Diaphragm-type substrate processing equipment

Abstract

A diaphragm type substrate processing apparatus that prevents corrosion of pipes. [Solution] The diaphragm-type substrate processing apparatus according to the present invention is used for placing and processing a circular substrate, and includes a placement table 100, a carrier 200, and an isolation structure. The placement table has a negative pressure chamber 101. The carrier includes an outer frame 210 and a diaphragm 220 installed in the outer frame, and the outer edge of the diaphragm is fixed to the outer frame. The diaphragm is placed on the placement table so as to close the negative pressure chamber, and the diaphragm has a working surface 221, and the working surface is provided with a plurality of through holes 223 penetrating the diaphragm at positions corresponding to the negative pressure chamber. The isolation structure is used for placing the circular substrate, and the isolation structure is protruding from the working surface of the diaphragm so as to arrange the circular substrate at a distance from the working surface of the diaphragm.

Description

[Technical field]

[0001] The present invention relates to a substrate processing apparatus, and more particularly to a leak-proof diaphragm type substrate processing apparatus. [Background technology]

[0002] Conventional substrate processing apparatuses generally have a carrier for carrying the substrate to be processed, and the substrate is placed on a pedestal by the carrier for processing. Negative pressure suction is a means for fixing the substrate, and generally, the carrier has fine holes, and negative pressure is provided by simply arranging a negative pressure pipe at the bottom of the carrier, so that the substrate is adsorbed to the top of the carrier. Summary of the Invention [Problem to be solved by the invention]

[0003] However, in the above-mentioned conventional technology, the substrate and the carrier are in flat contact with each other, so it is difficult to achieve perfect contact. When processing the substrate on the top of the carrier, the chemicals used in the processing process tend to penetrate into the gap between the substrate and the carrier, and further penetrate into the negative pressure pipe at the bottom of the carrier through the pores of the carrier, corroding the negative pressure pipe.

[0004] The present inventor therefore believed that the above-mentioned shortcomings could be improved, and after extensive research, came up with the present invention, which effectively improves the above-mentioned problems through rational design.

[0005] The present invention has been made in view of the above circumstances, and has as its object to provide a diaphragm type substrate processing apparatus. [Means for solving the problem]

[0006] In order to solve the above problems, a diaphragm-type substrate processing apparatus according to one embodiment of the present invention is used for placing and processing a circular substrate, and includes a placement table, a carrier, and an isolation structure. The placement table has a negative pressure chamber. The carrier includes an outer frame and a diaphragm installed within the outer frame, and the outer edge of the diaphragm is fixed to the outer frame. The diaphragm is placed on the placement table to close the negative pressure chamber, and the diaphragm has a working surface, and the working surface is provided with a plurality of through holes penetrating the diaphragm at positions corresponding to the negative pressure chamber. The isolation structure is used for placing the circular substrate, and the isolation structure is protruding from the working surface of the diaphragm so as to position the circular substrate at a distance from the working surface of the diaphragm.

[0007] In the diaphragm-type substrate processing apparatus of the present invention, the top of the isolation structure is disposed along the mounting plane, and the mounting plane is spaced apart from the working surface of the diaphragm.

[0008] In the diaphragm-type substrate processing apparatus according to the present invention, the isolation structure includes a plurality of ring ribs formed integrally with the diaphragm, the ring ribs are provided on the working surface of the diaphragm and are arranged concentrically, and each ring rib has an upper edge, and the upper edges are arranged coplanar to define a mounting plane.

[0009] In the diaphragm type substrate processing apparatus according to the present invention, the ribs include a ring rib, and the through holes are arranged in an area surrounded by the ring rib.

[0010] In the diaphragm type substrate processing apparatus according to the present invention, the ring rib is disposed so as to correspond to the edge of the circular substrate.

[0011] In the diaphragm-type substrate processing apparatus of the present invention, the isolation structure has a plate, the plate is placed on the working surface of the diaphragm, and the supporting plane is defined on the top of the plate.

[0012] In the diaphragm type substrate processing apparatus according to the present invention, the through holes are arranged in an area surrounded by the periphery of the plate.

[0013] In addition, in the diaphragm-type substrate processing apparatus of the present invention, the plate is characterized in that a plurality of channels are drilled at positions corresponding to the through holes, and each channel is respectively connected between the mounting plane and the corresponding through hole.

[0014] In addition, in the diaphragm-type substrate processing apparatus of the present invention, the peripheral edge of the plate is located within the peripheral edge of the circular substrate, and the peripheral edge of the plate is located so as to be spaced apart from the peripheral edge of the circular substrate. Effect of the Invention

[0015] When a circular substrate is processed by the diaphragm type substrate processing apparatus, the circular substrate is placed on the working surface of the diaphragm, and the circular substrate is placed on a placement plane defined by the outer shape of the isolation structure, so that the circular substrate is spaced apart from the working surface. When the circular substrate is processed, the above-mentioned structure prevents the process chemical from passing through the gap between the circular substrate and the working surface of the diaphragm and entering the negative pressure chamber, causing corrosion of the pipes.

[0016] At least the following points will become apparent from the following specification and drawings. [Brief description of the drawings]

[0017] [Figure 1] 1 is a schematic perspective view showing a diaphragm-type substrate processing apparatus according to a first embodiment of the present invention; [Diagram 2]1 is a top view showing a diaphragm type substrate processing apparatus according to a first embodiment of the present invention; [Diagram 3] 1 is a cross-sectional view showing a diaphragm-type substrate processing apparatus according to a first embodiment of the present invention; [Figure 4] FIG. 4 is a partially enlarged view of FIG. [Diagram 5] 10 is a schematic perspective view of a diaphragm-type substrate processing apparatus according to a second embodiment of the present invention; FIG. [Figure 6] FIG. 4 is a top view showing a diaphragm type substrate processing apparatus according to a second embodiment of the present invention. [Figure 7] 4 is a cross-sectional view showing a diaphragm-type substrate processing apparatus according to a second embodiment of the present invention. [Figure 8] FIG. 8 is a partially enlarged view of FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Hereinafter, the present invention will be described with reference to the drawings. Note that the present invention is not limited to the following embodiment, and various forms may be adopted as long as they fall within the technical scope of the present invention.

[0019] Incidentally, in this specification, terms indicating orientations or positional relationships, such as "front", "rear", "left side", "right side", "front end", "rear end", "end", "longitudinal", "lateral", "vertical", "top", and "bottom", are used merely for the convenience and brevity of the description of the present invention based on the orientations or positional relationships shown in the accompanying drawings, and are not intended to indicate or imply that the specified devices or components have a specific orientation, structure, or operation, and should not be construed as limitations on the present invention.

[0020] As used herein, and unless otherwise defined, terms such as "substantially" and "about" are used to describe and account for small variations. When linked to an event or circumstance, the term includes the exact time that the event or circumstance occurred, as well as the close approximation of the time that the event or circumstance occurred. For example, when linked to a numerical value, the term includes a variation range of ±10% or less of the numerical value, such as ±5% or less, ±4% or less, ±3% or less, ±2% or less, ±1% or less, ±0.5% or less, ±0.1% or less, and ±0.05% or less.

[0021] The detailed description and technical contents of the present invention will be described below in conjunction with the drawings. However, the attached drawings are only used for explanation purposes and are not intended to limit the present invention.

[0022] <First Example> Fig. 1 is a schematic perspective view of a diaphragm type substrate processing apparatus according to a first embodiment of the present invention. Fig. 2 is a top view of a diaphragm type substrate processing apparatus according to a first embodiment of the present invention. Fig. 3 is a cross-sectional view of a diaphragm type substrate processing apparatus according to a first embodiment of the present invention. Fig. 4 is a partially enlarged view of Fig. 3.

[0023] First, a specific embodiment of a diaphragm-type substrate processing apparatus according to a first embodiment of the present invention will be described with reference to Figures 1 to 4. The diaphragm-type substrate processing apparatus of the present invention is used for placing and processing a circular substrate 10, and includes a mounting table 100, a carrier 200, and an isolation structure 300. Each of these will be described below.

[0024] The mounting table 100 has a generally upright columnar shape and is rotatable about its central axis. The mounting table 100 has a negative pressure chamber 101, which is disposed on the top of the mounting table 100 and can be configured to have an open top, and which is connected to a negative pressure source via a pipe.

[0025] The carrier 200 is installed on the top of the mounting table 100 and is used to mount the circular substrate 10, and mounts the circular substrate 10 on the mounting table 100. In this embodiment, the carrier 200 includes an outer frame 210 and a diaphragm 220 installed in the outer frame 210, and the outer edge of the diaphragm 220 is fixed to the outer frame 210. Specifically, the diaphragm 220 has a working surface 221 and a back surface 222 opposite to the working surface 221, and a clasp 224 is protruding from the back surface 222 at the outer edge of the diaphragm 220, and the diaphragm 220 is engaged with the outer frame 210 by the clasp 224 and fixed to the outer frame 210. The diaphragm 220 is placed on the top of the mounting table 100, and the negative pressure chamber 101 is closed by the back surface 222. The diaphragm 220 is provided with a plurality of through holes 223 penetrating the diaphragm 220 at positions of the working surface 221 corresponding to the negative pressure chambers 101 , and each of the through holes 223 is connected to one of the negative pressure chambers 101 .

[0026] The isolation structure 300 is used to mount a circular substrate 10, and the isolation structure 300 is protruding from the working surface 221 of the diaphragm 220 so as to space the circular substrate 10 from the working surface 221 of the diaphragm 220. In this embodiment, the top of the isolation structure 300 is disposed along the mounting plane 301, and the mounting plane 301 is spaced from the working surface 221 of the diaphragm 220. Specifically, the isolation structure 300 includes a ring rib 310, which is integrally formed with the diaphragm 220 and protrudes from the working surface 221 of the diaphragm 220. The ring rib 310 has an upper edge 311, and the mounting plane 301 is defined on the upper edge 311, and the ring rib 310 is disposed to correspond to the edge of the circular substrate 10. In this embodiment, the through holes 223 are disposed in the area surrounded by the ring rib 310.

[0027] In this embodiment, the isolation structure 300 further includes a plurality of support ribs 310a, which are integrally formed with the diaphragm 220 and protrude from the working surface 221 of the diaphragm 220, and are disposed in an area surrounded by the ring rib 310. Each of the support ribs 310a has an upper edge 311a, and the upper edges 311a of the support ribs 310a are disposed coplanar with the mounting plane 301. Specifically, the support ribs 310a may be a circle or an arc that is disposed concentrically with the ring rib 310.

[0028] When the diaphragm-type substrate processing apparatus according to this embodiment performs a processing process, the circular substrate 10 is placed on the working surface 221 of the diaphragm 220, and the circular substrate 10 is placed on the placement plane 301 defined by the outer shape of the isolation structure 300, so that the circular substrate 10 is spaced apart from the working surface 221. One surface of the peripheral portion of the circular substrate 10 is placed on the upper edge 311 of the ring rib 310. The negative pressure source generates negative pressure in the negative pressure chamber 101, and the circular substrate 10 is sucked by the negative pressure of each through hole 223 and brought close to the working surface 221, so that the ring rib 310 is compressed and the circular substrate 10 is tightly attached to the diaphragm 220. The support rib 310a can support the circular substrate 10 so that the circular substrate 10 does not bend under the negative pressure. When a process is performed on the other side of the circular substrate 10, the above-described structure prevents the process chemical from passing through the gap between the circular substrate 10 and the diaphragm 220 and entering the negative pressure chamber 101, thereby preventing corrosion of the pipelines.

[0029] <Second Example> Fig. 5 is a schematic perspective view of a diaphragm type substrate processing apparatus according to a second embodiment of the present invention. Fig. 6 is a top view of a diaphragm type substrate processing apparatus according to a second embodiment of the present invention. Fig. 7 is a cross-sectional view of a diaphragm type substrate processing apparatus according to a second embodiment of the present invention. Fig. 8 is a partially enlarged view of Fig. 7.

[0030] Next, a specific embodiment of the diaphragm type substrate processing apparatus according to the second embodiment of the present invention will be described with reference to Figures 5 to 8. The diaphragm type substrate processing apparatus according to the present invention is used for placing and processing a circular substrate 10, and includes a placement table 100, a carrier 200, and an isolation structure 300. Each of these will be described below.

[0031] The mounting table 100 has a generally upright columnar shape and is rotatable about a central axis. The mounting table 100 has a negative pressure chamber 101, which is disposed on the top of the mounting table 100 and can be configured to have an open top, and which is connected to a negative pressure source via a pipe.

[0032] The carrier 200 is installed on the top of the mounting table 100 and is used to mount the circular substrate 10, and mounts the circular substrate 10 on the mounting table 100. In this embodiment, the carrier 200 includes an outer frame 210 and a diaphragm 220 installed in the outer frame 210, and the outer edge of the diaphragm 220 is fixed to the outer frame 210. Specifically, the diaphragm 220 has a working surface 221 and a back surface 222 opposite to the working surface 221, and the outer edge of the working surface 221 of the diaphragm 220 is fitted into the outer frame 210 and is attached so as to be fixed to the outer frame 210. The diaphragm 220 is placed on top of the mounting table 100, and the negative pressure chamber 101 is closed by the back surface 222. The diaphragm 220 is provided with a plurality of through holes 223 penetrating the diaphragm 220 at positions of the working surface 221 corresponding to the negative pressure chambers 101 , and each of the through holes 223 is connected to the negative pressure chambers 101 .

[0033] The isolation structure 300 is used to mount the circular substrate 10, and the isolation structure 300 is protruded from the working surface 221 of the diaphragm 220, so that the circular substrate 10 is spaced apart from the working surface 221 of the diaphragm 220. In this embodiment, the top of the isolation structure 300 is disposed along the mounting plane 301, and the mounting plane 301 is spaced apart from the working surface 221 of the diaphragm 220. Specifically, the isolation structure 300 has a plate 320, which is placed on the working surface 221 of the diaphragm 220, and the mounting plane 301 is defined on the top of the plate 320. These through holes 223 of the diaphragm 220 are disposed in an area surrounded by the periphery of the plate 320. The plate 320 is provided with a plurality of channels 323, each of which penetrates both sides of the plate 320, and is disposed at a position corresponding to each of the through holes 223 of the diaphragm 220, and each of the channels 323 is connected between the mounting surface 301 and the corresponding through hole 223. A slot is provided at the top of the plate 320 to connect the channels 323.

[0034] In this embodiment, the isolation structure 300 further includes a plurality of support ribs 310a, which are integrally formed with the diaphragm 220 and protrude from the working surface 221 of the diaphragm 220, and are disposed in an area surrounded by the ring rib 310. Each of the support ribs 310a has an upper edge 311a, and the upper edges 311a of the support ribs 310a are disposed coplanar with the mounting plane 301. Specifically, the support ribs 310a may be a circle or an arc that is disposed concentrically with the ring rib 310.

[0035] When the circular substrate 10 is processed by the diaphragm-type substrate processing apparatus according to this embodiment, the circular substrate 10 is placed on the working surface 221 of the diaphragm 220, and the circular substrate 10 is placed on the placement plane 301 defined by the outer shape of the isolation structure 300, so that the circular substrate 10 is spaced apart from the working surface 221. One side of the circular substrate 10 is placed on the plate 320, and the periphery of the plate 320 is located within the periphery of the circular substrate 10. The negative pressure source generates negative pressure in the negative pressure chamber 101, and the circular substrate 10 is sucked by the negative pressure of each through hole 223 and adhered to the plate 320. The slots on the top of the plate 320 distribute the negative pressure in these channels 323 so that the negative pressure exerts a uniform force on the circular substrate 10. When a process is performed on the other side of the circular substrate 10, the above-described structure prevents the process chemicals from passing through the gap between the circular substrate 10 and the plate 320 and entering the negative pressure chamber 101, thereby corroding the pipelines.

[0036] The above embodiment is for the purpose of facilitating understanding of the present invention, and is not intended to limit the present invention. It goes without saying that the present invention can be modified and improved without departing from the spirit of the present invention, and that the present invention includes equivalents thereof. [Explanation of symbols]

[0037] 10 Circular board 100 Placement table 101 Negative pressure room 200 Careers 210 Outer Frame 220 Diaphragm 221 Work surface 222 Back 223 through hole 224 Clasp 300 Isolation structure 301 Placing plane 310 Ring Rib 311 Upper edge 310a Support rib 311a Upper edge 320 Plate 323 Channels 324 Groove

Claims

1. A diaphragm-type substrate processing apparatus for processing a circular substrate, comprising: A mounting table having a negative pressure chamber; a carrier including an outer frame and a diaphragm installed within the outer frame, an outer edge of the diaphragm being fixed to the outer frame, the diaphragm being placed on the mounting table so as to close a negative pressure chamber, the diaphragm having a working surface, and a plurality of through holes penetrating the diaphragm being provided at positions of the working surface corresponding to the negative pressure chamber; a separation structure for placing the circular substrate, the separation structure being protruding from the working surface of the diaphragm so as to position the circular substrate at a distance from the working surface of the diaphragm.

2. 2. The diaphragm type substrate processing apparatus of claim 1, wherein the top of the isolation structure is disposed along a mounting plane, the mounting plane being spaced apart from a working surface of the diaphragm.

3. 3. The diaphragm-type substrate processing apparatus of claim 2, wherein the isolation structure comprises a ring rib formed integrally with the diaphragm, the ring rib is protruding from the working surface of the diaphragm, the ring rib has an upper edge, and the upper edge of the ring rib defines the above-mentioned placement plane.

4. 4. The diaphragm-type substrate processing apparatus of claim 3, wherein the isolation structure comprises a plurality of support ribs formed integrally with the diaphragm, the plurality of support ribs being protruding from the working surface of the diaphragm, each of the support ribs having an upper edge, and the upper edges of the plurality of support ribs being arranged coplanar with the mounting plane.

5. 5. The diaphragm type substrate processing apparatus according to claim 4, wherein the plurality of support ribs are arranged in an area surrounded by the ring rib.

6. 4. The diaphragm type substrate processing apparatus according to claim 3, wherein the plurality of through holes are arranged in an area surrounded by the ring rib.

7. 7. The diaphragm type substrate processing apparatus according to claim 6, wherein the ring rib is disposed so as to correspond to a peripheral edge of the circular substrate.

8. 3. The diaphragm type substrate processing apparatus of claim 2, wherein the isolation structure comprises a plate, the plate being overlaid on the working surface of the diaphragm, and the placement plane being defined on a top of the plate.

9. 9. The diaphragm type substrate processing apparatus according to claim 8, wherein the plurality of through holes are arranged in an area surrounded by a periphery of the plate.

10. 9. A diaphragm-type substrate processing apparatus as described in claim 8, wherein the plate has a plurality of channels drilled at positions corresponding to the plurality of through holes, and each of the channels is respectively connected between the mounting plane and a corresponding one of the through holes.

11. 9. The diaphragm type substrate processing apparatus according to claim 8, wherein the periphery of the plate is located within the periphery of the circular substrate, and the periphery of the plate is located so as to be spaced from the periphery of the circular substrate.

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