Temperature collection circuit, method, apparatus, storage medium, and charging / distribution system assembly

Abstract

SUMMARY OF THE INVENTION Embodiments of the present invention provide a temperature collection circuit, method, apparatus, storage medium, and power charging and distribution system assembly. [Solution] The temperature collection circuit includes a main control board and a power board, and the power board is provided with a first thermistor, a second thermistor, and an optocoupler isolation circuit, the first thermistor is connected to the optocoupler isolation circuit, the optocoupler isolation circuit is connected to the main control board, and the second thermistor is connected to the main control board. In a technical solution according to an embodiment of the present invention, two thermistors are provided on the power board of the charging and distribution system assembly, which prevents temperature measurement errors caused by over-range of the thermistors on the power board, improves the accuracy of temperature collection of the charging and distribution system assembly, and improves the charging safety of the power battery.

Description

Detailed Description of the Invention

[0001] (Related Applications) This application claims priority to a Chinese patent application bearing application number 202311864406.X and entitled "Temperature collection circuit, method, device, storage medium, and charging / distribution system assembly" filed with the State Intellectual Property Office of the People's Republic of China on December 29, 2023, the entire contents of which are incorporated herein by reference. [Technical Field]

[0002] The present invention relates to the field of vehicle technology, and more particularly to a temperature collection circuit, method, apparatus, storage medium, and power charging and distribution system assembly. [Background technology]

[0003] The circuit board of a vehicle's charging and distribution system assembly includes at least a main control chip that can collect temperature signals from the charging and distribution system assembly. Conventional collection methods typically involve converting the thermistor voltage value on the collection board into an on-board temperature value through A / D conversion to determine the temperature during the operation of the charging and distribution system assembly. However, during the design of the circuit board of the charging and distribution system assembly, the distance between the thermistor and the sampling pin of the main control chip may be too long to allow the thermistor to avoid other electronic components. This may result in errors in the temperature signal collected by the main control chip, which may affect the control of the charging and distribution system assembly, lengthen charging times, pose safety risks, and potentially have adverse effects on the power battery. Summary of the Invention [Problem to be solved by the invention]

[0004] In view of this, embodiments of the present invention provide a temperature collection circuit, method, apparatus, storage medium, and charging / distribution system assembly for improving the accuracy of temperature collection in a charging / distribution system assembly and improving the charging safety of a power battery. [Means for solving the problem]

[0005] In one aspect, an embodiment of the present invention provides a temperature collection circuit, the temperature collection circuit including a main control board and a power board, the power board having a first thermistor, a second thermistor, and a photocoupler isolation circuit, the first thermistor connected to the photocoupler isolation circuit, the photocoupler isolation circuit connected to the main control board, and the second thermistor connected to the main control board.

[0006] Preferably, the power board is further provided with a hysteresis comparator, an integrator, and a follower, and the hysteresis comparator, the integrator, and the follower form a triangular wave generator.

[0007] Preferably, the power board is further provided with an operational amplifier, the operational amplifier being connected to the triangular wave generator and the first thermistor.

[0008] In another aspect, an embodiment of the present invention provides a temperature collection method applied to the temperature collection circuit, the temperature collection method comprising: obtaining a first temperature of a first thermistor and a second temperature of a second thermistor; and determining a collection temperature of the charging and distribution system assembly based on the first temperature and the second temperature.

[0009] Preferably, before acquiring the first temperature of the first thermistor and the second temperature of the second thermistor, and obtaining a pulse-width modulated wave signal representing the first temperature based on a triangular wave signal voltage of a triangular wave generator and a first voltage of a first thermistor.

[0010] Preferably, determining a collection temperature of the charging and distribution system assembly based on the first temperature and the second temperature includes: When the first temperature is greater than or equal to a first predetermined threshold and the second temperature is less than a second predetermined threshold, the second temperature is the collection temperature of the charging and distribution system assembly; or determining the first temperature as the collection temperature of the electrical charging and distribution system assembly when the first temperature is greater than or equal to a first predetermined threshold and the second temperature is greater than or equal to a third predetermined threshold; or determining the first temperature as the collected temperature of the electrical charging and distribution system assembly when the first temperature is equal to or greater than a first predetermined threshold and the second temperature is equal to or greater than a second predetermined threshold but less than a third predetermined threshold; or When the first temperature is less than a first predetermined threshold, the first temperature is the collection temperature of the charging and distribution system assembly.

[0011] Preferably, the first predetermined threshold comprises 125°C, the second predetermined threshold comprises -40°C, and the third predetermined threshold comprises 25°C.

[0012] In another aspect, embodiments of the present invention provide a temperature collection device, the temperature collection device comprising: a first acquisition module for acquiring a first temperature of the first thermistor and a second temperature of the second thermistor; and an identification module for identifying a collection temperature of the charging and distribution system assembly based on the first temperature and the second temperature.

[0013] In another aspect, an embodiment of the present invention provides a storage medium including a program stored therein, the program, when activated, controlling a device in which the storage medium resides to perform the temperature collection method described above.

[0014] In another aspect, an embodiment of the present invention provides a charging and distribution system assembly including a memory for storing information including program instructions and a processor for controlling execution of the program instructions, wherein the program instructions, when loaded and executed by the processor, perform the steps of the temperature collection method described above. [Effects of the Invention]

[0015] In a technical solution of a temperature collection circuit according to an embodiment of the present invention, the temperature collection circuit includes a main control board and a power board, the power board is provided with a first thermistor, a second thermistor, and an optocoupler isolation circuit, the first thermistor is connected to the optocoupler isolation circuit, the optocoupler isolation circuit is connected to the main control board, and the second thermistor is connected to the main control board. In the technical solution according to an embodiment of the present invention, two thermistors are provided on the power board of the charging and distribution system assembly, which prevents temperature measurement errors caused by over-range of the thermistors on the power board, improves the accuracy of temperature collection of the charging and distribution system assembly, and improves the charging safety of the power battery.

[0016] In order to more clearly explain the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings necessary for the embodiments. Obviously, the drawings described below are only some embodiments of the present invention, and those skilled in the art can further obtain other drawings based on these drawings without any creative work. [Brief explanation of the drawings]

[0017] [Figure 1] 1 is a structural schematic diagram of a temperature collection circuit according to an embodiment of the present invention; [Figure 2] FIG. 2 is a circuit schematic diagram of a power board according to an embodiment of the present invention. [Figure 3] 3 is a flowchart of a temperature collection method according to an embodiment of the present invention. [Figure 4] FIG. 2 is a schematic diagram illustrating acquisition of a pulse width modulated wave signal according to an embodiment of the present invention. [Figure 5] 3A and 3B are waveform diagrams of a triangular wave signal voltage and a first voltage according to an embodiment of the present invention. [Figure 6] FIG. 2 is a schematic diagram showing the relationship between the resistance value and temperature of a thermistor according to an embodiment of the present invention. [Figure 7] 1 is a structural schematic diagram of a temperature collecting device according to an embodiment of the present invention; [Figure 8]1 is a schematic diagram of a charging and distribution system assembly according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0018] In order to better understand the technical solution of the present invention, the following detailed description of embodiments of the present invention will be given with reference to the accompanying drawings.

[0019] It should be noted that the described embodiments and examples are only some of the embodiments and examples of the present invention, and are not all of the embodiments and examples. All other examples that a person skilled in the art can obtain based on the embodiments of the present invention without any creative work are all included in the protection scope of the present invention.

[0020] The terms used in the embodiments and examples of the present invention are merely intended to describe specific embodiments and examples, and are not intended to limit the scope of the present invention. The singular forms "a kind," "the," and "the" used in the examples of the present invention and the appended claims also include the plural forms unless the context clearly dictates otherwise.

[0021] It should be understood that the term "and / or" used in this specification only describes the relationship between related objects, and there may be three types of relationships, for example, A and / or B can represent the following relationship, and there are three types of situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this specification generally indicates that the related objects before and after it are in an "or" relationship.

[0022] FIG. 1 is a structural schematic diagram of a temperature collection circuit according to an embodiment of the present invention. As shown in FIG. 1, the temperature collection circuit includes a main control board 1 and a power board 2. The power board 2 is provided with a first thermistor 21, a second thermistor 22, and a photocoupler isolation circuit 23. The first thermistor 21 is connected to the photocoupler isolation circuit 23, which is connected to the main control board 1. The second thermistor 22 is connected to the main control board 1.

[0023] In one embodiment of the present invention, the core of the photocoupler isolation circuit 23 is an optical coupling element consisting of a light-emitting diode (LED) and a phototriode (phototransistor).

[0024] In one embodiment of the present invention, the power board 2 is further provided with a hysteresis comparator 24, an integrator 25, and a follower 26, and the hysteresis comparator 24, the integrator 25, and the follower 26 constitute a triangular wave generator.

[0025] Specifically, the output of the operational amplifier 27 is added to the inverting input terminal of the integrator 25 and integrated, and the output of the integrator 25 is fed back to the non-inverting input terminal of the hysteresis comparator 24 to control the high-level and low-level conversion of the hysteresis comparator 24, and the triangular wave generator can generate a 200 Hz triangular wave.

[0026] In one embodiment of the present invention, the power board 2 is further provided with an operational amplifier 27, which is connected to a triangular wave generator and to the first thermistor .

[0027] FIG. 2 is a circuit schematic diagram of a power board according to an embodiment of the present invention. As shown in FIG. 2, the operational amplifier 27 includes five pins. The first pin 272 of the operational amplifier 27 is connected to the first pin 261 of the follower 26, the third pin 263 of the follower 26, and the second pin 252 of the integrator 25. The second pin 273 of the operational amplifier 27 is connected to resistors R259 and R263. The third pin 271 of the operational amplifier 27 is connected to resistors R259 and R262. The fourth pin 274 of the operational amplifier 27 is connected to capacitors C35, C43, R260, and R264, with the other ends of capacitors C35 and C43 grounded to DGND. The fifth pin 275 of the operational amplifier 27 is grounded to DGND. The second pin 262 of the follower 26 is connected to resistors R261 and R260, and the other end of the resistor R261 is grounded to DGND. The first pin 251 of the integrator 25 is connected to resistor R262 and capacitor C40. The third pin 253 of the integrator 25 is connected to capacitor C40, the second pin 242 of the hysteresis comparator 24, and resistor R263. The first pin 241 of the hysteresis comparator 24 is connected to resistors R264 and R265. Resistor R265 is connected to capacitor C48 and resistor R288. The other end of capacitor C48 is grounded to DGND. Resistor R288 is connected to the first thermistor 21, and the other end of the first thermistor 21 is grounded to DGND. The third pin 243 of the hysteresis comparator 24 is connected to resistor R266. The resistor R266 is grounded to DGND via the photocoupler isolation circuit 23. The resistor R267 is grounded to GND via the photocoupler isolation circuit 23. The resistor R267 is connected to a resistor R295, which is connected to a capacitor C80, the other end of which is grounded to GND. The resistor R295 is connected to the first output T_DCDC_MCU.

[0028] The resistor R66 is connected to the resistor R65, the capacitor C9, and the second output T2_BAN_MCU, and the other end of the capacitor C9 is grounded to GND. The resistor R65 is connected to the second thermistor 22, and the other end of the second thermistor 22 is grounded to GND. The first output T_DCDC_MCU and the second output T2_BAN_MCU may be connected to the main control board 1.

[0029] In a technical solution according to an embodiment of the present invention, the temperature collection circuit includes a main control board and a power board, the power board is provided with a first thermistor, a second thermistor, and an optocoupler isolation circuit, the first thermistor is connected to the optocoupler isolation circuit, the optocoupler isolation circuit is connected to the main control board, and the second thermistor is connected to the main control board. In a technical solution according to an embodiment of the present invention, the power board of the charging and distribution system assembly is provided with two thermistors, which avoids temperature measurement errors caused by over-range of the thermistors on the power board, improves the accuracy of temperature collection of the charging and distribution system assembly, and improves the charging safety of the power battery.

[0030] Based on the temperature collection circuit of FIG. 1, an embodiment of the present invention provides a temperature collection method. FIG. 3 is a flowchart of the temperature collection method according to an embodiment of the present invention. As shown in FIG. 3, the method includes step 102: In step 102, a pulse width modulated wave signal is obtained to represent a first temperature based on the triangular wave signal voltage of the triangular wave generator and the first voltage of the first thermistor.

[0031] In one embodiment of the present invention, each step may be performed by a main control board of the charging and distribution system assembly, for example, the main control board includes a microcontroller unit (MCU).

[0032] 4 is a schematic diagram illustrating an embodiment of the present invention for obtaining a pulse-width modulated signal. As shown in FIG. 4, a 200 Hz triangular wave generated by a triangular wave generator serves as the non-inverting input signal of a hysteresis comparator, and the first voltage of a first thermistor serves as the inverting input signal of the hysteresis comparator. The resistance signal of the first thermistor changes with temperature. Therefore, when the temperature of the power board decreases, the resistance of the first thermistor increases. When the temperature of the power board increases, the resistance of the thermistor decreases. Therefore, the voltage at the inverting input terminal of the hysteresis comparator changes with temperature. When the triangular wave signal voltage is higher than the first voltage of the first thermistor, the hysteresis comparator outputs a high voltage; when the triangular wave signal voltage is lower than the first voltage of the first thermistor, the hysteresis comparator outputs a low voltage; and when the triangular wave signal voltage is equal to the first voltage of the first thermistor, the hysteresis comparator outputs a voltage according to the previous time. Thus, a 200 Hz pulse width modulation (PWM) wave signal whose duty cycle changes with temperature can be obtained, and the PWM wave signal is used to feedback the temperature on the power board of the charging and distribution system assembly.

[0033] 5 is a waveform diagram of a triangular wave signal voltage and a first voltage according to an embodiment of the present invention. As shown in FIG. 5, the vertical axis in FIG. 5 represents voltage, the horizontal axis represents time, the solid line in FIG. 5 represents the triangular wave signal voltage, and the dashed line represents the first voltage.

[0034] Specifically, a photocoupler isolation circuit is used to transmit the PWM wave signal on the power board to the PWM pin on the main control board, which can be used as a temperature judgment signal.

[0035] In step 104, a first temperature of the first thermistor and a second temperature of the second thermistor are obtained.

[0036] In one embodiment of the present invention, the first thermistor is a thermistor mounted on the power board, and the resistance signal of the thermistor changes with temperature. When the temperature decreases, the resistance of the thermistor increases, and when the temperature increases, the resistance of the thermistor decreases. Therefore, the resistance of the first thermistor can be calculated based on its first voltage, and the resistance reflects the temperature on the power board based on the relationship between the resistance and temperature of the thermistor in Figure 5, and the voltage of the first thermistor is the first voltage.

[0037] Fig. 6 is a schematic diagram showing the relationship between the resistance and temperature of a thermistor according to an embodiment of the present invention. As shown in Fig. 6, the horizontal axis of Fig. 6 represents the temperature of the thermistor in °C, and the vertical axis represents the resistance of the thermistor in ohms, with the resistance of the thermistor decreasing as the temperature increases.

[0038] To prevent temperature measurement errors due to over-range of the thermistor on the power board, a second thermistor is further added to the power board. The second thermistor is located close to the board-to-board connector on the power board to avoid long-distance transmission. The second thermistor operates on the same principle as the first thermistor, and its voltage reflects the on-board temperature. The voltage of the second thermistor is a second voltage, and the second temperature corresponding to the second voltage is the on-board temperature of the power charging and distribution system assembly.

[0039] In step 106, a collection temperature of the charging and distribution system assembly is determined based on the first temperature and the second temperature.

[0040] Specifically, when the first temperature is equal to or greater than a first predetermined threshold and the second temperature is less than a second predetermined threshold, the second temperature is the collected temperature of the charging and distribution system assembly; or when the first temperature is equal to or greater than the first predetermined threshold and the second temperature is greater than or equal to a third predetermined threshold, the first temperature is the collected temperature of the charging and distribution system assembly; or when the first temperature is equal to or greater than the first predetermined threshold and the second temperature is greater than or equal to the second predetermined threshold and less than the third predetermined threshold, the first temperature is the collected temperature of the charging and distribution system assembly; or when the first temperature is less than the first predetermined threshold, the first temperature is the collected temperature of the charging and distribution system assembly.

[0041] In one embodiment of the present invention, the first, second and third predetermined thresholds can be set according to actual conditions, and the first predetermined threshold is 125°C, the second predetermined threshold is -40°C and the third predetermined threshold is 25°C as an optional solution.

[0042] In one embodiment of the present invention, when the ambient temperature is -40°C, the resistance value of the first thermistor 21 is found to be 195.652K by looking up the table. Resistive voltage division calculations reveal that the voltage at the first pin 241 of the hysteresis comparator 24 is 4.87V. When compared with the maximum voltage of 5V of the pulse signal at the second pin 242 of the hysteresis comparator 24, the third pin 243 of the hysteresis comparator 24 should output a PWM wave signal with a duty cycle of 2.5%. However, due to a small duty cycle and other factors, the third pin 243 of the hysteresis comparator 24 outputs a low level. Therefore, the MCU actually collects a high level of T_DCDC_MCU. The temperature calculated by the circuit is 125°C, which does not match the actual temperature of -40°C. Therefore, a second thermistor 22 is installed on the power board. When the sampling temperature of the PWM wave signal is 125°C or higher, the sampling temperature of the second thermistor 22 is -40°C or lower, which indicates a low ambient temperature, and the collected temperature of the charging and distribution system assembly can be based on the on-board temperature (second temperature). When the sampling temperature of the PWM wave signal is 125°C or higher, the sampling temperature of the second thermistor 22 is 25°C or higher, which indicates a high ambient temperature, and the collected temperature of the charging and distribution system assembly can be based on the first temperature corresponding to the PWM wave signal. When the sampling temperature of the PWM wave signal is lower than 125°C, the collected temperature of the charging and distribution system assembly can be based on the first temperature corresponding to the PWM wave signal.

[0043] In a technical solution according to an embodiment of the present invention, the temperature collection circuit includes a main control board and a power board, the power board is provided with a first thermistor, a second thermistor, and an optocoupler isolation circuit, the first thermistor is connected to the optocoupler isolation circuit, the optocoupler isolation circuit is connected to the main control board, and the second thermistor is connected to the main control board. In a technical solution according to an embodiment of the present invention, the power board of the charging and distribution system assembly is provided with two thermistors, which avoids temperature measurement errors caused by over-range of the thermistors on the power board, improves the accuracy of temperature collection of the charging and distribution system assembly, and improves the charging safety of the power battery.

[0044] In a technical solution according to an embodiment of the present invention, a plurality of electronic devices are used to collect temperatures on the power board of a charging and distribution system assembly, and the first temperature is compared with the second temperature, thereby improving the accuracy of temperature collection.

[0045] In the technical solution of the embodiment of the present invention, a redundant design is used in which two thermistors are installed on the power board of the charging and distribution system assembly, to avoid temperature measurement errors caused by over-range of the thermistor on the power board and ensure the validity of the temperature signal.

[0046] In the technical solution of the embodiment of the present invention, a method for acquiring a PWM wave signal is provided to quickly and accurately feedback the temperature in the power board, which not only provides a reference for determining the collected temperature of the entire charging and distribution system assembly, but also provides a technical guide for subsequently collecting temperatures in other systems in the vehicle.

[0047] In the technical solution of the embodiment of the present invention, in the process of collecting the temperature of the power board, high and low voltages are input under different conditions using an operational amplifier, so that a 200Hz PWM wave signal whose duty ratio changes with temperature can be obtained, eliminating the need for excessive devices and eliminating the impact of linear resistance on collection accuracy.

[0048] An embodiment of the present invention provides a temperature collecting device. Figure 7 is a structural schematic diagram of a temperature collecting device according to an embodiment of the present invention. As shown in Figure 7, the device includes a first acquisition module 61 and an identification module 62.

[0049] The first acquisition module 61 acquires a first temperature of the first thermistor and a second temperature of the second thermistor.

[0050] The identification module 62 identifies a collection temperature of the charging and distribution system assembly based on the first temperature and the second temperature.

[0051] In one embodiment of the present invention, the device further includes a second acquisition module 63 .

[0052] The second acquisition module 63 acquires a pulse width modulated wave signal representing a first temperature based on the triangular wave signal voltage of the triangular wave generator and the first voltage of the first thermistor.

[0053] In one embodiment of the present invention, the second acquisition module 62 specifically sets the second temperature as the collected temperature of the charging and distribution system assembly when the first temperature is equal to or greater than the first predetermined threshold and the second temperature is less than the second predetermined threshold; or sets the first temperature as the collected temperature of the charging and distribution system assembly when the first temperature is equal to or greater than the first predetermined threshold and the second temperature is greater than or equal to the third predetermined threshold; or sets the first temperature as the collected temperature of the charging and distribution system assembly when the first temperature is equal to or greater than the first predetermined threshold and the second temperature is greater than or equal to the second predetermined threshold and less than the third predetermined threshold; or sets the first temperature as the collected temperature of the charging and distribution system assembly when the first temperature is less than the first predetermined threshold.

[0054] In one embodiment of the present invention, the first predetermined threshold comprises 125°C, the second predetermined threshold comprises -40°C, and the third predetermined threshold comprises 25°C.

[0055] In a technical solution according to an embodiment of the present invention, the temperature collection circuit includes a main control board and a power board, the power board is provided with a first thermistor, a second thermistor, and an optocoupler isolation circuit, the first thermistor is connected to the optocoupler isolation circuit, the optocoupler isolation circuit is connected to the main control board, and the second thermistor is connected to the main control board. In a technical solution according to an embodiment of the present invention, the power board of the charging and distribution system assembly is provided with two thermistors, which avoids temperature measurement errors caused by over-range of the thermistors on the power board, improves the accuracy of temperature collection of the charging and distribution system assembly, and improves the charging safety of the power battery.

[0056] The temperature collecting device of this embodiment may be used to realize the temperature collecting method in Figure 3 above, and for specific details, please refer to the embodiment of the temperature collecting method above, and the description will be omitted here.

[0057] An embodiment of the present invention provides a storage medium, the storage medium including a stored program, which, when activated, controls an apparatus in which the storage medium is located to perform each step of the embodiment of the temperature collection method described above. For a detailed description, please refer to the embodiment of the temperature collection method described above.

[0058] An embodiment of the present invention provides a charging and distribution system assembly, which includes a memory for storing information including program instructions and a processor for controlling the execution of the program instructions, and when the program instructions are loaded and executed by the processor, each step of the embodiment of the temperature collection method is performed, and specific descriptions can be referred to the embodiment of the temperature collection method.

[0059] 8 is a schematic diagram of a charging and distribution system assembly according to an embodiment of the present invention. As shown in FIG. 8, a charging and distribution system assembly 70 of this embodiment includes a processor 71, a memory 72, and a computer program 73 stored in the memory 72 and executable by the processor 71. When executed by the processor 71, the computer program 73 is applied to a temperature collection method in this embodiment, and a description thereof will not be repeated to avoid redundancy. Alternatively, when the computer program is executed by the processor 71, the functions of each model / unit used in the temperature collection device in this embodiment are realized, and a description thereof will not be repeated to avoid redundancy.

[0060] The charging and distribution system assembly 70 includes, but is not limited to, a processor 71 and a memory 72. As will be understood by those skilled in the art, Figure 8 is only an example of the charging and distribution system assembly 70 and does not form a limitation on the charging and distribution system assembly 70, which may include more or fewer components than shown, or a combination of some components, or different components, for example, the charging and distribution system assembly may further include input and output devices, network access devices, buses, etc.

[0061] The processor 71 referred to may be a Central Processing Unit (CPU), or may be another general-purpose processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field-Programmable Gate Array (FPGA) or other programmable logic device, a discrete gate or transistor logic device, a discrete hardware assembly, etc. The general-purpose processor may be a microprocessor or the processor may be any common processor, etc.

[0062] The memory 72 may be an internal storage unit of the charging and distribution system assembly 70, such as a hard disk or memory of the charging and distribution system assembly 70. The memory 72 may also be an external storage device of the charging and distribution system assembly 70, such as an insertable hard disk, a Smart Media Card (SMC), a Secure Digital (SD) card, or a flash memory card provided in the charging and distribution system assembly 70. Furthermore, the memory 72 may include not only the internal storage unit of the charging and distribution system assembly 70 but also an external storage device. The memory 72 stores computer programs and other programs and data required by the charging and distribution system assembly. The memory 72 also temporarily stores data that is output or to be output.

[0063] As will be apparent to those skilled in the art, for ease of explanation and brevity, the specific operating processes of the above-mentioned systems, devices and units may refer to the corresponding processes in the above-mentioned method embodiments, and the description thereof will be omitted here.

[0064] In some embodiments of the present invention, it should be understood that the disclosed system, apparatus, and method can be realized in other ways. For example, the above-described apparatus embodiments are only schematic, and the division of the units is only a division of logical functions. In actual implementation, other division methods may be used. For example, multiple units or assemblies may be combined or integrated into another system, or some features may be omitted or not implemented. Furthermore, the couplings or direct couplings or communication connections between the units shown or discussed may be indirect couplings or communication connections via some interfaces, devices, or units, which may be electrical, mechanical, or other types of couplings.

[0065] The units described as separate components may or may not be physically separated, and the components represented as units may or may not be physical units, i.e., they may be located in one place or distributed across multiple network units, and some or all of the units may be selected to achieve the objective of the solution of this embodiment according to actual needs.

[0066] Furthermore, each functional unit in each embodiment of the present invention may be integrated into one processing unit, each unit may exist physically alone, or two or more units may be integrated into one unit. The integrated unit may be realized in the form of hardware, or may be realized in the form of a combination of hardware and software functional units.

[0067] The integrated unit realized in the form of the software functional unit can be stored in a single computer-readable storage medium. The software functional unit is stored in a single storage medium and includes a plurality of instructions, which are used by a single computer device (which may be a personal computer, a server, a network device, etc.) or a processor to execute some steps of the method according to each embodiment of the present invention. The storage medium includes various media capable of storing program codes, such as a U disk, a removable hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0068] The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims

1. 1. A temperature acquisition circuit comprising: It includes a main control board and a power board, The power board is provided with a first thermistor, a second thermistor, and a photocoupler isolation circuit, the first thermistor is connected to the photocoupler isolation circuit, the photocoupler isolation circuit is connected to the main control board, and the second thermistor is connected to the main control board.

2. 2. The temperature collection circuit of claim 1, wherein the power board further includes a hysteresis comparator, an integrator, and a follower, and the hysteresis comparator, the integrator, and the follower form a triangular wave generator.

3. 3. The temperature collection circuit according to claim 2, wherein the power board further includes an operational amplifier, the operational amplifier being connected to the triangular wave generator and the first thermistor.

4. 1. A temperature collection method comprising: The temperature collection method is applied to a temperature collection circuit according to any one of claims 1 to 3, and the temperature collection method includes: obtaining a first temperature of a first thermistor and a second temperature of a second thermistor; and determining a collected temperature of the charging and distribution system assembly based on the first temperature and the second temperature.

5. before acquiring the first temperature of the first thermistor and the second temperature of the second thermistor, 5. The temperature acquisition method of claim 4, further comprising obtaining the pulse-width modulated wave signal representing the first temperature based on a triangular wave signal voltage of a triangular wave generator and a first voltage of a first thermistor.

6. Determining a collection temperature of the charging and distribution system assembly based on the first temperature and the second temperature includes: When the first temperature is greater than or equal to a first predetermined threshold and the second temperature is less than a second predetermined threshold, the second temperature is the collected temperature of the charging and distribution system assembly; or determining the first temperature as a collection temperature of the electrical charging and distribution system assembly when the first temperature is greater than or equal to a first predetermined threshold and the second temperature is greater than or equal to a third predetermined threshold; or determining the first temperature as the collected temperature of the electrical charging and distribution system assembly when the first temperature is equal to or greater than a first predetermined threshold and the second temperature is equal to or greater than a second predetermined threshold but less than a third predetermined threshold; or 10. The method of claim 1, further comprising: when the first temperature is less than a first predetermined threshold, setting the first temperature as the collected temperature of the charging and distribution system assembly.

7. 7. The temperature collection method of claim 6, wherein the first predetermined threshold comprises 125°C, the second predetermined threshold comprises -40°C, and the third predetermined threshold comprises 25°C.

8. 1. A temperature collection device comprising: a first acquisition module for acquiring a first temperature of the first thermistor and a second temperature of the second thermistor; an identification module for identifying a collected temperature of the charging and distribution system assembly based on the first temperature and the second temperature.

9. A storage medium, the storage medium including a stored program, the program, when activated, controlling a device in which the storage medium is located to perform the temperature collection method described in any one of claims 4 to 7.

10. A charging and distribution system assembly including a memory for storing information including program instructions and a processor for controlling the execution of the program instructions, wherein when the program instructions are loaded and executed by the processor, the steps of the temperature collection method described in any one of claims 4 to 7 are performed.

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