a first plate and a second plate, the first plate and the second plate being combined by a roll pressing process, and the first passage being located between the first plate and the second plate.

5. The evaporator comprises:

2. The heat dissipation assembly of claim 1, comprising a first plate, a second plate, and a solder layer, the first plate and the second plate being welded together by the solder layer, and the first passage being located between the first plate and the second plate.

6. The condensation fins are 2. The heat dissipation assembly of claim 1, comprising a third plate and a fourth plate, the third plate and the fourth plate being combined by a roll pressing process, and the second passage being located between the third plate and the fourth plate.

7. The condensation fins are 2. The heat dissipation assembly of claim 1, comprising a third plate, a fourth plate, and a solder layer, the third plate and the fourth plate being welded together by the solder layer, and the second passage being located between the third plate and the fourth plate.

8. 2. The heat dissipation assembly of claim 1, wherein a folded metal sheet is disposed within the first passage of the evaporator, the metal sheet being positioned between a first plate member and a second plate member of the evaporator.

9. The heat dissipation assembly of claim 1 , wherein the evaporator and the condenser are blow-up plates or brazing plates.

10. 10. An electronic device comprising: a heat source device; and the heat dissipation assembly according to any one of claims 1 to 9, wherein the heat source device is provided on a side of an evaporator remote from a condenser.

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