High-speed substrate sorter

Abstract

This specification discloses a substrate sorter, an inspection and classification system having a substrate sorter, and a method for the inspection and classification system. The substrate sorter includes an annular gripper including a rotating body and a plurality of vacuum applicators arranged concentrically around an axis, a carrier operable to move substrates toward the rotating body into a loading area beneath the rotating body, and actuators coupled to the annular gripper and operable to rotate the rotating body about the axis relative to the plurality of vacuum applicators while one or more of the plurality of vacuum applicators hold the substrates toward the rotating body.

Description

Technical Field

[0001]

[0001] Embodiments of the present disclosure generally relate to high-speed semiconductor sorters and semiconductor inspection systems including such sorters. More specifically, the embodiments disclosed herein relate to a substrate sorter and method for sorting substrates moving on a high-speed carrier. Background Art

[0002]

[0002] Semiconductor substrates are regularly inspected by a measurement system prior to processing to ensure strict compliance with predetermined quality control standards, and the characteristics and defects of the substrates are obtained. The measurement system can provide comprehensive data regarding the substrate, such as physical dimensions, optical characteristics, electrical characteristics, crystal structure, and the like. After the inspection is completed, the substrates are sorted and transferred to designated containers assigned according to their specific characteristics.

[0003]

[0003] Since substrates can be inspected in parallel by a measurement station, the sorting and transfer of inspected substrates can be a limiting factor for the throughput of the measurement system. For example, a rotary sorter for sorting and transferring inspected substrates uses an indexing operation that rotates in a stop-and-go manner. In such a sorter, a picking arm rotates within a pickup area and then the operation is stopped so that the picking arm can lift the substrate. When the substrate is lifted by the picking arm, the operation of the picking arm resumes and the picking arm rotates out of the pickup area. However, the start and stop indexing operations limit the throughput through the system and pose a significant challenge for increasing the speed at which inspected substrates can be handled.

[0004]

[0004] Furthermore, the indexing operation for starting and stopping requires frequent acceleration and deceleration of the picking arm, and therefore requires a very powerful motor and brake. Thus, vibration is unavoidably induced by such indexing operation. In addition, as the speed of the indexing operation increases, the frequency of maintenance and preventive maintenance also increases undesirably.

[0005]

[0005] Therefore, an improved classification and transport system is needed. [Overview of the project]

[0006]

[0006] This specification discloses a substrate sorter, an inspection and sorting system including a substrate sorter, and a method for the inspection and sorting system. The substrate sorter includes an annular gripper including a rotating body and a plurality of vacuum applicators arranged concentrically around an axis; a carrier operable to move substrates toward the rotating body and into a loading area beneath the rotating body; and an actuator coupled to the annular gripper and operable to rotate the rotating body about an axis relative to a plurality of vacuum applicators while one or more of the plurality of vacuum applicators hold the substrates relative to the rotating body.

[0007]

[0007] In another embodiment, a system for inspecting and classifying a plurality of substrates is disclosed herein. The system includes a loading unit operable to load substrates, a measuring unit connected to the loading unit, and a classifying unit described herein, connected to the measuring unit.

[0008]

[0008] In yet another embodiment, a method for sorting and classifying a plurality of substrates is disclosed herein. The method includes the steps of: performing a measurement process on substrates in a measurement unit; assigning the substrates to collection bins based on substrate information obtained by the measurement process; transporting the substrates from the measurement unit on a carrier and passing them through a loading area where the carrier and a sorter intersect, wherein the sorter includes a rotating body and a plurality of vacuum applicators; keeping the plurality of vacuum applicators stationary with respect to an axis; rotating the rotating body around an axis with respect to the plurality of vacuum applicators while one or more of the plurality of vacuum applicators hold the substrates with respect to the rotating body; lifting the substrates from the carrier by the rotating body while the rotating body rotates continuously; rotating the rotating body and the substrates to a collection bin; and releasing the substrates from the rotating body to a collection bin.

[0009]

[0009] To enable a detailed understanding of the above-described features of the Disclosure, a more specific description of the Disclosure, which has been briefly summarized above, can be obtained by referring to embodiments. Some of these embodiments are illustrated in the accompanying drawings. However, it should be noted that the accompanying drawings only illustrate exemplary embodiments of the Disclosure and should not be considered to limit the scope of the Disclosure, as the Disclosure may also permit other equally valid embodiments. [Brief explanation of the drawing]

[0010] [Figure 1] A top view of an inspection system according to one embodiment is shown. [Figure 2A] Figure 1 shows a top view of a high-speed substrate sorter in the inspection system according to one embodiment. [Figure 2B] A cross-sectional view of the loading area in Figure 1, according to one embodiment, is shown. [Figure 2C] A cross-sectional view of the loading area in Figure 1, according to one embodiment, is shown. [Figure 2D] A perspective view of a high-speed substrate sorter according to one embodiment is shown. [Figure 3] A perspective view of at least one Bernoulli picker of a high-speed substrate sorter according to one embodiment is shown. [Figure 4A] A perspective view of a substrate collection bin according to one embodiment is shown. [Figure 4B] A cross-sectional view of a substrate collection area according to one embodiment is shown. [Figure 5] A flowchart of a method for classifying substrates according to one embodiment is shown. [Modes for carrying out the invention]

[0011]

[0019] To facilitate understanding, the same reference numerals were used where possible to indicate identical elements common to multiple figures. It is assumed that elements and features of one embodiment may be usefully incorporated into other embodiments without further description.

[0012]

[0020] Embodiments of this disclosure generally relate to a substrate sorter, an inspection and classification system including a substrate sorter, and a method for the inspection and classification system. The substrate sorter utilizes non-indexed (i.e., continuous) motion to drive the sorter to run on the fly, nonstop, during the process of lifting substrates and transporting them to designated positions. The vacuum of the sorting apparatus for lifting the substrates is no longer discrete but indexed. The vacuum applicator rotates continuously, even during the process of lifting the substrates. In other words, the two processes of lifting the substrates and rotating the vacuum applicator are performed in parallel. This sorting apparatus reduces the need for powerful motors, avoids the generation of vibrations caused by frequent acceleration and deceleration of the indexing motion, and improves the throughput of the sorting apparatus and the substrate inspection system.

[0013]

[0021] Figure 1 shows a top view of an inspection system 100 according to one embodiment. The inspection system 100 includes a loading unit 102, a measurement unit 104, and a classification unit 106. The loading unit 102 receives one or more cassettes 112 containing substrates 110 in a stacked configuration. The loading unit 102 includes a computer (not shown) having a graphical user interface adapted to present information related to operations occurring within the loading unit 102, including processing metrics, lot numbers, etc. The module unit 104 may be, for example, a measurement unit. The classification unit 106 may be, for example, a classification module. The loading unit 102, module unit 104, and classification unit 106 may, for example, be arranged linearly with respect to other units.

[0014]

[0022] The loading unit 102 includes a transfer robot 108 having support elements 108E such as suction elements, end effectors, and gripper clamps for gripping and transporting substrates 110. The transfer robot 108 is adapted to transport substrates 110 from one or more cassettes 112 positioned within the loading unit 102 to a conveyor system 114. The conveyor system 114 may be a motor-driven conveyor system and may include one or more carriers 111 such as conveyors, conveyor belts, pallet transporters, or tracks driven by actuators via rollers and / or drive gears. The conveyor system 114 may be arranged in a linear configuration to transport substrates received from the transfer robot 108 through the module unit 104. In this way, the conveyor system 114 is located within the module unit 104, facilitating the transport of substrates 110 through the module unit 104. To facilitate the expansion of the inspection system 100, additional module units may be positioned between the loading unit 102 and module unit 104, and / or between module unit 104 and classification unit 106, and / or following classification unit 106.

[0015]

[0023] Module unit 104 may include one or more measurement stations. In the embodiment shown in Figure 1, module unit 104 includes five measurement stations 116A to 116E. The inspection system 100 may also be modified by adding or subtracting measurement stations from module unit 104, as space allows, rather than adding a second module unit, thus increasing the throughput and / or the number of measurement processes performed.

[0016]

[0024] The measurement station may include, for example, a microcrack inspection unit, a thickness measurement unit, a resistivity measurement unit, a photoluminescence unit, a shape and dimension inspection unit, a saw mark detection unit, a dirt detection unit, a chip detection unit, and / or a crystal fraction detection unit. The microcrack inspection unit may, for example, be configured to inspect a substrate for cracks and optionally determine the crystal fraction of the substrate. The shape and dimension inspection unit may, for example only, be configured to analyze the surface properties of a substrate. The saw mark detection unit may, for example, be configured to identify saw marks on a substrate, including grooves, steps, and double step marks. The measurement station may also include other examples not listed above.

[0017]

[0025] Since multiple substrates 110 can be inspected in parallel by multiple module units 116, the substrate carrier 111 moves at high speed, transports the substrates within the measurement unit 104, and transports the inspected substrates 110 to the classification unit 106. According to one embodiment, the throughput of the inspection system 100 can reach 15,000 substrates per hour. In one embodiment, the substrate carrier 111 is a belt conveyor. In another embodiment, the substrate carrier 111 is a pallet conveyor. Other types of substrate carriers 111 may be used.

[0018]

[0026] The sorting unit 106 includes a sorter 120 and a housing 121. According to one embodiment, the sorter 120 includes an annular gripper 123 configured to continuously rotate about an axis R during operation. The annular gripper 123 includes a gas-permeable rotator (later identified by reference numeral 252 shown in FIG. 2B) that rotates below a plurality of vacuum applicators 130. The plurality of vacuum applicators 130 are arranged concentrically circumferentially directly above the rotator about the axis R. According to one embodiment, each vacuum applicator 130 is configured to individually draw a vacuum through a section of the rotator positioned below the vacuum applicator 130. For example, the rotator has a plurality of through holes for transmitting the vacuum from the vacuum applicator 130 so that the substrate 110 is held in a section of the rotator directly below the vacuum applicator 130 that provides the vacuum. The rotator may have any configuration or be made of any material as long as it can hold the substrate 110 even after the plurality of through holes are formed. According to one embodiment, the rotator is made of a plastic such as polyacetal or polyoxymethylene to avoid scratching the substrate 110. The plurality of vacuum applicators 130 are individually controllable and can hold the substrate 110 in place by vacuum while the annular gripper 123 continuously rotates about the axis R. The vacuum applicator 130 may be assisted by a separate device (e.g., an air nozzle disposed below the substrate 110 or a Bernoulli gripper disposed above the substrate 110) for lifting the substrate 110 from the carrier 111 and bringing it into contact with the rotator.

[0019]

[0027] The vacuum applicator 130 is configured to hold the substrate 110 at a predetermined position with respect to the rotating body. As the rotating body rotates, the substrate 110 is held with respect to the rotating body by one vacuum applicator 130 first, then by the adjacent vacuum applicator 130, etc., as the substrate 110 attached to the rotating body sequentially rotates under the rings of the adjacent vacuum applicators 130. When the substrate 110 reaches the designated collection bin 140 at the collection location 250 selected based on the measurement results of the substrate 100, the vacuum applied by the vacuum applicator 130 disposed above the designated collection location 250 is reduced or adjusted, whereby the substrate 110 is released from the rotating body and enters the designated collection location 250. The collection bin 140 can be disposed at each collection location 250 such that the released substrate 110 is collected in the designated collection bin 140. The release can be achieved by increasing the pressure of the vacuum applicator 130 beyond a threshold amount, i.e., by reducing the vacuum output. The release can be carried out by shutting off the vacuum or filling the vacuum plenum of the vacuum applicator 130 with gas. According to one embodiment, a plurality of air nozzles can be disposed at the collection location 250 configured to supply an air flow toward the rotating body in a direction opposite to the movement of the rotating body. This air flow is selected to slow down the momentum of the substrate 110 when the annular gripper 123 releases the substrate 110 without stopping the rotation of the rotating body.

[0020]

[0028] FIG. 1 shows that only 24 vacuum applicators 130 are included in the annular gripper 123. It is envisioned that more or fewer numbers of vacuum applicators 130 can be utilized. According to one embodiment, the annular gripper 123 includes 12 vacuum applicators 130. According to another embodiment, the annular gripper 123 includes 36 vacuum applicators 130.

[0021]

[0029] As shown in Figure 1, the carrier 111 crosses the sorter 120 so that the annular gripper 123 can reach the inspected substrates 110. For example, the carrier 111 and the annular gripper 123 intersect each other in at least two loading areas 133 and 135. In the first loading area 133, a vacuum applicator 130 applies vacuum through a rotating body to lift the substrates 110 for transfer to one of the collection locations 250. Substrates 110 that are not classified as defective or otherwise are passed below the annular gripper 123 to the second loading area 135 where defective substrates 110 are discarded.

[0022]

[0030] In addition, the carrier 111 can continue through the sorting unit 106 toward the connector 150. Therefore, if the sorting unit 106 does not sort a substrate 110, the inspected substrate 110 can bypass the sorter 120 of the sorting unit 106. Furthermore, if the inspected substrate 110 is not picked up by the sorter 120, the substrate can continue along the carrier 111 toward the connector 150. In certain embodiments, substrates not picked up by the sorter 120 may continue along the carrier 111 and lead to an unsorted substrate bin. In certain embodiments, the sorting unit 106 may be further connected via the connector 150 to additional units, such as additional inspection systems, additional sorting units, additional measurement units, etc., for example. The connector 150 may further allow the conveyor system 114 to align with the conveyor system of additional units, such as additional inspection systems, additional sorting units, additional measurement units, etc.

[0023]

[0031] The inspection system 100 may further include a controller 190. The controller facilitates the control and automation of the inspection system 100. The controller 190 may be connected to or able to communicate with one or more of the conveyor system 114, loading unit 102, module unit 104, sorting unit 106, transport robot 108, and / or measurement stations 116A to 116E. The inspection system 100 can provide the controller 190 with information regarding the movement of substrates being performed, the transport of substrates, the sorting of substrates, and / or measurement.

[0024]

[0032] The controller 190 may include a central processing unit (CPU) (not shown), memory (not shown), and support circuits (or I / O) (not shown). The CPU may be either a computer processor of any form used in industrial settings to control various processes, or hardware (e.g., pattern generators, motors, and other hardware), and may monitor processes (e.g., processing time, board position, or location). Memory (not shown) is connected to the CPU and may be one or more readily available memories, such as random access memory (RAM), read-only memory (ROM), floppy disks, hard disks, or local or remote digital storage of any other form. Software instructions and data can be coded and stored in memory to instruct the CPU. Support circuits (not shown) are further connected to the CPU to assist the processor in a conventional manner. The support circuits may include caches, power supplies, clock circuits, input / output circuits, and subsystems, etc. A program (or computer command) readable by the controller 190 determines which tasks are executable on the board. The program may be software readable by the controller 190, and may include, for example, code for monitoring and controlling processing time and the position or location of the board within the inspection system 100.

[0025]

[0033] Figure 2A shows a top view of the sorter 120 of Figure 1. The rotating body of the annular gripper 123 is supported by a support frame which includes an inner frame 125, an outer frame 127, a plurality of radially arranged tubular members 129, and a support platform 122. The support platform 122 is connected to a rotary actuator, such as an electric motor, which rotates the support frame on axis R. According to one embodiment, the annular gripper 123 is configured to rotate continuously around axis R while a vacuum applicator 130 applies vacuum through the rotating body to secure the substrate 110 from the carrier 111. In one embodiment, the vacuum applicator 130 rotates with the rotating body within a first loading region 133 around axis R. In another example, the vacuum applicator 130 remains stationary while the rotating body rotates around axis R. The rotation of the rotating body continues without stopping while the substrate 110 is lifted by the vacuum applicator 130 positioned above the first loading region 133. While the rotating body rotates within the first loading area 133, the substrate 110 attached to the annular gripper 123 also rotates around axis R. By performing the lifting and rotating movements in parallel or simultaneously, the sorter 120 can sort the substrate 110 at very high speed. The support platform 122 may be a rotating disk, a circular support, or any other shape. Multiple tubular members 129 connect the inner frame 125 and the outer frame 127 to the support platform 122 via appropriate coupling mechanisms such as welded connections, pinned connections, or clamping connections. The rotating body is mounted between the inner frame 125 and the outer frame 127 so as to rotate in conjunction with the support frame.

[0026]

[0034] Each vacuum applicator 130 may include a left wall 124 and a right wall 126 that separate it from adjacent vacuum applicators 130, and thus is applied through a section of the rotating body immediately preceding each vacuum applicator 130, which is individually controllable relative to the other vacuum applicators 130. Each vacuum applicator 130 generally includes a plenum box with one side open to the rotating body, and the plenums within the plenum box are individually connected to a vacuum source and, optionally, also to a pressure source, so that the pressure and / or vacuum within each plenum can be individually controlled.

[0027]

[0035] One or more substrate collection bins 140 are arranged around the peripheral area of ​​each annular gripper 123 in the collection area 250 to receive and store the sorted substrates 110. In one embodiment, the substrate collection bins 140 are arranged in a circle and share a common axis R as the center of the circular arrangement. The substrates 110 may be sorted into the substrate collection bins 140 according to one or more substrate characteristics determined during one or more inspection processes performed at the measurement stations 116A-116E. When the sorter 120 transfers the substrates 110 to the collection area 250 of the substrate collection bins 140, the pressure of the vacuum applicator 130 over the substrates 110 rises above a threshold amount, and the substrates 110 are released from the rotating body into the appropriate substrate collection bin 140.

[0028]

[0036] Each substrate collection bin 140 may be individually detachable from the sorting unit 106. Although not shown, additional substrate collection bins 140 may be positioned within the sorting unit 106 to receive substrates 110, thereby preventing the substrates 110 from being inadvertently excluded from sorting and thus preventing damage to such substrates. In addition, rejection bins may be positioned within the sorting unit 106 to capture substrates 110 rejected by one or more of the measurement stations 116A to 116E of the module unit 104. In this way, the sorter 120 can feed damaged substrates into the rejection bins.

[0029]

[0037] As described above, the support platform 122 may be connected to a rotary actuator (not shown), such as a pneumatic, hydraulic, or electric motor. The rotary actuator rotates the support platform 122 continuously without indexing. With the assistance of a sensor that detects the position of the substrate 110, the substrate 110 may be lifted from the carrier 111 by applying vacuum to a vacuum applicator 130 around the loading area 133, secured to the rotating body, and then released into a substrate collection bin 140 located in one of the collection locations 250 positioned below the rotating body. As the rotating body passes over all the substrate collection bins 140, the sorter 120 may sort the substrate 110 into one of the desired substrate collection bins 140 by turning off or significantly reducing the vacuum applied to the vacuum applicator 130 associated with the section of the rotating body positioned above the desired collection location. In some embodiments, the sorter 120 can advantageously sort at least 15,000 substrates per hour, which is a significant improvement over other sorting systems.

[0030]

[0038] Figure 2B shows a cross-sectional view along the cross-sectional line SS in the first region 133 of Figure 2A according to one embodiment. The cross-sectional view shows a vacuum applicator 130, a substrate 110, a carrier 111, and a lifter 242 below the carrier 111. The carrier 111 carries the substrate 110 and moves in linear motion 256 toward axis R, while the rotating body 252 rotates around axis R. The direction of movement of the rotating body 252 in the first region 133 is substantially perpendicular to the linear motion 256 of the carrier 111 and can be considered as lateral motion relative to the carrier 111. As already disclosed in this application, the rotating body 252 rotates within the loading region 133 and continues its rotational motion without stopping. While the rotating body 252 continues to rotate, the vacuum applicator 130, which does not move relative to the rotating body 252, applies vacuum through the rotating body 252 to pick up the substrate 110 from the carrier 111, by means of vacuum power or the like.

[0031]

[0039] According to one embodiment, the annular rotating body 252 is gas permeable and / or includes a plurality of through-holes for transmitting the vacuum supplied to the substrate 110 by the vacuum applicator 130. The annular rotating body 252 can be mounted to an inner frame 125 and an outer frame 127, which are connected to an actuator such as a motor via a tubular member 129 and a support platform 122. The annular rotating body 252 may be formed by a ring-shaped block having a plurality of channels. The ring-shaped block may be made of plastic, aluminum, or any other suitable material. According to one embodiment, the vacuum applicator 130 may be a vacuum plenum that abuts the upper surface of the annular rotating body 252. The vacuum plenum includes a plurality of vacuum sections, each section of the vacuum plenum is designed to control a section of the annular rotating body 252. According to one embodiment, the vacuum plenum is stationary, while the annular rotating body 252 rotates around an axis R. According to another embodiment, the vacuum applicator 130 is attached to the annular rotating body 252 and rotates together with the annular rotating body 252.

[0032]

[0040] To lift the substrate 110, the vacuum applicator 130 provides vacuum to the annular rotating body 252 after it has sufficient overlap with the substrate 110. According to one embodiment, the vacuum applicator 130 generates and maintains a predetermined level of vacuum, and a valve is used to control the supply of vacuum to the annular rotating body 252 and the substrate 110. The through-holes in the annular rotating body 252 are configured to instantaneously transmit vacuum power to the substrate 110 on the carrier 111. Again, the annular rotating body 252 of the annular gripper 123 continues to rotate while the substrate 110 is being lifted. This parallelization of the pickup process and the rotation of the annular rotating body 252 can provide the classification system with very high throughput compared to systems that use serialized processes for pickup and rotation, such as indexing methods.

[0033]

[0041] According to one embodiment, the loading area 133 also includes a lifter 242 positioned below the carrier 111 and configured to lift the substrate 110 using airflow. The lifter 242 may include a plurality of air nozzles that release air jets at appropriate times and with sufficient force to lift the substrate 110 toward the annular rotating body 252. The carrier 111 further includes a plurality of through-holes 246 that allow the airflow released by the lifter 242 to reach the substrate 110. The lifter 242 can assist the vacuum applicator 130 in lifting the substrate 110.

[0034]

[0042] According to another embodiment, the first region 133 may further include an auxiliary vacuum applicator 248 positioned adjacent to the annular rotating body 252. In some situations, the vacuum generated by the vacuum applicator 130 may not be strong enough to lift the substrate 110. Therefore, the auxiliary vacuum applicator 248 may be used together with the vacuum applicator 130 to lift the substrate 110. Once the substrate 110 is lifted, the vacuum applicator 130 generates sufficient suction force to hold the substrate 110 to the rotating body 252 without further assistance, and the assistance from the lifter 242 and the auxiliary vacuum applicator 248 may be turned off. The auxiliary vacuum applicator 248 may include a plurality of Bernoulli grippers 254 or any other suitable grippers. According to one embodiment, the auxiliary vacuum applicator 248 represents a stationary vacuum applicator positioned within the loading region 133 and does not rotate together with the annular gripper 123. According to another embodiment, the auxiliary vacuum applicator 248 is attached to the annular rotating body 252 and moves together with the annular rotating body 252.

[0035]

[0043] Figure 2C shows a cross-sectional view along the cross-sectional line SS in the first region 133 of Figure 2A, according to another embodiment. Figure 2C shows that the auxiliary vacuum applicator 248 may be positioned in the center between two concentric annular rotating bodies 252A and 252B. Both concentric annular rotating bodies 252A and 252B are connected to a support frame, and each rotating body section 252A or 252B is connected to at least one vacuum applicator 130. The centrally positioned vacuum applicator 248 shown in Figure 2C is in contrast to the auxiliary vacuum applicator 248 positioned on the outer periphery shown in Figure 2B. According to one embodiment, each vacuum applicator 130 may be separated into a plurality of vacuum sections 130A and 130B, and the auxiliary vacuum applicator 248 is positioned between those vacuum sections 130A and 130B. According to one embodiment, the vacuum sections 130A and 130B are arranged concentrically around an axis R.

[0036]

[0044] Figure 2D shows a perspective view of a high-speed substrate sorter according to one embodiment. As shown in Figure 2D, the rotating body 252 of the annular gripper 123 includes two concentric sections 252A and 252B that hold a plurality of substrates 110. The high-speed substrate sorter includes a roller module 270 configured to engage with and rotate with the rotating body 252. According to one embodiment, the roller module 270 includes a leg 272 connected to a cantilever beam 276. The leg 272 is grounded or attached to another part of the high-speed substrate sorter. The cantilever beam 276 is positioned above the rotating body 252 and is coupled to a plurality of rollers 274 that engage with the concentric sections 252A and 252B. As shown in Figure 2D, each of the sections 252A or 252B has two rollers 274 that engage with its side wall. The rollers 274 are driven by a suitable actuation mechanism, such as a motor. As the roller 274 rotates, the rotating body 252 rotates due to the contraction force between the roller 274 and sections 252A and 252B. According to one embodiment, the high-speed substrate sorter may include a plurality of roller modules 270 connected by concentric members 278. These concentric members 278 substantially conform to the shapes of the concentric sections 252A and 252B.

[0037]

[0045] As shown in Figure 2D, the vacuum applicator 130 includes two concentric sections 130A and 130B, the shape of which also conforms to the shapes of the concentric sections 252A and 252B. The concentric sections 130A and 130B are connected to each other by a connecting member 282. An opening 280 is provided in the connecting member 232 to allow vacuum to enter the vacuum applicator 130. According to one embodiment, an auxiliary vacuum applicator 248, such as a Bernoulli picker, is positioned between the concentric sections 252A and 252B of the loading region 133.

[0038]

[0046] Figure 3 shows a bottom perspective view of at least one auxiliary vacuum applicator 248 of the sorter 120. In the embodiment of Figure 3, four grippers 254 are shown, but it is assumed that any number of grippers 254, including one gripper 254, may be utilized. In one embodiment, each gripper 254 may be a Bernoulli picker 210. Each Bernoulli picker 210 may extend downward to lift the substrate 110, or may simply generate enough vacuum force to pull the substrate 110 towards the rotating body 252. The position of each Bernoulli picker 210 depends on the number of Bernoulli pickers utilized. In one embodiment, only one Bernoulli picker 210 may be utilized, and therefore it is assumed that the Bernoulli picker 210 may be located in the middle between two vacuum applicators 130, or alternatively, on either side of a single vacuum applicator 130.

[0039]

[0047] Each Bernoulli picker 210 may operate to provide soft-contact transfer of the substrate 110 by applying an airflow between the non-contact surface 214A of the Bernoulli picker 210 and the substrate 110. The airflow from the non-contact surface 214A can create a vacuum on the surface of the substrate 110, allowing it to lift force. A stop 214B may be located between the non-contact surface 214A of the Bernoulli picker and the substrate 110. The stop 214B may prevent the substrate 110 from sliding or moving away from the Bernoulli picker 210 when the substrate is being sorted. The stop 214B may be made of a thin material, such as a material that will not damage the substrate 110. The stop 214B may prevent contact between the substrate 110 and the non-contact surface 214A of the Bernoulli picker 210. In one embodiment, the substrate 110 may not be in direct contact with the Bernoulli picker 210, but rather in contact with the bottom surface of the vacuum applicator 130.

[0040]

[0048] Figure 4A shows a perspective view of a collection area 250 and a substrate collection bin 140 according to one embodiment. Each substrate 110 is sorted into a substrate collection bin 140 located in the collection area 250 based on inspection data acquired at one or more of the measurement stations 116A to 116E. According to one embodiment, both the substrate collection bin 140 and the vacuum applicator 130 are stationary and paired for ease of control. Once a substrate is positioned on the appropriate bin, the sorter 120 continues to rotate without stopping. A substrate 110 positioned on the appropriate bin 140 can be released from its respective rotating body 252 so that the substrate is dropped into the substrate collection bin 140. Release can be achieved by turning off the vacuum of the paired vacuum applicator 130, allowing the substrate 110 to fall by gravity. According to one embodiment, the paired sections of the vacuum plenum release the airflow, pushing the substrate 110 out of the annular rotating body 252. The airflow can be generated by reversing the operation of the vacuum applicator 130.

[0041]

[0049] The determination of the position for releasing the substrate 110 takes into account the tangential and radial momentum of the substrate 110 so that the released substrate 110 can reach the designated substrate collection bin precisely. When the substrate 110 reaches the designated substrate collection bin, the substrate 110 encounters an air cushion 192 or resistance, which slows down the fall and other movements of the substrate 110. The air cushion 192 may provide resistance to the falling substrate 110 so that the substrate 110 falls gently into the substrate collection bin 140.

[0042]

[0050] As further shown in Figure 4A, in certain embodiments, the collection location 250 may optionally include a frame 164 for securing a plurality of first gas nozzles 162 and a plurality of second gas nozzles 160. The frame 164 is positioned such that the filled bins 140 can be removed from the collection location 250 without interference from the frame 164. The plurality of first gas nozzles 162 are oriented opposite to the tangential motion 402 of the released substrate 110, and the plurality of second gas nozzles 160 are oriented opposite to the radial motion 404 of the released substrate 110. The optional gas nozzles 160 and 162 can release a pressurized gas, such as air, oxygen, or any other suitable pressurized or unpressurized gas, to decelerate or attenuate the radial and tangential momentum of the released substrate 110, respectively. The amount of air released by the gas nozzles 160 and 162 can be controlled by a controller 190.

[0043]

[0051] The frame 164, which has gas nozzles 160 and 162, is envisioned to be positioned outside the interior of the substrate collection bin 140. For example, the frame 164, as well as the gas nozzles 160 and 162, may be positioned slightly below the annular gripper 123 and above the substrate collection bin 140. Other positions may be chosen as long as the jets of gas released by the nozzles 160 and 162 can slow the tangential and radial motion of the released substrate 110.

[0044]

[0052] Figure 4B shows a cross-sectional view along the cross-sectional line BB in the substrate collection bin 140 of Figure 4A according to one embodiment. The substrate 110 is released by the vacuum applicator 130. The vacuum applicator 130 or a separate nozzle 264 may generate an airflow 262 to push the substrate 110 out of the annular rotating body 252. Once the substrate 110 is released by the vacuum applicator 130, the substrate 110 tends to maintain the momentum generated by the rotational speed of the substrate 110 attached to the rotating body 252. As shown in Figure 4B, the substrate 110 continues to move along the radial direction 404 (in addition to the tangential direction). This is different from a classification system that uses indexing action, in which the gripper stops any rotational motion before releasing the substrate into the substrate collection bin. In a classification system with indexing action, the substrate is dropped into the substrate collection bin, which essentially has neither tangential nor radial motion. To slow the radial and tangential movement of the substrate 110, the collection area 250 where the bin 140 is located is fixed by a frame 164 and includes one or more gas nozzles 160 and 162 positioned opposite to the radial and tangential movement of the substrate 110. The tangential motion of the released substrate can be damped as well as the tangential motion of the radial motion by the gas nozzles 162.

[0045]

[0053] Figure 5 shows a flowchart 500 of a method for inspecting and classifying multiple substrates according to one embodiment. The flowchart 500 begins in step 502. In step 502, a cassette holding multiple substrates for inspection is positioned in a loading station of the inspection system. The loading unit loads multiple substrates 110 into the inspection system 100. The inspection system's conveyor system 114 moves the substrates through various module units such as measurement stations 116A to 116E. When a measurement unit receives a substrate 110, a measurement process is performed on the substrate in the module unit 104. The substrates may be inspected by a first measurement station, such as measurement station 116A. For example only, measurement station 116A may be a microcrack inspection unit, a thickness measurement unit, a resistivity measurement unit, a photoluminescence unit, a shape dimension inspection unit, or a saw mark detection unit. Any number of measurement units may be configured along the conveyor system 114 in the module unit 104.

[0046]

[0054] In step 504, the substrate 110 may be assigned to the substrate collection bin 140 based on substrate information acquired by various measurement units. The substrate information includes measurement data and inspection results. The substrate information acquired by various measurement units may be transmitted to the yield analysis server. The yield analysis server can analyze the data and inspection results and assign the substrate to the substrate collection bin 140. For illustrative purposes only, the measurement station 116A may be a microcrack inspection unit. If the measurement station 116A inspects the substrate and determines that the substrate contains one or more microcracks, such data may be transmitted to the yield analysis server. The yield analysis server may then determine that the particular substrate is assigned to, for example, the substrate collection bin D, based on the microcracks.

[0047]

[0055] In step 506, the substrate 110 is placed on a carrier 111 that transports the substrate 110 from the measurement unit. According to one embodiment, the carrier 111 transports the substrate 110 in linear motion toward the axis R of the sorter unit.

[0048]

[0056] In step 508, the carrier 111 transfers the substrate 110 to the loading region 133 where the annular gripper 123 and the carrier 111 intersect.

[0049]

[0057] In step 510, the annular gripper 123 includes an annular rotating body 252 that rotates continuously rather than indexly around the axis R. The rotating body 252 rotates within the loading region 133 and intersects with the carrier 111 that carries the substrate 110. The annular gripper 123 further includes a plurality of vacuum applicators 130. According to one embodiment, the plurality of vacuum applicators 130 are kept stationary with respect to the axis.

[0050]

[0058] In step 512, while the rotating body 252 of the annular gripper 123 continues to rotate, the vacuum applicator 130 of the annular gripper 123 lifts the substrate 110 by using the vacuum power applied through the rotating body 252. To raise the substrate toward the rotating body 252, an airflow beneath the substrate 110 may be released by the lifter 242. In addition, in step 510, an auxiliary vacuum applicator 248, such as a Bernoulli gripper, may also be used to assist the vacuum applicator 130 in lifting the substrate and bringing it into contact with the rotating body 252.

[0051]

[0059] In step 514, the stationary vacuum applicator 130 holds the substrate 110 in place relative to the rotating body 252 by using vacuum. The substrate 110, held relative to the rotating body 252, continues to rotate toward the substrate collection bin 140 located within the collection area 250. The vacuum applicator 130, in contact with the upper surface of the gas-permeable rotating body 252 of the annular gripper 123, maintains a vacuum above a predetermined level sufficient to hold the substrate 110 relative to the rotating body 252. The vacuum level is maintained within the vacuum plenum or applicator 130 until the substrate 110 is adjacent to the substrate collection bin 140.

[0052]

[0060] In step 516, as the rotating body 252 moves the substrate 110 to the substrate collection location, the pressure in the vacuum applicator 130 rises above a threshold amount, causing the vacuum power to drop to a level where it can no longer hold the substrate 110 against the rotating body 252, thus allowing the substrate 110 to fall freely from the annular gripper 123. The substrate 110 is then released while the rotating body 252 continues to rotate. The pressure in the vacuum applicator 130 can be increased simply by turning off the vacuum or by injecting gas into the plenum of the vacuum applicator 130. The substrate collection bin 140 is positioned in the substrate collection location to receive the substrate 110. The substrate collection location and bin may include a plurality of gas nozzles 162 and 160 oriented in the opposite direction to the radial and tangential movement of the released substrate 110. The gas nozzles 162 and 160 release jets of gas to dampen the radial and tangential movement of the released substrate 110.

[0053]

[0061] Those skilled in the art will recognize that the embodiments described herein are illustrative and not limiting. All substitutions, enhancements, equivalents, and improvements of these embodiments, which will become apparent to those skilled in the art by reading this specification and examining the drawings, are intended to be included in the essence and scope of this disclosure. Accordingly, the following accompanying claims are also intended to include all such modifications, substitutions, and equivalents, as they are within the essence and scope of these teachings.

Claims

1. It is a substrate sorter, An annular gripper including a rotating body arranged concentrically around an axis and multiple vacuum applicators, A carrier that is operable to move the substrate toward the rotating body into the loading area beneath the rotating body, An actuator connected to the annular gripper and capable of rotating the rotating body about its axis relative to the plurality of vacuum applicators while one or more of the plurality of vacuum applicators are holding the substrate relative to the rotating body, A circuit board sorter, including a substrate sorter.

2. The substrate sorter according to claim 1, wherein the plurality of vacuum applicators remain stationary with respect to the axis.

3. The substrate sorter according to claim 2, wherein the plurality of vacuum applicators include a first vacuum applicator positioned on the loading area and capable of lifting the substrate while the rotating body rotates about the axis.

4. The substrate sorter according to claim 3, further comprising an auxiliary vacuum applicator positioned on the loading region of the carrier, the auxiliary vacuum applicator being operable to assist in transferring the substrates positioned on the carrier to the rotating body.

5. The substrate sorter according to claim 2, wherein the rotating body is gas permeable and includes two concentric sections.

6. The substrate sorter according to claim 5, further comprising an auxiliary vacuum applicator positioned between the two concentric sections, which is operable to assist in transferring the substrates arranged on the carrier to the rotating body.

7. The substrate sorter according to claim 5, wherein the actuator includes a plurality of rollers configured to engage with the two concentric sections and rotate the two concentric sections.

8. The substrate sorter according to claim 7, wherein the actuator includes a beam positioned above the rotating body and configured to support the plurality of rollers.

9. The substrate sorter according to claim 1, wherein the plurality of vacuum applicators include a second vacuum applicator corresponding to a substrate collection location, and so that when the pressure of the second vacuum applicator rises above a threshold amount, the substrate held by the rotating body is released to the substrate collection location.

10. The substrate sorter according to claim 9, further comprising a removable bin located in the substrate collection area.

11. The substrate sorter according to claim 9, further comprising a first nozzle positioned adjacent to the substrate collection area and oriented to direct a first jet of gas in a first direction opposite to the tangential direction of the rotating body.

12. The substrate sorter according to claim 9, further comprising a second nozzle positioned adjacent to the substrate collection area and oriented to direct a second jet of gas in a second direction opposite to the radial direction of the rotating body.

13. The substrate sorter according to claim 9, further comprising a third nozzle positioned above the second vacuum applicator and oriented to direct a third jet of gas in a third direction toward the substrate collection location.

14. The substrate sorter according to claim 1, further comprising a lifter positioned below the carrier in the loading region, the lifter being operable to assist in transferring the substrates positioned on the carrier to a first vacuum applicator.

15. A system for inspecting and classifying circuit boards, A loading unit capable of loading a circuit board, A measurement unit connected to the aforementioned loading unit, A classification unit connected to the aforementioned measurement unit, An annular gripper including a rotating body arranged concentrically around an axis and multiple vacuum applicators, A carrier that is operable to transfer the substrate toward the rotating body to the loading area below the rotating body, An actuator connected to the annular gripper and capable of rotating the rotating body about its axis relative to the plurality of vacuum applicators while one or more of the plurality of vacuum applicators are holding the substrate relative to the rotating body, A classification unit including, A system that includes this.

16. The system according to claim 15, wherein the plurality of vacuum applicators include a first vacuum applicator that remains stationary with respect to the axis, is positioned above the loading area, and is operable to lift the substrate while the rotating body rotates about the axis.

17. The system according to claim 16, wherein the rotating body includes two concentric sections, and the actuator includes a plurality of rollers configured to engage with the two concentric sections and rotate the two concentric sections.

18. The system according to claim 17, further comprising an auxiliary vacuum applicator which is operable to assist in transferring the substrate, which is placed on the carrier, to the rotating body, and which is positioned between the two concentric sections.

19. The system according to claim 15, wherein the plurality of vacuum applicators include a second vacuum applicator corresponding to a substrate collection location, and so that when the pressure of the second vacuum applicator rises above a threshold amount, the substrate held by the rotating body is released to the substrate collection location.

20. A method for inspecting and classifying multiple substrates, Performing a measurement process on the circuit board within the measurement unit, Based on the substrate information obtained by the measurement process, the substrate is assigned to a collection bin. The transfer of the substrate from the measurement unit on the carrier to a loading region where the carrier and the sorter intersect, wherein the sorter includes an annular gripper including a rotating body arranged concentrically around an axis and a plurality of vacuum applicators, and the transfer of the substrate. The plurality of vacuum applicators are kept stationary relative to the axis, While one or more of the plurality of vacuum applicators hold the substrate relative to the rotating body, the plurality of vacuum applicators rotate the rotating body around the axis, While the rotating body is rotating continuously, the rotating body lifts the substrate from the carrier, Rotating the rotating body and the substrate of the sorter toward the collection bin, To release the substrate from the rotating body to the collection bin, Methods that include...

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