Forming processing device and method for copper-clad plate

Abstract

The invention relates to the field of copper-clad plate press-fit processing, in particular to a copper-clad plate forming processing device and method.The copper-clad plate forming processing device comprises a supporting table of a hollow structure, a lower layer pressing plate is fixedly connected to the top of the supporting table, and a portal frame stretching across the front side and the rear side of the lower layer pressing plate is fixedly installed at the top of the supporting table; a hydraulic mechanism located above the supporting table is installed at the bottom of the portal frame, and a correction mechanism located on the side face of the lower pressing plate and a multi-stage laminating mechanism located on the top of the lower pressing plate are installed at the bottom of the hydraulic mechanism. According to the invention, the first-stage lamination mechanism and the second-stage lamination mechanism are matched to carry out multi-stage lamination on each layer of stacked copper-clad plates, and the second-stage lamination mechanism is firstly utilized to carry out multi-point pre-compaction on the copper-clad plates, so that air among the layers can be discharged from gaps among compaction points; and then the primary laminating mechanism performs high-temperature heating lamination on the copper-clad plate, so that bubbles are prevented from appearing in the copper-clad plate, and the firmness and quality of lamination molding of the copper-clad plate are improved.

Description

Technical Field

[0001] The invention relates to the technical field of copper clad laminate pressing processing, and in particular to a copper clad laminate forming processing device and method. Background Art

[0002] Copper clad laminate is one of the main materials for making printed circuit boards. It is composed of substrate, copper foil and adhesive, and is made through lamination composite processing technology under high temperature and high pressure. Copper clad laminate not only needs to have good electrical properties, but also needs to have certain mechanical strength, heat resistance, moisture resistance and chemical stability. Copper clad laminate includes single-layer copper clad laminate, double-sided copper clad laminate and multi-layer copper clad laminate. Among them, the most common double-sided copper clad laminate is prepared by laminating the copper foil layer, adhesive layer, substrate layer, adhesive layer and copper foil layer which are properly stacked and neatly arranged from bottom to top.

[0003] At present, copper clad laminates are generally prepared in large sizes, and then cut to the required size after the preparation is completed. At present, large-size copper clad laminates are generally processed by special laminating equipment during production, but there are still the following shortcomings: 1. When laminating large-size copper clad laminates, there are adhesive layers and substrate layers between the stacked copper foil layers, and the large-size copper clad laminates are laminated by pressing up and down. Due to the large size of large-size copper clad laminates, it is easy for air to exist between the stacked copper foil layers, adhesive layers, and substrate layers. If the air between the copper foil layers, adhesive layers, and substrate layers cannot be removed in time during pressing, bubbles will exist inside the laminated copper clad laminate, affecting the firmness and quality of the copper clad laminate.

[0004] 2. Since there is an adhesive layer between the copper foil layer and the substrate layer of the large-size copper clad laminate, the adhesive layer will be in a fluid state during high-temperature lamination. Before the fluid state of the adhesive layer solidifies, it is easy for the copper foil layer and the substrate layer to slide during lamination, resulting in misalignment. Therefore, after the lamination of the copper clad laminate is completed, the edges that do not meet the quality requirements are cut and corrected, resulting in waste of materials and increased production costs and time costs. Summary of the invention

[0005] In order to solve the above problems, the present invention provides a forming processing device for a copper clad laminate, comprising a support table with a hollow structure, the top of the support table is fixedly connected to a lower laminate, the top of the support table is fixedly installed with a gantry spanning the front and rear sides of the lower laminate, the bottom of the gantry is installed with a hydraulic mechanism located above the support table, the bottom of the hydraulic mechanism is installed with a correction mechanism located on the side of the lower laminate and a multi-stage lamination mechanism located on the top of the lower laminate, the bottom of the gantry is also installed with a reset push rod coordinated with the multi-stage lamination mechanism, and the interior of the lower laminate is installed with a conveying mechanism for horizontally conveying the copper clad laminate.

[0006] The correction mechanism includes a downward pressing drive component and a plurality of clamping and leveling components. The clamping and leveling components are installed inside the support platform. The downward pressing drive component is installed at the bottom of the hydraulic mechanism and drives the clamping and leveling components to clamp and level the copper clad laminates after each layer is stacked as a whole as the hydraulic mechanism moves downward.

[0007] The multi-stage laminating mechanism includes a first-level laminating mechanism installed at the bottom of the hydraulic mechanism for laminating copper-clad boards, a second-level laminating mechanism is slidably installed at the bottom of the first-level laminating mechanism, a friction limiting mechanism for clamping and limiting the second-level laminating mechanism is installed inside the first-level laminating mechanism, and electric heating tubes are arranged inside the lower laminating plate and the first-level laminating mechanism.

[0008] In one possible implementation, the hydraulic mechanism includes a plurality of hydraulic cylinders fixedly mounted on the bottom of the gantry, the bottom ends of the output shafts of the plurality of hydraulic cylinders being commonly fixedly connected to a lower pressure plate, the hydraulic cylinders being arranged in a row on the top of the lower pressure plate, and a through hole matching the reset push rod being provided on the top of the lower pressure plate.

[0009] In one possible implementation, the downward pressure driving assembly includes an elastic telescopic cylinder fixedly connected to the bottom surface of the lower pressure plate, the bottom end of the elastic telescopic cylinder penetrates into the interior of the support platform and is fixedly connected to a downward pressure frame, the bottom surface of the downward pressure frame is fixedly connected to a plurality of downward pressure blocks corresponding to the clamping and leveling assemblies one by one, and one end of the downward pressure block close to the clamping and leveling assembly is set as a slope surface one, and the height of the slope surface one gradually increases close to one end of the clamping and leveling assembly.

[0010] In one possible implementation, the clamping and leveling assembly includes a guide plate fixedly connected to the top surface of the inner cavity of the support platform, a leveling plate is slidably installed inside the guide plate, a pushing block is slidably installed on the side of the leveling plate away from the middle of the support platform, a side of the pushing block close to the lower pressure block is set to slope surface 2 and matches the slope surface 1 of the lower pressure block, the bottom of the pushing block is slidably installed on the bottom of the support platform, and a return spring is fixedly connected between the pushing block and the inner wall of the support platform to push the pushing block to move in a direction close to the lower pressure block.

[0011] In one possible implementation, a guide groove is provided inside the guide plate, a guide block is fixedly connected to the side of the screed plate, the guide block is slidably installed inside the guide groove, and the height of the guide groove gradually increases at one end close to the lower laminate.

[0012] In one possible implementation, the primary lamination mechanism includes an upper lamination plate with a hollow structure that is fixedly connected to the bottom of the lower lamination plate and located directly above the lower lamination plate. The bottom of the upper lamination plate is provided with alignment grooves arranged in a row, and the electric heating tube is installed in the bottom wall of the upper lamination plate.

[0013] In one possible implementation, the secondary lamination mechanism includes a movable plate slidably installed inside the upper lamination plate, the bottom of the movable plate is fixedly connected with pre-stressing columns arranged in a row, the bottom end of the pre-stressing column passes through the bottom wall of the upper lamination plate and is fixedly connected with a pre-stressing plate, and the pre-stressing plate matches the alignment groove.

[0014] In one possible implementation, the friction limit mechanism includes a limit frame fixedly installed inside the upper laminate, and the limit frame has friction blocks symmetrically distributed about the pre-stress column slidably installed inside, and a compression spring is fixedly connected between the friction block and the limit frame to push the friction block to move toward the pre-stress column.

[0015] In one possible implementation, the conveying mechanism includes a bearing component slidably mounted inside the lower laminate for horizontally conveying the copper-clad laminate, the bearing component is symmetrically distributed front and back on the lower laminate, and a conveying component is fixedly mounted inside the support platform for pushing the bearing component to move horizontally.

[0016] In one possible implementation, the bearing assembly includes a sliding block slidably mounted inside the lower laminate, the top of the sliding block is flush with the top of the lower laminate, and a plurality of equally spaced suction cups are mounted on the top of the sliding block.

[0017] The beneficial effects of the present invention are as follows: 1. The present invention adopts a primary lamination mechanism and a secondary lamination mechanism to perform multi-stage lamination on the copper clad laminates after each layer is stacked. The secondary lamination mechanism is first used to perform multi-point pre-compression on the copper clad laminates so that the air between the layers can be discharged from the gaps at the compression points. Then, the primary lamination mechanism performs high-temperature heating and lamination on the copper clad laminates to avoid the formation of bubbles inside the copper clad laminates, thereby improving the firmness and quality of the copper clad laminate lamination.

[0018] 2. The present invention uses a hydraulic mechanism, a correction mechanism and a multi-stage laminating mechanism in coordination. While the hydraulic mechanism pushes the multi-stage laminating mechanism to perform multi-stage lamination on the copper clad laminate, the hydraulic mechanism can also drive the correction mechanism to correct and level the copper clad laminate from four sides, thereby avoiding misalignment of the copper clad laminate during the lamination process. There is no need to cut and correct the copper clad laminate, thereby reducing material waste, lowering production costs, and improving the efficiency of copper clad laminate processing. In addition, the correction mechanism clamps the copper clad laminate in an oblique lifting and moving manner. After the copper clad laminate is processed, the correction mechanism can move obliquely downward away from the copper clad laminate to avoid affecting the loading and unloading of the copper clad laminate.

[0019] 3. The present invention adopts a friction limiting mechanism to limit the secondary laminating mechanism. When the hydraulic mechanism pushes the primary laminating mechanism and the secondary laminating mechanism to move downward, the secondary laminating mechanism can pre-press the copper clad laminate first. When the pressure applied by the primary laminating mechanism to the secondary laminating mechanism is greater than the friction force between the friction limiting mechanism and the secondary laminating mechanism, the primary laminating mechanism will slide relative to the secondary laminating mechanism, so that the primary laminating mechanism moves downward to laminate the copper clad laminate, thereby achieving a multi-level lamination effect. In addition, in the process of the primary laminating mechanism moving downward, the friction limiting mechanism maintains dynamic friction pressure on the secondary laminating mechanism, so that the secondary laminating mechanism can pre-press the copper clad laminate with a constant pressure, thereby improving the stability of the pre-pressing. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a three-dimensional structural schematic diagram of the present invention.

[0021] Figure 2 It is a three-dimensional structural schematic diagram of the present invention from another angle.

[0022] Figure 3 It is a cross-sectional view of the front side of the present invention.

[0023] Figure 4 It is a schematic diagram of the planar structure of the present invention when it is fully laminated.

[0024] Figure 5 It is a three-dimensional structural schematic diagram of the correction mechanism of the present invention.

[0025] Figure 6 It is a schematic diagram of the three-dimensional structure of the clamping and leveling assembly of the present invention.

[0026] Figure 7 It is a schematic diagram of the three-dimensional structure of the friction limit assembly of the present invention.

[0027] Figure 8 It is a three-dimensional structural schematic diagram of the conveying mechanism of the present invention.

[0028] In the figure: 1, support table; 11, lower laminate; 2, gantry; 3, hydraulic mechanism; 31, hydraulic cylinder; 32, lower pressure plate; 4, correction mechanism; 41, lower pressure drive assembly; 411, elastic telescopic cylinder; 412, lower pressure frame; 413, lower pressure block; 42, clamping and leveling assembly; 421, guide plate; 4211, guide groove; 422, leveling plate; 4221, guide block; 423, pushing block; 424, reset spring; 5, multi-stage Laminating mechanism; 51. primary laminating mechanism; 511. upper laminating plate; 512. alignment groove; 52. secondary laminating mechanism; 521. movable plate; 522. pre-pressing column; 523. pre-pressing plate; 53. friction limiting mechanism; 531. limiting frame; 532. friction block; 533. clamping spring; 6. reset ejector rod; 7. conveying mechanism; 71. bearing assembly; 711. sliding block; 712. suction cup; 72. conveying assembly; 8. electric heating tube. DETAILED DESCRIPTION

[0029] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described below, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0030] See also Figure 1 and Figure 2 A forming and processing device for a copper-clad laminate comprises a support platform 1 with a hollow structure, a lower laminate 11 is fixedly connected to the top of the support platform 1, a gantry 2 is fixedly installed on the top of the support platform 1 and spans the front and rear sides of the lower laminate 11, a hydraulic mechanism 3 located above the support platform 1 is installed at the bottom of the gantry 2, a correction mechanism 4 located on the side of the lower laminate 11 and a multi-stage lamination mechanism 5 located on the top of the lower laminate 11 are installed at the bottom of the hydraulic mechanism 3, a reset push rod 6 matched with the multi-stage lamination mechanism 5 is also installed at the bottom of the gantry 2, and a conveying mechanism 7 for horizontally conveying the copper-clad laminate is installed inside the lower laminate 11.

[0031] See also Figure 1 and Figure 3 The correction mechanism 4 includes a downward pressing driving component 41 and a plurality of clamping and leveling components 42. The clamping and leveling components 42 are installed inside the support platform 1. The clamping and leveling components 42 are symmetrically distributed about the lower laminate 11. The downward pressing driving component 41 is installed at the bottom of the hydraulic mechanism 3 and drives the clamping and leveling components 42 to clamp and level the copper clad laminate inward as the hydraulic mechanism 3 moves downward.

[0032] See also Figure 1 and Figure 3The multi-stage laminating mechanism 5 includes a primary laminating mechanism 51 installed at the bottom of the hydraulic mechanism 3 for laminating the copper clad laminate, a secondary laminating mechanism 52 for multi-point pre-pressing the copper clad laminate is slidably installed at the bottom of the primary laminating mechanism 51, a friction limiting mechanism 53 for clamping and limiting the secondary laminating mechanism 52 is installed inside the primary laminating mechanism 51, and electric heating tubes 8 are arranged inside the lower laminating plate 11 and the primary laminating mechanism 51, and the electric heating tubes 8 can meet the high temperature requirements during lamination.

[0033] See also Figure 1 , Figure 2 , Figure 3 and Figure 4 The hydraulic mechanism 3 includes a plurality of hydraulic cylinders 31 fixedly installed at the bottom of the gantry 2, and the bottom ends of the output shafts of the plurality of hydraulic cylinders 31 are fixedly connected to a lower pressure plate 32. The hydraulic cylinders 31 are arranged in a row on the top of the lower pressure plate 32, and a through hole matching the reset push rod 6 is opened on the top of the lower pressure plate 32. The hydraulic cylinders 31 push the lower pressure plate 32 to move downward, so that the down-pressure driving assembly 41 can drive the clamping and leveling assembly 42 to move inward to extrude and correct the copper clad laminate, and at the same time push the primary laminating mechanism 51 and the secondary laminating mechanism 52 to move downward to laminate the copper clad laminate. When the hydraulic cylinder 31 drives the lower pressure plate 32 to move upward, it can drive the down-pressure driving assembly 41 and the primary laminating mechanism 51 to move upward and reset. At this time, the bottom end of the reset push rod 6 can enter the interior of the primary laminating mechanism 51 through the through hole to squeeze and push the secondary laminating mechanism 52, so that the secondary laminating mechanism 52 slides down and resets relative to the primary laminating mechanism 51, which is convenient for the next laminating operation.

[0034] See also Figure 1 , Figure 3 , Figure 5 and Figure 6 The downward pressing driving component 41 includes an elastic telescopic cylinder 411 fixedly connected to the bottom surface of the lower pressing plate 32, the bottom end of the elastic telescopic cylinder 411 passes through the interior of the support platform 1 and is fixedly connected to a downward pressing frame 412, and the bottom surface of the downward pressing frame 412 is fixedly connected to a plurality of downward pressing blocks 413 corresponding to the clamping and leveling components 42 one by one, and one end of the downward pressing block 413 close to the clamping and leveling component 42 is set as a slope surface 1, and the height of the slope surface 1 gradually increases close to one end of the clamping and leveling component 42.

[0035] See also Figure 3 , Figure 5 and Figure 6The clamping and leveling assembly 42 includes a guide plate 421 fixedly connected to the top surface of the inner cavity of the support platform 1, a leveling plate 422 is slidably installed inside the guide plate 421, a pushing block 423 is slidably installed on the side of the leveling plate 422 away from the middle of the support platform 1, a side of the pushing block 423 close to the lower pressing block 413 is set as a slope surface 2 and matches the slope surface 1 of the lower pressing block 413, the bottom of the pushing block 423 is slidably installed at the bottom of the support platform 1, and a pushing block 423 is fixedly connected to the inner wall of the support platform 1 to push the pushing block 423 to approach the lower pressing block 413 When the return spring 424 moves in the direction of the elastic telescopic cylinder 411 is pushed downward by the hydraulic mechanism 3, the elastic telescopic cylinder 411 pushes the lower pressing frame 412 and the lower pressing block 413 to move downward, and the lower pressing block 413 is used to squeeze the pushing block 423 downward to make the pushing block 423 slide toward the lower laminate 11, and then the pushing block 423 pushes the smoothing plate 422 to move toward the lower laminate 11, so that the smoothing plate 422 can correct and level the four sides of the copper clad laminate placed on the lower laminate 11, so as to avoid the copper clad laminate from shifting and misaligning during the lamination process.

[0036] See also Figure 6 A guide groove 4211 is provided inside the guide plate 421, and a guide block 4221 is fixedly connected to the side of the screed plate 422. The guide block 4221 is slidably installed inside the guide groove 4211, and the height of the end of the guide groove 4211 close to the lower laminate 11 gradually increases. The guide groove 4211 guides and limits the guide block 4221. When the screed plate 422 moves toward the direction close to the lower laminate 11, the screed plate 422 can move upward synchronously. Conversely, the screed plate 422 can slide downward to the inside of the support platform 1 to avoid obstruction to the loading and unloading of the copper-clad plate on the lower laminate 11.

[0037] See also Figure 1 and Figure 3 The first-level laminating mechanism 51 includes an upper laminating plate 511 with a hollow structure, which is fixedly connected to the bottom of the lower pressing plate 32 and located directly above the lower laminating plate 11. The bottom of the upper laminating plate 511 is provided with alignment grooves 512 arranged in a row, and the electric heating tube 8 is installed in the bottom wall of the upper laminating plate 511.

[0038] See also Figure 1 and Figure 3 The secondary laminating mechanism 52 includes a movable plate 521 slidably installed inside the upper laminating plate 511, and the bottom of the movable plate 521 is fixedly connected with pre-stressing columns 522 arranged in a row. The bottom end of the pre-stressing column 522 passes through the bottom wall of the upper laminating plate 511 and is fixedly connected with a pre-stressing plate 523, which matches the alignment groove 512.

[0039] See also Figure 3 and Figure 7The friction limiting mechanism 53 includes a limiting frame 531 fixedly installed inside the upper laminating plate 511, and a friction block 532 symmetrically distributed about the pre-stressing column 522 is slidably installed inside the limiting frame 531. A compression spring 533 is fixedly connected between the friction block 532 and the limiting frame 531 to push the friction block 532 to move toward the direction close to the pre-stressing column 522. The compression spring 533 pushes the friction block 532 to clamp on the outside of the pre-stressing column 522, so that the pre-stressing column 522 can move together with the upper laminating plate 511. The hydraulic cylinder 31 pushes the primary laminating mechanism 51 and the secondary laminating mechanism 52 downward. First, the pre-stressing plate 523 will first press the copper clad laminate Pre-pressing is performed so that the air between the layers can be discharged from the gap at the extrusion point. When the downward pressure applied by the hydraulic cylinder 31 is greater than the maximum static friction between the friction block 532 and the pre-pressing column 522, the friction block 532 and the pre-pressing column 522 will slide. At this time, the hydraulic cylinder 31 will push the upper laminate 511 to move downward to laminate the copper clad laminate. During lamination, the pre-pressing plate 523 will overlap with the alignment groove 512 to form a whole, so that all parts of the copper clad laminate are evenly pressurized. At the same time, the electric heating tube 8 can heat the copper clad laminate at a high temperature, so that the adhesive layer inside the copper clad laminate can quickly melt into a fluid state and quickly fill in the space between the copper foil layer and the substrate layer of the copper clad laminate.

[0040] See also Figure 2 and Figure 8 The conveying mechanism 7 includes a bearing assembly 71 slidably installed inside the lower laminate 11 for horizontally conveying the copper-clad laminate. The bearing assembly 71 is symmetrically distributed front and back on the lower laminate 11. A conveying assembly 72 for pushing the bearing assembly 71 to move horizontally is fixedly installed inside the support platform 1. The conveying assembly 72 is a lead screw linear slide.

[0041] See also Figure 2 and Figure 8 The bearing assembly 71 includes a sliding block 711 slidably installed inside the lower laminate 11. The top of the sliding block 711 is flush with the top of the lower laminate 11. A plurality of equally spaced suction cups 712 are installed on the top of the sliding block 711. When laminating the copper clad laminate, the suction cups 712 can be adsorbed on the bottom of the copper clad laminate. After lamination, the sliding block 711 is driven horizontally by the conveying assembly 72, so that the sliding block 711 drives the copper clad laminate to move to the outside of the lower laminate 11, which is convenient for unloading the copper clad laminate.

[0042] In addition, the present invention also provides a processing method of a copper clad laminate forming processing device, which specifically comprises the following steps:

[0043] S1. Place the copper-clad laminate with each layer stacked on the lower laminate 11, push the lower pressing plate 32 downward through the hydraulic cylinder 31, and then push the elastic telescopic cylinder 411 and the upper laminate 511 downward through the lower pressing plate 32.

[0044] When the elastic telescopic cylinder 411 moves downward, it will push the lower pressing frame 412 and the lower pressing block 413 to move downward together, so that the lower pressing block 413 squeezes the pushing block 423 downward. When the pushing block 423 is squeezed by the lower pressing block 413, it will move toward the direction close to the lower laminate 11, and then push the smoothing plate 422 to move along the guide groove 4211 toward the direction close to the lower laminate 11, so that the smoothing plate 422 squeezes and corrects the copper clad laminate to avoid misalignment of the copper clad laminate.

[0045] Since the friction limit mechanism 53 clamps the secondary laminating mechanism 52, when the upper laminating plate 511 moves downward, it will drive the pre-stressing column 522 to move downward together, so that the pre-stressing plate 523 at the bottom of the pre-stressing column 522 will first pre-press the copper clad laminate. Through the pre-pressing, the air between the layers inside the copper clad laminate is discharged from the gap at the pressing point, avoiding the formation of bubbles in the copper clad laminate.

[0046] S2. Then, the hydraulic cylinder 31 continuously applies downward pressure to the upper laminate 511. When the downward pressure generated by the upper laminate 511 is greater than the maximum static friction between the friction block 532 and the pre-pressure column 522, the friction block 532 and the pre-pressure column 522 slide, thereby causing the upper laminate 511 to move downward. During the downward movement of the upper laminate 511, the pre-pressure plate 523 applies pressure to the copper clad laminate at a constant pressure, and then the upper laminate 511 is pressed against the surface of the copper clad laminate for lamination. During the lamination process, the electric heating tube 8 heats the copper clad laminate at a high temperature, so that the adhesive layer inside the copper clad laminate can quickly melt into a fluid state and quickly fill between the copper foil layer and the substrate layer of the copper clad laminate, thereby performing rapid lamination preparation.

[0047] S3. After lamination is completed, the hydraulic cylinder 31 drives the lower pressure plate 32 to move upward, so that the first-level lamination mechanism 51 and the lower pressure drive assembly 41 move upward and reset. In the process of the elastic telescopic cylinder 411 driving the lower pressure frame 412 and the lower pressure block 413 to move upward, the reset spring 424 pushes the pushing block 423 to move away from the lower laminating plate 11. At this time, the leveling plate 422 moves along the guide groove 4211 in the direction away from the lower laminating plate 11, so that the leveling plate 422 can be retracted into the inside of the support platform 1.

[0048] When the primary laminating mechanism 51 moves upward, it will drive the secondary laminating mechanism 52 away from the copper clad laminate. When the primary laminating mechanism 51 moves up to the reset push rod 6, the bottom end of the reset push rod 6 passes through the through hole inside the lower pressure plate 32 and presses the movable plate 521 downward, so that the secondary laminating mechanism 52 no longer moves up with the primary laminating mechanism 51 until the movable plate 521 fits with the bottom wall of the inner cavity of the upper laminating plate 511. At this time, the hydraulic cylinder 31 no longer drives the secondary laminating mechanism 52 to move upward.

[0049] S4. Finally, the conveying assembly 72 drives the sliding block 711 to move to the right, so that the sliding block 711 drives the copper clad laminate to move to the outside of the lower laminate 11, and then the existing robot arm moves the copper clad laminate on the upper end of the sliding block 711 horizontally to remove it. After that, the conveying assembly 72 drives the sliding block 711 to move to the left, so that the sliding block 711 returns to the inside of the lower laminate 11. After cooling and fixing, the processing is completed and the next processing can be carried out.

[0050] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "connect", "install", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, an integral connection, or a sliding connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0051] The embodiments of this specific implementation method are all preferred embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Therefore, all equivalent changes made based on the structure, shape, and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A copper-clad laminate forming device, comprising a support platform (1) with a hollow structure, characterized in that: The top of the support platform (1) is fixedly connected to a lower laminate (11), and a gantry (2) is fixedly installed on the top of the support platform (1) and spans the front and rear sides of the lower laminate (11). The bottom of the gantry (2) is installed with a hydraulic mechanism (3) located above the support platform (1), and the bottom of the hydraulic mechanism (3) is installed with a correction mechanism (4) located on the side of the lower laminate (11) and a multi-level lamination mechanism (5) located on the top of the lower laminate (11). The bottom of the gantry (2) is also installed with a reset push rod (6) that cooperates with the multi-level lamination mechanism (5), and the interior of the lower laminate (11) is installed with a conveying mechanism (7) for horizontally conveying the copper-clad laminate; The correction mechanism (4) comprises a downward pressing driving component (41) and a plurality of clamping and leveling components (42), wherein the clamping and leveling components (42) are installed inside the support platform (1), and the downward pressing driving component (41) is installed at the bottom of the hydraulic mechanism (3) and drives the clamping and leveling components (42) to clamp and level the copper clad laminate inwardly as the hydraulic mechanism (3) moves downward; The multi-stage laminating mechanism (5) comprises a primary laminating mechanism (51) installed at the bottom of the hydraulic mechanism (3) for laminating the copper-clad laminates, a secondary laminating mechanism (52) for multi-point pre-pressing the copper-clad laminates is slidably installed at the bottom of the primary laminating mechanism (51), a friction limiting mechanism (53) for clamping and limiting the secondary laminating mechanism (52) is installed inside the primary laminating mechanism (51), and electric heating tubes (8) are arranged inside the lower laminating plate (11) and the primary laminating mechanism (51).

2. The forming and processing device of a copper clad laminate according to claim 1, characterized in that: The hydraulic mechanism (3) comprises a plurality of hydraulic cylinders (31) fixedly mounted on the bottom of the gantry (2); the bottom ends of the output shafts of the plurality of hydraulic cylinders (31) are fixedly connected to a lower pressure plate (32); the hydraulic cylinders (31) are arranged in a row on the top of the lower pressure plate (32); and a through hole matching the reset push rod (6) is provided on the top of the lower pressure plate (32).

3. The forming and processing device of a copper clad laminate according to claim 2, characterized in that: The downward pressing driving assembly (41) comprises an elastic telescopic cylinder (411) fixedly connected to the bottom surface of the downward pressing plate (32); the bottom end of the elastic telescopic cylinder (411) penetrates into the interior of the support platform (1) and is fixedly connected to a downward pressing frame (412); the bottom surface of the downward pressing frame (412) is fixedly connected to a plurality of downward pressing blocks (413) corresponding one to one with the clamping and leveling assemblies (42); one end of the downward pressing block (413) close to the clamping and leveling assemblies (42) is arranged as a slope surface 1, and the height of the slope surface 1 gradually increases close to the end of the clamping and leveling assemblies (42).

4. The forming and processing device of a copper clad laminate according to claim 3, characterized in that: The clamping and leveling assembly (42) comprises a guide plate (421) fixedly connected to the top surface of the inner cavity of the support platform (1); a leveling plate (422) is slidably installed inside the guide plate (421); a pushing block (423) is slidably installed on the side of the leveling plate (422) away from the middle of the support platform (1); a side of the pushing block (423) close to the lower pressing block (413) is set as a slope surface 2 and matches the slope surface 1 of the lower pressing block (413); the bottom of the pushing block (423) is slidably installed on the bottom of the support platform (1); a return spring (424) is fixedly connected between the pushing block (423) and the inner wall of the support platform (1) to push the pushing block (423) to move in a direction close to the lower pressing block (413).

5. The forming and processing device of a copper clad laminate according to claim 4, characterized in that: A guide groove (4211) is provided inside the guide plate (421), and a guide block (4221) is fixedly connected to the side of the leveling plate (422). The guide block (4221) is slidably installed inside the guide groove (4211), and the height of the guide groove (4211) gradually increases at one end close to the lower laminate (11).

6. The forming and processing device of a copper clad laminate according to claim 2, characterized in that: The first-level laminating mechanism (51) includes an upper laminating plate (511) with a hollow structure, which is fixedly connected to the bottom of the lower pressing plate (32) and located directly above the lower laminating plate (11). The bottom of the upper laminating plate (511) is provided with alignment grooves (512) arranged in a row, and the electric heating tube (8) is installed in the bottom wall of the upper laminating plate (511).

7. The forming and processing device of a copper clad laminate according to claim 6, characterized in that: The secondary lamination mechanism (52) includes a movable plate (521) slidably mounted inside the upper lamination plate (511), the bottom of the movable plate (521) is fixedly connected with pre-stressing columns (522) arranged in a row, the bottom end of the pre-stressing column (522) passes through the bottom wall of the upper lamination plate (511) and is fixedly connected with a pre-stressing plate (523), and the pre-stressing plate (523) matches the alignment groove (512).

8. The copper clad laminate forming device according to claim 7, characterized in that: The friction limiting mechanism (53) includes a limiting frame (531) fixedly installed inside the upper laminate (511), and the limiting frame (531) is internally slidably installed with a friction block (532) symmetrically distributed about the pre-stress column (522), and a compression spring (533) is fixedly connected between the friction block (532) and the limiting frame (531) to push the friction block (532) to move in a direction close to the pre-stress column (522).

9. The copper clad laminate forming device according to claim 1, characterized in that: The conveying mechanism (7) comprises a bearing assembly (71) slidably mounted inside the lower laminate (11) for horizontally conveying the copper-clad laminate; the bearing assembly (71) is symmetrically distributed front to back on the lower laminate (11); and a conveying assembly (72) for pushing the bearing assembly (71) to move horizontally is fixedly mounted inside the support platform (1).

10. A copper clad laminate forming device according to claim 9, characterized in that: The bearing assembly (71) includes a sliding block (711) slidably mounted inside the lower laminate (11), the top of the sliding block (711) is flush with the top of the lower laminate (11), and a plurality of equally spaced suction cups (712) are mounted on the top of the sliding block (711).

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