Electronic component and method for manufacturing electronic component

Abstract

To provide an electronic component capable of suppressing deformation of an outer casing at the time of reflow, and provide a manufacturing method of the same.SOLUTION: An electronic component 100 comprises: an outer casing 20; and an electronic component element body 110 containing a first surface 110a and a second surface 110b that are opposite to a first direction T, a third surface and a fourth surface that are opposite to a second direction W orthogonal to the first direction, and a fifth surface 110e and a sixth surface 110f that are opposite to a third direction L orthogonal to the first and second directions. The outer casing 20 includes: a first part 21 containing a first resin material; and a second part 22 containing a second resin material. The first part 21 is existed at least one part of the first surface 110a, the second surface 110b, the third surface, and the fourth surface of the electronic component element body 110. The second part 22 includes an exposure part that is exposed to at least one surface of the first surface 110a, the second surface 110b, the third surface, and the fourth surface of the electronic component element body 110.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to an electronic component and a method for manufacturing an electronic component. [Background technology]

[0002] Patent Document 1 discloses a solid electrolytic capacitor in which a lead frame is connected to each of the anode and cathode of a solid electrolytic capacitor element, and the solid electrolytic capacitor element and parts of each lead frame are covered in an exterior resin such as epoxy resin. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-205446 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, since the above structure has a large volume that cannot accommodate solid electrolytic capacitor elements, it is necessary to increase the effective volume that can be used to accommodate solid electrolytic capacitor elements in order to further increase the capacitance of the capacitor, and it is also necessary to improve productivity in order to reduce costs.

[0005] Furthermore, since capacitors mounted on a board by reflow are exposed to high temperatures of nearly 260°C, if moisture inevitably penetrates the capacitor due to exposure to the external environment before reflow mounting, stress will be generated due to internal pressure (water vapor pressure inside the solid electrolytic capacitor) during reflow mounting, causing deformation of the exterior body, such as swelling. If swelling occurs, there is a risk of problems such as a deterioration in the electrical characteristics of the capacitor, the occurrence of cracks in the exterior body, and the height of the electronic circuit board exceeding the design limit.

[0006] In addition, it is possible to increase the capacitance of the capacitor by making the exterior body thinner and increasing the number of layers of the solid electrolytic capacitor element, but making the exterior body thinner increases the possibility of cracks occurring due to the inability to withstand the increase in internal pressure during reflow. If cracks are exposed on the exterior surface of the exterior body, moisture and oxygen will penetrate through the cracks, accelerating the deterioration of the internal element and causing further deterioration of the electrical characteristics.

[0007] If the time of exposure to the external environment is short, such a problem does not occur. However, if the time of exposure to the external environment is long due to the process, the above-mentioned problem becomes apparent.

[0008] The problem of defects caused by deformation of the exterior body due to an increase in internal pressure during reflow can occur not only in capacitors such as solid electrolytic capacitors, but also in other electronic components.

[0009] The present invention has been made to solve the above problems, and aims to provide an electronic component capable of suppressing deformation of an exterior body during reflow. Furthermore, the present invention aims to provide a manufacturing method for an electronic component capable of realizing an electronic component capable of suppressing deformation of an exterior body during reflow. [Means for solving the problem]

[0010] The electronic component of the present invention includes an element and an exterior body that seals the element, and is equipped with an electronic component body having a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface opposing each other in a third direction perpendicular to the first direction and the second direction, a first external electrode formed on the fifth surface, and a second external electrode formed on the sixth surface, wherein the exterior body has a first portion including a first resin material and a second portion including a second resin material surrounded by the first portion, the first portion being present on at least a portion of each of the first surface, the second surface, the third surface, and the fourth surface of the electronic component body, and the second portion has an exposed portion exposed to at least one of the first surface, the second surface, the third surface, and the fourth surface of the electronic component body.

[0011] The method for manufacturing an electronic component of the present invention includes the steps of preparing an element, preparing a first part of an outer casing containing a first resin material and having a through hole, hardening a liquid material containing a liquid second resin material filled in the gap between the first part and the element inserted into the through hole to form a second part of the outer casing, and cutting the outer casing along a cut line around the element, wherein the through hole has a shape such that a portion of the through hole is located on the cut line, and in the step of cutting the outer casing, an exposed portion of the second part is formed by cutting the outer casing along the cut line. Effect of the Invention

[0012] According to the present invention, it is possible to provide an electronic component capable of suppressing deformation of an exterior body during reflow. Furthermore, according to the present invention, it is possible to provide a manufacturing method for an electronic component capable of realizing an electronic component capable of suppressing deformation of an exterior body during reflow. [Brief description of the drawings]

[0013] [Figure 1] FIG. 1 is a perspective view that illustrates an example of an electronic component according to an embodiment of the present invention. [Diagram 2]FIG. 2 is a cross-sectional view of the electronic component shown in FIG. 1 taken along line XX. [Diagram 3] 3 is a cross-sectional view of the electronic component shown in FIG. 1 taken along line YY. [Figure 4] FIG. 4 is a diagram illustrating a schematic view of a first main surface or a second main surface of an electronic component body included in the electronic component shown in FIG. [Diagram 5] FIG. 5 is a diagram illustrating a schematic view of a first side surface or a second side surface of an electronic component body included in the electronic component shown in FIG. [Figure 6] FIG. 6 is a cross-sectional view that illustrates an example of an electronic component according to another embodiment of the present invention, and corresponds to the cross-sectional view taken along line YY in FIG. [Figure 7] FIG. 7 is a cross-sectional view that illustrates an example of an electronic component according to still another embodiment of the present invention, and corresponds to the cross-sectional view taken along line YY in FIG. [Figure 8] FIG. 8 is a cross-sectional view that illustrates an example of an electronic component according to still another embodiment of the present invention, and corresponds to the cross-sectional view taken along line XX in FIG. [Figure 9] FIG. 9 is a cross-sectional view that illustrates a schematic example of a solid electrolytic capacitor element included in the electronic component illustrated in FIG. [Figure 10] FIG. 10 is a perspective view that illustrates an example of a first portion of an exterior body used in the method for producing an electronic component according to an embodiment of the present invention. [Figure 11] FIG. 11 is a plan view of a first portion of the exterior body shown in FIG. [Figure 12] FIG. 12 is a plan view illustrating an example of a first portion of an exterior body used in a method for manufacturing an electronic component according to another embodiment of the present invention. [Figure 13] FIG. 13 is a plan view illustrating an example of a first portion of an exterior body used in a method for manufacturing an electronic component according to yet another embodiment of the present invention. [Figure 14] FIG. 14 is a plan view illustrating typically one example of a first portion of an exterior body used in a method for manufacturing an electronic component according to yet another embodiment of the present invention. [Figure 15]FIG. 15 is a plan view showing a schematic example of a workpiece used in the method for manufacturing an electronic component according to an embodiment of the present invention. [Figure 16] FIG. 16 is a diagram illustrating an example of a process for preparing a stack in which a plurality of solid electrolytic capacitor elements are stacked on top of one another. [Figure 17] FIG. 17 is a diagram illustrating an example of a step of attaching an adhesive sheet to a first portion of an exterior body. [Figure 18] FIG. 18 is a diagram illustrating an example of a step of supplying a conductive paste onto an adhesive sheet. [Figure 19] Fig. 19A is a schematic diagram showing an example of a process for inserting a stack into a through-hole, Fig. 19B is a schematic diagram showing an example of a process for embedding a tip of each element in a conductive paste, and Fig. 19C is a schematic diagram showing an example of a process for filling a liquid material around each element inserted into a through-hole. [Figure 20] FIG. 20 is a diagram illustrating an example of a step of cutting the first portion of the exterior body around the through hole. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] The electronic component and the method for manufacturing the electronic component of the present invention will be described below. However, the present invention is not limited to the following configurations, and can be modified as appropriate within the scope of the present invention. Note that the present invention also includes a combination of two or more of the individual desirable configurations described below.

[0015] [Electronic components] Fig. 1 is a perspective view showing a schematic diagram of an example of an electronic component according to an embodiment of the present invention. Fig. 2 is a cross-sectional view taken along line XX of the electronic component shown in Fig. 1. Fig. 3 is a cross-sectional view taken along line YY of the electronic component shown in Fig. 1. Fig. 4 is a diagram showing a schematic diagram of a first main surface or a second main surface of an electronic component body provided in the electronic component shown in Fig. 1. Fig. 5 is a diagram showing a schematic diagram of a first side surface or a second side surface of an electronic component body provided in the electronic component shown in Fig. 1. It should be noted that the internal structure of the solid electrolytic capacitor element is not shown in FIG. 3 and in FIGS. 6 to 8 which will be described later.

[0016] 1 to 5, the length direction of electronic component 100 and electronic component body 110 is indicated as L, the width direction as W, and the height direction as T. Here, the length direction L, the width direction W, and the height direction T are perpendicular to one another. The height direction T is an example of a first direction in the electronic component of the present invention, the width direction W is an example of a second direction in the electronic component of the present invention, and the length direction L is an example of a third direction in the electronic component of the present invention.

[0017] Electronic component 100 is a solid electrolytic capacitor, and has a substantially rectangular parallelepiped outer shape as shown in Figures 1 to 5. Electronic component 100 includes electronic component body 110, a first external electrode 120, and a second external electrode .

[0018] The electronic component body 110 includes a solid electrolytic capacitor element 10 (hereinafter sometimes simply referred to as "element 10") as an element (electronic component element), and includes a stack (capacitor element assembly) 11 in which a plurality of the elements 10 are arranged along a height direction T. The plurality of elements 10 are arranged so as to overlap one another to form the stack 11. The electronic component body 110 further includes an exterior body 20 and a collecting electrode 30. The number of elements 10 included in stack 11 is not particularly limited as long as it is two or more, and can be set appropriately.

[0019] The electronic component body 110 has a substantially rectangular parallelepiped outer shape. The electronic component body 110 has a first main surface 110a and a second main surface 110b that face each other in a height direction T, a first side surface 110c and a second side surface 110d that face each other in a width direction W perpendicular to the height direction T, and a first end surface 110e and a second end surface 110f that face each other in a length direction L perpendicular to the height direction T and the width direction W. Here, the first main surface 110a and the second main surface 110b of the electronic component body 110 are examples of the first and second surfaces of the electronic component body in the electronic component of the present invention, the first side surface 110c and the second side surface 110d of the electronic component body 110 are examples of the third and fourth surfaces of the electronic component body in the electronic component of the present invention, and the first end surface 110e and the second end surface 110f of the electronic component body 110 are examples of the fifth and sixth surfaces of the electronic component body in the electronic component of the present invention.

[0020] As described above, electronic component body 110 has a substantially rectangular parallelepiped outer shape, but the corners and ridges may be rounded. A corner is a portion where three faces of electronic component body 110 intersect, and a ridge is a portion where two faces of electronic component body 110 intersect.

[0021] The first external electrode 120 is formed on a first end face 110e of the electronic component body 110, and the second external electrode 130 is formed on a second end face 110f of the electronic component body 110.

[0022] The exterior body 20 encapsulates the multiple elements 10. That is, a stack 11 of the multiple elements 10 is embedded in the exterior body 20. The exterior body 20 also encapsulates the collecting electrodes 30. The exterior body 20 has a first portion 21 including a first resin material, and a second portion 22 surrounded by the first portion 21 and including a second resin material.

[0023] Since the exterior body 20 includes the first portion 21 and the second portion 22, resin materials having different properties can be selected as the first resin material of the first portion 21 and the second resin material of the second portion 22. Specifically, as the first resin material, a resin material having excellent strength at high temperatures to withstand high temperatures during reflow and excellent long-term thermal durability to ensure reliability, such as a thermoplastic resin such as polyphenylene sulfide or liquid crystal polymer, can be used. On the other hand, as the second resin material, a resin material having high air permeability, such as a thermosetting resin such as an epoxy resin or a silicone resin, can be used.

[0024] 3 to 5, the first portion 21 is present on at least a part of each of the first main surface 110a, the second main surface 110b, the first side surface 110c, and the second side surface 110d of the electronic component body 110. Therefore, by using a resin material with excellent strength at high temperatures, the first portion 21 can be disposed in a location where stress due to internal pressure during reflow is high. Hereinafter, the first main surface 110a, the second main surface 110b, the first side surface 110c, and the second side surface 110d of the electronic component body 110 may be collectively referred to simply as "four surfaces."

[0025] However, such high-strength resin materials often have low air permeability, so if all four sides are constructed from first portion 21 alone, decomposition gases may accumulate inside electronic component body 110 during use after mounting, causing swelling and resulting in deterioration of characteristics.

[0026] Therefore, second portion 22 has exposed portion 23 exposed on at least one of the four faces (see FIGS. 3 and 4). Therefore, second portion 22 having exposed portion 23 is formed using a resin material having high gas permeability, and gas generated inside electronic component body 110 (for example, around element 10) can be diffused in second portion 22 and released from exposed surface 23a of exposed portion 23. As a result, it is possible to suppress an increase in internal pressure due to moisture during reflow and swelling due to decomposition gas during use.

[0027] As a result, electronic component 100 can suppress deformation of exterior body 20 during reflow. As a result, it is possible to suppress the occurrence of problems such as a decrease in the electrical characteristics of electronic component 100, the occurrence of cracks in exterior body 20, and electronic component 100 exceeding the designed height of the electronic circuit board on which it is mounted.

[0028] Furthermore, although the exterior body 20 includes the first portion 21 and the second portion 22, a resin material with high strength can be used as the first resin material of the first portion 21, so that the thickness of the exterior body 20 can be made equal to or thinner than that of a conventional exterior body made of only one type of material. In other words, the effective volume that can be used to store the element 10 can be increased, thereby improving the capacitor capacitance.

[0029] Furthermore, the electronic component 100 can be manufactured with high productivity by a manufacturing method described below.

[0030] The first portion 21 is the main portion that constitutes (forms) the above four sides, and for example, the area proportion of the first portion 21 to the above four sides may be 60% or more and 95% or less, or 70% or more and 90% or less, when the total area of ​​the above four sides is 100%.

[0031] From the viewpoint of more effectively suppressing deformation of the exterior body 20, it is preferable that the first portion 21 exists at four ridge portions 110g where two of the four faces intersect, as shown in Figures 3 to 5. In other words, it is preferable that all of these four ridge portions 110g are formed from the first portion 21.

[0032] 3 to 5, the first portion 21 is composed of a plurality of plate-like portions, and has a structure in which these plate-like portions are arranged on at least a portion of each of the four faces. That is, the first portion 21 defines a space 24 therein in which the plurality of elements 10 (superimposed body 11) and a portion of the second portion 22 are housed. The first portion 21 is formed by integrally molding a tube structure from a predetermined material including a first resin material, and then cutting a portion of the tube structure, and the first portion 21 has no seams or internal bonding interfaces.

[0033] As shown in Figures 2, 4 and 5, the first portion 21 is present in the peripheral portions of the first end face 110e and the second end face 110f of the electronic component body 110, i.e., the ridge portion 110h and / or the corner portion 110j formed by the first end face 110e and the second end face 110f, but is not present in the central portion excluding the peripheral portions of the first end face 110e and the second end face 110f.

[0034] The second portion 22 is an auxiliary portion that constitutes (forms) the above four sides, and for example, the area proportion of the second portion 22 to the above four sides may be 5% or more and 40% or less, or 10% or more and 30% or less, when the total area of ​​the above four sides is 100%.

[0035] 3, the second portion 22 exists in a space 24 defined by the first portion 21 in which the plurality of elements 10 (superimposed body 11) are housed. In this manner, the second portion 22 may be filled in the space 24 around the plurality of elements 10 (superimposed body 11).

[0036] Note that here, the state in which the second portion 22 is filled around the multiple elements 10 (superimposed body 11) within the space 24 may mean that the second portion 22 completely fills the space around the multiple elements 10 (superimposed body 11) within the space 24, or may not completely fill it. In the latter case, for example, a small number of air bubbles may remain in the second portion 22, a small gap may remain between the second portion 22 and the first portion 21, or a small gap may remain between the second portion 22 and at least one element 10.

[0037] 3, second portion 22 is present within space 24 defined by first portion 21, and a portion of second portion 22 protrudes outside space 24 as exposed portion 23, and is exposed on at least one of the four faces. In other words, exposed portion 23 is a portion (protruding portion) of second portion 22 protruding outside space 24. Further, second portion 22 has not only exposed portion 23, but also non-exposed portion 25 that is not exposed on the four faces. Non-exposed portion 25 is covered by first portion 21, and is located closer to the center of electronic component body 110 than first portion 21.

[0038] The exposed portion 23 is preferably in contact with at least one of the first end face 110e and the second end face 110f, and may be in contact with each of the first end face 110e and the second end face 110f as shown in Fig. 4. Although not shown, the exposed portion 23 may be in contact with one of the first end face 110e and the second end face 110f and not in contact with the other (it may extend up to the other end face). This allows the first portion before singulation to have a shape with a through hole that is easy to mold by injection molding, and allows the exposed portion 23 to be formed without reducing productivity.

[0039] When exposed portion 23 contacts first end face 110e, exposed portion 23 is present in a part of first end face 110e (constitutes a part of first end face 110e), and when exposed portion 23 contacts second end face 110f, exposed portion 23 is present in a part of first end face 110f (constitutes a part of first end face 110f).

[0040] As shown in FIG. 4, the exposed portion 23 may be provided in a strip shape extending in the length direction L (for example, a rectangular shape having a long side in the length direction L) on the surface where the exposed portion is exposed.

[0041] Fig. 6 is a cross-sectional view showing a schematic example of an electronic component according to another embodiment of the present invention, and corresponds to the cross-sectional view taken along line YY in Fig. 1. Fig. 7 is a cross-sectional view showing a schematic example of an electronic component according to yet another embodiment of the present invention, and corresponds to the cross-sectional view taken along line YY in Fig. 1. Fig. 8 is a cross-sectional view showing a schematic example of an electronic component according to yet another embodiment of the present invention, and corresponds to the cross-sectional view taken along line XX in Fig. 1.

[0042] When viewed in cross section in a plane perpendicular to the longitudinal direction L with the first main surface 110a and the second main surface 110b arranged vertically, the second portion 22 may be H-shaped (see FIG. 3), inverted U-shaped (see FIG. 6), cross-shaped (see FIG. 7), or T-shaped (see FIG. 8). The inverted U-shape and the T-shape may be shapes obtained by upside down the shapes shown in FIGS. 6 and 8, respectively. That is, the second portion 22 may be U-shaped or inverted T-shaped.

[0043] Hereinafter, a cross-sectional view taken along a plane perpendicular to the length direction L in a state in which the first main surface 110a and the second main surface 110b are arranged one above the other may be simply referred to as a "transverse cross-sectional view."

[0044] Exposed portion 23 may be provided at one location per electronic component body 110 (see FIG. 8), two locations (see FIGS. 6 and 7), or four locations (see FIG. 3). In any case, exposed portion 23 is preferably symmetrical at least one of left and right and top and bottom when viewed in cross section. This allows stress to be distributed evenly without being concentrated in one area.

[0045] The above-mentioned effect can be sufficiently obtained if there are a maximum of four exposed portions 23 per electronic component body 110. Providing more exposed portions 23 in more locations reduces the effect, while increasing the cost of the injection molding die.

[0046] More specifically, the exposed portion 23 is symmetrical left-right and up-down in the case shown in Figure 3, left-right symmetrical in the case shown in Figure 6, left-right and up-down symmetrical in the case shown in Figure 7, and left-right symmetrical in the case shown in Figure 8.

[0047] Here, the term "exposed portion 23 being symmetrical in the left-right direction" refers to a state in which, when viewed in cross section, the outline of exposed portion 23 is symmetrical (including the case where it is substantially symmetrical) with respect to center line CL1 of electronic component body 110 extending in height direction T. Furthermore, the term "exposed portion 23 being symmetrical in the top-bottom direction" refers to a state in which, when viewed in cross section, the outline of exposed portion 23 is symmetrical (including the case where it is substantially symmetrical) with respect to center line CL2 of electronic component body 110 extending in width direction W.

[0048] As shown in Fig. 3, Fig. 4, and Fig. 6 to 8, exposed portion 23 is preferably present on at least one of first main surface 110a and second main surface 110b. Since two surfaces opposing each other in the height direction, namely first main surface 110a and second main surface 110b, have a large area, exposed portion 23 can be provided widely. In addition, in a manufacturing process of electronic component 100 described later, when element 10 (superimposed body 11) is inserted into a first portion of the exterior body before singulation, element 10 can be easily prevented from shifting in width direction W and overlapping the cut line.

[0049] From the viewpoint of preventing the element 10 from being displaced in the width direction W, it is preferable that the exposed portion 23 is not present on the first side surface 110c and the second side surface 110d, as shown in Fig. 5. In other words, it is preferable that only the first portion 21 is present on the first side surface 110c and the second side surface 110d.

[0050] 3, second portion 22 preferably has a tapered structure that becomes thinner from the inside of electronic component body 110 toward exposed surface 23a of exposed portion 23. With this, even if peeling occurs at the interface between first portion 21 and second portion 22 due to internal pressure during reflow, second portion 22 is caught by this tapered portion, so that second portion 22 can be prevented from protruding from first portion 21 like a fault. As a result, it is possible to prevent the dimensions of electronic component 100, for example, the dimension in height direction T (T dimension), from exceeding the designed height of the electronic circuit board.

[0051] More specifically, in this case, the area of ​​a cross section of second portion 22 (exposed portion 23) parallel to the surface where exposed surface 23a is exposed decreases from the inside of electronic component body 110 toward exposed surface 23a of exposed portion 23. Second portion 22 (exposed portion 23) also has exposed surface 23a and tapered surface 23b that is connected to exposed surface 23a and is inclined with respect to exposed surface 23a.

[0052] Here, "the inside of the electronic component body" means the side closer to the center of the electronic component body.

[0053] 3 shows a case where the entire opposing surface 23c (joint surface) opposing the first portion 21 of the exposed portion 23 is composed of the tapered surface 23b, but when the second portion 22 has a tapered structure, only a part of the opposing surface 23c may be composed of the tapered surface 23b. For example, only one of the two opposing surfaces 23c located on both sides of the exposed portion 23 in FIG. 3 may be composed of the tapered surface 23b.

[0054] In the mold shown in FIGS. 6 to 8, at least a part of the facing surface 23c (joint surface) facing the first portion 21 of the exposed portion 23 may be configured as a tapered surface as shown in FIG.

[0055] 3 shows a case where each tapered surface 23b is composed of a single surface, the tapered surface 23b may be composed of a plurality of surfaces. Specifically, for example, the tapered surface 23b may be composed of a fine staircase shape (a tread portion and a riser portion).

[0056] 3, the tapered surface 23b is preferably curved, which can increase the contact area between the second portion 22 and the first portion 21 in the exposed portion 23, thereby improving the bonding strength (for example, the bonding strength in the width direction W).

[0057] In addition, in Figure 3, the curved tapered surface 23b is shown to be convex, i.e., bulging outward from the exposed portion 23, but it may also be concave, i.e., recessed inward from the exposed portion 23.

[0058] It is preferable that the first resin material is at least one type of thermoplastic resin, and the second resin material is at least one type of thermosetting resin. In conventional technology, the exterior body is usually made of a thermosetting resin, but by using a thermoplastic resin as the first resin material, a material having higher strength at high temperatures can be selected as the first resin material constituting the first portion 21. In addition, by using a thermoplastic resin as the first resin material and a thermosetting resin as the second resin material, the electronic component 100 can be easily manufactured as described below.

[0059] The melting point of the at least one thermoplastic resin as the first resin material is preferably equal to or higher than 260° C., more preferably equal to or higher than 275° C., and even more preferably equal to or higher than 300° C. By using such a thermoplastic resin, the strength of exterior body 20 at high temperatures during reflow can be ensured.

[0060] There is no upper limit to the melting point of the at least one thermoplastic resin, but it is usually 400° C. or lower, preferably 360° C. or lower, and more preferably 330° C. or lower.

[0061] The first resin material preferably contains at least one of polyphenylene sulfide (PPS) and liquid crystal polymer (LCP). These resins are thermoplastic resins, but have high strength at high temperatures and can be processed into the shape of the first portion 21 by injection molding, which is a commonly used molding method for thermoplastic resins, and are therefore suitable as the first resin material.

[0062] The second resin material preferably contains at least one of an epoxy resin and a silicone resin. These resins are thermosetting resins, but are highly permeable, and therefore suitable as the second resin material. In addition, in the manufacturing method of the electronic component 100 according to the present embodiment described later, since the electronic component 100 is handled at room temperature, a material that is liquid at room temperature before curing is suitable, and these resins may fall into such a category. In addition, these resins are also suitable materials as capacitor sealing materials in terms of insulation, heat resistance, and the like.

[0063] In this way, the air permeability, for example, water vapor permeability, of the second resin material is preferably higher than the air permeability, for example, water vapor permeability, of the first resin material. More specifically, the water vapor permeability of the first resin material at 40° C. and 90% RH is preferably 300 g μm / m 2 / day or less (preferably 200g·μm / m 2 / day or less), and the water vapor permeability of the second resin material at 40°C and 90% RH is 500g μm / m 2 / day or more (preferably 800g·μm / m 2 / day or more).

[0064] Here, the water vapor permeability is measured based on the cup method specified in JIS Z 0208. That is, each resin material is prepared into a thin plate-like sample having a thickness of 300 to 800 μm, and the water vapor permeability is measured under condition B of the standard (temperature 40±0.5°C, relative humidity 90±2%) using the sample and a moisture permeability cup, converted into a value per unit thickness, and the value excluding the influence of the thickness is regarded as the water vapor permeability.

[0065] The lower limit of the water vapor permeability of the first resin material is not particularly limited, and the water vapor permeability of the first resin material at 40°C and 90% RH is 0 g μm / m 2 / day (preferably 5 g μm / m 2 / day or more). The upper limit of the water vapor permeability of the second resin material is not particularly limited, and the water vapor permeability of the second resin material at 40°C and 90% RH is 100,000 g μm / m 2 / day or less (preferably 60000g·μm / m 2 / day or less).

[0066] The water vapor permeability of the above resins at 40°C and 90% RH is as shown below (all units are g μm / m 2 / day). Polyphenylene sulfide: 175 Liquid crystal polymer: 10 Epoxy resin: 1000 Silicone resin: 50000

[0067] The first resin material and the second resin material may each contain, as a reinforcing material, a filler such as silica particles, alumina particles, or metal oxide particles, or a fiber such as ceramic fiber, etc. In particular, the first resin material preferably contains, as a reinforcing material, ceramic fiber having a fiber length of 50 μm or more.

[0068] The water vapor permeability of the first resin material means the water vapor permeability of the material including all the components constituting the first portion 21, and when the first resin material includes a filler or fiber, it means the water vapor permeability of the entire material including the filler or fiber. The same applies to the water vapor permeability of the second resin material.

[0069] The multiple elements 10 are arranged overlapping in the height direction T. The extending direction of each of the multiple elements 10 is substantially parallel to the first main surface 110a and the second main surface 110b of the electronic component body 110. The elements 10 adjacent to each other in the height direction T may be joined to each other via a conductive adhesive (not shown).

[0070] FIG. 9 is a cross-sectional view that illustrates a schematic example of a solid electrolytic capacitor element included in the electronic component illustrated in FIG.

[0071] 2 and 9, each solid electrolytic capacitor element 10 is a substantially flat-plate-shaped electronic component element, and includes an anode 40 which is a thin film (foil) having a rectangular shape in plan view and whose surface is made of a porous valve metal substrate, a dielectric layer 41 (see FIG. 9, not shown in FIG. 2) provided on the surface of the anode 40 except for the base end surface 40b of the anode 40, a mask layer 42 which is a linear (extending in a strip-like shape) insulating member provided on the dielectric layer 41 along the base end surface 40b of the anode 40, and a cathode 43 provided on the dielectric layer 41 on the side of the mask layer 42 closer to the tip end surface 40a of the anode 40. In each solid electrolytic capacitor element 10, the cathode 43 faces the anode 40 via the dielectric layer 41.

[0072] As shown in FIG. 2, each cathode 43 is electrically connected to a first external electrode 120 via a collecting electrode 30 at a first end face 110e of the electronic component body 110, and each anode 40 is electrically connected to a second external electrode 130 at a second end face 110f of the electronic component body 110.

[0073] The anode 40 extends between the first end face 110e and the second end face 110f of the electronic component body 110.

[0074] The cathode 43 extends between the first end face 110e and the second end face 110f of the electronic component body 110. The cathode 43 also has a solid electrolyte layer 44 provided on the dielectric layer 41, a carbon layer 45 provided on the solid electrolyte layer 44, and a cathode conductor layer 46 provided on the carbon layer 45.

[0075] 2, the collecting electrode 30 is electrically connected to a plurality of cathodes 43 of a plurality of elements 10. The collecting electrode 30 is exposed at the first end face 110e of the electronic component body 110, and is provided at least on the first end face 110e side of the electronic component body 110. The collecting electrode 30 is formed in a shape having a thickness at a position recessed from the first end face 110e.

[0076] As shown in FIG. 2, at least a portion of each cathode 43 on the first external electrode 120 side is embedded in the collecting electrode 30, thereby ensuring electrical connection between each cathode 43 and the collecting electrode 30.

[0077] The collecting electrode 30 is a composite material of a conductive component (conductive material) and a resin component (resin material). The conductive component preferably contains, as a main component, a metal such as silver, copper, nickel, or tin, or an alloy containing at least one of these metals. The resin component preferably contains, as a main component, an epoxy resin, a phenolic resin, or the like. The collecting electrode 30 can be formed, for example, using a conductive paste such as silver paste.

[0078] As shown in Fig. 2, the first external electrode 120 is provided on the first end surface 110e of the electronic component body 110. In Fig. 1, the first external electrode 120 is provided from the first end surface 110e of the electronic component body 110 to each of the first main surface 110a, the second main surface 110b, the first side surface 110c, and the second side surface 110d. The first external electrode 120 is electrically connected to the collecting electrode 30 exposed from the electronic component body 110 at the first end surface 110e. That is, the first external electrode 120 is electrically connected to each cathode 43 via the collecting electrode 30.

[0079] Furthermore, the collecting electrode 30 is present in the space 24 housing the multiple elements 10 (superimposed body 11), and the first end face 110e of the electronic component body 110 is formed mainly by the collecting electrode 30 and the first portion 21 of the exterior body 20, so that the first external electrode 120 can be formed on this first end face 110e. This makes it easy to electrically connect the first external electrode 120 to the collecting electrode 30, and also makes it possible to form the first external electrode 120 with a thin thickness.

[0080] Specifically, the first external electrode 120 may have a so-called sputtered film formed by a sputtering method. Examples of materials for the sputtered film include Ni, Sn, Ag, Cu, and Au.

[0081] The first external electrode 120 may have a so-called evaporated film formed by evaporation. Examples of materials for the evaporated film include Ni, Sn, Ag, and Cu.

[0082] In this way, since the first external electrode 120 can be formed from a sputtered film and / or a vapor deposition film, the film thickness of the first external electrode 120 may be thinner than the film thickness of the second external electrode 130. Specifically, the film thickness of the first external electrode 120 is preferably 1 μm or more and 100 μm or less, more preferably 5 μm or more and 50 μm or less, and even more preferably 10 μm or more and 30 μm or less.

[0083] As shown in Fig. 2, the second external electrode 130 is provided on the second end face 110f of the electronic component body 110. In Fig. 1, the second external electrode 130 is provided from the second end face 110f of the electronic component body 110 to each of the first main face 110a, the second main face 110b, the first side face 110c, and the second side face 110d. The second external electrode 130 is electrically connected to the anode 40 (valve metal base) of the element 10 exposed from the electronic component body 110 at the second end face 110f. The second external electrode 130 may be directly or indirectly connected to the anode 40 at the second end face 110f of the electronic component body 110.

[0084] At least one of the first external electrode 120 and the second external electrode 130 may have a resin electrode layer containing a conductive component and a resin component. The conductive component preferably contains, as a main component, a metal such as silver, copper, nickel, or tin, or an alloy containing at least one of these metals. The resin component preferably contains, as a main component, an epoxy resin, a phenolic resin, or the like. The resin electrode layer can be formed, for example, using a conductive paste such as a silver paste.

[0085] At least one of the first external electrode 120 and the second external electrode 130 may have a so-called plating layer formed by a plating method. Examples of the plating layer include a zinc-silver-nickel layer, a silver-nickel layer, a nickel layer, a zinc-nickel-gold layer, a nickel-gold layer, a zinc-nickel-copper layer, and a nickel-copper layer. On these plating layers, for example, a copper plating layer, a nickel plating layer, and a tin plating layer are preferably provided in this order (or with the exception of some plating layers).

[0086] At least one of the first external electrode 120 and the second external electrode 130 may have both a resin electrode layer and a plating layer. For example, the first external electrode 120 may have a resin electrode layer connected to the current collecting electrode 30 and an outer plating layer provided on the surface of the resin electrode layer. The first external electrode 120 may have an inner plating layer connected to the current collecting electrode 30, a resin electrode layer provided so as to cover the inner plating layer, and an outer plating layer provided on the surface of the resin electrode layer. The second external electrode 130 may have a resin electrode layer connected to the anode 40 (valve metal substrate) and an outer plating layer provided on the surface of the resin electrode layer. The second external electrode 130 may have an inner plating layer connected to the anode 40 (valve metal substrate), a resin electrode layer provided so as to cover the inner plating layer, and an outer plating layer provided on the surface of the resin electrode layer.

[0087] [Electronic component manufacturing method] The electronic component 100 can be manufactured by the following method. In the following example, a method for simultaneously manufacturing a plurality of solid electrolytic capacitor elements using a large valve metal substrate will be described.

[0088] FIG. 10 is a perspective view that illustrates an example of a first portion of an exterior body used in the method for producing an electronic component according to an embodiment of the present invention.

[0089] First, as shown in FIG. 10, a first portion 221 of an exterior body 220 (a member that will become the first portion 21 of the exterior body 20) containing the above-mentioned first resin material and having a plurality of through holes 223 is prepared. The first portion 221 is a member in which a plurality of through holes 223 are provided vertically and horizontally in a flat plate material having a predetermined thickness and a rectangular shape in a plan view. Each of the through holes 223 is provided in a direction perpendicular to the main surface of the first portion 221, and both ends are open. The first portion 221 can be made by injection molding. As the first resin material used for the first portion 221, a resin that can be injection molded is suitable, and specifically, a thermoplastic resin such as PPS (polyphenylene sulfide), LCP (liquid crystal polymer), PBT (polybutylene terephthalate), polyimide, or polyamide is suitable. The first resin material may contain fillers such as silica particles, alumina particles, or metal oxide particles, or fibers such as ceramic fibers, as reinforcing materials.

[0090] FIG. 11 is a plan view of a first portion of the exterior body shown in FIG.

[0091] As described below, first portion 221 is cut along cut lines to separate the first portion 221, and as shown in FIG. 11, each through hole 223 has a shape in which a part of the first portion 221 is located on the cut line (the dashed line in FIG. 11). That is, through hole 223 partially overlaps with the cut line, and a part of through hole 223 is located outside the element body region (the thick dashed line in FIG. 11) cut out along the cut line. This makes it possible to easily form exposed portion 23 of second portion 22 described above. That is, since second portion 22 having exposed portion 23 can be formed simply by changing the shape of each through hole 223, no additional process or the like is required, and electronic component 100 having exposed portion 23 can be obtained without reducing productivity.

[0092] Fig. 12 is a plan view showing a schematic example of a first part of an exterior body used in a method for producing an electronic component according to another embodiment of the present invention. Fig. 13 is a plan view showing a schematic example of a first part of an exterior body used in a method for producing an electronic component according to yet another embodiment of the present invention. Fig. 14 is a plan view showing a schematic example of a first part of an exterior body used in a method for producing an electronic component according to yet another embodiment of the present invention.

[0093] More specifically, when the main surface of the first portion 221 is viewed in a plane (when viewed in the direction in which the through hole 223 extends), the shape of the through hole 223 has a basic shape of a rectangle Rec set within an area surrounded by cut lines (dash lines in each figure), as shown in Figures 11 to 14, and a part of the rectangle Rec protrudes outside the cut lines in one or more areas corresponding to the exposed portions 23 of the second portion 22.

[0094] When an arc-shaped protrusion is provided as shown in Fig. 11, it is possible to form exposed portion 23 having curved tapered surface 23b as shown in Fig. 3. On the other hand, when a rectangular protrusion is provided as shown in Figs. 12 to 14, it is possible to form exposed portion 23 in which opposing surface 23c is perpendicular to any of the above four surfaces as shown in Figs. 6 to 8.

[0095] In the case shown in Fig. 11, an electronic component body 110 as shown in Fig. 3 can be formed. In the case shown in Fig. 12, an electronic component body 110 as shown in Fig. 6 can be formed. In the case shown in Fig. 13, an electronic component body 110 as shown in Fig. 7 can be formed. In the case shown in Fig. 14, an electronic component body 110 as shown in Fig. 8 can be formed.

[0096] Next, the stack 11 is prepared.

[0097] FIG. 15 is a plan view showing a schematic example of a workpiece used in the method for manufacturing an electronic component according to an embodiment of the present invention.

[0098] 15, a work 210 is prepared in which element portions 212 (plurality of solid electrolytic capacitor elements 10) are connected in strips at regular intervals to a band-shaped holding portion 211. A mask layer 42 is formed on each element portion 212.

[0099] In detail, first, a valve metal substrate having a porous portion on its surface is cut by laser processing, punching processing, or the like, to be processed into a shape including a plurality of element portions 212 and holding portion 211 .

[0100] The valve metal substrate is made of a valve metal such as an elemental metal such as aluminum, tantalum, niobium, titanium, or zirconium, or an alloy containing these metals. The valve metal base need only be composed of a core and a porous portion provided on at least one of the main surfaces of the core, and may be, for example, a metal foil having an etched surface or a metal foil having a porous sintered powder formed on the surface.

[0101] Next, a mask layer is formed on both main surfaces and both side surfaces of each element portion 212 so as to extend along the short sides of the element portion 212 .

[0102] The mask layer is formed by applying a mask material such as a composition containing an insulating resin by screen printing, roller transfer, dispenser application, inkjet printing, etc. Examples of insulating resins include polyphenylsulfone (PPS), polyethersulfone (PES), cyanate ester resins, fluororesins (tetrafluoroethylene, tetrafluoroethylene-perfluoroalkylvinylether copolymers, etc.), compositions consisting of soluble polyimidesiloxane and epoxy resins, polyimide resins, polyamideimide resins, and derivatives or precursors thereof.

[0103] After this, the mask layer may or may not be coated with a hydrophilic material.

[0104] Next, an oxide film that will become a dielectric layer is formed on the surface of the valve metal base by anodizing the valve metal base. For example, the dielectric layer is made of an aluminum oxide. At this time, an oxide film is also formed on the side of the element portion 212 that has been cut by laser processing, punching, or the like. A chemical foil on which an aluminum oxide has already been formed may be used as the valve metal base. In this case, an oxide film is also formed on the side of the cut element portion 212 by anodizing the valve metal base after cutting.

[0105] Next, a solid electrolyte layer is formed on the dielectric layer of the element section 212. Specifically, the element section 212 is immersed in a treatment liquid containing a solid electrolyte, so that the treatment liquid is impregnated into the porous portion of the valve metal base. After a predetermined period of immersion, the element section 212 is pulled out of the treatment liquid and dried at a predetermined temperature for a predetermined period of time. The immersion in the treatment liquid, pulling out, and drying are repeated a predetermined number of times to form a solid electrolyte layer.

[0106] As the treatment liquid containing a solid electrolyte, for example, a dispersion liquid of a conductive polymer such as polypyrroles, polythiophenes, polyanilines, etc. is used. Among these, polythiophenes are preferred, and poly(3,4-ethylenedioxythiophene), also known as PEDOT, is particularly preferred. The conductive polymer may also contain a dopant such as polystyrene sulfonic acid (PSS). A conductive polymer film can be formed by attaching a dispersion liquid of a conductive polymer to the outer surface of a dielectric layer and drying it. Alternatively, as the treatment liquid containing a solid electrolyte, a liquid containing a polymerizable monomer, such as 3,4-ethylenedioxythiophene, and an oxidizing agent may be used. This liquid containing the conductive polymer can be attached to the outer surface of the dielectric layer to form a conductive polymer film by chemical polymerization. This conductive polymer film becomes a solid electrolyte layer.

[0107] Thereafter, the element portion 212 is immersed in the carbon paste, pulled out, and dried to form a carbon layer in a predetermined area. The carbon paste is a conductive paste containing carbon particles as a conductive component and a resin component such as an epoxy resin or a phenol resin.

[0108] Then, the element portion 212 is immersed in the conductive paste, pulled up, and dried to form a cathode conductor layer in a predetermined region. The conductive paste for forming the cathode conductor layer may contain, for example, metal particles as a conductive component and a resin component such as an epoxy resin or a phenolic resin. The metal particles may be, for example, gold, silver, copper, platinum, or the like. Among them, a silver paste containing silver particles as a conductive component is preferable as the conductive paste for forming the cathode conductor layer.

[0109] As a result of the above, workpiece 210 is produced in which solid electrolytic capacitor elements 10 are formed in each element portion 212.

[0110] Here, in the above-mentioned first portion 221, substantially rectangular parallelepiped through holes 223 are formed at the same number and pitch as the elements 10 of the rectangular workpiece 210, and a plurality of rows of such through holes 223 are provided.

[0111] FIG. 16 is a diagram illustrating an example of a process for preparing a stack in which a plurality of solid electrolytic capacitor elements are stacked on top of one another.

[0112] 16, a plurality of workpieces 210 on which a plurality of elements 10 are formed in a strip shape are prepared, and a predetermined number of workpieces 210 are bundled together so that the plurality of elements 10 overlap each other and fixed with a jig such as a clamp (not shown). This produces a plurality of stacks 11 in which the plurality of elements 10 are arranged along the height direction T. The plurality of stacks 11 are arranged in a row (a row aligned perpendicular to the paper surface of FIG. 16).

[0113] FIG. 17 is a diagram illustrating an example of a step of attaching an adhesive sheet to a first portion of an exterior body.

[0114] 17, an adhesive sheet 250 (hereinafter may be simply abbreviated as "sheet 250") is attached to first portion 221 so as to close first openings 223a of each through-hole 223. That is, adhesive sheet 250 is attached to the entire surface of one side of first portion 221 so as to close one side of each through-hole 223. This makes it possible to easily expose the end face of collecting electrode 30 at first end face 110e of electronic component body 110 by peeling off sheet 250 after sealing.

[0115] It should be noted that it is sufficient for each through hole 223 to have the first opening 223a (lower opening) covered, and instead of attaching the adhesive sheet 250, the first opening 223a may be covered, for example, by placing the first portion 221 on a flat table.

[0116] FIG. 18 is a diagram illustrating an example of a step of supplying a conductive paste onto an adhesive sheet.

[0117] Next, as shown in FIG. 18, in a state where the first opening 223a of each through hole 223 is covered with the adhesive sheet 250, the conductive paste 230 is supplied onto the sheet 250 from the second opening 223b (upper opening) of each through hole 223. As a result, the conductive paste 230 is applied onto the sheet 250 in each through hole 223. For example, the conductive paste 230 may contain metal particles as a conductive component and a resin component such as epoxy resin or phenolic resin. For example, the metal particles may be silver, copper, nickel, tin, or the like. Among them, the conductive paste 230 is preferably a silver paste containing silver particles as a conductive component. In addition, for example, a dispenser or the like may be used to supply the conductive paste 230.

[0118] Fig. 19A is a schematic diagram showing an example of a process for inserting a stack into a through-hole, Fig. 19B is a schematic diagram showing an example of a process for embedding a tip of each element in a conductive paste, and Fig. 19C is a schematic diagram showing an example of a process for filling a liquid material around each element inserted into a through-hole.

[0119] Next, as shown in FIG. 19A, the fixed workpieces 210 are moved relative to the first portion 221, and the stack 11 is inserted into the through-holes 223 in the same row from the second openings 223b.

[0120] In this way, by using the workpiece 210 in which multiple elements 10 are connected in the form of strips at regular intervals in the holding portion 211, the elements 10 can be inserted into the first portion 221 in strip units, thereby significantly improving productivity compared to inserting the elements 10 one by one or the stacks 11 one by one into the first portion 221.

[0121] 19B, the conductive paste 230 is spread by the tip of each element 10, i.e., the tip of the cathode 43, and the tip of the cathode 43 of each element 10 is embedded in the conductive paste 230. That is, the conductive paste 230 is connected to all elements 10.

[0122] Then, with each cathode 43 embedded, the conductive paste 230 is cured, for example, by heating, on the sheet 250. As a result, the current collecting electrode 30 is formed with at least the tip of the cathode 43 of each element 10 embedded in the current collecting electrode 30 (see FIG. 2).

[0123] 19C, the liquid material 222 is filled around each element 10 inserted into each through hole 223, that is, between adjacent elements 10 and between the stack 11 and the first portion 221. For example, the liquid material 222 is injected into each through hole 223 by a dispenser or the like, and vacuum degassing is performed to fill the liquid material 222 around each element 10. The viscosity of the liquid material 222 may be reduced by heating during injection or vacuum degassing. The liquid material 222 contains the above-mentioned second resin material (however, liquid before hardening). The resin contained in the liquid second resin material is preferably a thermosetting resin such as epoxy resin, silicone resin, or urethane resin. The liquid second resin material may contain fillers such as silica particles, alumina particles, or metal oxide particles, or fibers such as ceramic fibers, as reinforcing materials.

[0124] The liquid material 222 before curing preferably has a viscosity of 100 Pa·s or less at 25° C. A viscosity of 100 Pa·s or less allows for easy filling by simply degassing and heating in a vacuum oven, thereby improving productivity. The viscosity of the liquid material 222 before curing is more preferably 30 Pa·s or less at 25° C., and even more preferably 5 Pa·s or less.

[0125] Although there is no lower limit to the viscosity of the liquid material 222 before hardening, it is preferable that the viscosity is not too low so that the liquid material 222 does not leak from the gap between the first portion 221 and the sheet 250 after the liquid material 222 is filled and before it is hardened by heating. More specifically, the viscosity of the liquid material 222 before hardening is usually 0.01 Pa·s or more at 25° C., preferably 0.1 Pa·s or more, and more preferably 0.3 Pa·s or more.

[0126] Then, the liquid material 222 filled in each of the through holes 223 is cured. For example, the liquid material 222 is heated and cured in a vacuum oven to form the second portion 222a of the exterior body 220 (the portion that becomes the second portion 22 of the exterior body 20). A small number of air bubbles may remain in the second portion 222a which is the cured product of the liquid material 222. A small gap may remain between the second portion 222a and the first portion 221 and / or between the second portion 222a and at least one element 10.

[0127] Then, for the other rows of through holes 223, the conductive paste 230 is supplied, multiple elements 10 (superimposed body 11) are inserted, the liquid material 222 is filled, and the liquid material 222 is hardened, so that the multiple elements 10 (superimposed body 11) and second portions 222a are stored in all of the through holes 223.

[0128] Subsequently, after the liquid material 222 has hardened, the sheet 250 is peeled off from the first portion 221. The collector electrodes 30 to which the elements 10 are connected are exposed on the peeled surface, and this peeled surface becomes the first end surface 110e of the electronic component body 110. An end surface of at least one cathode may be exposed on this peeled surface.

[0129] On the other hand, unnecessary parts of each element 10, unnecessary parts of the liquid material 222, and the holder 211 of the workpiece 210 are present above the first portion 221. The height of the first portion 221 is the length in the longitudinal direction of the chip, and therefore needs to be adjusted to a predetermined length. Therefore, the unnecessary parts above the first portion 221 are cut off with a grinder or the like along a predetermined cut line (for example, the dashed line in FIG. 19C). The surface exposed after the unnecessary parts have been cut off becomes the second end face 110f of the electronic component body 110. The anode 40 (foil made of a valve metal base) of each element 10 is exposed on the second end face 110f.

[0130] Next, cutting is performed to separate the substrate into individual pieces.

[0131] FIG. 20 is a diagram illustrating an example of a step of cutting the first portion of the exterior body around the through hole.

[0132] As shown in Fig. 20, the exterior body (first portion 221 and second portion 222a) is cut along cut lines (dotted lines in Fig. 20) around element 10 (superimposed body 11). As a result, first portion 21 is formed from first portion 221, and second portion 22 is formed from second portion 222a. That is, exposed portion 23 of second portion 22 is formed. For example, predetermined cut lines (dotted lines in Fig. 20) are cut around each through hole 223 using a dicer or the like.

[0133] In this manner, electronic component body 110 comprising stack 11 of elements 10 is obtained.

[0134] Thereafter, electronic component body 110 may be subjected to barrel polishing. Specifically, electronic component body 110 may be polished by sealing electronic component body 110 together with an abrasive in a barrel tank and rotating the barrel tank. This causes corners and ridges of electronic component body 110 to be rounded.

[0135] If necessary, metal particles (e.g., Cu particles) may be ejected by an aerosol deposition method and collided with the barrel-polished second end face 110f (anode end face) of electronic component body 110. This may form a metal film (contact layer) on anode 40 exposed at second end face 110f (anode end face) of electronic component body 110.

[0136] Next, the first external electrode 120 and the second external electrode 130 are formed on the first end face 110e (cathode end face) and the second end face 110f (anode end face) of the electronic component body 110, respectively. For example, a conductive paste is applied by a screen printing method or the like and cured to form resin electrode layers as the first external electrode 120 and the second external electrode 130, respectively. As the conductive paste for forming the resin electrode layer, a silver paste containing silver particles as a conductive component is suitable. After that, a plating layer may be formed on the resin electrode layer by plating.

[0137] At this time, the first external electrode 120 may be a thin sputtered film and / or a vapor deposition film having a thickness of, for example, several μm, formed by sputtering or vapor deposition.

[0138] By the above method, electronic component 100 (solid electrolytic capacitor) can be obtained.

[0139] In the above embodiment, the case where the current collecting electrode 30 is provided has been described, but the current collecting electrode 30 may not be provided and the cathode 43 of each solid electrolytic capacitor element 10 may be directly connected to the first external electrode 120. In this case, for example, after peeling off the adhesive sheet 250, the lower part of the first portion 221 to which the sheet 250 was attached may be scraped off with a grinder or the like to expose each cathode 43 at the first end surface 110e (cathode end surface) of the electronic component body 110, and the first external electrode 120 may be formed on each cathode 43 exposed at the first end surface 110e.

[0140] Furthermore, when the current collecting electrode 30 is not provided, the second portion 222a of the exterior body 220 may be manufactured according to the following steps. That is, first, the liquid material 222 is injected and filled into each through-hole 223 of the first portion 221 by using a dispenser or the like. Next, a plurality of solid electrolytic capacitor elements 10 (superimposed body 11) are inserted into each through-hole 223 filled with the liquid material 222, and the liquid material 222 is filled around each inserted element 10. For example, after the insertion of the plurality of elements 10, vacuum degassing is performed to fill the liquid material 222 around each element 10. Then, the liquid material 222 filled in each through-hole 223 is cured by heating in a vacuum oven, for example.

[0141] In the above embodiment, the exterior body 20 is composed of only two types of resin materials, i.e., the first portion 21 and the second portion 22. However, the exterior body of the electronic component of the present invention may be composed of three types of resin materials. For example, one or more intermediate resin layers composed of resin materials may be provided between the first portion and the second portion. Such an intermediate resin layer can be formed, for example, by forming the second portion that seals the stack of multiple solid electrolytic capacitor elements with dimensions smaller than the through hole of the first portion by transfer molding or the like, and then inserting the stack of solid electrolytic capacitor elements together with the second portion into the through hole of the first portion, and filling the gap between the second portion and the first portion with a liquid resin material and curing it.

[0142] In addition, in the above embodiment, a case has been described in which the electronic component 100 includes a plurality of solid electrolytic capacitor elements 10 as elements, but the electronic component of the present invention need only include at least one element (electronic component element), and may include only one element.

[0143] In addition, in the above embodiment, a case has been described in which a plurality of electronic component bodies 110 are simultaneously produced using a first portion 221 having a plurality of through holes 223, but in the electronic component manufacturing method of the present invention, electronic component bodies may also be produced one by one using a first portion having only one through hole.

[0144] In the above embodiment, the electronic component 100 is described as a solid electrolytic capacitor. However, the electronic component of the present invention is not particularly limited as long as it is an electronic component including an element (electronic component element) and an exterior body, and may be, in addition to a solid electrolytic capacitor, for example, a film capacitor, an electric double layer capacitor, a solid-state battery, etc.

[0145] The present specification discloses the following:

[0146] <1> an electronic component body including an element and an exterior body sealing the element, the electronic component body having a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface opposing each other in a third direction perpendicular to the first direction and the second direction; A first external electrode formed on the fifth surface; a second external electrode formed on the sixth surface, the exterior body has a first portion including a first resin material and a second portion including a second resin material surrounded by the first portion, the first portion is present on at least a part of each of the first surface, the second surface, the third surface, and the fourth surface of the electronic component body, The second portion has an exposed portion exposed to at least one of the first surface, the second surface, the third surface, and the fourth surface of the electronic component body.

[0147] <2> the exposed portion is in contact with at least one of the fifth surface and the sixth surface. <1> 2. An electronic component as described in claim 1.

[0148] <3> the exposed portion is provided at one, two or four locations per electronic component body, and is symmetrical in at least one of left and right directions and up and down directions when viewed in cross section on a plane perpendicular to the longitudinal direction in a state in which the first surface and the second surface are arranged vertically. <1> or <2> 2. An electronic component as described in claim 1.

[0149] <4> The exposed portion is present on at least one of the first surface and the second surface. <1> from <3> 13. An electronic component according to any one of claims 1 to 12.

[0150] <5> the first resin material includes at least one of polyphenylene sulfide and a liquid crystal polymer; The second resin material includes at least one of an epoxy resin and a silicone resin. <1> from <4> 13. An electronic component according to any one of claims 1 to 12. <6> The water vapor permeability of the first resin material at 40°C and 90% RH is 200 g μm / m 2 / day or less, The water vapor permeability of the second resin material at 40°C and 90% RH is 500g μm / m 2 / day or more, <1> from <5> 13. An electronic component according to any one of claims 1 to 12.

[0151] <7> the second portion has a tapered structure that becomes thinner from the inside of the electronic component body toward the exposed surface of the exposed portion. <1> from <6> 13. An electronic component according to any one of claims 1 to 12.

[0152] <8> The tapered structure has a curved tapered surface. <7> 2. An electronic component as described in claim 1.

[0153] <9> a stack of a plurality of electrolytic capacitor elements as the element arranged along the first direction; <1> from <8> 13. An electronic component according to any one of claims 1 to 12.

[0154] <10> providing a device; preparing a first portion of an exterior body including a first resin material and having a through hole; a step of hardening a liquid material, including a liquid second resin material, filled in a gap between the first portion and the element inserted into the through hole to form a second portion of the exterior body; cutting the exterior body at a cut line around the element; The through hole has a shape in which a portion of the through hole is located on the cut line, A method for manufacturing an electronic component, wherein in the step of cutting the exterior body, an exposed portion of the second portion is formed by cutting the exterior body along the cut line. [Explanation of symbols]

[0155] 10 Solid electrolytic capacitor element 11 Superposition 20 Exterior body 21 Part 1 22 Part 2 23 Exposed part 23a Exposed surface 23b Tapered surface 23c Opposite surface 24 Space 25 Non-exposed part 30 Current collecting electrode 40 Anode 40a Tip surface 40b Proximal surface 41 Dielectric layer 42 Mask Layer 43 Cathode 44 Solid electrolyte layer 45 Carbon Layer 46 Cathode conductor layer 100 Electronic Components 110 Electronic component body 110a 1st main surface 110b 2nd principal surface 110c 1st side 110d 2nd side 110e 1st end face 110f 2nd end face 110g, 110h ridgeline 110j Corner 120 1st external electrode 130 2nd external electrode 210 Work 211 Holding part 212 Element section 220 Exterior body 221 Part 1 222 Liquid Materials 222a Part 2 223 Through hole 223a First opening 223b Second opening 230 Conductive Paste 250 Adhesive Sheet

Claims

1. an electronic component body including an element and an exterior body sealing the element, the electronic component body having a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface opposing each other in a third direction perpendicular to the first direction and the second direction; A first external electrode formed on the fifth surface; a second external electrode formed on the sixth surface, the exterior body has a first portion including a first resin material and a second portion including a second resin material surrounded by the first portion, the first portion is present on at least a part of each of the first surface, the second surface, the third surface, and the fourth surface of the electronic component body, The second portion has an exposed portion exposed to at least one of the first surface, the second surface, the third surface, and the fourth surface of the electronic component body.

2. The electronic component according to claim 1 , wherein the exposed portion is in contact with at least one of the fifth surface and the sixth surface.

3. 3. The electronic component according to claim 1 or 2, wherein the exposed portions are provided at one, two or four locations per electronic component body, and are symmetrical in at least one of left and right directions or top and bottom directions when viewed in cross section on a plane perpendicular to the third direction with the first surface and the second surface arranged one above the other.

4. The electronic component according to claim 1 , wherein the exposed portion is present on at least one of the first surface and the second surface.

5. the first resin material includes at least one of polyphenylene sulfide and a liquid crystal polymer; The electronic component according to claim 1 , wherein the second resin material includes at least one of an epoxy resin and a silicone resin.

6. The water vapor permeability of the first resin material at 40° C. and 90% RH is 200 g μm / m ２ / day or less, The water vapor permeability of the second resin material at 40° C. and 90% RH is 500 g·μm / m ２ The electronic component according to claim 1 or 2, wherein the period is equal to or more than one day.

7. 3. The electronic component according to claim 1, wherein the second portion has a tapered structure that becomes thinner from an inner side of the electronic component body toward the exposed surface of the exposed portion.

8. The electronic component according to claim 7 , wherein the tapered structure has a curved tapered surface.

9. The electronic component according to claim 1 , further comprising a stack of a plurality of electrolytic capacitor elements as the element, the stack being arranged along the first direction.

10. providing a device; preparing a first portion of an exterior body including a first resin material and having a through hole; a step of hardening a liquid material, including a liquid second resin material, filled in a gap between the first portion and the element inserted in the through hole to form a second portion of the exterior body; cutting the exterior body at a cut line around the element; The through hole has a shape in which a portion of the through hole is located on the cut line, A method for manufacturing an electronic component, wherein in the step of cutting the exterior body, an exposed portion of the second portion is formed by cutting the exterior body along the cut line.

Images