Laminated molding system and laminated molding method

Abstract

To solve the problem of positional displacement caused by deflection of a carrier film in a conventional lamination forming system.SOLUTION: A lamination forming system according to the present invention has: a winding-off device 20 for winding off a carrier film while a pair of carrier films sandwich a to-be-laminated body; a lamination forming device 10 that executes a lamination forming step of pressurizing the to-be-laminated body with a pressurizing unit so as to laminate at least one side of the to-be-laminated body and a laminate film; a winding device 30 that conveys the to-be-laminated body after the lamination forming step out of the lamination forming device 10 by winding the pair of carrier films; and a tension assisting device 11 disposed on at least one of the winding-off device 20 side and the winding device 30 side of the pressurizing unit to temporarily strengthen a tension of a lower side carrier film CFL disposed below the pair of carrier films.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present invention relates to a lamination molding system, a tension assist system, and a lamination molding method for laminating, for example, a film material onto a substrate material having an uneven surface, the film material filling in the unevenness. [Background technology]

[0002] In recent years, semiconductor substrates or electronic circuit substrates have increasingly been multi-layered in wiring layers that form wiring. In such multi-layer wiring substrates, a method of forming an interlayer insulating film between layers by pressing is sometimes used. Therefore, a lamination molding system has been proposed that laminates a film material that becomes an interlayer insulating film onto a substrate material on which such electronic circuits are formed. An example of such a lamination molding system is disclosed in Patent Document 1.

[0003] The laminated molding system described in Patent Document 1 is a laminated molding system that laminates and molds laminated molded bodies using a laminated device, and at least one of the at least two laminated devices is arranged interchangeably between a supply device and a recovery device to form a continuous molding line. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2022-15589 A Summary of the Invention [Problem to be solved by the invention]

[0005] In the lamination device described in Patent Document 1, the object to be laminated is transported into and out of the lamination device by sandwiching it between carrier films arranged above and below. However, when the object to be laminated is transported, the carrier film bends, and there is a risk that this bending will cause the object to be laminated to become misaligned within the lamination device.

[0006] The present invention has been made in consideration of the above circumstances, and has an object to perform high-precision lamination molding by suppressing misalignment of the laminated body caused by bending of the carrier film. [Means for solving the problem]

[0007] The laminated molding system according to one embodiment includes an unwinding device that unwinds a carrier film that transports the laminated body, a laminated molding device that performs a laminated molding process in which the laminated body is pressed using a pressure section, a winding device that winds up the carrier film to transport the laminated body from the laminated molding device after the laminated molding process, and a tensioning assist device that is positioned at least either between the laminated molding device and the unwinding device or between the laminated molding device and the winding device and supports the underside of the carrier film, and the tensioning assist device is positioned in a position where no structure is between the pressure section and the tensioning assist device.

[0008] A tension assist system according to one embodiment is a tension assist system that is combined with a laminate molding device that transports a laminated object and performs a laminate molding process in which the laminated object is pressed in a pressure section so as to laminate at least one side of the laminated object and a lamination film, and has a tension assist device that supports the underside of the carrier film on which the laminated object is placed so that, when the laminated object is stopped at a stop position set in the pressure section, the tension applied in the conveying direction of the laminated object to the carrier film on which the laminated object is placed is substantially the same before and after the conveying direction.

[0009] A laminate molding method for a laminated body in a laminate molding system according to one embodiment is a laminate molding method for a laminated body in a laminate molding system having an unwinding device that unwinds a carrier film that transports the laminated body, a laminate molding device that performs a laminate molding process in which the laminated body is pressurized in a pressure section so as to laminate at least one side of the laminated body and the laminate film, and a winding device that transports the laminated body after the laminate molding process from the laminate molding device by winding up the carrier film, in which pressure is applied to the laminated body while supporting the underside of the carrier film while the laminated body is stopped at a stop position set in the pressure section.

[0010] In one embodiment of the laminate molding system, tension assistance system, and laminate molding method, a tension assistance device provided near the pressure section increases the tension of the lower carrier film after the laminated body is transported to the stopping position, thereby suppressing the amount of deflection of the lower carrier film. Effect of the Invention

[0011] According to the lamination molding system, tension assistance system, and lamination molding method of one embodiment, positional deviation caused by bending of the carrier film can be suppressed, and high-precision lamination molding can be performed. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a configuration diagram illustrating an overview of a laminate molding system according to a first embodiment. [Diagram 2] 3A to 3C are diagrams illustrating a first configuration and a first operation example of the tension assisting device according to the first embodiment. [Diagram 3] 6A to 6C are diagrams illustrating a second configuration and a second operation example of the tension assisting device according to the first embodiment. [Figure 4] 11A to 11C are diagrams illustrating a third configuration and a third operation example of the tension assisting device according to the first embodiment. [Diagram 5] 13A to 13C are diagrams illustrating a fourth configuration and a fourth operation example of the tension assisting device according to the first embodiment. [Figure 6]4 is a flowchart illustrating the operation of the lamination molding system according to the first embodiment. [Figure 7] FIG. 1 is a specific configuration diagram of a laminate molding system according to a first embodiment. [Figure 8] 13A and 13B are diagrams illustrating deflection of the lower carrier film. [Figure 9] 13 is a diagram for explaining the setting position of the fulcrum of the lower carrier film. FIG. [Figure 10] FIG. 11 is a configuration diagram for explaining an overview of a lamination molding system according to a second embodiment. [Figure 11] FIG. 11 is a specific configuration diagram of a lamination molding system according to a third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] For clarity of explanation, the following description and drawings are omitted and simplified as appropriate. In addition, in each drawing, the same elements are given the same reference numerals, and duplicate explanations are omitted as necessary.

[0014] First embodiment The lamination molding system 1 according to the first embodiment has a lamination molding device that performs a lamination molding process in which the laminated object is conveyed in a state where it is sandwiched between a pair of carrier films, and the laminated object is pressed by a pressure unit so that at least one side of the laminated object is laminated with the laminated film. The lamination molding system 1 according to the first embodiment conveys the laminated film sandwiched between the carrier films in a state where it is placed on the laminated object. In addition, in the lamination molding system 1, a winding device that supplies the carrier film and a winding device that recovers the carrier film are combined with the lamination molding device to form one system. In the lamination molding system 1 according to the first embodiment, when the laminated object is conveyed to a stop position set in the pressure unit in the lamination molding device, the tension of the lower carrier film of the pair of carrier films is increased to prevent the carrier film from sagging. Therefore, the lamination molding system 1 having a tension adjustment mechanism for the carrier film will be described in detail below.

[0015] Fig. 1 shows a configuration diagram for explaining an overview of the lamination molding system according to the embodiment 1. The configuration diagram shown in Fig. 1 mainly explains the configuration of a tension assist device 11 that temporarily increases the tension of the lower carrier film in the lamination molding system 1, and the specific configuration of the lamination molding system 1 is simplified. Note that in the following explanation, the lamination film to be laminated on the laminated body is not shown.

[0016] As shown in FIG. 1, the lamination molding system 1 is a combination of a tensioning auxiliary device 11 and a clip device 12 with a lamination molding device 10. In addition, the lamination molding system 1 is combined with an unwinding device and a winding device that supply a carrier film to carry the laminated film temporarily attached to the laminated object WK1 into and out of the laminate molding device 10 while sandwiching the laminated film between a pair of carrier films. In FIG. 1, the lower supply roll 21, the driven roller 22, the upper supply roll 23, the driven roller 24, and the placement stage 25 of the unwinding device are shown. In addition, the lower recovery roll 31, the driven roller 32, the upper recovery roll 33, the driven roller 34, and the collection stage 35 of the winding device are shown. In addition, in the lamination molding system 1 according to the first embodiment, the laminated object WK1 and the laminated film are overlapped on the placement stage 25. In the following description, the description of the laminated film is omitted, but the lamination molding system 1 according to the first embodiment is still used to laminate the laminated film on the laminated object WK1.

[0017] FIG. 1 shows the laminate molding apparatus 10 including an upper mold 101, an upper pressurizing platen 102, a lower mold 103, a lower pressurizing platen 104, a ram 105, and a pressure generating device 106. The laminate molding apparatus 10 forms a chamber in which the internal space can be maintained in a reduced pressure state by joining the upper mold 101 and the lower mold 103 together. The upper pressurizing platen 102 is provided on the surface of the upper mold 101 facing the lower mold 103, and the lower pressurizing platen 104 is provided on the surface of the lower pressurizing platen 104 facing the upper mold 101. The lower mold 103 is configured to approach the upper pressurizing platen 102 by a pressure generating device 106 such as a hydraulic unit provided below the lower mold 103 pushing up the ram 105. In other words, the upper pressurizing platen 102 and the lower mold 103 are provided in the chamber and serve as a pressure stage for applying pressure to the laminated body WK2. The laminate molding apparatus 10 is a vacuum laminate molding apparatus that performs vacuum laminate molding by pressing the laminated object WK2 with the upper pressurizing platen 102 and the lower pressurizing platen 104 while creating a vacuum inside the chamber. That is, the laminate molding apparatus 10 is configured with the upper pressurizing platen 102 and the lower pressurizing platen 104, and pressurizes the laminated object WK2 with the pressurizing portion. In addition, in the laminate molding apparatus 10, the upper mold 101 and the upper pressurizing platen 102, and the lower mold 103 and the lower pressurizing platen 104 can also be considered as pressurizing portions in order to perform vacuum laminate molding. The upper pressurizing platen 102 and the lower pressurizing platen 104 may each be a flexible sheet. In addition, if vacuum laminate molding is not performed, a structure for configuring the chamber is not necessary. In addition, the pressure generating device 106 may be a servo motor, and the ram 105 may be a ball screw.

[0018] In the lamination molding system 1 according to the first embodiment, the laminated object WK1 is placed on the lower carrier film CFL on the placement stage 25. After that, the laminated object WK1 is conveyed into the lamination molding device 10 in a state where the laminated object WK1 is sandwiched between the lower carrier film CFL and the upper carrier film CFU by overlapping the upper carrier film CFU on the laminated object WK1. In addition, in FIG. 1, the laminated object conveyed to the stop position in the lamination molding device 10 is shown as the laminated object WK2. Then, in the lamination molding system 1, the laminated object WK3 in which the laminated film is laminated on the laminated object WK2 in the lamination molding device 10 is conveyed to the collection stage 35 by moving the lower carrier film CFL and the upper carrier film CFU. Note that the film to be laminated on the laminated object WK2 is not limited to the upper carrier film CFU, and may be at least one of the lower carrier film CFL and the upper carrier film CFU.

[0019] In addition, in embodiment 1, when transporting the laminated material, the lower carrier film CFL unwound from the lower supply roll 21 is taken up by the lower recovery roll 31 while being assisted by the driven roller 22 and the driven roller 32, and the upper carrier film CFU unwound from the upper supply roll 23 is taken up by the upper recovery roll 33 while being assisted by the driven roller 24 and the driven roller 34.

[0020] The laminate molding apparatus 10 performs control to temporarily increase the tension of the lower carrier film CFL using the tension assist device 11 and the clip device 12. Here, Fig. 1 shows an operation control unit CU that controls the entire laminate molding system 1. The operation control unit CU controls the movement of the carrier film, the pressure timing and pressure force in the laminate molding apparatus 10, and the operations of the tension assist device 11 and the clip device 12. A specific control method will be described later.

[0021] In the example shown in FIG. 1, the tensioning auxiliary device 11 is provided between the laminate molding device 10 and the unwinding device. More specifically, the tensioning auxiliary device 11 is disposed at a position where no structure is interposed between the pressure unit of the laminate molding device 10 and the tensioning auxiliary device 11. Also, the clipping device 12 is provided between the winding device and the laminate molding device 10. More specifically, the clipping device 12 is disposed at a position where no structure is interposed between the pressure unit of the laminate molding device 10 and the clipping device 12. Here, in the example shown in FIG. 1, the pressure unit of the laminate molding device 10 is a chamber having a pressure mechanism composed of an upper mold 101 and an upper pressure platen 102, and a lower mold 103 and a lower pressure platen 104. Also, the clipping device 12 is disposed on the opposite side of the tensioning auxiliary device 11 across the pressure unit of the laminate molding device 10. In addition, instead of the clip device 12, a tension auxiliary device that pairs with the tension auxiliary device 11 may be provided, and instead of the clip device 12, the lower carrier film may be fixed by stopping the rotation of the lower recovery roll 31.

[0022] Then, in the laminate molding system 1, in response to the laminated object WK2 reaching the stop position set in the pressure unit, the operation control unit CU instructs the clip device 12 to clamp the lower carrier film CFL and the upper carrier film CFU. After that, in the laminate molding system 1, the operation control unit CU instructs the tension assist device 11 to increase the tension of the lower carrier film. As a result, in the laminate molding system 1, the tension of the lower carrier film CFL is increased before pressure is applied to the laminated object WK2, thereby suppressing deflection of the lower carrier film CFL.

[0023] Here, the configuration and operation of the tension assist device 11 will be described in more detail. The tension assist device 11 may be supplied separately from the laminate molding system 1 as a tension assist system for the laminate molding system 1 together with the operation control unit CU. Although multiple configurations of the tension assist device 11 are possible, the following description will focus on two configuration examples.

[0024] 2 shows a diagram illustrating a first configuration and a first operation example of tension-assistant device 11 according to embodiment 1. As shown in FIG. 2, in the first example, tension-assistant device 11 has a first roller 111, a second roller 112, and a third roller 113.

[0025] The first roller 111 is a driven roller arranged on the unwinding device side. The second roller 112 is a driven roller arranged on the winding device side. The third roller 113 is a roller that diverts the lower carrier film CFL sent from the first roller 111 to the second roller 112 to a position lower than the conveying height of the laminated object WK1. The conveying height of the laminated object WK1 in the first embodiment can be defined as a straight line connecting the highest position of the circle of the first roller 111 and the highest position of the circle of the second roller 112. In the first configuration example, the third roller 113 operates as a driven roller during the conveying of the laminated object WK1, and operates as a drive roller that rotates in a rotation direction that pulls the lower carrier film CFL in a direction opposite to the conveying direction of the laminated object WK1 during a tension assisting operation that increases the tension of the lower carrier film CFL. 2 shows a state in which the third roller 113 increases the tension of the lower carrier film CFL by generating a driving force in the counterclockwise direction during the tension assist operation, thereby pulling the lower carrier film CFL in the direction opposite to the transport direction. The operation of the third roller 113 is controlled by the operation control unit CU.

[0026] 3 shows a diagram for explaining a second configuration and a second operation example of tension-assistant device 11 according to embodiment 1. As shown in FIG. 3, tension-assistant device 11 also has a first roller 111, a second roller 112, and a third roller 113 in the second example.

[0027] In the second configuration example shown in FIG. 3, the first roller 111 is a driven roller arranged on the unwinding device side (for example, the front stage) of the laminate molding apparatus 10. The second roller 112 is a driven roller arranged on the winding device side (for example, the rear stage) of the laminate molding apparatus 10. The third roller 113 is a roller that detours the lower carrier film CFL sent from the first roller 111 to the second roller 112 to a position lower than the conveying height of the laminated object WK1. In the second configuration example, the third roller 113 operates as a driven roller during conveying of the laminated object WK1, and during a tension assist operation to increase the tension of the lower carrier film CFL, the third roller 113 increases the tension of the lower carrier film CFL by pulling the lower carrier film CFL further below the conveying position during the conveying operation to convey the laminated object WK1 into the laminate molding apparatus 10. The operation of the third roller 113 is controlled by the operation control unit CU.

[0028] 4 shows a diagram for explaining a third configuration and a third operation example of tension-assistant device 11 according to embodiment 1. As shown in FIG. 4, tension-assistant device 11 also has a first roller 111, a second roller 112, and a third roller 113 in the third configuration example.

[0029] In the third configuration example, the first roller 111 is a driven roller arranged on the unwinding device side (for example, the front stage) of the laminate molding apparatus 10. The second roller 112 is a driven roller arranged on the winding device side (for example, the rear stage) of the laminate molding apparatus 10. The third roller 113 is a driven roller that moves along an arc centered on the roller pivot center point. In the third configuration example, the third roller 113 moves in the opposite direction to the laminated body conveying direction along an arc centered on the roller pivot center point during a tension assist operation for increasing the tension of the lower carrier film CFL. In the third configuration example, the movement of the third roller 113 in this manner increases the tension of the lower carrier film CFL by pulling the lower carrier film CFL. The operation of the third roller 113 is controlled by the operation control unit CU.

[0030] 5 shows a diagram for explaining a fourth configuration and a fourth operation example of tension-assistant device 11 according to embodiment 1. As shown in FIG. 5, tension-assistant device 11 also has a first roller 111, a second roller 112, and a third roller 113 in the fourth configuration example.

[0031] In the fourth configuration example, the first roller 111 is a driven roller arranged on the unwinding device side (for example, the front stage) of the laminate molding apparatus 10. The second roller 112 is a driven roller arranged on the winding device side (for example, the rear stage) of the laminate molding apparatus 10. The third roller 113 is a driven roller that moves linearly in a direction having an angle θ with the vertical axis VX. Here, the angle θ is preferably in the range of 90°≦θ≦270° in order to increase the tension of the lower carrier film CFL. In the fourth configuration example, the third roller 113 moves linearly in a direction having an angle θ with the vertical axis VX during a tension assist operation that increases the tension of the lower carrier film CFL. In the fourth configuration example, the movement of the third roller 113 in this manner pulls the lower carrier film CFL to increase the tension of the lower carrier film CFL. The operation of the third roller 113 is controlled by the operation control unit CU.

[0032] 2 and 3, the tension assisting device 11 using three rollers has been described, but the tension assisting device 11 may have at least one roller for increasing the tension applied to the lower carrier film CFL. The roller may be supported on one side or both sides, may be supported by hanging from above, or may be supported by passing through a cross beam. In other words, the roller may be supported in any manner. In the configuration of the tension assisting device 11 shown in FIG. 2, the roller that exerts the driving force may be at least one of the first roller 111 and the second roller 112.

[0033] Furthermore, the diameters of the three rollers constituting the tension-assisting device 11 may all be the same, or at least one of them may be different. As an example of the diameters of the three rollers, the first roller 111 and the second roller 112 have the same diameter, and the third roller 113 has a diameter equal to or smaller than the other rollers. More preferably, the diameters of the first roller 111 and the second roller 112 are 0.2 to 1.9 times the diameter of the third roller 113. With such a configuration, space saving can be improved.

[0034] The material of the three rollers constituting the tension-assist device 11 is not particularly limited, and may be metal, resin, rubber, etc. At least one of the three rollers constituting the tension-assist device 11 may have an anti-slip material applied or attached to its surface. Furthermore, the three rollers constituting the tension-assist device 11 may be provided with a temperature control function. The temperature control function is preferably one that heats or cools the roller, and more preferably one that cools it.

[0035] Here, in the lamination molding system 1 according to the first embodiment, when performing the tension assist operation of the lower carrier film CFL, the operation control unit CU performs the following operation. When the clip device 12 is not present, the operation control unit CU instructs the tension assist device 11 to increase the tension of the lower carrier film CFL in a state where the laminated object WK2 is stopped at the position where it is pressed by the pressing unit. When the clip device 12 is present, the operation control unit CU instructs the tension assist device 11 to increase the tension of the lower carrier film CFL in a state where the laminated object WK1 is stopped at the position where it is pressed by the pressing unit and the pair of carrier films is fixed by the clip device 12. In the following explanation, the operation of the lamination molding system 1 in a state where the clip device 12 is present will be explained.

[0036] 6 shows a flowchart explaining the operation of the laminate molding system 1 according to the embodiment 1. Note that the operation of the laminate molding system 1 explained below is performed based on instructions from the operation control unit CU.

[0037] 6, in the lamination molding system 1, the subsequent operation is started in response to the placement of the laminated object WK1 on the placement stage 25 (step S1). In response to the placement of the laminated object WK1 on the placement stage 25 in step S1, the operation control unit CU instructs the lower supply roll 21 and the upper supply roll 23 to unwind a pair of carrier films and the lower recovery roll 31 and the upper recovery roll 33 to wind up a pair of carrier films, respectively, thereby carrying the laminated object WK1 into the lamination molding device 10 (step S2). Then, the carrying operation of step S2 is continued until the unwound amount of the carrier film reaches a specified amount, and in response to the unwound amount of the carrier film reaching the specified amount, the lower supply roll 21, the upper supply roll 23, the lower recovery roll 31, and the upper recovery roll 33 are instructed to stop unwinding the carrier film, thereby stopping the transport operation of the laminated object WK1 (steps S3 and S4). As a result, the laminated object WK1 becomes the laminated object WK2 placed at the stopped position.

[0038] Thereafter, the operation control unit CU instructs the clipping device 12 to clip the carrier film (step S5). Thereafter, the operation control unit CU instructs the tension assist device 11 to perform a tension assist operation to rewind the lower carrier film CFL (step S6). The operation control unit CU also continues the tension assist operation of step S6 until the rewinding amount of the lower carrier film CFL by the tension assist device 11 reaches a specified amount (step S7). Then, when the rewinding amount of the lower carrier film CFL reaches the specified amount, the operation control unit CU instructs the lamination molding device 10 to perform a vacuum lamination molding process (step S8).

[0039] In the vacuum laminate forming process in step S8, the following steps are performed: chamber closing to close the upper die 101 and the lower die 103, vacuum drawing to create a vacuum inside the closed chamber, laminate forming process to pressurize the laminated object WK2, vacuum release to release the vacuum inside the chamber, and chamber opening to open the upper die 101 and the lower die 103. After that, in response to the laminated object WK1 being placed on the placement stage 25 in S1, the operation control unit CU instructs the lower supply roll 21 and the upper supply roll 23 to unwind a pair of carrier films and the lower recovery roll 31 and the upper recovery roll 33 to take up the pair of carrier films, thereby transporting the laminated object WK2 out of the laminate forming apparatus 10 (step S9).

[0040] Next, the detailed arrangement of the tensioning auxiliary device 11 will be described. FIG. 7 shows a specific configuration diagram of the laminate molding system according to the first embodiment. As shown in FIG. 7, the laminate molding system 1 according to the first embodiment has a laminate molding device 10, an unwinding device 20, and a winding device 30. An upper mold 101, an upper pressure plate 102, a lower mold 103, and a lower pressure plate 104 are incorporated in the laminate molding device 10. In the example shown in FIG. 7, the tensioning auxiliary device 11 and the clip device 12 are incorporated in the laminate molding device 10. A lower supply roll 21, a driven roller 22, an upper supply roll 23, a driven roller 24, and a mounting stage 25 are incorporated in the unwinding device 20. A lower recovery roll 31, a driven roller 32, an upper recovery roll 33, a driven roller 34, and a recovery stage 35 are incorporated in the winding device 30. Note that the configuration incorporated in each device is a part of the structure that is actually incorporated. In addition, although the operation control unit CU is not explicitly shown in Figure 7, the operation control unit CU may be incorporated within the laminate molding apparatus 10, or may be incorporated in a housing separate from the laminate molding apparatus 10, the unwinding device 20, and the winding device 30.

[0041] As shown in Fig. 7, in the laminate molding system 1, the laminate molding device 10, the unwinding device 20, and the winding device 30 are arranged close to each other in order to shorten the length of the carrier film used for transportation as much as possible. Therefore, the tensioning assist device 11 and the clipping device 12 are incorporated in the narrow space between the upper mold 101 and the lower mold 103 of the laminate molding device 10. Of these, the upper mold 101 is a fixed type, and the lower mold 103 is a movable type. Therefore, considering the space between the upper mold 101 and the lower mold 103, it is desirable that the tensioning assist device 11 is fastened to the upper mold 101 by a bolt or the like. Fig. 7 shows an enlarged view of the portion where the tensioning assist device 11 and the clipping device 12 are incorporated.

[0042] In the laminate molding apparatus 10, a shutter 107 is provided to the lower die 103, and the chamber is formed by raising the lower die 103 equipped with the shutter 107. Then, when the chamber is formed, a pair of carrier films is sandwiched between the upper die 101 and the shutter 107. After that, in the laminate molding apparatus 10, the lower die 103 is raised to pressurize the laminated body WK2. Since such a pressurizing operation is performed, the tension assisting device 11 needs to be stored at a height that does not contact the lower die 103 after maximum elevation and at a position lower than the conveying position of the laminated body formed of the carrier film. In such a case, by making the tension assisting device 11 into the first configuration example shown in FIG. 2, the vertical height of the tension assisting device 11 can be suppressed. In other words, the first configuration example of the tension assisting device 11 has the advantage of being able to be installed in a narrow position. On the other hand, when the tension assisting device 11 is configured as in the second example, although space is required to move the third roller 113 up and down, there is an advantage in that the configuration of the tension assisting device 11 can be simplified because no driving force in the rotational direction is required.

[0043] In addition, by configuring the clip device 12 so that it presses the carrier film from above the upper carrier film CFU against a table placed below the lower carrier film CFL, it becomes possible to install the clip device 12 in the narrow space between the upper mold 101 and the upper mold carrier film CFU.

[0044] In addition, Figure 7 shows an example in which a table and clip device 26 that holds a pair of carrier films is provided in the unwinding device 20. By providing the table and clip device 26, it is possible to reduce the driving force of the third roller 113 when the tension assisting device 11 performs tension assisting operation.

[0045] As described above, in the laminate molding system 1 according to the first embodiment, it is possible to suppress the bending of the lower carrier film CFL by using the tensioning auxiliary device 11. At this time, by disposing the tensioning auxiliary device 11 at a position where no other structure is between it and the pressure applying unit (for example, a position immediately before the pressure applying unit), it becomes possible to efficiently apply tension to the lower carrier film CFL.

[0046] Here, the carrier film is often a resin film such as PET (polyethylene terephthalate resin). Since such resin films are subject to stretching due to tension, as described above, by providing the tension assisting device 11 as close as possible to the pressing unit, it becomes possible to efficiently apply tension to the lower carrier film CFL. Here, the distance between the surface of the roller that is closest to the pressing unit among the rollers constituting the tension assisting device 11 and the end of the pressing unit on the tension assisting device side is preferably within 500 mm, and more preferably within 100 mm.

[0047] In addition, by providing the clip device 12 at a position opposite the tension auxiliary device 11 across the pressure application section, the point from which the tension starts can be located closer to the pressure application section than the lower recovery roll 31 or the driven roller 32, thereby further increasing the efficiency of applying tension to the lower carrier film CFL.

[0048] Therefore, by suppressing the sagging of the lower carrier film CFL using the tension assist device 11 as in the lamination molding system 1, the positional accuracy of the laminated body WK2 is improved, and it is possible to improve the accuracy of lamination molding.

[0049] Here, a diagram for explaining the deflection of the lower carrier film CFL in FIG. 8 is shown, and the deflection of the lower carrier film CFL will be described in detail. In FIG. 8, the upper diagram shows a diagram for explaining the deflection of the lower carrier film CFL in a comparative example without using the tension assisting device 11, and the lower diagram shows a diagram for explaining the deflection of the lower carrier film CFL in the lamination forming system 1 according to Embodiment 1 having the tension assisting device 11. Further, in FIG. 8, an example is shown in which both the lamination forming system 1 according to Embodiment 1 and the lamination forming system according to the comparative example have the clip device 26 provided on the winding device 20 side.

[0050] As shown in the upper diagram of FIG. 8, in the lamination forming system according to the comparative example, the distance L1 between the center position CENT of the laminate WK2 that has reached the preset stop position and the end of the table that is the fulcrum on the film conveyance source side is much longer than the distance L0 between the center position CENT and the end of the table that is the fulcrum on the film conveyance destination side. That is, in the lamination forming system according to the comparative example, L0 < L1. Therefore, in the lamination forming system according to the comparative example, due to the balance between the center position of the laminate WK2 that has reached the stop position and the distances L0 and L1, the laminate WK2 is greatly inclined and the displacement of the laminate WK2 occurs. Also, in FIG. 8, the maximum deflection amount in the lamination forming system according to the comparative example is shown as DL0.

[0051] On the other hand, in the lamination forming system 1 according to Embodiment 1 shown in the lower diagram of FIG. 8, by arranging the tension assisting device 11 near the chamber, the distance L2 between the center position CENT of the laminate WK2 and the end of the second roller 112, which is the position closest to the chamber of the tension assisting device 11 and serves as the fulcrum on the film conveyance source side, becomes substantially the same as the distance L0 between the center position CENT and the end of the table that serves as the fulcrum on the film conveyance destination side. Thereby, since the center position CENT of the laminate WK2 comes to the center between the center position CENT and the fulcrum on the film conveyance source side and the center position CENT and the fulcrum on the film conveyance destination side, the inclination of the laminate WK2 is suppressed. And the maximum deflection amount of the lower carrier film CFL on which the laminate WK2 is placed also becomes DL1, which is smaller than DL0.

[0052] In this way, by disposing the tension-assist device 11 near the chamber, it is possible to suppress the inclination of the laminated object WK2 and effectively suppress the deflection of the lower carrier film CFL. Also, as shown in the lower diagram of Fig. 8, the tension-assist device 11 can suppress the inclination of the laminated object WK2 even when there is only one second roller 112 and it has no driving force. And, by having the tension-assist device 11 have a third roller 113 having a driving force as shown in Figs. 2 and 3, the deflection suppression effect can be further improved.

[0053] Furthermore, the tension-assistant device 11 is preferably disposed between the end of the shutter 107 and the end of the upper die 101 when viewed from the winding device 30 toward the unwinding device 20 in order to reduce the difference between the distances L2 and L0 as described above. That is, the tension-assistant device 11 is preferably disposed within 100 mm, and more preferably within 50 mm, of the end of the shutter 107. Here, a more preferable arrangement of the tension-assistant device 11 is shown in FIG. 9. FIG. 9 is a diagram for explaining an example of the arrangement of the tension-assistant device 11 and the clip device 12.

[0054] As shown in FIG. 9, the laminate molding apparatus 10 is provided with tie bars 108 penetrating the upper mold 101 and the lower mold 103. The tie bars 108 are arranged, for example, at the four corners of the chamber. The second roller 112 of the tensioning assisting device 11 is arranged so that at least a part of the second roller 112 overlaps with an area A (projection area of ​​the tie bars 108) that connects the outer peripheries of the tie bars 108 that are arranged opposite to each other in a direction perpendicular to the carrier film transport direction. In other words, the fulcrum at which the tensioning assisting device 11 supports the lower carrier film CFL is set at a position that overlaps with an area A (projection area of ​​the tie bars 108) that connects the outer peripheries of two tie bars 108 that are arranged opposite to each other in a direction perpendicular to the transport direction of the lower carrier film CFL among the tie bars 108 provided on the outer periphery side of the pressure unit in the laminate molding apparatus 10. Also, for region B which faces region A in a line symmetrical manner, a first roller 111 of the tension-assist device 11 may be further arranged so that at least a part of the first roller 111 of the tension-assist device 11 overlaps region B. In other words, the fulcrums supporting the lower carrier film CFL by two or more tension-assist devices 11 may be set at positions overlapping with each of region A and region B which are line symmetrical with respect to the pressure unit of the lamination molding apparatus 10. By arranging the tension-assist devices 11 in this manner, the difference between the distance L2 and the distance L0 becomes smaller, and the amount of deflection of the lower carrier film CFL can be further suppressed.

[0055] Embodiment 2 In the second embodiment, a laminate molding system 2 will be described which is a modified example of the laminate molding system 1 according to the first embodiment. In the description of the second embodiment, the same components as those in the first embodiment will be denoted by the same reference numerals as those in the first embodiment, and the description thereof will be omitted.

[0056] Fig. 10 shows a configuration diagram for explaining an overview of the laminate molding system 2 according to the embodiment 2. As shown in Fig. 10, in the laminate molding system 2 according to the embodiment 2, the arrangement of the tension assist device 11 and the clip device 12 is reversed from that of the laminate molding system 1 according to the embodiment 1.

[0057] In this way, even if the tension-assisting device 11 and the clip device 12 are reversed, it is possible to apply tension to the lower carrier film CFL in the same manner as in the lamination molding system 1 according to the first embodiment.

[0058] That is, in the laminate molding system described in this specification, the tension assist device 11 only needs to be disposed on at least one of the unwinding device 20 side and the winding device 30 side of the pressure applying unit of the laminate molding apparatus 10. Also, in the laminate molding system 2 according to the second embodiment, the tension assist device 11 can be disposed preferably within 500 mm, and more preferably within 100 mm, of the end of the pressure applying unit of the laminate molding apparatus 10 to suppress the amount of deflection of the lower carrier film CFL.

[0059] Third embodiment In the third embodiment, a laminate molding system 3 will be described which is a modified example of the laminate molding system 1 according to the first embodiment. In the description of the third embodiment, the same components as those in the first embodiment will be denoted by the same reference numerals as those in the first embodiment, and the description thereof will be omitted.

[0060] Fig. 11 shows a configuration diagram of a laminate molding system according to the third embodiment. As shown in Fig. 11, in the laminate molding system 3, at least one press device is disposed between the laminate molding device 10 and the winding device 30. The press device further applies a pressure to the laminated body discharged from the laminate molding device 10. In the example shown in Fig. 11, a press device 40 and a press device 50 are provided between the laminate molding device 10 and the winding device 30.

[0061] The press device 40 applies pressure to the laminated body with an upper pressure platen 402 provided on an upper die 401 and a lower pressure platen 404 provided on a lower die 403. The press device 50 applies pressure to the laminated body with an upper pressure platen 502 provided on an upper die 501 and a lower pressure platen 504 provided on a lower die 503. By providing one or more press devices in the rear stage of the laminate molding device 10 in this manner, the flatness of the laminate molding surface can be improved in stages.

[0062] On the other hand, if the press devices 40, 50 are provided between the lamination molding device 10 and the winding device 30, the distance from the unwinding device 20 to the winding device 30 becomes even greater, and the amount of bending of the lower carrier film CFL increases. However, by providing a tensioning auxiliary device 11 to the lamination molding device 10 and the press devices 40, 50, the amount of bending of the lower carrier film CFL can be suppressed. In this case, by providing a tensioning auxiliary device 11 that generates a driving force, the amount of bending of the lower carrier film CFL can be further suppressed.

[0063] Furthermore, as shown in FIG. 11, by providing clip devices 42, 52 for the press device 40 and the press device 50, respectively, it is possible to suppress an increase in the amount of deflection in the press devices.

[0064] The present invention is not limited to the above-described embodiment, and can be modified as appropriate without departing from the spirit and scope of the present invention. [Explanation of symbols]

[0065] 1~3 Laminated molding system 10 Lamination molding equipment 101, 401, 501 upper mold 102, 402, 502 Upper pressure plate 103, 403, 503 lower mold 104, 404, 504 Lower pressure plate 105 Ram 106 Pressure generating device 107 Shutter 108 Thaiba 11 Tension assist device 111 First Roller 112 The Second Roller 113 The Third Roller 12, 26, 42, 52 Clip device 20 Unwinding device 21 Lower supply roll 22, 24, 32, 34 Driven roller 23 Upper supply roll 25 Mounting stage 26 Clipping device 30 Winding device 31 Lower recovery roll 33 Upper recovery roll 35 Recovery Stage 40, 50 Press equipment WK1, WK2 laminated body WK3 laminate CFU Upper Carrier Film CFL bottom carrier film CU Operation Control Unit

Claims

1. an unwinding device that unwinds a carrier film that conveys the laminated body; a lamination molding device for performing a lamination molding step of pressing the laminated body with a pressing part; a winding device that winds up the carrier film to carry out the laminated body after the lamination molding process from the lamination molding device; a tension assist device disposed between the lamination molding device and the unwinding device or between the lamination molding device and the winding device, the tension assist device supporting a lower surface of the carrier film; and an operation control device that instructs the tension assisting device to increase the tension of the carrier film while the laminated body is stopped at a pressure position applied by the pressure unit, The tension assisting device is a lamination molding system that increases the tension applied to the carrier film in accordance with instructions from the motion control device.

2. The lamination molding system according to claim 1 , wherein the tension assist device is disposed at a position where no structure is interposed between the pressure unit and the tension assist device.

3. The pressure applying unit is A chamber capable of maintaining an internal space in a reduced pressure state reduced from the outside; a pressure mechanism provided in the chamber and configured to apply pressure to the laminate; The lamination molding system of claim 1 ,

4. The laminate molding system described in claim 1, wherein at least a portion of the member that creates a fulcrum for supporting the carrier film by the tension assist device is set at a position that overlaps with a projected area of ​​the outer periphery of two tie bars that are arranged opposite each other in a direction perpendicular to the conveying direction of the carrier film, among the tie bars provided on the outer periphery side of the pressure section in the laminate molding device.

5. An unwinding device that unwinds a carrier film that transports a laminated body; a lamination molding device for performing a lamination molding step of pressing the laminated body with a pressing part; a winding device that winds up the carrier film to carry out the laminated body after the lamination molding process from the lamination molding device; a tension assist device that is disposed at least one of between the lamination molding device and the unwinding device and between the lamination molding device and the winding device and supports a lower surface of the carrier film; The tension assist device is A first roller disposed on the unwinding device side; A second roller disposed on the winding device side; a third roller that diverts the carrier film fed from the first roller to the second roller to a position below the conveying height of the laminated material.

6. The laminate molding system according to claim 5 , wherein the third roller increases the tension of the carrier film by rotating in a rotation direction that pulls the carrier film in a direction opposite to the conveying direction of the laminated body.

7. The laminate molding system described in claim 5, wherein the third roller increases the tension of the carrier film by pulling the carrier film further downward than the transport position during the loading operation of loading the laminate into the laminate molding device.

8. At least one press device is disposed between the lamination molding device and the winding device to further apply a pressure to the laminated body discharged from the lamination molding device, The lamination molding system according to claim 1 or 5, wherein the tension assist device is disposed in at least one of the lamination molding device and the press device.

9. an unwinding device that unwinds a carrier film that conveys the laminated body; A lamination molding apparatus that performs a lamination molding step of pressing the laminated body with a pressing part so as to laminate at least one surface of the laminated body and a lamination film; a winding device that winds up the carrier film to carry out the laminated body after the lamination molding process from the lamination molding device; a tension assist device disposed between the lamination molding device and the unwinding device or between the lamination molding device and the winding device, the tension assist device supporting a lower surface of the carrier film; an operation control device that instructs the tension assist device to increase the tension of the carrier film while the laminated body is stopped at a position where the pressure is applied by the pressure unit; A lamination molding method for a laminated object in a lamination molding system having the following features: A lamination molding method in which, while the laminated object is stopped at a stop position set in the pressure applying section, the tension of the carrier film is increased by the tension assisting device based on instructions from the tension assisting device, and then the laminated object is pressed.

10. The lamination molding method according to claim 9 , wherein the tension of the carrier film is increased so that the tension applied to the laminate in the conveying direction of the laminate is substantially the same before and after the conveying direction.

11. An unwinding device that unwinds a carrier film that conveys a laminated body; A lamination molding apparatus that performs a lamination molding step of pressing the laminated body with a pressing part so as to laminate at least one surface of the laminated body and a lamination film; a winding device that winds up the carrier film to carry out the laminated body after the lamination molding process from the lamination molding device; a tension assist device disposed between the lamination molding device and the unwinding device or between the lamination molding device and the winding device, the tension assist device supporting a lower surface of the carrier film; A lamination molding method for a laminated object in a lamination molding system having the following features: In a state where the laminated object is stopped at a stop position set in the pressing unit, the tension of the carrier film is increased and the laminated object is pressed, The tension assist device is A first roller disposed on the unwinding device side; A second roller disposed on the winding device side; a third roller that diverts the carrier film sent from the first roller to the second roller to a position below the conveying height of the laminated material.

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