Relay Device

Abstract

To provide a relay device capable of effectively improving the reliability of a product. The relay device according to the present invention includes a substrate, an upper electrode, a switch element, a buffer layer, and a module package. The substrate has a top surface. The top electrode is disposed on the top surface. The switch element is bonded to the top electrode by a welding layer. The buffer layer is disposed on the top surface. The module package encapsulates the switch element. The buffer layer covers a first portion of the top electrode.

Description

[Technical field]

[0001] The present invention relates to a relay device. [Background technology]

[0002] When manufacturing relay devices, the mold used in the packaging process applies pressure to the components on the top surface of the board, which can easily reduce product reliability, making it very difficult to improve the above-mentioned problem. Summary of the Invention [Problem to be solved by the invention]

[0003] When manufacturing relay devices, the molds used in the packaging process apply pressure to the components on the top surface of the board, which can easily reduce product reliability. [Means for solving the problem]

[0004] The present invention provides a relay device, which can effectively improve the reliability of products.

[0005] The relay device according to the present invention includes a substrate, an upper electrode, a switch element, a buffer layer, and a module package. The substrate has a top surface. The top electrode is disposed on the top surface. The switch element is bonded to the top electrode by a welding layer. The buffer layer is disposed on the top surface. The module package encapsulates the switch element. The buffer layer covers a first portion of the top electrode.

[0006] In one embodiment of the present invention, the upper electrode includes a second portion opposite to the first portion, the first portion being located outside the upper surface, and the second portion being located inside the upper surface.

[0007] In one embodiment of the invention, the width of the second portion is greater than or equal to 0.15 mm and less than or equal to 0.3 mm.

[0008] In one embodiment of the present invention, the welding layer is sandwiched between the switch element and the buffer layer.

[0009] In one embodiment of the present invention, the weld layer and the buffer layer are in direct contact with each other.

[0010] In one embodiment of the present invention, the weld layer is enclosed within a buffer layer.

[0011] In one embodiment of the present invention, the edge of the module package directly contacts the buffer layer.

[0012] In one embodiment of the present invention, the substrate further comprises a notch, the switch element is disposed in the notch, and the buffer layer and the notch are spaced apart.

[0013] In one embodiment of the present invention, the buffer layer is a closed ring.

[0014] In one embodiment of the present invention, the thickness of the buffer layer is between 0.1 mm and 0.3 mm. Effect of the Invention

[0015] In view of the above, the present invention introduces a buffer layer design to give the buffer layer the function of absorbing stress, which can alleviate the pressure generated by the mold during the packaging process and reduce the adverse effects on the upper electrode during the packaging process. At the same time, the buffer layer can also improve the overflow phenomenon of the welding layer, effectively improving the reliability of the product.

[0016] In order to make the above features and advantages of the present invention clearer and easier to understand, the following detailed description is given by way of example in conjunction with the accompanying drawings, of the following specific embodiments. [Brief description of the drawings]

[0017] [Figure 1] 1 is a schematic perspective view of a relay device according to some embodiments of the present invention; [Diagram 2] FIG. 2 is a partial schematic three-dimensional view of the relay device of FIG. 1; [Diagram 3] 3 is a partial side schematic view of the relay device of FIG. 2 according to some embodiments. [Figure 4] FIG. 3 is a schematic partial cross-sectional view taken along line AA of FIG. 2 according to some embodiments. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Some of the embodiments of the present invention will be described in detail with reference to the accompanying drawings. When the same reference numerals appear in different drawings, they are regarded as the same or similar components. These embodiments are merely a part of the present invention and do not disclose all possible implementation methods of the present invention. Rather, these embodiments are merely examples within the scope of the application of the present invention.

[0019] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

[0020] Directional terms used herein (e.g., up, down, right, left, front, back, top, bottom) are used for illustration reference only and are not intended to imply absolute directions.

[0021] Figure 1 is a schematic three-dimensional view of a relay device according to some embodiments of the present invention. Figure 2 is a partial three-dimensional schematic view of the relay device of Figure 1, where some components of Figure 1 are omitted for clarity. Figure 3 is a partial side schematic view of the relay device of Figure 2 according to some embodiments, e.g., viewed along direction D of Figure 2. Figure 4 is a partial cross-sectional schematic view along line AA of Figure 2 according to some embodiments.

[0022] 1 to 4, in this embodiment, the relay device 100 includes a substrate 110, an upper electrode 120, a side conductive layer 130, and a lower electrode (not shown), in which the substrate 110 has a top surface 110t and a bottom surface 110b facing each other and a plurality of side walls (e.g., an inner wall 111a and an outer wall 111b facing the inner wall 111a) connecting the top surface 110t and the bottom surface 110b, the upper electrode 120 is provided on the top surface 110t, the side conductive layer 130 is provided on the outer wall 111b, and the lower electrode is provided on the bottom surface 110b. Here, the substrate 110 may be a ceramic substrate, bakelite, or any suitable insulating board that can withstand subsequent high temperature processes (e.g., withstand welding temperatures).

[0023] Furthermore, the relay device 100 includes a switch element 140, a buffer layer 150, and a module package 160, among which the switch element 140 is bonded onto the upper electrode 120 by a welding layer 170 (part of the switch element 140 is covered, and is shown by a dotted line in FIG. 1), the buffer layer 150 is provided on the upper surface 110t, and the module package 160 seals the switch element 140. Furthermore, the buffer layer 150 covers the first portion 120a of the upper electrode 120. Thus, the present invention introduces a design of the buffer layer 150 to give the buffer layer 150 a function of absorbing stress, which can relieve the pressure generated by the mold during the packaging process and reduce the adverse effects on the upper electrode 120 during the packaging process, and at the same time, the buffer layer 150 can improve the overflow phenomenon of the welding layer 170, which can effectively improve the reliability of the product.

[0024] In this embodiment, as shown in Figures 3 and 4, the upper electrode 120 is formed (e.g., by electroplating) on ​​the upper surface 110t of the substrate 110, so that the upper surface 110t becomes an uneven surface with projections and recesses. This uneven surface makes it easy for adhesive to overflow when the module package 160 is molded, which also affects the reliability of the product. Therefore, in this invention, the compressive elasticity of the buffer layer 150, which is in direct contact with part of the upper surface 110t of the substrate 110, is conformally formed on the upper electrode 120, so that the overflow of adhesive caused by the uneven surface can be reliably improved; however, the invention is not limited thereto.

[0025] In some embodiments, the upper electrode 120 includes a second portion 120b opposite to the first portion 120a, where the first portion 120a is located outside the upper surface 110t and the second portion 120b is located inside the upper surface 110t, for example, the outside of the upper surface 110t is close to the outer wall 111b of the substrate 110 and the inside of the upper surface 110t is close to the inner wall 111a of the substrate 110, and this design allows the edge of the module package 160 to directly contact the buffer layer 150 without the welding layer 170 flowing out onto or even down the edge of the upper surface 110t of the substrate 110, thereby reducing the defect rate during the formation of the edge of the module package 160.

[0026] For example, the welding layer 170 may be sandwiched between the switch element 140 and the buffer layer 150, and the welding layer 170 may extend over the upper electrode 120 exposed to the buffer layer 150, so that the welding layer 170 can be in direct contact with the buffer layer 150. When the buffer layer 150 covers the first portion 120a located outside the upper surface 110t of the upper electrode 120, the welding layer 170 can be reliably confined within the buffer layer 150, but the present invention is not limited thereto.

[0027] In some embodiments, as shown in FIG. 2, the width W1 of the first portion 120a of the upper electrode 120 (the portion covered by the buffer layer 150) is 0.1 millimeters (mm) or more and 0.3 millimeters or less, and the width W2 of the second portion 120b (the portion exposed to the buffer layer 150) is 0.15 millimeters or more and 0.3 millimeters or less, although the present invention is not limited thereto.

[0028] In some embodiments, the substrate 110 further includes a notch 111, the switch element 140 is disposed within the notch 111, and the buffer layer 150 and the notch 111 are spaced apart (the buffer layer 150 does not extend to the notch 111), wherein the switch element 140 further includes a switch 141 and a coil 142 (e.g., a group of coils) disposed thereon, e.g., the switch 141 is bonded onto the upper electrode 120, such that the switch 141 and the coil 142 are electrically connected to a control terminal by the upper electrode 120, the side conductive layer 130 and the lower electrode, and / or connected to a printed circuit board (PCB) or the like.

[0029] In some embodiments, the buffer layer 150 is a closed ring, and the buffer layer 150 surrounds the switch element 140 and the weld layer 170, which can further improve overflow, although the invention is not limited in this respect.

[0030] In some embodiments, the thickness 150T of the buffer layer 150 is 0.1 mm to 0.3 mm, the thickness 120T of the upper electrode 120 is 0.005 mm to 0.05 mm, the thickness 100T of the relay device 100 is 3.4 mm to 3.8 mm, and the thickness 110T of the substrate 110 is 1.7 mm to 1.9 mm, but the present invention is not limited thereto. Here, the buffer layer 150 in the embodiment of Fig. 3 can be formed by coating and has a non-uniform thickness (the above range can be the maximum thickness 150T) based on the fluidity of the material, but the present invention is not limited thereto, and the buffer layer 150 in the embodiment of Fig. 4 can be in the form of an adhesive film pasted, so it has a uniform thickness.

[0031] In some embodiments, the buffer layer 150 is made of a liquid or thin film solder mask or other suitable soft material, while the module package 160 is made of a suitable molding material and the welding layer 170 is made of a suitable solder material, although the invention is not limited thereto.

[0032] In some embodiments, the buffer layer 150 is only provided on the top surface 110t of the substrate 110, but the present invention is not limited thereto, and the buffer layer 150 may further be provided on other surfaces (such as the outer wall 111b and / or the bottom surface 110b) according to actual design needs.

[0033] To sum up, the present invention introduces a buffer layer design to give the buffer layer the function of absorbing stress, which can relieve the pressure generated by the mold during the packaging process and reduce the adverse effects on the upper electrode during the packaging process. At the same time, the buffer layer can also improve the overflow phenomenon of the welding layer, effectively improving the reliability of the product.

[0034] As described above, the present invention has been disclosed through the embodiments, but of course, this is not intended to limit the present invention. As can be easily understood by those skilled in the art, appropriate changes and modifications can naturally be made within the scope of the technical idea of ​​the present invention, and therefore the scope of protection for the utility model right must be determined based on the scope of the utility model claim and its equivalent area. [Industrial Applicability]

[0035] This relates to the field of relay devices. [Explanation of symbols]

[0036] 100 Relay Device 100T, 110T, 120T, 150T thickness 110 Substrate 110t top surface 110b Bottom 111 Notch 111a Inside wall 111b Outside wall 120 Upper electrode 120a Part 1 120b 2nd part 130 Side conductive layer 140 Switching element 141 Switch 142 Coil 150 Buffer Layer 160 module package 170 Welding layer D direction W1, W2 width

Claims

1. a substrate having a top surface; an upper electrode provided on the upper surface; a switch element joined to the upper electrode by a weld layer; a buffer layer provided on the upper surface and covering a first portion of the upper electrode; and a module package that encapsulates the switch element.

2. The relay device of claim 1 , wherein the top electrode includes a second portion opposite the first portion, the first portion being located outside the top surface, and the second portion being located inside the top surface.

3. The relay device of claim 2 , wherein the second portion has a width of at least 0.15 mm and at most 0.3 mm.

4. The relay device of claim 1 , wherein the weld layer is sandwiched between the switch element and the buffer layer.

5. The relay device of claim 1 , wherein the weld layer and the buffer layer are in direct contact.

6. The relay device of claim 1 , wherein the weld layer is encapsulated within the buffer layer.

7. The relay device of claim 1 , wherein an edge of the module package directly contacts the buffer layer.

8. 2. The relay device of claim 1, wherein the substrate further comprises a notch, the switch element is disposed in the notch, and the buffer layer and the notch are spaced apart.

9. The relay device of claim 1 , wherein the buffer layer is a closed ring.

10. The relay device according to claim 1 , wherein the buffer layer has a thickness of 0.1 mm to 0.3 mm.

Images