Imprinting apparatus and method for manufacturing article

Abstract

To provide a technique advantageous in accurately forming an imprint material on a substrate.SOLUTION: An imprint apparatus is configured to perform processing of forming an imprint material on a substrate using a mold, with respect to each of a plurality of shot regions on the substrate. The imprint apparatus includes: a detector configured to detect positions of marks provided on the substrate; and a controller configured to control, in the processing, alignment between the substrate and the mold on the basis of a detection result by the detector. Each of the plurality of shot regions is set to include two or more transfer regions where a pattern of an original has been individually transferred in a pre-process. In the processing on a specific shot region where the two or more transfer regions have different sizes, the controller controls the alignment based on the detection result of the marks provided in the transfer region other than the smallest transfer region among the two or more transfer regions.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an imprint apparatus and a method for manufacturing an article. [Background technology]

[0002] Imprint technology is a technology that enables the transfer of nanoscale fine patterns, and has been proposed as one of the nanolithography techniques for mass production of semiconductor devices, magnetic storage media, etc. An imprint device using imprint technology can form a pattern on a substrate by contacting a mold on which a pattern has been formed with an imprint material on a substrate, curing the imprint material, and then detaching the mold from the cured imprint material.

[0003] In recent years, in order to improve the productivity (throughput) of imprinting apparatuses, the so-called multi-area imprinting technology has been developed, which performs imprinting simultaneously on two or more transfer areas to which a pattern of an original has been transferred individually in a previous process. Patent Document 1 proposes a method of performing multi-area imprinting in the center of a substrate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2017-199760 A Summary of the Invention [Problem to be solved by the invention]

[0005] In imprinting apparatuses, from the standpoint of improving semiconductor chip yields and protecting the substrate during subsequent etching processes, it is necessary to precisely shape the imprinting material not only in the center of the substrate but also in the peripheral portion of the substrate.

[0006] Therefore, an object of the present invention is to provide an advantageous technique for forming an imprint material on a substrate with high precision. [Means for solving the problem]

[0007] In order to achieve the above object, an imprinting apparatus according to one aspect of the present invention is an imprinting apparatus that performs a process of forming an imprinting material on a substrate using a mold for each of a plurality of shot areas on the substrate, and includes a detection unit that detects a position of a mark provided on the substrate, and a control unit that controls alignment of the substrate and the mold based on a detection result by the detection unit during the process; The substrate The pattern of the master was transferred individually in the previous process. multiple Transcription region of and a non-transfer area to which the pattern of the original was not transferred in the previous process. , the mold is configured to be capable of collectively molding the imprint material on at least two of the plurality of transfer regions, the at least two transfer regions being regarded as one shot region; The control unit is A layout of the plurality of shot areas on the substrate is determined so that either a first condition that one shot area includes two or more transfer areas or a second condition that one shot area includes the non-transfer area and one or more transfer areas is satisfied, and the sizes of the plurality of shot areas are different from each other. Two or more transcription regions have In the processing of the specific shot area, Included in the specific shot area The alignment is controlled using the detection result of the marks provided in the transfer area other than the smallest transfer area among the two or more transfer areas.

[0008] Further objects and other aspects of the present invention will become apparent from the following description of preferred embodiments with reference to the accompanying drawings. Effect of the Invention

[0009] According to the present invention, for example, it is possible to provide an advantageous technique for forming an imprint material on a substrate with high precision. [Brief description of the drawings]

[0010] [Figure 1] 1 is a schematic diagram illustrating an example of the configuration of an imprint apparatus; [Diagram 2] Diagram showing mold side marks and substrate side marks [Diagram 3] FIG. 1 is a diagram for explaining an imprint process; [Figure 4]FIG. 1 is a diagram showing an example of an arrangement of a plurality of transfer regions on a substrate; [Diagram 5] FIG. 1 shows a conventional example of a layout of multiple shot areas. [Figure 6] FIG. 1 is a diagram for explaining a contact process between a mold and a resin on a substrate. [Figure 7] FIG. 1 is a diagram showing an example of the layout of a plurality of shot regions in the first embodiment; [Figure 8] FIG. 13 is a diagram showing an example of the layout of a plurality of shot regions in the second embodiment; [Figure 9] FIG. 13 is a diagram showing an example of the layout of a plurality of shot regions in the third embodiment; [Figure 10] FIG. 1 is a diagram for explaining a method for manufacturing an article. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0012] An imprinting device is a device that brings an imprinting material supplied on a substrate into contact with a mold and applies energy for hardening to the imprinting material, thereby forming a pattern of a cured product to which the concave-convex pattern of the mold has been transferred. For example, an imprinting device supplies a liquid imprinting material onto a substrate, and hardens the imprinting material while a mold (mold) on which a concave-convex pattern has been formed is brought into contact with the imprinting material on the substrate. Then, the mold pattern can be transferred to the imprinting material on the substrate by widening the gap between the mold and the substrate and peeling (releasing) the mold from the hardened imprinting material. This series of processes is called an "imprinting process" and is performed for each of a plurality of shot regions on the substrate.

[0013] The imprint material uses a curable composition (sometimes called an uncured resin) that is cured by applying energy for curing. Electromagnetic waves, heat, and the like are used as the energy for curing. The electromagnetic waves are, for example, light such as infrared rays, visible light, and ultraviolet rays, whose wavelengths are selected from the range of 10 nm to 1 mm. The curable composition is a composition that is cured by irradiation with light or by heating. Among them, the photocurable composition that is cured by light contains at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal mold release agent, a surfactant, an antioxidant, and a polymer component. The imprint material is applied in the form of a film on the substrate by a spin coater or a slit coater. Alternatively, the imprint material may be applied on the substrate in the form of droplets, or in the form of islands or films formed by connecting a plurality of droplets, by a liquid ejection head. The viscosity of the imprint material (at 25° C.) is, for example, not less than 1 mPa·s and not more than 100 mPa·s.

[0014] First Embodiment A first embodiment of the present invention will be described. Fig. 1 is a schematic diagram showing an example of the configuration of an imprinting apparatus 1 of this embodiment. The imprinting apparatus 1 performs an imprinting process in which an imprinting material on a substrate is formed using a mold, cured, and the mold is separated (released) from the cured imprinting material to form a pattern on the substrate. In this embodiment, a resin is used as the imprinting material, and a photocuring method is adopted as the resin curing method, in which the resin is cured by irradiation with ultraviolet light.

[0015] The imprint apparatus 1 has a mold holding unit 12 that holds the mold 11, a substrate holding unit 14 that holds the substrate 13, a detection unit 15, a curing unit 25, an observation unit 23, and a control unit CNT. The imprint apparatus 1 may also have a resin supply unit including a dispenser for supplying resin onto the substrate, a shape deformation mechanism for applying force to the side surface of the mold 11 to deform the pattern region 11a of the mold 11, and the like. The imprint apparatus 1 may also have a bridge surface plate for holding the mold holding unit 12, a base surface plate for holding the substrate holding unit 14, and the like.

[0016] Mold 11 has a pattern region 11a (pattern surface) in which a pattern (concave-convex pattern) to be transferred to (the resin on) substrate 13 is formed. Mold 11 can be made of a material that transmits ultraviolet light for hardening the resin on the substrate, such as quartz. In addition, in pattern region 11a of mold 11, alignment marks (mold-side marks 18) used for controlling the alignment between mold 11 and substrate 13 are formed.

[0017] The mold holding unit 12 is a holding mechanism that holds the mold 11. The mold holding unit 12 includes, for example, a mold chuck that vacuum- or electrostatically adsorbs the mold 11, a mold stage on which the mold chuck is placed, and a drive system that drives (moves) the mold stage. The drive system drives the mold stage (i.e., the mold 11) at least in the Z-axis direction (the imprinting direction when the mold 11 is imprinted on the resin on the substrate). The drive system may also have a function of driving the mold stage not only in the Z-axis direction, but also in the X-axis direction, Y-axis direction, and θ direction (rotation direction around the Z-axis).

[0018] The substrate 13 is a substrate onto which the pattern of the mold 11 is transferred (i.e., a substrate on which a pattern made of resin is formed). Examples of materials that can be used for the substrate 13 include glass, ceramics, metals, semiconductors, and resins. If necessary, a member made of a material different from that of the substrate 13 may be provided on the surface of the substrate 13. The substrate 13 is, for example, a silicon wafer, a compound semiconductor wafer, or quartz glass. The substrate 13 may also be, for example, an SOI (Silicon on Insulator) substrate. Resin is supplied (applied) to the substrate 13 from a resin supply unit. An alignment mark (substrate side mark 19) used for controlling the alignment between the mold 11 and the substrate 13 is formed on the substrate 13.

[0019] The substrate holding unit 14 is a holding mechanism that holds the substrate 13. The substrate holding unit 14 includes, for example, a substrate chuck that vacuum- or electrostatically adsorbs the substrate 13, a substrate stage on which the substrate chuck is placed, and a drive system that drives (moves) the substrate stage. The drive system drives the substrate stage (i.e., the substrate 13) at least in the X-axis direction and the Y-axis direction (directions perpendicular to the imprinting direction of the mold 11). The drive system may also have a function of driving the substrate stage not only in the X-axis direction and the Y-axis direction, but also in the Z-axis direction and the θ direction (rotation direction around the Z axis).

[0020] The detection unit 15 can detect the position of an alignment mark (substrate-side mark 19) provided on the substrate 13. In the present embodiment, the detection unit 15 includes a scope for optically observing the substrate-side mark 19 through the mold 11 (mold-side mark 18), and detects the relative position between the mold-side mark 18 and the substrate-side mark 19 corresponding thereto. For example, the detection unit 15 can measure the relative position between the mold 11 (pattern region 11a) and the substrate (shot region) based on the relative position between the mold-side mark 18 and the substrate-side mark 19 detected by the scope. Here, the detection unit 15 only needs to be able to detect the relative positional relationship between the mold-side mark 18 and the substrate-side mark 19. Therefore, the detection unit 15 may include a scope equipped with an optical system for simultaneously imaging the two marks, or may include a scope for detecting a signal reflecting the relative positional relationship, such as an interference signal or moire, between the two marks. The detection unit 15 may not be able to simultaneously detect the mold-side mark 18 and the substrate-side mark 19. For example, the detection unit 15 may detect the relative positional relationship between the mold-side mark 18 and the substrate-side mark 19 by determining the respective positions of the mold-side mark 18 and the substrate-side mark 19 relative to a reference position arranged inside.

[0021] The curing unit 25 irradiates the resin on the substrate with light 22 (e.g., ultraviolet light) for curing the resin through the mold 11, thereby curing the resin. The curing unit 25 may include, for example, a light source that emits light 22 for curing the resin, and an optical system that adjusts the light 22 emitted from the light source to optimal light for the imprint process. The imprint apparatus 1 of this embodiment may be configured such that the light 22 emitted from the curing unit 25 is reflected by the beam splitter 24 and irradiated onto the substrate 13 (specifically, the resin on the substrate).

[0022] The observation unit 23 includes, for example, a camera having a field of view that can accommodate the entire pattern region 11a of the mold 11, and has a function of observing (checking) the cured state of the resin on the substrate due to irradiation with ultraviolet light. Furthermore, the observation unit 23 can observe not only the cured state of the resin on the substrate, but also the state of the mold 11 imprinting the resin on the substrate, the state of the resin filling the pattern of the mold 11, and the state of the mold 11 being released from the cured resin on the substrate. The imprint apparatus 1 of this embodiment can be configured such that the observation unit 23 observes the cured state of the resin on the substrate via the beam splitter 24.

[0023] The control unit CNT includes, for example, a CPU, a memory, etc., and controls the imprint process and processes related thereto by controlling each unit of the imprint apparatus 1. For example, the control unit CNT can control the alignment of the mold 11 and the substrate 13 based on the detection result of the detection unit 15 (i.e., the detection result of the relative position between the mold-side mark 18 and the substrate-side mark 19). Furthermore, in the alignment of the imprint process, the control unit CNT may control a process of deforming the pattern region 11a of the mold 11 into a target shape by the shape correction unit (shape correction of the mold 11).

[0024] 2(a)-(b), a description will be given of a mold-side mark 18 and a substrate-side mark 19 serving as alignment marks used in aligning the mold 11 and the substrate 13. In the example shown in Figs. 2(a)-(b), six chip areas are arranged in one shot area of ​​the substrate 13.

[0025] FIG. 2(a) shows an example of the arrangement of the pattern region 11a of the mold 11, specifically, the mold side marks 18a to 18h provided at the four corners of the pattern region 11a. Referring to FIG. 2(a), the mold side marks 18a, 18b, 18e, and 18f having a longitudinal direction in the horizontal direction are marks having a measurement direction in the X-axis direction. Moreover, the mold side marks 18c, 18d, 18g, and 18h ​​having a longitudinal direction in the vertical direction are marks having a measurement direction in the Y-axis direction. Moreover, in FIG. 2(a), the region surrounded by the dotted line represents a pattern to be transferred to each of the six chip regions on the substrate. Moreover, in the mold 11 of this embodiment, as described later, the pattern region 11a is formed so as to mold the resin on two or more transfer regions on the substrate 13 at once (i.e., to form a pattern in the resin on the two or more transfer regions at once).

[0026] FIG. 2(b) shows the periphery of one shot area 13a of the substrate 13, specifically, the substrate side marks 19a to 19h provided at the four corners of the shot area 13a. Referring to FIG. 2(b), the substrate side marks 19a, 19b, 19e, and 19f having a longitudinal direction in the horizontal direction are marks having a measurement direction in the X-axis direction. Moreover, the substrate side marks 19c, 19d, 19g, and 19h having a longitudinal direction in the vertical direction are marks having a measurement direction in the Y-axis direction. Moreover, in FIG. 2(b), the area surrounded by a solid line inside the shot area 13a indicates the chip area 13b. Each chip area 13b is, for example, an area from which one semiconductor chip on which an integrated circuit is formed is obtained.

[0027] In the imprint process, when the mold 11 is brought into contact with the resin on the substrate, each of the mold-side marks 18a to 18h provided on the mold 11 and each of the substrate-side marks 19b to 19h provided on the substrate 13 come close to each other. Therefore, by detecting the mold-side marks 18 and the substrate-side marks 19 by the detection unit 15, it is possible to compare the position and shape of the pattern region 11a of the mold 11 with the position and shape of the shot region 13a of the substrate 13. If a difference (deviation) occurs between the position and shape of the pattern region 11a of the mold 11 and the position and shape of the shot region 13a on the substrate 13, the overlay accuracy decreases, resulting in poor transfer of the pattern (product defect).

[0028] Next, with reference to FIGS. 3(a) to 3(c), an imprint process for transferring the pattern of the mold 11 to the substrate 13 (specifically, the resin on the substrate), that is, for molding the resin on the substrate, will be described.

[0029] As shown in FIG. 3(a), before starting to imprint the mold 11, resin 20 is supplied to a target shot area on the substrate (a shot area to be subjected to the imprint process). Resins generally used in imprint devices are highly volatile, so they should be supplied onto the substrate immediately before the imprint process. However, if the resin is low in volatility, the resin may be supplied onto the substrate in advance using a spin cord or the like. After supplying the resin 20 onto the substrate, the substrate 13 is moved below the mold 11. Then, the detection unit 15 is caused to detect the relative positions of the mold side mark 18 and the substrate side mark 19, and the alignment between the mold 11 and the substrate 13 and the shape correction of the mold 11 are controlled based on the detection result.

[0030] Next, as shown in FIG. 3(b), the mold 11 is brought into contact with the resin 20 on the substrate, and a predetermined time is allowed to pass in this state to fill the pattern of the mold 11 with the resin 20. During this time, the mold-side mark 18 and the substrate-side mark 19 may be detected by the detection unit 15, and the alignment between the mold 11 and the substrate 13 may be controlled based on the detection result. Here, when the difference in refractive index between the mold 11 and the resin 20 is small, if the mold-side mark 18 is composed only of a concave-convex structure, it may be difficult to detect the mold-side mark 18 with the detection unit 15. Therefore, it is preferable to apply a substance having a refractive index or transmittance different from that of the mold 11 to the mold-side mark 18, or to change the refractive index of the mold-side mark 18 by ion irradiation or the like. This makes it possible to detect the mold-side mark 18 with the detection unit 15 even in a state in which the mold 11 is in contact with the resin 20 on the substrate.

[0031] When the pattern of the mold 11 is filled with the resin 20 (for example, after a predetermined time has passed), the resin 20 on the substrate is irradiated with light 22 by the curing unit 25 to cure the resin 20. Then, as shown in Fig. 3(c), the mold 11 is separated (released) from the cured resin 20 on the substrate. This allows a pattern 21 made of the resin 20 to be formed on the substrate (i.e., the pattern of the mold 11 can be transferred onto the substrate).

[0032] [Multi-area imprint] In recent years, the development of a multi-area imprinting technique has been progressing for the imprinting apparatus 1. The multi-area imprinting technique is a technique for imprinting two or more transfer areas to which a pattern of an original is transferred individually in a previous process at once, and this technique can improve the productivity (throughput) of the imprinting apparatus 1. Here, the mold 11 used in the multi-area imprinting technique is configured so that the resin 20 on the two or more transfer areas can be molded collectively by one imprinting process, with the two or more transfer areas being one shot area (imprint area). For example, the pattern area 11a of the mold 11 has a pattern to be collectively transferred to the resin 20 on the two or more transfer areas by one imprinting process. Also, each transfer area is an area on the substrate to which a pattern formed on the original is individually transferred. Each transfer area can also be said to be an area to which a pattern of the original is transferred in one shot (for example, one transfer process) in the previous process. For example, when an exposure device is used in the previous process, the transfer area is an area on the substrate to which one pattern corresponding to the pattern of the mask as the original is transferred. When an imprint apparatus is used in the pre-process, the imprint area is an area on the substrate onto which a pattern corresponding to the pattern of the mold serving as the original is transferred.

[0033] 4 shows an example of the layout (arrangement) of a plurality of transfer regions 30 on a substrate. The plurality of transfer regions 30 on the substrate 13 may include a transfer region 31 (complete transfer region) arranged in the center of the substrate 13, and a transfer region 32 (missing transfer region) arranged in the peripheral portion of the substrate 13 so as to include the edge of the substrate 13 and partially missing. The partially missing transfer region 32 may also include at least one chip region. Therefore, in the imprint apparatus 1, from the viewpoint of improving the yield of semiconductor chips, it is required to precisely mold the resin 20 on the substrate not only in the transfer region 31 arranged in the center of the substrate 13, but also in the transfer region 32 arranged in the peripheral portion of the substrate 13.

[0034] FIG. 5 shows a conventional example of the layout of a plurality of shot regions 40 (imprint regions) on a substrate. FIGS. 5(a) to 5(c) are enlarged views of representative shot regions 40 (41 to 43). The shot region 40 is an area to which the pattern of the mold 11 can be transferred by one imprint process, and is indicated by a thick black frame in FIG. 5. Here, an example is shown in which the pattern region 11a of the mold 11 is configured to be able to transfer the pattern to the resin 20 on two transfer regions 30 at once. In the conventional example shown in FIG. 5, there is a portion such as a shot region 42 (FIG. 5(b)) in which one transfer region 32 arranged on the periphery of the substrate 13 constitutes one shot region 40. In such a portion, it may be difficult to control the relative posture between the mold 11 and the substrate 13 in the contact step of the imprint process (the step of contacting the mold 11 with the resin on the substrate).

[0035] For example, FIG. 6(a) shows an example in which the mold 11 (pattern region 11a) is brought into contact with the resin 20 on a shot region 41 set in the center of the substrate 13. In this case, since the contact area between the pattern region 11a of the mold 11 and the resin 20 on the substrate is relatively large, it is possible to precisely control the relative posture between the mold 11 and the substrate 13 in the contacting step. On the other hand, FIG. 6(b) shows an example in which the mold 11 (pattern region 11a) is brought into contact with the resin 20 on a shot region 42 set in the peripheral portion of the substrate 13. In this case, the end of the pattern region 11a of the mold 11 may come into contact with the resin 20 on the shot region 42 over a relatively small area. Therefore, a moment that rotates the mold 11 is generated as shown by the arrow A in FIG. 6(b), and it may be difficult to precisely control the relative posture between the mold 11 and the substrate 13 in the contacting step. That is, it may be difficult to precisely control the thickness of the resin 20 on the substrate (e.g., residual layer thickness (RLT)). In this case, adding a new mechanism for precisely controlling the relative position between the mold 11 and the substrate 13 may be disadvantageous in terms of the complexity of the device configuration and the cost of the device.

[0036] Therefore, in this embodiment, as shown in FIG. 7, the layout of the multiple shot regions 40 on the substrate 13 can be set so that each shot region 40 includes two or more transfer regions 31. That is, the imprint apparatus 1 of this embodiment performs imprint processing collectively with two or more transfer regions 30 as one shot region 40. As a result, even when performing imprint processing on a transfer region 32 arranged on the periphery of the substrate 13, it is possible to easily control the relative posture of the mold 11 and the substrate 13 in the contact step, compared to the conventional example shown in FIG. 5. Therefore, the resin 20 on the transfer region 32 can be molded with high accuracy. Note that FIG. 7 shows an example of the layout of the multiple shot regions 40 (imprint regions) in this embodiment, and FIGS. 7(a) to (c) are enlarged views of representative shot regions 40 (44 to 46).

[0037] The layout of the multiple shot regions 40 on the substrate 13 may be set (determined) by the control unit CNT of the imprint apparatus 1. In this case, the control unit CNT may acquire information indicating the arrangement of the multiple transfer regions 30 on the substrate 13 from an apparatus (exposure apparatus, etc.) used in pre-processing, and set the layout such that each shot region 40 includes two or more transfer regions 31 based on the information. At this time, it is preferable for the control unit CNT to set the layout such that the number of transfer regions 30 included in each shot region 40 is the same for the multiple shot regions 40. Note that the layout may be set by an external computer of the imprint apparatus 1.

[0038] Here, as shown in FIG. 4, the substrate 13 may include a non-transfer region R to which the pattern of the original was not transferred in the previous process, in addition to a plurality of transfer regions 30 to which the pattern of the original was transferred individually in the previous process. The non-transfer region R is, for example, a region having a size that does not include even one chip region, that is, a region having an area smaller than one chip region, and does not require the transfer of the pattern of the mold 11 by the imprint process. However, if the resin 20 on the non-transfer region R is not molded, the substrate 13 will be etched in the non-transfer region R by the etching process or the like in the subsequent process. Therefore, from the viewpoint of protecting the substrate 13 in the etching process or the like, it is preferable to mold the resin 20 by the mold 11 in the non-transfer region R as well.

[0039] However, if the non-transfer region R is set as one shot region 40 by itself, as in the conventional shot region 43 (FIG. 5(c)) shown in FIG. 5, it may be difficult to precisely control the relative posture between the mold 11 and the substrate 13 in the contact step. That is, it may be difficult to precisely control the film thickness (e.g., residual film thickness (RLT; Residual Layer Thickness)) of the resin 20 on the substrate in the non-transfer region R. Therefore, in this embodiment, as in the shot region 46 (FIG. 7(c)) shown in FIG. 7, the layout of the multiple shot regions 40 is set so that the non-transfer region R and at least one transfer region 30 form one shot region 40. That is, the imprint apparatus 1 of this embodiment performs the imprint process collectively by treating the non-transfer region R and at least one transfer region 30 as one shot region 40. Thereby, the resin 20 on the non-transfer region R can be precisely molded so that the film thickness (e.g., residual film thickness) of the resin 20 on the non-transfer region R falls within a target range.

[0040] [Shot area alignment] The peripheral portion of the substrate 13 may exhibit peculiar behavior due to processing of the substrate 13 in pre-processing, since the continuity of the substrate 13 is interrupted. For example, the etching rate and film formation rate at the peripheral portion of the substrate 13 may differ from those at the center portion of the substrate 13, and non-uniformity in etching and film formation or unevenness in the amount of processing may occur. In other words, the substrate side mark 19 provided in the transfer region 32 at the peripheral portion of the substrate 13 may cause detection errors due to distortion, unevenness in film thickness, etc., and is therefore unreliable. If such a substrate side mark 19 is used to align the mold 11 and the substrate 13, it may be difficult to mold the resin 20 on the substrate with high precision (i.e., to transfer the pattern of the mold 11 to the resin 20 on the substrate with high precision).

[0041] Therefore, the imprint apparatus 1 of this embodiment controls the alignment of the specific shot area using the detection result of the substrate-side mark 19 provided in a transfer area other than the smallest transfer area among the two or more transfer areas 30 included in the specific shot area. The specific shot area is a shot area having two or more transfer areas 30 of different sizes among the multiple shot areas 40 on the substrate 13, and more specifically, may be a shot area including a transfer area 32 arranged on the periphery of the substrate 13. The specific shot area can also be said to be a shot area arranged on the periphery of the substrate 13 to which only a part of the pattern of the mold 11 is transferred. In the example shown in FIG. 7, a shot area 45 (FIG. 7(b)) is exemplified as the specific shot area.

[0042] For example, the control unit CNT judges whether the area of ​​the smallest transfer region 30 included in each shot region 40 is smaller than a predetermined ratio of the maximum area to which the pattern of the original is transferred in the previous process based on information indicating the arrangement of multiple transfer regions 30 on the substrate 13. This allows the control unit CNT to determine (judge) the shot region 40 including the transfer region 30 having an area smaller than the predetermined ratio of the maximum area as the specific shot region. The predetermined ratio can be set arbitrarily, and can be set to, for example, half (1 / 2), 1 / 3, 1 / 4, 1 / 5, etc. of the maximum area. The maximum area is, for example, the area of ​​the transfer region 31 arranged in the center of the substrate, and may be referred to as the maximum transfer area hereinafter.

[0043] Next, a method for selecting a predetermined number of substrate-side marks 19 to be used for alignment from among the substrate-side marks 19 provided in each shot area 40 will be described with reference to FIG. 7. In this description, an example will be described in which a predetermined number of four substrate-side marks 19 are selected from among the substrate-side marks 19 provided in each shot area 40, but the number of substrate-side marks 19 to be selected is not limited to four and can be set arbitrarily. For example, in the case where the detection unit 15 is provided with a plurality of scopes configured to detect one substrate-side mark 19, the number of substrate-side marks 19 corresponding to the number of the scopes can be selected. In addition, in this description, it is assumed that 3×4=12 substrate-side marks 19 are formed in the transfer area 30 (i.e., the transfer area 31) to which the entire pattern of the original is transferred in the previous process. In the example shown in FIG. 7, each substrate-side mark 19 is indicated by a circle, and the selected substrate-side marks 19 are indicated by a black circle, and the unselected substrate-side marks 19 are indicated by a white circle.

[0044] The control unit CNT selects a predetermined number (for example, four) of substrate-side marks 19 to be detected by the detection unit 15 in the alignment of the mold 11 and the substrate 13 from among the substrate-side marks 19 provided in the shot area 40. At this time, the control unit CNT may select a predetermined number of substrate-side marks 19 formed as far apart as possible from among the substrate-side marks 19 provided in the shot area 40. By selecting a predetermined number of substrate-side marks 19 in this way, the rotation component, magnification component, and the like of the shot area 42 can be obtained with high accuracy based on the detection result of the detection unit 15. For the shot area 44 shown in FIG. 7 (FIG. 7(a)), the control unit CNT may select four substrate-side marks 19 formed at the four corners of the shot area 44 as the substrate-side marks 19 to be used for alignment based on the above principle. The shot area 44 is a shot area arranged in the center of the substrate 13, and two or more transfer areas 30 included therein have the same size. In other words, the shot area 44 is a shot area that has not been determined (determined) as a specific shot area.

[0045] On the other hand, the shot area 45 shown in FIG. 7 is a shot area determined as a specific shot area. For the shot area 45, the control unit CNT selects a predetermined number of substrate-side marks 19 to be used for alignment from among the substrate-side marks 19 provided in the transfer area other than the smallest transfer area among the two or more transfer areas 30 included in the shot area 45. For example, as shown in FIG. 7(b), the shot area 45 includes a first transfer area 30a and a second transfer area 30b smaller than the first transfer area 30a. In this case, since the second transfer area 30b is the smallest transfer area 30, the control unit CNT selects a predetermined number of substrate-side marks 19 to be used for alignment from the first transfer area 30a, but not from the second transfer area 30b. That is, the control unit CNT controls the alignment of the shot area 45 as a specific shot area based on the detection result of the substrate-side marks 19 provided in the first transfer area 30a, without using the detection result of the substrate-side marks 19 provided in the second transfer area 30b. In this case, the control unit CNT does not need to cause the detection unit 15 to detect the position of the substrate-side mark 19 provided in the second transfer region 30b. This makes it possible to avoid using the substrate-side mark 19, which is likely to cause a detection error in alignment, and to mold the resin 20 on the substrate with high precision. That is, since the resin can be molded with high precision even in the transfer region 32 arranged on the periphery of the substrate 13, a pattern can be formed with high precision also in the chip region of the transfer region 32, and the yield of semiconductor chips, etc. can be improved.

[0046] Also, there are cases where the substrate-side marks 19 are not formed in the non-transfer region R. Therefore, as shown in FIG. 7(c), for a shot region 46 including the non-transfer region R, the control unit CNT can select a predetermined number of substrate-side marks 19 to be used for alignment from the transfer region 30c included in the shot region 46. Then, based on the detection result of the selected substrate-side marks 19, the alignment of the shot region 46 can be controlled. When two or more transfer regions 30 are included in the shot region 46 including the non-transfer region R, the alignment may be controlled based on the detection result of the substrate-side marks 19 provided in the transfer region other than the smallest transfer region among the two or more transfer regions 30, as described above.

[0047] Here, in the alignment of the mold 11 and the substrate 13 in the imprint process of this embodiment, an overlay error may occur in the transfer region 30 where the substrate side mark 19 is not selected and in the non-transfer region R. For example, for the transfer region 30 where the substrate side mark 19 is selected, the shift component, the rotation component, the magnification component, the shot shape difference, and the like can be obtained with high accuracy. On the other hand, for the transfer region 30 where the substrate side mark 19 is not selected, it may be difficult to obtain these components with high accuracy, so that an overlay error may occur between the pattern region 11a of the mold 11 and the transfer region 30. This overlay error may be reproduced in the subsequent imprint process. Therefore, it is advisable to calculate the overlay error from the result of the previous imprint process and obtain an offset value (correction value) for correcting the overlay error. Specifically, the amount of deviation and the shape difference between the base pattern of the substrate 13 and the pattern formed in the resin 20 by the imprint process (or the pattern after etching the substrate 13 using the resin 20 on which the pattern is formed as a mask) are measured. This makes it possible to obtain an offset value for correcting the amount of misalignment and the shape difference based on the measurement result. Such an offset value may be obtained for each shot region 40 (e.g., a specific shot region). Also, the offset value may be updated every time the imprint process is performed.

[0048] When there is a difference (error) in a parameter such as a substrate thickness between substrates or between lots, the parameter may be measured before the imprint process, and an offset value (correction value) for correcting the difference in the parameter may be stored in the imprint apparatus 1 (controller CNT). The control unit CNT can reduce (improve) the difference in the parameter by controlling the imprint process (for example, alignment between the mold 11 and the substrate 13) based on the offset value. Such measurement of the parameter may be performed by an external device of the imprint apparatus 1, or may be performed using a measurement unit configured inside the imprint apparatus 1. In addition, the difference in the parameter may be calculated (predicted) from the detection result of the position of the substrate side mark 19 selected in each shot region 40. Furthermore, for example, since the change in the parameter on the substrate usually changes concentrically due to the influence of chemical mechanical polishing (CMP) or spin coating in the previous process, it can also be predicted from the tendency and past history information.

[0049] Furthermore, when the layout of the multiple shot regions 40 is set so that each shot region 40 includes two or more transfer regions 30, the number of transfer regions 30 included in each shot region 40 (i.e., the dimensions of the pattern region 11a of the mold 11) may be adjusted. For example, the above-mentioned layout setting can be realized by adjusting the size of one shot region 40 on the substrate 13 or the layout of the multiple shot regions 40. In second and third embodiments described later, examples in which the number of transfer regions in one shot region is adjusted will be described.

[0050] Furthermore, it is desirable that the transfer of the pattern of the original in the previous process is performed under similar conditions in the multiple shot areas 40 on the substrate 13. For example, when a scanning exposure device (scanner) is used to transfer the pattern of the original in the previous process, up-scanning (scanning exposure in a first scanning direction) and down-scanning (scanning exposure in a second scanning direction opposite to the first scanning direction) can be repeated for each transfer area. Therefore, in order to reduce errors between the multiple shot areas on the substrate 13, it is desirable to make the scanning direction during scanning exposure the same in the multiple shot areas 40. As an example, when each shot area 40 includes two or more transfer areas 30, it is advisable to control the scanning exposure so that the scanning directions are the same in the transfer areas 30 that correspond (are the same) in each shot area 40. As shown in FIG. 7, when each shot area 40 includes two transfer areas 30, the transfer area 31 on the left side of the paper of the two transfer areas 30 is subjected to scanning exposure in the first scanning direction (for example, the +Y direction). On the other hand, the transfer area 31 on the right side of the paper is subjected to scanning exposure in the second scanning direction (for example, the -Y direction). This makes it possible to reduce errors between a plurality of shot areas on the substrate 13, and also makes it possible to apply the same offset value to transfer areas 30 having the same scanning direction.

[0051] As described above, in this embodiment, the layout of the multiple shot areas 40 on the substrate 13 is set so that each shot area 40 includes two or more transfer areas 30. Then, the imprint apparatus 1 controls the imprint process of each shot area 40 according to the layout. Furthermore, the imprint apparatus 1 controls the alignment of a specific shot area using the detection results of the substrate-side marks 19 provided in a transfer area other than the smallest transfer area among the two or more transfer areas 30 included in the specific shot area. This makes it possible to avoid using the substrate-side marks 19 that are likely to cause detection errors in alignment, and to mold the resin 20 on the substrate with high accuracy.

[0052] <Second embodiment> A second embodiment of the present invention will be described. In this embodiment, an example will be described in which the pattern area 11a of the mold 11 is configured so that the resin 20 on the three transfer areas 30 can be molded collectively (for example, so that the pattern can be transferred collectively). Note that this embodiment basically follows on from the first embodiment, and unless otherwise specified below, the configuration and processing of the imprint apparatus 1 are similar to those of the first embodiment.

[0053] FIG. 8 is a diagram showing an example of the layout of a plurality of shot regions 50 in this embodiment, and FIGS. 8(a)-(b) are enlarged views of representative shot regions 50 (51-52). In the example shown in FIG. 8, a shot region 50 including three transfer regions 30 and a shot region 50 including two transfer regions 30 can be set. For example, in a shot region 51 including three transfer regions, a substrate-side mark 19 to be used for alignment can be selected from transfer regions 30d and 30e other than the smallest transfer region 30f among the three transfer regions 30d-31f. Since the transfer region 30e has a larger number of substrate-side marks 19 than the transfer region 30f, the options for the substrate-side marks 19 can be increased. For example, even if a defect occurs in some of the substrate-side marks 19 provided in the transfer region 30e, the other substrate-side marks 19 can be selected. 8, similarly to Fig. 7, the selected substrate-side marks 19 are represented by filled black circles, and the unselected substrate-side marks 19 are represented by filled white circles. Meanwhile, in a shot area 52 including two transfer areas 31g-31h, a substrate-side mark 19 to be used for alignment can be selected from a transfer area 31g other than the smallest transfer area 31h of the two transfer areas 31g-31h.

[0054] <Third embodiment> A third embodiment of the present invention will be described. In this embodiment, an example will be described in which the pattern region 11a of the mold 11 is configured so that the resin 20 on the four transfer regions 30 can be molded collectively (for example, so that the pattern can be transferred collectively). Note that this embodiment basically follows on from the first and second embodiments, and unless otherwise specified below, the configuration and processing of the imprint apparatus 1 are the same as those of the first embodiment.

[0055] FIG. 9 is a diagram showing an example of the layout of a plurality of shot regions 60 in this embodiment, and FIGS. 9(a) and 9(b) are enlarged views of representative shot regions 60 (61 to 62). For example, in the shot region 61, the substrate-side marks 19 used for alignment can be selected from the transfer regions 30j and 30k other than the smallest transfer region 30i among the three transfer regions 30i to 30k included therein. At this time, the substrate-side marks 19 close to the edge of the substrate 13 (for example, the substrate-side marks 19 present within a predetermined range from the edge of the substrate 13) may be intentionally excluded from the options. In addition, it is not necessary to select the substrate-side marks 19 from all of the transfer regions 30j and 30k other than the smallest transfer region 30i, and for example, the substrate-side marks 19 may be selected only from the largest transfer region 30j. In addition, as another example, in the shot region 62, the substrate-side marks 19 used for alignment can be selected from the transfer regions 30l and 30m other than the smallest transfer region 30n among the three transfer regions 30l to 30n included therein.

[0056] <Embodiments of the method for manufacturing an article> The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing an article such as a microdevice such as a semiconductor device or an element having a fine structure. The method for manufacturing an article according to this embodiment includes a step of forming a pattern on an imprint material supplied (applied) onto a substrate using the above-mentioned imprint apparatus, and a step of processing the substrate on which the pattern has been formed in this step. Furthermore, this manufacturing method includes other well-known steps (oxidation, film formation, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The method for manufacturing an article according to this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to conventional methods.

[0057] The pattern of the cured product formed using the imprinting apparatus is used permanently on at least a part of various articles, or temporarily when manufacturing various articles. The articles include electric circuit elements, optical elements, MEMS, recording elements, sensors, molds, etc. Examples of electric circuit elements include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensors, and FPGAs. Examples of molds include molds for imprinting.

[0058] The pattern of the cured product is used as it is as at least a part of a component of the article, or is used temporarily as a resist mask, which is removed after etching or ion implantation in a substrate processing step.

[0059] Next, a specific method for manufacturing the article will be described. As shown in Fig. 10(a), a substrate 1z such as a silicon wafer is prepared on the surface of which a workpiece 2z such as an insulator is formed, and then an imprint material 3z is applied to the surface of the workpiece 2z by an inkjet method or the like. Here, a state in which the imprint material 3z in the form of multiple droplets is applied onto the substrate is shown.

[0060] As shown in Fig. 10(b), the imprinting mold 4z is placed with the side on which the concave-convex pattern is formed facing the imprinting material 3z on the substrate. As shown in Fig. 10(c), the substrate 1z to which the imprinting material 3z has been applied is brought into contact with the mold 4z, and pressure is applied. The imprinting material 3z fills the gap between the mold 4z and the workpiece 2z. When light is irradiated through the mold 4z in this state as energy for hardening, the imprinting material 3z hardens.

[0061] 10(d), after the imprint material 3z is cured, the mold 4z and the substrate 1z are separated, and a pattern of the cured product of the imprint material 3z is formed on the substrate 1z. In this cured product pattern, the recesses of the mold correspond to the protrusions of the cured product, and the protrusions of the mold correspond to the recesses of the cured product, i.e., the recessed and protruding pattern of the mold 4z is transferred to the imprint material 3z.

[0062] As shown in Fig. 10(e), when etching is performed using the pattern of the cured material as an etching-resistant mask, the portion of the surface of the workpiece 2z where there is no cured material or where only a thin layer remains is removed, forming a groove 5z. As shown in Fig. 10(f), when the pattern of the cured material is removed, an article having grooves 5z formed on the surface of the workpiece 2z can be obtained. Here, the pattern of the cured material is removed, but it may be used as an interlayer insulating film included in a semiconductor element or the like, that is, a component of an article, without being removed after processing.

[0063] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0064] 1: imprint device, 11: mold, 13: substrate, 15: detection unit, 30: transfer area, 40, 50, 60: shot area

Claims

1. An imprint apparatus that performs a process of forming an imprint material on a substrate using a mold for each of a plurality of shot areas on the substrate, comprising: a detection unit that detects the position of a mark provided on the substrate; a control unit that controls alignment of the substrate and the mold based on a detection result by the detection unit in the process; Equipped with the substrate includes a plurality of transfer regions to which a pattern of an original is individually transferred in a previous process, and a non-transfer region to which the pattern of the original is not transferred in the previous process; the mold is configured to be capable of collectively molding the imprint material on at least two of the plurality of transfer regions, the at least two transfer regions being regarded as one shot region; The control unit is determining a layout of the plurality of shot areas on the substrate so as to satisfy either a first condition that one shot area includes two or more transfer areas, or a second condition that one shot area includes the non-transfer area and one or more transfer areas; An imprint apparatus characterized in that, in the processing of a specific shot area having two or more transfer areas of different sizes, the alignment is controlled using the detection result of a mark provided in a transfer area other than the smallest transfer area among the two or more transfer areas included in the specific shot area.

2. The imprint apparatus according to claim 1 , wherein the control unit controls the alignment in the processing of the specific shot area without using the detection result of a mark provided in the smallest transfer area.

3. 3 . The imprint apparatus according to claim 1 , wherein the control unit prevents the detection unit from detecting a position of a mark provided in the smallest transfer area in the processing of the specific shot area. 4 .

4. 4. The imprint apparatus according to claim 1, wherein an area of ​​the smallest transfer area among the two or more transfer areas included in the specific shot area is smaller than half of a maximum area to which the pattern of the original is transferred in the pre-process.

5. 5. The imprint apparatus according to claim 1, wherein the specific shot area is a shot area that is arranged on a peripheral portion of the substrate and to which only a part of the pattern of the mold is transferred.

6. The imprint apparatus according to claim 1 , wherein the control unit controls the processing of each shot area based on information indicating the determined layout.

7. The imprint apparatus according to claim 1 , wherein the control unit determines the layout based on information indicating an arrangement of the plurality of transfer regions on the substrate.

8. The imprint apparatus according to claim 7 , wherein the control unit determines the layout such that the number of transfer regions is the same for shot regions that satisfy the first condition among the plurality of shot regions.

9. The imprint apparatus according to claim 1 , wherein each of the plurality of transfer regions includes at least one chip region.

10. The imprint apparatus according to claim 1 , wherein the detection unit detects a relative position between a mark provided on the mold and a mark provided on the substrate.

11. A forming step of forming a pattern on a substrate by using the imprint apparatus according to any one of claims 1 to 10; A processing step of processing the substrate on which the pattern is formed in the forming step, A method for manufacturing an article, comprising manufacturing an article from the substrate processed in the processing step.

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