Heated floor

Abstract

To provide a heating floor that has a floor heating mat with no joist-shaped member laid, and gives an excellent feeling of stepping to soles.SOLUTION: A floor heating mat 1 has a plurality of substrates 11 to 18 having grooves 2 on top surfaces, and a hot water pipe 3 arranged in the grooves 2. A board-like heat storage member 40 is laid on the floor heating mat 1, and a sound insulation floor 30 is laid on it. The heat storage member 40 in use is formed of a cured porous base material such as rock wool impregnated with a heat storage material-containing curable composition.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a heated floor that heats the floor of a building by passing hot water through it, and more particularly to a heated floor having a floor heating mat, a heat storage material, and flooring laid thereon.

[0002] In the following description, the upper surface of the floor heating mat refers to the upper surface when the floor heating mat is laid on the floor, and the lower surface of the floor heating mat refers to the lower surface when the floor heating mat is laid on the floor. [Background technology]

[0003] A widely used floor heating mat that uses hot water has hot water pipes routed through grooves in the upper surface of a plate-like base.

[0004] Figure 2 of Patent Document 1 shows a structure in which a hot water pipe is placed in the groove of a grooved mat layer, and a wooden soundproof floor material is placed on the mat layer with a cushion material interposed between them. The example of Patent Document 1 describes that the grooves are 7.2 mm wide and deep, and have a pitch of 75 mm.

[0005] Patent Document 2 describes a floor heating mat in which joist-like members are provided between foamed synthetic resin molded bodies equipped with hot water pipes. The joist-like members are for receiving loads from above and are made of wood or the like with a width of about 40 to 50 mm (Patent Document 2, paragraph 0018). Patent Document 2 also states that the joist-like members are arranged at a pitch of 300 to 305 mm (Claim 1).

[0006] In Patent Document 2, a floor finishing material (flooring) made of natural wood is placed on a heat dissipation panel as a floor heating mat (Patent Document 2, paragraph 0012). This floor finishing material is nailed to joist-like members (Patent Document 2, Figure 4).

[0007] Patent Document 3 describes a heated floor in which a heat storage unit as a heat storage member is placed on top of a heat generating mat as a floor heating mat, and flooring (floor finishing material) is placed on top of that. Note that Patent Document 3 also uses small floor joists, and an upper floor joist is placed so as to overlap the small floor joists.

[0008] In a heated floor in which a hot water floor heating mat is laid on a slab surface (a building frame floor surface) and a soundproof floor is laid directly on top of it, a cushioning material is used as a soundproofing material, so when the base of the floor heating mat (a base made of foamed synthetic resin) and the cushioning material overlap, an appropriate normal force is not applied to the sole of the foot to prevent the sole of the foot from sinking, which can cause an uncomfortable feeling in the sole of the foot. In addition, the hot water pipes arranged in the floor heating mat have high rigidity, but the base made of foamed synthetic resin has lower rigidity, so when the sole of the foot mainly steps on the base between the hot water pipes, the sole of the foot sinks significantly, causing an uncomfortable feeling. On the other hand, when the sole of the foot touches both the hot water pipe and the base, the part of the sole of the foot that touches the hot water pipe feels hard, and the part of the sole of the foot that touches the base feels soft, causing an uncomfortable feeling in the sole of the foot.

[0009] Even when a joist-like member is provided and flooring is placed on the joist-like member as in Patent Documents 2 and 3, if the flooring is soundproofed, when stepping on the boundary between the joist-like member (high rigidity) and the base (low rigidity), a hard and soft feel is simultaneously felt through the cushioning material, creating an uncomfortable feeling.

[0010] In Patent Document 3, a heat storage member (heat storage unit) is used in which a heat storage body is placed inside the frame of a frame section, and the frame section and heat storage body are sandwiched between panels of material from above and below. However, because the thickness of the panel material is small, the rigidity of the heat storage unit is low, and an uncomfortable feeling occurs when stepping on the boundary between the heat storage unit and the upper floor joist. [Prior art documents] [Patent documents]

[0011] [Patent Document 1] JP 2006-144273 A [Patent Document 2] JP 2008-309395 A [Patent Document 3] JP 2016-142432 A Summary of the Invention [Problem to be solved by the invention]

[0012] The present invention aims to provide a heated floor that provides a good feeling underfoot in a floor heating mat, a heat storage member and flooring. [Means for solving the problem]

[0013] In the heated floor of the present invention, a floor heating mat is laid on the floor surface, a board-shaped heat storage member is laid on the upper side of the floor heating mat, and flooring is provided on the upper side of the heat storage member.

[0014] In one aspect of the heated floor of the present invention, the heat storage member has a porous substrate and a heat storage material impregnated in the porous substrate.

[0015] In one embodiment of the heating floor of the present invention, the heat storage material is a heat storage material-containing cured product.

[0016] In one aspect of the heated floor of the present invention, the floor heating mat has a base plate having a groove on its upper surface for accommodating piping, and a hot water pipe accommodated in the groove, and does not have a joist-like member. Effect of the Invention

[0017] In the heated floor of the present invention, a board-shaped heat storage member is placed between the floor heating mat and the flooring, and when a person walks on the heated floor, the load on the soles of the feet is received by the board-shaped heat storage member, and the person does not feel any discomfort due to the soles of the feet sinking in, or feels almost no discomfort. In addition, no joist-shaped member is provided, and there is no boundary between the joist-shaped member and the floor heating mat or heat storage member. Therefore, no discomfort due to the boundary is caused even after many years of use. [Brief description of the drawings]

[0018] [Figure 1] 1 is a plan view of a floor heating mat used in a heating floor according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a vertical cross-sectional view of a heating floor according to an embodiment of the present invention. [Diagram 3] FIG. 2 is an exploded cross-sectional view of a heating floor according to an embodiment of the present invention. [Figure 4] (a) is an enlarged longitudinal cross-sectional view of the floor heating mat, and (b) is a cross-sectional view of the U-shaped aluminum and hot water pipe. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] Hereinafter, embodiments will be described with reference to the drawings. Note that the following embodiments are merely examples of the present invention, and the present invention may take forms other than the following embodiments.

[0020] This floor heating mat 1 comprises eight rectangular substrates (bases) 11-18, hot water pipes 3 arranged in grooves 2 (Fig. 4(a)) provided on the upper surface of each substrate 11-18, headers 4 (Fig. 1) to which the hot water pipes 3 are connected, and a heat spreading sheet 5 attached to the upper surface of each substrate 11-18 and disposed so as to cover the upper surface of each substrate 11-18. This floor heating mat 1 does not comprise joist-like members such as small joists or upper joists.

[0021] In the groove 2, as shown in FIG. 4(b), a heat transfer member 7 made of aluminum foil and called a U-shaped aluminum may be disposed in some cases. In this case, the hot water pipe 3 is disposed through the heat transfer member 7.

[0022] The substrates 11 to 18 have a density of 10 to 100 kg / m 3 For example, foamed polypropylene, foamed polyethylene, foamed polystyrene, foamed polyurethane, etc., having a thickness of about 20 to 150 mm can be used as the heat spreader sheet 5. For the attachment of the heat spreader sheet 5, adhesives such as acrylic, ethylene-vinyl acetate, polyamide, polyester, etc. can be used. However, these are merely examples, and the present invention is not limited to these.

[0023] The compressive stress (at 5% strain in a test according to JIS K 6767) of substrates 11 to 18 at 23° C. is preferably about 0.2 to 3.0 MPa, more preferably about 0.3 to 1.5 MPa. When the substrates are made of expanded polystyrene, the expansion ratio is preferably 5 to 60 times, more preferably 15 to 50 times.

[0024] The thickness a of the substrates 11 to 18 is preferably 6 mm or more, particularly 9 mm or more, especially 10 mm or more, and is 24 mm or less, particularly 18 mm or less, especially 15 mm or less.

[0025] The depth c of the groove 2 is preferably the sum of the diameter (outer diameter) of the hot water pipe 3 and the thickness of the heat transfer member 7. The outer diameter d of the hot water pipe 3 is preferably 3 mm or more, particularly 4 mm or more, and more particularly 5 mm or more, and is preferably 12 mm or less, particularly 10 mm or less, and more particularly 9 mm or less.

[0026] In one embodiment of the present invention, the ratio d / a of the outer diameter d to the thickness a of the substrates 11 to 18 is preferably 0.60 or more, particularly 0.63 or more, and 0.75 or less, particularly 0.72 or less.

[0027] In another embodiment of the present invention, d / a is preferably 0.40 or more, particularly preferably 0.42 or more, and 0.55 or less, particularly preferably 0.50 or less.

[0028] As shown in Fig. 1, rectangular substrates 11-14 are arranged in a row in this order with their long sides butting against each other. Substrates 15-18 are also arranged in a row in this order with their long sides butting against each other and adjacent to substrates 11-14. The short sides of substrates 11-14 butt against the short sides of substrates 15-18. As mentioned above, no joist-like members are used in this floor heating mat 1.

[0029] In each of the substrates 11-18, the grooves 2 extend parallel to the longitudinal direction of the substrates 11-18. Each groove extends from one end of the substrate in the longitudinal direction to the other end, curves in a generally U-shape at the other end, and extends from the other end to the one end. Some of the grooves 2 are further curved in a U-shape at the other end, and extend in a zigzag manner.

[0030] 1, one end of the forward side of two hot water pipes 3 is connected to the header 4, and is routed in the order of boards 15, 11, 12, 13, and 14, and the return side is routed in the order of boards 14, 13, 12, 11, and 15, and the other end of each hot water pipe 3 is connected to the header 4. The forward sides of the remaining two hot water pipes 3 are routed from the header 4 to boards 15, 16, 17, and 18, and the return sides are routed to boards 18, 17, 16, and 15, in that order.

[0031] The hot water pipe 3 is preferably made of cross-linked polyethylene, polyethylene, polypropylene, polybutene or the like.

[0032] The material used for the hot water pipe 3 has higher rigidity than the substrates 11-18, and specifically, the durometer hardness (measurement method JIS K 7215) at 23°C is preferably 50-75, particularly 55-70.

[0033] The floor heating mat 1 thus equipped with the substrates 11-18 and the hot water pipe 3 is laid on the floor slab 20 of a building as shown in Figures 2 and 3, a highly rigid board-like heat storage member 40 is laid on top of it, and a soundproof floor 30 is laid on top of that as flooring. In this embodiment, a shallow recess 21 is formed in the floor slab 20, and the floor heating mat 1 and the heat storage member 40 are placed in the recess 21. The upper surface of the heat storage member 40 and the slab surface 22 around the recess 21 are flush with each other. The soundproof floor 30 is laid so as to cover the upper surface of the heat storage member 40 and the slab surface 22.

[0034] In addition, the recess 21 may be omitted and the upper surface of the floor slab 20 may be made flat, and instead a dummy material of the same thickness as the floor heating mat 1 may be laid around the floor heating mat 1 and the heat storage member 40.

[0035] The board-shaped heat storage member 40 has a thickness of 0.5 to 15 mm, particularly 5 to 9 mm, and a compressive strength of 10 to 45 N / cm 2 , especially 15~40N / cm 2 A suitable method for producing the heat storage member will be described later.

[0036] In this embodiment, the soundproof floor 30 is preferably, but not limited to, constructed by laminating a veneer (a board material made by thinly slicing wood to about 0.2 to 0.6 mm) (not shown) on the surface of a base material 31 made of plywood, drilling a plurality of kerfs 32 on the back surface of the base material 31, and laminating a cushion layer 33. The overall thickness of the soundproof floor 30 is about 8 mm to 15 mm, and even thinner, about 8 to 10 mm.

[0037] The total thickness of the base material 31 and the veneer is preferably about 5 to 12 mm, particularly about 7 to 10 mm. Nonwoven fabric such as polyester, urethane sponge, etc. are suitable for the cushion layer 33. The thickness of the cushion layer 33 is preferably about 3 to 8 mm, particularly about 5 to 7 mm.

[0038] As a soundproof floor, a base material with a veneer applied to the upper surface, grooves are drilled from the rear surface of the base material, and a cushion layer is laminated on the rear surface.

[0039] In a heated floor (FIG. 2) using the floor heating mat 1 configured in this way, the floor heating mat 1 does not have any joist-like members, and the board-shaped heat storage member 40 is laid on the floor heating mat 1. Therefore, when walking on the soundproof floor 30, the load on the soles of the feet is received by the board-shaped heat storage member 40, and the soles of the feet do not sink or are hardly felt at all. As a result, the feeling of stepping on the floor is good. In particular, when the soundproof floor 30 is thin, the feeling of stepping on the floor is significantly improved compared to the conventional method. Furthermore, by placing the heat storage member 40 on the floor heating mat 1, a heated floor without uneven heating can be provided.

[0040] In addition, in this embodiment, since no joist-like member is provided as in Patent Document 2, even if the thickness of the substrates 11-18 decreases over time (due to long-term use of several years or more), there is no discomfort in the feeling of stepping on the floor due to the boundary between the joist-like member and the board-shaped heat storage member 40. That is, in a heated floor provided with a joist-like member as in Patent Document 2, a difference in thickness occurs over time in the heat storage member 40 or the floor heating mat between the area where the joist-like member is present and the area where the joist-like member is not present, which may cause unevenness in the feeling of stepping on the floor. In the heated floor of the present invention, since no joist-like member is present, there is no unevenness in the feeling of stepping on the floor due to the change in the thickness of the heat storage member or the floor heating mat over time.

[0041] A preferred method for producing the heat storage member will now be described.

[0042] In the present invention, the board-shaped heat storage member is preferably one obtained by impregnating a porous substrate with a curable heat storage composition containing a polyol (a), a compound (b) having an isocyanate group, and a heat storage material (c), followed by curing.

[0043] Such a heat storage member can be produced by a method in which a curable heat storage composition containing a polyol (a), a compound (b) having an isocyanate group, and a heat storage material (c) is impregnated into a porous substrate at a temperature equal to or higher than the melting point of the heat storage material (c), and then the composition is cured.

[0044] <Polyol (a)> The polyol of the component (a) is a component that reacts with the component (b) described below to form a three-dimensional crosslinked structure for supporting the heat storage material (c), and is capable of forming a dense crosslinked structure.

[0045] Examples of the polyol (a) include polyester polyols, polyether polyols, polyolefin polyols, polycarbonate polyols, polycaprolactone polyols, acrylic polyols, epoxy polyols, alkyd polyols, fluorine-containing polyols, silicon-containing polyols, cellulose and / or its derivatives, polysaccharides such as amylose, etc. As the component (a), only one of these may be used, or two or more may be mixed and used.

[0046] In the present invention, it is particularly preferred that the polyol (a) contains one or more selected from polyester polyols, polyether polyols, and polyolefin polyols, and the use of such polyols (a) has the advantages of being able to form a dense crosslinked structure, having good compatibility with the heat storage material (c) described below, and easily suppressing leakage of the heat storage material (c) from the three-dimensional crosslinked structure. Among these, it is preferred to contain a polyester polyol from the viewpoint of compatibility with the heat storage material (c).

[0047] Examples of polyester polyols include condensation polymers of polyhydric alcohols and polycarboxylic acids, ring-opening polymers of cyclic esters (lactones), reaction products of three components, polyhydric alcohols, polycarboxylic acids, and cyclic esters, castor oil or modified castor oils, etc. These may be used alone or in combination of two or more.

[0048] Examples of polyhydric alcohols include ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, trimethylene glycol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol, 1,3-tetramethylene diol, 1,4-tetramethylene diol, 1,6-hexanediol, 1,3-tetramethylene diol, 2-methyl-1,3-trimethylene diol, 1,5-pentamethylene diol, trimethylpentanediol, 2,2,4-trimethyl-1,3-pentanediol, neopentyl glycol, cyclohexanediol, 2-butyl-2-ethyl-1,3-propanediol, 1,6-hexamethylene diol, 3-methyl-1,5-pentamethylene diol, ol, 2,4-diethyl-1,5-pentamethylenediol, 1,8-octanediol, 1,9-nonanediol, 1,10-decanediol, meta-xylene glycol, para-xylene glycol, bishydroxyethoxybenzene, bishydroxyethyl terephthalate, glycerin, diglycerin, trimethylolpropane, ditrimethylolpropane, trimethylolethane, cyclohexanediols (1,4-cyclohexanediol, cyclohexanedimethanol, etc.), bisphenols (bisphenol A, etc.), sugar alcohols (xylitol, sorbitol, etc.), pentaerythritol, dipentaerythritol, 2-methylolpropanediol, ethoxylated trimethylolpropane, etc. These may be used alone or in combination of two or more.

[0049] Examples of polyvalent carboxylic acids include aliphatic dicarboxylic acids such as malonic acid, maleic acid, maleic anhydride, succinic acid, glutaric acid, adipic acid, suberic acid, azelaic acid, sebacic acid, and dodecanedioic acid; alicyclic dicarboxylic acids such as 1,4-cyclohexanedicarboxylic acid; aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, orthophthalic acid, phthalic anhydride, terephthalic acid, 2,6-naphthalenedicarboxylic acid, paraphenylenedicarboxylic acid, and trimellitic acid; and acid anhydrides thereof. These may be used alone or in combination of two or more.

[0050] Examples of the cyclic ester in the ring-opening polymer of the cyclic ester include propiolactone, β-methyl-δ-valerolactone, ε-caprolactone, etc. These may be used alone or in combination of two or more.

[0051] In the reaction product of the three components of the polyhydric alcohol, the polycarboxylic acid, and the cyclic ester, the polyhydric alcohol, the polycarboxylic acid, and the cyclic ester may be any of those exemplified above.

[0052] Examples of polyether polyols include aromatic polyether polyols, glycerin-based polyether polyols, and amino group-containing polyether polyols.Specific examples of aromatic polyether polyols include bisphenol A-based polyether polyols obtained by adding alkylene oxides (e.g., at least one of ethylene oxide, propylene oxide, etc.; the same applies below) to bisphenol A as an initiator, and aromatic amine-based polyether polyols obtained by adding alkylene oxides to aromatic amines (e.g., toluenediamine, diethyltoluenediamine, 4,4'-diaminodiphenylmethane, p-phenylenediamine, o-phenylenediamine, naphthalenediamine, triethanolamine, Mannich condensation products, etc.) as initiators.Examples of glycerin-based polyether polyols include polyether polyols obtained by adding alkylene oxides to glycerin as an initiator. Examples of amino group-containing polyether polyols include those obtained by adding alkylene oxide to low molecular weight amines (e.g., ethylenediamine, propylenediamine, butylenediamine, hexamethylenediamine, neopentyldiamine, etc.) as initiators. In the present invention, it is particularly preferable to use polyether polyols using glycerin as an initiator (glycerin-based polyether polyols).

[0053] The polyolefin polyol can be a polyol having an olefin as a component of the skeleton (or main chain) of a polymer or copolymer, having at least two hydroxyl groups in the molecule (particularly at the terminals), and having a number average molecular weight of 500 or more. The olefin may be an olefin having a carbon-carbon double bond at the terminal (e.g., α-olefins such as ethylene and propylene), an olefin having a carbon-carbon double bond at a site other than the terminal (e.g., isobutene), or even a diene (e.g., butadiene, isoprene).

[0054] The polyol (a) can be produced by a conventional method, and known curing agents, curing catalysts, etc. may be used, if necessary.

[0055] The hydroxyl value of the polyol (a) is not particularly limited, but is preferably about 10 to 500 KOHmg / g, and more preferably about 15 to 400 KOHmg / g.

[0056] The molecular weight of the polyol (a) is not particularly limited, but is preferably 100 to 20,000, more preferably 300 to 10,000, and even more preferably 1,000 or more and 8,000 or less. With such a molecular weight, a good three-dimensional crosslinked structure capable of sufficiently suppressing leakage of the heat storage material (c) can be formed. If the molecular weight of the polyol (a) is too small, the heat storage material (c) may easily leak. On the other hand, if the molecular weight is too large, the heat storage material (c) may not be sufficiently retained. The molecular weight referred to here is the weight average molecular weight in terms of polystyrene by the GPC method.

[0057] It is preferable to select and use the polyol (a) such that the viscosity at the melting temperature of the heat storage material (c) used in the curable heat storage composition is a suitable viscosity as described below.

[0058] <Compound (b) Having an Isocyanate Group> Component (b) reacts with the hydroxyl groups of polyol (a) to form a three-dimensional crosslinked structure. The isocyanate groups in component (b) have excellent reactivity with hydroxyl groups, allowing the reaction to proceed quickly and forming a dense crosslinked structure.

[0059] Examples of the compound (b) containing an isocyanate group include 1,3-Trimethylene diisocyanate, 1,4-Tetramethylene diisocyanate, 1,3-Pentamethylene diisocyanate, 1,5-Pentamethylene diisocyanate, 1,6-Hexamethylene diisocyanate (HMDI), 1,2-Propylene diisocyanate, 1,2-Butylene diisocyanate, 2,3-Butylene diisocyanate, 1,3-Butylene diisocyanate, 2-Methyl-1,5 Aliphatic diisocyanates such as pentamethylene diisocyanate, 3-methyl-1,5-pentamethylene diisocyanate, 2,4,4-trimethyl-1,6-hexamethylene diisocyanate, 2,2,4-trimethyl-1,6-hexamethylene diisocyanate, 2,6-diisocyanate methyl caproate, lysine diisocyanate, dimer acid diisocyanate, and norbornene diisocyanate; Alicyclic diisocyanates such as 1,3-cyclopentane diisocyanate, 1,4-cyclohexane diisocyanate, 1,3-cyclohexane diisocyanate, 3-isocyanatomethyl-3,5,5-trimethylcyclohexyl isocyanate, 4,4'-methylenebis(cyclohexyl isocyanate), methyl-2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate, 1,3-bis(isocyanatomethyl)cyclohexane, 1,4-bis(isocyanatomethyl)cyclohexane, isophorone diisocyanate (IPDI), norbornane diisocyanate, dicyclohexylmethane diisocyanate, hydrogenated diphenylmethane diisocyanate, and hydrogenated xylylene diisocyanate; m-Phenylene diisocyanate, p-Phenylene diisocyanate, 2,4-Tolylene diisocyanate (TDI), 2,6-Tolylene diisocyanate (TDI), Naphthylene-1,4-diisocyanate, Naphthylene-1,5-diisocyanate, 4,4´-Diphenyl diisocyanate, 4,4´-Diphenylmethane diisocyanate (MDI), 2,4´-Diphenylmethane diisocyanate, 4,4´-Diphenyl ether Diisocyanates, aromatic diisocyanates such as 2-nitrodiphenyl-4,4'-diisocyanate, 2,2'-diphenylpropane-4,4'-diisocyanate, 3,3'-dimethyldiphenylmethane-4,4'-diisocyanate, 4,4'-diphenylpropane diisocyanate, 3,3'-dimethoxydiphenyl-4,4'-diisocyanate, dianisidine diisocyanate, and tetramethylene xylylene diisocyanate; Aromatic aliphatic diisocyanates such as 1,3-xylylene diisocyanate (XDI), 1,4-xylylene diisocyanate (XDI), ω,ω´-diisocyanato-1,4-diethylbenzene, 1,3-bis(1-isocyanato-1-methylethyl)benzene, 1,4-bis(1-isocyanato-1-methylethyl)benzene, and 1,3-bis(α,α-dimethylisocyanatomethyl)benzene; and the like, and derivatives of these isocyanate group-containing compounds by allophanate formation, biuretization, dimerization (uretidione), trimerization (isocyanurate), adductization, carbodiimide reaction, etc., and mixtures thereof.

[0060] As the compound (b) having an isocyanate group, it is particularly preferable to use an aliphatic diisocyanate, and in particular, HMDI and its derivatives are preferred.

[0061] It is preferable to select the compound (b) having an isocyanate group so that the viscosity at the melting temperature of the heat storage material (c) used in the curable heat storage composition is a suitable viscosity as described below.

[0062] <Contents of polyol (a) and compound having an isocyanate group (b)> The content ratio of components (a) and (b) in the curable heat storage composition of the present invention may be set within a range such that the NCO / OH ratio (equivalent ratio) is preferably 0.5 to 5.0, more preferably 0.7 to 4.0, and even more preferably 0.8 to 3.0.

[0063] By keeping the NCO / OH ratio within such a range, the supporting strength of the heat storage material (c) can be increased, and a uniform and dense heat storage material-supporting three-dimensional crosslinked structure without leakage of the heat storage material (c) can be formed.

[0064] If the NCO / OH ratio is less than 0.5, the crosslinking rate is low, and sufficient physical properties such as curability, durability, and strength may not be secured, and the heat storage material (c) is likely to leak. If the NCO / OH ratio is more than 5.0, unreacted isocyanate groups remain, adversely affecting various physical properties of the heat storage material-supported three-dimensional crosslinked body, and the heat storage material-supported three-dimensional crosslinked body is likely to deteriorate.

[0065] <Thermal storage material (c)> Examples of the heat storage material (c) include inorganic latent heat storage materials and organic latent heat storage materials.

[0066] Examples of inorganic latent heat storage materials include hydrated salts such as sodium sulfate decahydrate, sodium carbonate decahydrate, sodium hydrogen phosphate dodecahydrate, sodium thiosulfate pentahydrate, and calcium chloride hexahydrate.

[0067] Examples of the organic latent heat storage material include aliphatic hydrocarbons, long-chain alcohols, long-chain fatty acids, long-chain fatty acid esters, polyether compounds, and fatty acid triglycerides.

[0068] The heat storage material (c) may be one or more of these heat storage materials.

[0069] In the present invention, when the curable heat storage composition is impregnated into the porous substrate, it is necessary to adjust the viscosity of the curable heat storage composition to an appropriate level so that the composition can smoothly penetrate into the voids of the porous substrate. For this purpose, it is preferable to use an organic latent heat storage material as the heat storage material (c), which can be melted and the viscosity can be easily reduced. Since the organic latent heat storage material has a high boiling point and is difficult to volatilize, there is almost no thinning during the formation of the heat storage material-supported three-dimensional crosslinked structure, and the heat storage performance is maintained for a long period of time, which is preferable. Furthermore, when an organic latent heat storage material is used, it is easy to set the phase change temperature according to the application, and for example, by mixing two or more organic latent heat storage materials with different phase change temperatures, the phase change temperature can be easily set.

[0070] Among the organic latent heat storage materials, the aliphatic hydrocarbons that can be used include, for example, aliphatic hydrocarbons having 8 to 30 carbon atoms. Specific examples include pentadecane (melting point 6°C), tetradecane (melting point 8°C), hexadecane (melting point 18°C), heptadecane (melting point 22°C), octadecane (melting point 28°C), nonadecane (melting point 32°C), icosane (melting point 36°C), docosane (melting point 44°C), paraffin wax, and the like.

[0071] As the long-chain alcohol, for example, a long-chain alcohol having 8 to 30 carbon atoms can be used, and specific examples thereof include capryl alcohol (melting point 7°C), lauryl alcohol (melting point 24°C), myristyl alcohol (melting point 38°C), and stearyl alcohol (melting point 58°C).

[0072] As the long-chain fatty acid, for example, a long-chain fatty acid having 8 to 30 carbon atoms can be used. Specific examples of the long-chain fatty acid include fatty acids such as octanoic acid (melting point 17°C), decanoic acid (melting point 32°C), dodecanoic acid (melting point 44°C), tetradecanoic acid (melting point 50°C), hexadecanoic acid (melting point 63°C), and octadecanoic acid (melting point 70°C).

[0073] As the long-chain fatty acid ester, for example, a long-chain fatty acid ester having 8 to 30 carbon atoms can be used. Specific examples thereof include methyl laurate (melting point 5°C), methyl myristate (melting point 19°C), methyl palmitate (melting point 30°C), butyl palmitate (melting point 15°C), methyl stearate (melting point 38°C), butyl stearate (melting point 25°C), methyl arachidate (melting point 45°C), stearyl stearate (melting point 60°C), distearyl phthalate, and the like.

[0074] Examples of the polyether compound include diethylene glycol, triethylene glycol, tetraethylene glycol, triethylene glycol monomethyl ether, polypropylene glycol, polyethylene glycol, polypropylene glycol diacrylate, and ethylethylene glycol.

[0075] Examples of fatty acid triglycerides include vegetable oils such as coconut oil and palm kernel oil, and their refined products such as medium-chain fatty acid triglycerides and long-chain fatty acid triglycerides.

[0076] In the present invention, it is particularly preferred to use aliphatic hydrocarbons and long-chain fatty acid esters as the heat storage material (c), and it is more preferred to use long-chain fatty acid esters. Among long-chain fatty acid esters, it is particularly preferred to use long-chain fatty acid esters having 15 to 22 carbon atoms, and such long-chain fatty acid esters have a high latent heat and a phase change temperature (melting point) in the practical temperature range, making them easy to use in various applications. Among them, it is particularly preferred to use one or a mixture of two or more of methyl palmitate, butyl palmitate, methyl stearate, and butyl stearate.

[0077] It is preferable to use a heat storage material (c) such as an organic latent heat storage material that has a suitable viscosity at its melting temperature, as described below.

[0078] The content of the heat storage material (c) in the curable heat storage composition is not particularly limited, but since this curable heat storage composition can support a large amount of the heat storage material (c) in a dense and intricate three-dimensional crosslinked structure, the heat storage material (c) content in the curable heat storage composition (the heat storage material (c) content in this curable heat storage composition corresponds to the amount of heat storage material supported in the heat storage material-supported three-dimensional crosslinked structure formed) can be preferably 40% by weight or more, more preferably 50% by weight or more, even more preferably 60% by weight or more, and particularly preferably 65% ​​by weight or more. In this way, by containing a large amount of the heat storage material (c), the heat storage material content of the obtained heat storage member can be increased, and the heat storage performance of the heat storage member can be improved. However, if the content of the heat storage material (c) in the curable heat storage composition is excessively high, the content of the three-dimensional crosslinked structure-forming components such as the (a) component and the (b) component will be relatively reduced, making it impossible to form a stable and strong three-dimensional crosslinked structure. Therefore, it is preferable that the content of the heat storage material (c) in the curable heat storage composition be 95% by weight or less, particularly 90% by weight or less, especially 85% by weight or less, and especially 80% by weight or less.

[0079] <Other ingredients> This curable heat storage composition may contain other components in addition to the above components (a), (b) and (c) as necessary.

[0080] For example, when two or more organic latent heat storage materials are mixed and used as the component (c), it is preferable to contain a compatibilizer. By containing a compatibilizer, the compatibility between the organic latent heat storage materials can be further improved. The compatibilizer not only improves the compatibility between the organic latent heat storage materials, but also improves the compatibility between the heat storage material (c) and the components (a) and (b), and is effective in forming a denser three-dimensional crosslinked structure and thereby improving the supporting performance of the heat storage material (c).

[0081] Examples of the compatibilizer include fatty acid triglycerides and nonionic surfactants having a hydrophilic-lipophilic balance (HLB) of 1 to 10, and these can be used alone or in combination of two or more kinds.

[0082] As described above, fatty acid triglycerides are also used as organic latent heat storage materials. Such fatty acid triglycerides are particularly preferred because they can further improve the compatibility between organic latent heat storage materials and have excellent heat storage properties. Examples of fatty acid triglycerides include vegetable oils such as coconut oil and palm kernel oil, and their refined products such as medium-chain fatty acid triglycerides and long-chain fatty acid triglycerides.

[0083] Examples of nonionic surfactants having a hydrophilic-lipophilic balance (HLB) of 1 to 10 include polyoxyethylene lauryl ether, polyoxyethylene oleyl ether, polyoxyethylene stearyl ether, sorbitan sesquioleate, sorbitan trioleate, sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan tristearate, glycerol monostearate, glycerol monooleate, glyceryl stearate, glyceryl caprylate, sorbitan stearate, sorbitan oleate, sorbitan sesquioleate, and sorbitan coconut fatty acid.

[0084] When the curable heat storage composition contains a compatibilizer, the compatibilizer is preferably contained in an amount of 0.1 to 30 parts by weight, particularly 0.5 to 20 parts by weight, per 100 parts by weight of the above-mentioned component (a).

[0085] In addition, the curable heat storage composition preferably contains a catalyst (reaction accelerator) in order to rapidly advance the curing reaction between the components (a) and (b).

[0086] Examples of the catalyst include amines such as triethylamine, triethylenediamine, triethylamine, tetramethylbutanediamine, dimethylaminoethanol, dimer diamine, and dimer acid polyamidoamine; tin carboxylates such as dibutyltin dilaurate, dibutyltin diacetate, and tin octoate; metal carboxylates such as iron naphthenate, cobalt naphthenate, manganese naphthenate, zinc naphthenate, iron octylate, cobalt octylate, manganese octylate, and zinc octylate; carboxylates such as dibutyltin thiocarboxylate, dioctyltin thiocarboxylate, tributylmethylammonium acetate, and trioctylmethylammonium acetate; and aluminum compounds such as aluminum trisacetylacetate. One or more of these can be used.

[0087] It is also preferable to select and use this catalyst so that the viscosity at the melting temperature of the heat storage material (c) used in the curable heat storage composition becomes a suitable viscosity, which will be described later.

[0088] The catalyst is usually used in an amount of 0.01 to 10 parts by weight, preferably 0.05 to 5 parts by weight, per 100 parts by weight of component (a). If the catalyst content is less than 0.01 parts by weight, the curability and strength of the three-dimensional crosslinked structure formed may be insufficient. On the other hand, if the catalyst content is more than 10 parts by weight, the durability and discoloration resistance of the three-dimensional crosslinked structure tend to decrease.

[0089] In addition to the above-mentioned components, the curable heat storage composition may contain various additives, such as plasticizers, preservatives, antifungal agents, anti-algae agents, defoamers, leveling agents, pigment dispersants, anti-settling agents, anti-sagging agents, curing accelerators, dehydrating agents, matting agents, flame retardants, ultraviolet absorbing agents, and light stabilizers.

[0090] The curable heat storage composition may contain a hydroxyl group-containing compound other than the polyol (a) described above, or a compound having a functional group capable of reacting with the hydroxyl group of the (a) component, such as a carboxyl group, an imide group, or an aldehyde group, other than the compound (b) having an isocyanate group.

[0091] It is also possible to add a thermally conductive material to the curable heat storage composition in order to improve the thermal efficiency of the heat storage material (c) and obtain better heat storage performance. Examples of the thermally conductive material include metals such as copper, iron, zinc, beryllium, magnesium, cobalt, nickel, titanium, zirconium, molybdenum, tungsten, boron, aluminum, gallium, silicon, germanium, and tin, and alloys thereof, or metal compounds such as metal oxides, metal nitrides, metal carbides, and metal phosphides containing these metals, and graphite such as scaly graphite, lump graphite, amorphous graphite, and fibrous graphite, and these can be used alone or in combination of two or more.

[0092] However, from the viewpoint of impregnation into the porous substrate, it is preferable that the curable heat storage composition of the present invention does not contain a thermally conductive substance.

[0093] The curable heat storage composition may include a viscosity modifier.

[0094] Examples of the viscosity regulator include layered clay minerals such as smectite and vermiculite, hydrophobic cellulose such as ethyl cellulose and cellulose nitrate, and polyolefins such as polyethylene and polypropylene, and one or more of these can be used. In particular, in the present invention, it is preferable to use layered clay minerals, and it is particularly preferable to use layered clay minerals that have been organically treated with long-chain alkyl ammonium ions or the like (organic smectites (organic montmorillonite, organic bentonite, etc.), organic vermiculite, etc.). By including a viscosity regulator, the viscosity of the curable heat storage composition can be adjusted, but the ratio of the viscosity regulator is preferably 10 parts by weight or less, more preferably 8 parts by weight or less, relative to 100 parts by weight of the (c) component, from the viewpoint of impregnation into the porous substrate, etc. It is also preferable that the curable heat storage composition of the present invention does not include such a viscosity regulator.

[0095] The curable heat storage composition may contain a nonionic surfactant having a hydrophilic-lipophilic balance (HLB value) of 10 or more (preferably 12 or more and 18 or less).

[0096] By including such a nonionic surfactant, the heat storage material (c) is supported in a finely and uniformly dispersed state on the three-dimensional crosslinked body, and thus it is possible to obtain better heat storage performance.

[0097] Examples of nonionic surfactants with a hydrophilic-lipophilic balance (HLB value) of 10 or more include: polyoxyethylene sorbitan fatty acid esters such as polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monopalmitate, polyoxyethylene sorbitan monostearate, and polyoxyethylene sorbitan monooleate; polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, and polyoxyethylene octyldodecyl ether; Polyoxyethylene sorbitol fatty acid esters such as polyoxyethylene sorbitol tetraoleate, Polyoxyethylene fatty acid esters such as polyethylene glycol monolaurate, polyethylene glycol monostearate, polyethylene glycol distearate, and polyethylene glycol monooleate; Polyoxyethylene hydrogenated castor oil, polyoxyethylene coconut oil fatty acid sorbitan etc.

[0098] <Viscosity> In order to enhance the impregnation into the porous substrate, the curable heat storage composition preferably has a viscosity of 10 to 500 mPa·s at the temperature during impregnation into the porous substrate. If the viscosity of the curable heat storage composition during impregnation is higher than 500 mPa·s, the curable heat storage composition may not be smoothly impregnated into the porous substrate. On the other hand, in order to reduce the viscosity of the curable heat storage composition to less than 10 mPa·s, it is necessary to reduce the contents of the (a) and (b) components, which may cause leakage of the heat storage material from the heat storage member.

[0099] Here, the temperature during impregnation is, as described later, a temperature equal to or higher than the melting point of the heat storage material (c), that is, the temperature at which the heat storage material (c) melts (melting temperature), and is usually in the range of the melting point of the heat storage material (c) to about the melting point + 40°C, preferably 40 to 80°C.

[0100] The viscosity of the curable heat storage composition at the time of impregnation is more preferably 12 to 400 mPa·s, further preferably 15 to 300 mPa·s, and particularly preferably 15 to 100 mPa·s.

[0101] The viscosity in the present invention is a value determined by measuring the viscosity at 20 rpm (the indicator value at the fourth revolution) using a BH type viscometer.

[0102] The viscosity of the curable heat storage composition can be controlled to the above suitable viscosity by adjusting the types and contents of the (a), (b), and (c) components used, and the types and contents of the other components.

[0103] In order to achieve the suitable viscosity described above, it is preferable that at the temperature during impregnation into the porous substrate, i.e., at a temperature range of the melting point of the heat storage material (c) to the melting point + 40°C of the heat storage material (c), the viscosity of the polyol (a) contained in the curable heat storage composition is 10 to 1000 mPa·s, particularly 30 to 500 mPa·s, and especially 50 to 450 mPa·s, and the viscosity of the compound (b) having an isocyanate group is 10 to 2000 mPa·s, particularly 50 to 1000 mPa·s.

[0104] If the viscosity of components (a) and (b) in the curable heat storage composition exceeds the above upper limit or is less than the above lower limit, it may be difficult to adjust the viscosity of the curable heat storage composition to the suitable value.

[0105] From the same viewpoint as above, it is preferable that the viscosity of the heat storage material (c) contained in the curable heat storage composition of the present invention when melted is 0.1 to 200 mPa·s, further 0.5 to 100 mPa·s, and particularly 1 to 50 mPa·s, and the viscosity of the catalyst at the melting temperature of this heat storage material (c) is 1 to 500 mPa·s, and particularly 3 to 300 mPa·s.

[0106] In many cases, the viscosity of the heat storage material (c) is lower than the viscosity of the components (a) and (b) in the curable heat storage composition. Therefore, by including a high ratio of the heat storage material (c), it becomes easier to adjust the viscosity of the curable heat storage composition to a predetermined value. However, in order to further improve the impregnation of the porous substrate, it is important to set the viscosity of the curable heat storage composition of the present invention to a desired range as described above, and it is necessary to adjust the types and content ratios of the components (a), (b), and (c), as well as the types and content ratios of other components.

[0107] Examples of the heat storage material (c) having a viscosity at the melting temperature that satisfies the above-mentioned preferred viscosity include methyl myristate, methyl palmitate, butyl palmitate, methyl stearate, and butyl stearate.

[0108] Moreover, the components (a) and (b) and the catalyst that satisfy the above-mentioned suitable viscosity may be appropriately selected and used according to the melting point and impregnation temperature of the heat storage material (c) used.

[0109] For example, when butyl palmitate (melting point 15°C), methyl myristate (melting point 19°C), methyl palmitate (melting point 30°C), methyl stearate (melting point 38°C), butyl stearate (melting point 25°C), or the like, which have melting points of 15 to 40°C, are used as the heat storage material (c), the impregnation temperature is usually set to about 45 to 80°C, so that polyester polyols, polyether polyols, polyolefin polyols, or the like can be used as the (a) component that satisfies the above-mentioned suitable viscosity at this temperature, and aliphatic diisocyanates, or the like can be used as the (b) component, and amines, tin carboxylates, metal carboxylates, or the like can be used as the catalyst.

[0110] Furthermore, when pentadecane (melting point 6°C), tetradecane (melting point 8°C), methyl laurate (melting point 5°C), or the like, having a melting point of 0 to 15°C, is used as the heat storage material (c), the impregnation temperature is usually set to about 40 to 70°C, and therefore polyester polyols, polyether polyols, polyolefin polyols, or the like can be used as component (a) that satisfies the above-mentioned suitable viscosity at this temperature, aliphatic diisocyanates, or the like can be used as component (b), and amines, tin carboxylates, metal carboxylates, or the like can be used as catalysts.

[0111] <Method of manufacturing the curable heat storage composition> The curable heat storage composition is produced by mixing predetermined amounts of the components (a), (b) and (c) and, if necessary, other components such as a catalyst.

[0112] In order to prevent a reaction between components (a) and (b) before the impregnation into the porous substrate, the curable heat storage composition may be produced as a two-part curing agent in which components (a) and (b) are separate components, and these may be mixed together immediately before the impregnation into the porous substrate for impregnation.

[0113] In this case, the curable heat storage composition of the present invention is usually prepared by mixing a base agent containing the components (a), (c), and other components, and a curing agent containing the component (b) before impregnation into the porous substrate. The curable heat storage composition of the present invention may also be prepared by separately preparing the components (a), (b), and (c), and impregnating the porous substrate with each of these in order.

[0114] The temperature at which the components are mixed during production of the curable heat storage composition is preferably the melting temperature of the heat storage material (c), ie, a temperature equal to or higher than the melting point, and more preferably within the range of the melting point to melting point + 40°C.

[0115] [Porous base material] Next, the porous substrate to be impregnated with the curable heat storage composition of the present invention will be described.

[0116] The porous substrate is not particularly limited as long as it has continuous pores that can be impregnated with the curable heat storage composition, and examples thereof include wood boards, inorganic porous boards, resin foams, nonwoven fabrics, woven fabrics, and paper.

[0117] Wood boards are produced by heating and pressurizing a mixture of lignocellulosic materials such as wood chips and fiber materials with a thermosetting adhesive such as phenolic resin, melamine resin, urea resin, urea-melamine co-condensation resin, or isocyanate resin, and then bonding the lignocellulosic materials with the thermosetting adhesive. Available types of wood boards include hardboard (hard fiberboard JIS A5905), MDF (medium density fiberboard JIS A5905), insulation board (soft fiberboard JIS A5905), particle board (JIS A5908), and insulation fiber insulation material (JIS A9521), but any of these may be used.

[0118] Examples of the material for the inorganic porous plate include diatomaceous earth, diatomaceous shale, calcium silicate, zeolite, bamboo charcoal, charcoal, etc. Foam glass can also be used.

[0119] The resin foam may be any foam having a heat resistance higher than the impregnation and curing temperature of the curable heat storage composition, and examples of such foam include polyethylene (high density polyethylene, linear low density polyethylene, low density polyethylene), polypropylene (isotactic polypropylene, syndiotactic polypropylene), polyethylene terephthalate, polybutylene terephthalate, polyamide (nylon 6, nylon 66, nylon 12), polystyrene, polycarbonate, polyvinyl alcohol, ABS resin, polymethyl methacrylate, polymethyl acrylate, polyvinyl chloride, polyvinylidene chloride, and polyvinyl butyral. Examples of the thermoplastic resin include resin foams obtained from one or two of thermoplastic resins such as polyacrylonitrile, polyether ether ketone, poly-4-methylpentene-1, polybutene-1, silicone resin, fluororesin (polytetrafluoroethylene, polyvinylidene fluoride), polyphenylene oxide, polyphenylene sulfide, polyimide resin (polyetherimide, polyamideimide), polyarylate, polyvinyl acetate, polyacrylamide, cellulose acetate, polysulfone, polyethersulfone, polyparaxylene, polymethylene oxide, polyethylene oxide, and polyvinylcarbazole.

[0120] As the nonwoven fabric or woven fabric, there can be used nonwoven fabric or woven fabric made of inorganic fibers such as glass fiber, ceramic fiber, or rock wool, or organic fibers such as polyester fiber.

[0121] The porous substrate preferably has a high porosity (air void ratio) from the viewpoint of impregnation and impregnation amount of the curable heat storage composition, while the porous substrate preferably has a low porosity from the viewpoint of strength and weight reduction. The porosity of the porous substrate used in the present invention is preferably 10 to 98%, and more preferably 30 to 90%.

[0122] Here, the "porosity" is a value calculated by "1-(bulk specific gravity of porous substrate / specific gravity of material constituting porous substrate)".

[0123] It is preferable that the entire porous substrate is impregnated with the curable heat storage composition and cured.

[0124] [Method of manufacturing heat storage member] The heat storage member can be produced by impregnating a porous substrate with the curable heat storage composition of the present invention at a temperature equal to or higher than the melting point of the heat storage material (c) in the curable heat storage composition, and curing the curable heat storage composition impregnated in the porous substrate.

[0125] The temperature during this impregnation is preferably equal to or higher than the melting point of the heat storage material (c), for example, from the melting point of the heat storage material (c) to melting point + 40°C.

[0126] If the temperature during impregnation is lower than the melting point of the heat storage material (c), the viscosity of the curable heat storage composition increases, making it difficult to be compatible and mixed with the (a) and (b) components, and the composition cannot be smoothly impregnated into the porous substrate. If the impregnation temperature is too high, the reaction may proceed excessively, making it difficult to impregnate and harden efficiently. Therefore, the impregnation temperature is preferably set in the range of the melting point of the heat storage material (c) to the melting point + 40°C. The specific impregnation temperature varies depending on the type of heat storage material (c) used, but is usually about 40 to 80°C.

[0127] In addition, the impregnation of the curable heat storage composition into the porous substrate is preferably carried out quickly so that the curing reaction does not proceed during the impregnation. In some cases, suction impregnation may be performed by suctioning from the surface of the porous substrate opposite to the surface impregnated with the curable heat storage composition.

[0128] Alternatively, the impregnation speed can be increased by forming a curable heat storage composition layer on the surface of the porous substrate and applying pressure from the surface of the curable heat storage composition layer.

[0129] However, by adjusting the viscosity of the curable heat storage composition to the above-mentioned preferred viscosity, it is usually possible to impregnate the curable heat storage composition without carrying out the above-mentioned suction impregnation or pressure impregnation.

[0130] That is, for example, the curable heat storage composition can be applied to the surface of the porous substrate, and the curable heat storage composition can be allowed to penetrate into the continuous pores of the porous substrate, thereby easily achieving impregnation.

[0131] The porous substrate may be impregnated with the curable heat storage composition in one permeation step, or in multiple permeation steps. The curable heat storage composition to be impregnated may be one type or two or more types.

[0132] For example, in a method of impregnating the curable heat storage composition in multiple infiltration steps, the porous substrate can be impregnated through a two-stage process in which the curable heat storage composition containing 50% or more by weight of the heat storage material (c) is first impregnated, and then the curable heat storage composition containing less than 50% by weight of the heat storage material (c) is impregnated. This method provides a heat storage member in which the inside of the porous substrate contains a large amount of the heat storage material (c) and the surface of the porous substrate contains less of the heat storage material (c), and thus the porous substrate can be provided with excellent heat storage performance, excellent anti-dissipation properties, and prevention of leakage of the heat storage material (c).

[0133] In addition, for example, in a method of impregnating a porous substrate with two or more curable heat storage compositions containing heat storage materials (c) having different melting points, the curable heat storage composition is impregnated into the porous substrate, and then the curable heat storage composition containing a heat storage material (c) having a melting point different from that of the heat storage material (c) in the curable heat storage composition is impregnated into the porous substrate. This makes it possible to ensure heat storage properties over a wider temperature range, and also makes it possible to obtain a heat storage member having different heat storage temperatures on the front and back sides, which can be used for various purposes.

[0134] In order to enhance the impregnation of the curable heat storage composition, it is preferable to thoroughly dry the porous substrate before the impregnation treatment to remove moisture and the like from within the pores.

[0135] The reaction conditions for the curing reaction after impregnation vary depending on the type and composition of the curable heat storage composition, but are usually at about 40 to 90° C. for about 30 minutes to 5 hours.

[0136] After impregnation with the curable heat storage composition, a protective layer can be provided as necessary by applying various coatings to the outermost surface of the heat storage member or by attaching a sheet / film or the like.

[0137] The content of the heat storage material (c) in the heat storage member thus produced can be adjusted by the concentration of the heat storage material (c) in the curable heat storage composition or the amount of impregnation. For example, when a wood board is used as the porous substrate, the heat storage member can be provided with high heat storage properties by containing about 100 to 300% by weight of the heat storage material (c) relative to the porous substrate.

[0138] The above-described embodiment is merely an example of the present invention, and the present invention may be embodied in other forms than those described above. EXAMPLES

[0139] Experimental Examples 1 to 4 were carried out as follows. [Purpose of the experiment] The reason why the heated floor of the present invention provides a good feeling underfoot is that, as described above, there is little sinking when the board-shaped heat storage member and floor heating mat are stepped on.

[0140] Therefore, we stacked expanded polystyrene (hereinafter referred to as EPS) with an expansion ratio of 20 times (Experimental Examples 1 and 2) or 40 times (Experimental Examples 3 and 4) as a replacement for floor heating mats, a board-shaped heat storage material, and a soundproof floor material (flooring), and measured the surface area of ​​the material to be 10 × 10 cm = 100 cm. 2 A compression test was performed by applying a predetermined load to each laminate for a predetermined time, and the amount of strain (mm) was measured. [Experimental Example 1] <Floor heating mat replacement> EPS with 20 times expansion ratio (thickness 12mm) <Soundproof flooring> Direct Excel 45HW (direct-attached flooring material) manufactured by Eida Sangyo Co., Ltd. Total thickness 13.5mm Soundproofing material 4.5mm <Board-shaped heat storage material> Bulk density 0.34g / cm 3The thermal storage composition was impregnated into rock wool with a porosity of 87% as follows (thickness: 12 mm, compressive strength: 25 N / cm 2 ). <Raw material for curable heat storage composition> Polyester polyol (a): Castor oil-based polyester polyol Compound having an isocyanate group (b): Solvent-free MDI-based polyisocyanate (NCO%: 16%, viscosity at 50°C: 500 mPa·s) Heat storage material (c): Methyl palmitate (melting point: 30.0°C, latent heat: 210 kJ / kg, viscosity at 50°C: 5 mPa·s) Catalyst: Dibutyltin dilaurate (viscosity at 50°C: 30 mPa·s) <Impregnation method> A curable heat storage composition was produced by mixing 28 parts by weight of polyol (a), 5 parts by weight of compound (b) having an isocyanate group, 67 parts by weight of heat storage material (c), and 0.25 parts by weight of catalyst at 60°C. The viscosity of this curable heat storage composition at an impregnation temperature of 50°C was 30 mPa s and the specific gravity was 0.90.

[0141] After drying the rock wool board at 40° C. for 48 hours, the rock wool board was impregnated with the curable heat storage composition held at 50° C., and then cured for 240 minutes in an oven at 80° C. The impregnation with the curable heat storage composition was performed by placing the rock wool board in a frame with the same area as the rock wool board, and applying an undiluted solution of the curable heat storage composition onto the rock wool board.

[0142] The specific gravity of the obtained board-shaped heat storage member (heat storage board) was 0.71, and from the specific gravity after impregnation and hardening and the specific gravity of the rock wool board, which was the porous base material before impregnation, the remaining porosity of the porous base material was calculated to be 45.1%.

[0143] In an evaluation of the impregnation property of the obtained board-shaped heat storage member, it was confirmed that the curable heat storage composition was impregnated throughout its entire thickness. <Compression test and results> As above, 10×10cm=100cm 2The laminate was cut into pieces and subjected to a load of 1.5 kg / cm 2 The strain (mm) was measured after 2 hours. The results are shown in Table 1. [Experimental Example 2] A test was carried out in the same manner as in Experimental Example 1, except that a 3 mm thick soft PVC base heat storage sheet (specific gravity 0.1, heat storage material content 35%) was used as the heat storage member. The results are shown in Table 1. [Experimental Example 3] A test was carried out in the same manner as in Experimental Example 1, except that EPS with an expansion ratio of 45 was used. The results are shown in Table 1. [Experimental Example 4] Except for not using the heat storage member, a test was carried out in the same manner as in Experimental Example 1. The results are shown in Table 1.

[0144] [Table 1]

[0145] As shown in Table 1, it was confirmed that the laminates using the board-shaped heat storage member (Experimental Examples 1 to 3) had smaller distortion amounts and better stepping feel than Experimental Example 4 which did not use a board-shaped heat storage member.

[0146] It was also found that the amount of distortion was smaller when the EPS expansion ratio was lower than 45. It is considered that the EPS expansion ratio is preferably 50 times or less, and more preferably 30 times or less. [Explanation of symbols]

[0147] 1. Floor heating mat 2 grooves 3 Hot water pipe 4. Header 5. Heat-dispersing sheet 11~18 Board 20 Slab 30 Soundproof floor 40 Heat storage material

Claims

1. A heating floor in which a floor heating mat is laid on a floor surface, a sheet or board-shaped heat storage member is laid on the upper side of the floor heating mat, and flooring is provided on the upper side of the heat storage member, The heat storage member has a porous substrate and a heat storage material-containing cured material impregnated in the porous substrate, The floor heating mat has a base plate having a groove on the upper surface for accommodating piping, and a hot water pipe accommodated in the groove, and does not have a joist-like member; The heat storage member has a thickness of 5 to 15 mm and a compressive strength of 15 to 45 N / cm 2 .

2. The heated floor of claim 1, wherein the substrate is made of expanded polypropylene, expanded polyethylene, expanded polystyrene, or expanded polyurethane having a density of 10 to 100 kg / m 3 and a thickness of 6 to 18 mm.

3. The substrates include a plurality of rectangular first substrates arranged with their long sides butted together, and a plurality of rectangular second substrates arranged with their long sides butted together, The short side of the first substrate and the short side of the second substrate are butted against each other. The heated floor of claim 2.

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