Metal rods inside the RF electrode assembly and the RF electrode assembly

Abstract

A metal rod inside an RF electrode assembly and an RF electrode assembly, wherein the metal rod is enclosed inside an electrode support member, one end of the metal rod is connected to an RF electrode plate in a heater disk, and the other end is connected to an RF component at the rear end, and the metal rod is cut into two segments with a gap remaining in the middle while enclosed in the support member, and the two segments of the metal rod are connected by a metal leaf spring, thereby providing a temperature reduction and heat insulation effect.

Description

Technical Field

[0001] The present invention relates to an RF (radio frequency) electrode assembly, and more particularly to the structure of a metal rod inside the RF electrode assembly and the RF electrode assembly including the metal rod.

Background Art

[0002] RF electrodes are widely used in semiconductor thin film deposition equipment. In the thin film deposition process, the frequency and output of the RF electrode can achieve adjustment of the thin film quality and performance by precisely controlling the ion energy and density. Specifically, the RF electrode supplies high-frequency electrical energy to activate atoms or molecules in the deposition gas and deposit them on the substrate surface to form a thin film. The RF electrode can supply a stable high-frequency electric field, giving sufficient energy to atoms or molecules in the deposition gas, thereby being fully activated, which is advantageous for uniform deposition of the thin film and good crystal performance.

[0003] Furthermore, RF electrodes are also widely used in semiconductor surface cleaning processes. In the semiconductor manufacturing process, various impurities and harmful substances often adhere to the semiconductor surface, and cleaning is required to improve device performance. The RF electrode supplies high-frequency electrical energy to excite ions in the cleaning solution, thereby realizing cleaning of the semiconductor surface. Therefore, the RF electrode plays an important role in semiconductor thin film deposition equipment and is crucial in controlling the quality and performance of the thin film.

[0004] [[ID=2E]]The RF electrode device in semiconductor thin film deposition equipment is used to generate an RF electric field to control the thin film deposition process. In this process, the metal rod inside the RF electrode assembly plays a key role. The metal rod is generally composed of a highly conductive material such as copper or aluminum. These materials have excellent conductivity and corrosion resistance, can efficiently transmit RF signals, and can maintain the stability of the equipment.

[0005] More specifically, the metal rod itself functions as a conductive medium, efficiently transmitting RF signals and contributing to the generation and maintenance of the RF electric field. The metal rod is typically fixed in the appropriate position of the electrode device, providing stable support and ensuring that the electrode device is in the correct position. In some cases, the metal rod also functions as a cooling path, contributing to the transfer and dissipation of heat generated during the operation of the equipment, thereby maintaining the stable operation of the equipment. Furthermore, the metal rod also functions as a shield, reducing the impact of external electromagnetic interference on the equipment and reducing the possibility of radiation exposure to operators.

[0006] In semiconductor thin-film deposition (STD) systems, the design and manufacture of metal rods must consider factors such as their dimensions, shape, material, and position within the system. All of these factors directly affect the system's performance and stability. Therefore, rationally designed metal rods are crucial for optimizing the performance of semiconductor thin-film deposition systems.

[0007] However, in conventional technology, a metal rod encased in an external insulating support member is typically in direct contact with the assembly at its rear end, while its front end is directly connected to an electrode plate on a heater disk within a semiconductor process chamber. During the process, the temperature of the heater disk rises to extremely high levels, and the metal rod also needs to conduct high-power RF signals to the heater disk. For example, in a typical thin-film deposition process, under conditions where the heater disk reaches temperatures above 650°C, it is necessary to conduct RF power exceeding 3000W to the electrode plate on the heater disk. This frequently leads to the burning of the metal rod, damaging the equipment, affecting the control of process parameters, and requiring frequent replacement of the metal rod, resulting in inconvenience for equipment maintenance.

[0008] To overcome the aforementioned shortcomings of conventional technology, there is an urgent need in this field for metal rods and RF electrode assemblies within RF electrode assemblies that optimize the device structure of the metal rods, add insulating materials to reduce heat conduction within the metal rods, relieve stress caused by thermal expansion and contraction due to temperature changes, extend the service life of the metal rods, and reduce the frequency of failures in RF electrode devices. [Overview of the Initiative] [Means for solving the problem]

[0009] The following provides a brief overview of one or more embodiments to offer a basic understanding of these embodiments. This overview is not a detailed overview of all conceived embodiments, nor is it intended to identify the importance or defining elements of all embodiments, nor to define the scope of any or all embodiments. Its sole purpose is to provide some concepts of one or more embodiments in a concise form, as an introduction to the more detailed explanations that will be provided later.

[0010] To overcome the aforementioned shortcomings of the prior art, the present invention provides a metal rod for inside an RF electrode assembly that is enclosed within an electrode support member, one end of which is connected to an RF electrode plate in a heater disk and the other end to an RF component at the rear end, and the metal rod is cut into two segments with a gap remaining in between at the position enclosed by the support member, and the two segments of the metal rod are connected by a metal leaf spring.

[0011] In one embodiment, and more preferably in the metal rod inside the RF electrode assembly provided by the present invention, the metal leaf spring includes a plurality of metal leaf springs connected in parallel.

[0012] In one embodiment, and more preferably in the metal rod inside the RF electrode assembly provided by the present invention, a bent portion is provided on at least one of the multiple metal leaf springs connected in parallel.

[0013] In one embodiment, and more preferably in the metal rod inside the RF electrode assembly provided by the present invention, the plurality of parallel-connected metal leaf springs include two metal leaf springs that are identical in shape and arranged in parallel.

[0014] In one embodiment, and more preferably in the metal rod inside the RF electrode assembly provided by the present invention, each of the two metal leaf springs, which are identical in shape and arranged in parallel, is provided with a bent portion that is positioned in the gap between the two segments of the metal rod and does not come into contact with the metal rods on either side thereof.

[0015] In one embodiment, and more preferably in the metal rod inside the RF electrode assembly provided by the present invention, at the connection point between the two segments of the metal rod and the metal leaf spring, the metal rod is in the shape of a flat strip, and the end of the metal leaf spring is in the shape of a flat straight strip, so that the metal rod is sandwiched between the ends of the two metal leaf springs and is further fixedly connected by a bolt.

[0016] In one embodiment, and more preferably in the metal rod inside the RF electrode assembly provided by the present invention, at the connection point between the two segments of the metal rod and the metal leaf spring, a steel ingot is further provided on the opposite side of the bolt and nut, the shape and size of the steel ingot being matched to the flat, strip-shaped and size of the metal rod, and the connection between the metal leaf spring and the metal rod being fixed.

[0017] In one embodiment, more preferably, in the metal rod inside the RF electrode assembly provided by the present invention, the contact area between the metal rod and the metal leaf spring is 6.37 mm². 2 ~37.8mm 2 It is within the range.

[0018] In one embodiment, and more preferably in the metal rod inside the RF electrode assembly provided by the present invention, the metal leaf spring is elastic, and when assembling the RF electrode, a gap space is left around the bent portion of the metal leaf spring that is used to deform the metal leaf spring and release stress.

[0019] Another aspect of the present invention also provides an RF electrode assembly including the metal rod described in any one of the above items. The position wrapped by the support member in the middle of the metal rod is cut into two segments, and the two segments of the metal rod are connected by a metal plate spring, so that temperature reduction and heat insulation can be effectively performed, preventing damage to the metal rod caused by the too high temperature of the electrode plate, thereby extending the service life of the RF electrode assembly and reducing the production cost.

[0020] After reading the detailed description of the embodiments of the present disclosure in connection with the following drawings, the above features and advantages of the present invention can be better understood. In the drawings, each component is not necessarily drawn to scale, and components having the same or similar correlation characteristics or features may have the same or similar reference numerals.

Brief Description of the Drawings

[0021] [Figure 1] It is a schematic diagram of the assembly structure of the metal rod inside the RF electrode assembly shown based on an example of the prior art. [Figure 2] It is a photograph of the burned metal rod shown based on an example of the prior art. [Figure 3] It is a schematic diagram of the assembly structure of the metal rod inside the RF electrode assembly shown based on an embodiment of the present invention. [Figure 4] It is a schematic diagram of the device structure of the partial enlargement of the metal rod at A in FIG. 3 shown based on an embodiment of the present invention.

Modes for Carrying Out the Invention

[0022] Hereinafter, embodiments of the present invention will be described using specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The description of the present invention is described together with preferred examples, but this does not mean that the features of the present invention are limited to this embodiment. On the contrary, the purpose of introducing the invention in relation to the embodiment is to cover other selections or modifications that may extend based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description includes many specific details. The present invention can also be implemented without using these details. Also, there are specific details that are omitted in the description in order not to confuse or obscure the gist of the present invention.

[0023] In the description of the present invention, unless there are particularly clear regulations and limitations, the terms "attachment", "contact", and "connection" should be understood in a broad sense. For example, it may be a fixed connection, a removable connection, or an integral connection, and may be a mechanical connection or an electrical connection. It may be in direct contact or indirectly in contact through an intermediate medium, or may be a communication inside two elements. Those skilled in the art can specifically understand the specific meaning of the above terms in the present invention.

[0024] Also, the "upper", "lower", "left", "right", "top", "bottom", "horizontal", and "vertical" used in the following description should be understood as the orientations depicted in the segments and related drawings. This relative term is for convenience of description only and does not mean that the described device needs to be manufactured or operated in a specific orientation, so it should not be understood as a limitation to the present invention. [[ID=[]]

[0025] [[ID=[]] Here, terms such as “first,” “second,” “third,” etc., may be used to describe various components, regions, layers, and / or parts, but it will be understood that these components, regions, layers, and / or parts should not be limited by these terms, and that these terms are used solely to distinguish different components, regions, layers, and / or parts. Accordingly, the first components, regions, layers, and / or parts discussed below may be referred to as second components, regions, layers, and / or parts without departing from some embodiments of the present invention.

[0026] Figure 1 is a schematic diagram of the assembly structure of metal rods inside an RF electrode assembly, based on an example of conventional technology.

[0027] As shown in Figure 1, in the prior art, the metal rod 101, which is encased by an external insulating support member 103, is usually in direct contact with the RF electrode rear end component 102, and its front end is directly connected to the electrode plate on the heater disk in the semiconductor process chamber.

[0028] During the process, the heater disk temperature rises to extremely high levels, and the metal rods also need to conduct high-power RF signals to the heater disk. For example, in a typical thin-film deposition process, the heater disk temperature must reach over 650°C, and RF power exceeding 3000W must be conducted to the electrode plates on the heater disk, frequently leading to the burning of the metal rods. Please refer to Figure 2.

[0029] Figure 2 is a photographic representation of a burnt metal rod, based on an example of the conventional technology.

[0030] As shown in Figure 2, when the metal rod burns or partially burns, the equipment is damaged and the control of process parameters is affected. Therefore, the burnt metal rod 201 needs to be replaced frequently, which makes equipment maintenance inconvenient.

[0031] To overcome the aforementioned shortcomings of conventional technology, the present invention provides a metal rod and an RF electrode assembly for inside an RF electrode assembly that optimize the device structure of the metal rod, add a heat insulating material to reduce heat conduction within the metal rod, relieve stress caused by thermal expansion and contraction due to temperature changes, extend the service life of the metal rod, and reduce the frequency of failures of the RF electrode device.

[0032] Figure 3 is a schematic diagram of the assembly structure of metal rods inside an RF electrode assembly, shown according to one embodiment of the present invention.

[0033] Please refer to Figure 3. The metal rod inside the RF electrode assembly provided by the present invention is enclosed inside the electrode support member 301, with one end of the metal rod connected to the RF electrode plate in the heater disk and the other end connected to the RF component at the rear end. For the specific structure of the metal rod in Figure 3A, please refer to Figure 4.

[0034] Figure 4 is a schematic diagram of the apparatus structure, showing a localized close-up of the metal rod in Figure 3A, based on one embodiment of the present invention.

[0035] Please refer to Figure 4. The metal rod provided by the present invention is cut into two segments with a gap in between at the position where it is encased in the support member, namely the first metal rod 401 and the second metal rod 402 in Figure 4, and the two segments of the metal rod are connected by a metal leaf spring.

[0036] For example, metal leaf springs can be made of copper and have good electrical and thermal conductivity.

[0037] In one preferred embodiment, the metal rod inside the RF electrode assembly provided by the present invention includes a plurality of metal leaf springs connected in parallel.

[0038] To understand this, connecting multiple metal leaf springs in parallel increases the number of paths through which current flows in the metal rod, thereby reducing the current value flowing through a single leaf spring. Taking two metal leaf springs connected in parallel as an example, the current I flowing through each leaf spring is half that of the original structure, and the heat generation formula Q = I 2 Based on R, the amount of heat generated by an electric current on a single leaf spring is 1 / 4 of the original amount of heat generated, and since a thin leaf spring structure is more suitable for heat dissipation, a configuration using multiple parallel-connected metal leaf springs to connect metal rods at both ends can exhibit better heat insulation and heat dissipation effects, reduce the heat conduction of the metal rods themselves, and decrease the probability of burnout.

[0039] Furthermore, more preferably, in one embodiment, in the metal rod inside the RF electrode assembly provided by the present invention, a bent portion is provided on at least one of the multiple metal leaf springs connected in parallel.

[0040] To understand this, the bend on the metal leaf spring extends the heat conduction length of the leaf spring as much as possible within the limited space, thereby enabling better heat dissipation.

[0041] In the embodiment shown in Figure 4, the multiple metal leaf springs connected in parallel include two metal leaf springs that are identical in shape and arranged in parallel, namely the first metal leaf spring 403 and the second metal leaf spring 404 in Figure 4.

[0042] As shown in Figure 4, in this embodiment, the first metal leaf spring 403 and the second metal leaf spring 404 have a bent portion located midway between the two metal leaf springs. This bent portion is positioned in the gap between the first metal rod 401 and the second metal rod 402, and does not come into contact with the metal rods on either side of it.

[0043] To make it easy to understand, by positioning the bent section in the gap between the metal rods on both sides, assembly space can be saved, thereby allowing for the smallest possible modifications to the existing electrode device structure, making it convenient for manufacturing.

[0044] Preferably, these metal leaf springs are elastic, and when assembling the RF electrodes, a gap is left around the bent portion of the metal leaf spring, which allows for faster heat dissipation on the one hand, and on the other hand, the gap can be used to release stress by allowing the metal leaf spring to deform when thermal expansion and contraction occur due to temperature changes.

[0045] It should be noted that the shape, number, and positional arrangement of the metal leaf springs and bends in this embodiment described herein are for illustrative purposes only and are intended to clearly illustrate preferred embodiments of the metal rod device structure inside the RF electrode assembly provided by the present invention, and are not intended to limit the scope of protection of the present invention. In practice, a greater number of leaf springs or other structural configurations that can extend the heat conduction length may be used, and all device structures that exhibit similar heat insulation and heat dissipation effects can be applied to the metal rods of the electrode assembly provided by the present invention and should all be included within the scope of protection of the present invention.

[0046] In a more preferred embodiment, we can refer to Figure 4, in which the metal rod inside the RF electrode assembly provided by the present invention is flattened into a strip shape at the connection point between the two segments of the metal rod and the metal leaf spring, and the end of the metal leaf spring is flattened into a straight strip shape. As a result, the metal rod is sandwiched between the ends of the two metal leaf springs and is further fixedly connected by bolt 406.

[0047] Furthermore, more preferably, as shown in Figure 4, at the connection point between the metal rods of the two segments and the metal leaf spring, a steel ingot 405 is further provided on the opposite side of the bolt and nut, and the shape and size of the steel ingot 405 are matched to the flat, strip-shaped shape and size of the metal rod, thereby fixing the connection between the metal leaf spring and the metal rod.

[0048] The installation of this connection point can increase the contact area between the metal leaf spring and the metal rod. For example, in an embodiment of the present invention, the contact area between the metal rod and the metal leaf spring is 6.37 mm². 2 ~37.8mm 2 It may be within the range of [a certain limit].

[0049] As those skilled in the art will understand, increasing the contact area at the connection point can reduce contact resistance, thereby reducing heat generation due to contact, and further increasing the temperature reduction and heat insulation effects of the electrode metal rod provided by the present invention.

[0050] The methods for connecting the metal rod and metal leaf spring described in this text are illustrative only and are intended to provide preferred and easily implementable embodiments, and are not intended to limit the scope of protection of the present invention. In practice, all other assembly methods for connecting and fixing the metal rod and metal leaf spring, or similar connection structures that exhibit the effect of reducing contact heat generation, can be applied to the metal rod of the RF electrode assembly provided by the present invention and should all be included within the scope of protection of the present invention.

[0051] Another aspect of the present invention also provides an RF electrode assembly comprising a metal rod as described in any one of the above sections. The portion of the metal rod covered by an intermediate support member is cut into two segments, and the two segments of the metal rod are connected by a metal leaf spring, thereby effectively reducing temperature and providing heat insulation, preventing damage to the metal rod due to excessively high electrode plate temperatures, and thereby extending the service life of the RF electrode assembly and reducing production costs.

[0052] The prior description is provided to enable those skilled in the art to prepare or use this disclosure. Various modifications to this disclosure will be obvious to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of this disclosure. Accordingly, this disclosure is not intended to be limited to the examples and designs described herein, but should be granted to the broadest extent consistent with the principles and novelty features disclosed herein.

[0053] For clarity, a brief explanation of the drawing references is provided below: [Explanation of symbols]

[0054] 101 Metal rod 102 RF electrode rear end parts 103 Support member 201 Burnt metal rod 301 Support Member 401 First metal rod 402 Second metal rod 403 First metal leaf spring 404 Second metal leaf spring 405 Steel ingot 406 volts.

Claims

1. A metal rod inside the RF electrode assembly that is enclosed within the electrode support member, One end of the metal rod is connected to the RF electrode plate in the heater disk, and the other end is connected to the RF component at the rear end. The metal rod is characterized in that, at the position where it is covered by the support member, it is cut into two segments with a gap in the middle, and the two segments of the metal rod are connected by a metal leaf spring.

2. The metal rod according to claim 1, characterized in that the metal leaf spring includes a plurality of metal leaf springs connected in parallel.

3. The metal rod according to claim 2, characterized in that a bent portion is provided on at least one of the plurality of metal leaf springs connected in parallel.

4. The metal rod according to claim 2, characterized in that the plurality of metal leaf springs connected in parallel include two metal leaf springs that are identical in shape and arranged in parallel.

5. The metal rod according to claim 4, characterized in that each of the two metal leaf springs, which are identical in shape and arranged in parallel, is provided with a bent portion that is positioned in the gap between the metal rods of the two segments and does not come into contact with the metal rods on either side thereof.

6. The metal rod according to claim 5, characterized in that, at the connection point between the metal rod of the two segments and the metal leaf spring, the metal rod is in the shape of a flat strip and the end of the metal leaf spring is in the shape of a flat straight strip, so that the metal rod is sandwiched between the ends of the two metal leaf springs and is further fixedly connected by a bolt.

7. The metal rod according to claim 6, characterized in that, at the connection point between the metal rod of the two segments and the metal leaf spring, a steel ingot is further provided on the side opposite the bolt and nut, and the shape and size of the steel ingot are matched to the flat, strip-shaped shape and size of the metal rod to secure the connection between the metal leaf spring and the metal rod.

8. The contact area between the metal rod and the metal leaf spring is 6.37 mm². ２ ~37.8mm ２ The metal rod according to claim 6, characterized in that it is within the range.

9. The metal rod according to claim 3 or claim 5, characterized in that the metal leaf spring is elastic, and a gap space is left around the bent portion of the metal leaf spring when assembling the RF electrode.

10. An RF electrode assembly characterized by comprising a metal rod according to any one of claims 1 to 9.

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