IC card manufacturing method

Abstract

To harden adhesive to be used in manufacturing an IC card, evenly.SOLUTION: A method for manufacturing an IC card formed by laminating inlets including an IC chip and an antenna between a pair of substrates with adhesive includes: a step of applying first adhesive on one surface of a first substrate sheet and arranging a plurality of inlets on the first adhesive; a step of applying second adhesive on one surface of the second substrate sheet; a step of arranging a ventilation sheet between the first substrate sheet and the second substrate sheet, and clamping the first substrate sheet and the second substrate sheet, while the surface with the first adhesive applied thereon facing the surface with the second adhesive applied thereon, to manufacture an IC card-formed sheet; and a step of hardening the adhesive included in the IC card-formed sheet.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a method for manufacturing an IC card, an IC card, and an IC card forming sheet. [Background technology]

[0002] Integrated circuits (ICs) used to verify personal identity, such as employee IDs and student IDs The cellular phone (Cell Phone) card incorporates an integrated circuit called an inlet, which has an IC chip and an antenna.

[0003] Known methods for manufacturing such IC cards include a thermal lamination method, an adhesive lamination method, an injection molding method, etc. Among these, in the moisture-curing adhesive lamination method, a sheet-like first base material on which adhesive and a number of inlets are arranged and a web-like second base material on which adhesive is applied are sandwiched between nip rollers to obtain a laminated structure with a uniform thickness. The obtained laminated structure is cut in the width direction to sequentially produce IC card forming sheets including a number of inlets.

[0004] The obtained IC card forming sheets are stacked on top of each other and subjected to an aging treatment. During the aging treatment, the moisture-curing adhesive contained in the IC card forming sheets absorbs moisture and gradually hardens. Individual IC cards are obtained by punching out the IC card forming sheets with the hardened adhesive into the desired card shape.

[0005] During the aging process, the IC card forming sheets are stacked together with no gaps between them, so each IC card forming sheet can absorb moisture in its peripheral area, but not in its central area. This makes it difficult for the adhesive in the central area to harden, and when the IC card is punched out, cutting debris is generated from the unhardened adhesive in the central area. If the cutting debris adheres to the surface of the IC card, it will have a negative effect on the print quality and reduce production efficiency. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2016-71744 A Summary of the Invention [Problem to be solved by the invention]

[0007] An object of the present disclosure is to provide an IC card manufacturing method capable of hardening an adhesive used in manufacturing an IC card with less unevenness, an IC card, and an IC card forming sheet. [Means for solving the problem]

[0008] The IC card manufacturing method of the present disclosure is a method for manufacturing an IC card in which an inlet including an IC chip and an antenna is laminated between a pair of base materials via an adhesive, and includes the steps of applying a first adhesive to one side of a first base sheet and arranging a plurality of inlets on the first adhesive, applying a second adhesive to one side of a second base sheet, arranging a breathable sheet between the first base sheet and the second base sheet, and clamping and pressing the first base sheet and the second base sheet with the side applied with the first adhesive facing the side applied with the second adhesive to produce an IC card forming sheet, and hardening the adhesive contained in the IC card forming sheet.

[0009] The IC card of the present disclosure comprises a first base material layer, a first adhesive layer provided on the first base material layer and accommodating an inlet including an IC chip and an antenna, a breathable sheet provided on the first adhesive layer, a second adhesive layer provided on the breathable sheet, and a second base material layer provided on the second adhesive layer.

[0010] The IC card forming sheet of the present disclosure comprises a first base sheet, a first adhesive layer provided on the first base sheet and accommodating a plurality of inlets each including an IC chip and an antenna, a breathable sheet provided on the first adhesive layer and having a size equal to or larger than that of the first base sheet, a second adhesive layer provided on the breathable sheet, and a second base sheet provided on the second adhesive layer. Effect of the Invention

[0011] According to the present disclosure, the adhesive used in manufacturing an IC card can be cured with less unevenness. [Brief description of the drawings]

[0012] [Figure 1] 1 is a plan view of an IC card according to an embodiment of the present disclosure. [Diagram 2] FIG. 2 is a cross-sectional view of an IC card according to the embodiment. [Diagram 3] 3a and 3b are a cross-sectional view and a plan view for explaining a method for manufacturing an IC card. [Figure 4] 4a and 4b are a cross-sectional view and a plan view for explaining a method for manufacturing an IC card. [Diagram 5] 5a and 5b are a cross-sectional view and a plan view for explaining a method for manufacturing an IC card. [Figure 6] 6a and 6b are a cross-sectional view and a perspective view for explaining a method for manufacturing an IC card. [Figure 7] FIG. 13 is a diagram showing a state in which IC card forming sheets are stacked. [Figure 8] 10 is a schematic diagram showing the flow of air entering the inside of the IC card forming sheet. FIG. [Figure 9] FIG. 11 is a plan view of a ventilation sheet according to another embodiment. [Figure 10] 5A to 5C are cross-sectional views illustrating a method for manufacturing an IC card. [Figure 11] 11a and 11b are plan views of a breathable sheet according to another embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Note that the present disclosure can be implemented in many different forms, and should not be interpreted as being limited to the description of the embodiments exemplified below. In addition, in order to clarify the explanation, the drawings may show the width, thickness, etc. of each part in a schematic manner compared to the actual form, but these are merely examples and do not limit the interpretation of the present disclosure.

[0014] 1 and 2, an IC card 70 according to an embodiment of the present disclosure incorporates an integrated circuit called an inlet 80 for recording information and performing calculations. The IC card 70 is used to authenticate an individual's identity, such as an employee ID card or a student ID card.

[0015] The IC card 70 includes, in this order from the front side to the back side, a printing layer 71, a receiving layer 72, a cushion layer 73, a first base material layer 74, an adhesive layer 75a, a breathable sheet 4, an adhesive layer 75b, and a second base material layer 76. An inlet 80 is accommodated in the adhesive layer 75a.

[0016] The printed layer 71 is typically formed by thermally transferring a coloring material from a thermal transfer sheet to the receiving layer 72. The printed layer 71 shown in FIG. 2 includes a pre-printed layer that is printed in advance before the IC card 70 is produced. An example of information printed as a pre-printed layer is printed information common to other IC cards 70, such as a picture, pattern, or frame. The printed layer 71 may further include an individual printed layer that is printed after the IC card 70 is produced, as necessary. An example of information printed as an individual printed layer is individual printed information, such as an image or written information related to an individual.

[0017] The receiving layer 72 is a layer configured to receive the coloring material transferred from the thermal transfer sheet by heat. The material forming the receiving layer 72 is a resin material that easily receives thermally transferred coloring materials such as sublimation dyes or heat-melting inks. Examples of materials forming the receiving layer 72 include vinyl chloride resins, acrylic-styrene resins, and polyester resins.

[0018] The cushion layer 73 exhibits appropriate cushioning properties and contributes to stable recording of the printing layer 71 that is thermally transferred to the receiving layer 72. As an example, the cushion layer 73 is obtained by dispersing hollow particles made of an inorganic material in a binder resin made of gelatin.

[0019] The first substrate layer 74 and the second substrate layer 76 protect the inlet 80 housed in the IC card 70 and constitute the main body of the IC card 70. The material forming the first substrate layer 74 and the second substrate layer 76 is not particularly limited, but may be, for example, a polyester resin such as polyethylene terephthalate. Note that a writing layer may be further laminated on the second substrate layer 76 as necessary.

[0020] An adhesive layer 75a, a breathable sheet 4, and an adhesive layer 75b are disposed between the first base material layer 74 and the second base material layer 76. The adhesive layer 75a (first adhesive layer) bonds the first base material layer 74 and the breathable sheet 4, and also houses and protects the inlet 80. The adhesive layer 75b (second adhesive layer) bonds the breathable sheet 4 and the second base material layer 76. A moisture-curing adhesive that absorbs moisture and gradually cures is typically used as a material for forming the adhesive layers 75a and 75b. An example of such a material is a hot melt adhesive.

[0021] Although not shown, the inlet 80 includes a plate-shaped inlet substrate, an IC chip disposed on the inlet substrate, and an antenna electrically connected to the IC chip. The inlet substrate is made of a film or nonwoven fabric. The antenna is made of a conductor such as Al, Cu, or Ag.

[0022] The IC chip has a memory section for storing information, and a control section for controlling the operation of storing information in the memory section, the operation of reading information from the memory section, and the operation of wireless communication. This IC chip reads information via an antenna to an interrogator such as a reader / writer (not shown), or stores information input from the interrogator via the antenna.

[0023] The breathable sheet 4 is a resin sheet having breathability, for example, a nonwoven fabric sheet using polyester fibers, polyethylene fibers, polypropylene fibers, etc. The breathable sheet 4 has a basis weight of 10 g / m 2 More than 80g / m 2 Less than 30 g / m is preferable. 2 More than 70g / m 2 The following is more preferable. The thickness of the breathable sheet 4 is preferably 100 μm or more and 400 μm or less, and more preferably 200 μm or more and 350 μm or less. By setting the basis weight and thickness of the breathable sheet 4 within this range, it is possible to suppress the penetration of the adhesive into the breathable sheet 4, ensure the breathability of the breathable sheet 4, and make the thickness of the entire IC card satisfy the card standard. In the example shown in FIG. 2, the breathable sheet 4 is provided on the entire surface of the IC card 70, and the peripheral portion of the breathable sheet 4 is exposed at the end face of the IC card 70.

[0024] Next, a method for manufacturing an IC card according to this embodiment will be described with reference to FIGS.

[0025] As shown in Figures 3a and 3b, a sheet-like first base sheet 10 is prepared. The first base sheet 10 includes the above-mentioned first base layer 74, cushion layer 73, receiving layer 72, and printing layer 71. A pre-printed layer such as a picture, pattern, or frame is formed in advance on the printing layer 71 of the first base sheet 10.

[0026] An adhesive 20 that will become the adhesive layer 75a is applied to the surface of the first base material sheet 10 that faces the first base material layer 74. The adhesive 20 is applied after being heated to a molten state. There are no limitations on the method of applying the adhesive 20, and a die application method, a gravure method, a roll method, or the like can be used. The adhesive 20 may be applied intermittently in accordance with the arrangement of the IC card.

[0027] Next, as shown in Figures 4a and 4b, a plurality of inlets 80 are two-dimensionally arranged on the surface of the first base material layer 74 side of the first base material sheet 10 to which the adhesive 20 has been applied. In this embodiment, the plurality of inlets 80 are arranged in a so-called lattice pattern. That is, the plurality of inlets 80 are arranged at predetermined intervals in the vertical and horizontal directions of Figure 4b.

[0028] Next, as shown in Figures 5a and 5b, the ventilation sheet 4 is disposed on the surface of the first base sheet 10 facing the first base layer 74 so as to cover the inlet 80. The size of the ventilation sheet 4 is equal to or larger than the size of the first base sheet 10, and is preferably larger than the first base sheet 10. For example, the size of the ventilation sheet 4 is approximately 10% larger in both the length and width than the size of the first base sheet 10. As shown in Figure 5b, the ventilation sheet 4 is preferably disposed so that the entire periphery of the ventilation sheet 4 is positioned outside the peripheral edge of the first base sheet 10.

[0029] Next, as shown in FIG. 6a and FIG. 6b, the adhesive 20 that becomes the adhesive layer 75b is applied to one side of the second base sheet 30. The second base sheet 30 constitutes the second base layer 76 of the IC card 70. Then, the surface of the second base sheet 30 on which the adhesive 20 is applied is faced to the breathable sheet 4 on the first base sheet 10, and the first base sheet 10 and the second base sheet 30 are sandwiched and pressed. In other words, the breathable sheet 4 is disposed between the first base sheet 10 and the second base sheet 30, and the first base sheet 10 and the second base sheet 30 are sandwiched and pressed with one side of the first base sheet 10 and the second base sheet 30 on which the adhesive 20 is applied facing each other. As a result, an IC card forming sheet 3 in which the first base sheet 10 and the second base sheet 30 are bonded with the adhesive 20 with the breathable sheet 4 sandwiched therebetween is obtained.

[0030] The second base sheet 30 is preferably in the form of a sheet having approximately the same size as the first base sheet 10. In the IC card sheet 3, the ventilation sheet 4 extends outward beyond the peripheral edges of the first base sheet 10 and the second base sheet 30.

[0031] 7, IC card sheets 3 are stacked and aged to harden the adhesive 20. Conditions in the aging step such as temperature, humidity, and aging time are appropriately determined depending on the specifications of the adhesive.

[0032] As shown in Fig. 8, the ventilation sheet 4 serves as a passageway for air from the outside. The ventilation sheet 4 extends beyond the peripheral edges of the first base sheet 10 and the second base sheet 30, and therefore easily takes in air. Air reaches not only the peripheral edges of the IC card forming sheet 3, but also the center, and the adhesive 20 absorbs moisture in the air and hardens. This allows the adhesive 20 contained in the IC card forming sheet 3 to harden evenly within the surface.

[0033] Thereafter, the IC card forming sheet 3 on which the adhesive 20 has hardened is punched out into a desired card shape, thereby obtaining individual IC cards 70.

[0034] As shown in Fig. 9, a breathable sheet 4A may be used in which the IC card punching area has an opening H. When this breathable sheet 4A is placed on the first base sheet 10 to which the adhesive 20 has been applied, the inlet 80 is adjusted to be located within the opening H, as shown in Fig. 10. Even when such a breathable sheet 4A is used, air can easily penetrate to the center of the IC card forming sheet 3, and the adhesive 20 can be quickly cured.

[0035] When the breathable sheet 4A is used, the IC card 70 punched out from the IC card forming sheet 3 does not include the breathable sheet 4A.

[0036] 11a, multiple striped ventilation sheets 4B may be arranged in parallel at a predetermined interval. It is preferable that the length of the ventilation sheet 4B in the longitudinal direction is longer than the length of one side of the first base sheet 10, and both ends of the ventilation sheet 4B in the longitudinal direction are located outside the first base sheet 10.

[0037] The ventilation sheet 4B may be disposed so as to cover the inlets 80 as shown in FIG. 11a, or may be disposed between the inlets 80 so as not to cover the inlets 80 as shown in FIG. 11b.

[0038] When the ventilation sheet 4B is arranged so as to cover the inlet 80, the adhesive 20 in the portion to be punched out as an IC card can be cured more quickly.

[0039] When the ventilation sheet 4B is arranged so as not to cover the inlet 80, the punched IC card does not include the ventilation sheet 4B.

[0040] In the above embodiment, the ventilation sheet 4 may be provided above and below the inlet 80. EXAMPLES

[0041] The present disclosure will be described in more detail below using examples, but the present disclosure is not limited to these examples. As described below, breathable sheets for each sample were prepared, and an evaluation was made as to whether the adhesive contained in the IC card forming sheet was evenly cured in the curing process when each breathable sheet was used. Sample 1 did not use a breathable sheet.

[0042] (Samples 2-6) A so-called nonwoven fabric sheet was used as the breathable sheet for Samples 2 to 6. The main physical properties of the breathable sheets for Samples 2 to 6 are shown in Table 1.

[0043] IC card sheets were made using the sample breathable sheet, and multiple IC card sheets were stacked and stored in an aging chamber to harden the adhesive contained in the IC card sheets. After the standing time had elapsed, the degree to which the adhesive had hardened in each IC card sheet was checked and evaluated based on the following evaluation criteria. The results are shown in Table 1.

[0044] (Evaluation Criteria) A: No difference was observed in adhesive hardening between the peripheral and central areas. B: There was almost no unevenness in the adhesive hardening. C: The adhesive hardening was relatively uneven. D: The adhesive hardened unevenly.

[0045] [Table 1] [Explanation of symbols]

[0046] 3 IC card forming sheet 4. Ventilated sheet 10 First base sheet 20. Glue 30 Second base sheet 70 IC Cards 80 Inlet

Claims

1. A method for manufacturing an IC card in which an inlet including an IC chip and an antenna is laminated between a pair of substrates via an adhesive, comprising the steps of: applying a first adhesive to one surface of a first base sheet and arranging a plurality of inlets on the first adhesive; applying a second adhesive to one surface of a second base sheet; a step of disposing a breathable sheet between the first base sheet and the second base sheet, and sandwiching and pressing the first base sheet and the second base sheet with the surface coated with the first adhesive facing the surface coated with the second adhesive to produce an IC card forming sheet; curing the adhesive contained in the IC card forming sheet; Equipped with The ventilation sheet has a plurality of openings formed therein, The method for manufacturing an IC card further comprises: arranging the ventilation sheet so that the inlet is positioned within the opening.

2. The method for manufacturing an IC card according to claim 1 , wherein the breathable sheet is larger than the first base sheet.

3. The method for manufacturing an IC card according to claim 2 , wherein the entire periphery of the breathable sheet is extended outward beyond the peripheral edge of the first base sheet.

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