Sensor module, assembly, operation method of sensor module, and wearable device

Abstract

The sensor module (1) comprises an optical sensor element (2) and an evaluation circuit (3). The optical sensor element (2) comprises at least one optical emitter (21) and at least one optical receiver (22). The optical sensor element (2) is configured to communicate non-contact with the optical interface (110) of the electronic device (100). The optical sensor element (2) is further configured to optically detect at least one sensing parameter. The evaluation circuit (3) is electrically connected to the optical sensor element (2) and is configured to determine at least one sensing parameter. For example, the at least one optical emitter (21) is a micro-LED or any optoelectronic emitter.

Description

Technical Field

[0001] A sensor module, an assembly, a method of operating a sensor module, and a wearable device are defined.

Summary of the Invention

[0002] One objective to be achieved is, inter alia, to define an improved sensor module. Other objectives to be achieved are, inter alia, to define an assembly comprising such a sensor module, to define a method of operating such a sensor module, and to define a wearable device comprising such a sensor module.

[0003] These objectives are achieved, inter alia, by a sensor module having the features of independent claim 1, an assembly having the features of claim 10, a method having the features of claim 15, and a wearable device having the features of claim 16. Advantageous embodiments and further developments are the subject matter of the respective dependent claims.

[0004] According to at least one embodiment, the sensor module comprises an optical sensor element and an evaluation circuit. The optical sensor element comprises at least one optical emitter and at least one optical receiver. Specifically, when the terms "optical emitter" and "optical receiver" are used herein and hereinafter, they are understood to be synonymous with "at least one optical emitter" and "at least one optical receiver" respectively. That is, features regarding the optical emitter and / or the optical receiver are respectively included or applied to a plurality of optical emitters and / or optical receivers as well, unless otherwise specified.

[0005] The optical emitter and optical receiver are preferably optoelectronic semiconductor components. For example, each of the optical emitter and optical receiver comprises an optoelectronic semiconductor chip configured to emit or receive electromagnetic radiation, respectively.

[0006] Specifically, electromagnetic radiation is generated or received in the active regions of the respective optoelectronic semiconductor chips of the emitter and receiver during the intended operation. For example, each semiconductor chip has a semiconductor stack. For example, the semiconductor stack is based on III-V compound semiconductor materials, silicon material systems, etc. For example, the optical emitter has a semiconductor chip based on III-V compound semiconductor materials and the optical receiver has a semiconductor chip based on silicon material systems, or vice versa. It is also possible that each of the emitter and receiver has a semiconductor chip based on either III-V compound semiconductor materials or silicon material systems.

[0007] Electromagnetic radiation in the infrared or visible light wavelength range of the electromagnetic spectrum can be generated or received by the active region of each semiconductor chip. The optical emitter is preferably configured to emit electromagnetic radiation in the infrared wavelength range, and the optical receiver is preferably configured to receive electromagnetic radiation in the infrared wavelength range. Specifically, the wavelength of the radiation is between 650 nm and 2000 nm, or between 800 nm and 1000 nm.

[0008] According to at least one embodiment, an optical sensor element is configured to communicate non-contact with the optical interface of an electronic device. In particular, "non-contact" means that there is no physical contact between the optical sensor element and the electronic device. This may include the communication between the optical sensor element and the electronic device being wireless, and preferably entirely optical.

[0009] For example, a sensor element is incorporated into or is part of a portable device. Examples of portable devices include smartwatches, smartphones, headphones, earphones, and TWS (True Wireless Stereo) earbuds. In this case, the electronic device is a counterpart to the portable device, such as a charging station or charging device, or a master device for evaluating and / or visualizing data from the portable device. Examples of electronic devices include personal computers, smartphones, and charging cases. Optical communication between the portable device and the electronic device can be established through the optical sensor element and optical interface. That is, the optical sensor element functions as a transceiver. For example, the portable device and the electronic device exchange data regarding the battery status of the portable device, diagnostic information, and software and / or firmware updates for the portable device and / or sensor module.

[0010] According to at least one embodiment of the sensor module, the optical sensor module is configured to optically detect at least one sensing parameter.

[0011] According to at least one embodiment of the sensor module, an evaluation circuit is electrically connected to an optical sensor element and configured to determine at least one sensing parameter. For example, the evaluation circuit may be an Application Specific Integrated Circuit (also known as an ASIC), or a microcontroller or a Field Programmable Gate Array (also known as an FPGA). Specifically, the evaluation circuit may receive as input at least one parameter signal optically acquired by an optical sensor element, corresponding to at least one sensing parameter, and determine at least one sensing parameter from that at least one parameter signal.

[0012] According to at least one embodiment of the sensor module, at least one detection parameter is at least one of proximity, bio-function, touch force, physical contact, swipe motion, distance to object, and velocity of object.

[0013] For example, proximity may be obtained optically by an optical emitter and an optical receiver. For example, if the sensor module is incorporated into headphones, earphones, or TWS earbuds, the optical sensor element may detect whether the headphones, earphones, or TWS earbuds are inserted into or worn in the user's ears. If the sensor module is incorporated into a smartphone or the like, the optical sensor module may determine whether the smartphone is being used by the user or whether it has been accidentally activated, for example, in the user's pocket, by detecting proximity.

[0014] Furthermore, or alternatively, one or more biological functions may be obtained by the optical sensor element. For example, the moisture content of the user's skin or the user's heart rate may be optically determined. In such cases, the optical sensor module may be incorporated into a smartwatch or fitness tracker, etc.

[0015] Furthermore, or alternatively, touch force may be obtained by an optical sensor element. To achieve this, for example, a deformable element that can be deformed by applying force may be placed in front of the optical emitter and / or optical receiver. The deformation of the deformable element may be determined by irradiating the deformable element with electromagnetic radiation from the optical emitter and receiving the radiation reflected by the deformable element with the optical receiver. If the mechanical properties of the deformable element are known, the force applied may be determined from the deformation of the deformable element.

[0016] Furthermore, or alternatively, physical contact and / or swipe motions may be detected by optical sensor elements. For example, the optical properties of a transparent element positioned in front of the optical receiver and / or optical emitter may change upon contact with the transparent element. Here, for example, the transparent element exhibits transparency suitable for the application. For example, the transmittance coefficient of the transparent element is at least 70%, at least 80%, or at least 90%. For example, the transparent element may come into contact with the user's skin. The change in optical properties may be determined by irradiating the transparent element with electromagnetic radiation from the optical emitter and receiving the radiation reflected by the transparent element with the optical receiver. Swipe motions may be detected by evaluating physical contact over time. Swipe motions may be detected by tracking contact over time.

[0017] For example, by detecting physical contact and / or swipe gestures, a sensor module can enable user interaction. That is, by swiping or touching the sensor module, the user may execute an input command. For example, if the sensor module is integrated into a mobile device, the user may be able to activate certain functions of the device. That is, for example, the user may be able to control the volume or switch the mobile device on / off by swiping.

[0018] Furthermore, or alternatively, the distance to the object and / or the object's velocity may be obtained by an optical sensor module. For example, distance and / or velocity may be obtained by time-of-flight measurement. Alternatively, distance and / or velocity may be obtained by LIDAR (Light Detection and Ranging) method. In this case, the optical sensor module functions as a LIDAR sensor.

[0019] As yet another alternative, distance and / or velocity may be acquired by the Self-Mixing Interferometry (SMI) method. In this case, the optical sensor element may function as an SMI sensor, and preferably at least one optical emitter also functions as an optical receiver. This optical emitter is specifically a laser, such as a Vertical Cavity Surface Emitting Laser (VCSEL). In such a measurement setup, the SMI signal is recorded, in particular, when the laser beam emitted from the optical emitter, i.e., laser radiation, strikes the object and the object scatters and at least partially reflects the laser radiation. The laser radiation preferably has wavelengths in the infrared wavelength range of the electromagnetic spectrum. The scattered radiation component is sent back to the emitter and superimposed on the existing field, i.e., the radiation of the laser beam, modulating the amplitude and frequency of the laser. In this example, the SMI signal is acquired by observing the voltage of the laser or the output power of the photodiode. The SMI signal includes, in particular, interference fringes. For example, the distance and / or velocity of an object can be obtained by evaluating the beat frequency of interference fringes or by other suitable methods.

[0020] By measuring the distance and / or velocity of the object, for example using the SMI method, proximity, physical contact, and / or swipe motion may also be detected.

[0021] In at least one embodiment, the sensor module comprises an optical sensor element and an evaluation circuit. The optical sensor element comprises at least one optical emitter and at least one optical receiver. The optical sensor element is configured to communicate non-contact with the optical interface of an electronic device. The optical sensor element is further configured to optically detect at least one sensing parameter. The evaluation circuit is electrically connected to the optical sensor element and is configured to determine at least one sensing parameter.

[0022] The sensor modules described herein are based on the following technical considerations. Currently, all functions, including optical elements such as proximity, biometrics, touch force, swipe, and communication, are separate sensors located at different positions on the wearable device. For example, headphones, earphones, or TWS earbuds currently use proximity sensors to detect whether the earphone body of the headphones or TWS earbuds is inserted into the ear, or whether it is inside or outside the charging case. In particular, power line communication is used as a transceiver between the headphones or TWS earbuds and the charging case. Other sensors, such as vital sensors, touch force sensors, and swipe sensors for volume control, are also separate sensors.

[0023] The sensor module described herein employs the idea of ​​integrating multiple functions into a single module. Specifically, the sensor module is configured to acquire at least one sensing parameter while simultaneously communicating optically with further electronic devices. Therefore, it is preferable that at least one optical emitter and at least one optical receiver are shared by multiple functions. That is, the optical emitter and optical receiver are used to perform optical communication and optical detection of at least one sensing parameter, possibly simultaneously.

[0024] In contrast to sensor modules where a separate sensor is provided for each function, the sensor module described herein significantly reduces costs, particularly by integrating multiple functions into a single module. Furthermore, because these functions are all individual, they can be executed in a time-divided manner during the operation of the sensor module. A further advantage is that the sensor module described herein is smaller than conventional solutions where a separate sensor is provided for each function. Also, by integrating multiple functions into a single sensor module as described herein, power consumption can be significantly reduced, particularly in the idle mode of the device into which the sensor module is integrated. Additionally, non-contact, i.e., optical communication between the sensor module and the electronic device can reduce the environmental impact on communication. For example, electrical contact surfaces used to connect the portable device with the sensor module to the electronic device can be omitted. Since such electrical contact surfaces can change over time due to environmental influences, dust, and dirt, non-contact communication has the advantage of providing a particularly robust communication channel between the portable device with the sensor module and the electronic device.

[0025] According to at least one embodiment of the sensor module, the optical emitter is a light-emitting diode or laser diode. The optical receiver is preferably a photodiode. For example, the optical emitter is a VCSEL. By using a light-emitting diode or laser diode for the optical emitter and a photodiode for the optical receiver, the sensor element can be manufactured in a cost-effective manner while being miniaturized.

[0026] According to at least one embodiment of the sensor module, the optical emitter is a micro-LED.

[0027] In a broad sense, a microLED can be considered any light-emitting diode (LED) (generally not a laser) that is particularly small in size.

[0028] As a principle, and this is a very important criterion in addition to size, since the growth substrate is removed from the micro-LED, the typical height of such a micro-LED is, for example, in the range of 1.5 μm to 10 μm.

[0029] In principle, a micro-LED does not necessarily have to have a rectangular light-emitting exit surface. Generally, for example, an LED can have a light-emitting exit surface where any lateral range of the light-emitting exit surface is 100 μm or less, 70 μm or less, or 1.5 μm or less when viewing the layer of the laminate in a plan view.

[0030] For example, in the case of a rectangular micro-LED, it is often cited as a criterion that the side length when viewing the layer of the laminate in a plan view is 70 μm or less, 50 μm or less, or 1.5 μm or less.

[0031] In most cases, such micro-LEDs are provided on a wafer with a holding structure that can be removed non-destructively with respect to the μLEDs.

[0032] Currently, micro-LEDs are mainly used in displays. Micro-LEDs form pixels or sub-pixels and emit light of a specified color. Due to the high density with a small pixel size and a close pitch, micro-LEDs are particularly suitable for small monolithic displays for AR applications, especially data glasses. In addition, other applications are being developed, particularly with regard to use in data communication or pixelated lighting applications.

[0033] The notation of micro-LEDs can be seen in related literature, for example, notations such as μLED, μ-LED, uLED, u-LED, or micro light-emitting diode.

[0034] According to at least one embodiment, the sensor module includes one optical receiver dedicated to communication with an electronic device. The sensor module further includes a laser diode configured as an emitter and a receiver for optically measuring at least one sensing parameter. That is, the optical receiver dedicated to communication with the electronic device is not used for acquiring a parameter signal for determining the sensing parameter. The optical emitter, preferably a laser diode, is configured for communication with the electronic device and for acquiring the sensing parameter. The laser diode is further configured as an optical receiver for acquiring the sensing parameter.

[0035] Specifically, the detection parameters are obtained during operation by the SMI method. That is, the optical emitter, which is a laser diode, functions as an SMI sensor. Preferably, the laser diode is a VCSEL. The laser diode acquires an SMI signal as a parameter signal as described above, which is preferably evaluated in an evaluation circuit to determine the detection parameters.

[0036] According to at least one embodiment, the evaluation circuit and the optical sensor module are monolithically integrated with each other. Specifically, the optical sensor module and the evaluation circuit are part of a single common die. For example, the optical sensor module and the evaluation circuit are manufactured using a common manufacturing process. This common manufacturing process is, for example, a complementary metal-oxide-semiconductor (CMOS) process. That is, in this case, the evaluation circuit is preferably based on a semiconductor material. For example, the common die for the optical sensor element and the evaluation circuit is an ASIC or FPGA. An advantage is that when the evaluation circuit and the optical sensor module are monolithically integrated with each other, the sensor module can be particularly miniaturized.

[0037] According to at least one embodiment, the evaluation circuit comprises at least one circuit element separate from the optical sensor element. This at least one circuit element is configured to determine at least one sensing parameter and / or drive the optical sensor element. By using separate circuit elements for the sensing parameter and / or for driving the optical sensor element, the sensor module can be configured in a predetermined variable manner. In addition, even if one of the circuit elements malfunctions, other functions of the sensor module can continue to operate.

[0038] According to at least one embodiment, the evaluation circuit comprises a plurality of circuit elements. A first circuit element is configured to drive an optical sensor element. Specifically, the first circuit element is configured to control optical communication between the sensor module and the electronic device. A second circuit element is configured to determine at least one sensing parameter. In particular, these circuit elements are distinct from one another. That is, the first circuit element is a drive and / or control unit for the optical sensor element. For example, if the sensor module acquires a plurality of sensing parameters, the evaluation circuit may comprise a separate circuit element for acquiring each sensing parameter. For example, each circuit element may be an ASIC or FPGA. In this embodiment, the sensor module may be a system-on-a-chip (SoC).

[0039] According to at least one embodiment, the sensor module includes a cover plate positioned downstream of the optical emitter. The cover plate is preferably transparent to radiation emitted by the emitter and / or radiation received by the receiver. Here, for example, a transparent element exhibits a transmittance suitable for the application. For example, the transmittance coefficient of the transparent element is at least 70%, at least 80%, or at least 90%. Alternatively, for example for a particular application, the cover plate may have a transmittance of up to 5%, up to 10%, or up to 20%. Specifically, the cover plate protects the emitter and / or receiver from environmental influences, such as dust. Preferably, the cover plate does not affect, or essentially does not affect, the radiation emitted by the emitter and / or radiation received by the receiver.

[0040] When the optical sensor element functions as a force sensor, the cover plate can be used as a deformable element.

[0041] Furthermore, if the optical sensor module functions as a physical contact and / or swipe sensor, physical contact with the cover plate can be established.

[0042] Furthermore, an assembly is described. The assembly comprises, in particular, a sensor module as described herein. That is, all features disclosed for the sensor module are also disclosed for the assembly, and vice versa.

[0043] According to at least one embodiment of the assembly, the assembly comprises a sensor module described herein and an electronic device having an optical interface. The optical interface comprises at least one interface emitter and at least one interface receiver. The optical sensor element of the sensor module and the optical interface of the electronic device are configured to communicate with each other non-contactually. For example, the optical interface is a counterpart to the optical sensor element. Thus, the optical interface may have essentially the same characteristics as the optical sensor element with respect to its communication function. That is, if the optical sensor element functions as a transceiver, the optical interface may have essentially the same characteristics as the optical sensor element. Specifically, the optical interface functions as a transceiver.

[0044] Preferably, the optical sensor element and the optical interface are aligned for optical communication. Specifically, this means that radiation emitted by the optical sensor element during operation is received by the optical interface, and radiation emitted by the optical interface is received by the optical sensor element, preferably in a substantially distortion-free manner.

[0045] In particular, the optical interface may comprise at least one interface emitter and at least one interface receiver. The configuration, functionality, and effects of the interface emitter and interface receiver may be the same as those of the optical emitter and optical receiver of the optical sensor element.

[0046] Furthermore, the optical interface can be further configured to determine at least one detection parameter. This is advantageous, for example, if the electronic device is a smartphone. Specifically, the determination of at least one detection parameter is performed in a similar manner to the determination of at least one detection parameter by the sensor module.

[0047] According to at least one embodiment of the assembly, the electronic device comprises a driver circuit configured to control an optical interface. For example, the driver circuit is an ASIC, FPGA, or microcontroller.

[0048] If the optical interface is also configured to determine the sensing parameters, the drive circuit can perform an evaluation to acquire those parameters. In this sense, the drive circuit may have similar characteristics to the evaluation circuit of the sensor module.

[0049] According to at least one embodiment of the assembly, the drive circuit and the optical interface are monolithically integrated with each other; that is, the optical interface of the drive circuit is part of a common die. Preferably, the optical interface and the drive circuit are manufactured in a common manufacturing process.

[0050] According to at least one embodiment of the assembly, the optical interface of the electronic device and the optical sensor element of the sensor module are configured exclusively for optical communication. Specifically, this means that during intended operation, no other wireless connections other than optical interaction are made between the optical interface and the optical sensor element.

[0051] According to at least one embodiment of the assembly, the sensor module and the electronic device are galvanically isolated from each other; that is, the sensor module and the electronic device are not electrically connected to each other. Specifically, a galvanically isolated channel is established between the sensor module and the electronic device for communication between the optical sensor element and the optical interface.

[0052] Furthermore, a method for operating the sensor module is described. This method is particularly suitable for operating the sensor module described herein. That is, all features disclosed for the sensor module are also disclosed for the method, and vice versa.

[0053] According to at least one embodiment of the method, the optical sensor element operates in two operating states. In a first operating state, the sensor module optically detects at least one sensing parameter. In the first operating state, the method includes the steps of emitting primary radiation by at least one optical emitter of the optical sensor element and receiving secondary radiation by at least one optical receiver of the optical sensor element. The primary radiation may include modulation. Modulation may be applied by an evaluation circuit. For example, modulation may be applied by a circuit element of an evaluation circuit configured to drive the optical sensor element.

[0054] Secondary radiation arises from primary radiation as a result of the sensor joule's interaction with the surrounding environment. The primary and / or secondary radiation are then evaluated by an evaluation circuit to obtain at least one sensing parameter. In particular, the interaction between the primary radiation and the surrounding environment depends on the sensing parameter. For example, if the sensing parameter is distance or a swipe motion, the secondary radiation is the reflected and / or scattered radiation of the primary radiation. Specifically, in a first operating state, the sensor module functions as a sensor for obtaining at least one sensing parameter.

[0055] Multiple detection parameters can be acquired simultaneously. This allows the sensor module to emit and receive primary and / or secondary radiation with different optical properties depending on the acquired detection parameters.

[0056] In a second operating state, the sensor module communicates non-contact with the optical interface of an electronic device located near the sensor module. In the second operating state, the method includes the steps of emitting primary radiation by at least one emitter of the optical sensor element and receiving primary radiation by at least one interface receiver of the optical interface. Primary radiation may include modulation. Modulation may be applied by an evaluation circuit. For example, modulation is applied by a circuit element of an evaluation circuit configured to drive the optical sensor element. The primary radiation received by the optical interface is then evaluated by a drive circuit of the electronic device.

[0057] Furthermore, the method in the second operating state includes the steps of emitting tertiary radiation by at least one interface emitter of the optical interface and receiving the tertiary radiation by at least one receiver of the optical sensor element. The tertiary radiation may include modulation. Modulation may be applied by a drive circuit. The tertiary radiation received by the optical sensor element is then evaluated by an evaluation circuit. For example, the steps of emitting and receiving primary radiation and imaging and receiving tertiary radiation may be performed at least partially simultaneously. Similarly, the steps of evaluating primary and tertiary radiation may be performed at least partially simultaneously.

[0058] The optical sensor element emits primary radiation and receives tertiary radiation, and the optical interface emits tertiary radiation and receives primary radiation, thereby enabling communication between the optical interface and the optical sensor module. For example, information data may be exchanged by modulation of the primary and / or tertiary radiation. In particular, this communication is dedicated to optical communication. Specifically, in this case, both the optical sensor module and the optical interface function as transceivers.

[0059] Furthermore, a wearable device is defined. The wearable device comprises a sensor module as described herein. That is, all features disclosed for the sensor module are also disclosed for the wearable device, and vice versa.

[0060] Further advantages and favorable embodiments and developments of the sensor module, assembly, method for operating the sensor module, and wearable device will become apparent from the following exemplary embodiments shown in conjunction with the schematic diagrams. Identical elements, similar elements, or elements having the same effect are denoted by the same reference numeral in the figures. The proportions of the figures and the elements shown therein should not be taken as to scale. Rather, individual elements may be shown larger than they actually are for better representation and / or better understanding. [Brief explanation of the drawing]

[0061] [Figure 1] A schematic block diagram of an assembly and sensor module described herein according to an exemplary embodiment is shown. [Figure 2] A schematic block diagram of an assembly and sensor module described herein according to an exemplary embodiment is shown. [Figure 3] A schematic block diagram of a sensor module described herein according to an exemplary embodiment is shown. [Figure 4] Figures of assemblies and wearable devices described herein according to exemplary embodiments are shown. [Figure 5] This illustrates the detection of a swipe motion by the sensor module described herein according to an exemplary embodiment. [Modes for carrying out the invention]

[0062] Figure 1 shows a schematic block diagram of an assembly comprising the electronic device 100 and optical sensor element 1 described herein, according to an exemplary embodiment. The sensor module 1 comprises an optical sensor element 2. In an exemplary embodiment, the optical sensor element 2 comprises two optical emitters 21 and an optical receiver 22. The optical emitters 21 are light-emitting diodes or laser diodes. The optical receiver 22 is a photodiode.

[0063] The optical emitter 21 comprises a semiconductor layer sequence, each having an active region. During operation, electromagnetic radiation is generated in the active regions and emitted by the emitter 21. Preferably, electromagnetic radiation in the IR wavelength range of the electromagnetic spectrum is generated in the active regions. The optical receiver 22 comprises a semiconductor layer sequence, each having an active region. During operation, the active regions of the receiver 22 are configured to receive electromagnetic radiation. For example, the active regions of the receiver 22 are configured to receive electromagnetic radiation in the IR wavelength range.

[0064] The sensor module 1 further includes an evaluation circuit 3. The evaluation circuit 3 includes a first circuit element 31 and a second circuit element 32. The first circuit element 31 is configured to drive the optical sensor module 2 and is electrically connected to the optical sensor element 2 via a plurality of connecting wires. The second circuit element 32 is connected to the optical sensor element 2 via a plurality of connecting wires.

[0065] The optical sensor element 2 is configured to determine detection parameters. In this exemplary embodiment, the optical sensor element 2 is configured to determine proximity and / or biofunction. Specifically, proximity and / or biofunction are optically acquired by the emitter 21 and receiver 22 in a first operating state of the sensor module 1. This causes primary radiation 5 to be emitted by the optical emitter 21. The primary radiation is reflected by the object as secondary radiation 6, which is optically received by the receiver 22.

[0066] In particular, the parameter signal is generated by the optical sensor element 2 from the primary radiation 5 and / or secondary radiation 6. The parameter signal is transferred to a second circuit element 32 via a connecting line. The second circuit element 32 is configured to evaluate the parameter signal and acquire detection parameters, namely proximity and / or biological function.

[0067] In this exemplary embodiment, the optical sensor element 2, the first circuit element 31, and the second circuit element 32 are separate components. For example, the sensor module 1 is a system-on-chip. The optical sensor element 2, the first circuit element 31, and the second circuit element 32 may each be formed in an ASIC or the like.

[0068] For example, sensor module 1 is part of a portable device, such as a wearable device 200.

[0069] The electronic device 100 may be a portable device into which the sensor module 1 is incorporated. The electronic device 100 may be a charging device for a portable device, etc.

[0070] The electronic device 100 comprises an optical interface 110 and a drive circuit 120. The optical interface 110 comprises two optical interface emitters 111 and an optical interface receiver 112. The interface emitters 111 and the interface receiver 112 may have the same characteristics and / or the same functionality as emitters 21 and receiver 22, respectively. The drive circuit 120 is configured to drive and control the optical interface 110. Thus, the drive circuit 20 is electrically connected to the optical interface 110 by connecting wires.

[0071] In the second operating state, the optical sensor element 2 and the optical interface 110 communicate with each other. That is, in this case, both the optical sensor element 2 and the optical interface 110 function as transceivers.

[0072] In the second operating state, at least one of the optical emitters 21 emits primary radiation 5, which is received by the interface receiver 112. The primary radiation 5 received by the interface receiver 112 is evaluated by the drive circuit 120. For example, the primary radiation 5 includes modulation. Next, tertiary radiation 7 is emitted by at least one of the interface emitters 111. The tertiary radiation 7 is detected by the optical receiver 22 and evaluated by the evaluation circuit 3, specifically the first circuit element 31. The tertiary radiation 7 may also include modulation. By interacting with the primary radiation 5 and the tertiary radiation 7, communication between the sensor module 1 and the electronic device 100 becomes possible. In particular, this communication is dedicated to optical communication. For example, the state of the electronic device 100 and / or the state of the device into which the sensor module 1 is incorporated is communicated. The state communicated is, for example, the state of the battery.

[0073] In contrast to Figure 1, Figure 2 shows an exemplary embodiment in which the optical sensor element 2 and the evaluation circuit 3 are monolithically integrated with each other. That is, the optical sensor element 2 and the evaluation circuit 3 are part of a common die. The common die is, for example, an ASIC or FPGA.

[0074] Similarly, in the exemplary embodiment shown in Figure 2, the optical interface 110 and the drive circuit 120 are monolithically integrated with each other.

[0075] Unlike Figures 1 and 2, the optical sensor element 2 and the evaluation circuit 3 are integrated with each other, and the optical interface 110 and the drive circuit 120 are separate, or vice versa.

[0076] Figure 3 shows a sensor module 1 according to a further exemplary embodiment. In contrast to the sensor module 1 in Figure 1, the sensor module 1 according to Figure 3 further comprises a third circuit element 33. The third circuit element 33 is configured to evaluate further detection parameters acquired by the optical sensor module 2. The third circuit element 33 is separate from the first and second circuit elements 31, 32. The third circuit element 33 is, for example, an ASIC.

[0077] Further detection parameters include, for example, the distance to the object and the velocity of the object. For example, the distance to the object and the velocity of the object are measured by the SMI method. That is, at least one of the optical emitters 21 also functions as an optical receiver 22. This optical emitter 21 is preferably a VCSEL. The primary emission 5 is specifically laser radiation, but is emitted by the VCSEL. The object is irradiated with the primary emission 5. At least a portion of the primary emission 5 is reflected by the object as secondary emission 6. The secondary emission 6 is received by the VCSEL, and in the process, the secondary emission 6 overlaps with the primary emission 5. This creates an interference pattern that yields an SMI signal. The SMI signal contains interference fringes, which are evaluated specifically by a third circuit element 33 to obtain the distance and velocity of the object.

[0078] In another embodiment, the sensor module 1 of the exemplary embodiment shown in Figure 3 has the same features, functionality, and effects as the sensor module 1 of Figure 1 and / or Figure 2.

[0079] Figure 4 shows the assembly of the wearable device 200 and the electronic device 100. The wearable device 200 comprises a sensor module 1 according to one of the exemplary embodiments described above. The wearable device 200 is headphones or TWS earbuds.

[0080] The electronic device 100 includes an optical interface 110 according to one of the exemplary embodiments described above, the optical interface 110 functioning as a counterpart to the sensor module 1 of the wearable device 200. The electronic device 100 is a charging case for headphones or TWS earbuds 200.

[0081] Figure 5 shows the detection of a swipe motion 310 by user 300. User 300 swipes on the cover plate 4 of sensor module 1. Sensor module 1 comprises an optical sensor element 2 similar to the optical sensor module 2 in the exemplary embodiment of Figure 3. In contrast to the exemplary embodiment of Figure 3, sensor module 2 in Figure 5 comprises two emitters 21 that also function as receivers 22. The emitters 21 are VCSELs. The swipe motion 310 is detected by the SMI method. The SMI method is performed in the same manner as described in Figure 3.

[0082] Each emitter 21 detects the user 300's finger swiping the cover plate 4 over time. The swipe direction 310 may be determined by evaluating the distance and / or speed of the finger.

[0083] The present invention is not limited to the description based on the exemplary embodiments described above. Rather, the present invention encompasses any novel features and any combination of features, including, in particular, any combination of features in the claims and any combination of features in the exemplary embodiments, even if such features or combinations themselves are not expressly defined in the claims or exemplary embodiments.

[0084] This application claims priority to German Patent Application No. 102023119283.3, the disclosures thereof of which are incorporated herein by reference. [Explanation of Symbols]

[0085] 1 Sensor Module 2 Optical sensor elements 3. Evaluation Circuit 4 Cover plate 5. Primary radiation 6. Secondary radiation 7 Tertiary radiation 21 Optical emitter 22 Optical Receivers 31 First circuit element 32 Second circuit element 100 Electronic Devices 110 Optical Interface 111 Interface Emitter 112 Interface Receiver 120 Drive Circuit 200 wearable devices 300 users 310 Swipe direction

Claims

1. Sensor module (1), Optical sensor element (2), The system includes an evaluation circuit (3), The optical sensor element (2) comprises at least one optical emitter (21) and at least one optical receiver (22), The optical sensor element (2) is The optical interface (110) of the electronic device (100) communicates with the electronic device (100) in a contactless manner. The optical emitter (21) and the optical receiver (22) are configured to optically detect at least one sensing parameter, and perform optical communication to the electronic device (100) and optical detection of the at least one sensing parameter. The evaluation circuit (3) is electrically connected to the optical sensor element (2) and is configured to determine the at least one detection parameter. Sensor module (1).

2. The sensor module (1) according to claim 1, wherein the at least one detection parameter is at least one of proximity, bio-function, touch force, physical contact, swipe motion, distance to the object, and speed of the object.

3. The sensor module (1) according to claim 1 or 2, wherein the optical emitter (21) is a light-emitting diode or a laser diode, and the optical receiver (22) is a photodiode.

4. The sensor module (1) according to claim 3, wherein the optical emitter (21) is a micro LED.

5. The sensor module (1) includes one optical receiver (22) dedicated to communication with the electronic device (100), The sensor module (1) according to any one of claims 1 to 4, comprising a laser diode configured as the emitter (21) and a receiver (22) for optically measuring the at least one detection parameter.

6. The sensor module (1) according to any one of claims 1 to 5, wherein the evaluation circuit (3) and the optical sensor module (2) are monolithically integrated with each other.

7. The evaluation circuit (3) comprises at least one circuit element (31, 32) separate from the optical sensor element (2), The sensor module (1) according to any one of claims 1 to 5, wherein the at least one circuit element (31, 32) is configured to determine the at least one detection parameter and / or drive the optical sensor element (2).

8. It comprises multiple circuit elements (31, 32), The first circuit element (31) is configured to drive the optical sensor element (2), The sensor module (1) according to claim 7, wherein the second circuit element (32) is configured to determine the at least one detection parameter.

9. The sensor module (1) includes a cover plate (4) positioned downstream of the optical emitter (21), The sensor module (1) according to any one of claims 1 to 8, wherein the cover plate (4) is transparent to radiation emitted by the optical emitter (21) and / or radiation received by the optical receiver (22).

10. An assembly comprising a sensor module (1) according to any one of claims 1 to 9 and an electronic device (100) having an optical interface (110), The optical interface (110) comprises at least one interface emitter (111) and at least one interface receiver (112), The optical sensor element (2) of the sensor module (1) and the optical interface (110) of the electronic device (100) are configured to communicate with each other without contact. assembly.

11. The assembly according to claim 10, wherein the electronic device (100) comprises a drive circuit (120) configured to control the optical interface (110).

12. The assembly according to claim 11, wherein the drive circuit (120) and the optical interface (110) are monolithically integrated with each other.

13. The assembly according to any one of claims 10 to 12, wherein the optical sensor element (2) of the sensor module (1) and the optical interface (110) of the electronic device (100) are configured exclusively for optical communication.

14. The assembly according to any one of claims 10 to 13, wherein the sensor module (1) and the electronic device (100) are galvanically insulated from each other.

15. A method for operating a sensor module (1) having an optical sensor element (2), wherein the method includes two operating states. In the first operating state, the sensor module (1) optically detects at least one detection parameter, and the operation in the first operating state is, The steps include: emitting primary radiation (5) through at least one optical emitter (21) of the optical sensor element (2); The step of receiving a secondary radiation (6) by at least one optical receiver (22) of the optical sensor element (2), wherein the secondary radiation (6) arises from the primary radiation (5) as a result of the interaction of the sensor module (1) with the surrounding environment, To obtain the aforementioned at least one detection parameter, the evaluation circuit (3) evaluates the primary emission (5) and / or the secondary emission (6), Includes, In the second operating state, the sensor module (1) communicates non-contact with the optical interface (110) of an electronic device (100) located near the sensor module (1), and the operation in the second operating state is as follows: The steps include: emitting the primary radiation (5) through at least one emitter (21) of the optical sensor element (2); The steps include receiving the primary radiation (5) by at least one interface receiver (122) of the optical interface (110), The driving circuit (120) of the electronic device (100) evaluates the primary radiation (5) received by the optical interface (110), The steps include: emitting tertiary radiation (7) through at least one interface emitter (111) of the optical interface (110); The steps include receiving the tertiary radiation (7) with at least one receiver (22) of the optical sensor element (2), The evaluation circuit (3) performs the step of evaluating the tertiary radiation (7) received by the optical sensor element (2), Methods that include...

16. A wearable device (200) comprising a sensor module (1) according to any one of claims 1 to 9.

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