Plasma reactor for treating a workpiece with an array of plasma point sources - Patents.com

Abstract

To perform plasma processing on a workpiece such as a semiconductor wafer and to reduce the unevenness of the processing.SOLUTION: A plasma source consists of an array of plasma point sources which controls generation of charge particles and radicals spatially and temporally over a user defined region.SELECTED DRAWING: Figure 1A

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority to U.S. patent application Ser. No. 14 / 867,240, filed Sep. 28, 2015 by Kartik Ramaswamy et al. and entitled "A PLASMA REACTOR FOR PROCESSING A WORKPIECE WITH AN ARAY OF PLASMA POINT SURFACES." Background

[0002] (Technical field) FIELD OF THE DISCLOSURE This disclosure relates to plasma processing of workpieces, such as semiconductor wafers, and reducing processing non-uniformities.

[0003] (Background discussion) In conventional plasma processing, processed wafers can suffer from local non-uniformities due to different etching environments (e.g., non-uniform stress, non-uniform film composition (for deposition processes), non-uniform CD (critical dimension of structures)). This can be due to differences between incoming wafers or differences in processing chamber characteristics (e.g., in carousel-style processing chambers where rotating wafers see radial residence time differences or different local temperatures at the leading and trailing edges). Overview

[0004] The plasma reactor includes a processing chamber and a workpiece support within the processing chamber, the chamber including a lower ceiling facing the workpiece support, an upper ceiling above the lower ceiling and facing the lower ceiling, a gas distributor above the upper ceiling, and a plurality of cavity walls defining a plurality of cavities between the upper and lower ceilings, the gas distributor including a plurality of cavity walls including a plurality of gas flow paths to respective ones of the plurality of cavities, a plurality of exit holes in the lower ceiling aligned with respective ones of the plurality of cavities, a respective power applicator adjacent a respective one of the plurality of cavities, a power source, a plurality of power conductors coupled to respective ones of the power applicators, and a power distributor coupled between the power source and the plurality of power conductors.

[0005] In one embodiment, the plurality of cavity walls includes dielectric cavity walls.

[0006] In a further embodiment, the power source includes an RF power generator, and each one of the respective power applicators is separated by a corresponding one of the plurality of cavity walls from an interior of the corresponding one of the plurality of cavity walls.

[0007] In one embodiment, the power applicator includes electrodes for coupling RF power to a corresponding one of the multiple cavities, in this embodiment, each electrode surrounding a portion of a corresponding one of the multiple cavities.

[0008] In another embodiment, the power applicator includes a coil antenna for inductively coupling RF power to the corresponding one of the multiple cavities. In this embodiment, the coil antenna can include a conductor helically wound around a portion of the corresponding one of the multiple cavities.

[0009] In yet another embodiment, the power source is a DC power generator, each one of the power applicators includes an electrode for DC discharge, and each one of the dielectric cavity walls is configured to expose a corresponding electrode within a corresponding one of the multiple cavities.

[0010] In one embodiment, the power splitter includes a plurality of switches coupled between the output of the power generator and a respective one of the power conductors.

[0011] In one embodiment, the plasma reactor further includes a processor that individually controls the multiple switches in response to user defined instructions.

[0012] In one embodiment, the plasma reactor includes a process gas source and a gas distributor including a plurality of valves coupled between the process gas source and a respective one of the plurality of cavities. The process gas source can include a plurality of gas sources of different gas species, and a respective one of the plurality of valves is coupled between a respective one of the plurality of gas sources and a respective one of the plurality of cavities. In one embodiment, the plasma reactor includes a processor that individually controls the plurality of valves in response to user-defined instructions.

[0013] In one embodiment, the plasma reactor further includes a remote plasma source coupled to deliver plasma by-products to the multiple cavities.

[0014] In one embodiment, the processing chamber further includes a cylindrical sidewall, and the reactor further includes an inductively coupled plasma source including a coil antenna wrapped around the cylindrical sidewall, and an RF power generator coupled to the coil antenna through an impedance matcher.

[0015] In one embodiment, a plasma reactor includes a processing chamber and a workpiece support within the processing chamber, a gas distributor above the workpiece support, and a plurality of cavity walls defining a plurality of cavities below the gas distributor, the plurality of cavity walls including a plurality of gas flow paths to a respective one of the plurality of cavities, a respective power applicator adjacent a respective one of the plurality of cavities, a power source, a plurality of power conductors coupled to a respective one of the power applicators, a power distributor coupled between the power source and the plurality of power conductors, a process gas source, and the gas distributor including a plurality of valves coupled between the process gas source and each one of the plurality of cavities.

[0016] In a further embodiment, a method for processing a workpiece in a plasma reactor including an array of plasma point sources distributed over a surface of the workpiece includes performing a plasma process on the workpiece, observing a non-uniformity in the spatial distribution of the process rate across the surface of the workpiece, and reducing the non-uniformity by performing at least one of the following steps: (a) adjusting the distribution of plasma source power levels among the array of plasma point sources; or (b) adjusting the distribution of gas flow among the array of plasma point sources. [Brief description of the drawings]

[0017] So that a detailed understanding can be had of the manner in which exemplary embodiments of the invention are accomplished, a more particular description of the invention briefly summarized above can be rendered by reference to embodiments thereof, which are illustrated in the accompanying drawings, and it should be understood that certain well-known processes have not been described herein in order not to obscure the invention. [Figure 1A] FIG. 1 is a simplified schematic of a first embodiment having an array of plasma point sources. [Figure 1B] FIG. 1B is an enlarged plan view of a plasma point source in the embodiment of FIG. 1A. [Figure 2A] ~ [Figure 2B] 1 shows different configurations of an array of plasma point sources. [Diagram 3] 1 illustrates an embodiment in which the plasma point source uses a plasma DC discharge. [Figure 4] 1 illustrates an embodiment in which the plasma point source uses inductive coupling. [Diagram 5] 1B illustrates a variation of the embodiment of FIG. 1A using a remote plasma source. [Figure 6] 5 shows a variation of the embodiment of FIG. 4 using a remote plasma source. [Figure 7] 1B shows a variation of the embodiment of FIG. 1A having a chamber-wide inductively coupled source in addition to an array of plasma point sources.

[0018] To facilitate understanding, the same reference numbers have been used, whenever possible, to designate identical elements common to the figures. It will be understood that elements and features of one embodiment may be beneficially incorporated in other embodiments without further description. It should be noted, however, that the appended drawings depict only illustrative embodiments of the invention and are therefore not to be construed as limiting the scope thereof, as the invention may include other equally effective embodiments. DETAILED DESCRIPTION

[0019] (Introduction) The plasma source consists of multiple independently controlled local plasma point sources or an array of local plasma point sources, which allows spatial and temporal control of charged particle species (electrons, negative and positive ions) over a user-defined area.

[0020] The use of plasma sources that allow spatial and temporal control allows for the correction of local non-uniformities. This can be achieved by switching on or off the plasma generation at different plasma point sources where charged particles and radicals are generated. Alternatively or additionally, this can be achieved by varying the flow of process gases to the different plasma point sources. For example, gas flows can be switched on or off and / or the gas mixture for each plasma point source can be changed. The user can select the gases that are ionized or decomposed at the local plasma point sources. The user can also select the time or duration of the discharge.

[0021] The local discharge chemistry can be changed by manipulating different gas chemistries in parallel in different simultaneous local gas discharges (spatial control) or by varying the gas chemistry locally in the same local discharge.

[0022] The entire workpiece (wafer) is subjected to a constant negative DC bias, but ions can be attracted locally to be implanted, or etched or deposited.

[0023] An array of plasma point sources can be combined with conventional non-localized plasma sources (eg, capacitively coupled large electrode plasma sources or inductively coupled plasma sources) to correct local non-uniformities in plasma generation in real time.

[0024] An array of plasma point sources can be combined with a remote plasma source (e.g., a remote radical source). The radical treatment step can be followed by a plasma treatment step that can change the composition and local residence time. Past solutions have focused on local changes in temperature by changing the current through a local heating element in the substrate holder. The embodiments described herein add to existing solutions to enable local chemical and affect the generation of charged particles and radicals rather than relying solely on temperature to speed up reactions.

[0025] (Embodiment) 1A and 1B show an embodiment having multiple plasma point sources 90 capacitively coupled using RF frequencies. The point sources 90 can be arranged in various configurations, such as circular (FIG. 2A) or pie-shaped (FIG. 2B). The embodiment of FIG. 1A includes a process chamber body 100 having a process zone 92 bounded by a cylindrical sidewall 102, a lower ceiling 104, and a floor 106. A workpiece support 94 supports a workpiece 96 within the process zone 92. A vacuum pump 108 can be coupled to the process zone 92 via the floor 106. An upper ceiling 110 supported on an upper cylindrical sidewall 126 overlies the lower ceiling 104 and supports a gas distributor 112. The lower ceiling 104 includes an array of gas outlet holes 114. 1A embodiment, the point source 90 is an array of cylindrical cavities 115 surrounded by dielectric cylindrical cavity walls 116, each parallel to the axis of symmetry of the cylindrical side wall 102 and aligned with the dielectric of a respective one of the gas exit holes 114. The cylindrical cavity walls 116 are surrounded by respective cylindrical electrodes 118.

[0026] Each plasma point source 90 is localized in which the area of ​​each gas outlet hole 114 is small relative to the area of ​​the lower ceiling 104 or upper ceiling 110, or relative to the diameter of the chamber body 100. In one embodiment, the area of ​​each gas outlet hole 114 does not exceed 5% of the area of ​​the lower ceiling 104 or upper ceiling 110, or the area of ​​the chamber body 100.

[0027] In the embodiment shown in Figures 1A and 1B, the shape of each gas outlet opening 114 is circular and matches the shape of the cylindrical cavity 115. However, in other embodiments, each gas outlet hole 114 may be any shape and may not match the shape of the cylindrical cavity 115. For example, each gas outlet hole 114 may be non-circular (e.g., elliptical), may be polygonal or linear slot shaped, or some combination of these shapes. If the shape of the gas outlet hole 114 does not match the cylindrical cavity 115, an adapter (not shown) may be introduced to provide a gas seal between the gas outlet hole 114 and the cylindrical cavity 115 in one embodiment.

[0028] The upper ceiling 110 has an array of gas inlets 119, each aligned with a respective one of the cylindrical cavities 115. The gas distributor 112 supplies process gases into the cylindrical cavities 115 through the gas inlets 119. Individual power conductors 120 convey power to individual ones of the respective cylindrical electrodes 118. The power distributor 122 distributes power to the power conductors 120 from a power source 124. In one embodiment, the power source 124 is an alternating current (AC) power generator or a radio frequency (RF) power generator with an RF impedance matcher. In a related embodiment, the frequency of the power source 124 may be anywhere from DC to UHF, for example. In one embodiment, a plasma is generated in the cylindrical cavity 115 by capacitive coupling of RF power from the cylindrical electrodes 118 through the dielectric cylindrical cavity wall 116 into the cylindrical cavity 115. The lower ceiling 104 separates the cylindrical electrodes 118 from the plasma.

[0029] The gas distributor 112 receives different gas species from multiple gas sources 250 and distributes different gas mixtures to each one of the cylindrical cavities 115 through respective gas inlets 119 according to different user-specified gas recipes for the different cylindrical cavities 115. For example, the gas distributor 112 may include an array of gas valves 252 individually controlled by a processor 254 according to user-defined instructions that define the gas mixture for each individual cylindrical cavity 115. The array of gas valves 252 is coupled between the multiple gas sources 250 and the gas inlets 119 to the cylindrical cavities 115.

[0030] The power distributor 122, in one embodiment, individually controls the power provided to each power conductor 120. For example, the power distributor 122 may include an array of electrical switches 262 that are individually controlled by the processor 254 in response to user-defined instructions. The power may be controlled by pulse width modulation, where the user-defined instructions may define the on / off duration (or duty cycle) of the power to the individual cylindrical cavities 115. The array of electrical switches 262 is coupled between the power source 124 and the power conductors 120.

[0031] In a first embodiment, the lower ceiling 104 is formed of a dielectric material, while the upper ceiling 110 is formed of a conductive material. In a second embodiment, the lower ceiling 104 is adjacent to a lower plate 190 formed of a conductive material, and both the lower plate 190 and the upper ceiling 110 are grounded. Thus, the plasma source is located between the two grounded plates, i.e., the lower plate 190 and the upper ceiling 110.

[0032] 3 illustrates an embodiment in which the plasma is generated by a DC discharge, and the power supply 124 is a DC power generator. Each of the dielectric cylindrical cavity walls 116 terminates above a corresponding one of the cylindrical electrodes 118. This configuration allows each cylindrical electrode 118 to be directly exposed to the plasma, which can facilitate a DC discharge.

[0033] Figure 4 shows a variation of the embodiment of Figure 1A, in which the cylindrical electrode 118 is replaced by an individual induction coil 210, thereby generating an inductively coupled plasma in each cylindrical cavity 115. Each induction coil 210 is wrapped around the bottom of a corresponding cylindrical dielectric wall 116, as shown in Figure 4. In the embodiment of Figure 4, a changing magnetic field generates a changing electric field in the cylindrical cavity 115, which in turn generates a closed, single-turn, oscillating plasma current.

[0034] FIG. 5 shows another variation of the embodiment of FIG. 1A, including a remote plasma source 220 and a radical distribution plate 280. The radical distribution plate 280 directs radicals from the remote plasma source 220 into the individual cylindrical cavities 115. The remote plasma source 220 can include a plasma source power applicator 222 driven by a power source 224. The remote plasma source 220 can further include a controlled gas source 226 containing precursors of the desired radical species. There are some processes in which remotely generated chemically active radicals play an important role in the processing of the wafer. However, it may be necessary to follow the radical process with a plasma processing step. Having a spatially and temporally controllable plasma source helps to address the non-uniformity of radicals. In the case of short-lived radicals (which recombine to become inactive neutrals), having a controllable plasma density can help to regenerate the important radicals.

[0035] Figure 6 shows a variation of the embodiment of Figure 4 including a remote plasma source 220 and a radical distribution plate 280. In the embodiment of Figure 6, the remote plasma source 220 is combined with the inductively coupled plasma source of Figure 4 (i.e., the inductively coupled coil 210). The inductively coupled plasma source (coil 210) allows operation in a different (lower) pressure regime (e.g., below 25 mTorr) compared to the capacitively coupled plasma source of the embodiment of Figure 1.

[0036] FIG. 7 shows a variation of the embodiment of FIG. 1A in which the array of plasma point sources 90 is combined with a larger non-local inductively coupled plasma source. The non-local inductively coupled plasma source of FIG. 7 includes a helically wound coil antenna 240 that surrounds the cylindrical sidewall 102. The helically wound coil antenna 240 is driven by an RF power generator 242 through an RF impedance matcher 244. In the embodiment of FIG. 7, the cylindrical sidewall 102 is formed from a non-metallic material, which allows for inductive coupling of RF power through the cylindrical sidewall 102. A bottom plate 190 shields the individual plasma point sources (corresponding to the individual cylindrical cavities 115) from the larger inductively coupled plasma source (corresponding to the helically wound coil antenna 240).

[0037] Each plasma point source 90 (corresponding to each cylindrical cavity 115) is individually controllable. This allows for spatial and temporal control of the plasma distribution. Such control can be implemented to reduce non-uniformity in the plasma distribution.

[0038] (Control Mode) The power supply 124 can supply power to each plasma point source 90 in different modes. In a first mode, each plasma point source 90 consumes a fixed amount of power, and the control system switches the power supplied to the plasma point source on or off using an array of electrical switches 262. In one example, each point source consumes a fixed amount of about 3 watts when it is on. The array of electrical switches 262 essentially applies power to the individual plasma point sources 90 on command. The plasma density is a function of how many plasma point sources 90 are turned on. Thus, the net power delivered to each plasma point source 90 can be controlled by varying the pulse width.

[0039] In the second mode, what is controlled is the level of power delivered to each plasma point source 90. Also, the gas composition to individual plasma point sources 90 (or groups of plasma point sources 90) can be varied by the gas distributor 112. In this way, different plasma point sources 90 do not need to have the same gas discharge composition. Each plasma point source 90 has a fixed address. The power and / or gas flow to each plasma point source 90 can be targeted to be turned on or off individually.

[0040] According to one method, the spatial distribution of the process rate across the surface of the workpiece is measured. Non-uniformity in the process rate distribution is compensated for by establishing a spatial distribution of the ON / OFF duty cycle of the power supplied to the array of plasma point sources 90 that is effectively the inverse of the measured process rate spatial distribution. In other words, the distribution of the ON / OFF power duty cycle has maxima where the measured process rate distribution has minima and has minima where the measured process rate distribution has maxima.

[0041] According to another method, non-uniformity in the process rate distribution is compensated for by establishing a spatial distribution of the ON / OFF duty cycles of the process gas flows supplied to the array of plasma point sources 90 that is effectively the inverse of the measured process rate spatial distribution. In other words, the distribution of the ON / OFF gas flow duty cycles has maxima where the measured process rate distribution has minima and has minima where the measured process rate distribution has maxima.

[0042] (advantage) The main advantage is the complete spatial and temporal control of the generation of charged particles and high energy radicals, which allows spatial and temporal control over the local charged particle and high energy radical distribution.

[0043] While the forgoing is directed to embodiments of the present invention, other and further embodiments of the invention may be made without departing from the basic scope thereof, which is defined by the following claims.

Claims

1. 1. A plasma reactor comprising: A process chamber having a lower process section having an axis of symmetry and an array of cavities extending upwardly from the lower process section, Each cavity is elongated and extends parallel to an axis of symmetry of the lower treatment section; Each cavity is positioned outside each of the other cavities; a processing chamber, the array of cavities being an array of a plurality of independently controlled local plasma point sources, the plasma point sources being arranged in a plurality of concentric zones including an outer zone and an inner zone, the inner zone having fewer local plasma point sources than the outer zone; a workpiece support within a lower processing section of the processing chamber; A plurality of gas sources of different gas species; a plurality of gas inlets, each gas inlet opening into a respective cavity; A gas distributor coupling a plurality of gas sources to a plurality of gas inlets, comprising: the gas distributor comprises a plurality of valves having a respective valve for each gas inlet; Each valve includes a gas distributor selectively connecting a respective gas inlet to one of a plurality of gas sources; Power supply, an array of conductors with a respective conductor for each cavity, an array of conductors, each conductor adjacent to and surrounding a respective single cavity in the array of cavities; a power splitter coupled between a power source and an array of conductors, The power divider comprises a plurality of switches coupled between an output of the power supply and the array of conductors; a power divider, the plurality of switches including a switch for each conductor; a processor for individually controlling a plurality of valves and individually controlling a plurality of switches in accordance with user-defined instructions to provide independent control of gas species and plasma generation in each of a plurality of cavities extending upwardly from a lower processing section of the processing chamber; A plasma reactor, wherein the processor controls the gas flow and power ON / OFF duty cycles provided to the array of conductors, and the distribution of the power ON / OFF duty cycles and the distribution of the gas flow ON / OFF duty cycles have maxima where the process rate distribution has minima and have minima where the process rate distribution has maxima.

2. 10. The plasma reactor of claim 1 wherein the processing chamber comprises a plurality of dielectric cavity walls defining an array of cavities extending upwardly from a lower processing section.

3. 3. The plasma reactor of claim 2 wherein the power supply comprises an RF power generator, each conductor being separated from the interior of a corresponding respective cavity by a corresponding respective one of the dielectric cavity walls.

4. 4. The plasma reactor of claim 3 wherein the array of conductors is an array of electrodes for capacitively coupling RF power to the array of cavities.

5. 5. The plasma reactor of claim 4 wherein each electrode of the array of electrodes forms a cylinder having an axis parallel to the axis of symmetry and surrounding a respective cavity.

6. 4. The plasma reactor of claim 3 wherein the array of conductors is an array of coil antennas for inductively coupling RF power to the array of cavities.

7. 7. The plasma reactor of claim 6 wherein each coil antenna of the array of coil antennas forms a coil wound in the shape of a cylinder having an axis parallel to the axis of symmetry.

8. the processing chamber includes a plurality of conductive cavity walls defining a portion of an array of cavities extending upwardly from a lower processing section; 10. The plasma reactor of claim 1 wherein the conductive cavity walls provide an array of conductors.

9. The power source is a DC power generator, 9. The plasma reactor of claim 8 wherein each conductor of the array of conductors is an electrode for a DC discharge.

10. 9. The plasma reactor of claim 8 wherein the processing chamber comprises a plurality of dielectric cavity walls, the dielectric cavity walls being disposed above and below the conductive cavity walls.

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