Elastomer-bonded doors for vacuum systems
JP2026515358A5Pending Publication Date: 2026-05-25APPLIED MATERIALS INC
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Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- APPLIED MATERIALS INC
- Filing Date
- 2024-03-18
- Publication Date
- 2026-05-25
AI Technical Summary
Technical Problem
Existing gasket sealing methods in semiconductor processing are prone to performance variability due to binder composition, application location, and peeling issues, leading to sealing failures.
Method used
A method involving the direct deposition of a first layer with a 3D surface pattern and a second layer of sealing material, using 3D printing, to enhance adhesion and stability without relying on adhesive binders, allowing for customizable seal shapes and sizes.
Benefits of technology
This approach improves seal integrity and performance by ensuring consistent adhesion and stability, eliminating variability associated with adhesive binders, and enabling automated, repeatable seal formation.
✦ Generated by Eureka AI based on patent content.
Smart Images
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Abstract
Embodiments of methods for manufacturing and refurbishing components having seals are provided. A method for manufacturing a component having a seal includes depositing a first layer directly onto the sealing surface of a body, wherein the first layer includes a 3D surface pattern, and depositing a second layer on the first layer, wherein the second layer includes a sealing material. A method for refurbishing a component having a seal includes preparing a component including a body and a seal attached to the body, removing at least a portion of the seal from the sealing surface to form an exposed portion of the sealing surface of the body, depositing a first layer directly onto the exposed portion of the sealing surface, wherein the first layer includes a 3D surface pattern, and depositing a second layer on the first layer, wherein the second layer includes a sealing material.
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