Transport System

Abstract

To provide an improved transfer system for transferring substrates between processing tools.SOLUTION: A substrate processing and transfer (SPT) system 200 includes a transport system that connects two processing tools 202a, 202b. The transport system includes a vacuum tunnel 102 that transports substrates between the processing tools. The vacuum tunnel includes a substrate transport carriage 106 to move a substrate through the vacuum tunnel. The SPT system is configured to allow a user to add or remove processing chambers, depending on processing chambers 206a to 206n required for a desired substrate processing procedure.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001]

[0001] This application relates generally to apparatus, and more specifically, to transport systems. [Background technology]

[0002]

[0002] The manufacture of semiconductor devices typically involves performing a series of procedures on a substrate or wafer, such as a silicon substrate, a glass plate, etc. These steps may include polishing, deposition, etching, photolithography, thermal treatment, etc. Typically, several different processing steps may be performed in a single processing system or tool that includes multiple processing chambers. However, other processes are typically performed at other processing locations within the manufacturing facility, thus requiring the substrate to be transported from one processing location to another within the manufacturing facility. Depending on the type of semiconductor device being manufactured, a relatively large number of processing steps may be performed at many different processing locations within the manufacturing facility.

[0003]

[0003] It is common to transport substrates from one processing location to another in substrate carriers, such as sealed pods, cassettes, containers, etc. It is also common to include automated substrate carrier transport devices, such as automated guided vehicles, overhead transport systems, substrate carrier handling robots, etc., to move the substrate carriers from one location to another within the manufacturing facility and to transfer the substrate carriers to and from the substrate carrier transport devices.

[0004]

[0004] Such transport of the substrate typically involves exposing the substrate to room air, or at least to non-vacuum conditions, both of which can expose the substrate to undesirable environments (e.g., oxidizing species) and / or contaminants.

[0005] Therefore, what is needed is an improved transfer system for transferring substrates between processing tools. Summary of the Invention

[0006]

[0006] The embodiments disclosed herein include a transfer system and a substrate processing and transfer (SPT) system. The transfer and SPT systems include vacuum tunnels, carriages, and other features that help protect the substrate from hostile environments.

[0007] In one embodiment, a transfer system is provided that includes a vacuum tunnel configured to interface with a first processing tool and a second processing tool. The vacuum tunnel includes an extension region, a substrate transport carriage, and a rotation stage disposed in the extension region. The rotation stage is configured to rotate the substrate transport carriage between about 0 degrees and about 180 degrees. The substrate transport carriage includes a carriage body and an end effector coupled to the carriage body. The end effector is configured to support the substrate during transfer within the vacuum tunnel. The end effector is configured to extend into the first or second processing tool to retrieve or place the substrate while the carriage body remains within the vacuum tunnel.

[0008] In another embodiment, a substrate processing and transfer (SPT) system is provided that includes a first processing tool and a second processing tool, each processing tool including a transfer chamber configured to couple to one or more processing chambers, a load lock chamber having a first access opening configured to receive a substrate from an equipment front-end module, a second access opening configured to transfer a substrate to / from the transfer chamber of the first processing tool, and a third access opening, and a vacuum tunnel coupled between the third access opening of the first processing tool and the third access opening of the second processing tool. The vacuum tunnel includes a substrate transfer carriage. The substrate support carriage includes a carriage body and an end effector coupled to the carriage body. The end effector is configured to support the substrate during transfer in the vacuum tunnel and extend into the load lock chambers of the first and second processing tools using the third access openings of the first and second processing tools, respectively.

[0009] In yet another embodiment, a transport system is provided that includes a vacuum tunnel configured to extend between a first processing tool and a second processing tool, the vacuum tunnel including a substrate transport carriage, a first elevator unit disposed near the first processing tool to enable transport of the substrate transport carriage between the first processing tool and the vacuum tunnel, a second elevator unit disposed near the second processing tool to enable transport of the substrate transport carriage between the first processing tool and the vacuum tunnel, and an emergency brake system configured to prevent the substrate transport carriage system in the first or second elevator unit from falling during a loss of electrical power. The vacuum tunnel is disposed above the first and second processing tools.

[0010]

[0010] So that the above-mentioned features of the present disclosure may be understood in detail, a more particular description of the present disclosure briefly summarized above may be obtained by reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the accompanying drawings illustrate only exemplary embodiments of the present disclosure and therefore should not be considered as limiting its scope, since the present disclosure may be applied to other equally effective embodiments. [Brief description of the drawings]

[0011] [Figure 1] 1 illustrates a top schematic view of a transport system according to one embodiment. [Diagram 2] 1 illustrates a top-down schematic view of a substrate processing and transport (SPT) system, according to one embodiment. [Diagram 3] 1 illustrates a load lock chamber, according to one embodiment. [Figure 4A] 1 illustrates a schematic front view of a transport system according to one embodiment. [Figure 4B] 1 illustrates a schematic side view of a transport system, according to one embodiment. [Figure 4C]1 illustrates a schematic front view of a transport system according to one embodiment. [Figure 4D] 1 illustrates a schematic side view of a transport system, according to one embodiment. [Figure 4E] 1 illustrates a side view of a magnetic levitation system, according to one embodiment. [Figure 5A] 1 illustrates a side view of an elevator unit, according to one embodiment. [Figure 5B] 1 illustrates a top view of an elevator unit, according to one embodiment. [Figure 5C] 1 illustrates a close-up view of a tab, according to one embodiment. [Figure 5D] 1 illustrates a close-up view of a tab, according to one embodiment. [Figure 6] 1 illustrates a top schematic view of an SPT system, according to one embodiment. [Figure 7] 1 illustrates a top schematic view of an SPT system, according to one embodiment. [Figure 8] 1 illustrates a top schematic view of an SPT system, according to one embodiment. [Figure 9] 1 illustrates a top schematic view of an SPT system, according to one embodiment. [Figure 10] 1 illustrates a top schematic view of an SPT system, according to one embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012]

[0027] For ease of understanding, the same reference numbers have been used, where possible, to designate identical elements common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0013]

[0028] According to the embodiments described herein, one or more processing tools are coupled via one or more vacuum tunnels. Such a system allows substrates to be transported under vacuum to various chamber locations of multiple processing tools, effectively increasing the number of available high vacuum or clean chamber locations (e.g., faceting). Normally, such processing tools are used as separate stand-alone processing tools that operate independently of each other.

[0014]

[0029] In some embodiments, the substrate is transferred between a load lock chamber of a first processing tool and a load lock chamber of a second processing tool using a vacuum tunnel. For example, the transfer of the substrate is performed at the same height level as the processing tools or at a different height (e.g., above the processing tools). In some embodiments, the vacuum tunnel allows metrology and / or inspection to be performed on the substrate as it is transferred between the processing tools. In one or more embodiments, magnetic levitation (maglev) is used to transport the substrate in the vacuum tunnel between the processing tools.

[0015]

[0030] As used herein, the term "about" refers to a + / - 10% variation from the stated value. It should be understood that such a variation can be included in any value provided herein.

[0016]

[0031] 1A-1E show a top schematic view of a transfer system 100, according to one embodiment. The transfer system 100 is configured to transfer substrates between multiple processing tools. As shown, the transfer system 100 includes a vacuum tunnel 102. The vacuum tunnel 102 is configured to extend between a first processing tool 104a and a second processing tool 104b. The processing tools 104a, 104b may be any suitable processing tools, such as an Endura2 mainframe available from Applied Materials, Inc. of Santa Clara, Calif., a Centura ACP mainframe also available from Applied Materials, Inc., etc. Other processing tools and / or mainframes may be used.

[0017]

[0032] The processing tools 104a, 104b can include processing chambers coupled to a transfer chamber, equipment front-end modules, load lock chambers, pre-processing chambers, etc. (described further below). Exemplary processing chambers include deposition chambers (e.g., physical vapor deposition, chemical vapor deposition, plasma enhanced chemical vapor deposition, etc.), etch chambers, degassing chambers, and / or any other type of processing chamber. Any number of processing chambers can perform the same or different processes.

[0018]

[0033] In general, the vacuum tunnel 102 may be coupled to an equipment front end module, a load lock chamber, a transfer chamber, a processing chamber, or elsewhere in a processing tool. An example of a vacuum level for the vacuum tunnel 102 is about 10 -10 Torr to about 760 Torr, although other vacuum levels may be used.

[0019]

[0034] As shown, the vacuum tunnel 102 includes a substrate transport carriage 106 having a carriage body 108 and an end effector 110 coupled to the carriage body 108. The end effector 110 is configured to support the substrate 112 during transport within the vacuum tunnel 102. The end effector 110 is configured to extend into the first or second processing tool 104a, 104b to retrieve or place the substrate 112 while the carriage body 108 remains fully or partially within the vacuum tunnel 102. For example, the end effector 110 is long enough to extend into a load lock chamber, processing chamber, transfer chamber, or other location within the processing tool 104a, 104b to receive or place the substrate while the remainder of the substrate transport carriage 106 remains within the vacuum tunnel 102. In some embodiments, the substrate transport carriage 106 is raised or lowered (e.g., via a z-axis motor, increasing the magnetic field strength in a magnetic levitation system, etc.) to facilitate transfer of the substrate to or removal from the processing tools 104a or 104b. In other embodiments, the substrate transport carriage 106 relies on z-axis motion provided by lift pins, a robot, etc. within the processing tools 104a and / or 104b during substrate pick-up and / or placement operations.

[0020]

[0035] In some embodiments, the vacuum tunnel 102 includes an expansion region 114 having a rotation stage 116 configured to rotate the substrate transport carriage 106 through a desired range of angles (e.g., between 0 and 180 degrees in some embodiments). This allows the end effector 110 to be rotated to face either the processing tool 104a or the processing tool 104b. Figures 1A-1E show examples of the movement of the substrate transport carriage 106, the end effector 110, and the substrate 112 during the transfer of the substrate 112 from the processing tool 104a to the processing tool 104b.

[0021]

[0036] In some embodiments, the transport system 100 includes a metrology or inspection tool 118 positioned relative to the vacuum tunnel 102 to enable metrology or inspection of the substrate 112 disposed on the end effector 110 while the substrate transport carriage 106 is rotated by the rotation stage 116. For example, the metrology tool 118 is configured to measure film thickness, film uniformity, substrate defect levels, perform edge inspection, and the like. In other embodiments, the metrology tool 118 is configured to locate notches, realign the substrate, and the like. Other metrology and / or inspection tools can also be used. In still other embodiments, the metrology tool 118 or another tool is used for other processes within the extension region 114 of the vacuum tunnel 102, such as substrate degassing, substrate cooling, pre-cleaning, and the like.

[0022]

[0037] In some embodiments, the transport system 100 includes a magnetic levitation system 120 configured to levitate the substrate transport carriage 106 and move the substrate transport carriage 106 between the first processing tool 104a and the second processing tool 104b. For example, the substrate transport carriage 106 includes a plurality of permanent magnets and / or other magnets that repel permanent magnets and / or other magnets used by a drive mechanism that in some embodiments is located outside the vacuum tunnel 102. Electromagnets can be configured to facilitate control of the movement and / or positioning of the substrate transport carriage 106. A controller 122, such as one or more microcontrollers, programmable logic controllers, dedicated hardware and / or software, can be configured to control the operation of one or more of the metrology tools 118, the magnetic levitation system 120, the vacuum tunnel 102, etc.

[0023]

[0038] In operation, the substrate transport carriage 106 can be configured to retrieve the substrate 112 from the first processing tool 104a by extending the end effector 110 from the vacuum tunnel 102 into the processing tool 104a. For example, the end effector 110 extends into a load lock chamber, a transfer chamber, a processing chamber, etc. of the processing tool 104a to retrieve the substrate 112 (e.g., with or without z-motion provided by the substrate transport carriage 106). The substrate transport carriage 106 then moves toward the processing tool 104b and rotates an appropriate amount within the extension region 114 so that the end effector 110 is oriented to extend into the processing tool 104b. The substrate transport carriage 106 rotates approximately 180 degrees so that the end effector 110 faces the processing tool 104b. In other embodiments where the processing tools 104a, 104b are not arranged along a straight line, other rotation angles (eg, 45 degrees, 90 degrees, etc.) can be used.

[0024]

[0039] During rotation of the substrate transport carriage 106, the metrology tool 118 may perform one or more metrology, inspection, or other measurements on the substrate 112. Additionally or alternatively, other processes may be performed within the expansion region 114 (e.g., degassing, pre-cleaning, cooling, etc.).

[0025]

[0040] Once the end effector 110 faces the processing tool 104b, the substrate transport carriage 106 can move to place the substrate 112 within the processing tool 104b. For example, the end effector 110 can extend into a load lock chamber, transfer chamber, processing chamber, etc. of the processing tool 104b to place the substrate 112 therein (e.g., with or without z-motion provided by the substrate transport carriage 106).

[0026]

[0041] 2 illustrates a top schematic view of a substrate processing and transfer (SPT) system 200, according to one embodiment. As shown, the SPT system 200 includes two processing tools 202a, 202b. For example, the processing tools 202a, 202b may be Endura2 systems available from Applied Materials, Inc., or another suitable processing tool (e.g., a single or dual transfer chamber processing tool). The SPT system 200 is configured to move a substrate between the two processing tools 202a, 202b.

[0027]

[0042] As shown, the processing tool 202a includes processing chambers 206a-g coupled to transfer chambers 208a and 208b, and load lock chambers 210a, 210b coupled between the transfer chamber 208a and the equipment front end module (EFEM) 212. As shown, the processing tool 202b includes processing chambers 202h-n coupled to transfer chambers 214a and 214b, and load lock chambers 216a, 216b coupled between the transfer chamber 214a and the EFEM 218. In some embodiments, the processing tools 202a and / or 202b include degassing and / or pre-cleaning chambers 220a, 220b, respectively. Other numbers and / or types of chambers may also be used. The processing tools 202a, 202b are configured to move a substrate around the various chambers of the processing tool, allowing the substrate to be processed in each of the individual processing chambers.

[0028]

[0043] The processing chambers 206a-n can be any type of processing chamber, such as a deposition chamber (e.g., physical vapor deposition, chemical vapor deposition, plasma enhanced chemical vapor deposition, etc.), an etch chamber, a degassing chamber, and / or any other type of processing chamber. Any number of the processing chambers 206a-n can perform the same or different processes.

[0029]

[0044] The processing tools 202a, 202b are coupled via a vacuum tunnel 102. For example, the vacuum tunnel 102 couples the load lock chamber 210b of the processing tool 202a to the load lock chamber 216b of the processing tool 202b. In some embodiments, the load lock chamber 210b has a first access opening configured to receive or supply a substrate from the EFEM 212, a second access opening configured to transfer a substrate to or from the transfer chamber 208a of the first processing tool 202a, and a third access opening coupled to the vacuum tunnel 102. Similarly, the load lock chamber 216b has a first access opening configured to receive or supply a substrate from or to the EFEM 218, a second opening configured to transfer a substrate to or from the transfer chamber 214a of the second processing tool 202b, and a third access opening coupled to the vacuum tunnel 102.

[0030]

[0045] 3 illustrates a load lock chamber 300, according to one embodiment. The load lock chamber 300 can be used for either the load lock chamber 210b or 216b of FIG. 2. The load lock chamber 300 is configured to receive a substrate from a processing tool 202a, 202b. As shown, the load lock chamber 300 includes a first access opening 302 configured to receive and / or provide a substrate from an EFEM (e.g., 212), a second access opening 304 configured to transfer a substrate to and / or from a transfer chamber (e.g., 208a), and a third access opening 306 configured to couple to a vacuum tunnel 102.

[0031]

[0046] 2, the vacuum tunnel 102 can include an expansion region 114 that includes a rotation stage 116. The rotation stage 116 is configured to rotate the substrate transport carriage 106 between about 0 degrees and about 180 degrees, thereby allowing the end effector 110 to be rotated and aimed at either the processing tool 202a or the processing tool 202b.

[0032]

[0047] In some embodiments, the metrology tools 118 are positioned relative to the vacuum tunnel 102 to enable measurement and / or inspection of a substrate disposed on the end effector 110 while the substrate transport carriage 106 is positioned in the extension region 114 and / or rotated by the rotation stage 116. Exemplary metrology tools 118 include tools that measure film thickness, film uniformity, substrate defect levels, edge characteristics, etc., as well as notch finders, substrate aligners and / or reorienters that determine and / or adjust the alignment / orientation of the substrate as it passes between the processing tools 202a, 202b, etc. The vacuum tunnel 102 can transfer substrates between the processing tools 202a, 202b at the same height as the processing tools 202a, 202b or at different heights.

[0033]

[0048] FIG. 4A shows a front schematic view of the transport system 400 according to one embodiment. FIG. 4B shows a side schematic view of the transport system 400 according to one embodiment. The vacuum tunnel 102 is disposed above the processing tools 202a, 202b. The elevator unit 402a can be configured to transfer the substrate transport carriage 106 between the processing tool 202a and the vacuum tunnel 102. Similarly, the elevator unit 402b can be included to transfer the substrate transport carriage 106 between the processing tool 202b and the vacuum tunnel 102. The elevator units 402a, 402b can include mechanical, magnetic levitation, or other lift mechanisms. As shown, the orientation change modules 404a, 404b can be configured to change the orientation of the substrate transport carriage 106 from along the y-axis (vertical) to along the x-axis (horizontal) and / or vice versa (e.g., using a suitable transfer or handoff operation). In some embodiments, the elevator units 402a, 402b and / or the direction changing modules 404a, 404b are maintained at a vacuum level similar to the vacuum level of the vacuum tunnel 102.

[0034]

[0049] FIG. 4C shows a front schematic view of the transport system 401, according to one embodiment. FIG. 4D shows a side schematic view of the transport system 401, according to one embodiment. The transport system 401 includes vacuum tunnels 102a, 102b stacked at different heights. The transport system 401 includes a metrology tool 118 in one of the elevator units 402a, 402b. A number of additional redirection modules 404a-e are shown. Such elevated vacuum tunnels 102a and / or 102b can be included in any transport system described herein. For example, in some embodiments, the load lock chamber 300 (FIG. 3) includes an access opening that allows the substrate to be accessed from the top of the load lock chamber 300. Additional stacked and / or elevated vacuum tunnels can be included (e.g., three, four, five, etc. vacuum tunnels).

[0035]

[0050] Returning to FIG. 4A, an elevator unit 402a located near the first processing tool 202a allows the substrate transport carriage 106 to be transported between the first processing tool 202a and the vacuum tunnel 102. An elevator unit 402b located near the second processing tool 202b allows the substrate transport carriage 106 to be transported between the second processing tool 202b and the vacuum tunnel 102. In FIG. 4C and FIG. 4D, an additional vacuum tunnel 102b is located above the processing tools and is accessible by the first and second elevator units 402a, 402b. The substrate transport carriage 106 can also be configured to support more than one substrate.

[0036]

[0051] 4E illustrates a side view of the magnetic levitation system 120, according to one embodiment. As shown, the magnetic levitation system 120 includes a passive mover 424 including an upper end effector 466 and a lower end effector 468. The two end effectors allow for the rapid removal of a substrate from a load lock or other chamber and the rapid placement of another substrate into the load lock or other chamber, although fewer or more end effectors may be included. In some embodiments, a plurality of permanent magnets and / or other magnets 460 are disposed within the lower end effector 468. The magnets 460 are repelled by magnets 462 disposed on a shelf 472. For example, the shelf 472 is attached to a horizontal magnetic levitation track 464 or is disposed in a fixed position relative to the horizontal magnetic levitation track 464. The horizontal magnetic levitation track 464 may include a drive coil and a position sensor (not shown) for moving the passive mover 424 via magnetic forces. In some embodiments, the horizontal magnetic levitation track 464 (and / or drive coils and / or position sensors) are located outside of the vacuum region that contains the passive mover 424 and the end effectors 466, 468. For example, the track 464 is in an atmospheric environment.

[0037]

[0052] The shelf 472 includes an upper surface 474 that, in some embodiments, intersects the horizontal magnetic levitation track 464 at an angle less than 90° or is parallel to a plane that intersects the horizontal magnetic levitation track 464 at an angle less than 90°. The lower end effector 468 has a lower surface 476 that can be parallel to the upper surface 474 of the shelf 472.

[0038]

[0053] In operation, the passive mover 424 is maintained in a vertical position away from the shelf 472 by the magnets 460, 462. The vertical position can be maintained regardless of whether power is applied to the magnetic levitation system 120. Magnets (not shown) in the passive mover 424 and the horizontal magnetic levitation track 464 maintain the gap 480 between the horizontal magnetic levitation track 464 and the passive mover 424. In the event of a power loss, the horizontal magnetic levitation track 464 is unable to maintain the gap 480 between the horizontal magnetic levitation track 464 and the passive mover 424. In that case, the inclination of the upper surface 474 and the lower surface 476 will move the passive mover 424 towards the horizontal magnetic levitation track 464, where the passive mover 424 will contact the horizontal magnetic levitation track 464 and will be prevented from moving (e.g., horizontally) by friction. The passive mover 424 will remain supported vertically by magnetic forces.

[0039]

[0054] In some embodiments, the horizontal maglev track 464 is curved so that the passive mover 424 is not constrained by the horizontal maglev track 464 as long as the gap 480 is maintained.

[0040]

[0055] While the passive mover 424 with end effectors 466, 468 is supported by a permanent magnetic field, the passive mover 424 can be driven horizontally along a horizontal magnetic levitation track 464 by coils (not shown) behind a magnetic levitation separation plate (not shown). These coils do not define the vertical position of the passive mover, but simply maintain a gap 480 between the track 464 and the passive mover 424 and propel the passive mover 424 horizontally along the track 464. This allows the horizontal magnetic levitation track 464 to be much simpler and use less power, as there is reduced or no contact, friction, and fighting gravity.

[0041]

[0056] 4A, in some embodiments, the elevator units 402a, 402b include emergency brake systems 406a, 406b configured to prevent a substrate transport carriage in the first or second elevator units 402a, 402b from falling during a loss of power. The emergency brake systems 406a, 406b can also be used as a backup or in place of a standard uninterruptible power supply.

[0042]

[0057] FIG. 5A illustrates a side view of the elevator unit 402b, according to one embodiment. FIG. 5B illustrates a top view of the elevator unit 402b, according to one embodiment. The second elevator unit 402b is shown in an unlocked state. As shown, the second elevator unit 402b includes a linear motor 520 configured to raise and lower a passive mover 424 coupled to the substrate transport carriage 106. In some embodiments, the passive mover 424 is a passive device without an electronic device disposed therein. The emergency brake system 406b can prevent the passive mover 424 from free falling in the event that the linear motor 520 malfunctions. The first elevator unit 402a can have similar locked and unlocked states.

[0043]

[0058] The emergency braking system 406b can include a friction surface 522 disposed on the linear motor 520 or the friction surface 522 can be disposed proximate to the linear motor 520. A strip 526 can extend the length of the second elevator unit 402b and can be configured to be magnetized by an electromagnet 528. For example, the outer surface of the strip 526 is polarized in response to the electromagnet 528 being energized. For example, when the electromagnet 528 is energized, the outer surface of the strip 526 is given a south polarity. The opposite polarity may also be used.

[0044]

[0059] 5C and 5D show close-up views of tab 530, according to one embodiment. Tab 530 is included in brake system 406b. Tab 530 may be pivotable relative to passive mover 424 about pivot point 532. Tab 530 may be biased in a counterclockwise direction 534 about pivot point 532 (e.g., via a spring or other tensioning device, not shown). Thus, a bottom portion of tab 530 is biased toward friction surface 522. Tab 530 may include a permanent magnet 538 with a pole facing strip 526 that is the same polarity as the polarity of strip 526 when strip is magnetized by electromagnet 528.

[0045]

[0060] Although two emergency braking systems 406b, one located on each side of the passive mover 424, are shown in FIG. 5B, it will be understood that fewer or more emergency braking systems may be used.

[0046]

[0061] In operation, the electromagnet 528 can be energized from a power source that operates the linear motor 520. The energized electromagnet 528 magnetizes the strip 526, which repels the magnet 538 and causes the tab 530 to pivot in the opposite direction 534, as shown in FIG. 5D. In such a configuration, the second elevator unit 402b is in an unlocked state and the substrate transport carriage 106 is free to rise or fall. When power to the linear motor 520 is lost, the electromagnet 528 cannot magnetize the strip 526, so the tab 530 rotates counterclockwise into the friction surface 522, as shown in FIG. 5C. The contact of the tab 530 with the friction surface 522 locks the second elevator unit 402b and prevents the passive mover 424 from falling. The brace 540 can prevent the passive mover 424 from falling or becoming separated from the linear motor 520 when the tab 530 contacts the friction surface 522 .

[0047]

[0062] FIG. 6 shows a top schematic view of an SPT system 600, according to one embodiment. The SPT system 600 is similar to the SPT system 200, except that the SPT system 600 includes a double load lock chamber 602a along with the processing tool 202a. Additionally, the vacuum tunnel 102 does not include an extension region or a rotation stage. The double load lock chamber 602a is sized to allow the substrate transport carriage 106 to extend into the double load lock chamber 602a so that the robot in the transfer chamber 208a can retrieve a substrate from (or place a substrate on) the substrate transport carriage 106. For example, the interior region of the double load lock chamber 602a has enough space to allow the substrate transport carriage 106 to move therein a sufficient distance for the substrate to be retrieved from the substrate transport carriage 106. In some embodiments, the load lock chamber 602a includes a mechanism (e.g., a magnetic levitation track or another movement mechanism) to allow the substrate transport carriage 106 to move therein. In this manner, no rotation is used when transferring substrates between processing tools 202a and 202b. In some embodiments, the double load lock chamber 602b is configured similarly to the double load lock chamber 602a, although a single load lock chamber may be used with processing tool 202b.

[0048]

[0063] FIG. 7 shows a top schematic view of an SPT system 700, according to one embodiment. The SPT system 700 is similar to the SPT system 200, except that in the SPT system 700, the EFEM 212 has been moved to provide access to the load lock chamber 210b, and the EFEM 218 has been moved to provide access to the load lock chamber 216b. Thus, the vacuum tunnel 102 extends between the front access openings of the load lock chamber 210b and the load lock chamber 216b. In some embodiments, two rotation stages 702a and 702b are provided to allow the substrate transport carriage 106 to be oriented for removal or placement of a substrate from either the load lock chamber 210b or the load lock chamber 216b (as shown in phantom). Such a configuration provides sufficient room for the additional facets F1 and F2 of the processing tools 202a and 202b, respectively, to be used. The additional facets F1, F2 allow the processing tools 202a, 202b to accommodate additional processing chambers.

[0049]

[0064] 8 shows a top schematic view of an SPT system 800, according to one embodiment. The SPT system 800 is similar to the SPT system 700, except that the load lock chambers 210b and 201b have been removed from the SPT system 700 (e.g., to provide a more compact layout). Instead, the SPT system 800 includes only a single load lock chamber 210a, 210b for each processing tool 202a, 202b. The vacuum tunnel 102 interfaces directly with the transfer chambers 208a, 208b.

[0050]

[0065] 9 shows a top schematic view of an SPT system 900, according to one embodiment. The SPT system 900 is similar to the SPT system 800, except that the SPT system 900 includes a curved path within the vacuum tunnel 102. Because the vacuum tunnel 102 is curved, a single rotational stage 902 is used to reorient the substrate transport carriage 106 when performing substrate transfer between the processing tools 202a and 202b.

[0051]

[0066] 10 shows a top schematic view of an SPT system 1000, according to one embodiment. The vacuum tunnel 102 is configured to extend linearly between two or more processing tools (e.g., at least processing tools 202a and 202b). Similar to the SPT system 600 of FIG. 6, the SPT system 1000 does not include a rotation stage.

[0052]

[0067] The vacuum tunnel 102 is disposed between the load lock chambers 210a, 210b and the EFEM 212 of the processing tool 202a, and between the load lock chambers 216a, 216b and the EFEM 218 of the processing tool 202b. Substrates are transferred into the vacuum tunnel 102 near the processing tool 202a using either a robot in the EFEM 212 or a robot in the transfer chamber 208a. For example, a robot in the transfer chamber 208a picks up or places a substrate in the vacuum tunnel 102 by extending through either the load lock chamber 210a or 210b. Isolation valves 1002a-1002g allow for isolating portions of the vacuum tunnel 102 during substrate transfer, particularly when a substrate is being transferred between the EFEM 212 and the vacuum tunnel 102 (as the EFEM 212 does not normally operate at vacuum levels). The isolation valves 1002a-1002g prevent the remainder of the vacuum tunnel 102 and / or the load lock chambers 210a, 210b from being exposed to the atmospheric pressure environment in the EFEM 212. The vacuum tunnel 102 is similarly configured with an isolation valve (not shown) near the processing tool 202b to allow substrate transfer between the vacuum tunnel 102, the load lock chambers 216a, 216b, and the EFEM 218.

[0053]

[0068] An advantage of the SPT system 1000 is that no rotation is used when moving between the processing tools 202a, 202b. Furthermore, the substrate transport carriage 106 is simplified in some embodiments because the substrate transport carriage does not extend into the processing tools 202a, 202b during pick-and-place operations. Instead, the EFEMs 212, 218 or the robots in the transfer chambers 208a, 214a enter the vacuum tunnel 102. Furthermore, the vacuum tunnel 102 can be used to interconnect any number of processing tools. The substrate transport carriage 106 does not include an end effector (although an end effector may be used).

[0054]

[0069] In some embodiments, the load lock chambers 210a, 210b, 216a, 216b are used for pre-heating, cooling, metrology, inspection, etc., or replace such chambers, as the vacuum tunnel 102 effectively functions as a load lock chamber.

[0055]

[0070] In some embodiments, one or more auxiliary substrate buffer locations 1004 are included and configured to store substrates. For example, an isolation valve 1006 is used to isolate the substrate from the vacuum tunnel 102. The substrate buffer locations 1004 may be in the same plane as the vacuum tunnel 102, perpendicular to the vacuum tunnel 102, vertically oriented, etc.

[0056]

[0071] As described above, a transfer system and an SPT system are provided. The SPT system includes a transfer system connecting two processing tools. The transfer system includes a vacuum tunnel configured to transfer a substrate between the processing tools. The vacuum tunnel includes a substrate transfer carriage for moving the substrate through the vacuum tunnel.

[0057]

[0072] SPT systems come in a variety of configurations that allow users to add or remove processing chambers depending on the processing chambers required for the desired substrate processing procedure. They can include one or more vacuum tunnels, which allow multiple substrates to be transported. Elevator units with braking systems prevent damage to substrates or SPT system components in the event of a power failure.

[0058]

[0073] Those skilled in the art will understand that the foregoing examples are illustrative and not limiting. All permutations, extensions, equivalents, and improvements thereto that become apparent to those skilled in the art upon reading the specification and studying the drawings are intended to be included within the true spirit and scope of the present disclosure. Accordingly, the following appended claims are intended to include all such modifications, permutations, and equivalents that are within the true spirit and scope of these teachings.

Claims

1. 1. A conveying system comprising: a vacuum tunnel having a first end, an opposing second end, a first side, and an opposing second side, a distance between the first end and the second end being greater than a distance between the first side and the second side, the vacuum tunnel being configured to interface with a first processing tool at the first end of the vacuum tunnel and to interface with a second processing tool at the second end of the vacuum tunnel; Expansion area, A substrate transport carriage, comprising: A carriage body, and an end effector coupled to the carriage body, the end effector configured to support a substrate during transfer within the vacuum tunnel and configured to extend into the first processing tool or the second processing tool to retrieve or place a substrate while the carriage body remains within the vacuum tunnel; A substrate transport carriage comprising: A path for transporting the substrate transport carriage; and a rotation stage disposed within the expansion region and configured to rotate the substrate transport carriage between about 0 degrees and about 180 degrees; Equipped with A transport system wherein a portion of the path of the vacuum tunnel is curved.

2. 2. The transport system of claim 1, further comprising an additional vacuum tunnel disposed above the first processing tool and the second processing tool, the additional vacuum tunnel being accessible by one or more elevator units disposed near the first processing tool, near the second processing tool, or near each of the first processing tool and the second processing tool.

3. The transport system of claim 2 , further comprising an emergency braking system configured to prevent the substrate transport carriage in the one or more elevator units from falling during a loss of power.

4. 10. The transport system of claim 1, further comprising a magnetic levitation system configured to levitate the substrate transport carriage and move the substrate transport carriage between the first processing tool and the second processing tool.

5. The transport system of claim 1 further comprising a second expansion region within the vacuum tunnel.

6. The transport system of claim 5 , wherein the second expansion area comprises a second rotation stage.

7. The transport system of claim 5 , wherein the portion of the vacuum tunnel disposed between the expansion region and the second expansion region is substantially straight.

8. 1. A conveying system comprising: a vacuum tunnel having a first end and an opposite second end, the vacuum tunnel configured to mate with a first processing tool at the first end of the vacuum tunnel and to mate with a second processing tool at the second end of the vacuum tunnel, the vacuum tunnel comprising: a first region disposed along the vacuum tunnel between the first end and the second end, the first region having a first width defined between opposing interior sidewalls of the first region of the vacuum tunnel; an expansion region disposed along the vacuum tunnel adjacent to the first region, the expansion region having an expanded width defined between opposing interior sidewalls of the vacuum tunnel, the expanded width being greater than the first width, one of the opposing interior sidewalls of the expansion region being coplanar with one of the opposing interior sidewalls of the first region; A substrate transport carriage, comprising: A carriage body, and an end effector coupled to the carriage body and configured to support a substrate during transfer through the vacuum tunnel; A substrate transport carriage comprising: a rotation stage disposed within the expansion region and configured to rotate the substrate transport carriage between about 0 degrees and about 180 degrees; A transport system comprising:

9. 9. The transport system of claim 8, further comprising a second region of the vacuum tunnel disposed adjacent the expansion region, the second region of the vacuum tunnel being angled relative to the first region.

10. 9. The transport system of claim 8, wherein the end effector can extend into the first processing tool or the second processing tool to retrieve or place the substrate while the carriage body remains in the vacuum tunnel.

11. The transport system of claim 8 , wherein the vacuum tunnel further comprises a second rotation stage.

12. 10. The transport system of claim 8, further comprising a magnetic levitation system configured to levitate the substrate transport carriage and move the substrate transport carriage between the first processing tool and the second processing tool.

13. The transport system of claim 8 , wherein the vacuum tunnel further comprises a curved path.

14. 10. The transfer system of claim 8, further comprising an isolation valve disposed between the vacuum tunnel and the first processing tool or the second processing tool.

15. The transport system of claim 8 , further comprising a plurality of isolation valves isolating portions of the vacuum tunnel.

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