Substrate transport device

Abstract

A substrate transport device that allows for appropriate adjustment of an exposure device. According to one aspect of the present disclosure, a substrate transport device is connected to an exposure device and includes a load / unload block and a relay block. The load / unload block has a cassette mounting portion on which a cassette capable of storing substrates is mounted. The relay block has a connection surface connected to the exposure device and is coupled to the load / unload block on the side opposite the connection surface.

Description

[Technical Field]

[0001] The present disclosure relates to a substrate transport apparatus. [Background technology]

[0002] BACKGROUND ART Conventionally, a coating and developing apparatus has been known in which a carry-in / out station, a first delivery station, a processing station, a second delivery station, and an interface station are connected in this order (see Patent Document 1).

[0003] A substrate carried into the carry-in / out station is transferred to the processing station via the first transfer station. A substrate on which a resist film has been formed in the processing station is carried into the exposure device via the second transfer station and the interface station. Furthermore, a substrate after exposure processing carried out from the exposure device is transferred to the processing station via the interface station and the second transfer station. A substrate that has been developed in the processing station is transferred to the carry-in / out station via the first transfer station. The substrate is then carried out from the carry-in / out station. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 7300935 Summary of the Invention [Problem to be solved by the invention]

[0005] The coating and developing apparatus described above may be used for the purpose of adjusting an exposure apparatus, including checking its operation. In this case, the coating and developing apparatus functions as a transport mechanism for transporting substrates to the exposure apparatus, i.e., a substrate transport apparatus. However, in such cases, the exposure apparatus to be adjusted must be connected to the coating and developing apparatus each time adjustment is performed, making it difficult to perform the adjustment work at the desired timing. Therefore, there is a need for a substrate transport apparatus that enables appropriate adjustment of the exposure apparatus.

[0006] The present disclosure provides a substrate transport device that allows for appropriate adjustment of an exposure device. [Means for solving the problem]

[0007] According to one aspect of the present disclosure, a substrate transport device is connected to an exposure device, and includes a load / unload block and a relay block. The load / unload block has a cassette mounting portion on which a cassette capable of storing substrates is mounted. The relay block has a connection surface connected to the exposure device and is coupled to the load / unload block on the side opposite to the connection surface. [Effects of the Invention]

[0008] According to the present disclosure, it is possible to provide a substrate transport device that allows the exposure device to be adjusted appropriately. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view showing a schematic configuration of a substrate transfer device according to an embodiment. [Figure 2] FIG. 2 is a side view showing a schematic configuration of the substrate transport device according to the embodiment. [Figure 3] FIG. 3 is a perspective view showing a schematic configuration of a substrate transfer device according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, a mode for carrying out a substrate transport apparatus according to the present disclosure (hereinafter referred to as an "embodiment") will be described in detail with reference to the drawings. Note that the coating and developing apparatus according to the present disclosure is not limited to this embodiment. Furthermore, each embodiment can be appropriately combined within the scope of not causing any contradiction in the processing content. Furthermore, the same components in each of the following embodiments will be given the same reference numerals, and duplicated explanations will be omitted.

[0011] First, the configuration of a substrate transfer apparatus 1 according to an embodiment will be described with reference to Figures 1 and 2. Figure 1 is a plan view showing a schematic configuration of the substrate transfer apparatus 1 according to an embodiment. Figure 2 is a side view showing a schematic configuration of the substrate transfer apparatus 1 according to an embodiment.

[0012] <Configuration of the substrate transport device> As shown in Fig. 1, a substrate transfer apparatus 1 according to the present disclosure is connected to an exposure apparatus EXP for performing an exposure process on a semiconductor wafer (hereinafter referred to as a wafer W) having a resist film formed on its surface. The substrate transfer apparatus 1 includes a load / unload block S1 and a relay block S2. The relay block S2 has a connection surface 21 that is connected to the exposure apparatus EXP, and is connected to the load / unload block S1 on the side opposite to the connection surface 21. As will be described in more detail below, the substrate transfer apparatus 1 includes a movement mechanism and is movable horizontally.

[0013] The carry-in / out block S1 is provided with a plurality of cassette mounting sections 11 and a first transfer mechanism 13. The plurality of cassette mounting sections 11 are arranged side by side along the X-axis direction. A cassette C capable of accommodating a plurality of wafers W is mounted on the cassette mounting section 11. An opening / closing section 12 for loading and unloading the wafers W is provided on the side of the cassette C facing the first transfer mechanism 13. The carry-in / out block S1 may also be provided with a chiller 14 and a power distribution panel 15. Details of the chiller 14 and the power distribution panel 15 will be described later.

[0014] The first transfer mechanism 13 transfers wafers W between the cassette C and a substrate rest part TRS (see FIG. 2) described below, which is provided in the relay block S2. The first transfer mechanism 13 has a holder for holding the wafer W, and is capable of moving in the horizontal and vertical directions and rotating about a vertical axis. For convenience, the first transfer mechanism 13 is not shown in FIG. 2.

[0015] The number of the multiple cassette mounting parts 11 may be, for example, two. In this case, the cassette C mounted on one of the cassette mounting parts 11 may be used as a loading port for wafers W, and the cassette C mounted on the other cassette mounting part 11 may be used as a loading port for wafers W. The number of cassette mounting parts 11 may be, for example, three, four or more, but is preferably two. If the number of cassette mounting parts 11 is two, the horizontal movement amount of the first transport mechanism 13 can be reduced, thereby improving the throughput of substrate transport in the substrate transport apparatus 1.

[0016] The relay block S2 is provided with a shelf unit 22 and a second transport mechanism 23. The shelf unit 22 is disposed in the center of the relay block S2. The shelf unit 22 is provided with a plurality of (here, two) temperature adjustment devices ICPL and a plurality of (here, two) heat treatment devices BAKE as substrate treatment modules (see FIG. 2). The number of these substrate treatment modules is not particularly limited. The number of these treatment modules may be one each, or three or more each. The relay block S2 may also be provided with a power distribution panel 24. Details of the power distribution panel 24 will be described later.

[0017] The temperature adjustment device ICPL is a module for adjusting (cooling) the temperature of the wafer W before it is loaded into the exposure device EXP. The temperature adjustment device ICPL has a flow path through which cooling water flows inside a holder that holds the wafer W, and by flowing the cooling water through this flow path, the temperature of the wafer W can be adjusted (cooled).

[0018] 2, the plurality of temperature adjustment devices ICPL are arranged in a vertical line on shelf unit 22. In this embodiment, wafers W are loaded and unloaded into and from temperature adjustment devices ICPL by second transfer mechanism 23, which will be described later. With this configuration, temperature adjustment processing can be performed on a plurality of wafers W in parallel, thereby improving the throughput of substrate transfer in substrate transfer apparatus 1. Furthermore, by arranging the plurality of temperature adjustment devices ICPL in a vertical line, the size of substrate transfer apparatus 1 can be made compact.

[0019] In this embodiment, temperature adjustment device ICPL is disposed in shelf unit 22 of relay block S2, but temperature adjustment device ICPL may be disposed on the substrate carry-in path from cassette mounting part 11 to exposure device EXP in substrate transfer apparatus 1. For example, temperature adjustment device ICPL may be disposed in carry-in / out block S1. In this case, a shelf unit capable of accommodating substrate processing modules may be disposed separately in carry-in / out block S1. In this case, wafers W may be carried in and out of temperature adjustment device ICPL by first transfer mechanism 13.

[0020] In the substrate transport apparatus 1 of the present disclosure, the temperature adjustment apparatus ICPL is the only substrate processing module arranged on the substrate carry-in path from the cassette mounting section 11 to the exposure apparatus EXP. By providing the minimum necessary substrate processing modules in the substrate transport apparatus 1 in this manner, the substrate transport apparatus 1 can be made compact.

[0021] The heat treatment device BAKE is a module for performing a PEB (Post Exposure Bake) process on a wafer W after exposure processing. The PEB process can make the thickness of the resist film on the wafer W after exposure processing uniform. The heat treatment device BAKE has a flow path through which cooling water flows inside a holder that holds the wafer W, and by flowing the cooling water through this flow path, the wafer W after PEB processing can be cooled.

[0022] 2, multiple heat treatment devices BAKE are arranged in a vertical line on shelf unit 22. In this embodiment, wafers W are loaded into and unloaded from heat treatment device BAKE by second transfer mechanism 23, which will be described later. With this configuration, PEB processing can be performed on multiple wafers W in parallel, thereby improving the throughput of substrate transfer in substrate transfer apparatus 1. Furthermore, by arranging multiple heat treatment devices BAKE in a vertical line, the size of substrate transfer apparatus 1 can be made compact.

[0023] In this embodiment, the heat processing apparatus BAKE is disposed in the shelf unit 22 of the relay block S2, but the heat processing apparatus BAKE may be disposed on the substrate transfer path from the cassette mounting part 11 to the exposure apparatus EXP in the substrate transfer apparatus 1. For example, the heat processing apparatus BAKE may be disposed in the transfer block S1. In this case, a shelf unit capable of accommodating a substrate processing module may be disposed separately in the transfer block S1. In this case, the wafer W may be transferred into and out of the heat processing apparatus BAKE by the first transfer mechanism 13.

[0024] In the substrate transport apparatus 1 of the present disclosure, the heat treatment apparatus BAKE is the only substrate processing module arranged on the substrate unloading path from the exposure apparatus EXP to the cassette mounting part 11. In this way, by configuring the substrate transport apparatus 1 to have the minimum necessary substrate processing modules, the substrate transport apparatus 1 can be made compact.

[0025] 2, in this embodiment, the plurality of temperature adjustment devices ICPL and the plurality of heat treatment devices BAKE are arranged in a vertical line in the relay block S2. Specifically, the plurality of heat treatment devices BAKE are arranged above the plurality of temperature adjustment devices ICPL in the shelf unit 22. By arranging all of the substrate processing modules in a vertical line in this manner, the substrate transfer apparatus 1 can be made compact.

[0026] As shown in FIG. 1, the second transport mechanism 23 transports a wafer W between a substrate rest part TRS (see FIG. 2), which will be described later and is located in the relay block S2, and the exposure tool EXP. The second transport mechanism 23 has a first transport part 231 and a second transport part 232. The first transport part 231 and the second transport part 232 are disposed at positions facing each other with the shelf unit 22 in between. The first transport part 231 and the second transport part 232 each have a holder that holds the wafer W. Furthermore, the first transport part 231 and the second transport part 232 are capable of moving in the vertical direction and rotating about a vertical axis.

[0027] 2, shelf unit 22 is provided with a plurality of (here, six) substrate placement parts TRS for temporarily placing wafers W transferred by first transfer mechanism 13 and second transfer mechanism 23. Specifically, shelf unit 22 is provided with two first substrate placement parts TRS1, two second substrate placement parts TRS2, and two third substrate placement parts TRS3, which are arranged in this order from bottom to top along the vertical direction. Note that the number of first substrate placement parts TRS1, second substrate placement parts TRS2, and third substrate placement parts TRS2 is not particularly limited. The number of each of these may be two, or may be three or more. Note that the transfer flow of wafers W in substrate transfer apparatus 1 will be described later.

[0028] The carry-in / out block S1 may be provided with a chiller 14 for supplying cooling water to the temperature adjustment device ICPL and the heat treatment device BAKE. This configuration can improve the convenience of the substrate transfer apparatus 1 compared to a case where a chiller is provided outside the substrate transfer apparatus 1. The chiller 14 may be appropriately placed in any possible position in the carry-in / out block S1.

[0029] A switchboard 15 for distributing power to the first transport mechanism 13, chiller 14, etc. may be provided in the load / unload block S1. The switchboard 15 may be placed in a suitable location in the load / unload block S1. Similarly, a switchboard 24 for distributing power to the second transport mechanism 23, temperature adjustment device ICPL, heat treatment device BAKE, etc. may be provided in the relay block S2. The switchboard 24 may be placed in a suitable location in the relay block S2. This configuration can improve the convenience of the substrate transport apparatus 1 compared to when a switchboard is placed outside the substrate transport apparatus 1.

[0030] The carry-in / out block S1 may be provided with a control unit (not shown) for controlling the operation of the first transport mechanism 13, the chiller 14, etc. Similarly, the relay block S2 may be provided with a control unit (not shown) for controlling the operation of the second transport mechanism 23, the temperature adjustment device ICPL, the heat treatment device BAKE, etc. These control units are, for example, computers and have computer-readable storage media. The storage media stores programs for controlling the various devices described above. The control unit controls the operation of the various devices described above by reading and executing the programs stored in the storage media.

[0031] The program may be stored in a computer-readable storage medium and installed into the control unit's storage medium from another storage medium. Examples of computer-readable storage media include hard disks (HDs), flexible disks (FDs), compact disks (CDs), magnetic optical disks (MOs), and memory cards.

[0032] <Wafer transport flow> Next, the transfer flow of the wafer W in the substrate transfer apparatus 1 will be described with reference to FIG.

[0033] First, a cassette C containing a wafer W on which a resist film is formed is loaded into the cassette mounting part 11. Next, the first transfer mechanism 13 removes the wafer W from the cassette C and transfers it to the first substrate mounting part TRS1. Next, the first transfer part 231 of the second transfer mechanism 23 removes the wafer W from the first substrate mounting part TRS1 and transfers it to the temperature adjustment device ICPL. Then, the temperature adjustment process is performed on the wafer W by the temperature adjustment device ICPL.

[0034] Next, the second transfer part 232 of the second transfer mechanism 23 takes the wafer W out of the temperature adjustment device ICPL and transfers it to the exposure device EXP. Then, the exposure device EXP performs an exposure process on the wafer W on which the resist film has been formed. Thereafter, the second transfer part 232 takes the wafer W out of the exposure device EXP and transfers it to the third substrate rest part TRS3.

[0035] Next, the first transfer part 231 takes out the wafer W from the third substrate rest part TRS3 and transfers it to the heat treatment device BAKE. Then, the heat treatment device BAKE performs PEB processing on the wafer W after the exposure processing. Thereafter, the first transfer part 231 takes out the wafer W from the heat treatment device BAKE and transfers it to the second substrate rest part TRS2.

[0036] Next, the first transfer mechanism 13 takes out the wafer W from the second substrate rest part TRS2 and transfers it to the cassette C. Thereafter, the cassette C is carried out from the carry-in / out block S1. In this manner, a series of wafer W transfers are performed.

[0037] When the PEB process is not performed on the wafer W after the exposure process, the first transfer unit 231 may transfer the wafer W taken out from the third substrate rest unit TRS3 to the second substrate rest unit TRS2. With such a substrate transfer flow, when the PEB process is not performed on the wafer W, the transfer efficiency of the wafer W can be improved.

[0038] <About the movement mechanism> Next, a movement mechanism of the substrate transfer apparatus 1 according to the embodiment will be described with reference to Fig. 3. Fig. 3 is a perspective view showing a schematic configuration of the substrate transfer apparatus 1 according to the embodiment.

[0039] As shown in Fig. 3, the carry-in / out block S1 has a connection surface 16 that is connected to the relay block S2. The relay block S2 also has a connection surface 25 that is connected to the connection surface 16. The connection surface 16 and the connection surface 25 have substantially the same shape. The carry-in / out block S1 and the relay block S2 are connected to each other by being fixed with a fixing member 41 so that the connection surface 16 and the connection surface 25 are in contact with each other.

[0040] The fixing member 41 is, for example, a metal plate-like member having a plurality of through holes (not shown). The fixing member 41 is arranged along the connection point between the carry-in / out block S1 and the relay block S2, straddling the outer surface of the carry-in / out block S1 and the outer surface of the relay block S2. Specifically, as shown in FIG. 3, the fixing members 41 are arranged on the side surface on the positive X-axis direction, the side surface on the negative X-axis direction, the upper surface on the positive Z-axis direction, and the lower surface on the negative Z-axis direction of the substrate transport apparatus 1. In other words, the substrate transport apparatus 1 may have four fixing members 41.

[0041] The outer surfaces of the carry-in / out block S1 and the relay block S2 may be provided with a plurality of screw holes (not shown) for attaching the fixing members 41. By threading screws (not shown) inserted into the through holes of the fixing members 41 into the screw holes, the carry-in / out block S1 and the relay block S2 can be connected via the fixing members 41.

[0042] In this manner, with the configuration in which the load-in / load block S1 and the relay block S2 are connected by the fixing member 41, it becomes possible to move the load-in / load block S1 and the relay block S2 in an integrated state. Therefore, the substrate transport device 1 having the above configuration is highly convenient.

[0043] 3, a plurality of casters 51 are provided on the bottom surfaces of the loading / unloading block S1 and the relay block S2 as a movement mechanism for the substrate transport device 1. This allows the substrate transport device 1 to be moved as needed. Note that the number and positions of the casters 51 are not particularly limited and may be changed as needed.

[0044] In addition, a plurality of legs 52 are provided on the bottom surfaces of the carry-in / out block S1 and the relay block S2 for resting the substrate transport apparatus 1 on the floor surface. The legs 52 are configured so that their vertical length can be adjusted. For example, when the length of the legs 52 is adjusted to be shorter, the casters 51 come into contact with the floor surface. This makes it possible to move the substrate transport apparatus 1. When the length of the legs 52 is adjusted to be longer, the casters 51 move away from the floor surface and the legs 52 come into contact with the floor surface. This makes it possible to place the substrate transport apparatus 1 on the floor surface. Therefore, the position of the substrate transport apparatus 1 relative to the exposure apparatus EXP can be fixed. The number and positions of the legs 52 are not particularly limited and may be changed as appropriate.

[0045] As described above, the substrate transport device 1 of the present disclosure has a more compact configuration than conventional coating and developing devices and can be easily moved as needed, making it possible to easily perform adjustment work on the exposure device EXP at the desired timing.

[0046] The disclosed embodiments should be considered in all respects as illustrative and not restrictive. Indeed, the above-described embodiments may be embodied in various forms. Furthermore, the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims.

[0047] The present technology can also be configured as follows. (1) A substrate transport device connected to an exposure device, a carry-in / out block having a cassette placement section on which a cassette capable of storing substrates is placed; a relay block having a connection surface connected to the exposure device, the relay block being connected to the carry-in / out block on the opposite side of the connection surface; A substrate transport device comprising: (2) the carry-in / out block has a first transport mechanism that transports the substrate between the cassette placement part and a substrate placement part provided in the relay block, The substrate transport device according to (1), wherein the relay block has a second transport mechanism that transports the substrate between the substrate platform and the exposure device. (3) a temperature adjustment device is the only substrate processing module disposed on a path for carrying in the substrate from the cassette mounting part to the exposure device; The substrate transfer device according to (2), wherein the substrate is carried in and out of the temperature adjustment device by the first transfer mechanism or the second transfer mechanism. (4) The substrate transfer apparatus according to (3) above, comprising a plurality of the temperature adjustment devices arranged in a line along the vertical direction. (5) the substrate processing module arranged on the substrate unloading path from the exposure device to the cassette mounting part is only a heat treatment device; The substrate transport device according to (2), wherein the substrate is transported into and out of the heat treatment device by the first transport mechanism or the second transport mechanism. (6) The substrate transfer device according to (5) above, comprising a plurality of the heat treatment devices arranged in a line along the vertical direction. (7) a plurality of temperature adjustment devices that are arranged on a substrate carry-in path from the cassette mounting part to the exposure device, and adjust the temperature of the substrate before being carried into the exposure device; and a plurality of heat treatment devices that are arranged on a substrate carry-out path from the exposure device to the cassette mounting part, and heat-treat the substrate carried out from the exposure device, The substrate transfer apparatus according to any one of (1) to (6), wherein the plurality of temperature adjustment devices and the plurality of heat treatment devices are arranged in the relay block in a vertical direction. (8) The substrate transport apparatus according to any one of (1) to (7), wherein the carry-in / out block and the relay block are connected by a fixing member. [Explanation of symbols]

[0048] 1. Substrate transport device TRS1 First substrate placement section (an example of a substrate placement section) TRS2 Second substrate placement section (an example of a substrate placement section) TRS3 Third substrate placement section (an example of a substrate placement section) 11 Cassette placement section 12 Opening and Closing Section 13 First transport mechanism 14 Chiller 15,24 Switchboard 16,21,25 Connection surface 22 Shelving Unit 23 Second transport mechanism 41 Fixing member 51 Caster 52 Legs 231 First conveyor section 232 Second conveying section C Cassette S1 Loading / unloading block S2 relay block W wafer

Claims

1. A substrate transport device connected to an exposure device, a carry-in / out block having a cassette placement section on which a cassette capable of storing substrates is placed; a relay block having a connection surface connected to the exposure device, the relay block being connected to the carry-in / out block on the opposite side of the connection surface; A substrate transport device comprising:

2. the carry-in / out block has a first transport mechanism that transports the substrate between the cassette placement part and a substrate placement part provided in the relay block, 2. The substrate transport device according to claim 1, wherein the relay block has a second transport mechanism that transports the substrate between the substrate platform and the exposure device.

3. a temperature adjustment device is the only substrate processing module disposed on a path for carrying in the substrate from the cassette mounting part to the exposure device; The substrate transfer device according to claim 2 , wherein the substrate is transferred into and out of the temperature adjustment device by the first transfer mechanism or the second transfer mechanism.

4. The substrate transfer apparatus according to claim 3 , comprising a plurality of the temperature adjustment devices arranged side by side in a vertical direction.

5. the substrate processing module arranged on the substrate unloading path from the exposure device to the cassette mounting part is only a heat treatment device; The substrate transfer device according to claim 2 , wherein the substrate is transferred into and out of the heat treatment device by the first transfer mechanism or the second transfer mechanism.

6. The substrate transfer apparatus according to claim 5 , further comprising a plurality of the heat treatment apparatuses arranged side by side in a vertical direction.

7. a plurality of temperature adjustment devices that are arranged on a substrate carry-in path from the cassette mounting part to the exposure device, and adjust the temperature of the substrate before being carried into the exposure device; and a plurality of heat treatment devices that are arranged on a substrate carry-out path from the exposure device to the cassette mounting part, and heat-treat the substrate carried out from the exposure device, The substrate transfer device according to claim 1 , wherein the plurality of temperature adjustment devices and the plurality of heat treatment devices are arranged in the relay block in a vertical direction.

8. The substrate transport device according to claim 1 , wherein the loading / unloading block and the relay block are connected by a fixing member.

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