Nozzle mechanism and sealing device for chip manufacturing

The nozzle mechanism synchronizes piping rotation with the rotor using a seal structure and bearings to address tangling and wear issues, ensuring smooth operation in chip manufacturing.

JP2026504157APending Publication Date: 2026-02-03CHIPMORE TECH CORP LTD +1
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Patent Information

Application Number
JP2025543149
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-09-26
Filing Date
2024-08-08
Publication Date
2026-02-03

AI Technical Summary

Technical Problem

During chip manufacturing, nozzles used in inner lead bonding machines rotate significantly, causing friction and wear on the connected piping, which can lead to tangling and reduced functionality.

Method used

A nozzle mechanism with a coupling assembly that allows the piping to rotate synchronously with the rotor, featuring a seal structure and rotating bearings to prevent tangling and wear, ensuring smooth operation.

Benefits of technology

Prevents piping from tangling and wear by synchronizing its rotation with the nozzle, maintaining functionality and stability during the manufacturing process.

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Abstract

A nozzle mechanism and sealing device for chip manufacturing, the nozzle mechanism including a nozzle, a coupling assembly, and piping. The coupling assembly includes a rotor having a transition space and a support. An intake hole communicating with the transition space is formed on the surface of the rotor facing the support, and the support is positioned to cover the intake hole of the rotor. The rotor is rotatable in the circumferential direction of the rotor relative to the support, and a seal structure is provided between the rotor and the support to block communication between the intake hole and the outside. The support has a support air hole communicating with the intake hole. The piping connects the nozzle to the transition space, and rotates synchronously with the rotor and the nozzle. The present invention designs the coupling assembly as a rotor and support that can rotate relatively, and connects the piping connected to the nozzle to the transition space of the rotor, thereby preventing tangling and wear of the piping during nozzle rotation.
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Description

[Technical Field]

[0001] The present invention is based on and claims priority from a Chinese patent application with application number 202311253348.7 and filing date September 26, 2023, the entire contents of which are incorporated herein by reference.

[0002] The present invention relates to the field of chip manufacturing, and more particularly to nozzle mechanisms and sealing devices for chip manufacturing. [Background technology]

[0003] During chip manufacturing, chips must be transported. To avoid damage to the components being transported, vacuum suction is typically used to attach the components to a nozzle. To achieve this, a pipe is typically connected to the nozzle, and the nozzle's exhaust hole creates a negative pressure environment under vacuum suction, allowing the components to be attached.

[0004] During the transfer process, nozzles typically rotate significantly as needed. For example, the nozzles of inner lead bonding machines rotate 180 degrees during operation. This movement causes friction between the piping connected to the nozzle end and the nozzle's connecting rod, resulting in wear on the piping over time. Furthermore, to prevent the piping from restricting the nozzle's rotation, the piping is typically designed to be long. However, this structure makes the piping prone to tangling as the nozzle rotates, affecting nozzle use.

[0005] The description of existing art herein does not confirm or suggest that such existing art forms part of the common general knowledge in any jurisdiction, nor does it suggest that such existing art would be understood by, considered relevant, and / or could reasonably be expected to be combined with other existing art by a person skilled in the art. Summary of the Invention

[0006] The present invention aims to provide a nozzle mechanism for chip manufacturing that overcomes the shortcomings of the prior art. The present invention allows the piping to rotate synchronously with the rotor, so that when the nozzle rotates in an inverted direction, the nozzle rotates the piping, and the piping rotates the rotor, thereby preventing the piping from becoming tangled or worn.

[0007] The nozzle mechanism for chip manufacturing provided by the present invention includes a nozzle, a coupling assembly, and piping.

[0008] The coupling assembly includes a rotating body having a transition space and a support body, and an intake hole communicating with the transition space is formed on the surface of the rotating body facing the support body, and the support body is positioned so as to cover the intake hole of the rotating body.

[0009] The rotor is rotatable in the circumferential direction of the rotor relative to the support, and a seal structure is provided between the rotor and the support to block communication between the intake hole and the outside. The support is provided with a support air hole that communicates with the intake hole. The piping communicates the nozzle with the transition space, and the piping rotates in synchronization with the rotor and the nozzle.

[0010] Furthermore, the outer contour of the rotating body is cylindrical overall, the rotating body and the support are arranged in a row along the axial direction of the rotating body, a rotation support portion is provided on the surface of the support facing the rotating body, and the rotating body is fitted outside the rotation support portion and can rotate along the circumferential direction of the rotating support.

[0011] Furthermore, the sealing structure includes an annular groove and an annular protrusion that fits into the annular groove, the annular groove and the annular protrusion being provided on the rotating body and the support body, respectively, and the annular groove or the annular protrusion being provided to surround the intake hole.

[0012] Furthermore, a plurality of the annular grooves are provided on the surface of the rotor facing the support body, and the plurality of annular grooves are provided concentrically.

[0013] The annular protrusion is provided in a plurality of concentric circles on the surface of the support body facing the rotor, and the annular groove is provided so as to surround the intake hole.

[0014] Furthermore, the joint assembly further includes a rotary bearing, the rotary bearing having a fixed ring and a movable ring positioned coaxially, the movable ring being rotatable relative to the fixed ring in the circumferential direction of the movable ring, the fixed ring being fixed to the support, and the movable ring being attached and fixed to the rotating body.

[0015] Furthermore, a protruding attachment portion is formed on the surface of the support body facing the rotating body, and the movable ring is fitted onto the outside of the protruding attachment portion and fixed to the protruding attachment portion.

[0016] The rotating body is provided with a bearing groove, the bearing groove is provided on the surface of the rotating body facing the support body, the intake hole is connected to the bearing groove, the intake hole has an inlet located at the bottom of the bearing groove, and the movable ring is disposed in the bearing groove.

[0017] Furthermore, the coupling assembly further has a secondary support provided on the surface of the rotating body opposite to the support body, the rotating body is rotatable relative to the secondary support body in the circumferential direction of the rotating body, the rotating body is rotatably attached between the support body and the secondary support body, and the coupling assembly has a seal structure provided between the secondary support body and the rotating body.

[0018] Furthermore, a secondary rotating bearing is provided between the rotating body and the secondary support, and the secondary rotating bearing has a secondary fixed ring and a secondary movable ring, the secondary movable ring is rotatable in the circumferential direction relative to the secondary fixed ring, the secondary fixed ring is fixed to the secondary support, and the secondary movable ring is attached and fixed to the rotating body.

[0019] The secondary support is provided with a secondary support protrusion, the secondary fixed ring is fixed to the secondary support protrusion, a secondary bearing groove is provided on the surface of the rotating body facing the secondary support, and the secondary movable ring is arranged in the secondary bearing groove.

[0020] Furthermore, the rotor has a pipe connection hole extending along the radial direction, the pipe connection hole communicates with the transition space, and the pipe communicates with the pipe connection hole.

[0021] The nozzle mechanism for manufacturing chips further includes a drive unit that rotates the nozzle, and the center of rotation of the nozzle and the center of rotation of the rotor are positioned coaxially.

[0022] Another embodiment of the present invention further discloses a sealing apparatus including the nozzle mechanism for chip manufacturing.

[0023] Compared with the prior art, the present invention designs the coupling assembly as a rotating body and a support that can rotate relatively, and the pipe connected to the nozzle communicates with the transition space of the rotating body, so that the pipe can rotate synchronously with the rotating body. When the nozzle reverses, the nozzle can rotate the pipe, and the pipe can rotate the rotating body, thereby preventing the pipe from tangling and wearing.

[0024] As used herein, the term "comprise" and variations thereof, such as "comprises", "comprised", "comprising", "including" and "containing", does not exclude other features, components, elements or steps unless the context clearly requires otherwise. [Brief explanation of the drawings]

[0025] [Figure 1] FIG. 1 is a first 3D view of a nozzle mechanism for manufacturing chips according to an embodiment of the present invention. [Figure 2] FIG. 2 is a second three-dimensional view of the nozzle mechanism for manufacturing chips disclosed in the embodiment of the present invention. [Figure 3] FIG. 3 is a schematic diagram of the internal structure of a nozzle mechanism for manufacturing chips disclosed in an embodiment of the present invention. [Figure 4] FIG. 4 is a structural schematic diagram of a rotating body in a nozzle mechanism for manufacturing chips disclosed in an embodiment of the present invention. [Figure 5] FIG. 5 is a plan view of a nozzle mechanism for manufacturing chips according to an embodiment of the present invention. [Figure 6] FIG. 6 is a cross-sectional view taken along the line AA in FIG. [Figure 7] FIG. 7 is a structural schematic diagram of a support in a nozzle mechanism for manufacturing chips disclosed in an embodiment of the present invention. [Figure 8] FIG. 8 is a front view of a support in a nozzle mechanism for manufacturing chips according to an embodiment of the present invention. [Figure 9] FIG. 9 is a cross-sectional view taken along the line BB in FIG. [Explanation of symbols]

[0026] 1 - nozzle, 2 - coupling assembly, 20 - transition space, 21 - rotating body, 211 - intake hole, 212 - bearing groove, 213 - secondary bearing groove, 214 - piping connection hole, 22 - support, 221 - rotating support part, 222 - support air hole, 223 - protruding mounting part, 23 - sealing structure, 231 - annular groove, 232 - annular protrusion, 24 - rotating bearing, 241 - fixed ring, 242 - movable ring, 25 - secondary support, 251 - secondary support protrusion, 26 - secondary rotating bearing, 261 - secondary fixed ring, 262 - secondary movable ring, 3 - piping, 4 - drive unit. DETAILED DESCRIPTION OF THE INVENTION

[0027] The following examples described with reference to the drawings are illustrative and are intended to illustrate the present invention only and should not be construed as limiting the present invention.

[0028] The present invention discloses a nozzle mechanism for chip manufacturing. This nozzle mechanism is used in chip production equipment and can be used to manipulate components during the chip manufacturing process. Specifically, the nozzle mechanism for chip manufacturing can be used in an inner lead bonding machine. The nozzle mechanism of an inner lead bonding machine rotates 180° during operation, and the piping connected to the nozzle is prone to wear and tangles as the nozzle mechanism rotates. The nozzle mechanism for chip manufacturing disclosed in the present invention can avoid the above problems. It should be further explained that the nozzle mechanism for chip manufacturing can also be used in other production equipment, such as for manipulating chips and heat sinks.

[0029] As shown in FIGS. 1 to 9, the nozzle mechanism for manufacturing chips disclosed in the present invention includes a nozzle 1 , a joint assembly 2 and a pipe 3 .

[0030] The joint assembly 2 includes a rotating body 21 and a support body 22. The rotating body 21 has a transition space 20, and the rotating body 21 has an air intake hole 211 communicating with the transition space 20, the air intake hole 211 being located on the surface of the rotating body 21 facing the support body 22. The support body 22 is located so as to cover the air intake hole 211 of the rotating body 21.

[0031] The rotor 21 is rotatable in the circumferential direction of the rotor 21 relative to the support 22, and a seal structure 23 is provided between the rotor 21 and the support 22 to block communication between the intake hole 211 and the outside. The support 22 is provided with a support air hole 222 that communicates with the intake hole 211.

[0032] The pipe 3 communicates the nozzle 1 with the transition space 20, and the pipe 3 can move synchronously with the rotor 21.

[0033] In the present invention, the coupling assembly 2 is designed as a rotor 21 and a support 22 that are rotatable relative to each other, and the pipe 3 connected to the nozzle 1 communicates with the transition space 20 of the rotor 21, so that the pipe 3 can rotate synchronously with the rotor 21. When the nozzle 1 reverses, the nozzle 1 rotates the pipe 3, and the pipe 3 can rotate the rotor 21, thereby preventing the pipe 3 from becoming tangled or worn.

[0034] In this embodiment, the pipe 3 has a certain rigidity and does not deform even when subjected to a certain force, so that the pipe 3 functions as a force transmitting tool and can transmit the force generated during the rotation of the nozzle 1 to the rotor 21. Specifically, the pipe 3 may be a metal pipe such as a steel pipe or a stainless steel pipe.

[0035] 3 to 6, the outer contour of the rotor 21 is cylindrical as a whole, the rotor 21 and the support 22 are arranged in a row along the axial direction of the rotor 21, a rotation support part 221 is provided on the surface of the support 22 facing the rotor 21, the rotor 21 is fitted to the outside of the rotation support part 221 and is rotatable in the circumferential direction of the rotation support 221. The rotation support part 221 is cylindrical as a whole and provides stable support for the rotation of the rotor 21.

[0036] 3 to 8, the seal structure 23 includes an annular groove 231 and an annular protrusion 232 that fits into the annular groove 231. One of the annular groove 231 and the annular protrusion 232 is provided on the rotor 21, and the other is provided on the support 22. The annular groove 231 or the annular protrusion 232 on the rotor 21 is provided so as to surround the intake hole 211. A labyrinth seal structure is formed by the combination of the annular groove 231 and the annular protrusion 232. The annular protrusion 232 is movable within the annular groove 231, and both perform the role of a seal while also providing a structure that does not interfere with the restriction of relative rotation between the rotor 21 and the support 22.

[0037] As can be understood, the annular protrusion 232 may be provided on the support 22 or on the rotating body 21. When the annular protrusion 232 is provided on the support 22, the annular groove 231 is provided on the rotating body 21. When the annular protrusion is provided on the rotating body 21, the annular groove is provided on the support 22.

[0038] As shown in FIGS. 3 to 6 , the air intake hole 211 is generally annular, extending along the rotor 21. The air intake hole 211 has an inner ring surface and an outer ring surface, which are arranged radially along the rotor 21, with the outer ring surface being located farther from the center of the rotor 21 than the inner ring surface. Support air holes 222 are provided on the support 22 at locations corresponding to the positions of the air intake holes 211, and the support air holes 222 communicate with the transition space 20 through the air intake holes 211. By providing the air intake holes 211 in an annular configuration, the air intake holes 211 can be positioned so that they always correspond to the positions of the support air holes 222 as the rotor 21 rotates relative to the support 22. The support air holes 222 communicate with a vacuum device to maintain a negative pressure in the transition space 20, allowing the nozzle 1 to adsorb the component.

[0039] To achieve a sealing effect, in one embodiment, the sealing structure 23 further includes an outer sealing structure and an inner sealing structure. The outer sealing structure is disposed on the outer side of the outer ring surface of the air intake hole 211, and the inner sealing structure is disposed on the inner side of the inner ring surface of the air intake hole 211. The outer side of the outer ring surface refers to a position farther from the center of the rotor 21, and the inner side of the inner ring surface refers to a position closer to the center of the rotor 21.

[0040] The above structure actually seals the transition space 20 and the intake hole 211 by providing a seal structure on the outer periphery of the intake hole 211. Of course, in other embodiments, an outer seal structure can be provided on the outside of the outer ring surface of the intake hole 211, and an inner seal structure can also be provided between the rotor 21 and the rotation support part 221 at the same time.

[0041] In this embodiment, the joint assembly 2 further includes a sub-support 25. The sub-support 25 is disposed on the surface of the rotating body 21 opposite to the support 22. The rotating body 21 is rotatable relative to the sub-support 25 along the circumferential direction of the rotating body 21, and the rotating body 21 is rotatably attached between the support 22 and the sub-support 25.

[0042] 3, the sub-support 25 is fixed to the rotation support 221, and the sub-support 25 and the support 22 form a support assembly. The use of the sub-support 25 makes the rotation process of the rotor 21 more stable and smooth. The sub-support 25 is fixed to the end of the rotation support 221 opposite to the support 22. As can be seen, a seal is provided between the sub-support 25 and the rotation support 221 to prevent the transition space 20 from leaking out through the gap at the joining portion between the sub-support 25 and the rotation support 221, thereby achieving a better sealing effect.

[0043] In this embodiment, the seal structure 23 includes a first seal structure provided between the rotor 21 and the support 22, and a second seal structure provided between the rotor 21 and the sub-support 25. The second seal structure has the same design as the first seal structure, and both include an annular protrusion 232 and an annular groove that fits the annular protrusion. The first seal structure and the second seal structure are located in corresponding positions, with the annular groove of the second seal structure located on the surface of the rotor 21 opposite the support 22, and the annular groove of the second seal structure and the annular groove of the first seal structure located back to back on both sides of the rotor 21.

[0044] In this embodiment, a plurality of the annular grooves 231 are provided on the surface of the rotating body 21 facing the support body 22, and the plurality of the annular grooves 231 are provided concentrically. The center of the annular groove 231 is positioned coaxially with the rotation center of the rotating body 21.

[0045] A plurality of the annular protrusions 232 are provided on the surface of the support body 22 facing the rotor 21, and the plurality of the annular protrusions 232 are provided concentrically. The center of the annular protrusion 232 is positioned coaxially with the rotation center of the rotor 21.

[0046] The annular groove 231 is provided so as to surround the intake hole 211. The seal structure 23 is formed by a combination of a plurality of annular protrusions 232 and annular grooves 231, and by employing a combination of a plurality of annular protrusions 232 and annular grooves 231, better sealing can be achieved.

[0047] As shown in Fig. 3, in order to better realize the rotation of the support body 22, the joint assembly 2 further includes a rotation bearing 24. The rotation bearing 24 includes a fixed ring 241 and a movable ring 242. The movable ring 242 is fitted onto the outside of the fixed ring 241, and the movable ring 242 is rotatable in the circumferential direction relative to the fixed ring 241. The fixed ring 241 is fixed to the support body 22, and the movable ring 242 is attached and fixed to the rotating body 21. By using the rotation bearing 24, the relative rotation between the rotating body 21 and the support body 22 becomes smoother.

[0048] In this embodiment, as shown in FIG. 3, the fixed ring 241 and the movable ring 242 are both annular, and the movable ring 242 is arranged concentrically with the fixed ring 241. A ball can be further provided between the fixed ring 241 and the movable ring 242 to realize relative rotation between the two.

[0049] 7, in order to more effectively mount and fix the rotary bearing 24, a protruding mounting portion 223 is formed on the surface of the support body 22 facing the rotor 21. The movable ring 242 is fitted onto the outside of the protruding mounting portion 223 and fixed to the protruding mounting portion 223.

[0050] The rotating body 21 is provided with a bearing groove 212. The bearing groove 212 is provided on the surface of the rotating body 21 facing the support body 22. The air intake hole 211 communicates with the bearing groove 212, and the air intake hole 211 has an inlet located at the bottom of the bearing groove 212. The movable ring 242 is disposed in the bearing groove 212.

[0051] Similarly, in order to better realize the relative rotation between the rotating body 21 and the sub-support 25, a sub-rotating bearing 26 is provided between the rotating body 21 and the sub-support 25. The sub-rotating bearing 26 has a sub-fixed ring 261 and a sub-movable ring 262, and the sub-movable ring 262 is rotatable in the circumferential direction relative to the sub-fixed ring 261. The sub-fixed ring 261 is fixed to the sub-support 25, and the sub-movable ring 262 is attached and fixed to the rotating body 21.

[0052] 3, the sub-support 25 is provided with a sub-support protrusion 251, and the sub-fixed ring 261 is fixed to the sub-support protrusion 251. A sub-bearing groove 213 is provided on the surface of the rotating body 21 facing the sub-support 25, and the sub-movable ring 262 is disposed in the sub-bearing groove 213.

[0053] 4 to 6, the rotor 21 has a piping connection hole 214 extending along the radial direction. The piping connection hole 214 communicates with the transition space 20, and the piping 3 communicates with the piping connection hole 214.

[0054] The nozzle mechanism for manufacturing chips further includes a drive unit 4. The drive unit 4 rotates the nozzle 1. The center of rotation of the nozzle 1 and the center of rotation of the rotating body 21 are positioned coaxially.

[0055] Another embodiment of the present invention discloses a chip sealing apparatus including the above-described chip manufacturing nozzle mechanism.

[0056] The structure, features, and operational effects of the present invention have been described in detail above based on the embodiments shown in the drawings. The above-described are merely preferred embodiments of the present invention, but the present invention is not limited to those shown in the drawings. Any modifications based on the concept of the present invention or equivalent modifications made by equivalent changes shall be within the scope of protection of the present invention as long as they do not exceed the scope encompassed by the description and illustrations.

Claims

1. 1. A nozzle mechanism for manufacturing chips, comprising: a nozzle, a fitting assembly, and a piping; the coupling assembly includes a rotating body and a support body, the rotating body having a transition space, an intake hole communicating with the transition space formed on a surface of the rotating body facing the support body, and the support body being positioned so as to cover the intake hole of the rotating body; The rotor is rotatable in the circumferential direction of the rotor relative to the support, and a seal structure is provided between the rotor and the support to block communication between the intake hole and the outside, the support is provided with a support air hole that communicates with the intake hole, the piping communicates between the nozzle and the transition space, and the piping rotates in synchronization with the rotor and the nozzle. Nozzle mechanism for chip manufacturing.

2. The outer contour of the rotating body is cylindrical as a whole, the rotating body and the support are arranged in a line along the axial direction of the rotating body, a rotation support portion is provided on the surface of the support facing the rotating body, the rotating body is fitted to the outside of the rotation support portion and is rotatable along the circumferential direction of the rotation support.

2. The nozzle mechanism for chip manufacturing according to claim 1.

3. The seal structure includes an annular groove and an annular protrusion that fits into the annular groove, one of the annular groove and the annular protrusion being provided on the rotating body and the other being provided on the support body, and the annular groove or the annular protrusion being provided so as to surround the intake hole.

3. The nozzle mechanism for chip manufacturing according to claim 2.

4. a plurality of the annular grooves are provided on a surface of the rotating body facing the support body, and the plurality of annular grooves are provided concentrically; A plurality of the annular protrusions are provided on the surface of the support body facing the rotor, and the plurality of annular protrusions are provided concentrically, and the annular groove is provided so as to surround the intake hole.

4. The nozzle mechanism for chip manufacturing according to claim 3.

5. The joint assembly further includes a rotary bearing, the rotary bearing having a fixed ring and a movable ring positioned coaxially, the movable ring being rotatable relative to the fixed ring in a circumferential direction of the movable ring, the fixed ring being fixed to the support, and the movable ring being attached and fixed to the rotating body.

2. The nozzle mechanism for chip manufacturing according to claim 1.

6. a protruding attachment portion is formed on a surface of the support body facing the rotating body, the movable ring is fitted onto the outside of the protruding attachment portion and fixed to the protruding attachment portion, The rotating body is provided with a bearing groove, the bearing groove being provided on a surface of the rotating body facing the support body, the intake hole communicating with the bearing groove, the intake hole having an inlet located at the bottom of the bearing groove, and the movable ring being disposed within the bearing groove.

6. The nozzle mechanism for manufacturing chips according to claim 5.

7. The joint assembly further includes a sub-support provided on a surface of the rotating body opposite to the support body, the rotating body being rotatable relative to the sub-support body along a circumferential direction of the rotating body, the rotating body being rotatably attached between the support body and the sub-support body, and the joint assembly having a seal structure provided between the sub-support body and the rotating body.

2. The nozzle mechanism for chip manufacturing according to claim 1.

8. a secondary rotary bearing is provided between the rotating body and the secondary support, the secondary rotary bearing has a secondary fixed ring and a secondary movable ring, the secondary movable ring is rotatable in a circumferential direction relative to the secondary fixed ring, the secondary fixed ring is fixed to the secondary support, and the secondary movable ring is attached and fixed to the rotating body; The secondary support is provided with a secondary support protrusion, the secondary fixed ring is fixed to the secondary support protrusion, the rotating body has a secondary bearing groove on a surface facing the secondary support, and the secondary movable ring is disposed in the secondary bearing groove.

8. The nozzle mechanism for manufacturing chips according to claim 7.

9. the rotor has a piping connection hole extending along a radial direction, the piping connection hole communicates with the transition space, and the piping communicates with the piping connection hole; The nozzle mechanism for chip manufacturing further includes a drive unit, which drives the nozzle to rotate, and the center of rotation of the nozzle and the center of rotation of the rotor are positioned coaxially.

2. The nozzle mechanism for chip manufacturing according to claim 1.

10. A sealing device comprising a nozzle mechanism for chip manufacturing according to any one of claims 1 to 9. Sealing device.

Citation Information

Patent Citations

  • Semiconductor chip-sucking device

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