Fully automatic multi-axis polishing and cleaning device for laser thickness measurement

Abstract

Provided is a multi-axis polishing and cleaning apparatus for fully automatic laser thickness measurement. 【Solution means】The multi-axis polishing and cleaning apparatus includes a thickness measurement mechanism 101, a transport mechanism 200, a plurality of polishing mechanisms 301, and a cleaning mechanism 401 that matches the number of polishing mechanisms, provided on a frame 100. The thickness measurement mechanism is located at the supply end of the transport mechanism, the cleaning mechanism is located above the corresponding polishing mechanism, and the cleaning mechanism is used to spray cleaning liquid onto the polishing mechanism. The polishing mechanism includes a first polishing roller and a second polishing roller. By measuring the thickness of the polishing target panel, the distance between the first polishing roller and the second polishing roller is adjusted to improve the accuracy of polishing.

Description

Technical Field

[0001] The present invention relates to the technical field of polishing, and specifically to a fully automatic multi-axis polishing and cleaning device for laser thickness measurement.

Background Art

[0002] Conventionally, before using workpieces such as films, papers, non-woven fabrics, metal foils, and steel plates (hereinafter abbreviated as panels), it is necessary to perform a polishing process. Generally, since the polishing of metal foils needs to be carried out in multiple stages, the thickness of the metal foil gradually becomes thinner. However, in reality, there is a certain error in the initial thickness of each metal foil, and since the position of the polishing roller cannot be adjusted, thickness variations occur during the polishing process, affecting the polishing accuracy.

Summary of the Invention

[0003] In order to overcome the defects and deficiencies of the prior art, the object of the present invention is to provide a fully automatic multi-axis polishing and cleaning device for laser thickness measurement, which measures the thickness of the current panel to be polished, adjusts the distance between the first polishing roller and the second polishing roller, and improves the accuracy of polishing.

[0004] The present invention is realized by the following technical solutions.

[0005] A fully automatic multi-axis polishing and cleaning device for laser thickness measurement includes a frame, a thickness measurement mechanism provided on the frame, a transport mechanism, a plurality of polishing mechanisms, and a cleaning mechanism corresponding to the number of polishing mechanisms. The thickness measurement mechanism is located at the supply end of the transport mechanism, the cleaning mechanism is located above the corresponding polishing mechanism, and the cleaning mechanism is used to spray cleaning liquid onto the polishing mechanism.

[0006] The grinding mechanism includes a first grinding roller, a second grinding roller located below the first grinding roller, a first grinding rotation driving mechanism, a second grinding rotation driving mechanism, a first grinding lifting driving mechanism, and a second grinding lifting driving mechanism provided on the frame. The first grinding lifting driving mechanism and the second grinding lifting driving mechanism are electrically connected to the thickness measuring mechanism respectively. Both ends of the first grinding roller and both ends of the second grinding roller are slidably connected to the frame vertically. The first grinding rotation driving mechanism is used to drive the first grinding roller to rotate. The second grinding rotation driving mechanism is used to drive the second grinding roller to rotate. The first grinding lifting driving mechanism is used to drive the first grinding roller to move up and down. The second grinding lifting driving mechanism is used to drive the second grinding roller to move up and down.

[0007] Here, the first grinding rotation driving mechanism includes a first rotation driving member, a first synchronous wheel, a first synchronous belt, a second synchronous wheel, and a tension mechanism. The first rotation driving member is provided on the frame. The first synchronous wheel is provided at the output end of the first rotation driving member. The second synchronous wheel is provided at one end of the first grinding roller. The first synchronous wheel is drivingly connected to the second synchronous wheel via the first synchronous belt. The tension mechanism is used to tension the first synchronous belt.

[0008] Here, the tension mechanism includes a tension base provided on the frame, a first elastic member provided on the tension base, and a tension wheel provided at one end of the first elastic member. The tension wheel is in contact with the first synchronous belt.

[0009] When the tension wheel is in contact with the first synchronous belt, the first elastic member contracts to drive the tension wheel to tension the first synchronous belt.

[0010] Here, the structure of the second grinding rotation driving mechanism is the same as that of the first grinding rotation driving mechanism.

[0011] Here, the first polishing lifting drive mechanism includes a first lifting drive member provided on the frame and a first bearing base slidably provided on the frame in the vertical direction. The output end of the first lifting drive member is connected to the lower end of the first bearing base, and the bearing of the first bearing base is fitted to one end of the first polishing roller.

[0012] Here, the structure of the second polishing lifting drive mechanism is the same as that of the first polishing lifting drive mechanism.

[0013] Here, the cleaning mechanism includes a liquid transport pipe and a plurality of nozzles provided on one side of the liquid transport pipe. The plurality of nozzles communicate with the liquid transport pipe. The polishing and cleaning device further includes a water pipe provided on the frame. The ends of the water pipe communicate with the liquid transport pipes of the plurality of cleaning mechanisms respectively, and the water supply end of the water pipe is used to communicate with an external liquid supply part.

[0014] Here, the transport mechanism includes a transport drive mechanism, a plurality of first transport rollers provided in a coplanar manner, and a plurality of second transport rollers having the same number as the first transport rollers. The second transport rollers are abutted against the upper ends of the corresponding first transport rollers, and the transport mechanism is used to drive the first transport rollers to roll.

[0015] Here, the transport mechanism further includes two second elastic members symmetrically provided at both ends of the second transport roller and two second bearing bases symmetrically provided at both ends of the second transport roller. The upper ends of the second elastic members are connected to the frame. The second bearing bases are slidably connected to the frame in the vertical direction. The lower ends of the second elastic members are connected to the upper ends of the second bearing bases. The bearings of the second bearing bases are fitted to one end of the second transport roller.

[0016] Here, the transport drive mechanism includes a transport drive member, a chain, and a plurality of gears. The plurality of gears are respectively provided in one-to-one correspondence with one end of the first transport roller, and the transport drive member is drivably connected to the plurality of gears respectively through the chain.

Advantages of the Invention

[0017] The beneficial effects of the present invention are as follows.

[0018] In the fully automatic multi-axis polishing and cleaning apparatus for laser thickness measurement according to the present invention, a thickness measurement mechanism and a polishing mechanism are provided. Here, the thickness measurement mechanism can measure the thickness of the panel to be polished, and the first polishing lifting drive mechanism and the second polishing lifting drive mechanism of the polishing mechanism can respectively lift and lower corresponding to the first polishing roller and the second polishing roller based on the numerical values obtained by the thickness measurement mechanism. As a result, the distance between the first polishing roller and the second polishing roller is adjusted, and the accuracy of polishing is improved.

Brief Description of the Drawings

[0019] The present invention will be further described with reference to the drawings. However, the embodiments of the drawings do not limit the present invention, and those skilled in the art can also obtain other drawings according to the following drawings without creative labor.

Figure 1

Figure 2

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Modes for Carrying Out the Invention

[0020] In order to make the above objects, features and advantages of the present invention more clear, specific embodiments of the present invention will be described in detail below with reference to the drawings. In the following description, many specific details are described in order to provide a complete understanding of the present invention. However, the present invention can be implemented in many ways other than those described here, and those skilled in the art can make similar improvements without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0021] In the description of the present invention, for the sake of understanding, orientations or positional relationships indicated by terms such as "center", "lateral direction", "longitudinal direction", "width", "length", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial direction", "diameter direction", "circumferential direction" are based on the orientations or positional relationships shown in the accompanying drawings, and are used only for explaining the present invention and simplifying the explanation, and do not indicate or imply that the device or element mentioned must have a specific orientation and be constructed and operated in a specific direction. Therefore, they should not be construed as limitations to the present invention.

[0022] Also, the terms "first" and "second" are used only for the purpose of explanation and should not be construed as indicating or implying relative importance or indicating or implying the quantity of technical features. Therefore, the features separated by "first" and "second" may include one or more of those features explicitly or implicitly. In the description of the present invention, unless otherwise specified, the meaning of "plural" refers to two or more, for example, two or three.

[0023] Conventionally, before using workpieces such as films, papers, non-woven fabrics, metal foils, steel plates (hereinafter abbreviated as panels), polishing treatment is required. Generally, since the polishing of metal foils needs to be performed in multiple steps, the thickness of the metal foil gradually becomes thinner. However, in reality, there is a certain error in the initial thickness of each metal foil, and since the position of the polishing roller cannot be adjusted, thickness variations occur during the polishing process, affecting the polishing accuracy.

[0024] To solve the above problems, this embodiment discloses a fully automatic multi-axis polishing and cleaning device for laser thickness measurement, the structure of which is shown in FIGS. 1 to 3. The polishing and cleaning device includes a frame 100, a thickness measurement mechanism 101 provided on the frame 100, a transport mechanism 200, a plurality of polishing mechanisms 301, and a cleaning mechanism 401 that matches the number of the polishing mechanisms 301. The thickness measurement mechanism 101 is located at the supply end of the transport mechanism 200, and the cleaning mechanism 401 is located above the corresponding polishing mechanism 301. The cleaning mechanism 401 is used to spray cleaning liquid onto the polishing mechanism 301.

[0025] The polishing mechanism 301 includes a first polishing roller 302, a second polishing roller 303 located below the first polishing roller 302, a first polishing rotation driving mechanism 304 provided on the frame 100, a second polishing rotation driving mechanism 313, a first polishing lifting driving mechanism 314, and a second polishing lifting driving mechanism 317. The first polishing lifting driving mechanism 314 and the second polishing lifting driving mechanism 317 are electrically connected to the thickness measurement mechanism 101 respectively. Both ends of the first polishing roller 302 and both ends of the second polishing roller 303 are slidably connected to the frame 100 vertically. The first polishing rotation driving mechanism 304 is used to drive the first polishing roller 302 to rotate. The second polishing rotation driving mechanism 313 is used to drive the second polishing roller 303 to rotate. The first polishing lifting driving mechanism 314 is used to drive the first polishing roller 302 to move up and down. The second polishing lifting driving mechanism 317 is used to drive the second polishing roller 303 to move up and down.

[0026] As can be seen from FIGS. 2 and 3, the polishing mechanism 301 in this embodiment includes three sets of first polishing rotation driving mechanisms 304 and three sets of second polishing rotation driving mechanisms 313. That is, the number of the first polishing roller 302 and the second polishing roller 303 in this embodiment is three each. With the above three sets of structures, polishing with different thicknesses in three stages is performed on the panel, and a polishing effect of six axes in total, three axes on the left and right, is realized. It should be noted that the thickness measurement mechanism 101 in this embodiment is a prior art and will not be described here.

[0027] In the fully automatic multi-axis grinding and cleaning apparatus for laser thickness measurement according to the present invention, a thickness measurement mechanism 101 and a grinding mechanism 301 are provided. Here, the thickness measurement mechanism 101 can measure the thickness of the panel to be ground, and the first grinding lifting drive mechanism 314 and the second grinding lifting drive mechanism 317 of the grinding mechanism 301 can respectively move up and down corresponding to the first grinding roller 302 and the second grinding roller 303 based on the numerical values obtained by the thickness measurement mechanism 101. As a result, the distance between the first grinding roller and the second grinding roller is adjusted, and the accuracy of grinding is improved.

[0028] Furthermore, the first grinding rotation drive mechanism 304 includes a first rotation drive member 305, a first synchronous wheel 306, a first synchronous belt 307, a second synchronous wheel 308, and a tension mechanism 309. The first rotation drive member 305 is provided on the frame 100, the first synchronous wheel 306 is provided at the output end of the first rotation drive member 305, the second synchronous wheel 308 is provided at one end of the first grinding roller 302, the first synchronous wheel 306 is drivingly connected to the second synchronous wheel 308 via the first synchronous belt 307, and the tension mechanism 309 is used to tension the first synchronous belt 307.

[0029] In this embodiment, the first rotation drive member 305 is preferably a servo motor. In the process of driving the first grinding roller 302 to move up and down, since the distance between the first synchronous wheel 306 and the second synchronous wheel 308 changes, the length of the first synchronous belt 307 needs to have a certain margin. In this case, in order to avoid the first synchronous belt 307, the first synchronous wheel 306, and the second synchronous wheel 308 from loosening and falling, the tension mechanism 309 performs self-adaptive tensioning processing on the first synchronous belt 307.

[0030] Furthermore, the tension mechanism 309 includes a tension base 310 provided on the frame 100, a first elastic member 311 provided on the tension base 310, and a tension wheel 312 provided at one end of the first elastic member 311. The first elastic member 311 is preferably a spring. The tension wheel 312 is in contact with the first timing belt 307. As can be seen from FIG. 2, the tension wheel 312 is located inside the first timing belt 307. When the first polishing roller 302 and the second polishing roller 303 move away from each other, the first timing belt 307 pulls the first elastic member 311 to stretch. When the first polishing roller 302 and the second polishing roller 303 move closer to each other, the first elastic member 311 contracts to ensure that the tension wheel 312 always maintains contact with the first timing belt 307. Therefore, the tension wheel 312 is always in contact with the first timing belt 307, and the first elastic member 311 contracts to drive the tension wheel 312 to pull the first timing belt 307.

[0031] Note that the structure of the second polishing rotation drive mechanism 313 in this embodiment is the same as that of the first polishing rotation drive mechanism 304. Therefore, the operating principle that the second polishing rotation drive mechanism 313 drives the second polishing roller 303 to rotate is the same as the operating principle that the first polishing rotation drive mechanism 304 drives the first polishing roller 302 to rotate, and the description thereof is omitted here.

[0032] Furthermore, the first polishing lifting drive mechanism 314 includes a first lifting drive member 315 provided on the frame 100 and a first bearing block 316 slidably provided on the frame 100 in the vertical direction. The output end of the first lifting drive member 315 is connected to the lower end of the first bearing block 316, and the bearing of the first bearing block 316 is fitted to one end of the first polishing roller 302.

[0033] In this embodiment, the first lifting drive member 315 is preferably a hydraulic cylinder. The first lifting drive member 315 drives the bearing block to move up and down, and moves the first polishing roller 302 up and down.

[0034] Note that since the structure of the second polishing lifting drive mechanism 317 in this embodiment is the same as the structure of the first polishing lifting drive mechanism 314, the operating principle that the second polishing lifting drive mechanism 317 drives the second polishing roller 303 to move up and down is the same as the operating principle that the first polishing lifting drive mechanism 314 drives the first polishing roller 302 to move up and down, and the description thereof is omitted here.

[0035] Furthermore, the cleaning mechanism 401 includes a liquid transport pipe 402 and a plurality of nozzles 403 provided on one side of the liquid transport pipe 402. The plurality of nozzles 403 communicate with the liquid transport pipe 402. The polishing and cleaning device further includes a water pipe 404 provided on the frame 100. The ends of the water pipe 404 communicate with the liquid transport pipes 402 of the plurality of cleaning mechanisms 401 respectively. The water supply end of the water pipe 404 is used to communicate with an external liquid supply unit. In this embodiment, the end of the water pipe 404 can be connected to a water pump from the outside. The water pump injects the cleaning liquid from the water pipe 404 into each liquid transport pipe 402, and then sprays it onto the polishing mechanism 301 through the corresponding nozzles 403.

[0036] Furthermore, the transport mechanism 200 includes a transport drive mechanism 201, a plurality of first transport rollers 202 provided in a coplanar manner, and a second transport roller 203 having the same number as the first transport rollers 202. The second transport roller 203 is abutted against the upper end of the corresponding first transport roller 202. The transport drive mechanism 201 is used to drive the first transport roller 202 to roll.

[0037] In this embodiment, it includes a transport drive member 204, a chain 205, and a plurality of gears 206. The plurality of gears 206 are respectively provided in one-to-one correspondence with one end of the first transport roller 202. The transport drive member 204 is drivably connected to the plurality of gears 206 through the chain 205 respectively. The transport drive member 204 is preferably a servo motor. The transport drive member 204 moves the gears 206 to rotate through the chain 205, and as a result, the panel transport effect is realized.

[0038] Specifically, the transport mechanism 200 further includes two second elastic members 207 symmetrically provided at both ends of the second transport roller 203, and two second bearing seats 208 symmetrically provided at both ends of the second transport roller 203. The upper end of the second elastic member 207 is connected to the frame 100. The second bearing seat 208 is connected to the frame 100 so as to be slidable up and down. The lower end of the second elastic member 207 is connected to the upper end of the second bearing seat 208. The bearing of the second bearing seat 208 is fitted to one end of the second transport roller 203. During actual use, when the panel passes through the first polishing roller 302 and the second polishing roller 303, the first polishing roller 302 can be lifted. At the same time, the first polishing roller 302 and the second polishing roller 303 are respectively abutted against two end faces of the panel through the second elastic member 207, thereby ensuring the stability of panel transport.

[0039] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention and do not limit the protection scope of the present invention. The present invention is described in detail with reference to the preferred embodiments. However, those skilled in the art should understand that they can make modifications or equivalent substitutions to the technical solution of the present invention without departing from the essence and scope of the technical solution of the present invention.

Description of Reference Numerals

[0040] Frame - 100, Thickness Measuring Mechanism - 101, Transport Mechanism - 200, Transport Driving Mechanism - 201, First Transport Roller - 202, Second Transport Roller - 203, Transport Driving Member - 204, Chain - 205, Gear - 206, Second Elastic Member - 207, Second Bearing Seat - 208, Grinding mechanism - 301, First grinding roller - 302, Second grinding roller - 303, First grinding rotation drive mechanism - 304, First rotation drive member - 305, First synchronous wheel - 306, First synchronous belt - 307, Second synchronous wheel - 308, Tension mechanism - 309, Tension base - 310, First elastic member - 311, Tension wheel - 312, Second grinding rotation drive mechanism - 313, First grinding lifting drive mechanism - 314, First lifting drive member - 315, First bearing block - 316, Second grinding lifting drive mechanism - 317 Washing mechanism - 401, Liquid transport pipe - 402, Nozzle - 403, Water pipe - 404

Claims

1. A fully automatic laser thickness measurement multi-axis polishing and cleaning apparatus including a frame, further including a thickness measurement mechanism provided on the frame, a transport mechanism, a plurality of polishing mechanisms, and a number of cleaning mechanisms corresponding to the number of polishing mechanisms, wherein the thickness measurement mechanism is located at a feed end of the transport mechanism, the cleaning mechanism is located above a corresponding polishing mechanism, and the cleaning mechanism is used to spray a cleaning liquid onto the polishing mechanism; The polishing mechanism includes a first polishing roller, a second polishing roller located below the first polishing roller, and a first polishing rotation drive mechanism, a second polishing rotation drive mechanism, a first polishing lift drive mechanism, and a second polishing lift drive mechanism provided on a frame, the first polishing lift drive mechanism and the second polishing lift drive mechanism are each electrically connected to a thickness measurement mechanism, both ends of the first polishing roller and both ends of the second polishing roller are each connected to the frame so as to be slidable up and down, the first polishing rotation drive mechanism is used to drive the first polishing roller to rotate, the second polishing rotation drive mechanism is used to drive the second polishing roller to rotate, the first polishing lift drive mechanism is used to drive the first polishing roller to move up and down, and the second polishing lift drive mechanism is used to drive the second polishing roller to move up and down. A fully automatic laser thickness measurement multi-axis polishing and cleaning device.

2. 2. The fully automatic laser thickness measurement multi-axis polishing and cleaning apparatus of claim 1, wherein the first polishing rotary drive mechanism includes a first rotary drive member, a first synchronous wheel, a first synchronous belt, a second synchronous wheel, and a tension mechanism, the first rotary drive member is mounted on a frame, the first synchronous wheel is mounted on an output end of the first rotary drive member, the second synchronous wheel is mounted on one end of a first polishing roller, the first synchronous wheel is drivingly connected to the second synchronous wheel via a first synchronous belt, and the tension mechanism is used to tension the first synchronous belt.

3. The tension mechanism includes a tension base provided on a frame, a first elastic member provided on the tension base, and a tension wheel provided on one end of the first elastic member, the tension wheel being in contact with the first synchronous belt, 3. The fully automatic laser thickness measurement multi-axis polishing and cleaning device according to claim 2, characterized in that, when the tension wheel is in contact with the first synchronous belt, the first elastic member contracts to drive the tension wheel to tension the first synchronous belt.

4. 4. The fully automatic laser thickness measuring multi-axis polishing and cleaning device according to claim 2 or 3, wherein the structure of the second polishing rotary drive mechanism is the same as that of the first polishing rotary drive mechanism.

5. 2. The fully automatic laser thickness measurement multi-axis polishing and cleaning device according to claim 1, wherein the first polishing lifting and lowering drive mechanism includes a first lifting and lowering drive member mounted on a frame and a first bearing stand mounted on the frame so as to be slidable up and down, an output end of the first lifting and lowering drive member is connected to a lower end of the first bearing stand, and a bearing of the first bearing stand is fitted to one end of a first polishing roller.

6. 6. The fully automatic laser thickness measuring multi-axis polishing and cleaning device according to claim 5, wherein the structure of the second polishing lifting and driving mechanism is the same as that of the first polishing lifting and driving mechanism.

7. 2. The fully automatic laser thickness measurement multi-axis polishing and cleaning device according to claim 1, characterized in that the cleaning mechanism includes a liquid transport pipe and a plurality of nozzles provided on one side of the liquid transport pipe, the plurality of nozzles being connected to the liquid transport pipe, the polishing and cleaning device further includes a water pipe provided on the frame, ends of the water pipes being connected to the liquid transport pipes of the plurality of cleaning mechanisms respectively, and a water supply end of the water pipe is used to connect to an external liquid supply unit.

8. The fully automatic laser thickness measurement multi-axis polishing and cleaning apparatus of claim 1, characterized in that the transport mechanism includes a transport drive mechanism, a plurality of coplanar first transport rollers, and second transport rollers, the number of which is the same as the number of the first transport rollers, the second transport rollers being abutted against the upper ends of the corresponding first transport rollers, and the transport mechanism is used to drive the first transport rollers to roll.

9. 9. The fully automatic laser thickness measurement multi-axis polishing and cleaning device according to claim 8, wherein the transport mechanism further includes two second elastic members symmetrically arranged on both ends of the second transport roller, and two second bearing stands symmetrically arranged on both ends of the second transport roller, the upper ends of the second elastic members are connected to a frame, the second bearing stands are connected to the frame so as to be slidable up and down, the lower ends of the second elastic members are connected to the upper ends of the second bearing stands, and the bearings of the second bearing stands are fitted to one ends of the second transport rollers.

10. The fully automatic laser thickness measurement multi-axis polishing and cleaning apparatus according to claim 8, characterized in that the transport driving mechanism includes a transport driving member, a chain, and a plurality of gears, each of which is provided in one-to-one correspondence with one end of the first transport roller, and the transport driving member is drivably connected to each of the plurality of gears via a chain.

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