Magnetic shielding structure, magnetic adsorption positioning structure, and wireless charging device

Abstract

The present invention provides a magnetic shielding structure, a magnetic adsorption positioning structure, and a wireless charging device. [Solution] The magnetic shield structure includes a first border structure layer 100, a magnetic material layer 200, and a second border structure layer 300, which are arranged sequentially. The first and second border structure layers are provided on both sides of the magnetic material layer. The magnetic material layer includes a first coating layer 210, an intermediate layer 220, and a second coating layer 230, which are stacked sequentially. The area of ​​the intermediate layer is smaller than the area of ​​the first and second coating layers, and the first and second coating layers cover the intermediate layer from both sides.

Description

Technical Field

[0001] This application relates to the technical field of wireless charging, and particularly to a magnetic shielding structure, a magnetic adsorption positioning structure, and a wireless charging device.

Background Art

[0002] Wireless charging technology is to perform charging by using the electromagnetic induction principle. Its principle originates from the theory of wireless power transmission and has been developing rapidly with the popularization of consumer electronic devices. Currently, the mainstream wireless charging technologies are roughly divided into three categories: electromagnetic induction method (Qi standard), magnetic resonance method (A4WP standard), and high-frequency method. Among them, the Qi standard based on the electromagnetic induction principle is widely applied due to the maturity of the technology and its superiority in terms of cost. A wireless charging device generates an alternating electric field during operation. The magnetic shielding material provided inside it can reduce magnetic field leakage, improve energy transmission efficiency, and prevent electromagnetic interference (EMI) to surrounding electronic devices. General magnetic shielding materials include soft magnetic alloys, ferrites, amorphous / nanocrystalline alloys, composite shielding materials, etc.

[0003] In related technologies, an electromagnetic induction type wireless charging device includes a magnetic shielding material layer and an electromagnetic coil provided on the magnetic shielding material. The magnetic shielding material layer is usually processed by combining multiple layers of nanocrystals. The thickness of each layer of nanocrystals is 10 - 25 μm, and the hardness of the nanocrystal material is generally in the range of 500 - 1500 HV, much higher than conventional ferrites and amorphous materials. Such high hardness is due to the ultrafine grain structure and the strengthening effect of alloy elements. On the other hand, it also has high brittleness and is prone to breakage and chipping during processing. Currently, to address such problems, in the industry, generally, a film (polymer materials such as PET, PI, etc.) is used to paste and edge the edges. Edging not only provides additional mechanical protection to prevent damage and deterioration of the nanocrystal material during the manufacturing and assembly processes, but can also effectively suppress the potential risk caused by the breakage of the nanocrystals.

[0004] When the thickness of the magnetic shielding material layer exceeds 25 μm, non-uniformity occurs in the nanocrystalline metallic structure, causing a rapid decrease in performance. Therefore, to achieve higher performance, multiple layers of nanocrystals are integrated. This multi-layer nanocrystalline structure improves the permeability of the material and exhibits more stable performance, especially at high frequencies. Such a thin-layer structure maintains high performance while improving the magnetic saturation characteristics of the magnetic material in high-frequency environments. To further enhance the performance of the magnetic material layer, different thicknesses are defined in different regions of the magnetic material layer, and different numbers of nanocrystalline layers are set in different regions of the magnetic material layer to achieve these different thicknesses.

[0005] In wireless charging devices, the center of the electromagnetic coil is the region with the strongest magnetic field and is most prone to saturation. As the magnetic field strength increases, the magnetic material can reach a state of magnetic saturation, potentially reducing its permeability and efficiency. To raise the magnetic field to a higher level, prevent the magnetic material from becoming magnetically saturated, and minimize the product thickness, an industry solution is to thicken the magnetic material layer corresponding to the central region of the electromagnetic coil, by covering the magnetic material layer 100' with an additional smaller magnetic material layer 200', as shown in Figure 1. However, a step is created between the smaller magnetic material layer 200' and the larger magnetic material layer 100', resulting in significant burrs as shown in Figure 2. Due to their high hardness and sharp edges, these burrs can easily penetrate various protective films within the device and are prone to detachment and deformation, especially in high-temperature and vibrating environments, potentially causing greater safety hazards such as short circuits and battery explosions. Furthermore, during operation, wireless chargers can cause the coils to remain at high temperatures for extended periods, accelerating the deterioration of the adhesive and insulating layers on the coil wires. As the coils are used for longer periods, the number of pinholes within the coils increases, and these pinholes can form tiny short circuits with nanocrystals, potentially further reducing charging efficiency.

[0006] To minimize the risk of burrs and fragments generated during the processing and use of nanocrystalline materials, it is necessary to research better design proposals that improve product quality, extend lifespan, and further enhance product safety. [Overview of the project]

[0007] Based on this, there is a need to provide a magnetic shielding structure, a magnetic adsorption positioning structure, and a wireless charging device that reduce burr problems in magnetic shielding structures and improve safety.

[0008] This application provides a magnetic shielding structure comprising a first border structure layer, a magnetic material layer, and a second border structure layer, which are arranged sequentially. The first border structure layer and the second border structure layer are provided on both sides of the magnetic material layer, The magnetic material layer includes a first coating layer, an intermediate layer, and a second coating layer, which are sequentially stacked. The area of ​​the intermediate layer is smaller than the area of ​​the first coating layer and the area of ​​the second coating layer, and the first coating layer and the second coating layer each cover the intermediate layer from both sides.

[0009] In one embodiment, the edging structure layer includes an insulating edging structure.

[0010] In one embodiment, the first coating layer and / or the intermediate layer and / or the second coating layer comprises a plurality of composite magnetic material sheets.

[0011] In one embodiment, the magnetic material sheet is manufactured from a magnetic material, the magnetic material includes one or more of the following: ferrite material, amorphous / nanocrystalline alloy, soft magnetic composite material, and flexible magnetic film.

[0012] In one embodiment, a first escape opening is provided in the intermediate layer.

[0013] In one embodiment, the magnetic shielding structure further includes a shielding layer provided on the side of the first or second edging structure layer away from the magnetic material layer.

[0014] In one embodiment, the shield layer is a sheet-like structure made from a metal material.

[0015] In one embodiment, the metal material is copper.

[0016] In one embodiment, an adhesive layer is provided between the first edging structure layer, the magnetic material layer, and the second edging structure layer of the magnetic shield structure.

[0017] In one embodiment, an adhesive layer is provided between the first coating layer, the intermediate layer, and the second coating layer of the magnetic material layer.

[0018] This application further provides a magnetic adsorption positioning structure, comprising a magnetic shielding structure and a positioning magnetic ring, wherein the magnetic shielding structure and the positioning magnetic ring are arranged in a stacked manner, and the magnetic shielding structure covers the positioning magnetic ring in the stacking direction.

[0019] In one embodiment, the edge of the magnetic shield structure is aligned with the edge of the positioning magnetic ring.

[0020] In one embodiment, the edge of the magnetic shield structure extends radially to the outside of the edge of the positioning magnetic ring.

[0021] In one embodiment, the edge of the magnetic shield structure extends to the outside of the edge of the positioning magnetic ring in the axial direction of the positioning magnetic ring.

[0022] In one embodiment, the extended end of the magnetic shield structure has a stepped structure.

[0023] In one embodiment, the end of the magnetic shield structure is folded inside the positioning magnetic ring to form an entrainment portion.

[0024] This application further provides a magnetic adsorption positioning structure, including the magnetic shield structure and the positioning magnetic ring, and the magnetic shield structure is surrounded inside the positioning magnetic ring.

[0025] In one embodiment, the positioning magnetic ring has a notch, and the magnetic shield structure has a protrusion extending to the notch.

[0026] In one embodiment, the protrusion fits into the notch.

[0027] In one embodiment, the positioning magnetic ring includes a plurality of magnetic units, and the plurality of magnetic units are arranged in an annular array.

[0028] In one embodiment, a second avoidance port is provided in the positioning magnetic ring.

[0029] This application further provides a wireless charging device, which includes the magnetic adsorption positioning structure and the electromagnetic coil. The magnetic shield structure of the magnetic adsorption positioning structure covers the electromagnetic coil, and the electromagnetic coil is surrounded inside the positioning magnetic ring.

[0030] To more clearly illustrate the embodiments of the present invention or the technical solutions according to the prior art, the drawings necessary for describing the embodiments or the prior art will be briefly described. The drawings described below only show the embodiments of the present invention, and it is obvious that those skilled in the art can obtain the drawings of other embodiments based on these drawings without the need for creative efforts.

Brief Description of the Drawings

[0031] [Figure 1] It is a structural schematic diagram of a magnetic shield structure in the prior art. [Figure 2]This is a schematic diagram of a conventional magnetic shielding stacked structure. [Figure 3] This is a schematic diagram of the structure of a magnetic shielding structure in one embodiment of the present application. [Figure 4] This is a schematic diagram of the structure of a magnetic shield stacked structure according to one embodiment of this application. [Figure 5] This is a schematic diagram of an exploded view of a magnetic shielding structure in one specific embodiment of the present application. [Figure 6] This is a schematic diagram showing that the edge of the magnetic shield structure in one embodiment of this application is aligned with the positioning magnetic ring. [Figure 7] This is a schematic diagram showing that the edge of the magnetic shield structure in one embodiment of this application extends to the outside of the edge of the positioning magnetic ring. [Figure 8] This is a schematic diagram of the magnetic field line distribution in a conventional magnetic adsorption positioning structure. [Figure 9] This is a schematic diagram of the magnetic field line distribution of a magnetic adsorption positioning structure in one embodiment of this application. [Figure 10] This is a schematic diagram of the configuration of a wireless charging device according to one embodiment of this application. [Figure 11] This is a schematic diagram of a wireless charging device in another embodiment of the present application. [Figure 12] This is a schematic diagram of a wireless charging device in yet another embodiment of the present application. [Figure 13] This is a schematic diagram of a wireless charging device in yet another embodiment of the present application. [Figure 14] This is a schematic diagram of the configuration of a wireless charging device according to one embodiment of this application. [Modes for carrying out the invention]

[0032] To facilitate understanding of this application, the application will be described more completely below with reference to the relevant drawings. The drawings illustrate embodiments of this application. However, this application may be carried out in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of this application more thorough and comprehensive.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art. The terms used herein are for the sole purpose of describing specific embodiments and are not intended to limit this application.

[0034] The terms “first,” “second,” and so on as used in this application may be used herein to describe various elements, but it will be understood that these elements are not limited by these terms. These terms are used solely to distinguish a first element from another element. For example, without departing from the scope of this disclosure, a first resistor can be called a second resistor, and similarly, a second resistor can be called a first resistor. Both the first and second resistors are resistors, but they are not the same resistor.

[0035] To ensure understanding, in the following embodiments, "connection" should be understood as "electrical connection," "communication connection," etc., when the connected circuits, modules, units, etc., have the transmission of electrical signals or data to each other.

[0036] To make it clear, "at least one" means one or more, and "plural" means two or more. "at least part of an element" means part or all of an element.

[0037] As used herein, the singular forms “1,” “one,” and “the said / the said” may also include the plural form unless explicitly stated otherwise in the context. Furthermore, terms such as “includes / contains” or “having” identify the presence of a described feature, whole, step, action, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, actions, components, parts, or combinations thereof. At the same time, as used herein, the term “and / or” includes any combination of the relevant described items.

[0038] This application provides a magnetic shielding structure 10, which includes a three-layer structure as shown in Figure 3, and specifically includes a first border structure layer 100, a magnetic material layer 200, and a second border structure layer 300, which are arranged sequentially.

[0039] The first edging structure layer 100 and the second edging structure layer 300 are provided on the upper and lower sides of the magnetic material layer 200, respectively. The first edging structure layer 100 and the second edging structure layer 300 are used to enhance the mechanical strength of the magnetic material layer 200 and reduce magnetic leakage at the edges, thereby confining the magnetic force path within the magnetic shield structure 10. Furthermore, the first edging structure layer 100 and the second edging structure layer 300 can provide insulating protection to the internal structure of the magnetic shield structure 10.

[0040] Exemplary, the specific shapes and manufacturing materials of the first border structure layer 100 and the second border structure layer 300 are adapted to the actual application needs. The specific shapes and manufacturing materials of the first border structure layer 100 and the second border structure layer 300 are independent of each other and may be manufactured from the same material or from different types of materials. Exemplary, since the first border structure layer 100 and the second border structure layer 300 have high mechanical strength and can help suppress magnetic leakage, the manufacturing materials of the first border structure layer 100 and the second border structure layer 300 can be selected from several materials, such as thermoplastic polymers such as polymers with a base material such as PPS (polyphenylene sulfide), PA6T (heat-resistant nylon), or LCP (liquid crystal polymer) and fillers such as glass fiber (for increased rigidity) or magnetic powder (e.g., FeSiAl, for improved edge shielding), etc. This includes edge coating by mold pressing of epoxy resin, such as a polymer with epoxy resin + curing agent (e.g., bisphenol A type) as the base material and Al2O3 powder (thermal conductivity) and carbon fiber (conductivity, suppression of eddy currents at the edges) as modifiers; a magnetic polymer composite material with, for example, TPU (thermoplastic polyurethane) as the base material and sheet-like carbonyl iron powder as a functional filler; and a UV-curable acrylate edge coating such as a polymer with, for example, acrylate resin + nanoSiO2 (improvement of abrasion resistance) as the UV adhesive and carbon nanotubes (0.5 wt%, electrostatic conductivity) as an additive. Other feasible means are similar to those described above and can be selected by engineers according to the actual application scene, and will not be repeated here.

[0041] The magnetic material layer 200 includes a first coating layer 210, an intermediate layer 220, and a second coating layer 230 that are sequentially stacked. The area of ​​the intermediate layer 220 is smaller than the area of ​​the first coating layer 210 and the second coating layer 230, and the first coating layer 210 and the second coating layer 230 each cover the intermediate layer 220 from both sides, forming a stacked structure that is "approximately sandwich-like".

[0042] Specifically, the first coating layer 210, the intermediate layer 220, and the second coating layer 230 may consist of a single layer of magnetic material sheet, or they may be obtained by compounding multiple magnetic material sheets. The number of magnetic material sheets between the first coating layer 210, the intermediate layer 220, and the second coating layer 230 is independent of each other. During implementation, the number of magnetic material sheets compounded in each of the first coating layer 210, the intermediate layer 220, and the second coating layer 230 may be determined by the engineer according to application needs, such as product thickness and magnetic shielding performance.

[0043] Exemplary, as shown in Figure 4, the magnetic material sheet may be a nanocrystalline sheet manufactured from a nanocrystalline alloy material. Accordingly, multiple layers of magnetic material sheets may be composited into the first coating layer 210, the intermediate layer 220, and the second coating layer 230. For example, two layers of nanocrystalline sheets may be composited into the first coating layer 210, three layers of nanocrystalline sheets into the intermediate layer 220, and five layers of nanocrystalline sheets into the second coating layer 230. In this way, the first coating layer 210, the intermediate layer 220, and the second coating layer 230 can be obtained by compositing multiple layers of magnetic material sheets, which helps to adjust the layered structure of the first coating layer 210, the intermediate layer 220, and the second coating layer 230 according to actual usage needs, thereby improving the flexibility of structural design.

[0044] Specifically, the magnetic material sheet may be manufactured from a magnetic material, and the magnetic material may include ferrite materials, amorphous / nanocrystalline alloys, soft magnetic composite materials, flexible magnetic films, and the like. Specifically, the magnetic material sheet may be manufactured from a single magnetic material or from a combination of multiple magnetic materials, thereby meeting the needs of different application scenarios, such as the needs for magnetic shielding performance, mechanical strength, corrosion resistance, and heat resistance. The specific manufacturing formulation can be determined by the engineer according to the actual usage needs and will not be repeated in this embodiment.

[0045] For example, in the process of compounding magnetic material sheets to obtain a first coating layer 210, an intermediate layer 220, and a second coating layer 230, the compounding process between the magnetic material sheets can be selected according to application needs, for example, from a sheet material compounding process such as lamination bonding, magnetic film deposition bonding, knitted fiber bonding, powder sintering bonding, and gradient material bonding. Furthermore, the compounding process described above may be determined by the engineer during implementation according to application needs, and may be determined as one of them, for example, lamination bonding, or as a combination of multiple processes, for example, a combination of lamination bonding and gradient bonding.

[0046] Specifically, in this embodiment, the first coating layer 210, the intermediate layer 220, and the second coating layer 230 are all planar sheet-like structures, and the first coating layer 210, the intermediate layer 220, and the second coating layer 230 are stacked and distributed in a direction perpendicular to their own plane. In this embodiment, the horizontal plane is described as a reference plane parallel to the first coating layer 210, the intermediate layer 220, and the second coating layer 230. As described in this embodiment, the fact that the area of ​​the intermediate layer 220 is smaller than the area of ​​the first coating layer 210 and the area of ​​the second coating layer 230 means that, as a projected area on the horizontal plane, the projected area of ​​the intermediate layer 220 is smaller than the projected area of ​​the first coating layer 210 and the projected area of ​​the second coating layer 230. The distribution of the first coating layer 210 and the second coating layer 230 on both sides of the intermediate layer 220 to cover the intermediate layer 220 means that the projection of the intermediate layer 220 on a horizontal plane is covered by the first coating layer 210 and the second coating layer 230, that is, when viewed from a planar viewpoint and a bottom viewpoint on a horizontal plane, the intermediate layer 220 is completely covered and shielded by the first coating layer 210 and the second coating layer 230, respectively. In the subsequent lamination and adhesion process, the portions of the first coating layer 210 and the second coating layer 230 that extend beyond the intermediate layer 220 are filled into the intermediate layer 220, ultimately forming a coating of the first coating layer 210 and the second coating layer 230 over the intermediate layer 220.

[0047] The magnetic shield structure 10 described above includes a first border structure layer 100, a magnetic material layer 200, and a second border structure layer 300. The first border structure layer 100 and the second border structure layer 300 are provided on both sides of the magnetic material layer 200, thereby protecting the magnetic material layer 200 and providing mechanical support and insulating protection. The magnetic material layer 200 is used to provide a low magnetoresistance path and reduce electromagnetic interference. The magnetic material layer 200 includes a first coating layer 210, an intermediate layer 220, and a second coating layer 230 that are sequentially laminated. The area of ​​the intermediate layer 220 is smaller than that of the first coating layer 210 and the second coating layer 230, and the first coating layer 210 and the second coating layer 230 cover the intermediate layer 220 from both sides, thereby forming a "multiple magnetic core laminate." The magnetic core laminate consists of a first coating layer 210, an intermediate layer 220, and a second coating layer 230. The magnetic material layer 200 includes a plurality of magnetic core laminates, which are arranged in a stack. The area of ​​the magnetic core laminate located in the center of the stacked structure of the magnetic material layer 200 is smaller than the area of ​​the magnetic core laminates located on both sides of the stacked structure. The magnetic core laminates located on both sides of the stacked structure cover the magnetic core laminates located within the stacked structure. In implementation, the plurality of magnetic laminates provided in the magnetic material layer 200 are stacked and distributed based on the characteristic that a small area is provided in the center and larger areas are provided on both sides. The magnetic core laminates on both sides cover the magnetic core laminate with the small area in the center, realizing a stepped coating structure that is symmetrically distributed on both sides. This helps to limit the location of the step to the central region of the magnetic material layer 200, and the dimensions of the step are uniformly distributed on both sides of the stacked structure, reducing the dimensions of the step due to the difference in area. On the other hand, stepped lamination helps to distribute mechanical stress, thereby avoiding contact at sharp angles between layers and eliminating burrs at the edges and microcracks between layers that occur due to abrupt changes in area in conventional laminates. In applications, a magnetic core laminate with a small central area helps to reduce the concentration of high-frequency eddy currents, and when combined with a magnetic core laminate with large areas on both sides, it helps to reduce eddy current losses in applications.

[0048] As shown in Figure 5, when applied, the magnetic shield structure 10 is provided inside the wireless charging device, so its structure and shape are limited by the structure of the wireless charging device itself. For example, it needs to cooperate with related devices such as the electromagnetic coil 500, and there may be scenes where the connector or coil of the related devices such as the electromagnetic coil 500 needs to embed the magnetic shield structure 10. In such scenes, it is difficult for the magnetic shield structure 10 to maintain a regular shape such as a circle or rectangle. Based on the above problem, the magnetic shield structure 10 provided in this embodiment has a first avoidance opening 240 in the intermediate layer 220. In this way, the first avoidance opening 240 makes it possible to create a flexible and controllable space in the magnetic shield structure 10, thereby enabling the magnetic shield structure 10 to avoid other module structures or to further reduce the thickness of the magnetic material layer 200.

[0049] Specifically, the first avoidance opening 240 may be provided on the edge of the intermediate layer 220, that is, a groove-shaped notch is formed on the edge of the intermediate layer 220, thereby avoiding a modular structure such as a coil interface. The shape of the first avoidance opening 240 may be rectangular, circular, triangular, etc., and the specific shape and structure may be determined by the engineer according to the application needs. The first avoidance opening 240 may also be provided in the center of the intermediate layer 220, that is, a through hole is formed in the center of the intermediate layer 220 to satisfy the application needs of the notch, thereby satisfying the need to form a space in the center of the magnetic shield structure 10. In the above two types of applications of the first avoidance opening 240, since the first avoidance opening 240 is opened in the intermediate layer 220, there is a possibility that new edge burrs will be formed on the magnetic shield structure 10, making the structure unstable. Accordingly, a blunting treatment may be performed on the first avoidance opening 240 of the intermediate layer 220. For example, the blunting treatment may refer to processing the corners of the first avoidance opening 240 to change the sharp angle structure within it to an obtuse angle, or it may refer to adding a chamfered structure to the corners of the cross-section of the first avoidance opening 240 to change the corners from right angles to chamfered angles. In this way, even if the first avoidance opening 240 of various shapes is added, the effect of reducing edge burrs in the magnetic material layer 200 can be maintained.

[0050] In one embodiment, as shown in Figure 5, the magnetic shield structure 10 may further include a shield layer 400. Specifically, the shield layer 400 is provided on the side of the first edging structure layer 100 or the second edging structure layer 300 that is away from the magnetic material layer 200. During implementation, the shield layer 400 can suppress magnetic field leakage by eddy current loss, thereby improving the shielding performance and application stability of the magnetic shield structure 10.

[0051] For example, the shield layer 400 satisfies the characteristics of having high thermal conductivity and conductive / magnetic conductivity. The shield layer 400 may be a sheet-like structure manufactured from a metallic material, such as a copper foil sheet. The shield layer 400 may also be a metal matrix composite material, a flexible thermal conductive insulating material, a magnetic-thermal conductive composite layer, a phase-change material bonded metal layer, and the like.

[0052] In one embodiment, an adhesive layer is provided between the first edging structure layer 100, the magnetic material layer 200, and the second edging structure layer 300 of the magnetic shield structure 10, and an adhesive layer is also provided between the first coating layer 210, the intermediate layer 220, and the second coating layer 230 of the magnetic material layer 200. In this way, the adhesive layer strengthens the functional layers on both sides of the adhesive layer, improving the stability of the magnetic shield structure 10 and the stability of its electromagnetic performance.

[0053] For example, the adhesive layer may be an insulating adhesive layer, such as an epoxy resin adhesive, a polyimide adhesive film, or a silicone rubber; a thermally conductive adhesive layer, such as a conductive adhesive containing metal particles, a graphene-filled adhesive, or a ceramic-filled adhesive; a magnetically conductive adhesive layer, such as a magnetic particle adhesive or a nanocrystalline alloy adhesive; or a multifunctional composite adhesive layer, such as a gradient adhesive layer or a phase-change material adhesive layer. The adhesive layer may be directly bonded and fixed between the layer structures, or it may be fixed between the layer structures by a process such as thermocompression curing.

[0054] As shown in Figure 5, the magnetic shielding structure 10 has a layered structure. From top to bottom, it consists of a shielding layer 400, a first edging structure layer 100, a first coating layer 210, an intermediate layer 220, a second coating layer 230, and a second edging structure layer 300. When applied, the magnetic shielding structure 10 covers the electromagnetic coil 500. Specifically, the shielding layer 400 is a copper foil sheet, the first edging structure layer 100 is made of polymer and has a sheet-like structure, the first coating layer 210 is a nanocrystalline layer containing two nanocrystalline material sheets and is circular, and the intermediate layer 220 is a nanocrystalline layer containing three nanocrystalline material sheets and is circular. A rectangular notch is further provided at the edge of the intermediate layer 220, and the position of this notch corresponds to the connection part of the electromagnetic coil 500, thus allowing the overall thickness of the product to be reduced. The second coating layer 230 is a nanocrystalline layer containing five nanocrystalline material sheets and is circular in shape, while the second border structure layer 300 is made of polymer and has a sheet-like structure.

[0055] In this way, the first coating layer 210 and the second coating layer 230 cover the intermediate layer 220 from both sides, improving the stability of the magnetic shield structure 10.

[0056] This application further provides a magnetic adsorption positioning structure. As shown in Figure 6, the magnetic adsorption positioning structure includes a magnetic shielding structure 10 and a positioning magnetic ring 600. The magnetic shielding structure 10 is a magnetic shielding structure 10 described in any of the embodiments described above. The magnetic shielding structure 10 is used to restrict the magnetic field path, suppress the diffusion of the magnetic field, and reduce electromagnetic interference. The positioning magnetic ring 600 is used to adsorb to the magnetic ring of the corresponding device, provide magnetic adsorption force to the magnetic adsorption positioning structure, and realize the positioning adsorption function.

[0057] In one embodiment, the magnetic shield structure 10 and the positioning magnetic ring 600 are arranged in a stacked manner, and the magnetic shield structure 10 covers the positioning magnetic ring 600 in the stacking direction. Specifically, there are two situations in which the magnetic shield structure 10 covers the positioning magnetic ring 600 in the stacking direction: when the edge of the magnetic shield structure 10 is aligned with the edge of the positioning magnetic ring 600, and when the edge of the magnetic shield structure 10 extends to the outside of the edge of the positioning magnetic ring 600.

[0058] As shown in Figure 6, in this embodiment, the edge of the magnetic shield structure 10 is aligned with the edge of the positioning magnetic ring 600. Specifically, both the magnetic shield structure 10 and the positioning magnetic ring 600 in this embodiment are planar sheet structures, and the magnetic shield structure 10 and the positioning magnetic ring 600 are stacked in a direction perpendicular to the plane in which they are distributed. In this embodiment, an example can be given in which the horizontal plane is a reference plane parallel to the magnetic shield structure 10 and the positioning magnetic ring 600. In this way, the magnetic shield structure 10 described in this embodiment covers the positioning magnetic ring 600 in the stacking direction. Specifically as an example, the magnetic shield structure 10 and the positioning magnetic ring 600 are arranged on two horizontal planes parallel to each other, and the magnetic shield structure 10 and the positioning magnetic ring 600 are stacked along a vertical axis, in which case the stacking direction of both is the horizontal plane. Specifically, in this embodiment, the fact that the magnetic shield structure 10 covers the positioning magnetic ring 600 in the stacking direction means that the projection of the magnetic shield structure 10 on a horizontal plane covers the positioning magnetic ring 600, that is, when viewed from a plane view or bottom view of one side of the magnetic shield structure 10, the magnetic shield structure 10 is covering and concealing the positioning magnetic ring 600.

[0059] As shown in Figure 7, in one embodiment, the edge of the magnetic shield structure 10 extends to the outside of the edge of the positioning magnetic ring 600. The magnetic shield structure 10 may extend along the radial direction of the positioning magnetic ring 600 to the outside of the edge of the positioning magnetic ring 600. The edge of the magnetic shield structure 10 may extend along the axial direction of the positioning magnetic ring 600 to the outside of the edge of the positioning magnetic ring 600. In this way, the magnetic shield structure 10 covers at least partially the radial end of the positioning magnetic ring 600. In one embodiment, the extending edge of the magnetic shield structure 10 can adopt a stepped structure, thereby increasing the magnetic field attenuation effect at the edge. In another embodiment, the edge of the magnetic shield structure 10 can be folded inward to form a wrapped portion, further reducing magnetic leakage.

[0060] For example, the specific size of the extension from the positioning magnetic ring 600 of the magnetic shield structure 10 can be determined by the engineer according to the actual application needs, for example, 1 to 15 mm.

[0061] For example, in a process where the magnetic shielding structure 10 extends outside the edge of the positioning magnetic ring 600, this can be divided into asymmetric and symmetric extensions. If there is a need for shielding with a fixed direction, the magnetic shielding structure 10 may extend only in a specific direction, for example, towards the side closer to the sensitive element and extending from the positioning magnetic ring 600.

[0062] For example, the portion of the magnetic shield structure 10 extending to the edge can be realized by embedding or combining it with other magnetic shielding materials, such as permalloy wire or other alloy wires with high magnetic permeability. In this way, a local magnetic field absorption network can be formed, further absorbing the amount of magnetic flux diffused at the edge and reducing leakage at the edge.

[0063] For example, if the edge of the magnetic shielding structure 10 extends outside the edge of the positioning magnetic ring 600, the magnetic shielding structure 10 can further localize the magnetic field, suppress the diffusion of magnetic flux at the edge of the positioning magnetic ring 600, further enhance the magnetic attraction force of the magnetic attraction positioning structure, and reduce coupling interference from the external magnetic field to the positioning magnetic ring 600-electromagnetic coil 500 system. Figure 8 shows a schematic diagram of the magnetic field line distribution of a conventional magnetic attraction positioning structure. In conventional designs, the magnetic shielding structure 10 covers only the bottom of the transmitting coil, in which case the magnetic field lines generated by the positioning magnetic ring 600 and the magnetic ring of the corresponding device are partially absorbed on the surface of the positioning magnetic ring 600 and partially diffused outwards. Figure 9 shows a schematic diagram of the magnetic field line distribution of a magnetic attraction positioning structure in one embodiment of the present application. In this application, the magnetic shielding structure 10 extends to the region of the positioning magnetic ring 600, thereby allowing the magnetic shielding structure 10 to cover the positioning magnetic ring 600 in the stacking direction. In this case, such an extending design "compresses" the magnetic field lines generated by the positioning magnetic ring 600 and concentrates them on its surface, reducing the diffusion of the magnetic field to the surroundings and increasing the magnetic flux density on the surface of the positioning magnetic ring 600, i.e., increasing the surface magnetic strength of the positioning magnetic ring 600. On the other hand, although the magnetic field lines of the positioning magnetic ring 600 would normally diffuse into space, the extending magnetic shielding structure 10 has high permeability and can "guide" the magnetic field lines to close along the surface of the magnetic shielding structure 10. This is equivalent to creating a path of low magnetoresistance around the positioning magnetic ring 600, concentrating more magnetic field lines on the adsorption surface of the opposing positioning magnetic ring 600 and increasing the magnetic adsorption force of the magnetic adsorption positioning structure. The magnetic shielding structure 10 covers the positioning magnetic ring 600, further suppressing magnetic field leakage and reducing interference to antennas of charging devices such as smartphones and tablets, as well as to communication functions that use magnetic fields, such as NFC.As described above, the magnetic adsorption positioning structure according to this application satisfies the dimensional constraints of the wireless charging device, and instead of upgrading the magnetic material, it achieves the effect of enhancing magnetic adsorption force through structural features, thereby achieving cost control of the magnetic adsorption positioning structure. This enhances the device alignment assistance effect during charging and improves the overall performance of magnetic adsorption positioning and the stability of the charging connection.

[0064] Referring to Figure 10, in one embodiment, the positioning magnetic ring 600 can be positioned to surround the magnetic shield structure 10. When applied to a wireless charging device, the positioning magnetic ring 600 is further positioned to surround the electromagnetic coil 500 as well.

[0065] Referring to Figure 11, the magnetic shield structure 10 is surrounded by a positioning magnetic ring 600, and the positioning magnetic ring 600 has a notch 610. Accordingly, the magnetic shield structure 10 is provided with a projection 140 that extends to the notch 610. In this case, the projection 140 on the magnetic shield structure 10 can fill the space formed by the notch 610 in the positioning magnetic ring 600, thereby assisting in the local magnetic field adjustment of the magnetic adsorption positioning structure and increasing the local magnetic flux. Furthermore, the combined structure of the notch 610 and the projection 140 strengthens the mechanical combination relationship between the positioning magnetic ring 600 and the magnetic shield structure 10 in terms of physical structure, strengthens the relative positional relationship between the positioning magnetic ring 600 and the magnetic shield structure 10, and can reduce the possibility of misalignment due to rotation or sliding.

[0066] Specifically, in the manufacturing process of the positioning magnetic ring 600 and the magnetic shield structure 10, the notch 610 can be manufactured by methods such as pressing, milling, laser cutting, and die forming, and the projection 140 can be directly formed in a mold during press forming, deep drawing, or injection molding, or can be realized by subsequent machining. The notch 610 may be a U-shaped groove, a square groove, a chamfered groove, a circular notch, a crescent-shaped notch, a trapezoidal or polygonal notch, etc., and the specific structure of the notch 610 will be determined by the engineer according to the application needs. The projection 140 may be a projection corresponding to the shape of the notch 610, for example, a rectangular projection, a semicircular projection, a trapezoidal projection, etc.

[0067] Referring to Figure 12, in one embodiment, the positioning magnetic ring 600 includes a plurality of magnetic units 620. Each magnetic unit 620 may be obtained by sintering a permanent magnet material such as neodymium iron boron (NdFeB) and may be a magnetic unit 620 that meets predetermined size and geometric shape requirements. In the manufacturing process of the positioning magnetic ring 600, the magnetic units 620 are arranged in a ring-shaped array along the magnetic ring and, after magnetization pretreatment along the axial direction of the magnetic ring, can form a unipolar or multipolar distributed magnetic field.

[0068] Permanent magnet materials may also refer to a type of functional material that maintains strong magnetism for a long period of time after magnetization and is resistant to demagnetization. Its important properties include high remanent magnetization (Br), high coercivity (Hc), and high magnetic energy product ((BH)max).

[0069] Exemplary examples, the permanent magnet material may include metallic permanent magnet materials, such as aluminum nickel cobalt (AlNiCo) and samarium cobalt (SmCo); rare earth permanent magnet materials, such as neodymium iron boron (NdFeB) and samarium iron nitrogen (SmFeN); ferrite permanent magnet materials, such as strontium / barium ferrite; and other novel composite permanent magnet materials, such as Mn-Al-C alloys and nanocomposite permanent magnets.

[0070] When applied, the magnetic adsorption positioning structure is provided inside the wireless charging module, and therefore its structure and shape are limited by the structure of the wireless charging module itself. For example, it needs to work in conjunction with related devices such as the electromagnetic coil 500, and there are scenes where the connector or coil itself of related devices such as the electromagnetic coil 500 needs to be embedded in the magnetic shielding structure 10. In such scenes, it is difficult for the magnetic shielding structure 10 to maintain a regular shape such as a circle or rectangle. In light of the above problem, the magnetic unit 620 is provided with a second avoidance opening 630. In this way, the second avoidance opening 630 makes it possible to create a flexible and controllable space for the positioning magnetic ring 600, thereby achieving the objective of either moving the positioning magnetic ring 600 away from other module structures or further reducing the thickness of the magnetic adsorption positioning structure.

[0071] For example, the second avoidance port 630 may be provided on the edge of the positioning magnetic ring 600, that is, the second avoidance port 630 is formed on the edge of the positioning magnetic ring 600, thereby retracting from modular structures such as the interface of the electromagnetic coil 500. The shape of the second avoidance port 630 may be rectangular, circular, triangular, etc., and the specific shape and structure can be determined by the engineer according to the application needs. The second avoidance port 630 may also be provided inside the positioning magnetic ring 600, that is, a through hole that satisfies the application needs is formed inside the positioning magnetic ring 600, thereby satisfying the need to create space inside the magnetic adsorption positioning structure. In the above two types of applications of the second avoidance port 630, since the second avoidance port 630 is opened in the positioning magnetic ring 600, there is a risk that burrs will be formed on the edge of the magnetic adsorption positioning structure, causing structural instability. Accordingly, a blunting treatment may be performed on the second avoidance port 630 of the positioning magnetic ring 600. For example, the blunting process may refer to processing the corners of the second relief opening 630 to change the sharp angle structure within it to an obtuse angle, or it may refer to adding a chamfered structure to the corners of the cross-section of the second relief opening 630 to change the corners from right angles to chamfered angles. In this way, even when adding second relief openings 630 of various shapes, the effect of reducing edge burrs in the positioning magnetic ring 600 can be maintained.

[0072] In this embodiment, by providing a second avoidance port 630 in the annular array formed in the magnetic unit 620 of the positioning magnetic ring 600, the flexibility of the application of the magnetic adsorption positioning structure is improved.

[0073] In the embodiment shown in Figure 12, the second avoidance opening 630 and the notch 610 are located at different positions on the positioning magnetic ring 600. In another embodiment, as shown in Figure 13, the second avoidance opening 630 and the notch 610 are located at the same position on the positioning magnetic ring 600.

[0074] As shown in Figures 10 to 13, embodiments of the present application further provide a wireless charging device comprising a magnetic adsorption positioning structure and an electromagnetic coil 500, wherein the magnetic adsorption positioning structure is the magnetic adsorption positioning structure described in any of the embodiments described above. In the magnetic adsorption positioning structure, the magnetic shielding structure 10 covers the electromagnetic coil 500, and the electromagnetic coil 500 is arranged to be surrounded inside the positioning magnetic ring 600. In one embodiment, an intermediate layer 200 in the magnetic material layer 200 of the magnetic shielding structure 10 covers the central region of the electromagnetic coil 500.

[0075] The electromagnetic coil 500 is used to convert electrical energy into a magnetic field and to achieve wireless transmission of electrical energy by electromagnetic induction. Specifically, the electromagnetic coil 500 can be realized by several selectable structural types, such as a winding topology structure and a coil molding structure. Exemplarily, the winding topology structure may include a multilayer progressive helical winding, in which case the electromagnetic coil 500 can be formed by winding multiple layers of multilayer rectangular cross-section copper foil wire. Adjacent layers may be separated by a heat-resistant polyimide insulating film, and the turn spacing of the windings in each layer increases in a gradient from the inside to the outside, for example, the turn spacing of the inner layer is 0.1 mm and the turn spacing of the outer layer is 0.3 mm.

[0076] Exemplary, the coil-formed structure can be created by forming a wiring pattern on copper foil using a photolithography process, then alternately laminating insulating films onto the multilayer wiring, and finally forming an integrated winding module by heat-press curing. The winding module can then be embedded in the internal cavity of the magnetic shield structure 10 and sealed with epoxy resin or the like. The electromagnetic coil 500 can also be realized using methods such as segment winding or flexible coil, and other feasible methods are similar to those in this embodiment and will not be repeated here.

[0077] As shown in Figure 14, a schematic diagram of a wireless charging device is provided. Specifically, the wireless charging device includes a transmitting side (TX side) and a receiving side (RX side). The TX side is the transmitting portion in the wireless charging system, and is used to generate an alternating electromagnetic field and transmit electrical energy by electromagnetic coupling or magnetic induction. The RX side is used to receive electromagnetic energy from the TX side, convert it into electrical energy, and supply it to a load (e.g., a smartphone, battery, etc.). Specifically, the magnetic adsorption positioning device shown in the embodiment of this application may be provided on the RX side.

[0078] To ensure that it is understood that the magnetic shielding structure 10, magnetic adsorption positioning structure, and wireless charging device described above are not limited to the forms described in the embodiments, but may take other forms. Any form that achieves an improvement in the function of the magnetic shielding structure is included in the present application.

[0079] In this specification, terms such as “several embodiments” and “other embodiments” mean that certain features, structures, materials, or properties described in relation to such embodiments or examples are included in at least one embodiment or example of the Application. It should be noted that these terms, when used herein, do not necessarily refer to the same embodiment or example.

[0080] The technical features of the embodiments described above can be combined in any way. For the sake of brevity, not all combinations of the technical features in the embodiments described above have been described, but these combinations of technical features should be considered to fall within the scope described herein, as long as they are not contradictory.

[0081] The embodiments described above are merely examples of some embodiments of the present invention, and although their descriptions are specific and detailed, they should not be interpreted as limiting the scope of protection of the invention. Furthermore, a person skilled in the art can make some modifications and improvements as long as they do not deviate from the spirit of the present invention, and all of these also fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be in accordance with the claims for utility model registration. [Explanation of symbols]

[0082] 10...Magnetic shielding structure, 100...First edging structure layer, 140...Protrusion, 200...Magnetic material layer, 210...First coating layer, 220...Intermediate layer, 230...Second coating layer, 240...First avoidance port, 300...Second edging structure layer, 400...Shielding layer, 500...Electromagnetic coil, 600...Positioning magnetic ring, 610...Notch, 620...Magnetic unit, 630...Second avoidance port.

Claims

1. A magnetic shielding structure, It includes a first border structure layer, a magnetic material layer, and a second border structure layer, which are arranged in sequence. The first border structure layer and the second border structure layer are provided on both sides of the magnetic material layer, The magnetic material layer comprises a first coating layer, an intermediate layer, and a second coating layer, which are sequentially stacked, wherein the area of ​​the intermediate layer is smaller than the area of ​​the first coating layer and the area of ​​the second coating layer, and the first coating layer and the second coating layer each cover the intermediate layer from both sides.

2. The magnetic shielding structure according to claim 1, characterized in that the first coating layer and / or the intermediate layer and / or the second coating layer include a plurality of composite magnetic material sheets.

3. The magnetic shield structure according to claim 2, characterized in that the magnetic material sheet is manufactured from a magnetic material, and the magnetic material includes one or more of the following: ferrite material, amorphous / nanocrystalline alloy, soft magnetic composite material, and flexible magnetic film.

4. The magnetic shielding structure according to claim 1, characterized in that a first avoidance opening is provided in the intermediate layer.

5. The magnetic shielding structure further, The magnetic shield structure according to claim 1, further comprising a shield layer provided on the side of the first border structure layer or the second border structure layer away from the magnetic material layer.

6. The magnetic shielding structure according to claim 5, characterized in that the shielding layer is a sheet-like structure manufactured from a metal material.

7. The magnetic shield structure according to claim 1, characterized in that an adhesive layer is provided between the first edging structure layer, the magnetic material layer, and the second edging structure layer of the magnetic shield structure.

8. The magnetic shield structure according to claim 1, characterized in that an adhesive layer is provided between the first coating layer, the intermediate layer, and the second coating layer of the magnetic material layer.

9. A magnetic adsorption positioning structure, The magnetic shielding structure and positioning magnetic ring described in claim 1 are included, A magnetic adsorption positioning structure characterized in that the magnetic shield structure and the positioning magnetic ring are arranged in a stacked manner, and the magnetic shield structure covers the positioning magnetic ring in the stacking direction.

10. The magnetic adsorption positioning structure according to claim 9, characterized in that the edge of the magnetic shielding structure is aligned with the edge of the positioning magnetic ring.

11. The magnetic adsorption positioning structure according to claim 9, characterized in that the edge of the magnetic shielding structure extends to the outside of the edge of the positioning magnetic ring in the radial direction of the positioning magnetic ring.

12. The magnetic adsorption positioning structure according to claim 11, characterized in that the edge of the magnetic shielding structure extends to the outside of the edge of the positioning magnetic ring in the axial direction of the positioning magnetic ring.

13. The magnetic adsorption positioning structure according to claim 12, characterized in that the extended end of the magnetic shield structure has a stepped structure.

14. The magnetic adsorption positioning structure according to claim 12, characterized in that the end of the magnetic shielding structure is folded back inward to form a wound portion of the positioning magnetic ring.

15. A magnetic adsorption positioning structure, The magnetic shielding structure and positioning magnetic ring described in claim 1 are included, A magnetic adsorption positioning structure characterized in that the magnetic shielding structure is surrounded inside the positioning magnetic ring.

16. The magnetic adsorption positioning structure according to claim 15, characterized in that the positioning magnetic ring has a notch, and the magnetic shielding structure has a projection extending to the notch.

17. The magnetic adsorption positioning structure according to claim 15, characterized in that the positioning magnetic ring includes a plurality of magnetic units, and the plurality of magnetic units are arranged in a ring-shaped array.

18. The magnetic adsorption positioning structure according to claim 15, characterized in that a second avoidance port is provided in the positioning magnetic ring.

19. A wireless charging device, Includes the magnetic adsorption positioning structure and positioning magnetic ring described in claim 9, A wireless charging device characterized in that the magnetic shielding structure covers the electromagnetic coil, and the electromagnetic coil is surrounded inside the positioning magnetic ring.

20. A wireless charging device, Includes the magnetic adsorption positioning structure and positioning magnetic ring described in claim 15, A wireless charging device characterized in that the magnetic shielding structure of the magnetic adsorption positioning structure covers the electromagnetic coil, and the electromagnetic coil is surrounded inside the positioning magnetic ring.

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