Display panels and display devices

Abstract

This application discloses a display panel and a display device belonging to the field of display technology. The display panel includes a substrate, a first metal driving layer, a light absorption layer, an auxiliary light absorption layer, and a plurality of light-emitting units. The orthographic projection of the light absorption layer onto the substrate and the orthographic projection of the driving layer onto the substrate overlap. In this way, the light absorption layer can absorb ambient light emitted onto the display panel, thereby ensuring that the degree to which ambient light emitted onto the display panel is reflected by the driving layer is low, and that the reflectivity of the display panel to ambient light is low. Furthermore, by providing a light absorption layer on the display panel, the reflectivity of the display panel to ambient light can be reduced. Therefore, the transmittance of the auxiliary light absorption layer located on the side of the plurality of light-emitting units away from the substrate can be appropriately increased, thereby reducing the absorption rate of the auxiliary light absorption layer to light rays, and reducing the degree to which light rays emitted from the light-emitting units are absorbed by the auxiliary light absorption layer.

Description

Technical Field

[0001] This application claims the priority of a Chinese patent application with an application number of 202310625067.3 filed on May 29, 2023, and an invention title of "Display Panel and Display Device", and all the contents of the patent application are incorporated herein by reference.

[0002] This application relates to the field of display technology, and in particular, to display panels and display devices.

Background Art

[0003] With the development of the display technology field, mini Light-Emitting Diode (LED) display panels have advantages such as pure chromaticity, wide dynamic range, high brightness, high resolution, low operating voltage, low power consumption, long lifespan, high shock resistance, large viewing angle, stable operation, and reliability. Therefore, LED display panels have become the most advantageous next-generation display media and are widely applied.

[0004] Currently, an LED display panel usually includes a driving backplane and a plurality of LEDs located on one side of the driving backplane. Here, the driving backplane can transmit a driving signal to each LED, whereby the LED can emit corresponding light, and the LED display panel can present a corresponding display screen.

[0005] However, the driving backplane usually contains a metal layer, and the reflectivity of the metal layer to ambient light is high. Therefore, current LED display panels are prone to reflecting ambient light, resulting in poor effects of the LED display panels.

Summary of the Invention

[0006] Embodiments of this application provide a display panel and a display device, which can solve the problem of the low effect of the display panel in the prior art, and the technical solution is as follows.

[0007] According to one embodiment, a display panel is provided, It includes a substrate, a first metal driving layer, a light absorption layer, a plurality of light-emitting units, and an auxiliary light absorption layer. The first metal drive layer is located on one side of the substrate and has a plurality of conductive pads. The light-absorbing layer is located on the side of the first metal drive layer away from the substrate, the orthographic projection of the light-absorbing layer onto the substrate and the orthographic projection of the first metal drive layer onto the substrate overlap, and the light-absorbing layer has a plurality of first vias corresponding to the plurality of conductive pads, the orthographic projection of the first vias onto the substrate and the orthographic projection of the corresponding conductive pads onto the substrate overlap, The plurality of light-emitting units are located on the side of the light-absorbing layer away from the substrate, and the light-emitting units are electrically connected to at least some of the conductive pads via the first via. The auxiliary light-absorbing layer is located on the side of the light-emitting unit that is away from the substrate.

[0008] As one option, the display panel further includes a light-reflecting layer located between the substrate and the light-absorbing layer, wherein the orthographic projection of the light-reflecting layer onto the substrate and the orthographic projection of the light-absorbing layer onto the substrate overlap.

[0009] As one option, the light-reflecting layer is located on the side of the first metal drive layer away from the substrate, and the light-reflecting layer has a second via that communicates with the first via.

[0010] As one option, the orthographic projection of the light-absorbing layer onto the substrate is located within the orthographic projection of the light-reflecting layer onto the substrate.

[0011] As one option, the display panel further includes a first insulating layer located between the first metal driving layer and the light absorbing layer, the first insulating layer having a third via communicating with the first via.

[0012] As one option, the light-reflecting layer has insulating properties, and the light-reflecting layer and the first insulating layer have the same film layer structure.

[0013] As one option, the light-reflecting layer is located on the side of the first insulating layer away from the substrate, or the light-reflecting layer is located on the side of the first insulating layer closer to the substrate.

[0014] As one option, the display panel further includes a second insulating layer located on the side of the light-absorbing layer away from the substrate, the second insulating layer having a fourth via communicating with the first via, and a portion of the second insulating layer extending into the first via and covering at least a portion of the inner wall of the first via.

[0015] As one option, the light-absorbing layer contains carbon particles, and the inner wall of the first via is completely covered by the second insulating layer.

[0016] As one option, the portion of the second insulating layer extends into the second via and covers at least a portion of the inner wall of the second via.

[0017] As one option, the display panel further includes a second metal drive layer located on the side of the first metal drive layer closer to the substrate, and the light reflective layer is located on the side of the second metal drive layer closer to the substrate.

[0018] As one option, at least one of the first metal driving layer and the second metal driving layer has a mark pattern, the light absorbing layer has relief holes corresponding to the mark pattern, and the orthographic projection of the relief holes onto the substrate overlaps with the orthographic projection of the mark pattern onto the substrate.

[0019] As one option, the material of the light-reflecting layer includes at least one of amorphous silicon, low-temperature polysilicon, and white ink.

[0020] As one option, if the material of the light-reflecting layer includes amorphous silicon, the thickness range of the light-reflecting layer is 500 angstroms to 2000 angstroms. When the material of the light-reflecting layer contains white ink, the thickness range of the light-reflecting layer is 0.5 micrometers to 3 micrometers. When the material of the light-emitting layer is low-temperature polysilicon, the thickness range of the light-emitting layer is 500 angstroms to 2000 angstroms.

[0021] As one option, the display panel further includes a plurality of drive circuits located on the side of the first metal drive layer closer to the substrate, the drive circuits being electrically connected to the light-emitting unit via the conductive pads, The drive circuit includes a plurality of stacked electrical patterns, and the display panel further includes an insulating layer located between two adjacent electrical patterns.

[0022] As one option, the display panel further includes a light-reflecting layer installed in the same layer as one of the plurality of electrical patterns, wherein the orthographic projection of the light-reflecting layer onto the substrate and the orthographic projection of the light-absorbing layer onto the substrate overlap.

[0023] As one option, the drive circuit has at least one transistor, one of the plurality of electrical patterns is the active layer pattern in the transistor, and both the material of the active layer pattern and the material of the light-reflecting layer contain low-temperature polysilicon. The active layer is installed in the same layer as the light-reflecting layer and is made of the same material.

[0024] As one option, the minimum distance between the outer boundary of the orthographic projection of the active layer pattern onto the substrate and the outer boundary of the orthographic projection of the light-reflecting layer onto the substrate is 5 micrometers or more.

[0025] As one option, the edge region of the surface of the substrate away from the first metal drive layer includes a binding region, and the display panel further includes a plurality of signal leads located within the binding region, and at least some of the plurality of signal leads are electrically connected to the drive circuit. The region between two adjacent said drive signal leads is an interval region, and the orthographic projection of the interval region onto the substrate overlaps with the orthographic projection of the light reflection layer onto the substrate.

[0026] As one option, the interval region includes a first region and a second region. The first region is the region in the interval region covered by the first metal drive layer and the plurality of electrical patterns, and the second region is the region in the interval region other than the first region. At least a part of the orthographic projection of the light reflection layer onto the substrate is located within the orthographic projection of the second region onto the substrate.

[0027] As one option, the orthographic projection of the light reflection layer onto the substrate does not overlap with the orthographic projection of the first metal drive layer onto the substrate and does not overlap with the orthographic projection of each electrical pattern onto the substrate.

[0028] As one option, the orthographic projection of the light reflection layer onto the substrate completely covers the second region.

[0029] As one option, the boundary of the orthographic projection of the portion of the light reflection layer covered by the second region onto the substrate extends along the boundary of the orthographic projection of the first region onto the substrate, and the boundary of the orthographic projection of the portion of the light reflection layer covered by the second region onto the substrate does not overlap with the boundary of the orthographic projection of the first region onto the substrate.

[0030] As one option, the display panel further includes a mark pattern installed in the same layer as at least one of the plurality of electrical patterns and having the same material, the light reflection layer has a relief hole corresponding to the mark pattern, and the orthographic projection of the relief hole onto the substrate overlaps with the orthographic projection of the mark pattern onto the substrate.

[0031] As one option, the plurality of electrical patterns include a first gate pattern, an active layer pattern, a second gate pattern, and a source-drain pattern stacked along a direction perpendicular to and away from the substrate. When the light-reflecting layer is installed in the same layer as the active layer pattern, there are at least two mark patterns, one of which is installed in the same layer as the second gate pattern and is made of the same material, and the other mark pattern is installed in the same layer as the source-drain pattern and is made of the same material.

[0032] As one option, the auxiliary light-absorbing layer has a transmittance of 50% or more for light rays emitted from the light-emitting unit.

[0033] As one option, the light-emitting unit includes a mini light-emitting diode or a micro light-emitting diode.

[0034] In another embodiment, a display device is provided, which includes a drive assembly and a display panel electrically connected to the drive assembly, wherein the display panel is the display panel described above.

[0035] The beneficial effects of the technical proposal provided in the embodiments of this application include at least the following:

[0036] The display panel includes a substrate, a first metal drive layer, a light absorption layer, an auxiliary light absorption layer, and a plurality of light-emitting units. The orthographic projection of the light absorption layer onto the substrate and the orthographic projection of the drive layer onto the substrate overlap. In this way, the light absorption layer can absorb ambient light emitted to the display panel, thereby reducing the degree to which ambient light emitted to the display panel is reflected by the drive layer. This ensures that the reflectivity of the display panel to ambient light is low. Furthermore, by providing a light absorption layer on the display panel, the reflectivity of the display panel to ambient light can be reduced. Therefore, the transmittance of the auxiliary light absorption layer located on the side of the plurality of light-emitting units away from the substrate can be appropriately increased, reducing the absorption rate of light rays by the auxiliary light absorption layer, and further reducing the degree to which light rays emitted from the light-emitting units are absorbed by the auxiliary light absorption layer. In this way, the display panel does not need to supply a large drive current to the light-emitting units, the overall display brightness of the display panel can be increased, and consequently the power consumption of the display panel can be effectively reduced. [Brief explanation of the drawing]

[0037] To more clearly explain the technical concept in the embodiments of this application, the drawings necessary for describing the embodiments will be briefly described below. However, the drawings in the following description represent only a few embodiments of this application, and it is clear to a person skilled in the art that other drawings can be obtained based on these drawings without any creative work.

[0038] [Figure 1] This is a plan view of a display panel according to an embodiment of the present invention. [Figure 2] Figure 1 is a schematic diagram of the film layer structure at A-A' in the display panel shown. [Figure 3] This is a schematic diagram of the structure of the film layer of the display panel according to an embodiment of the present invention. [Figure 4] This is a schematic rear view of a display panel according to an embodiment of the present invention. [Figure 5] This is a partial side view of a display panel according to an embodiment of the present invention. [Figure 6]This is a schematic diagram of the structure of the film layer of the drive backplate in a display panel according to an embodiment of the present invention. [Figure 7] This is a schematic diagram of the structure of the film layer of the drive backplate in another display panel according to an embodiment of the present invention. [Figure 8] This is a schematic diagram of the structure of the film layer of the drive backplate in yet another display panel according to an embodiment of the present invention. [Figure 9] This is a schematic diagram of the structure of the film layer of the drive backplate in yet another display panel according to an embodiment of the present invention. [Figure 10] This is a partially enlarged view of the drive backplate in the display panel according to an embodiment of the present invention. [Figure 11] This is a schematic diagram of the structure of the film layer of the drive backplate in a display panel according to another embodiment of the present invention. [Figure 12] This is a schematic diagram of the structure of the film layer of the drive backplate in another display panel according to another embodiment of the present application. [Figure 13] This is a schematic diagram of the structure of the film layer of the drive backplate in yet another display panel according to another embodiment of the present application. [Figure 14] This is a schematic diagram of the structure of the film layer of the drive backplate in yet another display panel according to another embodiment of the present application. [Figure 15] This is a partial plan view of the drive backplate in a display panel according to an embodiment of the present invention. [Figure 16] This is a partial plan view of a display panel according to an embodiment of the present invention. [Figure 17] This is a schematic diagram of the structure of the film layer of the drive backplate in a display panel according to another embodiment of the present invention. [Figure 18] This is a schematic diagram of the structure of the film layer of the drive backplate in another display panel according to another embodiment of the present application. [Figure 19] This is a magnified view of the back portion of the display panel according to an embodiment of the present invention. [Figure 20] This is a partially enlarged view of the front of the display panel according to an embodiment of the present invention. [Figure 21] This is a schematic partial view of a single spacing area on the front of another display panel according to an embodiment of the present invention. [Figure 22] This is a schematic diagram of the structure of the film layer of the drive backplate in yet another display panel according to another embodiment of the present application. [Figure 23] This is a partially enlarged view of the front of another display panel according to an embodiment of the present invention. [Figure 24] This is a partially enlarged view of the front of yet another display panel according to an embodiment of the present invention. [Figure 25] This is a partially enlarged view of the front of yet another display panel according to an embodiment of the present invention. [Figure 26] This is a partially enlarged view of the front of a display panel according to another embodiment of the present invention. [Figure 27] This is a partially enlarged view of the front of another display panel according to another embodiment of the present application. [Modes for carrying out the invention]

[0039] To further clarify the purpose, technical proposal, and advantages of this application, embodiments of this application will be described in more detail below with reference to the drawings.

[0040] In related technologies, a black film is usually required on the LED display panel to reduce its reflectivity to ambient light. For example, in an LED display panel, the black film may be located on the side away from the drive backplate of the multiple LEDs. In this way, the black film can absorb some of the ambient light emitted to the LED display panel, reducing the degree to which the ambient light emitted to the LED display panel is reflected by the metal signal lines on the drive backplate.

[0041] However, in order to reduce the reflectivity of the LED display panel to ambient light, it is necessary to maintain a high absorption rate of light in the black film. When the absorption rate of light in the black film is high, the transmittance of the black film is low. For example, since the light transmittance of such black film is usually less than 30%, the absorption rate of light emitted from the LEDs in the black film is also high. Therefore, the drive backplate needs to supply a larger current to the LEDs, which ensures that the overall display brightness of the LEDs is high and the power consumption of the LED display panel is high.

[0042] Referring to Figures 1 and 2, Figure 1 is a plan view of a display panel according to an embodiment of the present application, and Figure 2 is a schematic diagram of the structure of the film layers at A to A' of the display panel shown in Figure 1. Here, the display panel 000 may include a substrate 100, a first metal driving layer 201, a light absorbing layer 300, an auxiliary light absorbing layer 500, and a plurality of light-emitting units 400.

[0043] The first metal drive layer 201 in the display panel 000 may be located on one side of the substrate 100, and the first metal drive layer 201 may have a plurality of conductive pads S. Here, the first metal drive layer 201 belongs to a metal layer with high reflectivity.

[0044] The light-absorbing layer 300 in the display panel 000 may be located on the side of the first metal drive layer 201 that is away from the substrate 100. Here, the orthographic projection of the light-absorbing layer 300 onto the substrate 100 and the orthographic projection of the first metal drive layer 201 onto the substrate 100 overlap. In this way, the light-absorbing layer 300 can absorb ambient light emitted onto the display panel 000, thereby reducing the degree to which ambient light emitted onto the display panel 000 is reflected by the first metal drive layer 201, and ensuring that the reflectivity of the display panel 000 to ambient light is low. Furthermore, the light-absorbing layer 300 in the display panel 000 may have a plurality of first vias V1 corresponding to a plurality of conductive pads S, and the orthographic projection of each first via V1 onto the substrate 100 and the orthographic projection of the corresponding conductive pad S onto the substrate 100 may overlap. For example, the orthographic projection of each first via V1 onto the substrate 100 may be located within the orthographic projection of the corresponding conductive pad S onto the substrate 100. This ensures that the light-absorbing layer 300 does not obstruct the conductive pad S, and that the conductive pad S can be electrically connected to the light-emitting unit 400.

[0045] For example, within the display area of ​​the display panel 000, the orthographic projection of the light-absorbing layer 300 on the display panel 000 onto the substrate 100 can cover the orthographic projection of the portion of the first metal drive layer 201 other than the conductive pad S onto the substrate 100. That is, within the display area of ​​the display panel 000, all portions of the first metal drive layer 201 other than the conductive pad S are shielded by the light-absorbing layer 300. The display area of ​​the display panel 000 is the area on the front of the display panel 000 where the screen can be displayed. Typically, the front of the display panel 000 further includes a non-display area distributed around the display area. In possible embodiments, the light-absorbing layer 300 on the display panel 000 may be distributed within the non-display area of ​​the display panel 000.

[0046] Since the conductive pad S in the first metal drive layer 201 needs to be connected to the light-emitting unit 400, the conductive pad S is shielded by the light-emitting unit 400, and the parts of the first metal drive layer 201 other than the conductive pad S all belong to the highly reflective metal parts and are not shielded by the light-emitting unit 400. Therefore, when the light-absorbing layer 300 covers the parts of the first metal drive layer 201 other than the conductive pad S, the overall reflectivity of the display panel 000 can be further reduced.

[0047] The multiple light-emitting units 400 in the display panel 000 may all be located on the side of the light-absorbing layer 300 away from the substrate 100. Here, the light-emitting units 400 may be electrically connected to at least some of the conductive pads S via the first via V1. In this application, the display panel 000 further includes a drive structure layer distributed on the side of the first metal drive layer 201 toward the substrate 100, and the drive structure layer may be electrically connected to the first metal drive layer 201. In this way, the drive structure layer and the first metal drive layer 201 work together to drive the light-emitting units 400 via the conductive pads S and emit light. The portion of the display panel 000 located below the multiple light-emitting units 400 is the drive backplate of the display panel 000, that is, the drive backplate may include the substrate 100 and the first metal drive layer 201 and light-absorbing layer 300 located on one side of the substrate 100. The multiple light-emitting units 400 in the display panel 000 may all be installed on the drive backplate. Here, "below the multiple light-emitting units 400" means the side opposite to the direction of light emission from the multiple light-emitting units 400.

[0048] In this application, the light-emitting unit 400 in the display panel 000 may include an LED. In one possible embodiment, the drive backplate in the display panel 000 can directly drive the LED to emit light. In this case, the LED can be driven directly to emit light via the drive backplate in the display panel 000.

[0049] In another possible embodiment, as shown in Figure 3, Figure 3 is a schematic diagram of the structure of the film layer of a display panel according to an embodiment of the present invention, and the light-emitting unit 400 in the display panel 000 may further include not only an LED 401 but also a drive chip 402. Here, both the LED 401 and the drive chip 402 in the light-emitting unit 400 need to be electrically connected to the first metal drive layer 201 in the display panel 000 via a conductive pad S. In this case, the drive backplate and the drive chip 402 in the display panel 000 need to drive the LED 401 to emit light at the same time.

[0050] The LED in the light-emitting unit 400 may be a standard-sized LED, a mini light-emitting diode (mini-LED), or a micro light-emitting diode (micro-LED).

[0051] In the embodiments of the present invention, there are significant differences in the outer surface color of the LEDs in different light-emitting units 400, and for light-emitting units 400 that include both LEDs and light-emitting chips, there are also significant differences between the outer surface color of the LED 401 and the outer surface color of the drive chip 402. Therefore, it is necessary to provide an auxiliary light-absorbing layer 500 on the display panel 000. Here, the auxiliary light-absorbing layer 500 is located on the side of the multiple light-emitting units 400 away from the substrate 100, and the auxiliary light-absorbing layer 500 covers both the LED 401 and the drive chip 402 in each light-emitting unit 400 simultaneously. The auxiliary light-absorbing layer 500 is also commonly called a black film. When the auxiliary light-absorbing layer 500 covers both the LED 401 and the driver chip 402 simultaneously, the outer surfaces of both the LED 401 and the driver chip 402 can appear black. This effectively eliminates color differences on the outer surfaces of LEDs in different light-emitting units 400, and also effectively eliminates color differences between the outer surfaces of the LED 401 and the driver chip 402.

[0052] In this invention, by providing a light-absorbing layer 300 on the display panel 000, the reflectivity of the display panel 000 to ambient light can be reduced. This allows for an appropriate increase in the transmittance of the auxiliary light-absorbing layer 500 (i.e., black film) located on the side of the multiple light-emitting units 400 away from the substrate 100. For example, the transmittance of the auxiliary light-absorbing layer 500 to light emitted from the light-emitting units 400 is 50% or more. On the other hand, if the display panel is not provided with a light-absorbing layer, the light transmittance of the black film on the display panel must be 30% or less, thereby ensuring that the reflectivity of the display panel to ambient light is low. Therefore, after installing the light-absorbing layer 300 on the display panel 000, it is possible to ensure that the absorption rate of the auxiliary light-absorbing layer 500 to light is low, and furthermore, that the degree to which light emitted from the light-emitting units 400 is absorbed by the auxiliary light-absorbing layer 500 is low. In this way, the display panel 000 does not need to supply a large drive current to the light-emitting unit 400, the overall display brightness of the display panel 000 can be increased, and the power consumption of the display panel can be effectively reduced. Preferably, the auxiliary light absorption layer 500 has a transmittance of 60% or more to light rays emitted from the light-emitting unit 400.

[0053] In the embodiments of the present invention, the transmittance of the auxiliary light absorption layer 500 in the display panel 000 may be 90% or less. This ensures that the color difference of the outer surface of the LEDs in different light-emitting units 400 is small, and that for light-emitting units 400 that include both LEDs and light-emitting chips, the color difference between the outer surface of the LEDs and light-emitting chips in such light-emitting units 400 is small.

[0054] As one option, the light-absorbing layer 300 in the display panel 000 includes an organic film layer made of an organic material having light-absorbing properties. Exemplarily, such an organic material may be a black matrix (BM) material. That is, the light-absorbing layer 300 may be manufactured using a BM material. Because BM materials have excellent light-absorbing properties, when the light-absorbing layer 300 is manufactured using a BM material, the light-absorbing layer 300 has a high degree of absorption of ambient light emitted to the display panel 000, and the light-absorbing layer 300 can effectively reduce the reflectivity of the display panel 000 to ambient light. For example, the BM material may include an organic material and a plurality of carbon particles dispersed within the organic material. Here, the degree of absorption of light by the BM material can be adjusted by adjusting the concentration of carbon particles packed into the organic material. The organic materials used herein may include organic resins, polyimide (abbreviated as PI), polyvinyl alcohol (abbreviated as PVA), polyester (abbreviated as PET), or polyethylene naphthalate (abbreviated as PEN).

[0055] As one option, the thickness range of the light-absorbing layer 300 in the above embodiment may be 0.5 micrometers to 5 micrometers. Here, the greater the thickness of the light-absorbing layer 300, the greater the absorption rate of the light-absorbing layer 300 for light rays.

[0056] For example, the optical density (OD) value of the light-absorbing layer 300 is 4 or greater. Here, the OD value of the light-absorbing layer 300 is used to refer to the degree of absorption of light rays by the light-absorbing layer 300. In this case, the larger the OD value of the light-absorbing layer 300, the greater the absorption rate of light rays by the light-absorbing layer 300.

[0057] In the embodiments of the present invention, the auxiliary light absorption layer 500 in the display panel 000 may include a protective film and a light-absorbing colloid located on the side of the protective film facing the substrate 100. Here, the protective film in the auxiliary light absorption layer 500 may be bonded by the light-absorbing colloid to the side of the light-emitting unit 400 of the display panel 000 that is away from the substrate 100. Therefore, the protective layer in the auxiliary light absorption layer 500 can further protect the light-emitting unit 400 in the display panel 000 and prevent scratches on the surface of the light-emitting unit 400.

[0058] Here, the light-absorbing colloid in the auxiliary light-absorbing layer 500 may include a transparent colloid having adhesive properties and a light-absorbing dye mixed within the transparent colloid. For example, the light-absorbing dye may be a black dye.

[0059] As described above, the display panel according to the embodiment of the present invention includes a substrate, a first metal driving layer, a light absorption layer, an auxiliary light absorption layer, and a plurality of light-emitting units. The orthographic projection of the light absorption layer onto the substrate and the orthographic projection of the driving layer onto the substrate overlap. In this way, the light absorption layer can absorb ambient light emitted to the display panel, thereby ensuring that the degree to which ambient light emitted to the display panel is reflected by the driving layer is low, and that the reflectivity of the display panel to ambient light is low. Furthermore, by providing a light absorption layer on the display panel, the reflectivity of the display panel to ambient light can be reduced. Therefore, the transmittance of the auxiliary light absorption layer located on the side of the plurality of light-emitting units away from the substrate can be appropriately increased, thereby reducing the absorption rate of light by the auxiliary light absorption layer, and further reducing the degree to which light emitted from the light-emitting units is absorbed by the auxiliary light absorption layer. In this way, the display panel does not need to supply a large driving current to the light-emitting units, the overall display brightness of the display panel can be increased, and consequently the power consumption of the display panel can be effectively reduced.

[0060] In the embodiment of the present invention, the display panel 000 may be a single splice display unit in a splice screen. In this way, a larger splice screen can be obtained after splicing multiple display panels 000. When the display panel 000 is used as a splice display unit, it is necessary to ensure that the width of the frame of the display panel 000 is narrow. For this reason, in the present invention, the drive assembly must be bound to the display panel 000 using a back binding method.

[0061] Exemplary, as shown in Figure 4, Figure 4 is a schematic rear view of a display panel according to an embodiment of the present invention. The edge drive of the surface of the substrate 100 away from the first metal drive layer 201 in the display panel 000 may include a binding region F. The display panel 000 may further include a plurality of signal leads D1 located within the binding region F. Here, at least some of the signal leads D1 may be electrically connected to the first metal drive layer 201 in the display panel 000. Here, the plurality of signal leads D1 in the binding region F are bound to a drive assembly, thereby enabling the drive assembly to be bonded to the display panel 000. In this way, the drive assembly can transmit drive signals to the first metal drive layer 201 via the signal leads D1, thereby illuminating the corresponding light-emitting unit 400. If the drive assembly is bound to the back of the display panel 000, the drive assembly does not occupy space in front of the display panel 000, ensuring a relatively high screen occupancy rate in front of the display panel 000, and consequently, a narrow bezel width for the display panel 000.

[0062] As one option, as shown in Figure 5, Figure 5 is a partial side view of a display panel according to an embodiment of the present invention. The display panel 000 may further include a plurality of connection wires D2 that are electrically connected to a plurality of signal leads D1, a portion of which the connection wires D2 are located on the side of the substrate 100 closer to the first metal drive layer 201, and this portion of the connection wires D2 may be electrically connected to the drive structure layer in the display panel 000. Another portion of the connection wires D2 are located on the side of the substrate 100, and this portion of the connection wires D2 may be electrically connected to the corresponding signal leads D1 toward the rear end of the display panel 000.

[0063] Here, multiple connection lines D2 and multiple signal leads D1 are formed by the same process. For example, multiple connection lines D2 and multiple signal leads D1 can be formed simultaneously using a laser etching process. Exemplarily, after manufacturing a drive backplate, a single conductive layer can be sputtered into the edge region on the front of the drive backplate, the side of the drive backplate, and the binding region on the back of the drive backplate, and then a single laser etching process can be performed on the conductive layer to simultaneously form multiple connection lines D2 and multiple signal leads D1.

[0064] Furthermore, in the process of forming multiple signal leads D1 located within the bonding region F using a laser etching process, it is necessary to irradiate the bonding region F with a laser (for example, a laser with a wavelength between 350 nanometers and 390 nanometers). In this process, the laser may irradiate the portion of the light absorption layer 300 distributed within the bonding region F after passing through the substrate 100, and the light absorption layer 300 is manufactured using an organic material that has light-absorbing properties. Thus, the light absorption layer 300 suffers from a defect called bubbling due to the laser irradiation, resulting in low flatness of the light absorption layer 300.

[0065] Therefore, as shown in Figure 2, the display panel 000 in the embodiment of the present application may further include a light-reflecting layer 600 located between the substrate 100 and the light-absorbing layer 300. Here, the orthographic projection of the light-reflecting layer 600 onto the substrate 100 and the orthographic projection of the light-absorbing layer 300 onto the substrate 100 may overlap.

[0066] For example, the light-reflecting layer 600 reflects the laser that has passed through the substrate 100 and irradiated onto the light-absorbing layer 300, thereby ensuring that this laser does not irradiate the light-absorbing layer 300. This effectively avoids a problem called bubbling in the light-absorbing layer 300, increases the flatness of the light-absorbing layer 300, and improves the reliability of the display panel 000.

[0067] As one option, the material of the light-reflecting layer 600 in the display panel 000 may include amorphous silicon, low-temperature polysilicon, or white ink. In a possible embodiment, if the material of the light-reflecting layer 600 includes amorphous silicon, since amorphous silicon belongs to the category of inorganic insulating materials and has a high refractive index, a laser (for example, a laser with a wavelength between 350 nanometers and 390 nanometers) emitted onto amorphous silicon is extremely easily reflected. Furthermore, the thickness range of the light-reflecting layer 600 is 500 angstroms to 2000 angstroms, and in this way, the laser light irradiated onto the light-reflecting layer 600 is reflected by the light-reflecting layer 600, thereby preventing the laser light from irradiating the light-absorbing layer 300.

[0068] In another possible embodiment, if the material in the light-reflecting layer 600 includes low-temperature polysilicon, since low-temperature polysilicon is a semiconductor material and also has a high refractive index, laser light emitted onto the low-temperature polysilicon (for example, laser light with a wavelength between 350 nm and 390 nm) is extremely easily reflected. Furthermore, the thickness range of the light-reflecting layer 600 is 500 angstroms to 2000 angstroms, and in this way, laser light irradiated onto the light-reflecting layer 600 is reflected by the light-reflecting layer 600, thereby preventing the laser light from irradiating the light-absorbing layer 300.

[0069] In yet another possible embodiment, if the material of the light-reflecting layer 600 includes white ink, the white ink is a scattering organic insulating material, and the thickness range of the light-reflecting layer 600 is 0.5 micrometers to 3 micrometers. In this way, the laser irradiated onto the light-reflecting layer 600 is reflected by the light-reflecting layer 600, and the reflected laser is scattered and emitted, thereby preventing the laser from irradiating the light-absorbing layer 300.

[0070] In the embodiments of the present application, the structure of the drive structure layer located on the substrate-facing side of the first metal drive layer 201 in the display panel 000 can vary. For example, the drive structure layer may be a second metal drive layer 202, or it may include a plurality of drive circuits. Also, the position of the light-reflecting layer 600 distributed between the substrate 100 and the light-absorbing layer 300 in the display panel 000 can vary. For this reason, embodiments of the present application will be described using the following four selectable embodiments as examples.

[0071] Referring to Figure 6 in a first selectable embodiment, Figure 6 is a schematic diagram of the structure of the film layer of the drive backplate in a display panel according to an embodiment of the present application. Here, the drive backplate in the display panel 000 means the portion of the display panel 000 that does not include the light-emitting unit 400. The light-reflecting layer 600 in the display panel 000 may be located on the side of the first metal drive layer 201 away from the substrate 100, and the display panel 000 may further include a second metal drive layer 202 located on the side of the first metal drive layer 201 closer to the substrate 100. That is, the light-reflecting layer 600 is located between the first metal drive layer 201 and the light-absorbing layer 300, and the drive structure layer in the display panel 000 may be the second metal drive layer 202. In this case, the light-reflecting layer 600 may have a second via V2 that communicates with the first via V1, and in this way, the light-emitting unit 400 in the display panel 000 may be electrically connected to the conductive pad S via the first via V1 and the second via V2.

[0072] In this application, when the light-reflecting layer 600 is located between the first metal driving layer 201 and the light-absorbing layer 300, the second via V2 in the light-reflecting layer 600 and the first via V1 in the light-absorbing layer 300 are formed simultaneously by the same single patterning process. Here, the single patterning process may include photoresist coating, exposure, development, etching, and photoresist stripping. In this case, the light-reflecting layer 600 and the light-absorbing layer 300, which are installed across the entire layer, may first be formed sequentially, and then the first via V1 may be formed in the light-absorbing layer 300 using a single patterning process, and the second via V2 communicating with the first via V1 may be formed in the light-reflecting layer 600. In this way, the process difficulty of the display panel 000 can be effectively simplified.

[0073] As one option, the orthographic projection of the light-absorbing layer 300 onto the substrate 100 may be located within the orthographic projection of the light-reflecting layer 600 onto the substrate 100. In this way, during the process of forming multiple signal leads D1 located within the binding region F using a laser etching process, the laser irradiated onto the binding region F can be transmitted through the substrate 100 and, after passing through the first metal driving layer 201, be completely reflected by the light-reflecting layer 600, thereby ensuring that the laser does not irradiate the light-absorbing layer 300.

[0074] In the embodiment of the present application, the display panel 000 may further include a first insulating layer 700 located between the first metal driving layer 201 and the light absorbing layer 300. Here, the first insulating layer 700 may have a third via V3 communicating with a first via V1, and in this way, the light-emitting unit 400 in the display panel 000 may be electrically connected to the conductive pad S via the first via V1 and the third via V3.

[0075] Furthermore, since the light-absorbing layer 300 in the display panel 000 also has insulating properties, the light-absorbing layer 300 may be in direct contact with the side of the first metal drive layer 201 away from the substrate 100, or the first insulating layer 700 may be in direct contact with the side of the drive layer 200 away from the substrate 100. For this reason, the embodiments of the present invention will be described using the following three cases as examples.

[0076] In the first case, as shown in Figure 6, the first insulating layer 700 in the display panel 000 is in direct contact with the side of the drive layer 200 away from the substrate 100. The light reflective layer 600 in the display panel 000 is located on the side of the first insulating layer 700 away from the substrate 100. In this case, the first via V1 of the light absorbing layer 300, the second via V2 of the light reflective layer 600, and the third via V3 of the first insulating layer 700 are sequentially connected, and the light-emitting unit 400 may be electrically connected to the conductive pad S sequentially via the first via V1, the second via V2, and the third via V3. Furthermore, the first via V1 of the light absorbing layer 300, the second via V2 of the light reflective layer 600, and the third via V3 of the first insulating layer 700 can be formed simultaneously in a single patterning process.

[0077] In this case, the material of the light-reflecting layer 600 in the display panel 000 may be amorphous silicon or white ink. Furthermore, the first insulating layer 700 may be manufactured using an inorganic material with relatively good moisture and oxygen barrier properties. In this way, when the first insulating layer 700 is in direct contact with the side of the first metal drive layer 201 away from the substrate 100, the first insulating layer 700 can ensure that moisture and oxygen in the external environment do not corrode the first metal drive layer 201 from the side away from the substrate 100, and can effectively reduce the probability of the first metal drive layer 201 being oxidized and corroded. In addition, if the material of the light-reflecting layer 600 is amorphous silicon, amorphous silicon also belongs to the category of inorganic insulating materials, so the effect of protecting the first metal drive layer 201 can be further enhanced by laminating the first insulating layer 700 and the light-reflecting layer 600.

[0078] In the second case, referring to Figure 7, which is a schematic diagram of the structure of the film layer of the drive backplate in another display panel according to an embodiment of the present application. The light-reflecting layer 600 in the display panel 000 is in direct contact with the side of the drive layer 200 away from the substrate 100. The first insulating layer 700 in the display panel 000 is located on the side of the light-reflecting layer 600 away from the substrate 100. In this case, the first via V1 of the light-absorbing layer 300, the third via V3 of the first insulating layer 700, and the second via V2 of the light-reflecting layer 600 are sequentially connected, and the light-emitting unit 400 may be electrically connected to the conductive pad S sequentially via the first via V1, the third via V3, and the second via V2. Furthermore, the first via V1 of the light-absorbing layer 300, the third via V3 of the first insulating layer 700, and the second via V2 of the light-reflecting layer 600 can be formed simultaneously in a single patterning process.

[0079] In this case, the material of the light-reflecting layer 600 in the display panel 000 must be amorphous silicon. Since amorphous silicon belongs to the category of inorganic insulating materials, the light-reflecting layer 600 can ensure that moisture and oxygen in the external environment do not corrode the first metal driving layer 201 from the side of the first metal driving layer 201 away from the substrate 100, and can effectively reduce the probability of the first metal driving layer 201 being oxidized and corroded. Furthermore, the first insulating layer 700 may be manufactured using an inorganic material with relatively good moisture and oxygen barrier properties, or it may be manufactured using an organic material with good flatness, and the embodiments of this application are not limited thereto.

[0080] In the third case, referring to Figure 8, which is a schematic diagram of the structure of the film layer of the drive backplate in another display panel according to an embodiment of the present invention. The light-reflecting layer 600 in the display panel 000 is in direct contact with the side of the drive layer 200 away from the substrate 100, and the light-reflecting layer 600 and the first insulating layer 700 in the display panel 000 have the same film layer structure. In this case, the light-reflecting layer 600 in the display panel 000 may reflect the laser and may insulate the first metal drive layer 201 and the light-absorbing layer 300. Furthermore, the number of layers in the film layer structure of the display panel 000 can be reduced, and the manufacturing cost of the display panel 000 can be reduced.

[0081] In this case, the material of the light-reflecting layer 600 in the display panel 000 must be amorphous silicon. In this way, the light-reflecting layer 600 ensures that moisture and oxygen in the external environment do not corrode the first metal drive layer 201 from the side of the first metal drive layer 201 away from the substrate 100, and effectively reduces the probability of the first metal drive layer 201 being oxidized and corroded.

[0082] In a second optional embodiment, referring to Figure 9, Figure 9 is a schematic diagram of the structure of a film layer of a drive backplate in yet another display panel according to an embodiment of the present application. The light-reflecting layer 600 in the display panel 000 may be located on the side of the first metal drive layer 201 closer to the substrate 100, and the display panel 000 may further include a second metal drive layer 202 located on the side of the first metal drive layer 201 closer to the substrate 100. That is, the light-reflecting layer 600 may be located between the first metal drive layer 201 and the substrate 100, and the drive structure layer in the display panel 000 may be the second metal drive layer 202. Exemplarily, the light-reflecting layer 600 may be located between the second metal drive layer 202 and the substrate 100. Thus, in the process of forming multiple signal leads D1 located within the bonding region F using a laser etching process, the laser irradiated onto the bonding region F is completely reflected by the light reflection layer 600 after passing through the substrate 100, thereby ensuring that the laser does not irradiate the light absorption layer 300. Here, if the light reflection layer 600 can be located between the second metal driving layer 202 and the substrate 100, the laser irradiated onto the bonding region F does not need to pass through the first metal driving layer 201 after passing through the substrate 100, but can be reflected by the light reflection layer 600, thereby increasing the efficiency of the light reflection layer 600 in reflecting the laser.

[0083] Referring to Figure 10 in an embodiment of the present application, Figure 10 is a partially enlarged view of the drive backplate in a display panel according to an embodiment of the present application. At least one of the first metal drive layer 201 and the second metal drive layer 202 in the display panel 000 has a mark pattern M. Here, after providing the mark pattern M in at least one of the drive layers of the first metal drive layer 201 and the second metal drive layer 202, in the subsequent process of installing a plurality of signal leads in the binding region on the back surface of the substrate 100, or binding a drive assembly in the binding region on the back surface of the substrate 100, the position of at least one of the first metal drive layer 201 and the second metal drive layer 202 on the substrate 100 can be determined based on the mark pattern M. As a result, the signal leads formed in the binding region can be accurately electrically connected to the first metal drive layer 201 and the second metal drive layer 202, and the drive assembly can be accurately bound in the binding region.

[0084] When the light-reflecting layer 600 of the display panel 000 is located between the substrate 100 and the second metal drive layer 202, the light-reflecting layer 600 shields the mark pattern M in at least one of the drive layers, the first metal drive layer 201 and the second metal drive layer 202, thereby preventing the mark pattern M from being recognized from the back surface of the substrate 100. For this reason, the light-reflecting layer 600 needs to have a relief hole K. Here, the orthographic projection of the relief hole K in the light-reflecting layer 600 onto the substrate 100 may overlap with the orthographic projection of the mark pattern M in the first metal drive layer 201 onto the substrate 100. For example, the orthographic projection of the mark pattern M onto the substrate 100 may be located within the orthographic projection of the relief hole K onto the substrate 100. In this way, by exposing the mark pattern M in at least one of the drive layers, the first metal drive layer 201 and the second metal drive layer 202, through the relief hole K in the light-reflecting layer 600, the mark pattern M can be recognized from the back surface of the substrate 100. Furthermore, the orthographic projection of the mark pattern M onto the substrate 100 and the orthographic projection of the escape hole K onto the substrate 100 have the same shape, and the distance between the boundary of the orthographic projection of the mark pattern M onto the substrate 100 and the boundary of the orthographic projection of the escape hole K onto the substrate 100 is small, for example, the distance between them may usually be 1 micrometer or less. In this way, in the process of forming a plurality of signal leads D1 located within the bonding region F using a laser etching process, it is possible to ensure that even if the laser passes through the escape hole K in the light reflection layer 600, the laser passing through the escape hole K is shielded by the mark pattern M.

[0085] In the first selectable embodiment described above, that is, when the light-reflecting layer 600 in the display panel 000 is located between the first metal drive layer 201 and the light-absorbing layer 300, the first metal drive layer 201 is closer to the substrate 100 than the light-reflecting layer 600. Therefore, the light-reflecting layer 600 does not obstruct the first metal drive layer 201 from the back side of the substrate 100, and as a result, even without providing a relief hole in the light-reflecting layer 600, the mark pattern M in at least one of the drive layers, either the first metal drive layer 201 or the second metal drive layer 202, can be recognized from the back side of the substrate 100. In this case, the light-reflecting layer 600 in the display panel 000 does not need to be formed by a separate patterning process, and the light-reflecting layer 600 and the light-absorbing layer 300 can be formed simultaneously by a single patterning process, further simplifying the manufacturing difficulty of the display panel 000.

[0086] As one of the options, in the first and second selectable embodiments described above, the display panel 000 can emit light by driving the light-emitting unit 400 in the display panel 000 through the combined action of the first metal driving layer 201 and the second metal driving layer 202, and the light-emitting unit 400 in such a display panel 000 must simultaneously include an LED 401 and a driving chip 402. The following embodiments describe other structures within such a display panel 000 and the driving principle of the display panel 000.

[0087] As shown in Figures 6 to 9, the display panel 000 may further include a first inorganic protective layer 801 located between the second metal drive layer 202 and the substrate 100. Here, the first inorganic protective layer 801 can ensure that moisture and oxygen in the external environment do not erode the first metal drive layer 201 from the side of the first metal drive layer 201 closer to the substrate 100, thereby further reducing the probability of the first metal drive layer 201 being oxidized and corroded.

[0088] In the first selectable embodiment described above, that is, when the light-reflecting layer 600 in the display panel 000 is located between the first metal drive layer 201 and the light-absorbing layer 300, the first inorganic protective layer 801 in the display panel 000 may be in direct contact with the side of the first metal drive layer 201 that is closer to the substrate 100.

[0089] Regarding the second selectable embodiment described above, that is, when the light-reflecting layer 600 in the display panel 000 is located between the second metal drive layer 202 and the substrate 100, and the material of the light-reflecting layer 600 is amorphous silicon, the inorganic protective layer 801 may be located on the side of the light-reflecting layer 600 closer to the substrate 100, or on the side of the light-reflecting layer 600 further away from the substrate 100. Of course, the inorganic protective layer 801 and the light-reflecting layer 600 may have the same film layer structure, and the embodiments of this application are not limited thereto. When the material of the light-reflecting layer 600 is white ink, the inorganic protective layer 801 needs to be installed on the side of the light-reflecting layer 600 further away from the substrate 100, so that the inorganic protective layer 801 can directly contact the side of the second metal drive layer 202 closer to the substrate 100, and the inorganic protective layer 801 can better protect the first metal drive layer 201.

[0090] As an option, as shown in Figures 6 to 9, the display panel 000 may further include a second insulating layer 900 located on the side of the light-absorbing layer 300 away from the substrate 100. In this way, the second insulating layer 900 can protect the light-absorbing layer 300 in the display panel 000, ensuring that the light-absorbing layer 300 is not damaged and that the shielding effect on the first metal drive layer 201 and the second metal drive layer 202 is not impaired.

[0091] In this application, the second insulating layer 900 may have a fourth via V4 that communicates with the first via V1. In this case, the multiple light-emitting units 400 in the display panel 000 may be distributed on the side of the second insulating layer 900 away from the substrate 100, and the light-emitting units 400 may be electrically connected to the conductive pad S via the fourth via V4 and the first via V1.

[0092] As one option, as shown in Figures 6 to 9, a portion of the second insulating layer 900 may extend into the first via V1, and the portion of the second insulating layer 900 that extends into the first via V1 may cover at least a portion of the inner wall of the first via V1. In this case, the portion of the second insulating layer 900 that extends into the first via V1 has a fourth via V4 that communicates with the first via V1, and the orthographic projection of the fourth via V4 onto the substrate 100 may be located within the orthographic projection of the first via V1 onto the substrate 100. In this way, the portion of the second insulating layer 900 that extends into the first via V1 can protect at least a portion of the inner wall of the first via V1.

[0093] For example, the inner wall of the first via V1 of the light-absorbing layer 300 may be completely covered by the second insulating layer 900. That is, the portion of the second insulating layer 900 that penetrates into the first via V1 can completely cover the inner wall of the first via V1. In this case, by covering the light-absorbing layer 300 at each position with the second insulating layer 900, it is possible to ensure that the light-absorbing layer 300 is not exposed.

[0094] In one possible scenario, the light-absorbing layer 300 in the display panel 000 typically contains carbon particles. These carbon particles give the light-absorbing layer 300 a light-absorbing function. During the manufacturing process of the display panel 000, it is necessary to immerse the display panel 000 in a gold plating bath. The solution in the gold plating bath (usually an acidic or alkaline solution) will deposit carbon particles in the light-absorbing layer 300, contaminating the gold plating bath. Therefore, to prevent contamination of the gold plating bath, the portion of the second insulating layer 900 that enters the first via V1 must completely cover the inner wall of the first via V1. This ensures that the light-absorbing layer 300 is not exposed, and that when the display panel 000 is immersed in the gold plating bath, the solution in the gold plating bath does not deposit carbon particles in the light-absorbing layer 300, thereby ensuring that the gold plating bath is not contaminated.

[0095] In the first selectable embodiment described above, that is, when the light-reflecting layer 600 in the display panel 000 is located between the first metal driving layer 201 and the light-absorbing layer 300, as shown in Figures 6 to 8, the portion of the second insulating layer 900 that extends into the first via V1 may extend into the second via V2 and cover at least a portion of the inner wall of the second via V2. Similarly, the portion of the second insulating layer 900 that extends into the first via V1 may extend into the third via V3 and cover at least a portion of the inner wall of the third via V3. Exemplarily, the inner wall of the second via V2 may be completely covered by the second insulating layer 900, and the inner wall of the third via V3 may be completely covered by the second insulating layer 900.

[0096] In embodiments of the present application, there are multiple types of the second insulating layer 900 in the display panel 000. For example, the second insulating layer 900 may include at least one of an inorganic insulating layer and an organic insulating layer. Here, the second insulating layer 900 in the display panel 000 includes both an inorganic insulating layer 901 and an organic insulating layer 902, and the fourth via V4 in the second insulating layer 900 may include a communicating first sub-opening V41 and a second sub-opening V42. Here, the first sub-opening V41 is located in the inorganic insulating layer 901, and the second sub-opening V42 is located in the organic insulating layer 902. Embodiments of the present application will be schematically described using the following four possible situations as examples.

[0097] In the first possible scenario, as shown in Figure 11, Figure 11 is a schematic diagram of the structure of the film layer of the drive backplate in a display panel according to another embodiment of the present application. When the second insulating layer 900 in the display panel 000 is a single-layer film layer structure and the second insulating layer 900 is an inorganic insulating layer 901, a portion of the inorganic insulating layer 901 penetrates into the first via V1, and the portion of the inorganic insulating layer 901 that penetrates into the first via V1 can completely cover the inner wall of the first via V1, thereby ensuring that the light absorbing layer 300 is not exposed.

[0098] Furthermore, the portion of the inorganic insulating layer 901 located outside the first via V1 may be in contact with the side of the light absorbing layer 300 that is away from the substrate 100. In this way, the portion of the inorganic insulating layer 901 located outside the first via V1 protects the light absorbing layer 300 from the side of the light absorbing layer 300 that is away from the substrate 100, and the portion of the inorganic insulating layer 901 located inside the first via V1 protects the light absorbing layer 300 from the inner wall of the first via V1. Here, since the inorganic insulating layer 901 has excellent moisture and oxygen barrier capabilities, when the light absorbing layer 300 is covered and protected by the inorganic insulating layer 901, the protective effect on the light absorbing layer 300 can be effectively enhanced.

[0099] In a second possible scenario, as shown in Figure 12, Figure 12 is a schematic diagram of the film layer structure of a drive backplate in another display panel according to another embodiment of the present application. When the second insulating layer 900 in the display panel 000 is a single-layer film layer structure and the second insulating layer 900 is an organic insulating layer 902, the portion of the organic insulating layer 902 that penetrates into the first via V1 can completely cover the inner wall of the first via V1 so that the light absorbing layer 300 is not exposed.

[0100] Furthermore, the portion of the organic insulating layer 902 located outside the first via V1 may be in contact with the side of the light absorbing layer 300 that is away from the substrate 100. In this way, the portion of the organic insulating layer 902 located outside the first via V1 protects the light absorbing layer 300 from the side of the light absorbing layer 300 that is away from the substrate 100, and the portion of the organic insulating layer 902 located inside the first via V1 protects the light absorbing layer 300 from the inner wall of the first via V1. Here, since the organic insulating layer 902 can adhere well to the light absorbing layer 300, the portion of the organic insulating layer 902 that enters the first via V1 can be in close contact with the inner wall of the first via V1.

[0101] Furthermore, since the organic insulating layer 902 has relatively good flatness, when the organic insulating layer 902 is provided on the side of the light absorbing layer 300 away from the substrate 100, it is possible to guarantee that the flatness of the side of the organic insulating layer 902 away from the substrate 100 is good. In this case, since the side of the organic insulating layer 902 away from the substrate 100 is the outermost part of the drive backplate, when a plurality of light-emitting units 400 are subsequently formed on the drive backplate, it is possible to guarantee that the surfaces of each light-emitting unit 400 away from the substrate 100 are flush, thereby guaranteeing that the display effect of the display panel 000 is good.

[0102] In a third possible scenario, as shown in Figure 13, Figure 13 is a schematic diagram of a film layer structure of a drive backplate in yet another display panel according to another embodiment of the present application. If the second insulating layer 900 in the display panel 000 is a two-layer film layer structure, i.e., the second insulating layer 900 simultaneously includes an inorganic insulating layer 901 and an organic insulating layer 902, and the inorganic insulating layer 901 is closer to the light-absorbing layer 300 than the organic insulating layer 902, then a portion of the inorganic insulating layer 602 penetrates into the first via V1 and covers the inner wall of the first via V1, and / or a portion of the organic insulating layer 902 penetrates into the first via V1 and covers the inner wall of the first via V1.

[0103] For example, in Figure 13, both the inorganic insulating layer 901 and the organic insulating layer 902 have portions that penetrate into the first via V1, and the portion of the inorganic insulating layer 901 that penetrates into the first via V1 can completely cover the inner wall of the first via V1, and the portion of the organic insulating layer 603 that penetrates into the first via V1 can completely cover the portion of the inorganic insulating layer 901 that is not inside the first via V1. This ensures that the light absorbing layer 300 is not exposed.

[0104] Furthermore, the portion of the inorganic insulating layer 901 located outside the first via V1 may be in contact with the side of the light absorbing layer 300 away from the substrate 100, and the portion of the organic insulating layer 902 located outside the first via V1 may be in contact with the side of the inorganic insulating layer 901 away from the substrate 100. In this way, the portions of the inorganic insulating layer 901 and the organic insulating layer 902 located outside the first via V1 protect the light absorbing layer 300 from the side of the light absorbing layer 300 away from the substrate 100, and the portions of the inorganic insulating layer 901 and the organic insulating layer 902 located inside the first via V1 protect the light absorbing layer 300 from the inner wall of the first via V1.

[0105] Furthermore, since the organic insulating layer 902 has good flatness, if the organic insulating layer 902 is located on the side of the inorganic insulating layer 901 away from the substrate 100, it can be guaranteed that the flatness of the side of the organic insulating layer 902 away from the substrate 100 is good. In this case, since the side of the organic insulating layer 902 away from the substrate 100 is the outermost part of the drive backplate, when a plurality of light-emitting units 400 are subsequently formed on the drive backplate, it can be guaranteed that the surfaces of each light-emitting unit 400 away from the substrate 100 are flush, thereby guaranteeing that the display effect of the display panel 000 is good.

[0106] In a fourth possible scenario, as shown in Figure 14, Figure 14 is a schematic diagram of the structure of a film layer for driving a backplate in yet another display panel according to another embodiment of the present application. If the second insulating layer 900 in the display panel 000 is a two-layer film structure, i.e., the second insulating layer 900 simultaneously includes an inorganic insulating layer 901 and an organic insulating layer 902, and the organic insulating layer 902 is closer to the light-absorbing layer 300 than the inorganic insulating layer 901, then a portion of the organic insulating layer 902 penetrates into the first via V1 and covers the inner wall of the first via V1, and / or a portion of the inorganic insulating layer 602 penetrates into the first via V1 and covers the inner wall of the first via V1.

[0107] For example, in Figure 14, both the organic insulating layer 902 and the inorganic insulating layer 901 have portions that penetrate into the first via V1, and the portion of the organic insulating layer 902 that penetrates into the first via V1 can completely cover the inner wall of the first via V1, and the portion of the inorganic insulating layer 901 that penetrates into the first via V1 can completely cover the portion of the organic insulating layer 902 that is separated from the interior of the first via V1. This ensures that the light absorbing layer 300 is not exposed.

[0108] Furthermore, the portion of the organic insulating layer 902 located outside the first via V1 may be in contact with the side of the light absorbing layer 300 away from the substrate 100, and the portion of the inorganic insulating layer 901 located outside the first via V1 may be in contact with the side of the organic insulating layer 902 away from the substrate 100. In this way, the portions of the organic insulating layer 902 and the inorganic insulating layer 901 located outside the first via V1 protect the light absorbing layer 300 from the side of the light absorbing layer 300 away from the substrate 100, and the portions of the organic insulating layer 902 and the inorganic insulating layer 901 located inside the first via V1 protect the light absorbing layer 300 from the inner wall of the first via V1.

[0109] Here, since the organic insulating layer 902 can adhere well to the light absorbing layer 300, the portion of the organic insulating layer 902 that penetrates into the first via V1 can adhere tightly to the inner wall of the first via V1. Furthermore, since the inorganic insulating layer 901 has excellent moisture and oxygen barrier capabilities, when the organic insulating layer 902 is covered with the inorganic insulating layer 901, it can be ensured that moisture and oxygen in the external environment do not corrode the internal structure of the display panel 000. This further enhances the protective effect on the light absorbing layer 300.

[0110] As one option, the second metal drive layer 202 in the display panel 000 may include a plurality of second drive signal lines (not shown). The first metal drive layer 201 in the display panel 000 may include a first drive signal line (not shown) and a plurality of conductive pads S. Here, the extending direction of the first drive signal line may intersect with the extending direction of the second drive signal line. For example, the extending direction of the first drive signal line is perpendicular to the extending direction of the second drive signal line.

[0111] Some of the multiple conductive pads S in the first metal drive layer 201 need to be electrically connected to the first drive signal line, and some of the conductive pads S need to be electrically connected to the second drive signal line.

[0112] In the embodiment of the present invention, the display panel 000 may further include a third insulating layer 800 located between the second metal drive layer 202 and the first metal drive layer 201. The third insulating layer 800 can insulate the second metal drive layer 202 and the first metal drive layer 201 so as not to short-circuit at the point where the second drive signal line in the second metal drive layer 202 and the first drive signal line in the first metal drive layer 201 intersect.

[0113] For example, the third insulating layer 800 may have a fifth via V5, and in this way, the substructure in the first metal drive layer 201 may be electrically connected to the substructure in the second metal drive layer 202 via the fifth via V5.

[0114] As one option, the third insulating layer 800 in the display panel 000 may include a second inorganic protective layer 802, an organic planar layer 803, and a third inorganic protective layer 804 that are stacked and installed perpendicularly and away from the substrate 100. Here, the second inorganic protective layer 802 can cover the second metal driving layer 202 and has a third sub-opening, the organic flat layer 803 may be located on the side of the second inorganic protective layer 802 away from the substrate 100 and may have a fourth sub-opening that communicates with the third sub-opening, the third inorganic protective layer 804 is located on the side of the organic flat layer 803 away from the substrate 100 and a portion of the third inorganic protective layer 804 can enter into the third and fourth sub-openings and cover the inner walls of the third and fourth sub-openings, and the portion of the third inorganic protective layer 804 that enters into the third and fourth sub-openings has a fifth sub-opening. Therefore, the third, fourth and fifth sub-openings that communicate with each other can constitute the fifth via V5 of the third insulating layer 800.

[0115] Furthermore, the second inorganic protective layer 802 can block moisture and oxygen from the external environment, thereby preventing moisture and oxygen from the external environment from eroding the second metal driving layer 202 from the side away from the substrate 100, and effectively reducing the probability of the second metal driving layer 202 undergoing oxidative corrosion.

[0116] The organic flat layer 803 ensures that it can act flatly and stably form the subsequent film layer structure.

[0117] With respect to the third inorganic protective layer 804, since the subsequent first metal drive layer 201 needs to be installed on the side of the third inorganic protective layer 804 away from the substrate 100, the third inorganic protective layer 804 can ensure that moisture and oxygen in the external environment do not erode the first metal drive layer 201 from the side of the first metal drive layer 201 closer to the substrate 100, and can effectively reduce the probability of the first metal drive layer 201 being oxidized and corroded.

[0118] As one option, referring to Figures 15 and 16, Figure 15 is a partial plan view of a drive backplate in a display panel according to an embodiment of the present application, and Figure 16 is a partial plan view of a display panel according to an embodiment of the present application. The light-emitting units 400 in the display panel 000 may be arranged in multiple rows and multiple columns in an array. Multiple second drive signal lines 2021 in the second metal drive layer 202 may include multiple sets of second drive signal lines 2021 corresponding to multiple columns of light-emitting units 400, and each set of second drive signal lines 2021 may be electrically connected to a corresponding single column of light-emitting units 400. Multiple first drive signal lines 2011 in the first metal drive layer 201 may correspond to multiple rows of light-emitting units 400, and each first drive signal line 2011 may be electrically connected to a corresponding single row of light-emitting units 400. Here, the orthographic projection of one row of light-emitting units 400 onto the substrate 100 can overlap with the orthographic projection of a corresponding pair of second drive signal lines 2021 onto the substrate 100, and the row of light-emitting units 400 can be distributed between two adjacent first drive signal lines 2011.

[0119] For example, in the display panel 000, a set of second drive signal lines 2021 connected to a row of light-emitting units 400 may include an anode drive signal line L1, a data signal line L2, and a ground line L3, and a single first drive signal line 2011 connected to a row of light-emitting units 400 may be a power signal line.

[0120] The light-emitting unit 400 in the display panel 000 may include a drive chip 402 and at least one LED 401. In this case, the plurality of conductive pads S distributed within the first metal drive layer 201 in the display panel 000 may include a first pad group S10 for fixed connection to the LED 401 in the light-emitting unit 400 and a second pad group S20 for fixed connection to the drive chip 402 in the light-emitting unit 400. As an option, the orthographic projection of the first pad group S10 onto the substrate 100 may be located within the orthographic projection of the anode drive signal line L1 onto the substrate 100, and the orthographic projection of the second pad group S20 onto the substrate 100 may be located within the orthographic projection of the ground line L3 onto the substrate 100.

[0121] Here, the first pad group S10 may include a first conductive pad S1 and a second conductive pad S2. The second pad group S20 may include a third conductive pad S3, a fourth conductive pad S4, and a fifth conductive pad S5.

[0122] Here, some of the second drive signal lines 2021 of a pair of second drive signal lines 2021 electrically connected to the light-emitting unit 400 are used to electrically connect to the first conductive pad S1 in the first pad group S10. For example, the first metal drive layer 201 may further include a first relay electrode 2012. The anode drive signal line L1 in this pair of second drive signal lines 2021 may be electrically connected to the first conductive pad S1 via the first relay electrode 2012.

[0123] The second conductive pad S2 in the first pad group S10 is electrically connected to the third conductive pad S3 in the second pad group S20. For example, the first metal driving layer 201 may further include a second relay electrode 2013. The first conductive pad S1 may be electrically connected to the third conductive pad S3 via the second relay electrode 2013.

[0124] A portion of the second drive signal lines 2021 of a pair electrically connected to the light-emitting unit 400 is used to electrically connect to the fourth conductive pad S4 in the second pad group S20. For example, the first metal drive layer 201 may further include a third relay electrode 2014. The data signal line L2 in this pair of second drive signal lines 2021 may be electrically connected to one fourth conductive pad S4 via one third relay electrode 2014, and the ground line L3 in this pair of second drive signal lines 2021 may be electrically connected to another fourth conductive pad S4 via another third relay electrode 2014.

[0125] The first drive signal line 2011, which is electrically connected to the light-emitting unit 400, is electrically connected to the fifth conductive pad S5 in the second pad group S20. For example, the first metal drive layer 201 may further include a fourth relay electrode 2015. The first drive signal line 2011 may be electrically connected to the fifth conductive pad S5 via the fourth relay electrode 2015.

[0126] For example, the number of LEDs 401 in the light-emitting unit 400 may be three, and these three LEDs 401 may be distributed as a red LED 401a for emitting red light, a green LED 401b for emitting green light, and a blue LED 401c for emitting blue light. In this case, the number of first pad groups S10 is also three, and these three sets of first pad groups S10 may be electrically connected to the red LED 401a, the green LED 401b, and the blue LED 401c, respectively.

[0127] Here, the red LED 401a, green LED 401b, and blue LED 401c in the light-emitting unit 400 each have two fillets, which are the positive fillet and the negative fillet, respectively.

[0128] Here, the positive fillet of the red LED 401a can be connected to the first conductive pad S1 in the corresponding first pad group S10, thereby allowing the positive fillet of the red LED 401a to be connected to the corresponding anode drive signal line L1 via this first conductive pad S1. The negative fillet of the red LED 401a can be welded to the second conductive pad S2 in the corresponding first pad group S10.

[0129] The positive fillet of the green LED 401b may be welded to the first conductive pad S1 in the corresponding first pad group S10, thereby connecting the positive fillet of the green LED 401b to the corresponding anode drive signal line L1 via the first conductive pad S1. The negative fillet of the green LED 401b may be welded to the second conductive pad S2 in the corresponding first pad group S10.

[0130] The positive fillet of the blue LED 401c may be welded to the first conductive pad S1 in the corresponding first pad group S10, thereby connecting the positive fillet of the blue LED 401c to the corresponding anode drive signal line L1 via the first conductive pad S1. The negative fillet of the blue LED 401c may be welded to the second conductive pad S2 in the corresponding first pad group S10.

[0131] The drive chip 402 in the light-emitting unit 400 has six fillets, which are a power signal input fillet, a data signal input fillet, a ground fillet, and three signal output fillets corresponding to the three LEDs.

[0132] Here, the three signal output fillets in the drive chip 402 may each be welded to three third conductive pads S3 in the second pad group S20. The three third conductive pads S3 are electrically connected to three second conductive pads S2 in the three first pad groups S10. Therefore, the three signal output fillets in the drive chip 402 may each be electrically connected to three LED negative electrode fillets.

[0133] The power signal input fillet of the drive chip 402 may be welded to one of the fifth conductive pads S5 in the second pad group S20, thereby connecting the power signal input fillet to the power signal line (i.e., the first drive signal line 2011) via this fifth conductive pad S5.

[0134] The data signal input fillet of the drive chip 402 may be welded to one of the fourth conductive pads S4 in the second pad group S20, and the data signal input fillet may be connected to the data signal line L2 via this fourth conductive pad S4.

[0135] The ground fillet of the drive chip 402 may be welded to another fourth conductive pad S4 in the second pad group S20, thereby connecting the ground fillet to the ground wire L3 via this fourth conductive pad S4.

[0136] In this case, if the display panel 000 needs to control the illumination of the light-emitting unit 400, a power drive signal can be applied to a power signal line electrically connected to the light-emitting unit 400 within the display panel 000, and a data drive signal can be applied to a data signal line L2 electrically connected to the light-emitting unit 400. Thus, after the drive chip 402 in the light-emitting unit 400 receives a power drive signal via the power signal input fillet, the drive chip 402 may remain in operation. Furthermore, after the drive chip 402 receives a data signal via the data signal input fillet, the drive chip 402 can generate three cathode signals corresponding to the three LEDs based on the data signal. These three cathode signals may be transmitted to the three LED negative electrode fillets via three signal output fillets, respectively. The positive electrode welding of the LEDs is always connected to the anode signal applied to the anode drive signal line L1. Therefore, after each LED receives an anode signal and a cathode signal, the LED can emit a beam of light of the corresponding intensity.

[0137] Furthermore, in order to simplify the wiring structure within the display panel 000, at least two of the positive fillets of the red LED 401a, the green LED 401b, and the blue LED 401c may be connected to the same anode drive signal line L1. The difference between the light emission characteristics of the red LED 401a and the green LED 401b is large, and the difference between the light emission characteristics of the blue LED 401c is also large, while the difference between the light emission characteristics of the green LED 401b and the blue LED 401c is small. Therefore, the positive fillets of the green LED 401b and the blue LED 401c can be connected to the same anode drive signal line L1, and the positive fillet of the red LED 401a can be connected to a different anode drive signal line L1. In this case, the first conductive pad S1 welded to the positive electrode fillet of the green LED 401b and the first conductive pad S1 welded to the positive electrode fillet of the blue LED 401c may be an integrated structure. That is, the positive electrode fillet of the green LED 401b may be welded to the positive electrode fillet of the blue LED 401c, or to the same first conductive pad S1, and the positive electrode fillet of the red LED 401a may be welded to another first conductive pad S1.

[0138] Referring to Figure 17, which shows a schematic diagram of a film layer structure of a drive backplate in a display panel according to another embodiment of the present application, the light-reflecting layer 600 in the display panel 000 may be located on the side of the first metal drive layer 201 away from the substrate 100, and the display panel 000 may further include a plurality of drive circuits 203 located on the side of the first metal drive layer 201 closer to the substrate 100. In other words, the light-reflecting layer 600 is located between the first metal drive layer 201 and the light-absorbing layer 300, and the drive structure layer in the display panel 000 includes a plurality of drive circuits 203.

[0139] In this case, the distribution position and principle of the light-reflecting layer 600, as well as the material of the light-reflecting layer 600, can all be referenced from the corresponding details in the first selectable embodiment described above, and the embodiments of this application will not be described here.

[0140] Referring to Figure 18, which shows a schematic diagram of a film layer structure of a drive backplate in another display panel according to another embodiment of the present application, the light-reflecting layer 600 in the display panel 000 may be located on the side of the first metal drive layer 201 closer to the substrate 100, and the display panel 000 may further include a plurality of drive circuits 203 located on the side of the first metal drive layer 201 closer to the substrate 100. In other words, the light-reflecting layer 600 is located between the first metal drive layer 201 and the substrate 100, and the drive structure layer in the display panel 000 includes a plurality of drive circuits 203.

[0141] Exemplary, a plurality of drive circuits 203 in the display panel 000 may correspond one-to-one with a plurality of light-emitting units 400, and each drive circuit 203 may be electrically connected to the corresponding light-emitting unit 400 via a conductive pad S in the first metal drive layer 201. Here, each drive circuit 203 in the display panel 000 may include a plurality of stacked electrical patterns, and the display panel 000 may further include an insulating layer located between two adjacent electrical patterns, which insulates these two electrical patterns, thereby ensuring that the electrical patterns in each drive circuit 203 cooperate with each other to drive the corresponding light-emitting unit 400 and cause it to emit light.

[0142] In this case, the light-reflecting layer 600 on the display panel 000 is installed in the same layer as one of the multiple electrical patterns, and the orthographic projection of the light-reflecting layer 600 onto the substrate 100 can overlap with the orthographic projection of the light-absorbing layer 300 onto the substrate 100. Thus, in the process of forming multiple signal leads D1 located within the bonding region F using a laser etching process, the laser irradiated onto the bonding region F is completely reflected by the light-reflecting layer 600 after passing through the substrate 100, ensuring that this laser does not irradiate the light-absorbing layer 300.

[0143] Furthermore, when the light-reflecting layer 600 is installed in the same layer as one of several electrical patterns, the material of the light-reflecting layer 600 and the material of the electrical pattern may be the same or different. In this case, if the material of the light-reflecting layer 600 is the same as the material of the electrical pattern, the electrical pattern and the light-reflecting layer 600 can be formed in a single patterning process, effectively simplifying the manufacturing cost of the display panel 000.

[0144] As one of the options, in the third and fourth selectable embodiments described above, the display panel 000 can emit light by driving the light-emitting unit 400 in the display panel 000 through the joint action of the first metal drive layer 201 and a plurality of drive circuits 203, and the light-emitting unit 400 in the display panel 000 in such a configuration may include at least one LED. Other configurations within such a display panel 000 will be described below.

[0145] As shown in Figures 17 and 18, the multiple electrical patterns within each drive circuit 203 in the display panel 000 may include a first gate pattern 2031, an active layer pattern 2032, a second gate pattern 2033, and a source / drain pattern 2034 stacked along a direction perpendicular to and away from the substrate 100. The display panel 000 may further include a first gate insulating layer 2035 located between the first gate pattern 2031 and the active layer pattern 2032, a second gate insulating layer 2036 located between the second gate pattern 2033 and the active layer pattern 2032, and an interlayer insulating layer 2037 located between the second gate pattern 2033 and the source / drain pattern 2034.

[0146] Here, the drive circuit 203 may have at least one transistor, and the first gate pattern 2031, active layer pattern 2032, second gate pattern 2033, and source-drain pattern 2034 in the drive circuit 203 constitute the at least one transistor, and these transistors belong to the dual-gate type transistor.

[0147] For example, the orthographic projections of the first gate pattern 2031 and the second gate pattern 2033 onto the substrate 100 may both overlap with the orthographic projection of the active layer pattern 2032 onto the substrate 100, and the first gate pattern 2031 may be insulated from the active layer pattern 2032 by the first gate insulating layer 2035, and the second gate pattern 2033 may be insulated from the active layer pattern 2032 by the second gate insulating layer 2046. The source-drain pattern 2034 may include a first electrode 2034a and a second electrode (not marked in the figure) that wrap around the active layer pattern 2032, and a wrap electrode 2034b provided separately for the first electrode 2032a and the second electrode. Here, the first electrode 2034a may be either the source or the drain, and the second electrode may be the other of the source and the drain. The wrap electrode 2032b may be electrically connected to the first gate pattern 2031 and the second gate pattern 2033 via the first wrap via V10 and the second wrap via V20, respectively. In this way, the first gate pattern 2031 and the second gate pattern 2033 can be subjected to the same potential by the wrap electrode, and this potential acts on the active layer pattern 2033, thereby turning on or off the first electrode 2034a and the second electrode that are wrapped around the active layer pattern 2033.

[0148] As an option, the drive electrode layer in the display panel 000 may further include a plurality of drive signal lines electrically connected to the pixel drive circuit 203. Exemplarily, the plurality of drive signal lines electrically connected to the drive circuit 203 may include a data signal line L2, a low-level high-level voltage signal line L4, and a low-level voltage signal line L5. Here, the light-emitting unit 400 may include red LEDs, green LEDs, and blue LEDs, and the light-emitting unit 400 may have a plurality of conductive fillets electrically connected to these LEDs, some of which may be electrically connected to the drive signal lines via corresponding conductive pads S in the first metal drive layer 201, and some of which may be electrically connected to the drive circuit 203 via corresponding conductive pads S in the first metal drive layer 201. In this way, the light-emitting state and light-emitting brightness of each LED in the corresponding light-emitting unit 400 can be controlled by the cooperation of the drive signal lines and the pixel drive circuit 203.

[0149] In the embodiment of the present application, the display panel 000 may further include an organic planar layer 803 located on the side of the plurality of drive circuits 203 away from the substrate 100, a third inorganic protective layer 804 located between the organic planar layer 803 and the first metal drive layer 201, a first insulating layer 700 located between the first metal drive layer 201 and the light absorption layer 300, and a second insulating layer 900 located on the side of the light absorption layer 300 away from the substrate 100. The structure and characteristics of these insulating layers can all be described by referring to the corresponding contents in the above embodiment, and will not be described here.

[0150] In the fourth selectable embodiment described above, the materials of the light-reflecting layer 600 and the electrical pattern installed in the same layer on the display panel 000 may be the same or different. Therefore, the embodiments of this application will be explained using the following two examples.

[0151] In the first example, if the light-reflecting layer 600 on the display panel 000 is made of a different material than the electrical pattern installed on the same layer, the material of the light-reflecting layer 600 may be amorphous silicon or white ink, and the light-reflecting layer 600 may be installed on the same layer as any of the multiple electrical patterns in the drive circuit 203.

[0152] In the second example, if the light-reflecting layer 600 in the display panel 000 is made of the same material as the electrical pattern installed in the same layer, the light-reflecting layer 600 is installed in the same layer as the electrical pattern and is made of the same material, and both can be formed simultaneously in a single communication process, thereby effectively simplifying the manufacturing process of the display panel 000.

[0153] For example, the light-reflecting layer 600 may be installed in the same layer as the active layer pattern 2032 in the drive circuit 203. In this case, the material of the active layer pattern 2032 may be the same as the material of the light-reflecting layer 600, for example, both being low-temperature polysilicon. Since low-temperature polysilicon is a material that has both light-reflecting and semiconductor properties, it can be used as the active layer pattern 2032 in a transistor by utilizing its semiconductor properties, and it can also be used as the light-reflecting layer 600 by utilizing its light-reflecting properties.

[0154] The following embodiment describes the distribution position of the light-reflecting layer 600 within the display panel 000 when the light-reflecting layer 600 is installed in the same layer as the active layer pattern 2032 and is made of the same material.

[0155] As shown in Figure 19, Figure 19 is a partially enlarged view of the back of a display panel according to an embodiment of the present application. The edge of the surface of the substrate 100 in the display panel 000 that is away from the first metal drive layer 201 includes a bonding region F, and at least some of the multiple signal leads D1 installed within the bonding region F may be electrically connected to the drive circuit 203. Here, within the bonding region F, the region between two adjacent signal leads D1 is the spacing region C. Here, in the process of forming the multiple signal leads D1 located within the bonding region F using a laser etching process, the laser needs to irradiate the spacing region C, thereby allowing the metal portion within the spacing region C to be etched by the laser irradiation. Here, the orthographic projection of the light reflection layer 600 onto the substrate 100 can overlap with the orthographic projection of the spacing region C onto the substrate 100.

[0156] In this application, the frontal distribution of the spacing region C between two adjacent signal leads D1 on the display panel 000 can be seen in Figure 20, which is a partially schematic diagram of a single spacing region on the front of the display panel according to an embodiment of this application. The spacing region C may include areas on the display panel 000 that are not covered by the multiple electrical patterns in the first metal drive layer 201 and the drive circuit 203. The light-reflecting layer 600, which is located in the same layer as the active layer pattern 2032 and is made of the same material, must be located at least within these regions to ensure that laser light transmitted through the substrate 100 via the spacing region C is blocked by the light-reflecting layer 600 and that this laser light does not irradiate the light-absorbing layer 300.

[0157] For example, the spacing region C between two adjacent signal leads D1 may include a first region C01 and a second region C02.

[0158] Here, the first region C01 is the region in the spacing region C covered by multiple electrical patterns of the first metal drive layer 201 and the drive circuit 203, and the second region C02 is the region in the spacing region C other than the first region C01. In Figure 20, the black region 001 can represent the region covered by multiple electrical patterns of the first metal drive layer 201 and the drive circuit 203.

[0159] In this application, at least a portion of the orthographic projection of the light-reflecting layer 600 onto the substrate 100 is located within the orthographic projection of the second region C02 onto the substrate 100. Thus, lasers that have passed through the second region C02 in the spacing region C are blocked by the light-reflecting layer 600, and as a result, these lasers are not directed toward the light-absorbing layer 300.

[0160] Furthermore, since the first region C01 in the spacing region C may be covered by multiple electrical patterns in the first metal driving layer 201 and the driving circuit 203, the laser that has passed through the first region C01 in the spacing region C can be blocked by the multiple electrical patterns in the first metal driving layer 201 and the driving circuit 203, and as a result, these lasers do not have to be irradiated toward the light absorption layer 300.

[0161] For example, the orthographic projection of the light-reflecting layer 600 onto the substrate 100 does not overlap with the orthographic projection of the first metal drive layer 201 onto the substrate 100, nor does it overlap with the orthographic projection of each electrical pattern in the drive circuit 203 onto the substrate 100. In other words, the orthographic projection of the light-reflecting layer 600 onto the substrate 100 does not overlap with the orthographic projection of the first region C01 in the spacing region C onto the substrate 100. In this case, if the light-reflecting layer 600 is installed in the same layer as a certain electrical pattern in the drive circuit 203 and is made of the same material, it is possible to ensure that no parasitic capacitance occurs between the light-reflecting layer 600 and the nearby electrical pattern, and consequently, that the interference effect of parasitic capacitance on the signals inside the display panel 000 is small.

[0162] Exemplary, as shown in Figure 20, the orthographic projection of the light-emitting layer 600 onto the substrate 100 can completely cover the second region C02 in the spacing region C. Here, the laser transmitted at each position within the second region C02 in the spacing region C can be blocked by the light-reflecting layer 600, and these lasers are not directed toward the light-absorbing layer 300.

[0163] Exemplary, as shown in Figure 21, which is a schematic partial view of a single spacing region on the front of another display panel according to an embodiment of the present invention, the orthographic projection boundary of the portion of the spacing region C covered by the second region C02 in the light-reflecting layer 600 onto the substrate 100 extends along the orthographic projection boundary of the first region C01 in the spacing region C onto the substrate 100, and the orthographic projection boundary of the portion of the spacing region C02 covered by the light-reflecting layer 600 onto the substrate 100 does not overlap with the orthographic projection boundary of the first region C01 onto the substrate 100. However, the width of the gap d1 between the two boundaries is small, for example, the maximum width of the gap d1 between the two boundaries may be 15 micrometers or less. This ensures that even if a laser irradiated onto the spacing region C can pass through the gap d1 between the two boundaries and penetrate to the light-absorbing layer 300, the energy of the laser irradiated onto the light-absorbing layer 300 is small, and it can be guaranteed that a bubbling phenomenon does not occur in the light-absorbing layer 300. For example, the maximum width of the boundary d1 between the two may be 5 micrometers or less.

[0164] Exemplary, as shown in Figure 22, Figure 22 is a schematic diagram of the structure of the film layer of the drive backplate in yet another display panel according to another embodiment of the present application. The orthographic projection of the light-reflecting layer 600 onto the substrate 100 does not overlap with the orthographic projection of the first region onto the substrate 100. In this case, the orthographic projection of the light-reflecting layer 600 onto the substrate 100 does not overlap with the orthographic projection of the first metal drive layer 201 onto the substrate 100, nor does it overlap with the orthographic projection of each electrical pattern in the drive circuit 203 onto the substrate 100. In this case, the light-reflecting layer 600 is installed in the same layer as the active layer pattern 2032 and is made of the same material, and the material of the light-reflecting layer 600 is low-temperature polysilicon having semiconductor properties. Therefore, if the orthographic projection of the light-reflecting layer 600 onto the substrate 100 does not overlap with the orthographic projection of the first metal driving layer 201 onto the substrate 100, and the orthographic projections of the first gate pattern 2031, the second gate pattern 2033, and the source-drain pattern 2034 in the driving circuit 203 onto the substrate 100 do not overlap, then the first metal driving layer 201, the first gate pattern 2031, the second gate pattern 2033, and the source-drain pattern 2034 do not cause any electrical interference to the light-reflecting layer 600, the light-reflecting layer 600 remains in a non-conductive state at all times, and it is possible to guarantee that the parasitic capacitance generated between the light-emitting layer 600 and the metal structure installed in its vicinity is small.

[0165] In other possible embodiments, the orthographic projection of the light-reflecting layer 600 onto the substrate 100 may overlap with the orthographic projection of the first region onto the substrate 100, but the overlapping area of ​​the two is small. For example, the maximum width of the region where the orthographic projection of the light-reflecting layer 600 onto the substrate 100 and the orthographic projection of the first region onto the substrate 100 overlap is less than 5 micrometers.

[0166] As one option, as shown in Figure 22, if the light-reflecting layer 600 is installed in the same layer as the active layer pattern 2032 and is made of the same material, the minimum distance d2 between the outer boundary of the orthographic projection of the active layer pattern 2032 onto the substrate 100 and the outer boundary of the orthographic projection of the light-reflecting layer 600 onto the substrate 100 must be 5 micrometers or more. This ensures that the light-reflecting layer 600, installed in the same layer as the active layer pattern 2032 and made of the same material, does not interfere with the normal operation of the active layer pattern 2032.

[0167] Furthermore, the active layer patterns 2032 in each pixel circuit 203 within the display panel 000 are all island-like patterns, where each island-like pattern retains a continuously distributed internal region and a contour edge surrounding the internal region, and this contour edge is the outer boundary of the orthographic projection of the active layer pattern 2032 onto the substrate 100.

[0168] In the embodiment of the present application, as shown in Figure 22, the display panel 000 may further include a relay pad S0 electrically connected to the pixel circuit 203, where one end of the connection wiring D2 is wrapped around the side of the relay pad S0 away from the substrate, and the other end of the connection wiring D2 is electrically connected to the signal lead D1. Thus, the drive assembly bound within the binding region F may be electrically connected to the corresponding drive circuit 203 sequentially via the signal lead D1, the connection wiring D2, and the relay pad S0.

[0169] As one option, in the fourth selectable embodiment described above, as shown in Figure 10, the display panel 000 further includes a mark pattern M made of the same material and placed in the same layer as at least one of the plurality of electrical patterns. The light-emitting layer 600 in the display panel 000 may have a relief hole K corresponding to the mark pattern M. Here, the orthographic projection of the relief hole K onto the substrate 100 may overlap with the orthographic projection of the mark pattern M onto the substrate 100. Exemplarily, the orthographic projection of the mark pattern M onto the substrate 100 may be located within the orthographic projection of the relief hole K onto the substrate 100.

[0170] In this application, if the light-reflecting layer 600 and the active layer pattern 2032 are installed in the same layer and made of the same material, the number of mark patterns M in the display panel 000 is at least two, where one mark pattern M is installed in the same layer and made of the same material as the second gate pattern 2033, and the other mark pattern M is installed in the same layer and made of the same material as the source-drain pattern 2034. The light-reflecting layer 600 may have at least two escape holes K that correspond one-to-one with at least two mark patterns M, and the orthographic projection of each mark pattern M onto the substrate 100 may be located within the orthographic projection of the corresponding escape hole K onto the substrate 100.

[0171] The reasons for designing the mark pattern M within the display panel 000 and providing the corresponding relief holes K within the light-reflecting layer 600 can be explained by referring to the corresponding parts in the above embodiment, and the embodiment of this application will not be explained here. The display panel 000 may further include auxiliary mark patterns installed in the same layer as the first gate pattern 2031 and the active layer pattern 2032 and made of the same material, but since these auxiliary mark patterns are not necessarily shielded by the light-reflecting layer 600, it is not necessary to provide relief holes corresponding to these auxiliary mark patterns within the light-reflecting layer 600.

[0172] In the first and second selectable embodiments described above, that is, when the display panel 000 includes both the first metal drive layer 201 and the second metal drive layer 202, a schematic representation of the frontal distribution of the display panel 000 in the spacing region C between two adjacent signal leads D1 in the binding region F can be found in Figure 23, which is a partially enlarged view of the front of the display panel according to an embodiment of the present application. Therefore, even in the spacing region C, there may be areas in the display panel 000 that are not covered by the second metal drive layer 202 and the first metal drive layer 201. Thus, when the laser is irradiated into the spacing region C, the laser passes through the substrate 100, the second metal driving layer 202, and the first metal driving layer 201 before being emitted to the light absorption layer 300. After adding the light reflection layer 600 between the substrate 100 and the light absorption layer 300, the laser can be reflected by the light reflection layer 600, ensuring that the laser does not irradiate the light absorption layer 300 and that a problem called bubbling does not occur in the light absorption layer 300.

[0173] Here, if the material of the light-reflecting layer 600 is amorphous silicon or low-temperature polysilicon, amorphous silicon of different thicknesses will have different reflectivity to lasers of different wavelengths. Therefore, when a long-wavelength laser is used in the process of forming multiple signal leads D1 by employing a laser etching process, a thicker light-reflecting layer 600 can be used, thereby increasing the reflectivity of the light-reflecting layer 600 to the laser. For example, the thickness range of the light-reflecting layer 600 may be from 1100 angstroms to 2000 angstroms. When a short-wavelength laser light is used in the process of forming multiple signal leads D1 by laser etching, a thinner light-reflecting layer 600 can be used, thereby increasing the reflectivity of the light-reflecting layer 600 to the laser light. For example, the thickness range of the light-reflecting layer 600 may be from 500 angstroms to 1100 angstroms.

[0174] In the embodiments of the present application, in order to further avoid the phenomenon in which the light absorption layer 300 is bubbled when a laser is irradiated onto it, in addition to installing a light reflection layer 600, other structures in the display panel 000 can be optimized. In the following embodiments, three exemplary embodiments of methods for optimizing other structures in the display panel 000 are proposed, taking as an example that the display panel 000 simultaneously includes a first metal drive layer 201 and a second metal drive layer 202.

[0175] In the first exemplary embodiment, the structure of the light-absorbing layer 300 in the display panel 000 can be optimized. Referring to Figure 24, which is a partially enlarged view of the front of yet another display panel according to an embodiment of the present application. Note that the structure of the light-absorbing layer 300 is shown in the display panel 000 shown in Figure 24, but the light-absorbing layer 300 is not shown in the plan view or schematic view of the front portion of the other display panels in the above embodiment. The light-absorbing layer 300 in the display panel 000 has auxiliary grooves U, and the orthographic projection of the auxiliary grooves U onto the substrate 100 overlaps with the portion of the spacing region C that is not covered by the first metal drive layer 201 and the second metal drive layer 202 in the orthographic projection of the auxiliary grooves U in the light-absorbing layer 300 onto the substrate 100, and does not overlap with the orthographic projection of the first metal drive layer 201 onto the substrate 100, nor with the orthographic projection of the second metal drive layer 202 onto the substrate 100.

[0176] For example, in the orthographic projection of the spacing region C onto the substrate 100, the portion not covered by the first metal drive layer 201 and the second metal drive layer 202 may be located within the orthographic projection of the auxiliary groove U onto the substrate 100. In this way, the light-absorbing layer 300 shields the first metal drive layer 201 and the second metal drive layer 202 on the front of the display panel 000, thereby ensuring that the reflectivity of the display panel 000 to ambient light is low. Furthermore, the laser light irradiating the spacing region C does not irradiate the light-absorbing layer 300 after passing through the substrate 100, the first metal drive layer 201 and the second metal drive layer 202, thus further reducing the probability of a malfunction called bubbling occurring in the light-absorbing layer 300.

[0177] In this application, as shown in Figure 24, the first end of the spacing region C that is close to the edge of the display panel 000 is usually distributed between two sets of adjacent second drive signal lines 2021, and the first end of the spacing region C that is close to the display panel 000 extends along a bent shape. Therefore, in the light absorption layer 300, an auxiliary groove U that extends in a bent shape is provided in the portion located between two sets of adjacent second drive signal lines 2021, and this auxiliary groove U needs to cover the first end of the spacing region C.

[0178] Similarly, the second end of the spacing region C that separates from the edge of the display panel 000 is typically distributed between two other adjacent pairs of second drive signal lines 2021, and the second end of the spacing region C that separates from the display panel 000 extends in a straight line. Therefore, a linearly extending auxiliary groove U is provided in the portion of the light absorption layer 300 located between the other two adjacent pairs of second drive signal lines 2021, and this auxiliary groove U needs to cover the second end of the spacing region C.

[0179] As one option, as shown in Figures 23 and 24, the region located between the first and second ends of the spacing region C can span a pair of second drive signal lines 2021. On the other hand, in the gap region between two adjacent second drive signal lines 2021 in a pair of second drive signal lines 2021, there is a region not covered by the first metal drive layer 201. Therefore, in the spacing region C, there is also a region not covered by the first metal drive layer 201 and the second metal drive layer 202 between the first and second ends. An auxiliary groove U is provided in the light absorption layer 300 in the portion located between two adjacent second drive signal lines 2021, and this auxiliary groove U can cover the region in the spacing region C that overlaps with the gap region.

[0180] In other possible embodiments, the width of the gap region between two adjacent drive signal lines 2011 in a pair of second drive signal lines 2021 is small, for example, the width of the gap region is about 15 micrometers. Therefore, in the process of forming multiple signal leads D1 located within the bonding region F using a laser etching process, the laser may still penetrate the substrate 100 and pass through the gap region between two adjacent drive signal lines 2011 of a pair of second drive signal lines 2021 to irradiate the light absorption layer 300. However, because the width of the gap region is small, the laser energy passing through the gap region is small, and even if this laser irradiates the light absorption layer 300, bubbling does not occur in the light absorption layer 300. Therefore, it is not necessary to provide an auxiliary groove U in the portion of the light absorption layer 300 located between two adjacent second drive signal lines 2021.

[0181] In the embodiment of the present invention, the shape of the auxiliary groove U installed in the light-absorbing layer 300 matches the shape of the portion of the spacing region C that is not covered by the first metal drive layer 201 and the second metal drive layer 202. In this way, it is possible to ensure that the laser light irradiated into the spacing region C does not irradiate the light-absorbing layer 300 without providing a large-area auxiliary groove U in the light-absorbing layer 300. In this way, it is possible to ensure that the area of ​​the auxiliary groove U installed in the light-absorbing layer 300 is small, thereby reducing the probability of the display panel 000 experiencing color shift due to a large groove area installed in the light-absorbing layer 300.

[0182] Furthermore, during the manufacturing process of each film layer structure on the substrate 100, there is a possibility of processing errors in the film layer structure, resulting in a discrepancy between the position of the film layer structure on the substrate 100 and its position during the design phase. Therefore, in order to ensure that the auxiliary groove U can completely cover the portion of the spacing region C not covered by the first metal drive layer 201 and the second metal drive layer 202, it is necessary to maintain a certain distance between the boundary of the auxiliary groove U and the adjacent boundary in the spacing region C during the design phase. For example, this distance may be 10 micrometers or more. This ensures that even if processing errors exist in the film layer structure on the substrate 100, the auxiliary groove U in the final manufactured display panel 000 will completely cover the portion of the spacing region C not covered by the first metal drive layer 201 and the second metal drive layer 202.

[0183] Furthermore, a small portion of the orthographic projection onto the substrate 100 of the portion not covered by the first metal driving layer 201 and the second metal driving layer 202 in the spacing region C may be located outside the orthographic projection of the auxiliary groove U onto the substrate 100. That is, there may be portions in the spacing region C that are not covered by the first metal driving layer 201 and the second metal driving layer 202, and not covered by the auxiliary groove U. However, it is necessary to ensure that the maximum width of the orthographic projection onto the substrate 100 of the portion not covered by the first metal driving layer 201 and the second metal driving layer 202, and not covered by the auxiliary groove U, is small. For example, this maximum width must be 15 micrometers or less. This ensures that the energy emitted to the light absorption layer 300 after the laser irradiated onto the spacing region C has passed through the substrate 100, the second metal driving layer 202, and the first metal driving layer 201 is small. Here, the width of the orthographic projection onto the substrate 100 of the portion in the spacing region C that is not covered by the first metal driving layer 201 and the second metal driving layer 202, and is not covered by the auxiliary groove U, refers to the width in any direction of this orthographic projection. Therefore, the maximum value of the width in each direction of this orthographic projection is the maximum width of this orthographic projection.

[0184] In a second exemplary embodiment, the position or shape of the spacing region C between two adjacent signal leads D1 within the bonding region F is optimized so that the spacing region C is completely covered by the first metal driving layer 201 and the second metal driving layer 202. Here, a portion of the spacing region C may be covered by the first metal driving layer 201, and the other portion of the spacing region C may be covered by the second metal driving layer 202. In this way, the laser irradiated into the spacing region C may be shielded by the second metal driving layer 202 or by the first metal driving layer 201, thereby preventing the laser from irradiating toward the light absorption layer 300.

[0185] In this application, the position of the spacing region C may be optimized, or the shape of the spacing region C may be optimized, so that the spacing region C is completely covered by the first metal driving layer 201. Two examples of such embodiments will be explained below.

[0186] In the first exemplary case, the positioning of the spacing region C can be optimized. Referring to Figure 25, which is a partial enlarged front view of yet another display panel according to an embodiment of the present application. The orthographic projection onto the substrate 100 of the spacing region C between two adjacent signal leads D1 may be located within the orthographic projection onto the substrate 100 of the region where a pair of second drive signal lines 2021 are located. Thus, a portion of the spacing region C may be covered by the second drive signal lines 2021 in the second metal drive layer 202, and another portion of the region C may be covered by the first metal drive layer 201.

[0187] Exemplary, there is a gap region between two adjacent second drive signal lines 2021 of a pair of second drive signal lines 2021. In the orthographic projection of the gap region C onto the substrate 100, the portion of the gap region that overlaps with the orthographic projection onto the substrate 100 may be covered by the first metal drive layer 201. Exemplary, in the orthographic projection of the gap region C onto the substrate 100, the portion of the gap region that overlaps with the orthographic projection onto the substrate 100 may be covered by at least one of the first drive signal line 2011 and the relay electrode (e.g., first relay electrode 2012) in the first metal drive layer 201.

[0188] Furthermore, to ensure that the first metal drive layer 201 completely covers the portion of the gap region C that overlaps with the gap region, widening treatment may be applied to at least one of the first drive signal line 2011 and the relay electrode. In addition, at the design stage, the minimum distance between the metal portion of the first metal drive layer 201 and the second metal drive layer 202 and the gap region C must be 10 micrometers or more. This ensures that even if there are processing errors in the film layer structure on the substrate 100, the first metal drive layer 201 and the second metal drive layer 202 in the final manufactured display panel 000 completely cover the gap region C.

[0189] In the second exemplary case, the shape of the spacing region C can be optimized. Referring to Figure 26, which is a partially enlarged front view of a display panel according to another embodiment of the present application, the spacing region C between two adjacent signal leads D1 may include two first substripe regions C1 and a second substripe region C2 located between the two first substripe regions C1. Here, both ends of the second substripe region C2 may be distributed and communicate with the first substripe regions C1, and in the two first substripe regions C1, one first substripe region C1 may be distributed on the side of the spacing region C closer to the edge of the display panel 000, and the other first substripe region C1 may be distributed on the side of the spacing region C further away from the edge of the display panel 000.

[0190] Here, the extension direction of the first substripe region C1 may be parallel to the extension direction of the second drive signal line 2021, and the two first substripe regions C1 in the spacing region C may each be covered by two second drive signal lines 2021. The extension direction of the second substripe region C2 may be parallel to the extension direction of the second drive signal line 2012, and the second substripe region C2 may be covered by one second drive signal line 2012.

[0191] For example, because the width of the ground line L3 in one pair of second drive signal lines 2021 is large, for two first substripe regions C1 in the spacing region C, one first substripe region C1 may be covered by the ground line L3 of one pair of second drive signal lines 2021, and the other first substripe region C1 may be covered by the ground line L3 of an adjacent pair of second drive signal lines 2021.

[0192] Furthermore, during the design phase, it is necessary that the distance between the boundary of the first substripe region C1 and the adjacent boundary of the second drive signal line 2021 is 10 micrometers or more, and the distance between the boundary of the second substripe region C2 and the adjacent boundary of the second drive signal line 2012 is 10 micrometers or more. This ensures that even if there are processing errors in the film layer structure on the substrate 100, the first metal drive layer 201 and the second metal drive layer 202 in the final manufactured display panel 000 will completely cover the gap region C.

[0193] In a third exemplary embodiment, the structures of the first metal drive layer 201 and the second metal drive layer 202 in the display panel 000 are optimized so that the gap region C is completely covered by the first metal drive layer 201. Exemplarily, the orthographic projection area of ​​the first metal drive layer 201 onto the substrate 100 can be increased so that the portion of the gap region C that was not previously covered by the second metal drive layer 202 can be covered by the metal portion added to the first metal drive layer 201.

[0194] Referring to Figure 27, which is a partially enlarged view of the front of a display panel according to another embodiment of the present application. With respect to a spacing region C located between two adjacent signal leads D1, the first end of the spacing region C near the edge of the display panel 000 may be distributed between two sets of adjacent second drive signal lines 2021, and the second end of the spacing region C away from the edge of the display panel 000 may be distributed between two other sets of adjacent second drive signal lines 2021. The first metal drive layer 201 may further include a first auxiliary electrode G1 and a second auxiliary electrode G2. Here, the first end of the spacing region C near the edge of the display panel 000 may be covered by the first auxiliary electrode G1, and the second end of the spacing region C away from the edge of the display panel 000 may be covered by the second auxiliary electrode G2.

[0195] In this application, the first end of the spacing region C adjacent to the display panel 000 extends along a bent shape, so the first auxiliary electrode G1 covering the first end also needs to extend along a bent shape. The second end of the spacing region C away from the edge of the display panel 000 extends in a straight line, so the second auxiliary electrode G2 covering the second end also needs to extend in a straight line.

[0196] As one option, as shown in Figure 27, the region located between the first and second ends of the spacing region C may span a pair of second drive signal lines 2021. There is a gap region between two adjacent second drive signal lines 2021 of the pair. In the orthographic projection of the spacing region C onto the substrate 100, the portion of the gap region that overlaps with the orthographic projection onto the substrate 100 may be covered by the first metal drive layer 201. Exemplarily, in the orthographic projection of the spacing region C onto the substrate 100, the portion of the gap region that overlaps with the orthographic projection onto the substrate 100 may be covered by the first drive signal line 2011 and at least one of the relay electrodes (e.g., a third relay electrode 2014 and a fourth relay electrode 2015) in the first metal drive layer 201.

[0197] Furthermore, to ensure that the first metal drive layer 201 completely covers the portion that overlaps with the spacing region C, at least one of the first drive signal line 2011 and the relay electrode may be partially widened. Also, by setting the minimum distance between the metal portion of the first metal drive layer 201 and the spacing region C to 10 micrometers or more during the design phase, it is possible to ensure that the first metal drive layer 201 in the final manufactured display panel 000 completely covers the spacing region C, even if there are processing errors in the film layer structure on the substrate 100.

[0198] As one option, the first auxiliary electrode G1 and the second auxiliary electrode G2 added to the first metal drive layer 201 must both be electrically connected to the signal transmission structure in the first metal drive layer 201. Exemplarily, as shown in Figure 23, the first auxiliary electrode G1 may be electrically connected to the fourth relay electrode 2015 in the first metal drive layer 201, and the second auxiliary electrode G2 may be electrically connected to the first drive signal line 2011 in the first metal drive layer 201. This allows the charge accumulated on the first auxiliary electrode G1 and the second auxiliary electrode G2 to be conducted to the signal transmission structure during the manufacturing process of the display panel 000, thereby preventing the first auxiliary electrode G1 and the second auxiliary electrode G2 from accumulating charge on their own, and thus avoiding the problem of electrostatic discharge (ESD) occurring at these locations due to excessive charge accumulation.

[0199] In other possible embodiments, in the second and third exemplary embodiments described above, because the width of the gap region between two adjacent drive signal lines 2011 in a pair of second drive signal lines 2021 is small, during the process of forming a plurality of signal leads D1 located within the bonding region F using a laser etching process, the laser may still penetrate the substrate 100 and irradiate the light absorption layer 300 by passing through the gap region between two adjacent drive signal lines 2011 of the pair of second drive signal lines 2021. However, because the width of the gap region is small, the laser energy passing through the gap region is small, and even if this laser irradiates the light absorption layer 300, bubbling does not occur in the light absorption layer 300. For this reason, it is not necessary to widen the configuration of the first metal drive layer 201. In this way, the first metal drive layer 201 can ensure that the bubbling phenomenon does not occur in the light absorption layer 300 even if it does not cover the portion of the gap region C that overlaps with the gap region.

[0200] Most of the spacing region C can be completely covered by the first metal driving layer 201 and the second metal driving layer 202, and only a small portion of the spacing region (for example, the portion of the spacing region C that overlaps with the void region) may not be covered by the first metal driving layer 201 and the second metal driving layer 202. However, it is necessary to reduce the maximum width of the orthographic projection onto the substrate 100 of the portion of the spacing region C that is not covered by the first metal driving layer 201 and the second metal driving layer 202. For example, the maximum width of the orthographic projection onto the substrate 100 of the portion of the spacing region C that is not covered by the first metal driving layer 201 and the second metal driving layer 202 must be less than or equal to a preset width threshold. For example, the preset width threshold may be 15 micrometers, meaning that the maximum width of the orthographic projection onto the substrate 100 of the portion of the spacing region C not covered by the first metal driving layer 201 and the second metal driving layer 202 must be 15 micrometers or less. This ensures that the energy incident on the light absorption layer 300 after the laser irradiated onto the spacing region C has passed through the substrate 100, the first metal driving layer 201, and the second metal driving layer 202 is small.

[0201] Here, the width of the orthographic projection onto the substrate 100 of the portion not covered by the first metal drive layer 201 and the second metal drive layer 202 in the spacing region C refers to the width in any direction of this orthographic projection. Therefore, the maximum value of the width in each direction of this orthographic projection is the maximum width of this orthographic projection.

[0202] As described above, the display panel according to the embodiment of the present invention includes a substrate, a first metal driving layer, a light absorption layer, an auxiliary light absorption layer, and a plurality of light-emitting units. The orthographic projection of the light absorption layer onto the substrate and the orthographic projection of the driving layer onto the substrate overlap. In this way, the light absorption layer can absorb ambient light emitted to the display panel, thereby ensuring that the degree to which ambient light emitted to the display panel is reflected by the driving layer is low, and that the reflectivity of the display panel to ambient light is low. Furthermore, by providing a light absorption layer on the display panel, the reflectivity of the display panel to ambient light can be reduced. Therefore, the transmittance of the auxiliary light absorption layer located on the side of the plurality of light-emitting units away from the substrate can be appropriately increased, thereby reducing the absorption rate of light by the auxiliary light absorption layer, and further reducing the degree to which light emitted from the light-emitting units is absorbed by the auxiliary light absorption layer. In this way, the display panel does not need to supply a large driving current to the light-emitting units, the overall display brightness of the display panel can be increased, and consequently the power consumption of the display panel can be effectively reduced. Furthermore, by providing a light-reflecting layer between the substrate and the light-absorbing layer, the laser light that has passed through the substrate during the laser etching process can be reflected. This prevents the laser light from irradiating the parts of the light-absorbing layer that are not covered by the driving layer, effectively avoiding a problem called bubbling in the light-absorbing layer, resulting in higher flatness of the light-absorbing layer and increased reliability of the display panel.

[0203] Another embodiment of the present invention further provides a display panel, which may include a substrate, a driving layer, a light-absorbing layer, a plurality of signal leads, and a plurality of light-emitting units.

[0204] The drive layer may be located on one side of the substrate, and the drive layer has a plurality of conductive pads, and the edge region of the side of the substrate away from the drive layer includes a binding region.

[0205] The light-absorbing layer may be located on the side away from the substrate of the drive layer. The orthographic projection of the light-absorbing layer onto the substrate and the orthographic projection of the drive layer onto the substrate overlap, and the light-absorbing layer has a plurality of first vias corresponding to a plurality of conductive pads, and the orthographic projection of the first vias onto the substrate and the orthographic projection of the corresponding conductive pads onto the substrate overlap.

[0206] All of the signal leads are located within the bonding region, at least some of the signal leads are electrically connected to the drive layer, and the region between two adjacent drive signal leads is the spacing region.

[0207] Multiple light-emitting units are located on the side away from the substrate of the light-absorbing layer, and the light-emitting units are electrically connected to at least some of the conductive pads via a first via.

[0208] The structure of such a display panel can be found by referring to the structure of the display panel in the above embodiment. However, by optimizing other structures in the display panel without providing a light-reflecting layer within it, it is possible to ensure that the laser irradiated into the spacing area does not emit into the light-absorbing layer.

[0209] For example, where possible, the structure of the light-absorbing layer in the display panel may be optimized to provide auxiliary grooves within the light-absorbing layer, and the orthographic projection of these auxiliary grooves onto the substrate may overlap with the portion of the orthographic projection of the spacing region onto the substrate that is not covered by the driving layer.

[0210] In another possible example, the spacing region between two adjacent signal leads within the bonding region can be completely covered by the drive layer by optimizing its position or shape.

[0211] In yet another possible scenario, the spacing region can be completely covered by the driving layer by optimizing the structure of the driving layer in the display panel.

[0212] Furthermore, the principles for optimizing other structures in the display panel can be found in the corresponding details in the above-described embodiment. A detailed explanation is omitted here.

[0213] Embodiments of the present invention further provide a display device. The display device may be any product or component having a display function, such as a mobile phone, tablet computer, television, display, laptop computer, digital photo frame, or navigator. The display device may include a drive assembly and the display panel in the above embodiment. The drive assembly may be electrically connected to a drive layer in the display panel and is used to provide drive signals to a light-emitting unit via the drive layer.

[0214] Note that in drawings, the dimensions of layers and areas may be exaggerated for clarity. Also, when an element or layer is referred to as "above" another element or layer, it may be directly connected to the other element, or there may be an intermediate layer. Also, when an element or layer is referred to as "below" another element or layer, it may be directly below the other element, or there may be one or more intermediate layers or elements. Furthermore, when a layer or element lies between two layers or two elements, it may be the only layer between the two layers or two elements, or there may be one or more intermediate layers or elements. Similar reference numerals indicate similar elements.

[0215] In this application, the terms "first" and "second" are for explanatory purposes only and should not be understood as indicating or implying relative importance. Unless otherwise specified, "plural" refers to two or more.

[0216] The above description is merely an optional embodiment of the present application and does not limit it. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present application should be included within the scope of protection.

Claims

1. It includes a substrate, a first metal driving layer, a light absorption layer, a plurality of light-emitting units, and an auxiliary light absorption layer. The first metal drive layer is located on one side of the substrate and has a plurality of conductive pads. The light-absorbing layer is located on the side of the first metal drive layer away from the substrate, the orthographic projection of the light-absorbing layer onto the substrate and the orthographic projection of the first metal drive layer onto the substrate overlap, and the light-absorbing layer has a plurality of first vias corresponding to the plurality of conductive pads, the orthographic projection of the first vias onto the substrate and the orthographic projection of the corresponding conductive pads onto the substrate overlap, The plurality of light-emitting units are located on the side of the light-absorbing layer away from the substrate, and the light-emitting units are electrically connected to at least some of the conductive pads via the first via. The auxiliary light absorption layer is located on the side of the light-emitting unit away from the substrate, A display panel characterized by the following features.

2. The display panel further includes a light-reflecting layer located between the substrate and the light-absorbing layer, wherein the orthographic projection of the light-reflecting layer onto the substrate and the orthographic projection of the light-absorbing layer onto the substrate overlap. The display panel according to feature 1.

3. The light-reflecting layer is located on the side of the first metal drive layer away from the substrate, and the light-reflecting layer has a second via that communicates with the first via. The display panel according to feature 2.

4. The orthographic projection of the light-absorbing layer onto the substrate is located within the orthographic projection of the light-reflecting layer onto the substrate. The display panel according to feature 3.

5. The display panel further includes a first insulating layer located between the first metal driving layer and the light absorbing layer, the first insulating layer having a third via communicating with the first via. The display panel according to feature 4.

6. The light-reflecting layer has insulating properties, and the light-reflecting layer and the first insulating layer have the same film layer structure. The display panel according to feature 5.

7. The light-reflecting layer is located on the side of the first insulating layer away from the substrate, or the light-reflecting layer is located on the side of the first insulating layer closer to the substrate. The display panel according to feature 5.

8. The display panel further includes a second insulating layer located on the side of the light-absorbing layer away from the substrate, the second insulating layer having a fourth via communicating with the first via, and a portion of the second insulating layer extending into the first via and covering at least a portion of the inner wall of the first via. The display panel according to feature 3.

9. The light-absorbing layer contains carbon particles, and the inner wall of the first via is completely covered by the second insulating layer. The display panel according to feature 8.

10. The portion of the second insulating layer extends into the second via and covers at least a portion of the inner wall of the second via. The display panel according to feature 9.

11. The display panel further includes a second metal drive layer located on the side of the first metal drive layer closer to the substrate, and the light reflection layer is located on the side of the second metal drive layer closer to the substrate. The display panel according to feature 2.

12. At least one of the first metal driving layer and the second metal driving layer has a mark pattern, the light absorbing layer has relief holes corresponding to the mark pattern, and the orthographic projection of the relief holes onto the substrate and the orthographic projection of the mark pattern onto the substrate overlap. The display panel according to feature 11.

13. The material of the light-reflecting layer includes at least one of amorphous silicon, low-temperature polysilicon, and white ink. The display panel according to any one of claims 2 to 12.

14. When the material of the light-reflecting layer includes amorphous silicon, the thickness range of the light-reflecting layer is 500 angstroms to 2000 angstroms. When the material of the light-reflecting layer contains white ink, the thickness range of the light-reflecting layer is 0.5 micrometers to 3 micrometers. When the material of the light-emitting layer is low-temperature polysilicon, the thickness range of the light-emitting layer is 500 angstroms to 2000 angstroms. The display panel according to feature 13.

15. The display panel further includes a plurality of drive circuits located on the side of the first metal drive layer closest to the substrate, the drive circuits being electrically connected to the light-emitting unit via the conductive pads, The drive circuit includes a plurality of stacked electrical patterns, and the display panel further includes an insulating layer located between two adjacent electrical patterns. The display panel according to feature 1.

16. The display panel further includes a light-reflecting layer installed in the same layer as one of the plurality of electrical patterns, wherein the orthographic projection of the light-reflecting layer onto the substrate and the orthographic projection of the light-absorbing layer onto the substrate overlap. The display panel according to feature 15.

17. The drive circuit has at least one transistor, one of the plurality of electrical patterns is an active layer pattern in the transistor, and both the material of the active layer pattern and the material of the light-reflecting layer contain low-temperature polysilicon. The active layer is installed in the same layer as the light-reflecting layer and is made of the same material. The display panel according to feature 16.

18. The minimum distance between the outer boundary of the orthographic projection of the active layer pattern onto the substrate and the outer boundary of the orthographic projection of the light-reflecting layer onto the substrate is 5 micrometers or more. The display panel according to feature 17.

19. The edge region of the surface of the substrate away from the first metal drive layer includes a binding region, and the display panel further includes a plurality of signal leads located within the binding region, and at least some of the plurality of signal leads are electrically connected to the drive circuit. The region between two adjacent drive signal leads is a spacing region, and the orthographic projection of the spacing region onto the substrate overlaps with the orthographic projection of the light-reflecting layer onto the substrate. The display panel according to feature 17.

20. The aforementioned interval region includes a first region and a second region, The first region is the region in the spacing region that is covered by the first metal driving layer and the plurality of electrical patterns, and the second region is the region in the spacing region other than the first region. At least a portion of the orthographic projection of the light-reflecting layer onto the substrate is located within the orthographic projection of the second region onto the substrate. The display panel according to feature 19.

21. The orthographic projection of the light-reflecting layer onto the substrate does not overlap with the orthographic projection of the first metal driving layer onto the substrate, and does not overlap with the orthographic projection of each of the electrical patterns onto the substrate. The display panel according to claim 20.

22. The orthographic projection of the light-reflecting layer onto the substrate completely covers the second region. The display panel according to claim 20.

23. The orthographic projection boundary of the portion of the light-reflecting layer covered by the second region onto the substrate extends along the orthographic projection boundary of the first region onto the substrate, and the orthographic projection boundary of the portion of the light-reflecting layer covered by the second region onto the substrate does not overlap with the orthographic projection boundary of the first region onto the substrate. The display panel according to claim 20.

24. The display panel further includes a mark pattern which is installed in the same layer as at least one of the plurality of electrical patterns and is made of the same material, the light-reflecting layer has relief holes corresponding to the mark pattern, and the orthographic projection of the relief holes onto the substrate and the orthographic projection of the mark pattern onto the substrate overlap. The display panel according to any one of claims 16 to 23, characterized by the features described herein.

25. The plurality of electrical patterns include a first gate pattern, an active layer pattern, a second gate pattern, and a source-drain pattern, which are stacked and arranged perpendicularly and away from the substrate. When the light-reflecting layer is installed in the same layer as the active layer pattern, the number of mark patterns is at least two, one of which is installed in the same layer as the second gate pattern and is made of the same material, and the other of which is installed in the same layer as the source-drain pattern and is made of the same material. The display panel according to feature 24.

26. The auxiliary light-absorbing layer has a transmittance of 50% or more for light rays emitted from the light-emitting unit. A display panel according to any one of claims 1 to 12, 14 to 23, or 25.

27. The light-emitting unit includes a mini light-emitting diode or a micro light-emitting diode. A display panel according to any one of claims 1 to 12, 14 to 23, or 25.

28. A drive assembly and a display panel according to any one of claims 1 to 27, electrically connected to the drive assembly, A display device characterized by the following features.

Images