Shower head for organometallic chemical vapor deposition

Abstract

The present invention relates to a shower head for organometallic chemical vapor deposition, and includes a plurality of injection lines formed in which injection parts are connected to a gas supply line so that the gas is transported independently, and a fine hole formed on one side of the injection part so as to spray the gas onto a workpiece, wherein the plurality of injection lines are arranged in a winding shape adjacent to each other.

Description

Technical Field

[0001] The present invention relates to a shower head for metal-organic chemical vapor deposition, and more particularly to a shower head for metal-organic chemical vapor deposition in which components do not react with each other and manufacturing is easy.

Background Art

[0002] A superconductor refers to a substance that exhibits zero electrical resistance at temperatures below the critical temperature (Tc) and exhibits perfect diamagnetism called the Meissner effect.

[0003] In the first generation of superconductors, the superconducting phenomenon in which the electrical resistance of mercury becomes zero at a temperature of 4.2 K of liquid helium was first discovered in 1911. In the second generation of superconductors, cuprate superconductors were discovered in 1986.

[0004] An oxide superconductor (REBCO: RE is one or two elements of rare earth elements (Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu)) means individual oxide particle substances of RE, Ba, and Cu, or composite oxide particles (Complex Oxide) composed of two or more of these elements.

[0005] In order to apply the REBCO thin film superconductor to the power transmission field, a process that enables elongation while maintaining a high critical current density (Jc) and has a low manufacturing cost must be applied. Therefore, various processes are applied for the buffer layer and the superconducting layer thin film.

[0006] The buffer layer is prepared using methods such as sputtering and deposition. The superconducting layer of high-temperature superconducting wires can be produced by methods such as pulsed laser deposition (PLD), reactive co-evaporation (REC), metal-organic chemical vapor deposition (MOCVD), and metal-organic evaporation (MOD).

[0007] In this context, metal-organic vapor deposition (MOCVD) refers to a chemical vapor deposition method that uses liquid metal-organic compound raw materials. Because these compounds are imperfect and easily decompose, the method involves vaporizing them and causing a gas-phase reaction and a chemical vapor deposition reaction on the surface of the substrate (wire) to obtain a solid vapor-deposited layer.

[0008] Such organometallic chemical vapor deposition methods are equipped with a deposition component for spraying gaseous compounds. Conventional deposition components are formed from multiple plates and have a complex structure to prevent the compounds from reacting with each other, which makes them difficult to manufacture.

[0009] Therefore, there is a need to improve this.

[0010] The background art of this invention is disclosed in the Registered Patent Publication No. 10-1429553 of the Republic of Korea (registered on August 6, 2014, title of invention: superconducting wire and method for forming a superconducting wire). [Overview of the project] [Problems that the invention aims to solve]

[0011] The present invention aims to provide a shower head for organometallic chemical vapor deposition that can uniformly spray organometallic raw materials onto the vapor deposition area of ​​a workpiece, allows for reliable compartmentalization to prevent internal reactions between components, and is easy to manufacture. [Means for solving the problem]

[0012] The shower head for organometallic chemical vapor deposition according to the present invention includes a plurality of spray lines formed in a plurality of spray sections so as to be connected to a plurality of gas supply lines, and a fine hole formed on one side of the spray section to spray gas onto a workpiece, wherein the plurality of spray lines may be arranged in a winding shape adjacent to each other.

[0013] The injection unit includes a fixing unit for fixing the plurality of injection lines, and the fixing unit may include a base plate to which the plurality of injection lines are attached, and a guide for preventing the plurality of injection lines from detaching from the base plate.

[0014] The injection unit can be formed by interconnecting the plurality of injection lines, each of which is formed by a plurality of pipes connected to the gas supply line through which the gas is transported.

[0015] The cross-sectional shape of each of the multiple pipes in the multiple injection lines can be formed as a polygon or a circle.

[0016] The injection unit may include a base plate, an injection plate spaced apart from the base plate, and a partition wall provided between the injection plate and the base plate to form the plurality of injection lines.

[0017] The injection unit may be formed to correspond to the shape of the processing area of ​​the workpiece.

[0018] The injection unit may include a cooling unit that exchanges heat with the plurality of injection lines.

[0019] The cooling unit may include cooling lines formed between the plurality of injection lines. [Effects of the Invention]

[0020] According to the shower head for metalorganic chemical vapor deposition according to the present invention, the metalorganic raw material can be uniformly sprayed onto the deposition site of the object to be processed, and is formed in independent injection lines so as to independently transfer each vaporized metalorganic raw material, and the reaction of each component inside can be fundamentally blocked.

[0021] According to the present invention, the injection lines forming the injection part are formed of independent pipes and can be manufactured with a simple structure that is bent and wound in a spiral shape, so the manufacturing is easy and the manufacturing cost can be reduced.

[0022] According to the present invention, the injection lines forming the injection part can be achieved by combining injection plates provided with partition walls, so the manufacturing is easy and the manufacturing cost can be reduced.

[0023] According to the present invention, the injection part is formed in a shape corresponding to the processing site of the object to be processed, and the vaporized metalorganic raw material can be uniformly sprayed onto the processing site.

[0024] According to the present invention, the injection lines composed of independent pipes are fixed by fixing parts, so that the modularization of parts is possible and rigidity can be maintained, and vibration and noise caused by vapor pressure can be prevented.

[0025] According to the present invention, a cooling line is provided between the injection lines to prevent heat generation in the injection lines, and the chemical reaction of components inside the injection lines can be suppressed.

Brief Description of the Drawings

[0026] [Figure 1] It is a perspective view schematically showing a shower head for metalorganic chemical vapor deposition according to an embodiment of the present invention.

[0027] [Figure 2] It is an exploded perspective view schematically showing a shower head for metalorganic chemical vapor deposition according to an embodiment of the present invention.

[0028] [Figure 3] This is a cross-sectional view AA in Figure 1.

[0029] [Figure 4] This is a schematic plan view showing a shower head for organometallic chemical vapor deposition according to one embodiment of the present invention.

[0030] [Figure 5] This figure shows a cross-section of the spray line of a shower head for organometallic chemical vapor deposition according to one embodiment of the present invention.

[0031] [Figure 6] This diagram schematically shows a vapor deposition apparatus to which a showerhead for organometallic chemical vapor deposition according to one embodiment of the present invention is applied.

[0032] [Figure 7] This is a schematic perspective view showing a modified example of a shower head for organometallic chemical vapor deposition according to one embodiment of the present invention.

[0033] [Figure 8] This is an exploded perspective view schematically showing a modified example of a shower head for organometallic chemical vapor deposition according to one embodiment of the present invention.

[0034] [Figure 9] Figure 8 is a cross-sectional view of BB. [Modes for carrying out the invention]

[0035] Hereinafter, an embodiment of the shower head for organometallic chemical vapor deposition according to the present invention will be described with reference to the attached drawings.

[0036] In this process, the thickness of lines and the size of components shown in the drawings may be exaggerated for clarity and convenience of explanation. The terms described later are defined in consideration of the function in this invention, and these may vary depending on the intent or convention of the user or operator. Therefore, the definitions of these terms should be based on the content throughout this specification.

[0037] In this specification, when a part is described as being "connected" to another part, this includes not only cases where it is "directly connected," but also cases where it is "indirectly connected" with another component in between. In this specification, when a part is described as "containing" a component, this means, unless otherwise stated, that it further "contains" other components rather than excluding them.

[0038] Throughout this specification, the same reference numerals may refer to the same component. The same or similar reference numerals may be described in reference to other drawings even if they are not mentioned or described in a particular drawing. Even if a part of a particular drawing does not have a reference numeral, that part may be described in reference to other drawings. The number, shape, size, and relative differences in size of detailed components included in the drawings of this application are set for the sake of understanding and can be embodied in various ways without limiting the embodiments.

[0039] Figure 1 is a schematic perspective view of a shower head for organometallic chemical vapor deposition according to one embodiment of the present invention; Figure 2 is a schematic exploded perspective view of a shower head for organometallic chemical vapor deposition according to one embodiment of the present invention; Figure 3 is a cross-sectional view AA of Figure 1; Figure 4 is a schematic plan view of a shower head for organometallic chemical vapor deposition according to one embodiment of the present invention; Figure 5 is a diagram showing a cross-section of the spray line of a shower head for organometallic chemical vapor deposition according to one embodiment of the present invention; Figure 6 is a schematic diagram showing a deposition apparatus to which a shower head for organometallic chemical vapor deposition according to one embodiment of the present invention is applied; Figure 7 is a schematic perspective view showing a modified example of a shower head for organometallic chemical vapor deposition according to one embodiment of the present invention; Figure 8 is a schematic exploded perspective view showing a modified example of a shower head for organometallic chemical vapor deposition according to one embodiment of the present invention; and Figure 9 is a cross-sectional view BB of Figure 8.

[0040] First, referring to Figure 6, the deposition apparatus 1 is of the open-reel (Reel-to-Reel) type, and the deposition process is carried out in chambers connected by vacuum.

[0041] The deposition apparatus 1 may include a deposition chamber 10, a guide section 20, and a deposition section 30. The deposition chamber 10 is kept under vacuum by a vacuum pump.

[0042] The guide unit 20 is provided in the deposition chamber 10 and guides the movement of the workpiece supplied to it, and can heat the workpiece.

[0043] In this embodiment, the workpiece includes a wire with a buffer layer formed on it, and for the sake of convenience, the workpiece will be described as a wire below.

[0044] The guide section 20 is formed to a length corresponding to the width of the wire and is equipped with a heating unit 25 inside.

[0045] As shown in Figure 6(a), the guide section 20 may be formed from a guide drum. As shown in Figure 6(b), the guide section 20 may be formed from a conveyor. Inside each guide section 20, a heating unit 25 is provided to heat the wire being transported by the guide section 20 to a temperature suitable for depositing a superconducting layer.

[0046] The vapor deposition unit 30 may include a shower head 100 and an organometallic raw material supply unit 32.

[0047] Referring to Figures 1 to 6, the shower head 100 for organometallic chemical vapor deposition according to one embodiment of the present invention may include a jet section 110 and fine holes 115.

[0048] The injection unit 110 may be formed by a plurality of injection lines 112 connected to the gas supply line 35 so that the gas is transported independently.

[0049] More specifically, as shown in Figures 1 to 3, the injection unit 110 can be formed by interconnecting injection lines 112, which are each connected to a gas supply line 35 and formed by pipes through which gas is transported.

[0050] The injection lines 112 are arranged in a shape that is wound side by side. As shown in Figure 4, the injection lines 112 can be wound in a square spiral or in a circular spiral.

[0051] Fine holes 115 are formed at regular intervals in each injection line 112, which consists of pipes.

[0052] The gas supply line 35 is connected to the organometallic raw material supply unit 32, which includes a vaporizer 33. The organometallic raw material is vaporized by the vaporizer 33 and can be injected into the heated wire through the fine holes 115 of the injection line 112.

[0053] According to this embodiment, the organometallic raw material supply unit 32 consists of a ternary system of Y (Yttrium), Ba (Barium), and Cu (Copper), and the injection line 112 of the injection unit 110 is formed into three lines so that each component is transported independently.

[0054] Therefore, each component can be independently transported to the injection line 112 and injected through the fine holes 115 to be deposited onto the surface of the wire.

[0055] In this embodiment, the injection line 112 is shown as a ternary system consisting of three lines, but it is not limited to this, and the injection line 112 can be designed as a ternary system or more.

[0056] The injection unit 110 may include a fixing unit 120 for fixing the injection line 112.

[0057] The fixing portion 120 may include a base plate 122 to which the injection line 112 is attached, and a guide 124 that prevents the injection line 112 from detaching from the base plate 122.

[0058] The base plate 122 has connecting pipes formed therein so that three gas supply lines 35 are drawn out to the outside and connected to the organometallic raw material supply unit 32, and each injection line 112 is connected to the gas supply line 35 and attached to the base plate 122.

[0059] In this configuration, each injection line 112 can be interconnected to form an injection unit 110 and mounted, or it can be individually attached to the injection line 112 to form an injection unit 110. The guide 124 is connected to the edge of the base plate 122 and can fix the injection unit 110 mounted on the upper part of the base plate 122.

[0060] The injection unit 110 may include a cooling unit 130 that exchanges heat with the injection line 112. The cooling unit 130 may include a cooling line 132 formed between the injection lines 112. The cooling line 132 may be formed of pipe, similar to the injection lines 112, and may be provided between the injection lines 112 and arranged in a winding configuration adjacent to each other.

[0061] In other words, cooling lines 132 are provided between the injection lines 112 and can be wound in a square or circular spiral shape.

[0062] The cooling line 132 can prevent heat generation in the injection line 112 and suppress chemical reactions of components inside the injection line 112.

[0063] In this embodiment, the cooling unit 130 consists of a cooling line 132 and is shown as being arranged between the injection lines 112 and wound in a spiral shape. However, it is not limited to this configuration, and various design modifications are possible, such as being provided on a separate base plate 122 for heat exchange.

[0064] Referring to Figure 6, it is preferable that the injection section 110 is formed to correspond to the shape of the processed portion of the wire.

[0065] As shown in Figure 6(a), when the guide section 20 is formed by a guide drum, the wire transported by the guide drum has the same curvature as the outer surface of the guide drum, and the injection section 110 is formed in a curved shape corresponding to the outer surface of the guide drum. This allows for uniform injection of gas to the processing area of ​​the wire. As shown in Figure 6(b), when the guide section 20 is formed by a conveyor, the injection section 110 can form a planar shape and inject vaporized organometallic raw materials.

[0066] Referring to Figures 7 to 9, a modified example of the injection unit 210 may include injection plates 212 that are positioned opposite each other and spaced apart, and a partition wall 214 provided between the injection plates 212 to form a plurality of injection lines 112.

[0067] In other words, the injection plate 212 consists of a lower injection plate 212 and an upper injection plate 212, and by forming a partition wall 214 in the lower injection plate 212, the injection line 112 can be formed by the coupling of the upper injection plate 212 and the lower injection plate 212. At this time, a coupling groove 215 is formed on the inner surface of the upper injection plate 212 into which the upper end of the partition wall 214 is fitted and coupled.

[0068] In a modified example, a cooling line 132 may be formed between the injection lines 112 by a partition wall 214.

[0069] The operation and effects of a shower head for organometallic chemical vapor deposition according to one embodiment of the present invention are as follows:

[0070] First, the manufacturing process for superconducting wires is carried out in an open-reel (Reel-to-Reel) format within a vacuum chamber.

[0071] The organometallic chemical vapor deposition showerhead 100 according to the present invention can independently transport and spray a ternary system of organometallic elements Y (Yttrium), Ba (Barium), and Cu (Copper) during the process of depositing a superconducting layer, and has the advantage of a simple structure and easy manufacturing.

[0072] To explain this in more detail, the wire moved by the guide unit 20 is heated by the heating unit 25 to a temperature suitable for vapor deposition, and the spray unit 110 can spray vaporized organometallic raw materials onto the wire heated by the heating unit 25 through a number of fine holes 115.

[0073] Therefore, by injecting vaporized gas of organometallic raw materials, a superconducting layer can be formed on the surface of the wire by creating films of Y (Yttrium), Ba (Barium), and Cu (Copper) components.

[0074] The injection unit 110 is formed by injection lines 112 consisting of separate pipes, and each vaporized organometallic raw material is transported through its own independent injection line 112. This fundamentally eliminates the possibility of mutual contact within the injection unit 110 and prevents the components from reacting with each other.

[0075] Since the injection lines 112, each consisting of a pipe, are bent and arranged so as to be wound side by side, they have the effect of being easy to manufacture and can form a structure that can uniformly inject vaporized organometallic raw materials onto the surface of the wire.

[0076] In this case, as shown in Figure 4(a), each injection line 112 can be wound up in a square spiral shape, or as shown in Figure 4(b), it can be wound up in a circular spiral shape, and can be formed into various shapes.

[0077] As shown in Figure 5, each injection line 112 can be formed with various cross-sectional shapes, such as a square cross-section or a circular cross-section.

[0078] As shown in Figure 6, the injection unit 110 is formed in a shape corresponding to the processing area of ​​the wire, and has the effect of uniformly injecting vaporized organometallic raw materials onto the processing area.

[0079] The injection lines 112 are modularized into a single component by being fixed by the fixing part 120, thus maintaining rigidity. As shown in Figure 2, each injection line 112 is attached to the base plate 122 and can be securely fixed in the correct position by guides 124 formed on the edge of the base plate 122. Thus, vibrations and noise that may occur in the vapor pressure can be prevented.

[0080] Cooling lines 132 are provided between each of the injection lines 112, which consist of pipes, to prevent heat generation in the injection lines 112 and suppress chemical reactions of components inside the injection lines 112.

[0081] Referring to Figures 7 to 9, as a modified example of the injection section 210, the injection section 210 may be formed by a partition wall 214 that independently partitions the space formed by the opposing injection plates 212.

[0082] In other words, the partition wall 214 formed on the lower injection plate 212 is fitted and joined to the upper injection plate 212, thereby forming an injection line 112 through which each vaporized organometallic raw material can be transported, and thus has the effect of being easy to manufacture.

[0083] According to the present invention, organometallic raw materials can be uniformly sprayed onto the vapor deposition area of ​​the workpiece, and each vaporized organometallic raw material is transported independently by separate spray lines, fundamentally preventing the components from reacting internally. Furthermore, since the spray lines can be formed using a simple structure consisting of bending independent pipes or joining spray plates, manufacturing is easy and has the effect of reducing manufacturing costs.

[0084] The present invention has been described with reference to embodiments shown in the drawings, which are illustrative only, and those with ordinary skill in the art will understand that various modifications and equivalent other embodiments are possible therefrom.

[0085] Therefore, the scope of technical protection of the present invention should be defined by the following claims.

Claims

1. An injection unit formed in multiple injection lines so as to be connected to multiple gas supply lines, The injection section includes a fine hole formed on one side of the injection section to spray gas onto the workpiece, A shower head for organometallic chemical vapor deposition, characterized in that the plurality of spray lines are arranged in a winding shape adjacent to each other.

2. The injection unit includes a fixing unit for fixing the injection line, The aforementioned fixing part is A base plate to which the aforementioned multiple injection lines are attached, The shower head for organometallic chemical vapor deposition according to claim 1, further comprising a guide for preventing the plurality of spray lines from detaching from the base plate.

3. The shower head for organometallic chemical vapor deposition according to claim 1, characterized in that the injection section is formed by interconnecting the plurality of injection lines, which are each connected to the plurality of gas supply lines and formed by a plurality of pipes through which gas is transported.

4. The shower head for organometallic chemical vapor deposition according to claim 3, characterized in that the cross-sectional shape of each of the multiple pipes of the multiple spray lines is formed to be polygonal or circular.

5. The aforementioned injection unit comprises a base plate and An injection plate is positioned at a distance from the base plate so as to face it, The shower head for organometallic chemical vapor deposition according to claim 1, further comprising a partition wall provided between the spray plate and the base plate to form the plurality of spray lines.

6. The shower head for organometallic chemical vapor deposition according to claim 1, characterized in that the spraying portion is formed to correspond to the shape of the processed portion of the workpiece.

7. The shower head for organometallic chemical vapor deposition according to claim 1, characterized in that the injection unit includes a cooling unit that exchanges heat with the plurality of injection lines.

8. The shower head for organometallic chemical vapor deposition according to claim 7, characterized in that the cooling section includes a cooling line formed between the plurality of injection lines.

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