Wafer-type sensor unit and data acquisition method using the wafer-type sensor unit

Abstract

To provide a wafer type sensor unit for improving the air flow analysis method in a semiconductor process.SOLUTION: A wafer type sensor unit that is supported by a support unit, which supports a substrate, of a substrate processing device including the support unit and acquires data about the wind direction and the wind speed of the air flow in a process is disclosed. The unit may include a circuit board with a wafer shape, and a heat ray wind speed sensor that is provided to a position a predetermined distance away from an upper surface of the circuit board.SELECTED DRAWING: Figure 1A

Description

[Technical field]

[0001] The present invention relates to a wafer-type sensor unit and a data acquisition method using the wafer-type sensor unit, and more particularly to a wafer-type sensor unit capable of measuring airflow flowing in the Z-axis direction. [Background technology]

[0002] In semiconductor processing, the direction and speed of airflow are closely related to particle and temperature distribution. One of the important issues is to control the direction and speed of airflow uniformly by measuring the airflow over the wafer. As there are no existing commercial products that can measure airflow on the surface of the wafer, a method was used in which a commercially available airflow sensor was installed together with a jig at a specific location within the facility to measure the airflow and estimate the airflow within the facility. However, airflow analysis using a commercial anemometer like this was difficult.

[0003] The existing method had a problem that there was a high probability of measurement errors occurring due to human error such as the angle or height of the anemometer, which occurs when the anemometer is manually installed. In addition, when measuring wind speed, it was difficult to disassemble the equipment and install auxiliary tools according to the equipment structure, and the conventional patented technology had a problem of being unable to measure wind speed in the Z-axis direction. In addition, the anemometer structure and tool act as an obstacle to the airflow generated around the wafer, affecting the airflow, which caused a problem of measurement errors occurring depending on the distance difference from the wafer. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Patent Publication No. WO201711196A1 Summary of the Invention [Problem to be solved by the invention]

[0005] SUMMARY OF THE PRESENT EMBODIMENT An object of the present invention is to provide a wafer-type sensor unit for improving an airflow analysis method in a semiconductor process.

[0006] The problems to be solved by the present invention are not limited to those mentioned above, and problems not mentioned should be clearly understood by a person having ordinary skill in the art to which the present invention pertains from this specification and the attached drawings. [Means for solving the problem]

[0007] According to an embodiment of the present invention, a wafer-type sensor unit is disclosed that is supported by a support unit of a substrate processing apparatus including a support unit on which a substrate is supported, and acquires data on airflow direction and speed during processing.

[0008] The wafer-type sensor unit may include a wafer-shaped circuit board and a hot wire anemometer provided at a position spaced a predetermined distance from an upper surface of the circuit board.

[0009] According to an embodiment, a plurality of the thermal anemometers may be provided, and the plurality of thermal anemometers may be spaced apart from each other by a predetermined distance at the center of the circuit board.

[0010] According to an embodiment, the plurality of hot wire anemometers may be combined and arranged in the shape of concentric circles centered on a center point of the circuit board.

[0011] According to an embodiment, the hot wire anemometer may be provided at a position spaced apart from the upper surface of the circuit board by 0.5 mm or more.

[0012] According to an embodiment, the plurality of hot wire anemometers may be spaced apart from the upper surface of the circuit board by the same distance.

[0013] According to an embodiment, the display device may further include a spacing member for spacing the circuit board and the hot wire anemometer.

[0014] According to one embodiment, the spacing member may be provided by a thermal insulating material.

[0015] According to an embodiment, the wafer-type sensor unit may further include an electronic element disposed under the circuit board.

[0016] According to an embodiment, the electronic device may further include a power supply unit and a signal processing unit for processing a signal of the circuit board.

[0017] According to another embodiment of the present invention, there is disclosed a wafer-type sensor unit that is supported by a supporting unit of a substrate processing apparatus including the supporting unit for supporting a substrate and that acquires data on airflow direction and speed during processing.

[0018] The wafer-type sensor unit may include a wafer-shaped circuit board, an electronic device installed on an upper surface of the circuit board and coated on the upper surface of the circuit board, the height of the coating film being the same as that of the circuit board and spaced apart by a predetermined distance, and a hot wire anemometer provided at a position spaced apart by a predetermined distance from the upper surface of the coating film of the electronic device.

[0019] According to another embodiment of the present invention, a method for acquiring data on airflow direction and speed during a process using a wafer-type sensor unit is disclosed.

[0020] The method may include measuring wind speed at each location where the thermal anemometer is disposed, and determining a bias in wind speed using measurements from the thermal anemometer.

[0021] According to an embodiment, the step of measuring the wind speed at each position where the hot wire anemometer is disposed may measure a Z-direction wind speed at each position where the hot wire anemometer is disposed. Effect of the Invention

[0022] According to the present invention, it is possible to improve the measurement accuracy as compared with the existing airflow analysis methods.

[0023] According to the present invention, it is possible to be efficient in terms of user convenience and PM automation.

[0024] The effects of the present invention are not limited to the effects described above, and effects not mentioned can be clearly understood by those having ordinary skill in the art to which the present invention belongs from this specification and the attached drawings. [Brief description of the drawings]

[0025] [Figure 1A] 1 is a diagram showing a wafer-type sensor unit according to an embodiment of the present invention. [Figure 1B] 1 is a diagram showing a wafer-type sensor unit according to an embodiment of the present invention. [Figure 2A] 13 is a view showing a wafer-type sensor unit according to another embodiment of the present invention. [Figure 2B] 13 is a view showing a wafer-type sensor unit according to another embodiment of the present invention. [Figure 3A] 1 is a diagram illustrating an arrangement structure of a hot wire anemometer sensor of a wafer-type sensor unit according to an embodiment of the present invention; [Figure 3B] 1 is a diagram illustrating an arrangement structure of a hot wire anemometer sensor of a wafer-type sensor unit according to an embodiment of the present invention; [Figure 4] 1 is a diagram for explaining the effect of airflow on a vertical plate; [Figure 5A] 13 is a diagram illustrating an arrangement structure of a hot wire anemometer of a wafer-type sensor unit according to another embodiment of the present invention; [Figure 5B] 13 is a diagram illustrating an arrangement structure of a hot wire anemometer of a wafer-type sensor unit according to another embodiment of the present invention; [Figure 6]1 is a diagram showing a result of measuring wind speed using a wafer-type sensor unit according to an embodiment of the present invention. [Figure 7] 1 is a diagram showing a result of measuring wind speed using a wafer-type sensor unit according to an embodiment of the present invention. [Figure 8] 1 is a diagram showing a result of measuring wind speed using a wafer-type sensor unit according to an embodiment of the present invention. [Figure 9] 1 is a diagram showing a result of measuring wind speed using a wafer-type sensor unit according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0026] Other advantages and features of the present invention, and methods for achieving the same, will become apparent from the following detailed description of the embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and may be embodied in various different forms, and the present embodiments are merely provided to fully disclose the present invention and to fully inform those skilled in the art of the scope of the invention, and the present invention is only defined by the scope of the claims.

[0027] Even if not defined, all terms (including technical or scientific terms) used herein have the same meaning as commonly accepted by the art common to the prior art to which this invention belongs. Terms defined by common dictionaries can be interpreted to have the same meaning as they have in the relevant art and / or the text of this application, and should not be conceptualized or interpreted excessively formally without a clearly defined expression herein.

[0028] Terms such as "first," "second," etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only to distinguish one component from another. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component, without departing from the scope of the present invention.

[0029] The singular expression includes the plural expression unless otherwise clearly expressed in the context. Also, in the drawings, the shapes and sizes of elements may be exaggerated for more clear explanation.

[0030] The terms used in the present specification are for the purpose of describing the embodiments and are not intended to limit the present invention. In the present specification, the singular form includes the plural form unless otherwise specifically stated in the text. As used in the specification, 'comprises' and / or various conjugations of this verb, such as 'comprises', 'comprises', etc., the term 'comprises' refers to a recited composition, ingredient, component, step, operation and / or element, and does not exclude the presence or addition of one or more other compositions, ingredients, components, steps, operations and / or elements. As used in the specification, the term 'and / or' refers to each of the listed components or various combinations thereof.

[0031] A "module" as used throughout this specification may refer to a hardware component, such as software, FPGA, or ASIC, as a unit that processes at least one function or operation. However, there is no meaning that a "module" is limited to software or hardware. A "module" may be configured to reside on an addressable storage medium and may be configured to execute one or more processors.

[0032] As an example, a 'module' may include components such as software components, object-oriented software components, class components, and task components, as well as processes, functions, classes, procedures, subroutines, program code segments, drivers, firmware, microcode, circuits, data, databases, data structures, tables, arrays, and variables. The functionality provided by the components and 'modules' may be performed separately by multiple components and 'modules' or may be integrated with other additional components.

[0033] According to the wafer-type sensor unit 1 according to the embodiment of the present invention, the hot wire anemometer 20 is disposed at a position spaced a certain distance from the upper surface of the circuit board 10 where the airflow is to be measured, thereby making it possible to measure the airflow at a desired position. Also, the hot wire anemometer 20 is installed on the upper surface of the circuit board 10 with only a minimum number of hot wires and wiring 50, and other electronic elements 40 such as a signal processing unit, a power supply unit, etc. are integrated under the circuit board 10, thereby minimizing factors that affect the upper airflow.

[0034] 1A and 1B are diagrams showing a wafer-type sensor unit 1 according to an embodiment of the present invention.

[0035] The wafer-type sensor unit 1 according to the embodiment of the present invention may include a circuit board 10, a hot wire anemometer 20, and an electronic element 40. The wafer-type sensor unit 1 according to the embodiment of the present invention is supported by a support unit of a substrate processing apparatus including a support unit on which a substrate is supported, and is capable of acquiring data on the wind direction and wind speed of airflow during processing.

[0036] According to an embodiment, the circuit board 10 may be a PCB board. The circuit board 10 may have a wafer shape. The circuit board 10 may be formed to a size and shape corresponding to the wafer. The electronic elements 40 may be disposed on a lower surface of the circuit board 10. The electronic elements 40 that may be included in the wafer-type sensor unit 1 may include a power supply unit, a signal processing unit, a sensor unit, etc. According to an embodiment, the electronic elements 40 that may be included in the wafer-type sensor unit 1 may further include wiring 50 that connects the electronic elements 40 together, a microcontroller unit MCU, etc.

[0037] According to an embodiment, the power supply unit may include a battery for providing operating power. According to an embodiment, the sensor unit may include a sensor for sensing various conditions. According to an embodiment, the sensor unit may include a temperature sensor, a pressure sensor, etc. The signal processing unit may perform signal processing on information transmitted from the sensor unit. The signal processing unit may include a communication unit for transmitting information, etc.

[0038] According to an embodiment, the electronic components 40 disposed on the lower surface of the circuit board 10 may be formed with a surface coating. According to an embodiment, the electronic components 40 disposed on the lower surface of the board may be protected by a film and may be covered with a cover.

[0039] The coating on the bottom surface of the wafer-type sensor unit 1 may be a cover or case used to protect the electronic elements 40 and the circuit board 10 from the external environment. This may be made of PI, Teflon film, or a cover to minimize the weight, or may be coated with epoxy, PI, acrylic resin, etc.

[0040] According to an embodiment of the present invention, the device may further include a thermal anemometer 20 disposed on the upper surface of the circuit board 10. A plurality of thermal anemometers 20 may be provided. The thermal anemometers 20 may be disposed at a predetermined distance from the upper surface of the circuit board 10. The thermal anemometers 20 are disposed at a predetermined distance from the upper surface of the circuit board 10, thereby providing an effect of measuring the wind speed of airflow flowing in a vertical direction.

[0041] According to another embodiment of the present invention, the hot wire anemometer 20 may be provided in various shapes such as a line, an ellipse, a coil, etc. Alternatively, according to another embodiment of the present invention, the hot wire may be provided alone or may be integrated into a PCB or a film. According to an embodiment of the present invention, the hot wire anemometer 20 may measure the wind speed using a temperature change of the hot wire.

[0042] The present invention has an advantage that the airflow can be measured in the area adjacent to the wafer by using a hot wire anemometer. When using the hot wire anemometer 20 according to the embodiment of the present invention, the hot wire anemometer uses a wire having a micron diameter, so that the size of the structure is small, efficient, and structurally optimized.

[0043] Although the ultrasonic method rather than the thermal wire anemometer 20 can also minimize the structure by making the sensor smaller, it is difficult to measure the edge areas where the airflow is large because two ultrasonic sensors must be installed facing each other or a reflector is required. Therefore, it is preferable to measure the airflow using the thermal wire anemometer 20.

[0044] According to one embodiment, the method of measuring wind speed using the hot wire wind speed sensor 20 can measure the wind speed by outputting a voltage based on the difference with a reference value according to the degree to which a hot wire heated to a high temperature is cooled by the wind speed.

[0045] That is, according to an embodiment of the present invention, the hot wire anemometer 20 may be provided at a distance to measure the wind speed in the Z-axis on the surface of the circuit board 10. According to an embodiment, the hot wire anemometer 20 may be arranged in a concentric circle configuration based on the center point of the circuit board 10 to check the bias of the airflow.

[0046] 1, a structure is disclosed in which electronic elements 40 are disposed on the lower surface of the circuit board 10, and only the hot wire anemometer 20 and wiring 50 for heat transfer and connection are exposed on the upper surface of the circuit board 10. According to the embodiment of the present invention, electronic elements 40 of the wafer-type sensor unit 1 are disposed on the lower surface of the board, and only the sensor and wiring 50 for airflow measurement are disposed on the upper surface of the board, thereby minimizing external factors required for airflow measurement and providing more accurate airflow measurement results.

[0047] 2A and 2B are views showing a wafer-type sensor unit 1 according to another embodiment of the present invention.

[0048] 2, a wafer-type sensor unit 1 according to another embodiment of the present invention is disclosed. Descriptions of the same features as those in FIG. 1 will be omitted.

[0049] The wafer-type sensor unit 1 according to the embodiment of FIG. 2 differs from the embodiment of FIG. 1 in the following respects.

[0050] According to FIG. 2, the electronic device 40 may be disposed on the upper surface of the circuit board 10, not on the lower surface. The electronic device 40 according to an embodiment may include a signal processing unit, a power supply unit, a sensor unit, etc., as in the embodiment of FIG. 1. The electronic device 40 according to an embodiment of FIG. 2 includes a signal processing unit and a power supply unit, and the electronic device 40 may be provided with a coated surface. According to an embodiment, the electronic device 40 installed on the upper surface of the circuit board 10 may be provided with a coating, and the height of the coating film provided by coating may be provided at a certain distance from the circuit board 10. The height of the coating film provided to coat the electronic device 40 installed on the circuit board 10 may be provided at the same height over the entire area of ​​the circuit board 10. This is because the thermal anemometers 20 are disposed on the top of the coating film of the electronic device in the embodiment of FIG. 2, and all the thermal anemometers 20 are disposed at the same height.

[0051] Referring to FIG. 2, the hot wire anemometer 20 may be provided spaced apart from the upper surface of the coating film of the electronic component 40 by a certain distance.

[0052] When the lower surface of the wafer-type sensor unit 1 is supported by a robot or the like and transported in the embodiment shown in FIG. 2, the lower surface is provided flatter than in the embodiment shown in FIG. 1, which makes it easier to transport.

[0053] In addition, by being spaced a certain distance from the top surface of the coating film of the electronic device 40, when measuring the airflow as in the embodiment of FIG. 1, there is little influence from external factors such as other devices on the top surface of the substrate, so that a uniform airflow can be measured.

[0054] 3A and 3B are diagrams illustrating the layout structure of the hot wire anemometer sensor 20 of the wafer-type sensor unit 1 according to the embodiment of the present invention.

[0055] According to an embodiment of FIG. 3A, the hot wire anemometer 20 may be arranged such that the shape and area of ​​the hot wire are constant on a concentric circular basis.

[0056] According to an embodiment of Fig. 3A, the hot wire anemometers 20 may be arranged to have the same area or direction on concentric circles based on the center point of the substrate. According to an embodiment, they may be arranged perpendicularly or tangentially based on the concentric circles in the substrate. According to an embodiment of Fig. 3A, the deflection of the airflow can be determined from the difference between the sensors evenly arranged based on the concentric circles.

[0057] According to another embodiment of Fig. 3B, a plurality of hot wire wind speed sensors 20 may be arranged to form a plurality of concentric circles based on the center point of the board. According to the embodiment of Fig. 3B, one or more sensors may be installed at the center, edge, or middle part of the board to measure the wind speed applied to the surface of the circuit board 10 from above. Through this embodiment, there is an effect of being able to measure the wind speed at various positions on the circuit board 10.

[0058] According to an embodiment, when a plurality of thermal anemometers 20 are provided, the wind speed at each position is measured, and the bias of the wind speed can be determined using the measured values ​​of the thermal anemometers 20 at each position. Measuring with the thermal anemometers 20 at each position can be measuring the Z-direction wind speed at each position.

[0059] If the hot wire anemometer 20 readings at each location are the same, it may be the case that the airflow in all directions is flowing similarly.

[0060] If the measured values ​​of the hot wire anemometers 20 arranged in a concentric circle are different from each other, the direction of the airflow can be confirmed.

[0061] FIG. 4 is a diagram for explaining the effect of airflow on a vertical plate.

[0062] When the airflow is applied vertically as in the example of FIG. 4, there is a problem in that the velocity is measured as 0 when the airflow is measured on the surface of the substrate.

[0063] More specifically, if the hot wire anemometer 20 is attached to the board instead of being spaced apart from the board, the air current flowing from above in the vertical direction (z direction) of the board will have a wind speed of 0 m / s on the surface of the board and will be outside the measurement range. Therefore, in the present invention, in order to measure the air current flowing in the vertical direction of the board, the hot wire can be spaced apart from the surface of the circuit board 10 as in the embodiment of Figure 5 to measure the minute air current. This will be explained in more detail with reference to Figure 5.

[0064] 5A and 5B are diagrams illustrating the layout structure of hot wire anemometers 20 of a wafer-type sensor unit 1 according to another embodiment of the present invention.

[0065] 5, the hot wire anemometer 20 is not tightly attached to the upper surface of the substrate, but is spaced apart at a certain height, which may be several mm to several cm.

[0066] The reason why the hot wire anemometers 20 are installed at a fixed distance from each other is as follows.

[0067] The principle of measuring wind speed through a hot wire by the hot wire sensor 20 is to measure temperature changes, but if the hot wire is attached to the circuit board 10, the thermal characteristics change, making it difficult to obtain accurate measurement results. Therefore, the hot wire sensor 20 according to the embodiment of the present invention may be provided separated from the upper surface of the board. According to an embodiment, the height at which the hot wire sensor 20 is separated from the upper surface of the board or the electronic device 40 may be installed at different heights depending on the strength of the airflow or the sensor sensitivity. Since the measurement results vary greatly depending on the height at which the hot wire sensor 20 is separated from the upper surface of the board or the electronic device 40, all the hot wire sensors 20 may be installed at the same height in order to measure the uniformity of the airflow.

[0068] According to an embodiment, the hot wire anemometer 20 may be provided in the form of a pin and fixed to the circuit board 10 at a distance.

[0069] According to another embodiment of the present invention, a spacing member 30 may be included between the thermal anemometer 20 and the circuit board 10, which are installed at a distance from each other. According to one embodiment, the spacing member 30 may be made of a heat insulating material. By providing the spacing member 30 as a heat insulating material, it is possible to minimize heat loss of the thermal anemometer 20.

[0070] 6 to 9 are diagrams showing the results of measuring wind speed using the wafer-type sensor unit 1 according to the embodiment of the present invention.

[0071] FIG. 6 is a diagram showing that the wind speed is changed according to the strength of the fan filter unit.

[0072] 6, it can be seen that the wind speed output increases in proportion to the strength (0 to 200 Pa) of the fan filter unit. According to one embodiment of FIG. 6, the wind speed output at the edge portion of the wafer-type sensor unit 1 may be 2.0 to 2.8. The wind speed output at the center portion of the wafer-type sensor unit 1 may be 0.2 to 0.4.

[0073] FIG. 7 is a diagram showing that the wind speed is measured differently along the direction of the hot wire wind speed sensor 20 installed on the wafer.

[0074] 7, it can be seen that the measurement result of the hot wire anemometer 20 installed in the 180° direction from the initial position (0°) is reduced by about 6%. As shown in Fig. 7, the wind speed is measured differently in the direction in which the hot wire anemometer 20 is installed, which has the effect of being able to measure the airflow direction.

[0075] FIG. 8 is a diagram showing that wind speed is measured differently depending on the position of the sensor.

[0076] 8 shows a case where the edge hot wire anemometer 20 is fixed and the center hot wire anemometer 20 is changed in position. It is estimated that the wind speed intensity varies according to the difference in sensor height due to the loss of insulation, even though they are in similar positions. It is also measured that the wind speed intensity on the surface of the wafer type sensor unit 1 is strongest at the edge, followed by the center and then the middle.

[0077] FIG. 9 is a diagram showing that the hot wire anemometers 20 are provided at different positions, so that the anemometers can provide different anemometer measurement results.

[0078] 9 shows that the output changes depending on the height of the sensor even at the same wind speed. From FIG. 9, it can be seen that the wind speed can be easily measured even when the thermal anemometer 20 is spaced about 0.5 mm from the circuit board 10. Thus, the wind speed of the wafer-type sensor unit 1 can be measured under various conditions by adjusting the height between the thermal anemometer 20 and the circuit board 10.

[0079] It should be understood that the above embodiment is presented to help the understanding of the present invention, does not limit the scope of the present invention, and various modified embodiments are also included in the scope of the present invention. The drawings provided in the present invention are merely illustrative of the best embodiment of the present invention. It should be understood that the technical scope of the present invention should be determined by the technical ideas of the claims, and is not limited to the literal description of the claims themselves, but should substantially extend to inventions of equivalent technical value. [Explanation of symbols]

[0080] 1 Wafer type sensor unit 10 Circuit Board 20 Hot wire anemometer 30 Separation member 40 Electronic Elements 50 Wiring

Claims

1. A wafer-type sensor unit is supported by a support unit of a substrate processing apparatus, the support unit including the support unit for supporting a substrate, and acquires data on airflow direction and speed during processing, A wafer-shaped circuit board; a plurality of hot wire anemometers provided at positions spaced a predetermined distance from the upper surface of the circuit board; The plurality of hot wire anemometers are provided at positions spaced apart from an upper surface of the circuit board by 0.5 mm or more. Wafer type sensor unit.

2. A wafer-type sensor unit as described in Claim 1, wherein the multiple thermal anemometers are positioned a predetermined distance away from the center of the circuit board.

3. The wafer-type sensor unit according to claim 2 , wherein the plurality of hot wire anemometers are combined and arranged in the shape of concentric circles centered on a central point of the circuit board.

4. The wafer-type sensor unit of claim 2 , wherein the plurality of hot wire anemometers are spaced apart from the upper surface of the circuit board by the same distance.

5. 5. The wafer-type sensor unit according to claim 1, further comprising a separator for separating the circuit board from the plurality of hot wire anemometers.

6. The wafer-type sensor unit according to claim 5 , wherein the separating member is made of a thermal insulating material.

7. The wafer-type sensor unit includes: The wafer-type sensor unit according to claim 5 , further comprising an electronic element disposed under the circuit board.

8. The electronic element is A power supply unit; The wafer-type sensor unit according to claim 7 , further comprising a signal processing unit for processing a signal from the circuit board.

9. A wafer-type sensor unit is supported by a support unit of a substrate processing apparatus, the support unit including the support unit for supporting a substrate, and acquires data on airflow direction and speed during processing, A wafer-shaped circuit board; an electronic device that is installed on an upper surface of the circuit board and is provided by coating the upper surface of the circuit board with a coating film, the height of the coating film being constant from an upper surface of the circuit board; a plurality of hot wire anemometers provided at positions spaced a predetermined distance from an upper surface of the coating film of the electronic device; The plurality of hot wire anemometers are provided at positions spaced apart from an upper surface of a coating film of the electronic device by 0.5 mm or more. Wafer type sensor unit.

10. A wafer-type sensor unit as described in Claim 9, wherein the multiple thermal anemometers are positioned a predetermined distance away from the center of the circuit board.

11. The wafer-type sensor unit according to claim 10 , wherein the plurality of hot wire anemometers are combined and arranged in the shape of concentric circles centered on a central point of the circuit board.

12. The wafer-type sensor unit of claim 10 , wherein the plurality of hot wire anemometers are spaced at equal distances from the top surface of the coating film of the electronic device.

13. The wafer-type sensor unit according to claim 9 , further comprising a separator for separating an upper surface of the coating film of the electronic element from the plurality of hot wire anemometers.

14. The wafer-type sensor unit according to claim 13 , wherein the separating member is made of a thermal insulating material.

15. A method for acquiring data on airflow direction and speed during a process by using the wafer-type sensor unit according to claim 1 or 9, measuring wind speed at each of the positions where the plurality of hot wire anemometers are disposed; and determining wind speed bias using measurements from the plurality of hot wire anemometers.

16. The step of measuring the wind speed at each of the positions where the plurality of hot wire anemometers are disposed includes: The data acquisition method of claim 15, wherein the Z-direction wind speed is measured at each of the positions where the plurality of hot wire anemometers are disposed.

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