Reaction chamber of thin film deposition apparatus
The laminar flow reaction chamber with a rotating substrate holder addresses non-uniform deposition in batch processing by ensuring uniform precursor distribution and reducing turbulence, enhancing processing quality and efficiency.
JP2026520840APending Publication Date: 2026-06-25PICOSUN OY
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- PICOSUN OY
- Filing Date
- 2024-06-13
- Publication Date
- 2026-06-25
AI Technical Summary
Technical Problem
Existing substrate processing apparatuses face challenges in providing uniform processing conditions for multiple substrates within a reaction chamber, leading to non-uniform deposition and increased resource usage.
Method used
A laminar flow reaction chamber design with a substrate holder that accommodates multiple substrates in a stack, allowing for uniform precursor distribution and rotation during processing to mitigate non-uniform flow effects.
Benefits of technology
Ensures homogeneous deposition across all substrates by maintaining laminar flow and reducing turbulence, improving processing quality and efficiency.
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Smart Images
Figure 2026520840000001_ABST
Abstract
An apparatus comprising: a main body of a laminar flow reaction chamber (120) having an inlet opening for a precursor gas on its front, an exhaust opening (190) on its rear, and a lid opening on its top or bottom; and a substrate holder (140) configured to accommodate a batch (bundle, group) of a plurality of substrates (130), wherein the plurality of substrates are arranged so that their surfaces face each other to form a substrate stack, and the substrate holder forms a lid that covers the lid opening.
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