Manufacturing method for multilayer ceramic electronic components

Abstract

A base multilayer body in which a plurality of dielectric ceramics and a plurality of internal electrode layers are layered in an alternating manner is cut along a cutting line orthogonal to the base multilayer body, a plurality of element precursors having a cut side surface in which the internal electrode layers are exposed is obtained, the element precursors are aligned so that the cut side surfaces serve as open surfaces, an air removal liquid is applied to the open cut side surfaces, a side surface green sheet is brought into contact with the air removal liquid applied to the cut side surfaces, and the side surface green sheet is subsequently pressed.

Description

[Technical field]

[0001] The present invention relates to a method for manufacturing a laminated electronic component in which a protective layer is provided on the side surface of a laminate where internal electrode layers are exposed. [Background technology]

[0002] An example of the prior art is described in Patent Document 1. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 5780169 Summary of the Invention

[0004] The method for manufacturing a multilayer ceramic electronic component disclosed herein includes cutting a base laminate, in which a plurality of dielectric ceramics and a plurality of internal electrode layers are alternately stacked, along cutting lines perpendicular to the base laminate to obtain a plurality of element precursors having cut sides at which the internal electrode layers are exposed, aligning the element precursors so that the cut sides become open faces, applying an air removing liquid to the open cut sides, bringing a side surface green sheet into contact with the air removing liquid applied to the cut sides, and then pressing the side surface green sheet.

[0005] In addition, the method for manufacturing a multilayer ceramic electronic component disclosed herein involves cutting a base laminate in which a plurality of dielectric ceramics and a plurality of internal electrode layers are alternately stacked, along a cutting line perpendicular to the base laminate, to obtain a plurality of element precursors having cut sides on which the internal electrode layers are exposed, aligning the element precursors so that the cut sides are open faces, applying an air removing liquid to the open cut sides, bringing a side green sheet into contact with the air removing liquid applied to the cut sides, pressing the side green sheet, and removing the portions of the side green sheet other than the portions pressed against the cut sides with a jet air stream containing dry ice fine particles. [Brief description of the drawings]

[0006] [Figure 1] FIG. 1 is a perspective view illustrating an example of a multilayer ceramic capacitor. [Diagram 2] FIG. 2 is a perspective view illustrating a schematic diagram of an element part of the multilayer ceramic capacitor of FIG. [Diagram 3] FIG. 3 is a perspective view showing a schematic diagram of a precursor of the element part of FIG. 2. [Figure 4] FIG. 2 is a perspective view showing a ceramic green sheet on which an internal electrode layer is printed. [Diagram 5] FIG. 2 is a perspective view showing a schematic stacking state of ceramic green sheets on which internal electrode layers are printed. [Figure 6] 2 is a perspective view showing a schematic diagram of a base laminate for producing the multilayer ceramic capacitor of FIG. 1. FIG. [Figure 7] FIG. 7 is a perspective view that typically shows an element precursor obtained by cutting the base laminate of FIG. 6. [Figure 8] FIG. 2 is a perspective view showing a schematic state of aligned element precursors. [Figure 9A] FIG. 13 is a diagram showing the state immediately before the open cut side of the element precursor is brought into contact with a nonwoven fabric that has been soaked in an air removing liquid and spread on the bottom of a flat-bottom pool. [Figure 9B] FIG. 13 is a diagram showing an element precursor having an air removing liquid attached to the cut side surface. [Figure 9C] FIG. 13 is a diagram showing a schematic diagram of a state in which side green sheets are arranged. [Figure 9D] FIG. 13 is a schematic diagram showing a state in which the air removing liquid on the cut side surface of the element precursor is pressed against the side surface green sheet. [Figure 10A] FIG. 13 is a diagram showing a state in which air remains in a recess on a cut side surface after the application of an air removing liquid. [Figure 10B] FIG. 2 is a diagram showing a schematic diagram of air being present in an air removing liquid. [Figure 10C] FIG. 13 is a diagram showing a schematic diagram of air being pushed away and removed from the cut side surface together with the air removing liquid. [Figure 11A]13 is a diagram showing a schematic diagram of a marginal portion of a side green sheet being cut by dry ice particles. FIG. [Figure 11B] 13 is a diagram showing a schematic view of a support member supporting a marginal portion of a side surface green sheet. FIG. [Figure 12] FIG. 11 is a perspective view showing a schematic state of an element part on which a side green sheet is laid. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0007] The objects, features and advantages of the present disclosure will become more apparent from the following detailed description and drawings.

[0008] In recent years, electronic components mounted on wiring boards of electronic devices have become more sophisticated and smaller in size. One example of such electronic components is a multilayer ceramic capacitor.

[0009] There is a demand for improving the capacitance per unit volume of multilayer ceramic capacitors, so it is important to reduce the thickness of the dielectric between the internal electrode layers, reduce the margin of the outer shell that protects the inside, and increase the area ratio of the internal electrode layers.

[0010] For example, Patent Document 1 presents a method in which a mother block in which internal electrode layers and ceramic green sheets are alternately stacked is cut along orthogonal cutting lines to form multiple green chips, and then the parts are rolled while spreading the gap between them with an expandable adhesive sheet, and a thin side ceramic green sheet is attached to the cut side where the internal electrode layer is exposed, to form a protective layer.

[0011] In addition, Patent Document 1 presents a means of applying an adhesive to improve adhesion to the ceramic protective layer, and a means of forming a raw ceramic protective layer and then heat-pressing it at a temperature of 200°C or less.

[0012] However, the method described in Patent Document 1 has some problems. In order to expand the distance between the green chips, a process is presented in which a plurality of green chips arranged in rows and columns are attached to an expandable adhesive sheet, and the adhesive sheet is expanded in this state, but the disposable expanded adhesive sheet requires material costs.

[0013] When adhesive is used for bonding, there is always the possibility that air may be present in the recesses on the cut side due to the adhesive layer. If sintering is performed with air remaining between the cut side and the protective side green sheet, this area will become a void, causing insulation deterioration or reduced reliability. In this way, it is important to perform bonding without air in the green bonding process, but there is no description of how to do this.

[0014] In addition, there is no specific description of the adhesive used to attach the side green sheet to the cut surface, and there is no mention of the fact that with normal adhesives, small cavities may remain when the cut side surface is adhered with air trapped between the unevenness of the cut side surface. Also, with some adhesives, gas generated in the adhesive layer area can create cavities inside.

[0015] In addition, in the method of placing the side ceramic green sheet on an elastic body and pressing the cut side against it to punch out, in order to prevent punching defects when punching out the side ceramic green sheet with the corner of the raw element precursor, the elastic body had to penetrate deep between the components, which resulted in a restriction that the components had to be spaced apart widely, and there was a risk that a large number of components could not be processed at once on the base plate.

[0016] An object of the present disclosure is to provide a method for manufacturing a multilayer ceramic electronic component that enables side ceramic green sheets to be laid without allowing air to be trapped on the cut side surfaces of a green laminate.

[0017] Hereinafter, an embodiment of a method for manufacturing a multilayer ceramic electronic component according to the present disclosure will be described with reference to the drawings. Note that, although a multilayer ceramic capacitor will be described as an example of a multilayer ceramic electronic component, the multilayer ceramic electronic component to which the present disclosure is directed is not limited to a multilayer ceramic capacitor, and can be applied to various multilayer ceramic components such as a multilayer piezoelectric element, a multilayer thermistor element, a multilayer chip coil, and a ceramic multilayer substrate.

[0018] FIG. 1 is a perspective view of an example of a multilayer ceramic capacitor. First, a multilayer ceramic capacitor 1, which is an example of a multilayer ceramic electronic component, will be described. FIG. 2 is a perspective view that typically shows an element component of the multilayer ceramic capacitor of FIG. 1. FIG. 2 is a view showing the element component before firing, and also a view showing the element component after firing. This is because the element component after firing has the same structure as the element component before firing, although it has shrunk due to firing. FIG. 3 is a perspective view that shows a precursor of the element component of FIG. 2. Hereinafter, the precursor of the element component may be referred to as an element precursor.

[0019] The multilayer ceramic capacitor 1 in Fig. 1 has an element component 2 and an external electrode 3. As shown in Fig. 2, the element component 2 has a substantially rectangular parallelepiped shape. The element component 2 is made of a dielectric ceramic 4 and has a plurality of internal electrode layers 5 connected to the external electrode 3. The external electrodes 3 are disposed on a pair of end faces of the element component 2 and extend around to other adjacent faces. The multiple internal electrode layers 5 extend inward from a pair of end faces of the element component 2 and are alternately stacked without contacting each other.

[0020] The external electrode 3 is configured to have an undercoat layer that connects to the element component 2, and a plated outer layer that facilitates solder mounting of external wiring to the external electrode 3. The undercoat layer may be applied and baked onto the element component 2 after sintering. The undercoat layer may be disposed on the element component 2 before sintering, and may be fired simultaneously with the element component 2. The undercoat layer and plated outer layer may be multiple layers according to the required function. The external electrode 3 may not have a plated outer layer, and may be configured to have an undercoat layer and a conductive resin layer.

[0021] Fig. 3 is a perspective view showing a schematic diagram of a precursor of the element part in Fig. 2. The element part 2 is obtained by laying a protective layer 6 on a pair of first side surfaces 9a and second side surfaces 9b of the element part precursor 13 in Fig. 3. The element part precursor 13 has a substantially rectangular parallelepiped shape as shown in Fig. 3. The element part precursor 13 has a pair of first main surfaces 7a and second main surfaces 7b facing each other, a pair of first end surfaces 8a and second end surfaces 8b facing each other, and a pair of first side surfaces 9a and second side surfaces 9b facing each other.

[0022] The internal electrode layer 5 is exposed on the first end face 8a, the second end face 8b, the first side face 9a, and the second side face 9b of the element precursor 13. The protective layer 6 is attached last in the production of the element component 2. The protective layer 6 not only physically protects the first side face 9a and the second side face 9b, but also suppresses electrical short-circuiting between the internal electrode layer 5 exposed on the first end face 8a and the internal electrode layer 5 exposed on the second end face 8b. The protective layer 6 may be made of a ceramic material having high insulation properties and high mechanical strength. In FIG. 2, the boundary between the element precursor 13 and the protective layer 6 is shown by a two-dot chain line, but the actual boundary is not clearly visible.

[0023] The manufacturing method of the element component 2 and the multilayer ceramic capacitor 1 in Fig. 2 is explained below. First, a ceramic powder mixture of BaTiO3, a ceramic dielectric material, and additives is wet-pulverized and mixed in a bead mill. A polyvinyl butyral binder, a plasticizer, and an organic solvent are added to the pulverized and mixed slurry and mixed to produce a ceramic slurry.

[0024] Next, a ceramic green sheet 10 is formed on the carrier film using a die coater. The thickness of the ceramic green sheet 10 may be, for example, about 1 to 10 μm. The thinner the ceramic green sheet 10, the higher the capacitance of the multilayer ceramic capacitor can be. The forming of the ceramic green sheet 10 is not limited to the die coater, and may be performed using, for example, a doctor blade coater or a gravure coater.

[0025] FIG. 4 is a perspective view showing a ceramic green sheet on which an internal electrode layer is printed. Next, as shown in FIG. 4, a conductive paste containing a metal material to be the internal electrode layer 5 is printed in a predetermined pattern on the ceramic green sheet 10 prepared above by using a screen printing method. The printing of the conductive paste is not limited to the screen printing method, and may be performed by using, for example, a gravure printing method or the like. The conductive paste may contain, for example, a metal such as Ni, Pd, Cu, Ag, or an alloy thereof. In FIG. 3, an example in which the pattern of the internal electrode layer 5 is a strip-shaped pattern of multiple rows is shown, but the pattern of the internal electrode layer 5 may be, for example, an individual electrode pattern or the like.

[0026] As long as the characteristics of the capacitor can be ensured, the thinner the thickness of the internal electrode layer 5, the more the internal defects caused by internal stress can be prevented. In the case of a capacitor with a high number of laminations, the thickness of the internal electrode layer 5 may be, for example, 1.0 μm or less.

[0027] FIG. 5 is a perspective view showing a schematic stacking state of ceramic green sheets on which internal electrode layers are printed. Next, as shown in FIG. 5, a predetermined number of ceramic green sheets 10 on which internal electrode layers 5 are printed are stacked on top of a predetermined number of stacked ceramic green sheets 10, and a predetermined number of ceramic green sheets 10 are further stacked. A predetermined number of ceramic green sheets 10 on which internal electrode layers 5 are printed are stacked while shifting the patterns of the internal electrode layers 5. Although omitted in FIG. 5, the ceramic green sheets 10 are stacked on a support sheet. The support sheet may be an adhesive release sheet that can be adhered and released, such as a weak adhesive sheet or a foam release sheet.

[0028] FIG. 6 is a perspective view showing a schematic diagram of a base laminate for manufacturing the multilayer ceramic capacitor of FIG. 1. Next, a laminate formed by laminating a plurality of ceramic green sheets 10 is pressed in the lamination direction to obtain an integrated base laminate 11 as shown in FIG. 6. The laminate can be pressed using, for example, a hydrostatic press. Inside the base laminate 11, the internal electrode layers 5 are embedded in layers with the ceramic green sheets 10 sandwiched therebetween. Although omitted in FIG. 6, a support sheet used when laminating the ceramic green sheets 10 is located below the base laminate 11. Also, the orthogonal dashed lines shown in FIG. 6 are cutting lines indicating the positions to be cut.

[0029] Fig. 7 is a perspective view showing a schematic diagram of an element precursor obtained by cutting the base laminate of Fig. 6. Next, as shown in Fig. 7, the base laminate 11 is cut to a predetermined size using a push-cutting device to obtain the element precursor 13 of Fig. 3. The method of cutting the base laminate 11 is not limited to the method using the push-cutting device, and a dicing saw device, for example, may be used. The main surface, end surface, and side surface of the base laminate 11 correspond to the main surface 7, end surface 8, and cut side surface 9 of the base precursor 13, respectively, and therefore will be denoted by the same reference numerals below.

[0030] Next, a transfer tray (not shown) in which pockets (not shown) for storing individual element precursors 13 are aligned lengthwise and widthwise is prepared, and the element precursors 13 are aligned on the transfer tray with the cut side 9 facing upward. Thereafter, an adhesive and peelable support sheet 18 is placed over the element precursors 13, and the element precursors 13 are fixed to the support sheet 18.

[0031] Fig. 8 shows the element precursor 13 fixed to the support sheet 18 after the transfer tray has been removed. As shown in Fig. 8, the cut side surface 9 of the element precursor 13 is an open surface.

[0032] Next, the process of attaching the side surface green sheet 17 to the cut side surface 9 of the element precursor 13 will be described with reference to Figures 9A to 9D. Figure 9A shows a state immediately before nonwoven paper soaked in air removing liquid 20 is laid on the bottom surface of a flat-bottom pool 21 and the open cut side surface 9 of the element precursor 13 is brought into contact with the nonwoven paper. Figure 9B shows the element precursor 13 with the air removing liquid 20 attached to the cut side surface 9.

[0033] In addition to having good wettability with respect to the element precursor 13 and the side green sheet 17, it is desirable that the air removing liquid 20 is a liquid that does not dry quickly and does not dissolve both the materials of the element precursor 13 and the side green sheet 17. After the air removing liquid 20 is applied to the cut side surface 9 and comes into contact with the side green sheet 17, it does not penetrate into the element precursor 13 or the side green sheet 17 and disappear while being pressed against the side green sheet 17, but maintains its liquid state. For example, a solvent is not preferable from the above-mentioned viewpoint. A solvent has good wettability because it dissolves the side green sheet 17, but if it dissolves the surface of the cut side surface 9, Ni particles present on the surface will move, leading to a short circuit between adjacent exposed internal electrode layers.

[0034] Thereafter, as shown in Fig. 9C, side surface green sheet 17 is prepared. Side surface green sheet 17 may be a laminate of a plurality of green sheets, or may be a laminate of green sheets of different compositions.

[0035] Next, as shown in FIG. 9D, the air removing liquid 20 on the cut side surface 9 of the element precursor 13 is brought into contact with the side surface green sheet 17, and the element precursor 13 is pressed against the side surface green sheet 17 using a press. The air removing liquid 20 sandwiched between the cut side surface 9 and the side surface green sheet 17 is pushed out of the cut side surface 9 and discharged into the margin of the side surface green sheet 17. If the pressing force is too weak, the air removing liquid 20 will not be expelled from above the cut side surface 9. If the pressing force is too strong, the element precursor 13 before firing will deform. The pressing force is 30 kg / cm. 2 ~100Kg / cm 2 may be in the range.

[0036] In this process, it is important to attach the side green sheet 17 without air. If sintering is performed while air is present between the cut side 9 and the side green sheet 17 protecting the cut side 9, that portion will become a void, causing insulation deterioration or reliability deterioration. When the air removing liquid 20 with good wettability is applied to the cut side 9, the cut side 9 is wetted evenly with the air removing liquid 20. Even if the cut side 9 has a minute uneven portion, the air removing liquid 20 spreads and wets the surface, and the air originally trapped in the recess is separated from the cut side 9. Then, in the subsequent pressing process, the air removing liquid 20 is pushed out of the cut side 9, so the air contained in the air removing liquid 20 is also discharged. The wettability of the air removing liquid 20 to the cut side 9 is preferably one in which the contact angle is close to zero and the liquid shows an expansion wetting such that the liquid spreads on the solid surface.

[0037] Here, we will explain the action of an air removing agent that exhibits an expansionary wetting effect in which a liquid spreads over a solid surface. Figure 10A shows a schematic diagram of a state in which air 31 is present in a recess 19 of a cut side surface 9 after the application of air removing liquid 20. The surface of the cut side surface 9 where the air 31 is present is not wet at first, but the entire surface of the cut side surface 9 becomes wetted by the gradually spreading air removing liquid 20, and the air 31 comes to be present in the air removing liquid 20 as shown in Figure 10B.

[0038] In this embodiment, a plasticizer is used as the air removing liquid 20. The plasticizer increases the plasticity of the binder of the element precursor 13 or the binder of the side green sheet 17, and has good wettability to the element precursor 13, so that it exhibits diffusive wettability. Therefore, the surface of the element precursor 13 can be completely wetted without dissolving the element precursor 13. For example, even if the plasticizer is applied while leaving the air 31 in the recess 19 of the cut side 9, the plasticizer penetrates into the cut side 9 where the air 31 exists so as to wet the cut side 9, so that the air 31 is separated from the cut side 9 as shown in FIG. 10B, and when the plasticizer is pushed aside and removed from the cut side 9 by the subsequent pressing, the air 31 is also pushed aside and removed from the cut side 9 together as shown in FIG. 10C.

[0039] Furthermore, when the plasticizer comes into contact with the binder on the surface of the element precursor 13 or the side surface green sheet 17, the plasticity of the binder on the surface with which the plasticizer comes into contact is increased. Similarly, the plasticity of the binder present on the surface on the side to which the side surface green sheet 17 is attached is also increased. This allows the pressure bonding to be performed effectively.

[0040] As the plasticizer, when the binder used in the green sheet of this embodiment is a polyvinyl butyral resin binder, a phthalate ester such as dioctyl phthalate (DOP), bis(2-ethylhexyl) phthalate (DEHP) or dibutyl phthalate (DBP), which has good compatibility, or a phosphoric acid ester or a fatty acid ester may be used.

[0041] In the pressing process, the base plate on which the side surface green sheet 17 is placed is preferably a flat hard plate in order to ensure the discharge of the air removing liquid 20. However, in consideration of cases in which the dimensions of the element precursor 13 vary, a flexible sheet may be sandwiched in the pressing mechanism. In that case, an elastic body such as a thin silicone rubber plate may be interposed between the support sheet 18 of the element precursor 13 and a press punch (not shown), rather than on the side surface green sheet 17 side.

[0042] FIG. 11A is a schematic diagram showing how the margin of the side green sheet is cut by dry ice particles. After the above-mentioned application and removal of the air removing liquid 20, the margin of the side green sheet 17 (other than the part pressed against the cut side 9) is cut and removed. The part of the side green sheet 17 other than the part pressed against the cut side 9 is removed by a jet air stream containing dry ice particles 30. The dry ice particles 30 remove the heat of the side green sheet 17 when colliding and vaporize, so that the temperature of the side green sheet 17 decreases and the flexibility decreases. In this state, the impact force of the jet air stream and the dry ice is applied to the side green sheet 17, so that the margin of the side green sheet 17 that is not supported below bends and is cut so as to be torn off at the edge of the cut side 9 of the element precursor 13. This is because inside the edge, the side surface green sheet 17 is pressed against the cut side surface 9 by the dry ice jet, and outside the edge, a tensile force acts in the direction in which the side surface green sheet bends, and the dry ice particles 30 collide with the edge. At this time, the air removing liquid 20 expelled from the cut side surface 9 scatters while remaining attached to the torn side surface green sheet 17.

[0043] 11B is a schematic diagram showing a support member supporting a marginal portion of the side surface green sheet. Support members 51 that support portions other than the portion pressed against the cut side surface 9 are arranged around the aligned element body precursors 13. By arranging the support members 51, the cutting environment of the side surface green sheet 17 present in the center of the element body precursor 13 and the side surface green sheet 17 present around the element body precursor 13 can be made the same, thereby reducing the processing time and maintaining uniformity in the cutting quality.

[0044] The dry ice nozzle used was one that could spray dry ice particles on the high-pressure air of the jet stream. The air pressure ranged from 0.2 MPa, which was the minimum pressure required for cutting the sheet, to 0.5 MPa, which was the maximum pressure of air supply in the factory. The distance between the dry ice nozzle and the cut side, which is the surface to be processed, was 20 to 80 mm, and was set appropriately according to the size of the base plate 28. If the distance from the surface to be processed is 80 mm or more, cutting becomes difficult even with the maximum air pressure of 0.5 MPa. The jet stream may be attenuated, but since dry ice is a fine particle, the particles are vaporized before impact, which also affects the smaller impact effect. The dry ice fine particles used had an average particle size of 100 microns or less as measured by high-speed photography observation. This is because the surface of the base body of the multilayer ceramic part before firing is soft, so if the average particle size is large, a polishing effect is gradually expressed and unevenness is formed on the surface of the side green sheet.

[0045] In cutting with a jet stream of dry ice particles, the distance between workpieces can be made as narrow as possible as long as there is a gap for the air stream to pass through, which has the effect of increasing the number of workpieces on the base plate 28.

[0046] As an example of a method that does not use airflow, it is possible to press an elastic body so that the elastic body penetrates between the element components and removes the excess portion by punching it out with the edge of the cut side surface; however, this type of processing is difficult when the spacing between the element components is narrow.

[0047] The above-mentioned processes from the process of applying the air removing liquid to the process of cutting and removing the margins of the side surface green sheet are also performed on the cut exposed surface on the opposite side. Figure 12 shows the appearance of the raw element part 2 obtained by the above processes, with the side surface green sheet as a protective layer laid on a pair of cut side surfaces.

[0048] The obtained element parts were degreased in a nitrogen atmosphere and then fired in a hydrogen / nitrogen mixed atmosphere. After firing, external electrodes were formed by coating and baking a conductive paste to produce the multilayer ceramic capacitor shown in Figure 1.

[0049] The present disclosure may have the following embodiments.

[0050] A method for producing a multilayer ceramic electronic component according to the present disclosure includes cutting a base laminate in which a plurality of dielectric ceramic layers and a plurality of internal electrode layers are alternately stacked, along cutting lines perpendicular to the base laminate, Obtaining a plurality of element precursors having cut side surfaces on which the internal electrode layers are exposed, The precursor body is aligned so that the cut side surface is an open surface; applying an air removing liquid to the open cut side; The side surface green sheet is brought into contact with the air removing liquid applied to the cut side surface, and then the side surface green sheet is pressed.

[0051] In addition, a method for producing a multilayer ceramic electronic component according to the present disclosure includes cutting a base laminate in which a plurality of dielectric ceramics and a plurality of internal electrode layers are alternately laminated, along cutting lines perpendicular to the base laminate, to obtain a plurality of element precursors having cut side surfaces on which the internal electrode layers are exposed, The precursor body is aligned so that the cut side surface is an open surface; applying an air removing liquid to the open cut side; The side surface green sheet is brought into contact with the air removing liquid applied to the cut side surface, and then the side surface green sheet is pressed; A jet stream containing fine dry ice particles is used to remove the portions of the side green sheet other than the portion pressed against the cut side surface.

[0052] According to the method for manufacturing a multilayer ceramic electronic component disclosed herein as configured above, voids at the boundaries between the cut side surfaces of the element component and the side margin layers are eliminated, making it possible to prevent deterioration of insulation or reliability, which are product characteristics after firing.

[0053] Furthermore, according to the method for manufacturing a multilayer ceramic electronic component of the present disclosure configured as described above, the margins, which are the overlapping portions of the side surface green sheets attached to the side surfaces of the laminate, can be efficiently cut and removed. [Explanation of symbols]

[0054] 1. Multilayer ceramic capacitors 2. Base parts 3 External electrode 4. Dielectric ceramic 5 Internal electrode layer 6 Protective layer 7 Main Surface 7a 1st principal surface 7b Second main surface 8 End face 8a 1st end face 8b 2nd end face 9 Cut side 9a 1st side 9b Second side 10 Ceramic green sheet 11 Mother laminate 13. Primer 17 Side green sheet 18 Support Sheet 19 Recess 20 Air Removal Fluid 21 Flat-bottom Pool 22 Transfer Tray 23 Pocket 27 Press 28 Base plate 29 Jet Stream 30 Dry Ice Particles 31 Air 51 Support member

Claims

1. A mother laminate in which a plurality of dielectric ceramics and a plurality of internal electrode layers are alternately laminated is cut along a cutting line perpendicular to the mother laminate to obtain a plurality of element precursors having cut side surfaces on which the internal electrode layers are exposed, The precursor body is aligned so that the cut side surface is an open surface; Applying an air removing liquid, which is a plasticizer, to the open cut side surface; A method for manufacturing a multilayer ceramic electronic component, comprising contacting the side surface green sheet with an air removing liquid applied to the cut side surface, and then pressing the side surface green sheet.

2. 2. The method for producing a multilayer ceramic electronic component according to claim 1, wherein the side green sheets are pressed using a press machine having an elastic body interposed between a support sheet for supporting the element precursor and a press punch.

3. 3. The method for producing a multilayer ceramic electronic component according to claim 1, wherein the portions of said side surface green sheets other than those pressed against said cut side surfaces are removed by a jet stream containing fine dry ice particles.

4. 4. The method for producing a multilayer ceramic electronic component according to claim 3, further comprising the step of: disposing a support member for supporting the portions of said side surface green sheets other than the portions pressed against said cut side surfaces around said aligned element body precursors.

5. A mother laminate in which a plurality of dielectric ceramics and a plurality of internal electrode layers are alternately laminated is cut along a cutting line perpendicular to the mother laminate to obtain a plurality of element precursors having cut side surfaces on which the internal electrode layers are exposed, The precursor body is aligned so that the cut side surface is an open surface; applying an air removing liquid to the open cut side; The side surface green sheet is brought into contact with the air removing liquid applied to the cut side surface, and then the side surface green sheet is pressed; a jet stream containing fine dry ice particles is used to remove the portions of the side green sheet other than the portions pressed against the cut side surfaces.

Images