Teaching method for conveying device and conveying system

Abstract

To provide a teaching method for a transport device and a transport system.SOLUTION: A teaching method for a transport device including a pick for holding a substrate and a mapping sensor includes a step of detecting a height position of a reference substrate using the mapping sensor to set a reference position in a height direction in an accommodation container for reference in which the reference substrate is accommodated, a step of detecting a height position of a production substrate using the mapping sensor to detect a height position of the production substrate in an accommodation container in which the production substrate to be processed by a substrate processing apparatus is accommodated, and storing information on the height position, and a step of correcting the reference position on the basis of the stored information in the plurality of accommodation containers.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present disclosure relates to a teaching method for a conveying device and a conveying system. [Background technology]

[0002] A transport device for transporting a substrate is known.

[0003] Patent Document 1 discloses a load port that is provided adjacent to a wafer transfer chamber, forms an EFEM together with the wafer transfer chamber, receives a transferred FOUP, and is used to move wafers stored in the FOUP between the inside of the wafer transfer chamber and the inside of the FOUP, the load port being characterized in that it is equipped with a mapping device that maps the wafers, and a transfer device that transfers wafers between the inside of the FOUP and the inside of the wafer transfer chamber. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2012-49382 A Summary of the Invention [Problem to be solved by the invention]

[0005] In one aspect, the present disclosure provides a teaching method for a transport device and a transport system. [Means for solving the problem]

[0006] In order to solve the above problem, according to one aspect, a teaching method for a transport device having a pick for holding a substrate and a mapping sensor includes the steps of: detecting a height position of a reference substrate using the mapping sensor in a reference storage container that stores the reference substrate, and setting a reference position in the height direction; detecting a height position of a production substrate using the mapping sensor in a storage container that stores a production substrate to be processed in a substrate processing apparatus, and storing information on the height position; and correcting the reference position based on the stored information for a plurality of the storage containers. the information includes information on the height position and information on a model of the storage container, and the step of correcting the reference position corrects the reference position for each model. A method for teaching a transport device is provided. Effect of the Invention

[0007] According to one aspect, a teaching method for a conveying device and a conveying system can be provided. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a configuration diagram showing an example of a substrate processing apparatus according to an embodiment. [Diagram 2] FIG. 2 is a plan view showing an example of a pick and a wafer of an atmospheric transfer apparatus. [Diagram 3] FIG. 13 is an example of a perspective view illustrating a mapping operation. [Figure 4] 11 is a flowchart illustrating an example of a teaching operation of the atmospheric transfer arm. [Diagram 5] 5 is a graph showing an example of a detection result of a height position of a wafer, a reference position, and upper and lower limit threshold values ​​in the first embodiment. [Figure 6] 10 is a graph showing an example of a detection result of a height position of a wafer, a reference position, and upper and lower limit threshold values ​​in the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and duplicated descriptions may be omitted.

[0010] <Substrate Processing Apparatus 100> A substrate processing apparatus 100 according to an embodiment will be described with reference to Fig. 1. Fig. 1 is a configuration diagram showing an example of the substrate processing apparatus 100 according to an embodiment.

[0011] The substrate processing apparatus 100 includes a vacuum transfer chamber 1 that is held in vacuum and that transfers a wafer W, which is an example of a substrate, and a plurality of processing modules that are airtightly connected to the periphery of the vacuum transfer chamber 1 and perform a predetermined processing on the wafer W. In this example, for example, four processing modules are provided, but it is sufficient to provide one or more. In the following, the four processing modules are referred to as processing chambers PM1, PM2, PM3, and PM4, and are collectively referred to as processing chamber PM. The four processing chambers PM1 to PM4 and the two load lock chambers 2 are connected to each side of the hexagonal vacuum transfer chamber 1, respectively.

[0012] In the processing chambers PM1 to PM4, a predetermined process is performed on the wafer W while it is heated to a predetermined temperature. For example, the processing chambers PM1 to PM4 may be COR (Chemical Oxide Removal) processing chambers or PHT (Post Heat Treatment) processing chambers. For example, the process performed in the processing chambers PM1 to PM4 may be a dry etching process using plasma or an ashing process. Other processes may be a film formation process using thermal CVD (Chemical Vapor Deposition) or ALD (Atomic Layer Deposition), or an annealing process. In addition, a moisture removal process may be performed by heating the wafer W to, for example, about 200° C. to remove moisture contained in the wafer W. The processing chambers PM1 and PM4 each include a mounting table on which the wafer W is mounted, a gas supply path for supplying a processing gas into the chamber, and an exhaust pipe for evacuating the chamber.

[0013] A substrate transfer device 10 is disposed inside the vacuum transfer chamber 1. The substrate transfer device 10 has two arms, a first transfer arm 11 and a second transfer arm 12, and holds and transfers a wafer W on one or both of the two arms.

[0014] The first transfer arm 11 and the second transfer arm 12 are configured to be freely rotatable about the same axis and freely movable up and down by a rotation mechanism 13 provided on the bottom surface of the vacuum transfer chamber 1. The tips of the first transfer arm 11 and the second transfer arm 12 each form a pick 14, 15 that is formed, for example, in a U-shape and holds a wafer W, and are configured to be freely movable forward and backward independently in the horizontal direction relative to the processing chambers PM1 to PM4 and the two load lock chambers 2.

[0015] The first transfer arm 11 and the second transfer arm 12 are each connected to the rotation mechanism 13 such that, for example, their travel directions when extending from the rotation mechanism 13 are opposite to each other. The wafer W is transferred between each processing chamber PM and the load lock chamber 2 by the cooperation of the advance / retract and elevation of the first transfer arm 11 and the second transfer arm 12 and the elevation of elevation pins provided on a mounting table on which the wafer W is placed in each processing chamber PM.

[0016] The load lock chamber 2 is airtightly connected to the vacuum transfer chamber 1, and switches the internal atmosphere between a vacuum atmosphere and an air atmosphere. In this embodiment, two load lock chambers 2 are provided, but the number is not limited to this.

[0017] The two load lock chambers 2 are airtightly connected to a common atmospheric transfer chamber 3 for transferring wafers W in an atmospheric atmosphere. In the atmospheric transfer chamber 3, loading ports 4 are provided with loading tables at multiple locations for loading FOUPs 5 storing, for example, 25 wafers W. In this embodiment, loading tables are provided at four locations, but the number of loading tables is not limited to this. A pressing mechanism 41 functions to press the FOUPs 5 on the loading tables against the atmospheric transfer chamber 3.

[0018] The FOUP 5 is also provided with an identifier 52. The identifier 52 is, for example, a barcode, an IC tag, or the like, and has identification information for individually identifying the FOUP 5. The identification information may also include information on the model of the FOUP 5. The load port 4 also has a detection unit 42 that detects information from the identifier 52 of the FOUP 5 attached to the load port 4.

[0019] An atmospheric transfer device 30 is provided inside the atmospheric transfer chamber 3 for transferring the wafer W between the load lock chamber 2 and the FOUP 5. The atmospheric transfer device 30 includes an atmospheric transfer arm having an arm that can be raised and lowered in the vertical direction and can rotate about a vertical axis, and a slide mechanism (not shown) configured to be movable in parallel along the row of the load ports 4. An alignment device 6 that aligns the wafer W is provided between the two load lock chambers 2. In the following description, the atmospheric transfer device 30 and the control unit 7 are also referred to as a transfer system.

[0020] Gate valves GV are provided between the vacuum transfer chamber 1 and the processing chambers PM1 to PM4, and between the vacuum transfer chamber 1 and the load lock chamber 2, and a door valve DV is provided between the load lock chamber 2 and the atmospheric transfer chamber 3. The wafer W is transferred airtight by opening and closing the gate valves GV and door valves DV.

[0021] The substrate processing apparatus 100 thus configured has a control unit 7 that is constituted by, for example, a computer. The control unit 7 controls the entire substrate processing apparatus 100. The control unit 7 has a memory and a CPU, and the memory stores programs and recipes used for performing processing in each processing chamber PM. The programs include programs related to input operations and display of processing parameters. The recipe sets process conditions such as the temperature to which the processing chamber PM is heated, processing procedures, and a transfer path for the wafer W.

[0022] The CPU transfers the wafer W taken out of the FOUP 5 to the multiple processing chambers PM along a predetermined route using the atmospheric transfer device 30, the first transfer arm 11, and the second transfer arm 12 in accordance with the program and recipe stored in the memory. Then, the CPU executes a predetermined process in each processing chamber PM based on the process conditions set in the recipe. The program may be stored in a storage unit such as a computer storage medium, for example, a flexible disk, a compact disk, a hard disk, or an MO (magneto-optical disk), and installed in the control unit 7, or may be downloaded using a communication function.

[0023] The unprocessed wafer W unloaded from the FOUP 5 is transferred to the load lock chamber 2 by the atmospheric transfer device 30. Next, the unprocessed wafer W is transferred to the processing chamber PM by the first transfer arm 11 or the second transfer arm 12. In the processing chamber PM, the wafer W is subjected to a desired process (e.g., a film formation process, etc.). The wafer W that has been processed in the processing chamber PM may be transferred to another processing chamber PM by the first transfer arm 11 or the second transfer arm 12 and further processed. The processed wafer W is returned to the FOUP 5 via the load lock chamber 2.

[0024] <Atmospheric transport device 30> Next, the atmospheric transfer device 30 will be further described. Fig. 2 is a plan view showing an example of the pick 31 and the wafer W of the atmospheric transfer device 30. The pick 31 is provided with a mapping sensor 32. The mapping sensor 32 has a light emitting unit 33 and a light receiving unit 34, and detects the presence or absence of a light blocking object (wafer W) on the path of the beam 35 by detecting a beam 35 irradiated from the light emitting unit 33 with the light receiving unit 34.

[0025] 3 is an example of a perspective view for explaining the mapping operation. By raising the light-emitting unit 33 and the light-receiving unit 34 (arrow 36), the height direction position of the wafer W accommodated in the FOUP 5 can be detected (mapped).

[0026] <Teaching Operation of the Atmospheric Transfer Apparatus 30 and Substrate Processing of the Substrate Processing Apparatus 100> Next, the teaching operation of the atmospheric transfer device 30 will be described with reference to Fig. 4 to Fig. 6. Here, the operation of teaching the reference position of the wafer W in each slot accommodated in the FOUP 5 to the atmospheric transfer device 30 will be described.

[0027] FIG. 4 is a flow chart for explaining an example of the teaching operation of the atmospheric transfer device 30 and the substrate processing of the substrate processing apparatus 100. As shown in FIG.

[0028] In step S101, an operator installs a teaching FOUP (reference container) 5 on the load port 4. Here, the teaching FOUP 5 installed in step S101 is a FOUP 5 used to set the reference position and upper and lower thresholds of each slot of the FOUP 5 (step S103 described later). Here, the reference position of each slot of the FOUP 5 is a reference value of the height position of the wafer W accommodated in each slot. Furthermore, the upper and lower thresholds of each slot of the FOUP 5 are values ​​indicating an allowable range of the height position of the wafer W in each slot. If the height position of the wafer W accommodated in a slot is within the range of the upper and lower thresholds of the slot, it is determined that the wafer W is normally accommodated in the slot. The teaching FOUP 5 has a plurality of slots (e.g., 25) for accommodating the wafer W. Furthermore, a teaching wafer (reference substrate) W is accommodated in the slots (e.g., the first and 25th slots) of the teaching FOUP 5.

[0029] In step S102, the control unit 7 maps the teaching wafer W housed in the teaching FOUP 5. Here, the control unit 7 detects (maps) the height position of the teaching wafer W housed in the teaching FOUP 5 using the mapping sensor 32 provided on the pick 31 (see FIGS. 2 and 3). The control unit 7 controls the atmospheric transfer device 30 to move the pick 31 to a predetermined mapping position and lift it in the Z direction, thereby performing mapping.

[0030] In step S103, the control unit 7 sets the reference position and upper and lower thresholds for each slot of the FOUP 5 based on the mapping data of the teaching FOUP 5. For example, the height positions of the teaching wafers W accommodated in the first slot at the bottom and the 25th slot at the top are detected by the mapping sensor 32 and are set as the reference position of the first slot and the reference position of the 25th slot, respectively. For the second to 24th slots, the interval between the reference position of the first slot and the reference position of the 25th slot is equally divided to set the reference positions of the second to 24th slots. Also, for each slot, upper and lower thresholds (lower and upper thresholds) are set based on the reference position. Here, the upper threshold of each slot is set to a height position obtained by adding a predetermined addition value to the reference position of each slot, for example. Also, the lower threshold of each slot is set to a height position obtained by subtracting a predetermined subtraction value from the reference position of each slot, for example. In addition, the addition value and subtraction value are values ​​that are preset based on the specifications of FOUP 5 and the height position at which the atmospheric transfer device 30 can remove the wafer W from FOUP 5 without interfering with the wafer W in an adjacent slot.

[0031] In step S104, the control unit 7 starts production of semiconductor products. That is, the control unit 7 repeats the following steps S105 to S107 to perform predetermined processing on the production wafers W in the substrate processing apparatus 100 (processing chambers PM1 to PM4) to produce semiconductor products (not shown).

[0032] In step S105, the FOUP 5 attached to the load port 4 is removed, and a new production FOUP (container) 5 is installed on the load port 4. The production FOUP 5 is attached to and removed from the load port 4 by an OHT (Overhead Hoist Transport). Here, the production FOUP 5 installed in step S105 is a FOUP 5 that houses production wafers (production substrates) W. The production wafers W are wafers that are subjected to a predetermined process in the substrate processing apparatus 100 (processing chambers PM1 to PM4) to produce semiconductor products (not shown). The production FOUP 5 has a plurality of slots (e.g., 25) for storing the wafers W. Furthermore, a wafer W is stored in each slot of the production FOUP 5.

[0033] In step S106, the control unit 7 maps the wafers W accommodated in the production FOUP 5. Here, the control unit 7 detects (maps) the height position of the wafers W accommodated in the production FOUP 5 using the mapping sensor 32 provided on the pick 31 (see FIGS. 2 and 3). The control unit 7 controls the atmospheric transfer device 30 to move the pick 31 to a predetermined mapping position and raises it in the Z direction, thereby performing mapping.

[0034] In step S107, the control unit 7 stores the mapping data detected in step S106 in a storage unit (not shown) of the control unit 7. In addition, the mapping data may be stored in association with the identification information of the production FOUP 5 detected by the detection unit 42.

[0035] In step S108, the control unit 7 determines for each slot whether or not the height position of the wafer W detected in step S106 is within the range of the upper and lower threshold limits for each slot set in step S103.

[0036] If the height position of the wafer W is not within the range of the upper and lower thresholds (S108: No), the control unit 7 proceeds to step S109. In step S109, the control unit 7 determines that an error has occurred, and skips the processing of the FOUP 5. In other words, the control unit 7 determines that the atmospheric transfer device 30 may not be able to normally remove the wafer W from the slot of the production FOUP 5, and skips the processing of the FOUP 5 (transfer and processing of the wafer W accommodated in the FOUP 5). The control unit 7 may also cause a display device (not shown) to display a warning prompting the operator to check the state of the wafer W, etc. This makes it possible to notify the operator of the occurrence of an error. The control unit 7 may also notify the host computer that manages the substrate processing apparatus 100 of the occurrence of the error. Thereafter, the control unit 7 proceeds to step S111.

[0037] If the height position of the wafer W is within the range of the upper and lower threshold limits (S108: Yes), the process by the control unit 7 proceeds to step S110. In step S110, the control unit 7 transfers the wafer W from the production FOUP 5 to the process chamber PM, and performs a predetermined process on the wafer W in the process chamber PM.

[0038] The control unit 7 determines that the wafer W is properly accommodated in the slot of the production FOUP 5. In other words, the control unit 7 determines that the atmospheric transfer device 30 can properly remove and transfer the wafer W from the slot of the production FOUP 5. Thereafter, the control unit 7 controls the atmospheric transfer device 30 to transfer the wafer W from the slot of the production FOUP 5 to the load lock chamber 2, and the substrate transfer device 10 further transfers the wafer W from the load lock chamber 2 to the processing chamber PM, where the desired processing is performed on the wafer W. The processed wafer W is returned to the FOUP 5 by the substrate transfer device 10 and the atmospheric transfer device 30. Thereafter, the processing of the control unit 7 proceeds to step S111.

[0039] In step S111, the control unit 7 determines whether or not the resetting conditions for the reference position and the upper and lower thresholds are satisfied. Here, the resetting conditions are conditions for determining the timing for executing the resetting of the reference position and the upper and lower thresholds. For example, when the operator performs an operation to execute the resetting after recording mapping data for an arbitrary number of production FOUPs 5 (see S107), the control unit 7 may determine that the resetting conditions are satisfied. Furthermore, the control unit 7 may determine that the resetting conditions are satisfied when the number of mapping data records reaches a predetermined number.

[0040] If the reset conditions are not satisfied (S111 No), the process of the control unit 7 returns to step S105, where mapping is performed for the next production FOUP 5, the mapping data is stored, and a predetermined process is performed on the wafer W accommodated in the production FOUP 5.

[0041] If the resetting condition is satisfied (S111: Yes), the process of the control unit 7 proceeds to step S112. In step S112, the control unit 7 resets (corrects) the reference position and the upper and lower limit thresholds of each slot of the FOUP 5 based on the stored mapping data of the multiple FOUPs 5.

[0042] Thereafter, the control unit 7 performs error determination (determines whether the wafer W can be normally removed or not; see S110) using the reference position and upper and lower threshold ranges of each slot reset (corrected) in step S112, and continues the production of semiconductor products (see S105 to S110). After resetting (correcting) the reference position etc. in step S112, the process of the control unit 7 may return to step S105. This allows the reference position etc. to be set (corrected) again when the resetting conditions are met again.

[0043] <Method of correcting the reference position and the upper and lower limit positions in the first embodiment> Next, a method for correcting the reference position and the upper and lower limit positions in step S112 will be described with reference to Fig. 5. Fig. 5 is a graph showing an example of the detection result of the height position of the wafer W in a predetermined slot (e.g., the 13th slot) of the FOUP 5 in the first embodiment, the reference position, and the upper and lower limit thresholds.

[0044] 5(a) is a graph showing the relationship between a reference position 510 set using a teaching FOUP 5 in a predetermined slot (e.g., the 13th slot) and the height position of a wafer W in a production FOUP 5 relative to the reference position 510. In FIG. 5(a), the horizontal axis shows the amount of deviation between the height position of the wafer W in the predetermined slot detected in step S106 and the reference position of the predetermined slot in step S103. The vertical axis shows the count number. The reference position 510 of the predetermined slot in step S103 is shown by a two-dot chain line, and a lower threshold 511 and an upper threshold 512 of the predetermined slot in step S103 are shown by dashed lines.

[0045] Here, the height positions of the slots of the FOUP 5 differ within the range of the specifications for the FOUP 5. The FOUP 5 used during teaching in steps S101 to S103 is one of multiple FOUPs 5. Therefore, if the FOUP 5 used during teaching is shifted from the standard height dimension to one side within the range of the specifications (the lower side of the height position in the example of FIG. 5(a)), the margin 531 until an error is determined to be on the other side is reduced. This may increase the frequency of errors occurring in the production FOUP 5. For example, if teaching is performed using a teaching FOUP 5 that is shifted to one side within the range of the specifications, a wafer W accommodated in a slot of a production FOUP 5 that is shifted to the other side may be determined to be an error.

[0046] In response to this, in step S112, the control unit 7 resets the reference position 520 of each slot based on the mapping data of a plurality of different individual FOUPs 5. In other words, the control unit 7 corrects the reference position of each slot based on the difference between the reference position 510 of the teaching FOUP 5 and the reference position 520 determined from a plurality of different individual production FOUPs 5. Furthermore, the control unit 7 resets the upper and lower thresholds (lower limit threshold and upper limit threshold) for each slot based on the new reference position 520.

[0047] For example, when the height positions of predetermined slots in the FOUP 5 show a normal distribution by detecting mapping data for a plurality of different individual FOUPs 5, the control unit 7 may set the center of the normal distribution as the new reference position 520.

[0048] Note that the method of correcting the reference position 520 is not limited to this. For example, the control unit 7 may obtain the reference position 520 from the average value of the height positions of the wafers W detected in step S106. This makes it possible to reset (correct) the reference position based on multiple mapping data even when the number of detected FOUPs 5 is small.

[0049] Furthermore, the control unit 7 may obtain the reference position 520 from the intermediate value between the maximum value and the minimum value among the height positions of the plurality of wafers W detected in step S106. This can further reduce the frequency of error occurrence.

[0050] Fig. 5(b) is a graph showing the relationship between a reset reference position 520 in a predetermined slot (e.g., the 13th slot) and the height position of a wafer W in a production FOUP 5 relative to the reference position 520. In Fig. 5(b), the horizontal axis shows the amount of deviation between the height position of the wafer W in the predetermined slot detected in step S106 and the reference position 520 of the predetermined slot in step S112. The vertical axis shows the count number. The reference position 520 of the predetermined slot in step S112 is shown by a two-dot chain line, and a lower threshold 521 and an upper threshold 522 of the predetermined slot in step S112 are shown by dashed dot lines.

[0051] This makes it possible to secure a margin 532 until an error is determined on the other side, thereby improving the frequency of error occurrence.

[0052] In FIG. 5, the resetting of the reference position and the upper and lower thresholds in a specific slot (e.g., the 13th slot) has been described, but the reference positions and the upper and lower thresholds can be reset in a similar manner for other slots (e.g., slots 1 to 12 and 14 to 25).

[0053] <Method of correcting the reference position and the upper and lower limit positions in the second embodiment> Next, another method of correcting the reference position and the upper and lower limit positions in step S112 will be described with reference to Fig. 6. Fig. 6 is a graph showing an example of the detection result of the height position of the wafer W in a predetermined slot (e.g., the 13th slot) of the FOUP 5 in the second embodiment, the reference position, and the upper and lower limit thresholds.

[0054] 6(a) is a graph showing the relationship between a reference position 550 set using a teaching FOUP 5 in a predetermined slot (e.g., the 13th slot) and the height position of a wafer W in a production FOUP 5 relative to the reference position 550. In FIG. 6(a), the horizontal axis shows the amount of deviation between the height position of the wafer W in the predetermined slot detected in step S106 and the reference position of the predetermined slot in step S103. The vertical axis shows the number of counts. The reference position 550 of the predetermined slot in step S103 is shown by a two-dot chain line, a lower threshold 551 and an upper threshold 552 of the predetermined slot in step S103 are shown by dashed lines, and a range 553 between the upper and lower thresholds is shown by arrows.

[0055] Here, a production FOUP 5 of type A and a production FOUP 5 of type B are attached to the load port 4. In Fig. 6, the count number of production FOUPs 5 of type A is indicated by a solid line, and the count number of production FOUPs 5 of type B is indicated by a dotted line. Furthermore, the tendency of the height position of the wafer W may differ depending on the type. For this reason, in the example of Fig. 6(a), a wafer W accommodated in a slot of a production FOUP 5 of type B in a range 581 exceeding the upper limit threshold 552 is determined to be an error.

[0056] In response to this, in step S112, the control unit 7 resets the reference positions 560, 570 of each slot based on the mapping data of multiple different individual FOUPs 5 for each type. Here, in step S107, the control unit 7 associates the identification information including the type information of the FOUP 5 detected by the detection unit 42 with the mapping data detected in step S106 and stores them in a storage unit (not shown). The control unit 7 sets the reference position 560 based on the mapping data of multiple different individual FOUPs 5 of type A. Also, the control unit 7 sets the reference position 570 based on the mapping data of multiple different individual FOUPs 5 of type B.

[0057] 6(b) is a graph showing the relationship between reset reference positions 560, 570 in a predetermined slot (e.g., the 13th slot) and the height position of the wafer W in the production FOUP 5 relative to the reference position 550. In FIG. 6(b), the horizontal axis shows the deviation between the height position of the wafer W in the predetermined slot detected in step S106 and the reference position of the predetermined slot in step S103. The vertical axis shows the count number. The reference position 560 of the predetermined slot of the FOUP 5 of type A reset (corrected) in step S112 is shown by a two-dot chain line, the lower limit threshold 561 and the upper limit threshold 562 of the predetermined slot of the FOUP 5 of type A reset (corrected) in step S112 are shown by a dashed dot line, and the range 563 of the upper and lower limit thresholds of the predetermined slot of the FOUP 5 of type A is shown by an arrow. In addition, the reference position 570 of a specified slot of FOUP 5 of type B, which was reset (corrected) in step S112, is indicated by a two-dot dashed line, the lower threshold 571 and upper threshold 572 of the specified slot of FOUP 5 of type B, which was reset (corrected) in step S112, are indicated by a dot dashed line, and the range 573 of the upper and lower thresholds of the specified slot of FOUP 5 of type B is indicated by arrows.

[0058] Then, in the production of semiconductor products after step S112, the control unit 7 reads the identifier 52 of the FOUP 5 attached to the load port 4 with the detection unit 42 to identify the type, and performs error judgment (judgment as to whether the wafer W can be removed normally or not; see S110) using the range of upper and lower threshold limits of each slot corresponding to that type (range 563 or range 573).

[0059] 6(b), FOUP 5 of type B in range 582 falls within range 573 of the upper and lower threshold limits for type B, and is therefore prevented from being determined as an error. This makes it possible to reduce the frequency of error occurrence.

[0060] In FIG. 6, the resetting of the reference position and the upper and lower thresholds in a specific slot (e.g., the 13th slot) has been described, but the reference positions and the upper and lower thresholds can be reset in a similar manner for other slots (e.g., slots 1 to 12 and 14 to 25).

[0061] The above describes one embodiment of a substrate processing apparatus, but the present disclosure is not limited to the above embodiment, and various modifications and improvements are possible within the scope of the gist of the present disclosure described in the claims.

[0062] In step S111, the resetting condition is not limited to the above-mentioned. For example, when the operator performs an operation to execute the resetting at any timing, the control unit 7 may determine that the resetting condition is satisfied.

[0063] The control unit 7 may also display a warning on a display device (not shown) to prompt the user to correct the reference position, etc., after processing a predetermined number of FOUPs 5 after setting the reference position, etc. (S103, S112). The control unit 7 may also display a warning on a display device (not shown) after a predetermined time has elapsed since setting the reference position, etc. (S103, S112). The control unit 7 may also calculate a reference position based on acquired mapping data, and display a warning on a display device (not shown) when the deviation between the reference position set (S103, S112) and the reference position calculated based on the mapping data exceeds a predetermined threshold. Then, when the operator who has confirmed the warning display performs an operation to execute the resetting, the control unit 7 may determine that the resetting condition is satisfied. This makes it possible to prompt the operator to reset the reference position, etc., and to suppress the occurrence of errors.

[0064] The control unit 7 may also determine that the resetting condition is satisfied after, for example, processing a predetermined number of FOUPs 5 after setting the reference position, etc. (S103, S112). The control unit 7 may also determine that the resetting condition is satisfied after a predetermined time has elapsed after setting the reference position, etc. (S103, S112). The control unit 7 may also determine that the resetting condition is satisfied when, for example, the amount of deviation between the reference position set (S103, S112) and the reference position calculated based on the mapping data exceeds a predetermined threshold. This allows the reference position, etc. to be automatically reset, and the occurrence of errors to be suppressed. [Explanation of symbols]

[0065] W Wafer (substrate) 100 Substrate processing apparatus 1 Vacuum transfer chamber 3. Atmospheric Transfer Chamber 4. Loading port 5 FOUP (Fuel Container) 7 Control section 30 Atmospheric transport device 31 Picks 32 Mapping Sensor 33 Light-emitting part 34 Light receiving part 35 Beam 36 Arrow 41 Pressing mechanism 42 Detection unit 52 Identifier

Claims

1. A teaching method for a conveyance device having a pick for holding a substrate and a mapping sensor, comprising the steps of: detecting a height position of the reference substrate in a reference container by using the mapping sensor and setting a reference position in a height direction; detecting a height position of a production substrate in a container that accommodates the production substrate to be processed in a substrate processing apparatus using the mapping sensor and storing information on the height position; and correcting the reference position based on the stored information on the plurality of containers, The information includes information on the height position and information on the type of the storage container, The step of correcting the reference position includes correcting the reference position for each type. A teaching method for a transport device.

2. The method further includes a step of determining whether or not the detected height position of the production board is within a range of upper and lower threshold limits corresponding to the reference position.

2. A teaching method for a conveying device according to claim 1.

3. The step of correcting the reference position includes: Correcting the normal distribution of the height positions so that the center of the normal distribution is the reference position.

3. A teaching method for a conveying device according to claim 1 or 2.

4. The step of correcting the reference position includes: Correcting the height position so that the average value of the height position is the reference position.

3. A teaching method for a conveying device according to claim 1 or 2.

5. The step of correcting the reference position includes: Correcting the height position so that the intermediate value between the maximum value and the minimum value is set as the reference position.

3. A teaching method for a conveying device according to claim 1 or 2.

6. a transfer device having a pick for holding a substrate and a mapping sensor; A conveying system having a control unit, The control unit is The transport device is controlled to detect a height position of the reference substrate in a reference container containing the reference substrate by using the mapping sensor, and set a reference position in a height direction; a substrate processing apparatus that detects a height position of a production substrate in a container that accommodates the production substrate and that is to be processed in the substrate processing apparatus, the substrate processing apparatus being configured to detect a height position of the production substrate using the mapping sensor and to store information on the height position; The reference position is corrected based on the stored information on the plurality of containers, The information includes information on the height position and information on a type of the storage container, The step of correcting the reference position includes correcting the reference position for each type. Conveying system.

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