System and method for quality verification of mixtures

Abstract

This disclosure relates to an electrical characteristic sensor comprising a printed circuit board having a first surface and a second surface separated by thickness, wherein the first surface has length and width. The sensor also comprises a first sensing region disposed on the first surface, including a receiving electrode and a transmitting electrode. When a fluid comes into contact with the first or second sensing region and the transmitting electrode is activated, an electrical characteristic value sensed at the receiving electrode is measured.

Description

Background Art

[0001] Many products require mixtures in manufacturing. For example, commercial or industrial paints, adhesives, resins, etc. Many mixtures may contain different materials that can sediment or separate over time. For the users of the mixture, it may not be easy to recognize that its composition has become non-uniform.

Summary of the Invention

[0002] An electrical property sensor is disclosed that includes a printed circuit board having a first surface and a second surface separated by a thickness, the first surface having a length and a width. The sensor also includes a first sensing region disposed on the first surface and including a receiving electrode and a transmitting electrode. When a fluid contacts the first or second sensing region and the transmitting electrode is actuated, the electrical property value sensed at the receiving electrode is measured.

[0003] Systems and methods including such sensors enable direct contact between the sensor and the fluid flowing within the dispenser. These sensors are economical because they have a low manufacturing cost and can be discarded after use. Furthermore, the systems and methods of the present invention enable the acquisition of a plurality of sensor signals across the fluid flow, providing real-time information regarding the materials flowing into and out of the mixing region. Also, it enables the detection and removal of air bubbles. With the systems and methods of the present invention, the dispenser system and its operator can change the operating parameters to address problems that are occurring or may occur during operation. As a result, waste of materials can be reduced and more accurate dispensing can be achieved.

[0004] The above summary of this disclosure is not intended to describe each or all embodiments of this disclosure. More specific examples are provided illustratively in the following description. In several places in this specification, guides are provided by lists of examples, but these examples can be used in various combinations. Each list represents a representative set of examples and should not be construed as limiting. Accordingly, the scope of this disclosure is not limited to any specific exemplary structure described herein, but extends at least to structures and their equivalents as described in the language of the claims. Elements expressly described as alternatives herein may be expressly included or excluded in any combination in the claims. Furthermore, where various theories or possible mechanisms may be referred to herein, such descriptions should not be construed as limiting the scope of the claimed invention. [Brief explanation of the drawing]

[0005] [Figure 1A] Figure 1A shows a system for distributing atomized fluid, which has the advantages of the system and method according to the present invention. [Figure 1B] Figure 1B shows a system for distributing atomized fluid, which has the advantages of the system and method according to the present invention. [Figure 1C] Figure 1C shows a system for distributing atomized fluid, which has the advantages of the system and method according to the present invention.

[0006] [Figure 2] Figure 2 shows an exploded view of a spray gun that can implement an embodiment of the present invention.

[0007] [Figure 3A] Figure 3A shows a material measurement flow sensor according to an embodiment of the present invention. [Figure 3B] Figure 3A shows a material measurement flow sensor according to an embodiment of the present invention. [Figure 3C] Figure 3A shows a material measurement flow sensor according to an embodiment of the present invention. [Figure 3D] Figure 3A shows a material measurement flow sensor according to an embodiment of the present invention.

[0008] [Figure 4A] Figure 4A shows a spray gun according to an embodiment of the present invention. [Figure 4B] Figure 4B shows a spray gun according to an embodiment of the present invention.

[0009] [Figure 5A] Figure 5A shows a material measurement flow sensor used according to an embodiment of the present invention. [Figure 5B] Figure 5B shows a material measurement flow sensor used according to an embodiment of the present invention.

[0010] [Figure 6A] Figure 6A shows an exemplary distribution system equipped with a sensor system according to an embodiment of the present invention. [Figure 6B] Figure 6B shows an exemplary distribution system equipped with a sensor system according to an embodiment of the present invention. [Figure 7A] Figure 7A shows an exemplary distribution system equipped with a sensor system according to an embodiment of the present invention. [Figure 7B] Figure 7B shows an exemplary distribution system equipped with a sensor system according to an embodiment of the present invention. [Figure 7C] Figure 7C shows an exemplary distribution system equipped with a sensor system according to an embodiment of the present invention. [Figure 7D] Figure 7D shows an exemplary distribution system equipped with a sensor system according to an embodiment of the present invention.

[0011] [Figure 8A] Figure 8A shows the dispersion state that can be obtained using the sensor system and method of the present invention. [Figure 8B] Figure 8B shows the dispersion state that can be obtained using the sensor system and method of the present invention. [Figure 8C]FIG. 8C shows a dispersion state that can be obtained using the sensor system and method of the present invention.

[0012] [Figure 9] FIG. 9 shows an embodiment of a stir bar configured to provide in-situ conductivity measurements for a mixture.

[0013] [Figure 10] FIG. 10 shows a long sensor according to an embodiment of the present invention. [[ID=1s4]]

[0014] [Figure 11A] FIG. 11A shows a sensor having electrodes in a series configuration according to an embodiment of the present invention. [Figure 11B] FIG. 11B shows a sensor having electrodes in a series configuration according to an embodiment of the present invention. [Figure 11C] FIG. 11C shows a sensor having electrodes in a series configuration according to an embodiment of the present invention. [Figure 11D] FIG. 11D shows a sensor having electrodes in a series configuration according to an embodiment of the present invention.

[0015] [Figure 12] FIG. 12 shows an embodiment of another system where embodiments of the present invention may be useful.

[0016] [Figure 13A] FIG. 13A shows a sensor configuration for bubble detection according to an embodiment of the present invention.. [Figure 13B] FIG. 13B shows a sensor configuration for bubble detection according to an embodiment of the present invention. [Figure 13C] FIG. 13C shows a sensor configuration for bubble detection according to an embodiment of the present invention.

[0017] [Figure 14] FIG. 14 shows a method for detecting and correcting quality problems in a mixture according to an embodiment of the present invention.

[0018] [Figure 15] Figure 15 shows a quality control system according to an embodiment of the present invention.

[0019] [Figure 16A] Figure 16A shows a stacked printed circuit board sensor according to an embodiment of the present invention. [Figure 16B] Figure 16B shows a stacked printed circuit board sensor according to an embodiment of the present invention.

[0020] [Figure 17A] Figure 17A shows a sensor according to an embodiment of the present invention. [Figure 17B] Figure 17B shows a sensor according to an embodiment of the present invention. [Figure 17C] Figure 17C shows a sensor according to an embodiment of the present invention. [Figure 17D] Figure 17D shows a sensor according to an embodiment of the present invention.

[0021] [Figure 18A] Figure 18A shows a surface sensing sensor configuration according to an embodiment of the present invention. [Figure 18B] Figure 18B shows a surface sensing sensor configuration according to an embodiment of the present invention. [Figure 18C] Figure 18C shows a surface sensing sensor configuration according to an embodiment of the present invention. [Figure 18D] Figure 18D shows a surface sensing sensor configuration according to an embodiment of the present invention. [Figure 18E] Figure 18E shows a surface sensing sensor configuration according to an embodiment of the present invention.

[0022] [Figure 19A] Figure 19A shows a flexible sensor system according to an embodiment of the present invention. [Figure 19B] Figure 19B shows a flexible sensor system according to an embodiment of the present invention. [Figure 19C] Figure 19C shows a flexible sensor system according to an embodiment of the present invention. [Figure 19D]Figure 19D shows a flexible sensor system according to an embodiment of the present invention. [Figure 19E] Figure 19E shows a flexible sensor system according to an embodiment of the present invention.

[0023] [Figure 20] Figure 20 shows a quality control method for a material distribution system according to an embodiment of the present invention.

[0024] [Figure 21A] Figure 21A shows a conductivity measurement system in an exemplary network architecture. [Figure 21B] Figure 21B shows a conductivity measurement system in an exemplary network architecture. [Figure 21C] Figure 21C shows a conductivity measurement system in an exemplary network architecture.

[0025] [Figure 22A] Figure 22A shows a sensing system according to an embodiment of the present invention. [Figure 22B] Figure 22B shows a sensing system according to an embodiment of the present invention. [Figure 22C] Figure 22C shows a sensing system according to an embodiment of the present invention. [Figure 22D] Figure 22D shows a sensing system according to an embodiment of the present invention.

[0026] [Figure 23] Figure 23 shows a distribution system according to an embodiment of the present invention.

[0027] [Figure 24] Figure 24 shows an exemplary computing device that may be used in embodiments of the present invention. [Figure 25] Figure 25 shows an exemplary computing device that may be used in embodiments of the present invention. [Figure 26] Figure 26 shows an exemplary computing device that may be used in embodiments of the present invention. [Modes for carrying out the invention]

[0028] This disclosure relates to a system and method including a sensor for measuring the properties of a fluid in situ. The disclosure also relates to a dataset received by such a sensor and a method for analyzing the fluid properties using such data. Using the systems and methods described herein, it may be possible to adjust the operating conditions of a mixture (e.g., pressure, temperature, mixing ratio, etc.) or improve the uniformity of the composition (e.g., remixing, degassing, etc.) before or during operation.

[0029] Many industrial processes utilize mixtures of liquids such as liquid adhesives, liquid food components, liquid coolants, and liquid reaction products. Some of the properties of these liquids change over time. For example, dispersions or emulsions may separate, oils may decrease in viscosity with rising temperatures, and coolants may degrade, resulting in a decrease in heat capacity compared to their initial state. This can impair the performance of the product during use. For instance, paints may soften and harden (or fail to harden at all), become brittle, crack, delaminate, or exhibit poor adhesion. If the paint mixture is not uniform before application, corrective actions may require considerable time, and energy-intensive sanding and surface treatment may be necessary before attempting reapplication. Solving these problems requires detailed chemical knowledge, time, and the exclusion of other causes. In many operations, troubleshooting consumes valuable work time.

[0030] International joint application IB2021 / 056362, filed on 14 July 2021, discloses a characteristic sensor for determining the characteristic values ​​of a liquid, the sensor comprising two printed circuit boards forming a channel through which the liquid flows. While this configuration allows for direct contact between the sensor and the fluid, there is still a need for a cost-effective sensor that can provide more contextual information about material mixtures. Embodiments described herein provide systems and methods for effectively and accurately measuring material information for quality control of mixtures.

[0031] This specification describes sensors and sensor systems used to measure the electrical properties of fluids. Generally, the sensors described herein operate by generating an electric field when a transmitting electrode receives a voltage. When a fluid flows between the transmitting and receiving electrodes, the fluid conducts an electric current toward the receiving electrode. As used herein, the term “sensor” may refer to a physical sensor that outputs a sensor signal indicating a conducted current, or it may refer to a “sensor system” that includes a processor that calculates the electrical properties of a fluid based on the sensor signal.

[0032] As used herein, the term “electrical properties” is intended to broadly encompass any electrical properties of a fluid that can be derived based on impedance measurements of a sensor. For ease of understanding, the description of embodiments uses examples of impedance measurements. However, it is explicitly assumed that other electrical properties can be calculated and may be relevant in embodiments of the present invention. For example, conductivity or dielectric constant can also be determined from impedance measurements. As shown herein, either conductivity or dielectric constant may be useful in determining the relevant function of a distribution system or the quality of the fluid flowing within the system.

[0033] As described herein, sensors are described as measuring the electrical properties of a “fluid.” The term “fluid” as used herein is interpreted broadly and is intended to include low-viscosity liquids, high-viscosity liquids, semi-solid materials, suspensions, molten materials, and other flowable materials.

[0034] As used herein, “electrical parameters” can be detected by an electrode pair. A fluid may flow between or near the electrode pair. The transmitting electrode generates an electric field when a voltage or current is applied, while the receiving electrode receives a current or voltage. The electrical parameters to be detected may be conductivity, relative permittivity, or impedance. In this specification, the terms “relative permittivity” and “permittivity” are used synonymously.

[0035] Sensors described herein are described as having one or more "openings" within a “printed circuit board.” These terms are to be interpreted broadly. For example, an opening may extend completely through its thickness direction for part or all of the length of the sensor. An opening may have a chamfered edge on part or all of its periphery. An opening may be elongated, like a slot, or it may be shaped like a circular or elliptical hole. An opening may have one or more corners or edges, and may have curvature along part or all of its periphery. As used herein, “printed circuit board” refers to a laminated sandwich structure consisting of conductive and insulating layers. A printed circuit board (PCB) as used herein may include any number of terminals and conductors that enable the application of voltage (or current) to a transmitting electrode and the transmission of current (or voltage) from a receiving electrode. A printed circuit board may be manufactured using conventional PCB manufacturing techniques or additive manufacturing technology. As used herein, “PCB” shall include any number of layers, with or without edge connectors. Any suitable conductive metal can be used to form the conductive layer. Any suitable insulating material can be used to form the insulating layer. The edge connector is described and illustrated as one means of communicating a signal from the receiving electrode to the analysis system. For example, a signal reader may receive the edge connector. However, other suitable connection mechanisms are also available.

[0036] To form the sensors of this disclosure, any suitable technique known to a person skilled in the art in an advantageous manner can be used. In some embodiments, the sensors may be formed using three-dimensional electronic circuit printing techniques, which include printing electronic circuits onto a three-dimensional substrate and fully additive manufacturing. Non-limiting examples of fully additive manufacturing include fused filament fabrication, stereolithography, or inkjet printing. In a fully additive manufacturing approach, both the electronic and structural elements of the sensor may be formed using one or more additive manufacturing techniques, and this approach may also be referred to as a “fully integrated manufacturing approach.” Generally, the structural elements of the sensor are described as substrate materials, and the electronic elements of the sensor are described as functional materials.

[0037] Suitable substrate materials usable in three-dimensional electronic circuit printing technology may include polymer materials or ceramic materials. The substrate may also include flexible materials such as polyimide or polyethylene terephthalate (PET). The substrate material may be selected to have good adhesion properties to the functional material used, withstand curing or sintering used in the printing process, and have sufficient durability for the intended application of the sensor. The substrate material can be used to form the structural elements of the sensor (e.g., the dielectric substrate of a printed circuit board) using any suitable technique, including additive manufacturing techniques.

[0038] Suitable functional materials usable in three-dimensional electronic circuit printing technology may include conductive inks, dielectric inks, hybrid inks, or other functional inks. In some embodiments, conductive inks may be used to print conductive wiring, electrodes, and interconnects. Conductive inks generally contain conductive materials such as silver nanoparticles, graphene, or nanotubes dispersed in a liquid medium. Dielectric inks can be used to print electrically insulating structures. Dielectric inks may contain polymeric or ceramic materials dispersed in a liquid medium. Hybrid inks can combine multiple functions into a single ink composition.

[0039] The characteristic sensors described herein can be used to sense the properties of a fluid resulting from a mixing process. They can also be used to sense the properties of input fluids in a mixing process or an industrial manufacturing process. Advantageously, a separate characteristic sensor corresponding to each input fluid is placed immediately before the mixer. Data from these characteristic sensors measuring the input fluids, along with data from characteristic sensors measuring the mixed fluid, can be processed, for example, in an integrated material property monitoring system. For example, if a fluid composition is mixed from three different input fluids, the properties of each fluid before mixing can be determined by providing three characteristic sensors at the outlets of three containers holding each of the input fluids. This is useful for quality control and can reduce waste that may result from any of the input fluids being outside of specified properties.

[0040] As used herein, the term “real-time” means that data is processed in milliseconds and becomes available as feedback virtually immediately. While some processing delay is unavoidable, “real-time” is intended to encompass systems and methods that allow users to interact with data without significant delay after it has been collected or entered. For example, when a user enters data into a system, that data entry becomes available for viewing or editing virtually immediately.

[0041] The sensors described herein can determine various properties of a fluid, such as the mixing ratio of a two-component adhesive, the curing state of a curable composition, or the state of degradation over time. The number of properties that have been changed in the past, i.e., the number of properties that have been changed when establishing a calibration dataset representing calibration impedance responses measured at different characteristic values, determines the number of properties that can later be determined by the characteristic sensor. A pre-stored calibration dataset, which represents calibration impedance responses measured in the past at one or more sensing frequencies and at different characteristic values ​​of the fluid's properties, forms or represents a multidimensional data field specific to that fluid. This data field allows the characteristic value derivation unit to determine the fluid's characteristic value from the actually measured response impedance.

[0042] Fluids possess many properties. These include viscosity, density, color, volatile component content, water content, chemical composition, boiling point, and even their degradation over time, curing state in the case of curable compositions, or mixing ratio in the case of mixtures. These are just a few examples.

[0043] As used herein, the term “curing” is intended to broadly encompass the change of a material from a first state to a second state. For example, a liquid hardens into a solid. Some mixtures may undergo crosslinking reactions. Some mixtures may undergo prepolymerization. Other mixtures may undergo chemical transformations.

[0044] The detection of these and similar state changes is explicitly assumed in embodiments of the present invention. Furthermore, since certain properties of a particular fluid may change with time and / or other parameters, the response impedance in the characteristic sensor described herein also changes with time and / or other parameters. These characteristic values ​​can be derived through the sensor and system described herein. Variations with time also include variations in properties between different manufacturing lots of a fluid. Therefore, the characteristic sensor described herein can also be used to detect differences between later and earlier manufacturing lots for certain properties (e.g., chemical composition) of a suitable fluid.

[0045] According to this disclosure, the term “property” of a fluid is not particularly limited. For example, one property of interest in embodiments of the present invention is the mixing ratio of two or more components constituting the fluid. In some of these embodiments, the fluid is a two-component adhesive, and the property of the fluid is the mixing ratio of the components. In other embodiments, the property of interest is the degree of curing or curing state. In some of these embodiments, the fluid is a curable composition, and the property of the fluid is the degree of curing of the composition.

[0046] In yet another embodiment, the characteristic of interest is the degree of degradation over time or the state of degradation over time. In some of these embodiments, the fluid is a degradable fluid, i.e., a fluid whose specific characteristics change over time after it is created. The characteristic sensor can determine the change in the response impedance of the fluid after degradation by comparing it with the response impedance of the same fluid recorded at a certain time before and after degradation. This allows the characteristic sensor to determine the degree of degradation over time or the state of degradation over time of the fluid.

[0047] The properties of a fluid can take on a variety of values. For example, the kinematic viscosity of the fluid "water" can take on values ​​such as 1.30 mPa·s or 0.31 mPa·s. Such values ​​are referred to herein as "property values." Certain properties may not be related only to numerical property values. For example, the property "curing degree" can take on property values ​​such as "uncured," "partially cured," or "fully cured." Similarly, the property "curing status" may take on property values ​​such as "uncured" or "fully cured." The fluids relating to this disclosure may be viscous fluids. Regardless of their viscosity, the fluids may be fluids that are fluid in nature, and may be fluids that flow continuously.

[0048] As used herein, the terms “fluid” or “fluid mixture” broadly refer to a composition comprising two or more components, which may both be liquids or particles dispersed in a liquid. Generally, “fluid” or “fluid mixture” refers to a fluid substance. The systems and methods described herein may be useful for a wide variety of fluid applications, not limited to, paints, resins (for adhesive or other applications), field-curing gaskets, adhesives or other coating materials, dental impression materials, void fillers, sealants, design fluids, thermally conductive interface materials, their precursor materials, emulsions, or any material that may lose stability over time.

[0049] Figures 1A to 1C illustrate atomizing fluid distribution systems that can obtain the advantages of the systems and methods described herein. Figure 1A shows a painting operation 100 in which a spray gun 114 atomizes paint from a paint cup 110 using air from an air supply source 112. However, although a painting operation is illustrated, the container 110 may supply other materials to be distributed. Figure 1B shows another configuration of a spray gun 130 that receives two materials and produces an atomizing mixture. The spray gun 130 may be coupled to the system 150 shown in Figure 1C. The system 150 may include a pumping system and / or a pressurized air source for one or both components 132.

[0050] Figure 2 shows an exploded view of a spray gun that may implement the embodiments described herein. In addition to other features, the spray gun 200 includes a container 202 for holding the fluid to be dispensed. However, although the container 202 connected to the nozzle via a fastener 204 is illustrated, it is also explicitly envisioned that a larger container may supply fluid to the spray gun 200, for example, using a pump. The spray gun may be activated, for example, when the trigger 208 is pulled.

[0051] Figures 3A and 3B illustrate a material measuring flow sensor according to an embodiment of this specification. Figure 3A shows a printed circuit board (PCB) material measuring flow sensor 300. As shown in Figure 3A, the sensing system 300 includes a printed circuit board (PCB) 302 having one or more grounds 330 and transmit contacts (TX contacts) 440. The transmit contacts 440 supply a transmit signal to each transmit electrode 310. Four receive contacts (RX contacts) (not shown) located on the back surface of the PCB receive impedance indicator signals sensed from each electrode pair. The potential of each receive electrode 320 is electronically and independently adjusted to ground potential. In some embodiments, the adjustment operation of each receive electrode is interpreted as an impedance signal for each electrode pair. In the illustrated embodiment, there are four independent measuring channels, each capable of providing information via its own transmit contacts 340 and receive contacts (not shown).

[0052] In the illustrated embodiment, the sensing system 300 has four electrode pairs, with each of the four transmitting electrodes 310 paired with one of the four receiving electrodes 320. However, the present invention is not limited thereto, and it is explicitly assumed that more or fewer electrode pairs may be present depending on the available area on the printed circuit board and the sensing requirements. For example, in some applications only a single electrode pair may be present, while in other applications two or three electrode pairs may be present. Furthermore, in some embodiments, there may be six or more, eight or more, or more than eight electrode pairs.

[0053] Each electrode pair is isolated from adjacent electrode pairs, resulting in four independent conductivity measurements, each corresponding to a measurement signal from electrode pairs 310 and 320. In some embodiments, the sensing system 300 is positioned perpendicular to the material flow. In this case, the first sensing region 352 receives the first portion of the material flow, the second sensing region 354 receives the second portion, the third sensing region 356 receives the third portion, and the fourth sensing region 358 receives the fourth portion. Thus, the system 300 can generate four different signals simultaneously for a single material flow, allowing for a more accurate determination of whether the mixing ratio (or other measurement parameter) is consistent across the entire sensing region.

[0054] Compared to conventional sensing systems, conductivity measurement required both a positive and negative electrode, necessitating two printed circuit boards for each electrode pair. In contrast, system 300 enables four measurements to be performed simultaneously on a single printed circuit board. It also provides a wider surface area for material flow through a shorter sensor distance.

[0055] Figure 3A shows an embodiment in which each electrode pair constitutes part of slots 352, 354, 356, and 358. However, it is explicitly assumed that, instead of a structure with both ends closed, the sensing region may include a "comb" structure with a pair of electrodes on a projection or within an opening. However, particularly in the case of viscous fluids, it may be preferable from a structural standpoint to close both ends.

[0056] Furthermore, as will be described later in this specification, electrodes 310 and 320 may be formed by, for example, applying a metallization treatment to the inner surfaces of slots 352, 354, 356, and 358 using copper. The metallization process may result in electrode 320 being connected to electrode 410. Therefore, a separation or cutting step is required. This can be done, for example, by breaking the connection by drilling holes at positions 350A and 350B shown in the figure. Alternatively, this can be done by removing the punched part, milling, nibbling, etching, laser cutting, or other suitable method.

[0057] The systems and methods described herein can be used for a variety of materials to be distributed. Printed circuit boards (PCBs) often have a maximum operating temperature of less than 170°C, which limits the temperature of materials that can be distributed through the sensor system 300. The materials are, for example, about 10 5 The viscosity may be in the range of Pa·s. If the viscosity is higher, the distribution pressure may be insufficient to push the material through slots 352-358, potentially damaging the sensor. However, by widening the width of slots 352-358, it is possible to accommodate high-viscosity materials. In that case, however, the sensitivity of the sensing system 300 may decrease. Similarly, for materials containing particles, such as suspensions, the particle size must be smaller than the width of slots 352-358. Furthermore, the system described herein may be limited to solvents that do not corrode or damage PCB 302 or electrodes 310, 320.

[0058] Figure 3B shows another embodiment of the sensing system 360 incorporating a temperature sensor 370. The temperature sensor 370 is located in a slot and has a ground signal connection point 372 and a temperature signal connection point 374. The ground signal connection point 372 is connected to a ground signal communication unit 382. The temperature signal connection point 374 is connected to a temperature signal communication unit 376. Similar to the embodiment in Figure 3A, there are also four impedance or conductivity sensor slots 380, each connected to a ground signal 382. However, it is noteworthy that in the embodiment of Figure 3B, there are two different spacings between the slots. A first spacing 362 exists between the first and second slots 380 and between the third and fourth slots 380, and a second spacing 364 exists between the second and third slots 380. The wider spacing 364 may improve the shielding effect against interference between electromagnetic fields generated by each electrode pair.

[0059] Many mixing processes are at least partially temperature-dependent, and material properties such as viscosity change with temperature. Externally inserted temperature sensors are often fragile and need to be positioned in the center of the flow of the material under test. In the embodiment shown in Figure 3B, the temperature sensor is enclosed within a housing and insulated from the material. The sealing layer may be, for example, a varnish layer, which may improve thermal contact compared to other housing materials. As shown, the temperature sensor is connected via contact 382 on an edge connector. However, although an edge connector is illustrated, it is explicitly assumed that other connection mechanisms may be used.

[0060] Figures 3A and 3B show embodiments in which slots 352-358, 370, and 380 have an oval shape with a generally straight body and rounded ends. However, other configurations are possible. Electrodes 310 and 320 may be, for example, curved, or have other shapes to fit the available volume in the distribution system.

[0061] Figures 3C and 3D show sensor housings according to some embodiments of this specification. In some embodiments, the sensor (e.g., sensor 300 or 360) may be mounted directly to the material distribution system. However, in other embodiments, the housing 390 may be configured to directly receive the sensor 396. The housing 390 includes a receiving slot 392 for receiving the sensor, and receives the sensor as shown in configuration 394.

[0062] In some embodiments, the housing 390 is integrated into the distribution system and configured to receive the sensor 396 by the distribution system. In other embodiments, the distribution system is configured to receive the housing 390 with the sensor 396 already installed. In some embodiments, the sensor 396 is sealed within the housing 390 so that the distribution system is configured to receive the housing 390.

[0063] Figures 4A and 4B show a spray gun according to an embodiment of this specification. Figure 4A is a reproduction of the exploded view shown in Figure 2, showing an example of the installation location of a conductivity sensor (shown in Figures 3A to 3B, or any other sensor configuration described herein).

[0064] As shown in Figure 4A, one example of an installation location is inside the container 420, for example, inside the mixing impeller, inside the cup body, or inside the lid.

[0065] Alternatively, or in addition to the above, another installation location is possible in which the sensor is placed at the supply point of the spray gun. In the embodiment shown in Figure 4A, this configuration allows for obtaining an indicator of the quality of the mixture entering the gun. In the case of the two-component spray gun shown in Figure 4B, two sensors can be provided at the supply point for each pre-mixed supply material. This is particularly useful for troubleshooting when one or both of the supply materials are a mixture in themselves. Some of the dispensing devices described herein have the advantage of being equipped with a needle valve 440 for controlling the flow rate.

[0066] Alternatively, or in addition to the above, another example of an installation location is that it may be placed inside the atomizing head 460.

[0067] Figure 4B shows a two-component spray gun according to an embodiment of this specification. An example of an additional mounting location in the two-component spray gun is behind the spray nozzle 480. This ensures that the two (or more) supply components are properly mixed before spraying.

[0068] By using the systems and methods described herein, it is possible to monitor numerous parameters related to the quality of a mixture before or during its use. Quality monitoring of a mixture includes consistency, texture, composition, or other relevant quality indicators. The sensor systems and methods of use described herein provide indicators of mixing ratio, curing (e.g., open time, curing rate, temperature change), and can also provide in-situ indications of process conditions such as aging, bubble detection, or concentration, lot-to-lot variation, raw material quality, and phase separation. By using the sensor systems described herein, quality problems (such as imbalances in mixing ratio or phase separation) can be automatically detected, and instructions for correcting these quality problems can be provided. Therefore, corrective actions can be performed in situ.

[0069] Early detection of quality problems can shorten corrective time, and as a result, reduce operating time, corrective supply costs, and corrective work time and costs. The sensors described herein can be implemented at various points in the distribution process, for example, during suction, during or after mixing, inside the distribution device, inside the container, etc.

[0070] The sensors described herein are capable of communicating with a computerized control system, which can apply an alternating voltage to a suitable sensing system (such as those described herein) to generate an electric field necessary for measuring conductivity.

[0071] When performing actual measurements of quality control parameters for a mixture, the measured impedance response (MIR) for each measurement sensing frequency (MSF) can be recorded within the control system.

[0072] For example, to derive the mixing ratio value from the measured impedance response at the measurement sensing frequency, the software running on the control system identifies a set of calibrated impedance response triplets from a set of calibrated impedance response triplets that has the calibration response impedance closest to the measured impedance response and the calibration sensing frequency closest to the measurement sensing frequency. This identification process and, if necessary, interpolation can be easily performed using a multidimensional polynomial parameterized by a set of triplets consisting of multiple datasets, i.e., (CMR, CSF, CIR). From this calibration data, the software derives the (previously unknown) mixing ratio value in the actual measurement.

[0073] The same sensing frequency used for calibration is often used for measurement. However, in measurement, mixing ratios may occur for which the calibration impedance response was not determined during calibration. Therefore, it is possible that no triplets that perfectly match both the sensing frequency and response impedance exist within the calibration dataset. In such cases, an interpolated calibration mixing ratio is obtained by interpolating between two appropriately selected calibration triplets that contain two calibration impedance responses close to the measured response impedance. This interpolated value can be treated as the mixing ratio at the time of measurement. The interpolation process is performed by software on the control system 220 using a parameterized multidimensional polynomial.

[0074] As a result of interpolation and derivation, the mixing ratio of component A and component B as the mixture passes through the PCB sensor during measurement is obtained.

[0075] In this embodiment, the calibration impedance response was measured depending on two parameters, namely the sensing frequency and the mixing ratio. In other embodiments, further parameter dependencies of the impedance response may be considered, such as the dependence on the temperature of the adhesive within the sensing region. In that case, the dataset of calibration impedance responses consists of a quadrivalent set of values ​​such as (CMR, CSF, CIR, Temperature), and the pre-stored set of calibration impedance responses forms a four-dimensional data field specific to that mixture. If even more parameters are considered, the dataset may consist of a quintuple or higher-order set of values. Thus, the dataset of calibration impedance responses forms a more multidimensional data field and can be represented by different parameterized multidimensional polynomials.

[0076] The control system may record the mixing ratio values ​​with a timestamp for quality assurance purposes. The mixing ratio derived during actual measurement can be continuously compared against the target mixing ratio. If the deviation exceeds the acceptable range, the control system can appropriately change the flow rate of either component to bring the measured mixing ratio closer to the target mixing ratio.

[0077] Some of the methods for forming the sensor systems illustrated herein are similar to those described, for example, in international publication application PCT / US22 / 52343 (particularly Figure 5 and the related description), the details of which are incorporated herein by reference.

[0078] Figures 5A and 5B show material measuring flow sensors according to embodiments of this specification. As shown in both figures, the sensors according to embodiments herein are positioned to be in direct contact with the material or fluid, and conductivity measurements can be performed based on this direct contact. This measurement by direct contact allows for more accurate measurement of the mixing ratio compared to other methods that do not allow direct contact between the sensor and the material. However, as shown in Figures 5A and 5B, the sensors are coated with material after use. If the material in question is corrosive, highly viscous, or curable, it is beneficial to be able to discard the sensor after use.

[0079] Figures 6 and 7 show an example of a distribution system incorporating a sensor system according to the embodiment of this specification. Figures 6A and 6B show a PCB sensor 620 incorporated in a nozzle, illustrating a configuration in which fluid from a container (not shown) passes through an adapter 630 and then through the sensor 620, and is subsequently distributed by an atomizing nozzle 610.

[0080] Figures 7A to 7D show the arrangement of sensors within the conduit. In Figure 7A, sensor 710 is positioned within conduit 700. Sensor 710 has four electrode slots, and as the mixture passes through the conduit (i.e., enters the electric field), the mixture is forced to pass through the slots of sensor 710. Conductivity measurements are transmitted to the control system, for example, via edge connector 712. However, although an edge connector is illustrated, it is explicitly assumed that other suitable connection mechanisms may be used.

[0081] If a difference in conductivity measurements is observed between one electrode slot and another, it may indicate variability in the quality consistency of the mixture.

[0082] Figure 7B shows a perspective view 700 of the conduit 722. The conduit 722 may be connected to other parts of the distribution system or fluid transport system. The conduit 722 may be connected to other parts of the fluid flow system using other suitable fastening mechanisms, such as a threaded section 726.

[0083] Figures 7C and 7D show cross-sectional views of the conduit. In Figure 7C, overmolded plastics 744, 740, and 760 are used as seals to hold the PCB sensor in place. Such seals may include end stops to ensure that the sensor is correctly positioned. However, other types of seal configurations or positioning means (e.g., snaps or clips) are also possible. The illustrated seals may include barbs (projections) to hold the connection.

[0084] In Figure 7D, a different sealing configuration is shown, in which an O-ring can be used. A corresponding recess for receiving the O-ring 764 is machined into the conduit, allowing the sensor to be stabilized against the pressure of the fluid flow.

[0085] The illustrated conduit may be replaceable, and in some embodiments, the entire sensing assembly is a disposable assembly. In other embodiments, the sensor may be removable, and the PCB sensor itself may be a disposable sensor.

[0086] The embodiments shown in Figures 7A to 7D relate to a PCB-based impedance sensor that can be attached to a static mixer using an adapter or other connection mechanism, and provides real-time mixing ratio information. By using an adapter that can accept a PCB unit, the PCB sensor can be made compatible with a wide range of distribution systems.

[0087] Figures 8A to 8C show three dispersion states that can be experienced when using the sensor system and method described herein. Figure 8A shows a stable dispersion state 810 in which particles (or other fluids) are uniformly dispersed throughout the mixture. From a colloidal standpoint, the dispersion is considered stable when aggregation (flocculation) of separated particles is prevented and the particles repel each other. Figure 8B shows an example of a dispersion state 820 in which creaming (float separation) is occurring, showing that a certain material has separated and floated to the top of the mixture. The dispersion state 830 shown in Figure 8C is a state in which sedimentation is occurring, showing that the particles have settled to the bottom of the container.

[0088] The sensor systems described so far are those that can be used to evaluate the quality of a mixture during a dispensing operation. However, it is explicitly assumed that the same or similar sensors may be used to evaluate the mixture within a container. For example, painting operations often involve mixing multiple fluids or mixtures within a container before connecting the container to a dispensing device.

[0089] Furthermore, many materials are stored in large containers before use, but these containers are not transparent, making easy visual inspection difficult. For example, many materials are stored in 55-gallon (approximately 208-liter) drums before use, but these are opaque. Therefore, it is difficult to visually confirm whether sedimentation has occurred or whether the mixture is close to phase separation.

[0090] Figure 9 shows one embodiment of a stirring rod configured for in-situ conductivity measurement of a mixture. Schematic figure 900 shows a stirring rod 910 that can be used with a container such as a paint mixing cup 920. However, the stirring rod 910 is also applicable to other containers and other types of mixtures.

[0091] The stirring rod 910 includes a sensor 916 that can be moved through the mixture (or placed within the mixture in flow). The stirring rod 910 is provided with a window 914 for connecting an edge connector to a wire lead. However, in some embodiments, the wire lead may be connected to the edge connector by other suitable means. In some embodiments, the stirring rod 910 is also provided with one or more retaining clips 912 or other suitable wire retaining structures to assist in connecting the edge connector of the sensor 916 to the wire lead. Although an edge connector is illustrated, it is explicitly assumed that other connection mechanisms may be used.

[0092] The sensor 916 is shown to be positioned on the same plane as the stirring rod 910. This configuration allows for easy cleaning of the sensor 916, such as by wiping the stirring rod 910 after stirring. However, it is explicitly assumed that the sensor 916 and / or the stirring rod 910 are single-use (disposable) products and will be discarded after each use.

[0093] In other embodiments, the sensor 916 is positioned offset from the stirring rod 910 (for example, attached to the first or other side of the stirring rod), in which case the wire lead can be connected without providing the window portion 914.

[0094] The stirring rod 910 is configured such that when it is moved relative to the mixture, the mixture passes through the slot of the sensor 916.

[0095] Figure 10 shows a long sensor according to an embodiment of this specification. The sensor 1000 shown in Figure 10 has a separation distance 1030 between the electrode portion 1020 and the edge connector 1010. The edge connector 1010 must not come into contact with the mixture. Therefore, providing a separation distance 1030 between the edge connector 1010 and the electrode portion 1020 increases the flexibility of use of the conductivity sensor. For example, the sensor 1000 can be used in deeper containers, ensuring consistency across the entire depth of the container. The sensor 1000 can be immersed in a mixture and stirred without the edge connector coming into contact with the fluid and short-circuiting, and material property data (conductivity, temperature, and dielectric constant) can be monitored and visualized in real time. However, although an edge connector is illustrated, it is explicitly assumed that other suitable connection mechanisms may be used.

[0096] Figures 11A to 11D show a sensor having series-configured electrodes according to an embodiment of this specification. In the sensor configuration described so far, the electrode slots 1102 are arranged on the same plane along the edge opposite the edge connector 1108 of the sensor. A temperature sensor 1104 is also included on the PCB substrate. A distance 1106 is provided between the edge connector 1108 and the electrode slot 1102 closest to it, reducing the possibility of the edge connector 1108 coming into contact with the fluid in the container. However, although an edge connector is shown, it is explicitly assumed that other connection mechanisms can also be used.

[0097] Figure 11B shows an example 1130 of using the sensor 1100 in a container 1140 containing an imperfect mixture. By stacking the sensors vertically on a PCB, each electrode slot can be positioned at a different depth within the container 1140. The lowest electrode pair 1142 measures a first conductivity at a depth of 1132. The next lowest electrode pair 1144 measures a second conductivity at a depth of 1134. Due to the different compositions, the conductivity at depth 1132 is different from the conductivity at depth 1134. Similarly, the conductivity measured by electrode pair 1146 at depth 1136 is different from the conductivity measured by electrode pair 1148 at depth 1138.

[0098] As shown in Figures 11A and 11B, the sensor 1100 has a configuration in which four electrode pairs are stacked vertically on the PCB, but it is explicitly assumed that the number of electrode pairs may vary. For example, a configuration with only two electrode pairs, a configuration with only three electrode pairs, or a configuration with more than four electrode pairs (e.g., five sets, six sets, or more than six sets of electrode pairs) is possible. Furthermore, there is a spacing between the electrodes, and it may be longer or shorter than that shown.

[0099] Sensors such as Sensor 1100 are currently particularly useful in containers holding dispersions or emulsions that need to be continuously rotated or constantly in motion to prevent sedimentation or creaming (float separation). However, the resulting mixing quality is not always proven. Sensor 1100 may be used to measure the consistency of the current dispersion / emulsion, or it may be incorporated into a stirring rod or other stirring tool to provide an in-situ mixing index, allowing for confirmation that the mixture is well mixed while avoiding wasting time on excessive stirring.

[0100] Figures 11C and 11D show examples of mixtures using sensor 1100 and the resulting conductivity measurements. Figure 11C shows a stable dispersion state 1150 in which the conductivity measurements obtained from each electrode pair are very similar. Figure 11D shows a dispersion state 1160 in which sedimentation occurs, and it is shown that the conductivity measurements differ between different electrode pairs because the concentration changes depending on the depth of the electrode pair in the mixture.

[0101] Sensors like those shown in Figures 11A to 11D are particularly useful for measuring flocculation and aggregation in situ before sedimentation or phase separation becomes significant. This allows for early corrective action.

[0102] Figure 12 shows an example of another system in which the embodiments described herein may be useful. System 1200 shows an example of a distribution system 1200, comprising a controller 1202. The controller 1202 may include a motor and supply pressure for distributing a mixture through a distributor 1210. The distributed mixture may have quality control problems that are not readily apparent to the operator. The systems and methods described herein are useful for detecting and correcting such quality control problems. As shown in Figures 7A to 7D above, the sensors herein may be placed in a conduit, for example, in a sensing region 1210 where the material is initially supplied. As the material passes through or is discharged from the sensing region 1210, air bubbles or droplets formed from only some components (or groups of components) of the mixture may be introduced. If the material supplied from the sensing region 1210 is mixed downstream, the air bubbles also affect the mixing ratio. As a result, the distributed mixture may have an incorrect mixing ratio. With high-viscosity fluids, there may be areas on the work surface where the distributed fluid does not reach. Air bubbles can cause problems in various distribution applications, such as discontinuities in sealing during sealant distribution and poor adhesion during adhesive distribution.

[0103] Similarly, improperly mixed mixtures also pose quality control concerns. The presence of droplets may indicate that phase separation is imminent within the mixture. For example, the droplet size of the first or second mixture may indicate instability of the emulsion before phase separation occurs. Such detection allows for precautionary measures to be taken to maintain the emulsion before separation occurs.

[0104] It is important to detect and remove air and / or droplets from the distribution system as necessary. Therefore, in some embodiments, the material passes through a sensing region 1210 before reaching the distributor 1240. This sensing region 1210 includes one of the PCB-based sensors described herein. The sensor detects non-uniformity of the mixture (e.g., air bubbles or droplets) and causes a corrective action mechanism 1220 to be activated before the material reaches the distributor 1240.

[0105] If air bubbles are present, valve 1230 opens, and the portion containing the air bubbles is discharged through flow path 1250. After the air bubbles have passed, valve 1230 closes, and the material continues to flow toward the distribution system 1240.

[0106] Similarly, if phase separation or other quality issues are detected in the mixture passing through the sensing region 1210, the valve 1230 diverts the mixture in the flow path 1250 and performs corrective treatment such as remixing, degassing, or excessive purging. Phase separation can be detected at the stage when droplets of the first material begin to form due to aggregation.

[0107] The controller 1202 can also stop the distributor 1240 from distributing until it determines that the mixture is sufficiently mixed. In the illustrated embodiment, material from the flow path 1250 can be returned to the sensing area 1210 via the controller 1202 to confirm that it is of sufficient quality to resume distribution. The controller 1202 can notify the operator through other systems connected to the distribution system 1240 (e.g., a motion controller that moves the distributor 1240 relative to the surface receiving the distributed material), a user interface on a display, voice instructions, etc.

[0108] In some embodiments, the valve 1230 automatically opens and closes based on instructions from the sensing system 1220, the controller 1202, or commands from other control systems. These control systems send commands to perform corrective actions based on conductivity measurements received from the sensing system 1220.

[0109] Figure 12 is a schematic diagram of system 1200, explicitly showing the components of one material line. However, as shown in the figure, it is also assumed that the distributed mixture may be formed from two components, in which case it is explicitly assumed that a similar system will be provided for the second component as well.

[0110] Figures 13A to 13C show sensor configurations that are particularly useful for detecting the aggregation of droplets in the second phase and the generation of bubbles before phase separation occurs.

[0111] Figure 13A shows a dip sensor particularly useful for detecting air bubbles or droplets in a mixture. The sensor comprises four pairs of electrodes, each arranged in four different sized slots 1302, 1304, 1306, and 1308. Slot 1302 is wider than slot 1304, slot 1304 is wider than slot 1306, and slot 1306 is wider than slot 1308. Slots 1302-1308 are arranged from thickest to thinnest, but other arrangements are explicitly assumed. Similarly, in the illustrated example, the four electrode pairs are coplanar and all are located at approximately the same distance from the edge connector 1314. However, although the edge connector is illustrated, it is explicitly assumed that other suitable connection mechanisms may be used.

[0112] Slots 1302–1308 are designed to both detect and indicate the size of bubbles or droplets. Generally, a homogeneous mixture without bubbles or droplets exhibits an insulating effect, maintaining consistent conductivity across all electrode pairs. When a droplet reaches a size equal to or greater than the width of the slot, it connects both electrodes within the slot, resulting in a detectable change in conductivity.

[0113] In the design shown in Figure 13A, the slot width increases linearly (e.g., 1 mm, 2 mm, 3 mm, 4 mm). The linear increase in diameter corresponds to a cubic increase in the volumetric flow rate passing through the opening. This configuration allows for a good understanding of how quickly phase separation is progressing or the stability of the mixture. For example, if phase separation is expected to occur in more than an hour, the mixture may be able to be distributed without corrective action.

[0114] However, in some embodiments, it is explicitly assumed that smaller or larger slot widths may be required. For example, the thinnest slots may be around 100 μm, or less than 150 μm, less than 200 μm, less than 300 μm, or less than 400 μm. One or more slots may be less than 500 μm. Also, one or more slots may be less than 1 mm. Larger slots may be required for other applications, such as when sensors are attached to a stirring rod in large-scale measurement operations, such as inspecting the quality of a mixture in a 50-gallon drum.

[0115] In addition to changing the width of the slots, the length of the slots can also be changed to suit specific applications. For example, when verifying the shelf life of large containers, the overall sensor length needs to be significantly longer. For instance, the total length of the sensor may be around 1 meter or even longer. In such cases, the opening also needs to be larger to increase signal strength and ensure sufficient flow. By increasing the length, signal strength can be increased, while by selecting the width, flowability can be ensured without compromising signal strength. For example, in a sensor with a total length of 1 meter, the slot dimensions may be 10 centimeters in length and 1 centimeter in width.

[0116] For example, when the diameter of a droplet (or bubble) reaches the same width as or greater than the width of the narrowest slot 1308, the droplet (or bubble) connects both electrodes in slot 1308, and a conductivity spike occurs only in electrode pair 1308. The two sides in slot 1306 remain unconnected until the diameter of the droplet (or bubble) reaches the same width as or greater than the width of slot 1306. Once the bubble (or droplet) passes through slot 1308, the conductivity of the mixture returns to the baseline. The frequency of conductivity spikes varies depending on the number of droplets (or bubbles) in the mixture.

[0117] Sensor 1300 also includes a temperature sensor 1310 and is shown to be arranged in a straight line with electrode pairs 1302-1308, but it is explicitly assumed that the temperature sensor 1310 may be placed in other suitable locations. Furthermore, in some embodiments, the temperature sensor 1310 may not be necessary. For example, this may be the case for mixtures whose viscosity does not change significantly over the operating temperature range.

[0118] Sensor 1300 is illustrated to have a length 1312 separating the edge connector 1314 from the electrode pairs 1302-1308. However, the length 1312 is not necessarily required when sensor 1300 is used as an inline flow sensor mounted inside a conduit, as shown in Figures 7A-7D. Although an edge connector is illustrated, it is explicitly assumed that other suitable connection mechanisms may be used.

[0119] Figures 13B and 13C show the sensor connected to lead wire 1340, illustrating how the length 1312 provides additional isolation from electrode pair 1302-1308 when used in container 1350.

[0120] The sensor configurations described so far have a single row of parallel electrodes (e.g., the horizontal arrangement in Figures 3-7 and 13, or the vertical arrangement in Figure 11). However, arrangements that combine features of both configurations are explicitly envisioned. For example, a grid arrangement of electrode pairs is useful for simultaneously detecting consistency and mixing quality (or the presence of droplets / bubbles) at multiple depths. Furthermore, while the embodiments herein illustrate a configuration with four sets of electrode pairs, it is explicitly envisioned that the number of electrode pairs may be greater or less in either vertical or horizontal arrangements.

[0121] Figure 14 shows a method for detecting and correcting quality concerns in a mixture according to the embodiments of this specification. Method 1400 may be carried out using a sensor system as described herein, or a combination thereof, or other suitable sensors.

[0122] In block 1410, heterogeneity in the mixture is detected. This heterogeneity may be contaminated air or non-uniform mixing (e.g., droplet formation, sedimentation, creaming). Detection can be performed by detecting conductivity spikes by one or more electrode pairs on the PCB sensor. It can also be performed by detecting the conductivity difference (1404-1402) measured between a first electrode pair and a second electrode pair of the sensor system. Other detection methods 1408 described herein may also be used. Detection is performed as the mixture passes through the electrode pairs in the conductivity sensor.

[0123] In one embodiment, the conductivity sensor may be a disposable sensor that is discarded after use. The conductivity sensor may have multiple pairs of electrodes arranged on the same plane, and the distributed material may be configured to pass through different electrode pairs. By including multiple electrode pairs of different sizes, bubbles or droplets of varying sizes can be detected as they pass through the sensing area.

[0124] In block 1420, the detected heterogeneity is corrected. The corrective process may include, for example, further mixing 1422 of the mixture to ensure consistency of concentration, reduce the risk of phase separation, or stabilize the dispersion or emulsion. The corrective process may also include degassing 1428 of the mixture to remove detected air bubbles or to remove contaminated air introduced during the remixing process. Degassing may be carried out, for example, by using a vacuum or by purging a portion of the mixture containing contaminated air. Other suitable corrective means 1428, such as modification of the mixture composition, may also be used, one example being purging.

[0125] In some embodiments, it is also possible to reduce detected air bubbles without purging. For example, a signal may be sent to a motor that controls the fluid flow to increase its speed and distribute additional material equivalent to the volume occupied by the bubbles. Alternatively, the same volume of material as if no bubbles were present can be supplied by increasing the applied pressure or increasing the volumetric flow rate.

[0126] In block 1440, the consistency of the mixture may be checked before proceeding to block 1430, where the mixture is distributed. For example, using the sensors described herein, the consistency of the mixture can be checked by confirming that conductivity spikes stabilize (e.g., their intensity and / or frequency decrease) or that the conductivity difference between electrode pairs reduces to an acceptable level. If consistency is not confirmed, the process may return to block 1420 to continue the corrective process or select a new corrective strategy.

[0127] Figure 15 shows a quality control system according to an embodiment of this specification. The quality control system 1550 may be used to identify and correct heterogeneity detected in a mixture. The quality control system 1550 may be implemented as a dipstick or other analytical tool targeting a static environment, i.e., a fluid in a container, or in a dynamic environment, i.e., in a fluid conduit through which a fluid passes through electrode pairs on a printed circuit board (PCB).

[0128] Some systems and methods described herein may benefit from using relative thresholds rather than absolute thresholds. Measuring a reference level (base level) is crucial for setting more accurate relative thresholds. For example, if a conductivity measurement falls below a certain percentage of the reference level (e.g., 50% of the reference level), it can be determined that heterogeneity exists. This could be a concentration gradient indicating poor mixing, droplets indicating phase separation, or contaminated air. Using relative thresholds can reduce material waste due to incorrect purging and wasted time trying to correct non-existent or unnecessary heterogeneity.

[0129] The non-uniformity detection system 1550 may be implemented by a suitable computing device capable of communicating with the sensing system 1530. The sensing system 1530 may include one or more electrode pairs 1532 that are in direct contact with the material flow. The sensing system 1530 may also include a temperature sensor 1534. The electrode pairs 1532 may be provided, for example, in an opening formed in a printed circuit board, which is formed by machining or lamination. The opening may be closed at both ends or open at one end to have a "comb-like" structure. In some embodiments, the temperature sensor 1534 may be shielded so as not to be in direct contact with the material flow. The sensing system 1530 may also include other functional elements 1538.

[0130] Sensor signals from the sensing system 1530 are received by the quality control system 1550 by an active signal retriever 1552. The active signal retriever 1552 may receive signals from the sensing system 1530 periodically or continuously during operation. The received sensor signals may be impedance signals, conductivity signals, relative permittivity signals, or a combination thereof. In embodiments where non-uniformity is detected using conductivity values, a conductivity signal generator 1554 converts the received signals into conductivity values. The signal values ​​and / or conductivity values ​​may be provided to a data store via a signal transmission unit 1556.

[0131] The historical signal retriever 1558 communicates with the data store to retrieve previously acquired signal values. The historical signal values ​​of interest may include signal values ​​acquired within a recent period from the same batch or the same mixed material. For example, values ​​acquired in the last few seconds or minutes may be important. In some embodiments, signal values ​​may drift over long periods due to temperature changes, material degradation over time, fluctuations in mixing ratios, etc. However, non-uniformity can be detected as abrupt changes in conductivity or discrepancies between conductivity measurements within the sensing system. In some embodiments, the threshold generation unit 1560 periodically or continuously generates relative thresholds based on historical signals. The relative threshold may be an absolute value, and may be defined, for example, as "non-uniformity is indicated if there is an increase or decrease of X% or more over a certain period of time Y." If the fluctuation in conductivity values ​​is large, the threshold change amount may be set to be large, and if the fluctuation in conductivity values ​​is small, the threshold change amount may be set to be small.

[0132] The signal analysis unit 1562 compares the received signal or the calculated conductivity with a threshold, and if a deviation exceeding the allowable threshold is detected, the command generation unit 1564 generates a command and transmits it to the device 1580 via the command transmission unit 1566.

[0133] In some embodiments, device 1580 may include a display component, and the generated commands may be update information presented to the display component as a graphical user interface update indicating the detected heterogeneity. Device 1580 may also include a feedback component, such as acoustic, visual, or tactile feedback, configured to inform the controller that air bubbles have been detected. Furthermore, device 1580 may be the corrective mechanism itself, and the command generation unit 1564 may generate commands to perform a corrective action selected based on the detected heterogeneity (e.g., opening a purge valve, a remix command, a degassing command, etc.).

[0134] System 1550 may include other functional elements 1568.

[0135] In some embodiments, the threshold generation unit includes a machine learning model that predicts time-series data of conductivity over time based on historical data. This prediction may include so-called confidence intervals. Training may be performed in advance on a reference dataset in which no quality problems have been detected or quality problems have been quantified. The signal analysis unit 1562 determines whether the received signal is within or outside the confidence interval.

[0136] In some embodiments, at regular intervals (e.g., 10 milliseconds, 100 milliseconds, etc.), the threshold generation unit generates a prediction of the conductivity value and assigns confidence bands based on past signals acquired by the past signal acquisition unit. If the actual measured value falls below the lower confidence band or exceeds the upper confidence band, the signal analysis unit detects non-uniformity. If the conductivity measurement value is within the confidence band, the signal analysis unit 1562 provides an output indicating that no non-uniformity has been detected or that no correction is necessary. The command generation unit 1564 may provide an instruction indicating that the GUI (Graphical User Interface) of device 1580 does not need to be updated.

[0137] Relative thresholds are a crucial component of air detection systems because they account for noise in the data. The confidence band, a statistical concept, addresses this point. That is, when the data is noisy, the confidence band expands away from the current value, and while simple thresholding methods may cause false detections due to noise, this method can prevent that.

[0138] While conductivity is used as an example of a value of interest in this specification, the detection algorithm explicitly assumes the use of other material parameters, such as current or relative permittivity (εr), either by substitute or in combination.

[0139] By measuring conductivity, useful information regarding the quality of a mixture can be obtained. For example, as described herein and in the "Examples" section of application PCT / US22 / 52343, conductivity measurements can be used to determine consistency issues due to lot-to-lot variability, contaminated air, droplet formation, degradation over time, concentration gradients, dispersion separation, or emulsion separation.

[0140] The sensor systems described so far are based on a single printed circuit board. Such systems are relatively low-cost and therefore cost-effective in use and replacement. However, one drawback of the designs described so far is the generation of a large stray field compared to the main electric field present between each electrode pair. This stray field effect is caused by the short distance between the material inlet and outlet, i.e., the thickness of the PCB. One way to reduce the stray field effect is to form a PCB stack by soldering together multiple PCBs that have openings containing electrodes.

[0141] Figures 16A and 16B show stacked printed circuit board (PCB) sensors according to embodiments of this specification. Figure 16A shows a sensor with stacked PCB boards similar in configuration to Figures 11A and 11B, and Figure 16B shows a sensor with stacked PCB boards similar in configuration to Figures 13A to 13C. As shown, in one embodiment, the sensor stack 1600 may include four PCB sensors. That is, it consists of one four-layer PCB 1610, two stacked PCBs 1620 to increase the electrode surface area and obtain the required sensitivity, and an uppermost PCB 1630. In some embodiments, the flow through the sensor stack 1600 is indicated by arrows 1650. Although the embodiments shown in Figures 16A and 16B both illustrate a four-layer sensor stack, it is explicitly assumed that fewer or more PCB sensors may be combined. For example, a minimum of two PCBs may be used, and up to five, six, seven, eight, nine, ten, or more PCBs may be stacked.

[0142] The stacked sensor 1600 offers the advantages of a single PCB sensor while reducing leakage field effects. Furthermore, its compact design improves shielding of the highly sensitive electrode, and because the sensitive region can be internally sealed, it can be used as an electrode cartridge without the need for additional housing. In some embodiments, the sensitive region is internally sealed by soldering, allowing it to withstand pressure applied from the material sensor without the need for additional housing.

[0143] Furthermore, because the stacked sensor 1600 can use smaller electrodes, the sensor stack 1600 can be integrated into an active or passive mixing nozzle in both the material input and material output sections. Within the sensor stack, only one electrode 1610 with an edge connector for connecting to lead wires is required. As shown in Figures 16A and 16B, the stacked sensor may include a temperature sensor, and may also have an elongated section in embodiments where a stir stick is suitable for conductivity detection. However, it is explicitly assumed that any configuration of the stacked sensor, even without an elongated section, is suitable for placement in a conduit as shown in Figure 7.

[0144] Figures 17A to 17D show sensors according to embodiments of this specification. This specification shows that multiple electrode slots may be arranged in a row, with each slot being approximately the same distance from the edge connector. It also shows that multiple electrode slots may be arranged in a vertical column rather than a row, with each slot being at a different distance from the edge connector. Furthermore, in some embodiments, it is explicitly assumed that electrode slots may be arranged in both row and column directions. While edge connectors are shown, the use of other connection mechanisms is also explicitly assumed.

[0145] Figure 17A shows a sensing setup 1700 in which the sensor 1710 is partially immersed in solution 1720. The sensor 1710 includes an electrode slot 1702 of a first size and an electrode slot 1704 of a second size. The electrode slots are arranged in both row and column directions (1708). By arranging the electrode slots in a matrix, additional insights regarding the material can be obtained.

[0146] Figure 17A shows a homogeneous solution 1720, and Figure 17B shows a solution 1750 that has undergone sedimentation over time. This sedimentation may be an indication of material degradation over time. Sensor 1740 outputs a signal for each electrode pair through which the material flows, and can provide, for example, 12 different sensor signals for analysis. The difference in signals from electrode slots 1742 and 1744 may indicate degradation over time, and the difference in signals from electrode slots 1744 and 1746 may indicate the viscosity of solution 1750.

[0147] In many production facilities, raw materials are stored in large containers such as drums. As material separation progresses, a lighter phase forms on top and a heavier phase forms on the bottom. The more separation progresses, the more the quality tends to deteriorate.

[0148] Furthermore, sensors capable of handling a wider viscosity range of materials are desirable. A narrow electrode slot width is unsuitable for measuring high-viscosity materials, while a wide electrode slot width may reduce accuracy for low-viscosity materials. Sensors 1710 and 1740 can output signals along the depth direction of the material container while accommodating a wider viscosity range of materials. Although only four rows of electrode pairs are shown in the illustrated embodiment, it is explicitly assumed that other embodiments may have more rows to accommodate the depth of the container. Additionally, although only three columns of electrode slots are illustrated, it is explicitly assumed that other embodiments may have additional columns with wider or narrower electrode slots.

[0149] Figures 17C and 17D show examples of signal profiles obtained from sensors 1710 or 1740. Profile 1760 represents a low-viscosity material, and sensor 1770 represents a high-viscosity material.

[0150] The sensor system described herein can be used to detect the viscosity of a material, as shown in the comparison of profiles 1760 and 1770. The viscosity of the material affects the rate of material exchange within the inter-electrode gap. The delay between the signal at a large gap and the signal at a small gap indicates the viscosity of the material. Low-viscosity materials result in a shorter delay, while high-viscosity materials result in a longer delay.

[0151] Figures 18A to 18E show surface-sensing sensor configurations according to embodiments of this specification. Some adhesives and other materials are distributed onto the surface, while other materials are applied by a coating process. Adhesive coatings are an example of non-conductive coatings. Non-conductive coatings can lead to static electricity buildup and discharge during the coating process. For safety reasons, the target conductivity of adhesive coatings may exceed 10,000 pSiemens / m. The sensitivity of the sensing system described herein can be improved by using surface sensing instead of bulk sensing.

[0152] Figure 18A shows a schematic diagram of a bulk electrical signal sensing system according to an embodiment of this specification. In bulk sensing, the fluid passes between the first electrode 1802 and the second electrode 1804, as shown in the material flow direction 1808. The electric field 1806 is generated by the first and second electrodes 1802 and 1804, respectively. A housing or support structure 1810 may provide structure and support to the electrodes 1802 and 1804.

[0153] Figure 18B shows a top view 1820 of a surface-sensing impedance sensor configuration according to an embodiment of this specification. The housing or support structure 1826 may have a first electrode group 1822 and a second electrode group 1826 formed on it by machining or printing. For example, the transmitting electrode 1822 and the receiving electrode 1826 may be machined or printed on a printed circuit board.

[0154] Figure 18C is an enlarged view of section 1830, showing a cutaway of the impedance sensor configuration. The first electrode 1822 and the second electrode 1826, supported by the support structure 1826, generate an electric field 1832. The electrical properties of the fluid in contact with electrodes 1822 and 1824 can be measured.

[0155] In contrast to configuration 1800, sensor configuration 1820 does not rely on fluid passing through gaps, slots, or openings in the sensor. Instead, the sensor signal is generated based on contact with the material.

[0156] Figures 18D and 18E show an impedance sensor according to an embodiment of this specification. Sensor 1850 is shown in a configuration in which the sensing region 1860 is spaced apart from the edge connector 1852 by a gap 1854. The edge connector 1852 may couple the sensor signal received from the sensing region 1860 to a processing system. The sensing region 1860 is a surface-sensing sensor and can provide significantly higher sensitivity compared to a bulk sensor of comparable size. Although an edge connector is shown, it is explicitly assumed that other connection mechanisms are also applicable.

[0157] Figure 18E shows a magnified view of the sensing region 1860. Two channels 1862 are outlined on the surface 1860. It is explicitly assumed that two additional channels 1862 may be provided on the surface opposite to surface 1860, so that a single sensor 1850 has four channels. The channels 1862 are isolated from each other, and each channel provides an independent signal regarding the electrical properties of the material. Providing multiple channels can reduce the number of measurement artifacts.

[0158] Figures 18D to 18E illustrate a sensor with two channels per sensing area, but it is explicitly assumed that there may be more channels or even a single channel. For example, there may be three, four, six, eight, or more channels on a single surface. The sensor may have the same number of channels on each surface, or different numbers of channels on each surface.

[0159] This specification describes sensing systems that can utilize either bulk sensing technology or surface sensing technology. However, it is also explicitly envisioned that both bulk sensing and surface sensing may be used within a single sensing system. For example, the sensing system may have a surface 1860 and also have electrode slots for bulk sensing along the interval 1854.

[0160] Bulk sensing sensors can be useful for screening the quality status of materials, such as tracking air bubbles and other defects. Surface sensing sensors can be useful for precision measurements in applications requiring high resolution.

[0161] The sensing systems described herein may operate with a single voltage and frequency. However, it is expressly assumed that the voltage, frequency, or both may be varied. Furthermore, current may be used instead of voltage. For example, the sensing system may perform a frequency sweep from a first frequency to a second frequency. The sweep may be performed at a specific sweep rate and may be linear or logarithmic. The sweep may be triggered automatically or manually.

[0162] Figures 19A to 19D show sensors according to embodiments of this specification. This specification shows that multiple electrode slots may be arranged in a row, with each slot located at approximately the same distance from the edge connector. It also shows that multiple electrode slots may be arranged in a vertical column rather than a row, with each slot at a different distance from the edge connector. Furthermore, in some embodiments, it is explicitly assumed that electrode slots may be arranged in both row and column directions. While edge connectors are shown, it is explicitly assumed that other connection mechanisms may be used.

[0163] Figure 19A shows a sensing setup 1900 in which the sensor 1910 is partially immersed in solution 1920. The sensor 1910 includes an electrode slot 1902 of a first size and an electrode slot 1904 of a second size. The electrode slots are arranged in row and column directions (1908). By arranging the electrode slots in a matrix, additional insights into the material can be obtained.

[0164] Figure 19A shows a homogeneous solution 1920, and Figure 19B shows a solution 1950 with sedimentation. This sedimentation may be an indication of the material's degradation over time. Sensor 1940 can provide, for example, 12 different sensor signals for analysis, for each electrode pair through which the material flows. Differences in signals from electrode slots 1942 and 1944 may indicate degradation over time, and differences in signals from electrode slots 1944 and 1946 may indicate the viscosity of solution 1950.

[0165] In many production facilities, raw materials are stored in large containers such as drums. As material separation progresses, a lighter phase forms on top and a heavier phase forms on the bottom. The more separation progresses, the more the quality tends to deteriorate.

[0166] Furthermore, sensors capable of handling a wider viscosity range of materials are desirable. If the electrode slot width is narrow, it is unsuitable for measuring high-viscosity materials, and conversely, if the electrode slot width is wide, accuracy for low-viscosity materials may decrease. Sensors 1910 and 1940 can handle a wider viscosity range of materials while outputting signals along the depth direction of the material container. Although only four rows of electrode pairs are shown in the illustrated embodiment, it is explicitly assumed that other embodiments will have more rows to accommodate the depth of the container. Also, although only three columns of electrode slots are illustrated, it is explicitly assumed that additional columns with wider or narrower electrode slots will be provided.

[0167] Figures 19C and 19D show examples of signal profiles obtained from sensors 1910 or 1940. Profile 1960 represents a low-viscosity material, and profile 1970 represents a high-viscosity material.

[0168] The sensor system described herein can be used to detect the viscosity of a material, as shown in the comparison of profiles 1960 and 1970. The viscosity of a material affects the rate of material exchange within the inter-electrode gap. The delay between the signal at a large gap and the signal at a small gap indicates the viscosity of the material. Low-viscosity materials result in a shorter delay, while high-viscosity materials result in a longer delay.

[0169] Figure 20 shows a quality control method for a material dispensing system according to an embodiment of this specification. Method 2000 can be used in combination with the dispenser described herein or other suitable sensing system.

[0170] In block 2010, one or more components to be dispensed are supplied to a sensing area. The sensing area may be a material dispenser, a transport line to a material dispenser, before a nozzle, an atomizer, other transport mechanism, or a container within a fluid system. For example, a material dispenser may dispense a liquid 2012, a suspension, or other form of particles 2014. The material may also be a mixture 2016 of multiple materials, such as an emulsion or other mixture of component A and component B. The emulsion must be dispensed in a stable state, and the reactive A:B components must be supplied in a desired mixing ratio. Other components 2018 may also be supplied to the sensing area before dispensing.

[0171] In block 2020, the mixture comes into contact with the sensing system. Contact with the sensing system may include, for example, passing through one or more openings on the PCB, which may occur before distribution, storage, or removal from storage. It may also include the mixture coming into contact with the surface of the sensor, which may be part of the PCB. In the case of a conductivity sensor, direct contact between the material and the electrode pair ensures accurate measurement. The sensing system may be a bulk sensing system or a surface sensing system. The sensing system may have two, three, four, or more independent electrode pairs.

[0172] In block 2030, conductivity measurements are received from a sensing system. The sensing system may include multiple sensors, i.e., multiple electrode pairs that detect the electrical parameters of a material when a sufficient voltage (or current) is applied. Based on the obtained sensor signals, several things may be determined about the material. In the case of a mixture, the mixing ratio is determined. In the case of a curable material, the progress of curing is detected. It is also possible to detect the degradation of the material over time and differences between batches. Furthermore, indicators of instability such as air entrapment, signs of phase separation, and contamination may also be detected. Conductivity measurements may be performed sequentially, for example, at a frequency of one signal per second or more. Conductivity measurements may also be performed in parallel, for example, by acquiring them simultaneously from each of multiple electrode pairs. In some embodiments, the electrode pairs are arranged on the same plane as each other.

[0173] In block 2040, feedback is provided based on conductivity measurements. The feedback may include material characterization, as shown in block 2032. For example, mixing ratio, presence of entrained air or single-component fluid, indicators of degradation over time, and other parameters of interest may be calculated and presented. Predictive information may also be provided, as shown in block 2034. For example, future behavior of the material under measurement can be predicted based on trends in past conductivity sensor measurements. Other characterization information 2038 may also be provided. For example, if conductivity measurements show a tendency to change in a certain direction, it may indicate that the mixing ratio is approaching the edge of the acceptable range and that the mixing rate needs to be changed, or that the increase in instability is approaching phase separation. Similarly, changes in conductivity may indicate the progression of curing of a curable component.

[0174] The feedback may also indicate the need for corrective action. For example, emulsions or dispersions undergoing phase separation may require stabilization by remixing, heating, etc. 2042. The feedback may also indicate the need to purge one or more components or the entire mixture, as shown in block 2044. In embodiments dealing with corrosive or curing materials, predictive feedback may indicate the need to replace the sensor, as shown in block 2046. Other predictive information 2038 may trigger other actions, as shown in block 2048.

[0175] In some embodiments, as shown herein, providing feedback may include providing conductivity measurements, material characterizations, or predictive information to a customer, a dispenser controller, or other target. Information such as the material source, batch number, material name, distribution temperature, distribution pressure, material concentration, mixing ratio, and other information may also be provided. Figures 21A–21C illustrate conductivity measurement systems within a system network according to embodiments of this specification.

[0176] In the example shown in Figure 21A, some components are similar to those shown in the previous figure. Figure 21A specifically shows that the conductivity sensing system 2110 can be located at the remote server location 2102. Thus, the computing device 2120 accesses these systems via the remote server location 2102. User 2150 can also access the user interface 2122 using the computing device 2120. For example, user 2150 can interact with applications in the user interface 2122 on their smartphone 2120, laptop 2120, or other computing device 2120 and receive information from the distribution system or quality control system.

[0177] Figure 21A also shows that some elements of the system described herein may be located at the remote server location 2102, while other elements may be located elsewhere. For example, data stores 2130, 2140, and / or 2160 may be located at a different location from location 2102 and accessed via the remote server location 2102. Wherever they are located, they may be directly accessed by the computing device 2120, accessed via a network (wide area network or local network), hosted as a service at a remote site, provided as a service, or accessed via a connection service located at the remote location. Furthermore, data may be stored in virtually any location and accessed or transferred intermittently by the parties involved. For example, a physical carrier may be used instead of, or in addition to, an electromagnetic carrier. This allows user 2150 to communicate with system 2110 via computing device 2160 and initiate, for example, a seal check process.

[0178] Furthermore, it should be noted that the elements or parts of the systems described herein may be deployed on a wide variety of devices. These devices include servers, desktop computers, laptop computers, embedded computers, industrial controllers, tablet computers, and other mobile devices (such as palmtop computers, mobile phones, smartphones, multimedia players, and PDAs).

[0179] The conductivity measurement system may be any suitable system configured to collect and analyze conductivity measurements using the systems and methods described herein and to provide the analysis results to a receiving device, storage device, or graphical user interface generator. Figure 16 of PCT / US22 / 52343 illustrates the operation of such a system, which is incorporated herein by reference.

[0180] System 2110 receives conductivity measurements from one or more sensors 2170. Each sensor may include one or more electrode pairs on the PCB. In some embodiments, the electrodes may be formed on the same plane at similarly spaced distances from one end of the PCB, and in other embodiments, they may be arranged in a straight line along the length of the PCB. The sensors may be formed by processes such as metallization. The sensors 2170 are isolated from each other, and independent conductivity signals are received from each sensor. Each sensor 2170 may include a positive electrode and a negative electrode that are separated from each other.

[0181] The conductivity measurement system 2110 may receive the sensor signal as a conductivity signal or a dielectric constant signal, or it may receive it as an impedance signal. In embodiments where the received signal is an impedance signal, the conductivity value may be calculated based on the received impedance signal. Similarly, the dielectric constant value may be calculated based on the received impedance signal. Based on the received sensor signal, calculations and / or predictions may be performed, for example, as shown in Figure 21. The mixing ratio may be calculated based on calibration data stored in the data store 2160. This calibration data may show conductivity data for the pure component and / or a known mixed component. As described above, sensors may be placed at both the inlet and outlet of the sensing area, so that the system 2110 can receive sensor signals from all sensors related to the material distribution system. In some embodiments, the system 2110 may be configured to compensate for a time delay between the acquisition and analysis of the sensor signal. In other embodiments, compensation may not be necessary if trend information is particularly important.

[0182] The systems and methods described herein utilize machine learning algorithms. Machine learning models are advantageous because they excel at processing noisy data, predicting future signal trends, and making adjustments before significant changes in mixing quality occur. The systems and methods described herein can calculate mixing ratios in real time. By using machine learning techniques, mixing ratios can be predicted in advance. This allows for faster adjustments and extends the time that the mixing ratio can be maintained close to the target value. Some current dispensers hold a large amount of material in the static mixer, and by the time a change in mixing ratio is detected, at least one mixer's worth of material may remain in the mixer at the wrong mixing ratio. Therefore, earlier identification of mixing ratio problems can reduce material and potential purging waste.

[0183] Similarly, the machine learning models described herein can receive information from multiple systems within a distribution system, including conductivity sensors, temperature sensors, motor speed signals, and material information. In some embodiments, multiple machine learning models may be used simultaneously, with each model independently learning from the individual systems to improve the accuracy of the overall model. However, it is explicitly assumed that models other than machine learning models may also be used.

[0184] The sensing system described herein is configured to have the function of receiving and transmitting information that can be communicated with other devices. This communication can be performed, for example, via an application programming interface (API), and system 2110 can communicate with a pump controller, a line pressure sensor, a movement controller that drives parts of the distribution system, a temperature sensor, a heating element, a data store that stores information about the material being distributed or the mixture being produced, and so on.

[0185] In embodiments where machine learning models are used, the data store may include an analyzer that learns the usage behavior of a particular distribution system to improve its operation and predictions. Similarly, information such as distribution frequency and patterns provides insights into hardening behavior and contributes to improving the mixed model. For example, usage data such as distribution frequency, purge frequency, distribution pattern, and sensor replacement count can be collected and used to train the model to more accurately predict trends and provide appropriate corrective actions.

[0186] Furthermore, as described herein, the display device 2160 displays a graphical user interface (GUI) generated by the generator 2120, which is periodically updated with information collected by the system 2110 and / or data stores 2130-2160. The information may be updated passively or provided with alerts and notifications when updated. For example, current status information may be displayed, and visual, auditory, or tactile warnings may be issued if the mixing ratio approaches an acceptable range. In addition, notifications may be sent when a device command is generated or when operator intervention is required.

[0187] In some embodiments, the signal encoder and regressor may operate locally. For example, they may operate on a computer processing unit associated with the material distribution system. Alternatively, the encoder, regressor, or both may be located on a cloud-based storage system.

[0188] The encoder output may be used to directly control the pressure applied to cartridges containing one or more material components so that the mixture satisfies a predetermined mixing ratio. For example, if the mixture contains an excess of component A, the pressure in the cartridge containing component A can be reduced, and the pressure in the cartridge containing component B can be increased.

[0189] The regressor receives an encoded signal and generates a mixing ratio signal. The regressor may be a machine learning-based algorithm that can be trained in any appropriate way.

[0190] The first learning option is a segregated learning approach, where an encoder-decoder model is trained based on a signal set of A components, B components, and various mixtures. In the second stage, a machine learning regressor can be further trained based on the encoded signal and the corresponding mixing ratio.

[0191] The second training option is the alternating training option, where one signal batch is used for the training step of the encoder-decoder model, and then the same signal batch is used for the training step of the encoder-machine learning regressor unit. The training step consists of forward passing the data within the batch, calculating the gradient, and optimizing the weights in the model using the gradient.

[0192] The third training option is the combined training method, in which the encoder-decoder pair and the machine learning model are optimized simultaneously. That is, batch data is forward propagated through the encoder, and the resulting representation is forward propagated through the decoder and the machine learning regressor. Next, the gradients calculated at both outputs are applied to the backpropagation process as a weighted combination.

[0193] Through alternating or coupled learning, the signal representation is trained to favorably influence the regressor's performance, resulting in the advantage of reducing errors in estimating mixing ratios. By learning signal representations for various materials and mixing ratios, the model can be applied to previously untrained materials belonging to the same chemical system.

[0194] Unlike conventional systems that utilize only a single mixed material signal, the novel approach of the present invention can adapt to lot-to-lot variation in raw material batches. That is, it can handle cases where a change in one component causes a change in the mixed signal even at the same mixing ratio. Furthermore, this method allows for tracking the mixing behavior of new materials of the same type and learning the ability to fuse the signals of two components to generate a mixed signal.

[0195] Data traces collected from the sensor system may be processed to provide other information described herein. For example, the sensor may generate a signal indicating that corrective action is required.

[0196] As described herein, in some embodiments, the sensor includes four pairs of electrodes. By analyzing the time-series conductivity data obtained from the four sensor capacitors, it is possible to identify the point at which the corrective operation was successful—for example, when remixing is complete, when phase separation is resolved, or when the mixture has reached a stable state again.

[0197] For example, mixing (or remixing) requires time to reach a steady state. At the start of a mixing operation, the mixture is initially incomplete due to differences in back pressure and component viscosity, and gradually stabilizes. By tracking this consistent variance trend, the progress of stabilization can be monitored, and the timing for the dispensing device to begin dispensing material into the workpiece or receiving container can be indicated. The variance trend is analyzed against a threshold set for each material. However, instead of determining the threshold individually, the Augmented Dickey-Fuller test can be used to determine the stationarity of the signal. The advantage of this method is that the ADF test is adaptive, compared to the conventional method which requires manual adjustment of the threshold for each new batch.

[0198] The sensors described herein can also detect inhomogeneity. The four electrode pairs should record similar readings, and while a certain offset due to manufacturing tolerances is acceptable, the fluctuations of the four signals should be synchronized in a stable mixing process.

[0199] As each signal stabilizes, the covariance between the four sensors increases. If negative covariance is observed, it indicates persistent inverse correlation behavior and signifies spatial heterogeneity.

[0200] Similarly, individual components of a mixture may be heterogeneous, for example, due to sedimentation in the drum or insufficient mixing during manufacturing. In this case, too, the extended Dickey-Fuller test can be used to confirm longer-term stability. The relevant time range is determined by the time required to empty the container.

[0201] Figure 21A shows the architecture 2100 of a concentration profile simulation system. However, architecture 2100 is an example of an embodiment of the conductivity sensing system 2110. For example, architecture 2100 can provide computation, software, data access, and storage services without the end user knowing the physical location or configuration of the system being provided. In various embodiments, a remote server can provide these services over a wide area network such as the Internet using an appropriate protocol. For example, a remote server can provide applications over a wide area network, and these applications can be accessed through a web browser or other computing components. The software or components shown or described in Figures 1 to 20, and the data corresponding thereto, may be stored on a server located remotely. Computational resources in a remote server environment may be aggregated at a remote data center location or distributed. The infrastructure of the remote server can provide services through a shared data center, even if it appears to the user as a single point of access. Thus, the components and functions described herein may be provided from a server located remotely using a remote server architecture. Alternatively, they may be provided by conventional servers, installed directly on client devices, or provided in other ways.

[0202] Figure 21B shows an example of a system architecture. In the embodiment of Figure 21B, the system is wired and not wireless or an open, distributed solution. Wired communication may be preferred when wireless communication results in reduced transfer speed or reliability. However, as discussed in relation to Figure 21A, it is explicitly assumed that a wireless system is also feasible.

[0203] The conductivity sensor 2180 acquires conductivity signals from, for example, one or more PCB sensors as described herein, and transmits the sensor signals to the signal converter 2182. Signal conversion is performed in the signal converter 2182 as needed. However, in some embodiments, it is explicitly assumed that the conductivity sensor 2180 also transmits the sensor signals directly to the processor 2184. The signal converter 2182 may perform, for example, impedance to conductivity, analog signals to digital signals, or other appropriate conversions.

[0204] The processor 2184 receives conductivity indicator values ​​and generates a conductivity output. This output may be provided to one or more devices 2186. Devices 2186 include computing devices with display capabilities, smartphones, laptops, or storage media that store conductivity sensor signals for future reference. The processor 2184 may also refer to one or more data stores 2188 to generate additional instructions. For example, the data store 2188 may contain historical conductivity sensor signals, conductivity signal thresholds, commands for adjusting distribution parameters based on the thresholds, etc. The processor 2184 operates appropriately based on this information.

[0205] In embodiments described herein, the system may also include a pressure sensor 2190, which generates a pressure signal indicating the pressure detected at a given location within the distribution system. If necessary, a signal converter 2192 may convert the pressure signal to another format, for example, converting amperes to voltage or an analog signal to a digital signal.

[0206] Processor 2184, or another suitable processor, can generate a pressure output and provide it to one or more devices 2186. Processor 2184 can continuously receive signals from the pressure sensor 2190 and conductivity sensor 2180 throughout the process and similarly continuously generate outputs to provide substantial real-time information about the distribution system. Processor 2184 may include one or more suitable machine learning techniques, referencing lookup tables or performing other suitable data analysis techniques on the received conductivity or pressure signals.

[0207] The processor 2184 may communicate with sensors 2180 and 2190 via wireless communication, wired communication, or other suitable network. The processor 2184 may also receive encrypted signals and provide encrypted outputs, or it may operate without an encryption protocol.

[0208] Any number of communication paths are possible. For example, these include direct communication from sensor 2190 to processor 2184, and a path from sensor 2180 to data store 2188 via signal converter 2182, from which data is retrieved by processor 2184. Similarly, information requests from device 2186 may be sent directly to conductivity sensors 2180, 2190, data store 2188, or processor 2184.

[0209] In some embodiments, an MQTT broker may be used to allow, for example, device 2186 to subscribe to a subset of data from sensor 2190 or processor 2184.

[0210] The processor 2184 may also communicate with the data store 2188 to store conductivity and pressure signals for later analysis. For example, a dataset containing conductivity and pressure signals over time can be used to train a machine learning algorithm. Alternatively, it can be used for troubleshooting purposes. For instance, a machine learning algorithm can detect patterns in the dataset—such as deviations in mixing ratios or the need for purging—and provide indicators or thresholds to detect deviations in mixing ratios before they become severe.

[0211] Figure 21B shows a configuration in which a single processor receives information from a single set of sensors and performs distribution operations. However, in a production environment, it is explicitly assumed that multiple distribution devices are in operation, each equipped with multiple conductivity sensors and pressure sensors, which continuously provide status information. Therefore, it is conceivable that multiple users may want to view information from multiple production lines simultaneously. Figure 21C shows an example of a system configuration that can provide such functionality.

[0212] Figure 21C shows a signal analysis system communicating with multiple devices via a cloud-based network. As shown in Figure 21C, the signal analysis system 2200 may communicate with a local analysis system 2240, as described in relation to Figure 21B. The signal analysis system 2200 can receive a number of sensor signal data 2210 from multiple distribution operations. These include, for example, a pilot line 2204, an operational line 2202, and / or a laboratory configuration 2206. As described in relation to Figure 21B, the sensor signals 2210 may be digital signals, analog signals, conductivity measurement signals, pressure signals, or other signal information. For example, they may include signals indicating that a low level of reservoir has been detected, valve opening / closing indications, or other detectable indications from any of the systems 2202-2206.

[0213] The signal analysis system 2200 performs analysis on the received sensor signal information. This analysis is performed using any appropriate analysis tools, such as lookup tables, comparison thresholds, and / or machine learning algorithms, and can detect parameter trend information indicating the occurrence of a problem or the need for corrective action (e.g., purging, adjustment of mixing ratio).

[0214] The analysis results from the signal analysis system 2200 are provided to several appropriate devices 2250 as output indicators 2220. The signal analysis system 2200 may provide output information 2220 continuously or in response to a request 2234. The request 2234 may be a one-time request for current status information or a request for receiving continuous updates in the future.

[0215] Figures 22A to 22D show a sensing system according to one embodiment of the present invention. Conventional sensing configurations required combining components from different manufacturers and performing data preprocessing and analysis on separate computing devices. However, to quickly detect concerns about material quality, a robust and compact system that can process data quickly with minimal downtime and startup time is desirable.

[0216] In some embodiments of the present invention, the sensor is a “smart sensor” that incorporates signal preparation and processing functions within a single housing. Such a smart sensor includes processing components such as a microprocessor, microcontroller, digital signal processor, or other processing circuitry. In some embodiments, the sensor has one or more standardized interfaces for connecting to other systems. These may include fieldbus systems, sensor networks, input / output links, etc. In some embodiments of the present invention, sensor signal processing is completed without the use of an external computer. This enables decentralization, improved reliability, cost reduction, increased flexibility, and system simplification.

[0217] In some embodiments, the sensor system includes a concentrator that integrates electronic components within a single housing. In one embodiment, all electronic components are located on a single PCB. In another embodiment, an analog front-end with signal conversion (e.g., an AD converter, a DA converter, or both) is connected to a microcontroller that performs signal conversion and processing and provides an output signal. Furthermore, the sensing system may include operational circuitry. This operational circuitry may include power supply circuits, input / output protection circuits, signal conditioning circuits, reset management, and / or debugging circuits and interfaces. In some embodiments, the concentrator may include user interface components, such as LED indicators, UART, USB, wireless interfaces (Bluetooth®, WiFi, Zigbee®, cellular networks, etc.), dot matrix or alphanumeric displays, industrial bus systems, push-button switches, and tactile interfaces such as touchscreens.

[0218] The system of the present invention may include user-accessible data, such as signal values ​​themselves, pass / fail judgments (e.g., "yes / no," "proceed / stop"), and indicators of quality or quantity. The system may also output a data stream containing time and / or frequency-dependent data, which can be used for recording and / or post-processing. Furthermore, the system may include algorithms and calibration information necessary for data processing.

[0219] Figure 22A shows a schematic configuration of a sensing system according to an embodiment of the present invention. The sensing system 2300 can be used with the sensors described herein or other suitable sensors. The sensor signal reader 2302 is connected to the sensor. For example, it may be connected to an edge connector on a PCB board containing one or more electrode pairs. However, although an edge connector is shown, it is explicitly assumed that other connection mechanisms are applicable.

[0220] In some embodiments, a transimpedance amplifier is provided to convert current measurements to voltages, or vice versa. The concentrator 2310 receives sensor signals, processes these signals, and provides an output. The output may be provided via an input / output device (I / O device) 2306 and / or using a wired or wireless communication protocol 2308. The power supply 2312 supplies power to the concentrator 2310. Although a wired power supply is shown in the illustrated example, power may be supplied wirelessly, or the concentrator 2310 may be integrated into a material distribution system and receive power from there.

[0221] Figure 22B shows interface 2320 as an example of a concentrator. This interface can receive sensor signals via one or more sensor signal receiving ports 2324. In some embodiments, other data or inputs may be received through another receiver 2322.

[0222] Figure 22C shows another interface 2330, which is configured to accept connections to input / output devices. Power can be supplied, for example, using port 2334. Data may be communicated from the concentrator via computer link 2336.

[0223] Figure 22D shows a component diagram of a sensing system 2340 according to an embodiment of the present invention. One or more sensors 2342 provide sensor signals, which are received by one or more receivers 2344. The receivers 2344 may be coupled to or contained within a housing 2370. In some embodiments, the system 2340 includes an analog front end, which may include a filter 2348 and / or an analog multiplexer 2346. A converter 2349 (e.g., a DA converter or a DC converter) may also be included. The concentrator 2350 may include a non-volatile memory 2352, a flash memory 2354, or other suitable information storage. A temperature sensor 2356 may be built into the concentrator 2350 or receive temperature signals from an external temperature sensor. A clock 2358 may be included in the concentrator 2350. The concentrator 2350 may also include a reset function 2362.

[0224] The sensor analyzer 2370 may include calibration data and / or calibration functions 2372. A real-time operating system (RTOS) 2373 may manage the functions. The sensor analyzer 2370 may include a Fourier transformer 2376. It may also include a waveform generator 2376. Furthermore, other applications 2375 may be included, which may provide functions for detecting material properties such as mixing ratio, material degradation over time (age), and hardening progression. The sensor analyzer 2370 may include an identifier 2374 for identifying the type of sensor.

[0225] The concentrator 2350 includes a power management system 2360, which may include or access a power supply unit 2466. Power quality 2368 may be monitored, and energy consumption 2369 may be tracked. Conversion input and output ranges 2364 may also be stored. Symmetric voltage 2367 may also be used.

[0226] Figure 23 shows a dispensing system according to an embodiment of the present invention. Many dispensing operations are performed using portable handheld systems. However, if the quality of the materials or the machine settings are not appropriate, dispensing errors or adhesion failures may occur. For example, incorrect mixing ratios or improper pressure settings may result in unacceptable products. Therefore, there is a need for a handheld dispensing system that can provide the user with real-time sensing and feedback. The system shown in Figure 23 is an example of a system that can receive and process sensor signals without requiring a separate computing device. Numerous embodiments of sensors that can be used with dispensing devices are disclosed herein. Systems for measuring pressure within a dispensing system are also described. The dispensing system 2400 includes a dispenser 2410. The dispenser 2410 shown is exemplified as an adhesive dispenser, but the systems described herein are also useful for other types of dispensers. The dispenser 2410 includes an in-line sensor 2430 that detects the electrical properties of the material being dispensed. Additionally, a pressure sensor 2440 is incorporated into the dispenser 2410 to monitor the pressure inside the dispenser.

[0227] The dispenser 2410 also includes a signal processing system 2420. The signal receiving unit receives parameter signals detected from the sensor 2430. The processing unit includes any suitable processor or processing circuit and processes the received detection signals. The memory may store calibration data, historical signal data, etc. The display unit 2450 presents the processed information received from the signal processing system 2420 to the user. This communication is performed, for example, via a communication module. The display unit 2450 may be integrated with the dispenser 2410, or it may be a separate display device visible to the operator (such as a mobile computer or a work site display). Although the illustrated display unit 2450 is configured to present information visually, in some embodiments of the present invention, it is explicitly assumed that the output of the signal processing system 2420 may be presented as audio or haptic feedback.

[0228] Based on the detection signal, the signal processing system 2420 may activate changes to the distribution parameters. For example, if the detected mixing ratio deviates from a specified mixing ratio, the signal processing system 2420 may adjust the mixing ratio by changing the pump speed of one component based on the deviation. The signal processing system 2420 may directly control the pump speed or indirectly control it by sending a speed change command to the pump controller. The signal processing system 2420 can also notify of deviations in the mixing ratio through the display unit 2450. In some embodiments, the signal processing system 2420 only notifies when it detects material-related problems such as mixing ratio, age, curing progress, or pressure, requiring the operator to take manual action. However, in other embodiments of the present invention, it is explicitly assumed that the dispenser parameters are automatically adjusted in real time based on signals from sensors 2430 and 2440.

[0229] In some embodiments, the distribution system 2400 includes a material inventory system 2460. The material inventory system 2460 may store physical materials 2462 and dispenser components 2464 (e.g., various static mixers installed in the dispenser 2410). However, in some embodiments, it is explicitly assumed that the material inventory system 2460 holds only information about the materials 2462 and the dispenser 2464.

[0230] Materials 2462 may include information related to the distribution operation in which they are used. For example, the distribution cartridge may include an RFID tag, an NFC tag, or other wirelessly accessible data storage. Information may also be transferred via a printed code (such as a barcode or QR code). In some embodiments, a printed RFID label is affixed to the distribution cartridge.

[0231] When a cartridge of material 2462 enters a data transfer range (such as an RFID range or NFC range), the distribution system 2410 or material inventory system 2460 acquires distribution information. This distribution information may include, for example, distribution parameters 2466 (such as operating pressure for one or both components) and recommended settings 2468 corresponding to material 2462. Other information may also be provided.

[0232] Based on the acquired information, the system 2410 can provide the operator with operational guidance by displaying it on a display device (e.g., display unit 2450). For example, in some embodiments, the dispenser identifies an NFC tag, RFID tag, or other information recording means provided on the material to be dispensed and receives expected process parameters from the material information system 2460 based on this.

[0233] By using the sensors described herein or other suitable sensors, the distribution system 2410 can receive detected electrical parameter values ​​from which it can identify the ongoing process state (mixing ratio, age, curing state, etc.). Based on the detected process values, the system 2410 may display instructions to the operator or perform processes to automatically correct any inconsistencies.

[0234] Figures 24 to 26 show examples of devices usable in the embodiments shown in the aforementioned figures. Figure 24 shows an example of a mobile device usable in the aforementioned embodiments. Figure 24 shows a simplified block diagram of an example of a handheld or mobile computing device that can be used as a worker device or a supervisor / safety manager device. This system (or a part thereof) can be implemented in such a mobile device. For example, a mobile device can be placed in the operator's compartment of a computing device used by an operator and used for generating, processing, or displaying data.

[0235] Figure 24 shows a typical configuration block diagram of a mobile cellular device 2516, which can perform or communicate with some of the components described herein. Device 2516 operates some of them and communicates with others. Device 2516 is provided with a communication link 2513, which enables the handheld device to communicate with other computing devices. In some embodiments, the communication link 2513 provides a channel for automatically receiving information, such as by scanning. Examples of the communication link 2513 include wireless communication services that provide cellular access to a network, and communication protocols that provide a local wireless connection to a network.

[0236] In another example, the application may be stored on a removable secure digital (SD) card and connected to interface 2515. Interface 2515 and communication link 2513 communicate with processor 2517 via bus 2519, to which memory 2521, input / output (I / O) components 2523, clock 2525, and position system 2527 are further connected.

[0237] I / O component 2523 is provided to facilitate input and output operations. Device 2516 can include input components such as buttons, touch sensors, optical sensors, microphones, touchscreens, proximity sensors, accelerometers, and attitude sensors. Output components include display devices, speakers, and printer ports. Other I / O components can also be used.

[0238] Clock 2525 constitutes a real-time clock (RTC) that outputs the time and date. It can also provide timing functions to processor 2517.

[0239] The position system 2527 includes a component that outputs the current position of device 2516. This may include other positioning systems, such as a GPS receiver, a LORAN system, a dead reckoning system, or a cellular triangulation system. It may also include mapping software and navigation software that generate the desired map, navigation route, or other geographical functions.

[0240] Memory 2521 stores the following information: Operating System 2529, Network Settings 2531, Applications 2533, Application Configuration Settings 2535, Data Store 2537, Communication Drivers 2539, and Communication Configuration Settings 2541. Memory 2521 may include all types of volatile and non-volatile tangible computer-readable memory devices. It may also include computer storage media as described later. Memory 2521 stores instructions that, when executed by processor 2517, cause computer implementation steps or functions to be performed. Processor 2517 can also be started by other components and assist in their functions. Although the physical memory store 2521 is depicted as part of the device in the illustration, the present invention explicitly envisions configurations in which some data and / or processing are performed in a remote service (cloud).

[0241] Figure 25 shows an example where the device is a smartphone 2671. The smartphone 2671 has a touch-sensitive display 2673 on which icons, tiles, or other user interface elements 2675 are displayed. The user can use these elements 2675 to launch applications, make calls, and perform data transfer operations. Generally, the smartphone 2671 is built on a mobile operating system and has higher computing power and connectivity than conventional feature phones. It should be noted that the present invention explicitly assumes that other forms of devices are also possible.

[0242] Although device 2600 is exemplified as a smartphone 2671 in Figure 25, the present invention explicitly assumes a configuration in which the display unit is displayed on another computing device.

[0243] Figure 26 shows an example of a computing environment that may implement the systems and methods described herein, or parts thereof. Referring to Figure 26, an exemplary system for implementing some embodiments includes a general-purpose computing device in the form of a computer 2710. Components of the computer 2710 include, but are not limited to, a processing unit 2720 (which may include a processor), system memory 2730, and a system bus 2721 that connects various system components, including the system memory, to the processing unit 2720. The system bus 2721 may be any of several types of bus structures, such as a memory bus or memory controller, peripheral bus, or local bus utilizing various bus architectures. The memory and programs for the systems and methods described herein may be located in the section corresponding to Figure 22.

[0244] Computer 2710 typically includes a variety of computer-readable media. Computer-readable media refers to all media accessible by computer 2710, including both volatile / non-volatile and removable / non-removable media. Examples of computer-readable media include computer storage media and communication media. Computer storage media, unlike modulated data signals and carrier waves, does not include these. It includes volatile / non-volatile, removable / non-removable hardware storage media implemented in any method or technique for storing information (e.g., computer-readable instructions, data structures, program modules, or other data). Specific examples include RAM, ROM, EEPROM, flash memory, other memory technologies, optical discs such as CD-ROMs and DVDs, magnetic cassettes, magnetic tapes, magnetic disk storage, other magnetic storage devices, or other media capable of storing desired information and accessible by computer 2710. Communication media includes any information transmission media that embodies computer-readable instructions, data structures, program modules, or other data within a transport mechanism. Here, "modulated data signal" refers to a signal in which one or more characteristics of the signal are set or changed, and information is encoded within that signal.

[0245] System memory 2730 includes volatile and / or non-volatile computer storage media, such as read-only memory (ROM) 2731 and random-access memory (RAM) 2732. Basic input / output system (BIOS) 2733 contains basic routines that facilitate information transfer between elements within the computer 2710 (e.g., during startup) and is typically stored in ROM 2731. RAM 2732 stores data and / or program modules that are immediately accessible by the processing unit 2720 or are currently being processed. Exemplarily, Figure 26 shows an operating system 2734, an application program 2735, other program modules 2736, and program data 2737.

[0246] Computer 2710 may also include other removable / non-removable, volatile / non-volatile computer storage media. For example, Figure 26 shows a hard disk drive 2741, a non-volatile magnetic disk 2752, an optical disk drive 2755, and a non-volatile optical disk 2756 that read from and write to a non-removable non-volatile magnetic medium. The hard disk drive 2741 is typically connected to the system bus 2721 via a non-removable memory interface 2740, and the optical disk drive 2755 is connected to the system bus 2721 via a removable memory interface 2750.

[0247] Alternatively, or in addition to the above, the functions described herein may be performed at least in part by one or more hardware logic components. Examples of usable hardware logic components include field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), and complex programmable logic devices (CPLDs).

[0248] The drives and associated computer storage media shown in Figure 26 store computer-readable instructions, data structures, program modules, and other data for computer 2710. For example, Figure 26 shows a hard disk drive 2741 storing the operating system 2744, application programs 2745, other program modules 2746, and program data 2747. These components may be identical to or different from the operating system 2734, etc.

[0249] The user can input commands and information to the computer 2710 via input devices such as a keyboard 2762, a microphone 2763, and a pointing device 2761 such as a mouse, trackball, or touchpad. Other input devices (not shown) may also be used, such as a joystick, gamepad, satellite receiver, or scanner. These and other input devices are often connected to the processing unit 2720 via the user input interface 2760 and coupled to the system bus, but may also be connected via other interfaces or bus structures. A display device 2791 (such as a video display) is also connected to the system bus 2721 via the video interface 2790. In addition to this monitor, the computer may include other peripheral output devices such as a speaker 2797 and a printer 2796, which are connected via the output peripheral interface 2795.

[0250] Computer 2710 operates in a network environment such as a local area network (LAN) or wide area network (WAN) and establishes a logical connection with one or more remote devices, such as a remote computer 2780.

[0251] When used in a LAN network environment, computer 2710 is connected to LAN 2771 via a network interface or adapter 2770. When used in a WAN network environment, computer 2710 typically includes a modem 2772 or other means for establishing communication over WAN 2773 (e.g., the Internet). In a network environment, program modules may be stored in remote memory storage. For example, Figure 26 shows that a remote application program 2785 may reside on a remote computer 2780.

[0252] In the detailed description of preferred embodiments of the present invention, reference is made to the accompanying drawings, which illustrate specific embodiments in which the present invention may be carried out. The illustrated embodiments are not intended to exhaust all embodiments of the present invention. It should be understood that other embodiments may be used, and structural or logical modifications may be made without departing from the scope of the invention. Accordingly, the following detailed description should not be constrained, and the scope of the invention is defined by the appended claims.

[0253] Unless otherwise indicated, all numerical values ​​representing characteristic dimensions, quantities, and physical properties used herein and in the claims shall be understood in all cases to be modified by the word “about.” Thus, unless otherwise indicated, the numerical parameters described herein and in the appended claims are approximations that may vary depending on the desired properties sought by a person skilled in the art utilizing the teachings disclosed herein.

[0254] As used herein and in the appended claims, the singular forms "a," "an," and "the" encompass embodiments having multiple subjects unless otherwise indicated to indicate a clear difference in content. As used herein and in the appended claims, the word "or" is used in a general sense to include "and / or" unless otherwise indicated to indicate a clear difference in content.

[0255] Spatial relationship terms, including but not limited to "proximate," "distal," "lower," "upper," "beneath," "below," "above," and "on top," are used to facilitate descriptions of the spatial relationships of elements relative to other elements. Such spatial relationship terms encompass different directions in the use or operation of the apparatus, in addition to the specific directions shown in the drawings and this specification. For example, if an object shown in a drawing is inverted or turned inside out, a part previously described as being below or beneath other elements would be located above or on top of those other elements.

[0256] In this specification, when an element, component, or layer is described as forming a “coincident interface,” or as “on,” “connected to,” “coupled with,” “stacked on,” or “in contact with,” it may mean that it is directly on top of, directly connected to, directly coupled to, directly stacked on, or directly in contact with, but it also includes cases where an intervening element, component, or layer is connected to, coupled to, or in contact with that particular element, component, or layer. For example, when an element, component, or layer is described as “directly on,” “directly connected to,” “directly coupled with,” or “directly in contact with,” there is no intervening element, component, or layer. The technology of this disclosure can be implemented in a wide range of computer devices, such as servers, laptop computers, desktop computers, notebook computers, tablet computers, handheld computers, and smartphones. Any component, module, or unit described herein is intended to highlight its functional aspects and does not necessarily require implementation by different hardware units. The technologies of this disclosure can be implemented in hardware, software, firmware, or any combination thereof. Any feature described as a module, unit, or component may be implemented integrally within an integrated logic device, or separately as individual, interoperable logic devices. In some examples, various features may be implemented as an integrated circuit device, e.g., an integrated circuit chip or chipset. Furthermore, although the numerous different modules described herein are described as performing specific functions, all functions of all modules may be combined into a single module, or they may be further divided into additional modules.The modules described herein are all exemplary and are described as such for ease of understanding.

[0257] When implemented in software, these techniques are realized, at least in part, by a computer-readable medium that includes instructions to perform one or more of the above methods when executed within a processor. The computer-readable medium includes tangible computer-readable storage media and may form part of a computer program product that includes packaging material. The computer-readable storage media may include random access memory (RAM), such as synchronous dynamic random access memory (SDRAM), read-only memory (ROM), non-volatile random access memory (NVRAM), electrically erasable programmable read-only memory (EEPROM), flash memory, magnetic or optical data storage media, and the like. The computer-readable storage media may also include non-volatile storage devices, such as hard disks, magnetic tapes, compact discs (CDs), digital versatile discs (DVDs), Blu-ray discs, holographic data storage media, or other non-volatile memory devices, and the like.

[0258] As used herein, the term "processor" can refer to any of the above structures or any other structure suitable for implementing the techniques described herein. Further, in some aspects, the functions described herein may be provided within dedicated software modules or hardware modules configured to execute the techniques of the present disclosure. Even when implemented in software, these techniques can use hardware, such as a processor for executing the software, and memory for storing the software. In such cases, the computer described herein can define a specific machine capable of performing the specific functions described herein. Also, these techniques can be fully implemented within one or more circuits or logic elements, and in that case, those circuits or logic elements can also be regarded as processors.

[0259] An electrical property sensor is provided. The sensor includes a printed circuit board having a first surface and a second surface spaced apart in thickness from the first surface, and the first surface has a length and a width. The sensor also includes a first sensing region on the first surface, and the first sensing region includes a receiving electrode and a transmitting electrode. When a fluid contacts the first or second sensing region and the transmitting electrode is activated, an electrical property value sensed at the receiving electrode is measured.

[0260] The sensor may be configured such that the sensed electrical property value is a current flow measurement.

[0261] The sensor may be configured such that the sensed electrical property value is an impedance.

[0262] The sensor may be configured such that the sensed electrical property value is a relative permittivity.

[0263] The sensor may be configured such that the transmitting electrode includes a plurality of transmitting branches, the receiving electrode includes a plurality of receiving branches, and the plurality of transmitting branches are alternately arranged between the plurality of receiving branches.

[0264] The sensor may further include a second sensing region configured such that the second sensing region includes a second receiving electrode and a second transmitting electrode.

[0265] The sensor may be configured such that the first sensing region is on the first surface and the second sensing region is on the second surface.

[0266] The sensor may be configured such that both the first and second sensing regions are on the first surface.

[0267] The sensor may be configured such that the first and second sensing regions are separated, and the electrical characteristic value sensed from the first sensing region differs from the electrical characteristic value sensed from the second sensing region.

[0268] The sensor may further include a third sensing region separated from both the first and second sensing regions.

[0269] The sensor may be configured to further include a temperature sensor.

[0270] The sensor may be configured such that the temperature sensor is electrically isolated from the fluid flow.

[0271] The sensor may be configured such that the sensing area has a sensing length and a sensing width, and the length of the printed circuit board exceeds twice the sensing length.

[0272] The sensor may further include an edge connector configured to communicate with a sensor signal receiver.

[0273] The sensor may further include an opening formed along the printed circuit board between the edge connector and the sensing area.

[0274] The sensor may be configured such that the length of the printed circuit board exceeds three times the length of the first opening.

[0275] The sensor may be configured such that the length of the printed circuit board exceeds four times the length of the first opening.

[0276] A sensing system for a mixture is provided. The system includes a sensing zone containing the mixture and a sensor within the sensing zone. The sensor includes a printed circuit board (PCB). The sensor also includes first and second regions of the PCB, each of the first and second regions including a receiving electrode spaced from a transmitting electrode, the first region being separated from the second region such that a first electrical parameter value sensed by the first region is different from a second electrical parameter value sensed by the second region. The mixture is in direct contact with the transmitting and receiving electrodes of each of the first and second regions. The system also includes a communication component that communicates the first and second electrical parameter values.

[0277] The system may be configured such that the sensing zone is a container that houses the mixture.

[0278] The system may be configured to detect a difference between the first and second electrical parameter values and indicate instability of the mixture based on the difference.

[0279] The system may be configured such that the detected instability indicates a contaminant.

[0280] The system may be configured such that a controller generates an instruction based on the instability.

[0281] The system may be configured such that the instruction is communicated to a controller of a container that holds the material.

[0282] The system may be configured to detect, in situ, a difference between first and second current signals to detect instability, compare the difference to a tolerance threshold difference, and generate an instability indication if the difference exceeds the threshold difference.

[0283] The system may be configured to generate an indication that the instability has been resolved when it is detected that the difference between the first and second current signals falls below the threshold difference.

[0284] The system may be configured such that the transmitting electrode is parallel to the surface of the printed circuit board.

[0285] The sensor may be configured such that the sensed electrical characteristic value is a current flow rate measurement.

[0286] The sensor may be configured such that the detected electrical characteristic value is impedance.

[0287] The sensor may be configured such that the detected electrical characteristic value is the dielectric constant.

[0288] The sensor may be configured such that the transmitting electrode includes a plurality of transmitting branches, the receiving electrode includes a plurality of receiving branches, and the plurality of transmitting branches are alternately arranged between the plurality of receiving branches.

[0289] The sensor may further include a second sensing region, the second sensing region being configured to include a second receiving electrode and a second transmitting electrode.

[0290] The sensor may be configured such that the first sensing area is on the first surface and the second sensing area is on the second surface.

[0291] The sensor may be configured such that both the first and second sensing regions lie on the first surface.

[0292] The sensor may be configured such that the first and second sensing regions are separated, and the electrical characteristic value sensed from the first sensing region differs from the electrical characteristic value sensed from the second sensing region.

[0293] The sensor may further include a third sensing region separated from both the first and second sensing regions.

[0294] The sensor may be configured to further include a temperature sensor.

[0295] The sensor may be configured such that the temperature sensor is electrically isolated from the fluid flow.

[0296] The sensor may be configured such that the sensing area has a sensing length and a sensing width, and the length of the printed circuit board exceeds twice the sensing length.

[0297] The sensor may further include an edge connector configured to communicate with a sensor signal receiver.

[0298] The sensor may further include an opening formed along the printed circuit board between the edge connector and the sensing area.

[0299] A method for sensing the state of a material, comprising the step of bringing the material into contact with a sensor, wherein the contact includes direct contact between the sensor and the material. The sensor includes a printed circuit board (PCB) having a first surface and a second surface separated by a thickness. The sensor also includes a sensing region provided on the first surface and configured to sense electrical parameter values. The sensor further includes an edge connector configured to communicate a signal from the sensing region to a signal processor. The method also comprises the step of receiving an electrical signal from the sensor, the electrical signal being communicated by the edge connector. The method also comprises the step of sensing the state of the material based on the received signal, the sensing being performed in real time by the signal processor. The method also comprises the step of communicating the sensed material state.

[0300] The method may be configured such that the signal processor receives the sensed electrical parameter value, senses the material state, and communicates the sensed material state.

[0301] The method may be configured such that the communication includes the signal processor communicating the sensed material state to a graphical user interface generator, and the graphical user interface generator generating a graphical user interface for a device having a screen.

[0302] The method may be configured such that the apparatus includes the signal processor.

[0303] The method may be configured such that the sensed electrical characteristic value is a current flow rate measurement.

[0304] The method may be configured such that the sensed electrical characteristic value is an impedance.

[0305] The method may be configured such that the sensed electrical characteristic value is the dielectric constant.

[0306] The method may be configured such that the sensing region includes a transmitting electrode and a receiving electrode, the transmitting electrode includes a plurality of transmitting branches, the receiving electrode includes a plurality of receiving branches, and the plurality of transmitting branches are alternately arranged between the plurality of receiving branches.

[0307] The method may further include a second sensing region, the second sensing region being configured to include a second receiving electrode and a second transmitting electrode.

[0308] The method may be configured such that the first sensing area is on the first surface and the second sensing area is on the second surface.

[0309] The method may be configured such that both the first and second sensing regions lie on the first surface.

[0310] The method may be configured such that the first and second sensing regions are separated, and the electrical characteristic value sensed from the first sensing region is different from the electrical characteristic value sensed from the second sensing region.

[0311] The method may further include a third sensing region separated from both the first and second sensing regions.

[0312] The method may further include a temperature sensor.

[0313] The method may be configured such that the temperature sensor is electrically isolated from the fluid flow.

[0314] The method may be configured such that the sensing area has a sensing length and a sensing width, and the length of the printed circuit board exceeds twice the sensing length.

[0315] The method may further include an edge connector configured to communicate with a sensor signal receiver.

[0316] The method may further include an opening formed along the printed circuit board between the edge connector and the sensing region.

Claims

1. A printed circuit board having a first surface and a second surface separated by a thickness from the first surface, wherein the first surface has a length and a width, The first sensing region on the first surface includes a receiving electrode and a transmitting electrode, Equipped with, An electrical characteristic sensor in which, when a fluid comes into contact with the first or second sensing area and the transmitting electrode is activated, an electrical characteristic value sensed at the receiving electrode is measured.

2. The sensor according to claim 1, wherein the sensed electrical characteristic value is a current flow rate measurement.

3. The sensor according to claim 1 or 2, wherein the sensed electrical characteristic value is impedance.

4. The sensor according to any one of claims 1 to 3, wherein the sensed electrical characteristic value is the relative permittivity.

5. The sensor according to any one of claims 1 to 4, wherein the transmitting electrode includes a plurality of transmitting branches, the receiving electrode includes a plurality of receiving branches, and the plurality of transmitting branches are alternately arranged between the plurality of receiving branches.

6. The sensor according to any one of claims 1 to 5, further comprising a second sensing region, wherein the second sensing region includes a second receiving electrode and a second transmitting electrode.

7. The sensor according to claim 6, wherein the first sensing region is on the first surface and the second sensing region is on the second surface.

8. The sensor according to claim 6, wherein both the first and second sensing regions are located on the first surface.

9. The sensor according to claim 6, wherein the first and second sensing regions are separated, and as a result, the electrical characteristic value sensed from the first sensing region is different from the electrical characteristic value sensed from the second sensing region.

10. The sensor according to claim 6, further comprising a third sensing region separated from both the first and second sensing regions.

11. The sensor according to any one of claims 1 to 10, further comprising a temperature sensor.

12. The sensor according to claim 11, wherein the temperature sensor is electrically insulated from the fluid flow.

13. The sensor according to any one of claims 1 to 12, wherein the sensing area has a sensing length and a sensing width, and the length of the printed circuit board exceeds twice the sensing length.

14. The sensor according to any one of claims 1 to 13, further comprising an edge connector configured to communicate with a sensor signal receiver.

15. The sensor according to claim 14, further comprising an opening formed along the printed circuit board between the edge connector and the sensing region.

16. The sensor according to any one of claims 1 to 15, wherein the length of the printed circuit board exceeds three times the length of the first opening.

17. The sensor according to any one of claims 1 to 16, wherein the length of the printed circuit board exceeds four times the length of the first opening.

18. A sensing area containing a mixture, A sensor arranged within the aforementioned sensing area, Printed circuit board (PCB) and, The first and second regions of the printed circuit board, each region including a receiving electrode spaced apart from the transmitting electrode, the first region being separated from the second region, such that the first electrical parameter value sensed by the first region is different from the second electrical parameter value sensed by the second region, The sensor comprising, A communication component for communicating the first and second electrical parameter values, Equipped with, A sensing system for a mixture, wherein the mixture is in direct contact with the transmitting electrode and the receiving electrode of the first and second regions, respectively.

19. The system according to claim 18, wherein the sensing area is a container for containing the mixture.

20. The system according to claim 18 or 19, wherein the sensing system detects the difference between the first and second electrical parameter values ​​and indicates instability of the mixture based on the difference.

21. The system according to claim 20, wherein the detected instability indicates a contaminant.

22. The system according to any one of claims 18 to 22, wherein the controller generates instructions based on the instability.

23. The system according to claim 22, wherein the instruction is communicated to a controller of a container containing the material.

24. The system according to claim 23, wherein the system is configured to detect instability by detecting the difference between a first and a second current signal in place, comparing the difference with an acceptable threshold difference, and generating an instability indicator if the difference exceeds the threshold difference.

25. The system according to claim 24, which generates an instruction indicating that the instability has been resolved based on the detection that the difference between the first and second current signals has fallen below the threshold difference.

26. The system according to any one of claims 18 to 25, wherein the transmitting electrode is parallel to the surface of the printed circuit board.

27. The sensor according to any one of claims 18 to 26, wherein the sensed electrical characteristic value is a current flow rate measurement.

28. The sensor according to any one of claims 18 to 27, wherein the sensed electrical characteristic value is impedance.

29. The sensor according to any one of claims 18 to 28, wherein the sensed electrical characteristic value is the dielectric constant.

30. The sensor according to any one of claims 18 to 29, wherein the transmitting electrode includes a plurality of transmitting branches, the receiving electrode includes a plurality of receiving branches, and the plurality of transmitting branches are alternately arranged between the plurality of receiving branches.

31. The sensor according to any one of claims 18 to 30, further comprising a second sensing region, wherein the second sensing region includes a second receiving electrode and a second transmitting electrode.

32. The sensor according to claim 32, wherein the first sensing region is on the first surface and the second sensing region is on the second surface.

33. The sensor according to claim 32, wherein both the first and second sensing regions are located on the first surface.

34. The sensor according to claim 32, wherein the first and second sensing regions are separated, and as a result, the electrical characteristic value sensed from the first sensing region is different from the electrical characteristic value sensed from the second sensing region.

35. The sensor according to claim 32, further comprising a third sensing region separated from both the first and second sensing regions.

36. The sensor according to any one of claims 18 to 35, further comprising a temperature sensor.

37. The sensor according to claim 36, wherein the temperature sensor is electrically insulated from the fluid flow.

38. The sensor according to any one of claims 18 to 37, wherein the sensing area has a sensing length and a sensing width, and the length of the printed circuit board exceeds twice the sensing length.

39. The sensor according to any one of claims 18 to 39, further comprising an edge connector configured to communicate with a sensor signal receiver.

40. The sensor according to claim 39, further comprising an opening formed along the printed circuit board between the edge connector and the sensing region.

41. A method for sensing the state of a material, A step of bringing the material into contact with a sensor, wherein the contact includes direct contact between the sensor and the material, A PCB having a first surface and a second surface separated by a thickness, A sensing region provided on the first surface and configured to sense electrical parameter values, An edge connector configured to communicate signals from the sensing area to a signal processor, A step of bringing the material into contact with the sensor, comprising: The process of receiving an electrical signal communicated by the edge connector from the sensor, A process of sensing the state of the material based on the received signal, and the sensing being performed in real time by a signal processor, The process of communicating the sensed material state, Methods that include...

42. The method according to claim 41, wherein the signal processor receives the sensed electrical parameter value, senses the material state, and communicates the sensed material state.

43. The method according to claim 42, wherein the communication includes the signal processor communicating the sensed material state to a graphical user interface generator, and the graphical user interface generator generating a graphical user interface for a device having a screen.

44. The method according to claim 43, wherein the apparatus includes the signal processor.

45. The method according to any one of claims 40 to 44, wherein the sensed electrical characteristic value is a current flow rate measurement.

46. The method according to any one of claims 40 to 45, wherein the sensed electrical characteristic value is impedance.

47. The method according to any one of claims 40 to 46, wherein the sensed electrical characteristic value is the dielectric constant.

48. The method according to any one of claims 40 to 47, wherein the sensing region includes a transmitting electrode and a receiving electrode, the transmitting electrode includes a plurality of transmitting branches, the receiving electrode includes a plurality of receiving branches, and the plurality of transmitting branches are alternately arranged between the plurality of receiving branches.

49. The method according to any one of claims 40 to 48, further comprising a second sensing region, wherein the second sensing region includes a second receiving electrode and a second transmitting electrode.

50. The method according to claim 49, wherein the first sensing region is on the first surface and the second sensing region is on the second surface.

51. The method according to claim 50, wherein both the first and second sensing regions are located on the first surface.

52. The method according to claim 50, wherein the first and second sensing regions are separated, and as a result, the electrical characteristic value sensed from the first sensing region is different from the electrical characteristic value sensed from the second sensing region.

53. The method according to claim 50, further comprising a third sensing region separated from both the first and second sensing regions.

54. The method according to any one of claims 40 to 53, further comprising a temperature sensor.

55. The method according to claim 54, wherein the temperature sensor is electrically insulated from the fluid flow.

56. The method according to any one of claims 40 to 55, wherein the sensing region has a sensing length and a sensing width, and the length of the PCB is more than twice the sensing length.

57. The method according to any one of claims 40 to 56, further comprising an edge connector configured to be communicatively coupled to a sensor signal receiver.

58. The method according to claim 57, further comprising an opening formed along the PCB between the edge connector and the sensing region.

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