Injectors, liners, process kits, processing chambers, and related methods for gas flow in batch processing of semiconductor manufacturing.

Abstract

Embodiments of the present disclosure relate to injectors, liners, process kits, processing chambers, and related methods for gas flow in batch processing processes. In one or more embodiments, the liner promotes uniformity of gas flow in batch processing. In one or more embodiments, the liner includes a plurality of inlet openings on an inlet side, the plurality of inlet openings extending to an outer surface of the liner. The plurality of inlet openings includes a plurality of first inlet openings including a first row extending to a first side and a second row extending to a second side. The plurality of inlet openings includes a plurality of second inlet openings extending between the inner surface and the outer surface. The liner includes one or more outlet openings on an outlet side. The outlet side is opposite the inlet side. The one or more outlet openings extend to the inner surface.

Description

[Technical Field]

[0001] FIELD OF THE DISCLOSURE

[0001] Embodiments of the present disclosure relate to injectors, liners, process kits, processing chambers, and related methods for gas flow in batch processing. In one or more embodiments, a liner promotes uniformity of gas flow in batch processing. [Background technology]

[0002]

[0002] Semiconductor substrates are processed for a wide variety of applications, including the fabrication of integrated devices and microdevices. One method of processing a substrate involves depositing a material, such as a semiconductor material or a conductive material, on the surface of the substrate. For example, epitaxy is a deposition process that deposits films of various materials on the surface of a substrate in a processing chamber.

[0003]

[0003] Non-uniformities can exist during processing. For example, non-uniformities can exist in gas flows (e.g., gas concentrations, gas temperatures, and / or flow rates). Non-uniformities can impede deposition uniformity, such as control and adjustability, thermal uniformity, and center-to-edge film thickness uniformity. Such problems can be exacerbated by the relatively complex deposition process.

[0004]

[0004] Therefore, there is a need for improved apparatus and methods that facilitate reliably delivering gas flow in a manner that promotes gas flow uniformity. Summary of the Invention

[0005]

[0005] Embodiments of the present disclosure relate to injectors, liners, process kits, processing chambers, and related methods for gas flow in batch processing operations.

[0006] In one or more embodiments, a process kit adaptable for placement within a processing chamber includes an injector. The injector includes an inner surface, an outer surface opposite the inner surface, and a plurality of first injection openings extending between the inner surface and the outer surface. The plurality of first injection openings includes a first row of first injection openings and a second row of first injection openings. The injector includes a plurality of second injection openings extending between the inner surface and the outer surface. The plurality of second injection openings are aligned between the first row and the second row of first injection openings. The process kit includes a first liner sized and shaped to be placed inside the injector. The first liner includes an inner surface, an outer surface opposite the inner surface of the first liner, a first side between the inner surface of the first liner and the outer surface of the first liner, and a second side between the inner surface of the first liner and the outer surface of the first liner. The second side is opposite the first side. The first liner includes a plurality of inlet openings on an inlet side of the first liner. The plurality of inlet openings extend to an inner surface and a second side surface of the first liner. The first liner includes one or more outlet openings on an outlet side of the first liner. The outlet side is opposite the inlet side, and the one or more outlet openings extend to the inner surface of the first liner. The process kit includes a second liner sized and shaped to be at least partially supported by the first liner. The second liner includes an inner surface, an outer surface opposite the inner surface of the second liner, a first side surface between the inner surface of the second liner and the outer surface of the second liner, and a second side surface between the inner surface of the second liner and the outer surface of the second liner. The second side surface of the second liner is opposite the first side surface of the second liner. The second liner includes a plurality of inlet openings on the inlet side of the second liner. The second liner has a plurality of inlet openings extending to an outer surface thereof. The second liner includes one or more outlet openings on an outlet side thereof. The outlet side of the second liner is opposite the inlet side of the second liner. The one or more outlet openings extend to an inner surface of the second liner.

[0007] In one or more embodiments, a liner adaptable for placement within a processing chamber includes an inner surface, an outer surface opposite the inner surface, a first side surface between the inner surface and the outer surface, and a second side surface between the inner surface and the outer surface. The second side surface is opposite the first side surface. The liner includes a plurality of inlet openings on an inlet side. The plurality of inlet openings extends to the outer surface. The plurality of inlet openings includes a plurality of first inlet openings including a first row extending to the first side surface and a second row extending to the second side surface. The plurality of inlet openings includes a plurality of second inlet openings extending between the inner surface and the outer surface. The liner includes one or more outlet openings on an outlet side. The outlet side is opposite the inlet side. The one or more outlet openings extend to the inner surface.

[0008] In one or more embodiments, a processing chamber applicable for use in semiconductor manufacturing includes a chamber body including an interior space and an injector. The injector includes an interior surface, an exterior surface opposite the interior surface, and a plurality of first injection openings extending between the interior surface and the exterior surface. The plurality of first injection openings includes a first row of first injection openings and a second row of first injection openings. The injector includes a plurality of second injection openings extending between the interior surface and the exterior surface. The plurality of second injection openings is aligned between the first row and the second row of first injection openings. The processing chamber includes one or more heat sources configured to generate heat and a substrate support assembly disposed within the interior space. The substrate support assembly includes a plurality of lift pins and one or more substrate supports. The processing chamber includes a first liner disposed inside the injector. The first liner includes an inner surface, an outer surface opposite the inner surface of the first liner, a first side surface between the inner surface of the first liner and the outer surface of the first liner, and a second side surface between the inner surface of the first liner and the outer surface of the first liner. The second side surface is opposite the first side surface. The first liner includes a plurality of inlet openings on an inlet side of the first liner. The plurality of inlet openings extend to the inner surface of the first liner and the second side surface. The first liner includes one or more outlet openings on an outlet side of the first liner. The outlet side is opposite the inlet side, and the one or more outlet openings extend to the inner surface of the first liner. The processing chamber includes a second liner at least partially supported by the first liner. The second liner includes an inner surface, an outer surface opposite the inner surface of the second liner, a first side surface between the inner surface of the second liner and the outer surface of the second liner, and a second side surface between the inner surface of the second liner and the outer surface of the second liner. The second side surface of the second liner is opposite the first side surface of the second liner. The second liner includes a plurality of inlet openings on an inlet side of the second liner. The plurality of inlet openings of the second liner extend to the outer surface of the second liner. The second liner includes one or more outlet openings on an outlet side of the second liner. The outlet side of the second liner is opposite the inlet side of the second liner.

[0009]

[0009] So that the above features of the present disclosure can be understood in detail, a more particular description of the present disclosure briefly summarized above can be made by reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the accompanying drawings illustrate only exemplary embodiments and therefore should not be considered to limit the scope of the present disclosure, as other equally effective embodiments may also be acceptable. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a schematic cross-sectional side view of a processing apparatus according to one or more embodiments. [Figure 2]

[0011] 2 is a schematic cross-sectional side view of the processing apparatus shown in FIG. 1 according to one or more embodiments. [Figure 3]

[0012] 2 is a simplified diagram of an enlarged view of the inlet side of the processing device shown in FIG. 1, according to one or more embodiments. [Figure 4]

[0013] 2 is a simplified diagram of an expanded view of the outlet side of the processing device shown in FIG. 1, according to one or more embodiments. [Figure 5]

[0014] 2 is a schematic partial top view of the processing apparatus shown in FIG. 1 according to one or more embodiments. [Figure 6]

[0015] 2 is a schematic partial axonometric view of the inlet side of the processing apparatus shown in FIG. 1, according to one or more embodiments. [Figure 7]

[0016] 2 is a schematic partial axonometric cross-sectional view of the inlet side of the processing apparatus shown in FIG. 1, according to one or more embodiments. [Figure 8]

[0017] 2 is a schematic partial cross-sectional side view of the cross-flow side of the processing device shown in FIG. 1, according to one or more embodiments. [Figure 9]

[0018] 2 is a schematic partial cross-sectional side view of the cross-flow side of the processing device shown in FIG. 1, according to one or more embodiments. [Figure 10]

[0019] 2 is a schematic partial axonometric cross-sectional view of the processing apparatus shown in FIG. 1 in accordance with one or more embodiments. [Figure 11]

[0020] FIG. 11 is a schematic axonometric top view of the first liner shown in FIGS. 1-10, according to one or more embodiments. [Figure 12]

[0021] FIG. 11 is a schematic axonometric bottom view of the first liner shown in FIGS. 1-10, according to one or more embodiments. [Figure 13]

[0022] FIG. 11 is a schematic axonometric top view of the second liner shown in FIGS. 1-10, according to one or more embodiments. [Figure 14]

[0023] FIG. 11 is a schematic axonometric bottom view of the second liner shown in FIGS. 1-10, according to one or more embodiments. [Figure 15]

[0024] FIG. 11 is a schematic axonometric top view of the third liner shown in FIGS. 1-10, according to one or more embodiments. [Figure 16]

[0025] FIG. 11 is a schematic axonometric bottom view of the third liner shown in FIGS. 1-10, according to one or more embodiments. [Figure 17]

[0026] 2 is a schematic partial axonometric view of the outlet side of the processing device shown in FIG. 1, according to one or more embodiments. [Figure 18]

[0027] FIG. 18 is a schematic partial axonometric view of the inlet side of the processing device shown in FIG. 17, according to one or more embodiments. [Figure 19]

[0028] 6 is a schematic partial front view of the injector shown in FIG. 5, according to one or more embodiments. [Figure 20]

[0029] 1 is a simplified diagram of an enlarged view of the inlet side of a processing device according to one or more embodiments. [Figure 21]

[0030] 21 is a schematic diagram of an expanded view of the outlet side of the processing device shown in FIG. 20, according to one or more embodiments. [Figure 22]

[0031] 22 is a schematic partial cross-sectional side view of the cross-flow side of the processing device shown in FIGS. 20 and 21, in accordance with one or more embodiments. FIG. [Figure 23]

[0032] 1 is a schematic block diagram of a method for processing a substrate for semiconductor manufacturing, according to one or more embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0011]

[0033] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements common to the figures. It is believed that elements and features of one embodiment may be beneficially incorporated in multiple other embodiments without further description.

[0012]

[0034] FIELD OF THE DISCLOSURE Embodiments of the present disclosure relate to liners, process kits, processing chambers, and related methods for gas flow in batch processing steps. In one or more embodiments, the liners promote uniformity of gas flow in batch processing.

[0013]

[0035] It is contemplated that the present disclosure contemplates that terms such as "couple," "bond," "bonding," and "coupled" may include, but are not limited to, welding, fusion bonding, fusion bonding, interference fitting, and / or fastening (e.g., using bolts, threaded connections, pins, and / or screws). It is contemplated that the present disclosure contemplates that terms such as "couple," "bond," "bond," and "coupled" may include, but are not limited to, integral formation. It is contemplated that the present disclosure contemplates that terms such as "couple," "bond," "bond," and "coupled" may include, but are not limited to, direct bonding and / or indirect bonding (e.g., indirect bonding via components such as links, blocks, and / or frames).

[0014]

[0036] FIG. 1 is a schematic cross-sectional side view of a processing apparatus 100 in accordance with one or more embodiments. Side heat sources 118a, 118b, shown in FIG. 2, are not shown in FIG. 1 for the sake of visual clarity. The processing apparatus 100 includes a processing chamber having a chamber body 130 that defines an interior space 124. The processing chamber 100 includes a plate 109 disposed within the interior space 124 and at least partially defining a processing space 128 within the interior space 124. The plate 109 is described further below.

[0015]

[0037] A cassette 1030 is disposed within the processing space 128 and is at least partially supported by a substrate support assembly 119 (e.g., a pedestal assembly). The cassette 1030 includes a cassette plate 1032 and multiple levels for supporting multiple substrates 107 for simultaneous processing (e.g., epitaxial deposition). This disclosure contemplates that the cassette plate 1032 may be omitted. In one embodiment shown in FIG. 1 , the cassette 1030 supports three substrates 107. The cassette 1030 can support other numbers of substrates 107, including, but not limited to, two substrates 107, four substrates 107, six substrates 107, or eight substrates 107. In one or more embodiments, the cassette 1030 supports two substrates 107 or three substrates 107. The processing apparatus 100 includes an upper window 116, such as a dome, disposed between the lid 104 and the processing space 128.

[0016]

[0038] The processing apparatus 100 includes a lower window 115 disposed below the processing space 128. One or more upper heat sources 106 are disposed above the processing space 128 and the upper window 116. The one or more upper heat sources 106 may be radiant heat sources such as lamps (e.g., halogen lamps). The one or more upper heat sources 106 are disposed between the upper window 116 and the lid 104. The upper heat sources 106 are disposed to provide uniform heating of the substrate 107. One or more lower heat sources 138 are disposed below the processing space 128 and the lower window 115. The one or more lower heat sources 138 may be radiant heat sources such as lamps (e.g., halogen lamps). The lower heat sources 138 are disposed between the lower window 115 and a floor 134 of the interior space 124. The lower heat sources 138 are disposed to provide uniform heating of the substrate 107.

[0017]

[0039] The present disclosure contemplates that other heat sources may be used (in addition to or instead of lamps) for the various heat sources described herein, for example, resistive heaters, light emitting diodes (LEDs), and / or lasers may be used for the various heat sources described herein.

[0018]

[0040] The upper and lower windows 116, 115 and / or plate 109 may be transparent to infrared radiation, such as by transmitting at least 80% (e.g., at least 95%) of the infrared radiation. The upper and lower windows 116, 115 and / or plate 109 may be formed of a quartz material (e.g., clear quartz). In one or more embodiments, the upper window 116 includes an inner window 193 and an outer window support 194. The inner window 193 may be a thin quartz window. The outer window support 194 supports the inner window 193 and is at least partially disposed within the support groove. In one or more embodiments, the lower window 115 includes an inner window 187 and an outer window support 188. The inner window 187 may be a thin quartz window. The outer window support 188 supports the inner window 187.

[0019]

[0041] A substrate support assembly 119 is disposed within the processing space 128. A plurality of liners 307, 330, 350, 380 (described below in connection with FIGS. 3 and 4 ) are disposed within the processing space 128 and surround the substrate support assembly 119. The liners 307, 330, 350, 380 facilitate shielding the chamber body 130 from processing chemistry within the processing space 128. The chamber body 130 includes one or more sidewalls disposed at least partially between the upper window 116 and the lower window 115. The liners 307, 330, 350, 380 are disposed between the processing space 128 and the chamber body 130. In one or more embodiments, the liners 307, 330, 350, 380 are formed from one or more of quartz (transparent quartz, such as clear quartz, opaque quartz, and / or black quartz), silicon carbide (SiC), and / or graphite coated with SiC.

[0020]

[0042] The processing apparatus 100 includes a flow guide structure 150 having one or more flow diverters 111 disposed outside the cassette 1030. Three flow diverters 111 are shown in FIG. 1 . Other numbers of flow diverters 111 (e.g., two or four) may be used. The flow guide structure 150 divides the processing space into multiple flow levels 153 (three flow levels are shown in FIG. 1 ). In one or more embodiments, the flow guide structure 150 includes at least two (e.g., at least three) flow levels 153.

[0021]

[0043] The flow guide structure 150 and / or the cassette 1030 are formed from one or more of quartz (transparent quartz, e.g., clear quartz, opaque quartz, and / or black quartz), silicon carbide (SiC), and / or graphite coated with SiC.

[0022]

[0044] Multiple portions of the flow guide structure 150 (e.g., one or more flow diverters 111) may each act as a preheat ring for each flow level 153. The one or more flow diverters 111 may be referred to as one or more preheat rings.

[0023]

[0045] As explained below, the present disclosure contemplates that the flow guide structure 150 may be omitted.

[0024]

[0046] The substrate support assembly 119 includes a first support frame 199 and a second support frame 198 disposed at least partially around the first support frame 199. The first support frame 199 includes arms coupled to the cassette 1030, such that raising and lowering the first support frame 199 raises and lowers the cassette 1030. A plurality of lift pins 189 hang from the cassette 1030. Lowering the cassette 1030 and / or raising the second support frame 198 initiates contact between the lift pins 189 and the arms of the second support frame 198. As the cassette 1030 continues to lower and / or the second support frame 198 continues to raise, the lift pins 189 contact the substrates in the cassette 1030. The lift pins 189 thereby raise the substrates in the cassette 1030. The lower region 105 of the processing device 100 is defined between the floor 134 and the cassette 1030 .

[0025]

[0047] The first shaft 126 of the first support frame 199, the second shaft 125 of the second support frame 198, and the section 151 of the lower window 115 extend through ports formed in the lower portion 135 and floor 134 of the chamber body 130. Each shaft 125, 126 is coupled to one or more respective motors 164. The motors 164 are configured to independently raise, lower, and / or rotate the cassette 1030 using the first support frame 199 and to independently raise and lower the lift pins 189 using the second support frame 198. The first support frame 199 includes the first shaft 126 and a plurality of first arms 1021 configured to support the cassette 1030, which includes one or more substrate supports 112. The cassette 1030 includes a plurality of mounting columns 1081 that support the arcuate supports 112. The second support frame 198 includes the second shaft 125 and a plurality of second arms 1022 configured to interact with and support the lift pins 189. The bellows assembly 158 surrounds and closes a portion of the shafts 125, 126 disposed outside the chamber body 130 to facilitate reducing or eliminating vacuum leakage outside the chamber body 130.

[0026]

[0048] The processing apparatus 100 may include one or more sensors 191, 192, 282, such as temperature sensors (e.g., optical pyrometers) or other metrology sensors, that measure temperature (or other parameters) within the processing apparatus 100 (e.g., at the surface of the upper window 116, the surface of the plate assembly 300, and / or one or more surfaces of the substrates 107, the flow guide structure 150, and / or the cassette 1030). The one or more sensors 191, 192 are disposed on the lid 104. One or more sensors 282 (e.g., lower pyrometers) are shown in FIG. 2 and are disposed below the lower window 115. The one or more sensors 282 may be disposed adjacent to and / or on the lower portion 135 of the chamber body 130.

[0027]

[0049] In one or more embodiments, the upper sensors 191, 192 are positioned toward the top of the cassette 1030, the plate 109, and / or the top of the flow guiding structure 150. In one or more embodiments, the side sensor 281 (e.g., a side temperature sensor) is positioned toward the substrate support 112 of the cassette 1030. In one or more embodiments, the lower sensor 282 is positioned toward the bottom of the cassette 1030 (e.g., the underside of the cassette plate 1032), the bottom of the plate 109, and / or the bottom of the flow guiding structure 150.

[0028]

[0050] The processing system 100 includes a controller 1070 configured to control the processing system 100 or its components. For example, the controller 1070 can control the operation of the components of the processing system 100 by using direct control of the components or by controlling a controller associated with the components. During operation, the controller 1070 enables data collection and feedback from each chamber to adjust and control the performance of the processing system 100.

[0029]

[0051] The controller 1070 generally includes a central processing unit (CPU) 1071, memory 1072, and support circuits 1073. The CPU 1071 can be any form of general-purpose processor that can be used in an industrial environment. The memory 1072, or non-transitory computer-readable medium, is accessible by the CPU 1071 and can be one or more memories (e.g., random access memory (RAM), read-only memory (ROM), floppy disk, hard disk, or any other form of local or remote digital storage). The support circuits 1073 are coupled to the CPU 1071 and can include cache, clock circuits, input / output subsystems, power supplies, etc.

[0030]

[0052] The various methods (e.g., method 2300) and operations disclosed herein may generally be implemented by CPU 1071, under control of CPU 1071, executing computer instruction code stored, for example, as software routines in memory 1072 (or the memory of a particular processing chamber). Execution of the computer instruction code by CPU 1071 causes CPU 1071 to control components of processing chamber 100 to perform steps according to the various methods and operations described herein. In one embodiment, which may be combined with other embodiments, memory 1072 (a non-transitory computer-readable medium) stores instructions that, when executed, cause the methods (e.g., method 2300) and operations (e.g., steps 2302-2312) described herein to be performed. Controller 1070 may, for example, communicate with heat sources, gas sources, and / or vacuum pump(s) of processing apparatus 100 to perform steps.

[0031]

[0053] Figure 2 is a schematic cross-sectional side view of the processing apparatus 100 shown in Figure 1, in accordance with one or more embodiments. The cross-sectional view shown in Figure 2 is rotated by 55 degrees relative to the cross-sectional view shown in Figure 1.

[0032]

[0054] The processing apparatus 100 includes one or more side heat sources 118a, 118b (e.g., side lamps, side resistive heaters, side LEDs, and / or side lasers) positioned outside the processing space 128. The one or more second side heat sources 118b are located across the processing space 128 opposite the one or more first side heat sources 118a.

[0033]

[0055] In FIG. 2 , for visual clarity, the flow guide structure 150 is not shown. Furthermore, the present disclosure contemplates that the flow guide structure 150 may be omitted from the processing apparatus 100 shown in FIGS. 1-2 . In one such embodiment, one or more process and / or purge gas streams flow from the liners 330, 350, 380 to the outer ring of the processing space 128, then to the openings 216 between and outside the substrate supports 112 (e.g., arc-shaped supports) of the cassette 1030, and then into the gaps between the substrates 107. One or more process gases P1 flow out of the gaps, to the openings 216 (between and outside the substrate supports 112) on the exhaust side of the substrates 107, to the outer ring of the processing space 128, and out of the processing space 128 through the liners 330, 350, 380. The present disclosure also contemplates that multiple lines (eg, conduits) within the processing space 128 may connect each of the liners 330 , 350 , 380 to each of the inlet openings of the cassette 1030 .

[0034]

[0056] In addition to the one or more sensors 191, 192 positioned above the processing space 128 and above the second blocking plate 1062, the processing apparatus 100 may include one or more sensors 281, such as a temperature sensor (e.g., an optical pyrometer) or other metrology sensor, that measure the temperature (or other parameter) within the processing apparatus 100 (e.g., at the surface of the upper window 116, the surface of the plate 109, and / or one or more surfaces of the substrates 107, the windows 257, and / or the cassette 1030). The windows 257 (if used) may be positioned within gaps formed between or within one or more of the liners 307, 330, 350, 380. One or more of the sensors 281 are side sensors (e.g., side pyrometers) that are positioned outside the processing space 128, outside the flow guide structure 150, and outside the windows 257. The one or more sensors 281 may, for example, be radially aligned with the plurality of windows 257 (shown in FIG. 2).

[0035]

[0057] One or more side sensors 281 (e.g., one or more pyrometers) can be used to measure the temperature within the processing space 128 from each side of the processing space 128. The side sensors 281 are arranged on multiple sensor levels (three sensor levels are shown in FIG. 2). In one or more embodiments, the number of sensor levels equals the number of heat source levels. Each side sensor 281 can be oriented horizontally or can be oriented (e.g., downward at an angle) toward the substrates 107 and substrate supports 112 on the respective level of the cassette 1030.

[0036]

[0058] The present disclosure contemplates that the side heat sources 118a, 118b, the window 257, and / or the side sensor 281 may be omitted.

[0037]

[0059] FIG. 3 is a simplified diagram of an enlarged view of the inlet side of the processing apparatus 100 shown in FIG. 1, according to one or more embodiments.

[0038]

[0060] The chamber body 130 includes a base 302 (e.g., a base ring). The base 302 can be rectangular or circular. An insert 301 is disposed partially through the base 302. The process kit includes an injector 310 at least partially supported by the base 302. The injector 310 includes an inner surface 311 and an outer surface 312 opposite the inner surface 311. The injector 310 includes a plurality of first injection openings 313 extending between the inner surface 311 and the outer surface 312. The plurality of first injection openings 313 includes a first row 314 of first injection openings 313 and a second row 315 of first injection openings 313. The injector 310 includes a plurality of second injection openings 316 extending between the inner surface 311 and the outer surface 312. A plurality of second injection openings 316 are aligned between the first row 314 and the second row 315 of first injection openings 313. In one or more embodiments, the first injection openings 313 and the second injection openings 316 each include an aperture. The injector 310 includes a ring-shaped body 317, such as in the shape of a circular ring or a rectangular ring (as shown in FIG. 5). In one or more embodiments, the injector 310 may be referred to as an injection ring.

[0039]

[0061] The process kit includes a first liner 330 sized and shaped to be disposed inside the injector 310. The first liner 330 is at least partially supported by the insert 301. The first liner 330 includes an inner surface 331 and an outer surface 332 of the first liner 330 opposite the inner surface 331. The first liner 330 includes a first side surface 333 between the inner surface 331 of the first liner 330 and the outer surface 332 of the first liner 330. The first liner 330 includes a second side surface 334 between the inner surface 331 of the first liner 330 and the outer surface 332 of the first liner 330. The second side surface 334 is opposite the first side surface 333. The first liner 330 includes a plurality of inlet openings 335 on an inlet side of the first liner 330. A plurality of inlet openings 335 extend into the inner surface 331 and the second side surface 334 of the first liner 330. In one or more embodiments, the inlet openings 335 of the first liner 330 comprise recesses. The first liner 330 includes a ring-shaped body 337, such as in the shape of a circular ring (as shown in FIGS. 11 and 12) or a rectangular ring.

[0040]

[0062] The process kit includes a second liner 350 sized and shaped to be at least partially supported by the first liner 330. The second liner 350 includes an inner surface 351 and an outer surface 352 opposite the inner surface 351 of the second liner 350. The second liner 350 includes a first side 353 between the inner surface 351 of the second liner 350 and the outer surface 352 of the second liner 350. The second liner 350 includes a second side 354 between the inner surface 351 of the second liner 350 and the outer surface 352 of the second liner 350. The second side 354 of the second liner 350 is opposite the first side 353 of the second liner 350. The second liner 350 includes a plurality of inlet openings 355 on an inlet side of the second liner 350. A plurality of inlet openings 355 in the second liner 350 extend to an outer surface 352 of the second liner 350 .

[0041]

[0063] In one or more embodiments, the plurality of inlet openings 355 of the second liner 350 includes a first row 361 extending to a first side 353 of the second liner 350 and configured to align (e.g., sized, shaped, and disposed along the second liner 350) with the first row 314 of first injection openings 313 of the injector 310. In one or more embodiments, the plurality of inlet openings 355 of the second liner 350 includes a second row 362 extending to a second side 354 of the second liner 350 and configured to align (e.g., sized, shaped, and disposed along the second liner 350) with the second row 315 of first injection openings 313 of the injector 310. In one or more embodiments, the inlet openings 355 including the first row 361 and the second row 362 are a plurality of first inlet openings, and the second liner 350 includes a plurality of second inlet openings 363 extending between the inner surface 351 of the second liner 350 and the outer surface 352 of the second liner 350. The first row 361 of the plurality of first inlet openings 355 of the second liner 350 includes a first recess extending into the outer surface 352 and the first side surface 353 of the second liner 350. The second row 362 of the plurality of first inlet openings 355 of the second liner 350 includes a second recess extending into the outer surface 352 and the second side surface 354 of the second liner.

[0042]

[0064] The plurality of second inlet openings 363 of the second liner 350 are configured (e.g., sized, shaped, positioned along the second liner 350) to align with the second injection openings 316 of the injector 310. The second liner 350 includes a ring-shaped body 357, such as in the shape of a circular ring (as shown in FIGS. 13 and 14) or a rectangular ring.

[0043]

[0065] The process kit includes a third liner 380 sized and shaped to be at least partially supported by the second liner 350. The third liner 380 includes an inner surface 381 and an outer surface 382 opposite the inner surface 381 of the third liner 380. The third liner 380 includes a first side 383 between the inner surface 381 of the third liner 380 and the outer surface 382 of the third liner 380, and a second side 384 between the inner surface 381 of the third liner 380 and the outer surface 382 of the third liner 380. The second side 384 of the third liner 380 is opposite the first side 383 of the third liner 380. The second side 384 of the third liner 380 includes a tapered section 385. The third liner 380 includes a plurality of inlet openings 386 on an inlet side of the third liner 380. The plurality of inlet openings 386 of the third liner 380 extend to a first side 383 of the third liner 380. The plurality of inlet openings 386 of the third liner 380 extend to an inner surface 381 of the third liner 380. In one or more embodiments, the plurality of inlet openings 386 of the third liner 380 include recesses. The third liner 380 includes a ring-shaped body 390, such as in the shape of a circular ring (as shown in FIGS. 15 and 16 ) or a rectangular ring.

[0044]

[0066] The first liner 330, the second liner 350, and the third liner 380 are stacked vertically relative to one another. In one or more embodiments, the inner diameters of the respective liners 330, 350, 380 are substantially equal to one another (e.g., within 10% of each other). The inner diameters are defined for the respective liners 330, 350, 380 by their respective inner surfaces 331, 351, 381. In one or more embodiments, the outer diameters of the respective liners 330, 350, 380 are substantially equal to one another (e.g., within 10% of each other). The outer diameters are defined for the respective liners 330, 350, 380 by their respective outer surfaces 332, 352, 382.

[0045]

[0067] The insert 301 and the base 302 may each include transfer openings 303, 304 for transferring substrates therethrough. The openings 303, 304 may be used to transfer the substrates 107 into and out of the cassette 1030, for example, into and out of the interior space 124. In one or more embodiments, the openings 303, 304 include slit valves. In one or more embodiments, the openings 303, 304 may be connected to, interact with, or be part of any suitable valve that allows the passage of substrates therethrough. While the openings 303, 304 are shown open, they may be closed (e.g., using a door on a slit valve). In one or more embodiments, a first cover 398 covers a cooling channel 397 formed in the injector 310, and a second cover 396 covers cooling channels 394, 395 formed in the injector 310 and the base 302.

[0046]

[0068] FIG. 4 is a simplified diagram of an expanded view of the outlet side of the processing apparatus 100 shown in FIG. 1, according to one or more embodiments.

[0047]

[0069] The first liner 330 includes one or more outlet openings 336 on an outlet side of the first liner 330. The outlet side is opposite the inlet side. The one or more outlet openings 336 extend to an inner surface 331 of the first liner 330. The one or more outlet openings 336 of the first liner 330 include a recessed section 338 that extends to the inner surface 331 of the first liner 330. The one or more outlet openings 336 include a passage section 339 that extends to the recessed section 338.

[0048]

[0070] The second liner 350 includes one or more outlet openings 356 on an outlet side of the second liner 350. The outlet side of the second liner 350 is opposite the inlet side of the second liner 350. The one or more outlet openings 356 of the second liner 350 extend to an inner surface 351 of the second liner 350. The one or more outlet openings 356 of the second liner 350 include a passage section 365 extending between the first side 353 and the second side 354 of the second liner 350. The one or more outlet openings 356 of the second liner 350 include an opening section 366 extending between the inner surface 351 of the second liner 350 and the passage section 365 of the second liner 350.

[0049]

[0071] The third liner 380 includes one or more outlet openings 387 on an outlet side of the third liner 380. The outlet side of the third liner 380 is opposite the inlet side of the third liner 380. The one or more outlet openings 387 of the third liner 380 extend to an inner surface 381 of the third liner 380. The one or more outlet openings 387 of the third liner 380 extend to a first side surface 383 of the third liner 380. In one or more embodiments, the one or more outlet openings 387 of the third liner 380 include a recessed section 388 that extends to the inner surface 381 and the first side surface 383 of the third liner 380.

[0050]

[0072] The insert 301 and the base 302 may each include transfer openings 303, 304 for transferring substrates therethrough. The openings 303, 304 may be used to transfer the substrates 107 into and out of the cassette 1030, for example, into and out of the interior space 124. In one or more embodiments, the openings 303, 304 include slit valves. In one or more embodiments, the openings 303, 304 may be connected to, interact with, or be part of any suitable valve that allows for the passage of substrates therethrough.

[0051]

[0073] During a process (such as an epitaxial deposition process), a first gas flow P1 is supplied to the processing space 128 through the outer supply conduit system 122, and a second gas flow P2 is supplied to the processing space 128 through the inner supply conduit system 121. The first gas flow P1 includes one or more process gases, and the second gas flow P2 includes one or more purge gases. The inner and outer supply conduit systems 121, 122 include multiple gas boxes 117 attached to the injectors 310. The present disclosure contemplates that a variety of supply conduit systems and / or gas boxes may be used.

[0052]

[0074] A first gas flow P1 is supplied from one or more gas sources 196 through one or more valves 183 (shown in FIG. 1), and a second gas flow P2 is supplied from one or more purge gas sources 129 through one or more valves 182.

[0053]

[0075] The inlet opening 335, the second inlet opening 363, and the inlet opening 386 are configured to direct the first gas flow P1 and the second gas flow P2 in a generally radially inward direction toward the cassette 1030. The flow(s) of the one or more process gases P1 may be divided into multiple flow levels 153. In one or more embodiments, a plate 109 separates the processing space 128 from the upper section 131 of the interior space 124. At least in the uppermost flow level 153 (or the single flow level 153, if a single flow level 153 is used), the one or more process gases P1 may be guided (using the plate 109) along a streamlined flow path, thereby reducing or eliminating diffusive flow away from the top substrate 107 (or the single substrate 107, if a single substrate 107 is used). The plate assembly 300 may promote a more uniform flow of one or more process gases P1 along the top flow level 153 relative to other flow levels 153 below the top flow level 153.

[0054]

[0076] The processing apparatus 100 includes a common exhaust box 1092 (shown in FIG. 1). A first gas stream P1 and a second gas stream P2 flow from the interior space 124, through liners 307, 330, 350, and 380, and through one or more exhaust passages 308. The first gas stream P1 and the second gas stream P2 flow from the one or more exhaust passages 308 and through the common exhaust box 1092 using one or more pumping devices 197 (e.g., one or more vacuum pumps) shown in FIG. 1. The one or more exhaust passages 308 are defined at least in part by one or more exhaust structures 399 (e.g., boxes) in fluid communication with the common exhaust box 1092.

[0055]

[0077] The one or more process gases of the first gas flow P1 may include, for example, a purge gas, a cleaning gas, and / or a deposition gas. The deposition gas may include, for example, one or more reactant gases carried in one or more carrier gases. The one or more reactant gases may include, for example, a silicon- and / or germanium-containing gas (such as silane (SiH), disilane (SiH), dichlorosilane (SiHCl), and / or germane (GeH)), a chlorine-containing etching gas (such as hydrogen chloride (HCl)), and / or a dopant gas (such as phosphine (PH) and / or diborane (BH)). The one or more purge gases of the first gas flow P1 and / or the second gas flow P2 may include, for example, one or more of argon (Ar), helium (He), nitrogen (N), hydrogen chloride (HCl), and / or hydrogen (H).

[0056]

[0078] The second gas flow P2 is supplied to the processing space 128 through the second liner 350 and may also be supplied to the lower region 105 (shown in FIG. 1 ) of the interior space 124 through one or more purge gas inlets formed in one or more sidewalls of the chamber body 130 (e.g., formed circumferentially below or outside the insert 301). The one or more purge gas inlets direct the second gas flow P2 in a generally radially inward direction. One or more purge gases for the second gas flow P2 may be supplied from a purge gas source 129 (shown in FIG. 1 ). The second gas flow P2 in the lower region 105 may be directed in an upward direction. During the film formation process, the substrate support assembly 119 is positioned to facilitate the second gas flow P2 in the lower region 105 flowing generally along a path that extends generally along the backside of the cassette 1030. The second gas flow in the lower region 105 exits the lower region 105 through one or more purge gas outlets 309 formed in the lower liner 307, through one or more exhaust channels 305 in the lower liner 307, and through one or more exhaust passages 308.

[0057]

[0079] 3 and 4, a cassette 1030 includes three substrate supports 112, three flow dividers 111, and three substrates 107. In one or more embodiments, a first gas flow P1 provided from a first liner 330 flows over the top surface of the first substrate (lower substrate 107), a second gas flow P2 provided from a second liner 350 flows over the top surface of the second substrate (middle substrate 107), and a second gas flow P1 provided from a third liner 380 flows over the top surface of the third substrate (upper substrate 107). In one such embodiment, the top surface of the first substrate 107 (lower substrate 107) and the top surface of the third substrate 107 (upper substrate 107) are processed (e.g., for deposition) with a first gas flow P1, while the top surface of the second substrate 107 (middle substrate 107) is purged with a second gas flow P2. The second substrate 107 (middle substrate 107) acts as a barrier between the first substrate 107 (lower substrate 107) and the third substrate 107 (upper substrate 107). The present disclosure contemplates that other barriers may be used in place of the second substrate 107 (middle substrate 107). The processing apparatus 100 facilitates modularization of the gas flow paths to reduce or eliminate contamination of the barrier (e.g., the second substrate 107). For example, a second gas flow P2 is supplied to the second flow level 153, while a first gas flow P1 is supplied to the first and third flow levels 153, while a window gas flow WP1 is supplied to the upper section 131.

[0058]

[0080] 3 and 4, the first liner 330 includes a shelf 349 that supports the first flow divider 111 (lower flow divider 111). The second liner 350 includes two shelves 378 and 379 that support the second flow divider 111 (middle flow divider 111) and the third flow divider 111 (upper flow divider 111), respectively. The third liner 380 includes a shelf 377 that supports the plate 109.

[0059]

[0081] Figure 5 is a schematic partial top view of the processing apparatus 100 shown in Figure 1, in accordance with one or more embodiments. The section shown in Figure 1 is taken approximately along section 1-1 shown in Figure 5. The section shown in Figure 2 is taken approximately along section 2-2 shown in Figure 5.

[0060]

[0082] FIG. 6 is a schematic partial axonometric view of the inlet side of the processing apparatus 100 shown in FIG. 1, in accordance with one or more embodiments.

[0061]

[0083] Second liner 350 includes one or more outwardly facing inlet openings 371 (two are shown in FIG. 13 below) that extend to second side 354. One or more outwardly facing inlet openings 371 are disposed circumferentially outward of inlet opening 355.

[0062]

[0084] The third liner 380 includes one or more second inlet openings 391 (two are shown in FIG. 16 below) that extend between a first side 383 and a tapered section 385 on a second side 384 of the third liner 380. The one or more second inlet openings 391 are disposed circumferentially outward of the inlet openings 386. An arcuate channel 392 is disposed between the two second inlet openings 391. The arcuate channel 392 extends into the tapered section 385.

[0063]

[0085] Window gas flow WP1 (shown in FIG. 3) is supplied to upper section 131 through one or more second openings 391 and / or arcuate channels 392. Window gas flow WP1 includes one or more purge gases (such as the same or different purge gases as second gas flow P2). Window gas flow WP1 flows from injector 310 to one or more second inlet openings 391 and then to one or more second inlet openings 391 in third liner 380. Gas flows through one or more second inlet openings 391 to arcuate channels 392 and / or upper section 131.

[0064]

[0086] Figure 7 is a schematic partial axonometric cross-sectional view of the inlet side of the processing apparatus 100 shown in Figure 1, in accordance with one or more embodiments. The section shown in Figure 7 is taken approximately along section 7-7 shown in Figure 5. Second inlet opening 363 includes an open section 763 extending between outer surface 352 and a recessed section 764 extending to inner surface 351.

[0065]

[0087] Figure 8 is a schematic partial cross-sectional side view of the cross-flow side of the processing apparatus 100 shown in Figure 1, in accordance with one or more embodiments. The section shown in Figure 8 is taken approximately along section 8-8 shown in Figure 5.

[0066]

[0088] Injector 310 includes a plurality of side injection openings 813 (including a first row, e.g., a lower row, of one or more side injection openings 813 and a second row, e.g., an upper row, of one or more side injection openings 813) extending between inner surface 311 and outer surface 312. In one or more embodiments, side injection openings 813 include openings. Side injection openings 813 are in fluid communication (e.g., using one or more conduits) with one or more gas sources (such as one or more gas sources 196).

[0067]

[0089] The first liner 330 includes one or more side injection openings 835 on the cross-flow side of the first liner 330. The one or more side injection openings 835 extend to the inner surface 331 and the second side surface 334 of the first liner 330. In one or more embodiments, the one or more side inlet openings 835 of the first liner 330 include a recess. In one or more embodiments, the one or more side inlet openings 835 include one or more recesses.

[0068]

[0090] The second liner 350 includes a plurality of side inlet openings 855 on the crossflow side of the second liner 350. The plurality of side inlet openings 855 of the second liner 350 extend to the exterior surface 352 of the second liner 350. In one or more embodiments, the side inlet openings 855 include recesses.

[0069]

[0091] The third liner 380 includes one or more side inlet openings 886 on a cross-flow side of the third liner 380. The one or more side inlet openings 886 in the third liner 380 extend to a first side 383 of the third liner 380. The one or more side inlet openings 886 in the third liner 380 extend to an inner surface 381 of the third liner 380. In one or more embodiments, the one or more side inlet openings 886 in the third liner 380 include a recess.

[0070]

[0092] A third gas flow P3 is supplied to the side injection opening 813 and flows through the side inlet opening 855, through one or more side inlet openings 835 and one or more side inlet openings 886, respectively. The third gas flow P3 then flows into the processing space 128 in a cross-flow relative to the first gas flow P1. The third gas flow P3 includes one or more process gases (e.g., the same or different process gas(es) as the first gas flow P1) to provide a cross-flow relative to the first gas flow P1.

[0071]

[0093] Figure 9 is a schematic partial cross-sectional side view of the cross-flow side of the processing apparatus 100 shown in Figure 1, in accordance with one or more embodiments. The section shown in Figure 8 is taken approximately along section 8-8 shown in Figure 5. The one or more outlet openings 387 of the third liner 380 include a passage section 389 extending between the concave section 388 and the tapered section 385.

[0072]

[0094] FIG. 10 is a schematic, partial axonometric cross-sectional view of the processing apparatus 100 shown in FIG. 1 in accordance with one or more embodiments. The section shown in FIG. 10 is taken approximately along section 10-10 shown in FIG. 6. A first alignment pin 1001 is disposed between the first liner 330 and the second liner 350. The first alignment pin 1001 facilitates alignment of the first liner 330 and the second liner 350 with one another and facilitates reducing or preventing relative rotation between the first liner 330 and the second liner 350. The first alignment pin 1001 is disposed within a retention opening 1002 formed in the second side 334 of the first liner 330 and a retention opening 1003 formed in the first side 353 of the second liner 350.

[0073]

[0095] A second alignment pin 1005 is disposed between the second liner 350 and the third liner 380. The second alignment pin 1005 facilitates aligning the second liner 350 and the third liner 380 with one another and facilitates reducing or preventing relative rotation between the second liner 350 and the third liner 380. The second alignment pin 1005 is disposed within a retention opening 1006 formed in the second side 354 of the second liner 350 and a retention opening 1007 formed in the first side 383 of the third liner 380. In one or more embodiments, the first and second alignment pins 1001, 1005 are formed from quartz.

[0074]

[0096] The second liner 350 is partially shown in ghost form in FIG. 10 for visual clarity.

[0075]

[0097] Figure 11 is a schematic axonometric top view of the first liner 330 shown in Figures 1-10, according to one or more embodiments. In the view shown in Figure 11, the inlet side of the first liner 330 is at the front of the view 1101 and the outlet side of the first liner 330 is at the rear of the view 1102.

[0076]

[0098] Figure 12 is a schematic axonometric bottom view of the first liner 330 shown in Figures 1-10, according to one or more embodiments. In the view shown in Figure 12, the inlet side of the first liner 330 is at the front of the view 1201 and the outlet side of the first liner 330 is at the rear of the view 1202.

[0077]

[0099] 11 and 12, multiple passage sections 339 are shown separated by beams 340. Multiple protrusions 341 protrude to separate portions of the recessed sections 338. In one or more embodiments, the top surfaces of the protrusions 341 are part of the second side surface 334. The first liner 330 includes a second recessed section 342 extending to the inner surface 331 and the first side surface 333. The passage section 339 extends between the recessed section 338 and the second recessed section 342. The first liner 330 includes a recess 343 formed on the inlet side, allowing the insert 301 to extend at least partially therethrough.

[0078]

[0100] Figure 13 is a schematic axonometric top view of the second liner 350 shown in Figures 1-10, according to one or more embodiments. In the view shown in Figure 13, the inlet side of the second liner 350 is at the front of the view 1301 and the outlet side of the second liner 350 is at the rear of the view 1302.

[0079]

[0101] As shown in FIG. 13, the plurality of second inlet openings 363 in the second liner are at least partially aligned between the columns of first inlet openings 355 in the second liner 350 .

[0080]

[0102] Figure 14 is a schematic axonometric bottom view of the second liner 350 shown in Figures 1-10, according to one or more embodiments. In the view shown in Figure 14, the outlet side of the second liner 350 is at the front 1401 of the view and the inlet side of the second liner 350 is at the rear 1402 of the view.

[0081]

[0103] Figure 15 is a schematic axonometric top view of the third liner 380 shown in Figures 1-10, according to one or more embodiments. In the view shown in Figure 15, the inlet side of the third liner 380 is at the front 1501 of the view and the outlet side of the third liner 380 is at the rear 1502 of the view.

[0082]

[0104] Figure 16 is a schematic axonometric bottom view of the third liner 380 shown in Figures 1-10, according to one or more embodiments. In the view shown in Figure 16, the inlet side of the third liner 380 is at the front 1601 of the view and the outlet side of the third liner 380 is at the rear 1602 of the view.

[0083]

[0105] The third liner 380 includes one or more handling openings 392 a, 392 b (two are shown) formed in the tapered section 385. The one or more handling openings 392 a, 392 b can be manipulated (e.g., using a user's hands and / or using tools and / or a robot) to lift, lower, and otherwise position the third liner 380. The third liner 380 includes an outlet slot 393 that extends to the second side 384.

[0084]

[0106] FIG. 17 is a schematic partial axonometric view of the outlet side of the processing apparatus 100 shown in FIG. 1, in accordance with one or more embodiments.

[0085]

[0107] In one embodiment shown in Figure 17, the outlet slot 393 is omitted and the passage section 389 is circular (the slot shape is shown in Figures 15 and 16). In one embodiment shown in Figure 17, the arcuate channel 392 is omitted, the one or more outer inlet openings 371 are omitted, and the one or more handling openings 392a, 392b extend to the inner surface 381.

[0086]

[0108] FIG. 18 is a schematic partial axonometric view of the inlet side of the processing apparatus 100 shown in FIG. 17, in accordance with one or more embodiments.

[0087]

[0109] FIG. 19 is a schematic partial front view of the injector 310 shown in FIG. 5, according to one or more embodiments.

[0088]

[0110] The plurality of first injection openings 313 (arranged as a first row 314 and a second row 315) are arranged as five columns, as shown in Figure 19. In one or more embodiments, at least one (e.g., at least some) of the plurality of second injection openings 316 (having four columns and designated as 316C in Figures 5 and 19) is at least partially aligned between the columns of first injection openings 313. In one or more embodiments, at least one (e.g., at least some) of the plurality of second injection openings 316 of injector 310 (designated as 316A in Figures 5 and 19) is aligned circumferentially outward of the first injection openings 313. In one or more embodiments, at least one (e.g., at least some) of the multiple second injection openings 316 of the injector 310 (shown as numeral 316B in Figures 5 and 19) is oriented upward to supply window gas flow WP1 to the outer inlet opening 371 and / or the second inlet opening 391.

[0089]

[0111] The subject matter described herein facilitates providing multiple zones of gas flow that can be independently controlled and adjusted for process uniformity. As one example, the first row 314 of first injection openings 313 facilitates five zones of gas flow for a first gas flow P1 supplied to a first (e.g., lower) flow level 153. The first gas flow P1 thereby has five zones of gas flow over a first (e.g., lower) substrate 107 aligned with the first flow level 153. As another example, the second row 315 of first injection openings 313 facilitates five zones of gas flow for a first gas flow P1 supplied to a third (e.g., upper) flow level 153. As another example, the second injection opening 316C facilitates four zones of gas flow for a second gas flow P2 supplied to a second (e.g., middle) flow level 153. The zones can be independently adjusted and controlled to promote uniformity of process parameters.

[0090]

[0112] 20 is a simplified schematic view of an enlarged inlet side of a processing device 2000, according to one or more embodiments. Processing device 2000 is similar to processing device 100 shown in FIGS. 1-3, including one or more aspects, features, components, characteristics, and / or operations thereof.

[0091]

[0113] The process kit of the processing apparatus 2000 includes an injector 310 , a first liner 2030 , a second liner 2050 , and a third liner 2080 .

[0092]

[0114] The first liner 2030 includes an inner surface 2031, an outer surface 2032, a first side surface 2033, and a second side surface 2034. The first liner 2030 includes a plurality of inlet openings 2035 on an inlet side of the first liner 2030. The plurality of inlet openings 2035 extend to the inner surface 2031 and the second side surface 2034 of the first liner 2030. In one or more embodiments, the inlet openings 2035 of the first liner 2030 include a recessed section 2036 extending to the outer surface 2032 and an open section 2037 extending between the recessed section 2036 and the inner surface 2031. The inlet openings 2035 of the first liner 2030 are aligned with the first inlet openings 313 of the first row 314.

[0093]

[0115] The second liner 2050 includes an inner surface 2051, an outer surface 2052, and a plurality of inlet openings 2055 on the inlet side of the second liner 2050. The plurality of inlet openings 2055 of the second liner 2050 extend between the outer surface 2052 and the inner surface 2051 of the second liner 350. The inlet openings 2055 align with the second inlet opening 316 of the injector 310. In one or more embodiments, the inlet openings 2055 include openings.

[0094]

[0116] The third liner 2080 includes an inner surface 2081, an outer surface 2082, a first side surface 2083, a second side surface 2084, and a plurality of inlet openings 2086 on an inlet side of the third liner 2080. The plurality of inlet openings 2086 of the third liner 2080 extend to the first side surface 2083 of the third liner 2080. The plurality of inlet openings 2086 of the third liner 2080 extend to the inner surface 2081 of the third liner 2080. In one or more embodiments, the plurality of inlet openings 2086 of the third liner 2080 includes a recessed section 2087 extending to the outer surface 2082 and the first side surface 2083, and an open section 2088 extending between the recessed section 2087 and the inner surface 2081. The inlet opening 2086 of the third liner 2080 is aligned with the first injection opening 313 of the second row 315 .

[0095]

[0117] FIG. 21 is a simplified diagram of an expanded view of the outlet side of the processing device 2000 shown in FIG. 20, according to one or more embodiments.

[0096]

[0118] The first liner 2030 includes one or more outlet openings 2041 on an outlet side of the first liner 2030. In one or more embodiments, the one or more outlet openings 2041 include one or more passage sections 2043 (a single combined passage section 2043 is shown in FIG. 21 ) extending between the first side 2033 and the second side 2034, and multiple opening sections 2044 extending between the inner surface 2031 and the one or more passage sections 2043.

[0097]

[0119] The second liner 2050 includes one or more outlet openings 2056 on an outlet side of the second liner 2050. In one or more embodiments, the one or more outlet openings 2056 include one or more passage sections 2057 (a single combined passage section 2057 is shown in FIG. 21 ) extending between the first side 2053 and the second side 2054, and multiple opening sections 2058 extending between the inner surface 2051 and the one or more passage sections 2057.

[0098]

[0120] The third liner 2080 includes one or more outlet openings 2090 on an outlet side of the third liner 2080. In one or more embodiments, the one or more outlet openings 2090 include one or more recessed sections 2091 (a single combined passage section 2091 is shown in FIG. 21 ) extending to the first side 2083 and a plurality of open sections 2092 extending between the inner surface 2081 and the one or more recessed sections 2091.

[0099]

[0121] FIG. 22 is a schematic partial cross-sectional side view of the cross-flow side of the processing apparatus 2000 shown in FIGS. 20 and 21, according to one or more embodiments.

[0100]

[0122] The first liner 2030 includes one or more side inlet openings 2235 on a crossflow side of the first liner 2030. In one or more embodiments, the one or more side inlet openings 2235 include one or more recessed sections 2236 extending to the second side surface 2034 and the outer surface 2032, and one or more open sections 2237 extending between the one or more recessed sections 2236 and the inner surface 2031.

[0101]

[0123] The third liner 2080 includes one or more side inlet openings 2285 on a cross-flow side of the third liner 2080. The one or more side inlet openings 2285 of the third liner 2080 extend to a first side 2083 of the third liner 2080. In one or more embodiments, the one or more side inlet openings 2285 include one or more recessed sections 2286 extending to the first side 2083 and the outer surface 2082, and one or more open sections 2287 extending between the one or more recessed sections 2286 and the inner surface 2081.

[0102]

[0124] The second liner 2050 fluidly separates the third gas flow P3 in the one or more side inlet openings 2235 from the third gas flow P3 in the one or more side inlet openings 2285.

[0103]

[0125] 20-22, the first liner 2030 includes two shelves 2048, 2049 that respectively support the first flow diverter 111 (lower flow diverter 111) and the second flow diverter 111 (middle flow diverter 111). The third liner 2080 includes two shelves 2098, 2099 that respectively support the third flow diverter 111 (upper flow diverter 111) and the plate 109.

[0104]

[0126] FIG. 23 is a schematic block diagram of a method 2300 of processing a substrate for semiconductor manufacturing, according to one embodiment.

[0105]

[0127] A step 2302 of the method 2300 includes placing one or more substrates within a processing space of a chamber.

[0106]

[0128] Step 2304 includes heating one or more substrates. It is contemplated that step 2304 may occur before, after, and / or simultaneously with step 2306.

[0107]

[0129] Step 2306 includes flowing gases into the processing space, which can include, for example, one or more of a first gas flow P1, a second gas flow P2, a third gas flow P3, and / or a window gas flow WP1.

[0108]

[0130] Step 2310 includes simultaneously depositing one or more layers onto each of one or more substrates.

[0109]

[0131] Step 2312 includes evacuating the gas from the processing space. During the flowing of step 2306 and / or the evacuating of step 2312, the gas(es) may follow various flow paths described herein.

[0110]

[0132] Advantages of the present disclosure include modularity in providing gas flow, assured gas flow uniformity of gas parameters (e.g., gas concentration, gas temperature, and / or flow rate), parameter control and tunability (e.g., zone tunability), thermal uniformity, and deposition uniformity (e.g., center-to-edge film thickness uniformity). Such advantages can facilitate relatively complex deposition processes, such as batch processing processes in which multiple substrates are processed simultaneously. Additional advantages include increased film growth rates and improved device performance.

[0111]

[0133] It is contemplated that one or more aspects disclosed herein may be combined. As an example, one or more aspects, features, components, operations, and / or properties of the processing device 100, the controller 1070, the injector 310, the first liner 330 of the embodiment shown in Figures 13 and 14, the second liner 350, the third liner 380 of the embodiment shown in Figures 15 and 16, the second liner 350 of the embodiment shown in Figures 17 and 18, the third liner 380 of the embodiment shown in Figures 17 and 18, the processing device 2000, the first liner 2030, the second liner 2050, the third liner 2080, and / or the method 2300 may be combined. Furthermore, it is contemplated that one or more aspects disclosed herein may include some or all of the advantages described above.

[0112]

[0134] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the basic scope thereof, which scope is defined by the following claims.

Claims

1. 1. A process kit adaptable to be disposed in a processing chamber, comprising:

1. An injector comprising: Inner side, an outer surface opposite said inner surface; a plurality of first inlet openings extending between the inner surface and the outer surface, the plurality of first inlet openings including a first row of the first inlet openings and a second row of the first inlet openings; and an injector including a plurality of second injection openings extending between the inner surface and the outer surface, the plurality of second injection openings being aligned between the first and second rows of first injection openings; a first liner sized and shaped to be placed inside the syringe; Inner side, an outer surface of the first liner opposite the inner surface; a first side between the inner surface of the first liner and the outer surface of the first liner; a second side between the inner surface of the first liner and the outer surface of the first liner, the second side being opposite the first side; a plurality of inlet openings on an inlet side of the first liner, the plurality of inlet openings extending to the inner surface and the second side surface of the first liner; and a first liner including one or more outlet openings on an outlet side of the first liner, the outlet side being opposite the inlet side, the one or more outlet openings extending to the inner surface of the first liner; and a second liner sized and shaped to be at least partially supported by the first liner, Inner side, an outer surface of the second liner opposite the inner surface; a first side between the inner surface of the second liner and the outer surface of the second liner; a second side between the inner surface of the second liner and the outer surface of the second liner, the second side of the second liner being opposite the first side of the second liner; a plurality of inlet openings on an inlet side of the second liner, the plurality of inlet openings in the second liner extending to the outer surface of the second liner; and 10. A process kit comprising: a second liner, the second liner including one or more outlet openings on an outlet side of the second liner, the outlet side of the second liner being opposite the inlet side of the second liner, the one or more outlet openings of the second liner extending to the inner surface of the second liner.

2. 10. The process kit of claim 1, wherein at least one of the plurality of second injection openings of the injector is at least partially aligned between columns of the first injection openings.

3. The process kit of claim 1 , wherein at least one of the plurality of second injection openings of the injector is aligned circumferentially outward of the first injection opening.

4. The process kit of claim 3 , wherein the first injection opening and the second injection opening each comprise an opening.

5. The one or more outlet openings of the first liner include: a recessed section extending into the inner surface of the first liner; and The process kit of claim 1 , including a passageway section extending into the recessed section.

6. The process kit of claim 5 , wherein the plurality of inlet openings of the first liner comprise recesses.

7. The plurality of inlet openings in the second liner include: a first row extending to the first side of the second liner and configured to align with the first row of first injection openings of the injector; and 10. The process kit of claim 1, further comprising a second row extending to the second side of the second liner and configured to align with the second row of the first injection openings of the injector.

8. The plurality of inlet openings in the second liner include: a plurality of first inlet openings including the first row and the second row of the second liner; and 8. The process kit of claim 7, comprising a plurality of second inlet openings extending between the inner surface of the second liner and the outer surface of the second liner, the plurality of second inlet openings of the second liner configured to align with the second injection openings of the injector.

9. 9. The process kit of claim 8, wherein the first row of the plurality of first inlet openings in the second liner includes a first recess extending into the outer surface and the first side surface of the second liner, and the second row of the plurality of first inlet openings in the second liner includes a second recess extending into the outer surface and the second side surface of the second liner.

10. The one or more outlet openings of the second liner include: a passage section extending between the first side and the second side of the second liner; and The process kit of claim 9 , including an opening section extending between the inner surface of the second liner and the passage section of the second liner.

11. and a third liner sized and shaped to be at least partially supported by the second liner, the third liner comprising: Inner side, an outer surface of the third liner opposite the inner surface; a first side between the inner surface of the third liner and the outer surface of the third liner; a second side between the inner surface of the third liner and the outer surface of the third liner, the second side of the third liner being opposite the first side, the second side of the third liner including a tapered section; a plurality of inlet openings on an inlet side of the third liner, the plurality of inlet openings in the third liner extending to the first side of the third liner; and 10. The process kit of claim 1, comprising one or more outlet openings on an outlet side of the third liner, the outlet side of the third liner opposite the inlet side of the third liner, the one or more outlet openings of the third liner extending to the inner surface of the third liner.

12. 12. The process kit of claim 11, wherein the plurality of inlet openings of the third liner extend to the inner surface of the third liner and the one or more outlet openings of the third liner extend to the first side surface of the third liner.

13. 13. The process kit of claim 12, wherein the plurality of inlet openings in the third liner comprise recesses and the one or more outlet openings in the third liner comprise recessed sections extending to the inner surface and the first side surface of the third liner.

14. 14. The process kit of claim 13, wherein the third liner further comprises one or more second inlet openings extending between the first side and the tapered section of the second side, and the one or more outlet openings of the third liner further include a passage section extending between the recessed section and the tapered section.

15. 1. A liner adaptable for placement in a processing chamber, comprising: Inside an outer surface opposite said inner surface; a first side between the inner surface and the outer surface; a second side between the inner surface and the outer surface, the second side being opposite the first side; a plurality of inlet openings on an inlet side extending to the outer surface, the plurality of inlet openings comprising: a plurality of first inlet openings including a first row extending to the first side and a second row extending to the second side; and a plurality of inlet openings, including a plurality of second inlet openings extending between the inner surface and the outer surface; and A liner including one or more outlet openings on an outlet side, said outlet side being opposite said inlet side and extending into said interior surface.

16. The liner of claim 15 , wherein the plurality of second inlet openings are at least partially aligned between columns of the first inlet openings.

17. 17. The liner of claim 16, wherein the first row of the plurality of first inlet openings includes a first recess extending into the outer surface and the first side surface, and the second row of the plurality of first inlet openings includes a second recess extending into the outer surface and the second side surface.

18. The one or more outlet openings a passageway section extending between the first side and the second side; and The liner of claim 17 including an opening section extending between the inner surface and the passage section.

19. 1. A processing chamber applicable for use in semiconductor manufacturing, comprising: A chamber body having an interior space and an injector, the injector comprising: Inner side, an outer surface opposite said inner surface; a plurality of first inlet openings extending between the inner surface and the outer surface, the plurality of first inlet openings including a first row of the first inlet openings and a second row of the first inlet openings; and a chamber body comprising an injector including a plurality of second injection openings extending between the inner surface and the outer surface, the plurality of second injection openings aligned between the first and second rows of the first injection openings; one or more heat sources configured to generate heat; a substrate support assembly disposed within the interior space, a plurality of lift pins; and a substrate support assembly comprising one or more substrate supports; a first liner disposed inside the injector, Inner side, an outer surface of the first liner opposite the inner surface; a first side between the inner surface of the first liner and the outer surface of the first liner; a second side between the inner surface of the first liner and the outer surface of the first liner, the second side being opposite the first side; a plurality of inlet openings on an inlet side of the first liner, the plurality of inlet openings extending to the inner surface and the second side surface of the first liner; and a first liner including one or more outlet openings on an outlet side of the first liner, the outlet side being opposite the inlet side, the one or more outlet openings extending to the inner surface of the first liner; and a second liner at least partially supported by the first liner, Inner side, an outer surface of the second liner opposite the inner surface; a first side between the inner surface of the second liner and the outer surface of the second liner; a second side between the inner surface of the second liner and the outer surface of the second liner, the second side of the second liner being opposite the first side of the second liner; a plurality of inlet openings on an inlet side of the second liner, the plurality of inlet openings in the second liner extending to the outer surface of the second liner; and 1. A processing chamber comprising a second liner including one or more outlet openings on an outlet side of the second liner, the outlet side of the second liner being opposite the inlet side of the second liner.

20. 20. The processing chamber of claim 19, wherein the one or more outlet openings in the second liner extend to the interior surface of the second liner.

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