Coil substrate and electronic device including same

Abstract

Provided is a coil substrate having an asymmetric structure in which the area of ​​a coil pattern included in a first region is expanded relative to the area of ​​a coil pattern included in a second region with respect to a virtual axis, and an electronic device including the same. The coil substrate includes a base layer and a coil pattern wound spirally on the base layer, the upper part of the base layer is divided into a first region and a second region with respect to a void region formed inside the coil pattern, and the area of ​​the coil pattern formed in the second region is larger than the area of ​​the coil pattern formed in the first region.

Description

[Technical field]

[0001] The present invention relates to a coil substrate and an electronic device including the same, and more particularly to a coil substrate capable of controlling the balance of electrical characteristics and an electronic device including the same. [Background technology]

[0002] Generally, when a current flows through a conductor in a magnetic field, the conductor is subjected to electromagnetic force from the magnetic field. In particular, in the case of a coil in which the conductor is wound in a spiral shape, changes in electrical characteristics such as current, electromagnetic force, and resistance appear depending on the structure of the coil itself, such as the number of turns, winding direction, length or thickness of the wound conductor, and the design structure of the coil and adjacent magnetic bodies.

[0003] Recently, camera actuators have been attracting attention as a representative electronic device that uses such coils. Summary of the Invention [Problem to be solved by the invention]

[0004] With reference to Japanese Patent Registration No. 6626729, when a control current is applied to the first coil 51, the magnetic field emitted from the magnet 52 mounted on the movable unit 20 and the control current move the lens holder 25 along the central axis O, thereby adjusting the focus on the image sensor. Then, when a control current is applied to the second coil 71 constituting the cross-axis drive mechanism 70, the magnetic flux Φ extending from the first magnetized surface 52a of the magnet 52 to the lower end 63a of the side plate portion 63 and the control current drive the movable unit 20 in a direction intersecting the central axis O, thereby correcting camera shake.

[0005] That is, since the camera actuator has a coil and a magnet arranged close to each other and drives the lens through their mutual interaction, it is necessary to design the actuator while taking into consideration the mutual influence between them, such as whether the intervals and the reference axes are aligned.

[0006] In addition, the structural design of the coil itself should also be considered. Increasing the number of turns and thickness of the coil is effective in strengthening the electromagnetic force inside the actuator, but if only the number of turns is increased, the resistance also increases at the same time, hindering the flow of current, which may cause errors in the drive control or problems with heat generation. On the other hand, if only the thickness is increased, the resistance decreases more than necessary, which may cause other problems with heat generation due to excessive current.

[0007] The problem to be solved by the present invention is to provide a coil substrate having an asymmetric structure in which the area of ​​the coil pattern included in a first region is expanded relative to the area of ​​the coil pattern included in a second region based on a virtual axis, and an electronic device including the same.

[0008] The objects of the present invention are not limited to the objects mentioned above, and other objects not mentioned herein will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0009] One aspect of the coil substrate of the present invention for achieving the above object includes a base layer; and a coil pattern wound in a spiral shape on the base layer, an upper portion of the base layer is divided into a first region and a second region based on a void region formed inside the coil pattern, the coil pattern includes a coil pattern 1 formed in the first region, a coil pattern 2 formed in the second region, and a coil pattern 3 connecting the coil pattern 1 and the coil pattern 2, the coil pattern 3 includes a coil pattern 3a, a coil pattern 3b connecting the coil pattern 1 and the coil pattern 3a, and a coil pattern 3c connecting the coil pattern 2 and the coil pattern 3a, and an area of ​​the coil pattern 2 is larger than an area of ​​the coil pattern 1. K, Front The coil pattern 3c is formed non-parallel to the coil pattern 2 and the coil pattern 3a, The width of each pattern constituting the coil pattern 1 is different from the width of each pattern constituting the coil pattern 2, and the width of each pattern constituting the coil pattern 3c gradually changes.

[0010] The first region and the second region may be separated based on a reference axis formed along the longitudinal direction of the void region from one end of the base material layer to the other end of the base material layer, and the reference axis may be formed across the center of the short axis of the void region.

[0011] The coil pattern may include a plurality of first straight portions formed in the first region; a plurality of second straight portions formed in the second region; a plurality of third straight portions formed in the first region and the second region and formed on both sides of the first straight portions and the second straight portions; a plurality of first inflection portions formed in the first region and connecting the first straight portions and the third straight portions; and a plurality of second inflection portions formed in the second region and connecting the second straight portions and the third straight portions. Here, the multiple first straight line portions are patterns that constitute coil pattern 1, the multiple second straight line portions are patterns that constitute coil pattern 2, the multiple third straight line portions are patterns that constitute coil pattern 3a, the multiple first inflection portions are patterns that constitute coil pattern 3b, and the multiple second inflection portions are patterns that constitute coil pattern 3c.

[0012] The first linear portion may be formed along a longitudinal direction of the first region, the second linear portion may be formed parallel to the first linear portion, the third linear portion may be formed perpendicular to or diagonally from the first linear portion and the second linear portion, and the first inflection portion and the second inflection portion may be formed in a diagonal line shape or a circular arc shape.

[0013] The second straight portions may have a width greater than a width of the first straight portions.

[0014] A width of the third straight portion may be equal to a width of the first straight portion, and a width of the second bend portion may be expanded from the third straight portion in a direction toward the second straight portion.

[0016] The number of windings in the second straight portion may be the same as or greater than the number of windings in the first straight portion.

[0017] The above The second straight portion may have a greater number of windings than the first straight portion.

[0018] The coil substrate may further include a protective layer formed on the coil pattern to protect the coil pattern.

[0019] The coil patterns may be formed in multiple numbers on one side of the base layer, or at least one may be formed on each of both sides of the base layer. When the coil patterns are formed in multiple numbers on one side of the base layer, an interlayer insulating layer may be formed between two adjacent coil patterns.

[0020] One aspect of the electronic device of the present invention for achieving the above object includes a housing; a coil substrate provided inside the housing; and a magnetic body provided inside the housing at a distance from the coil substrate, the coil substrate includes a base layer and a coil pattern wound in a spiral shape on the base layer, an upper portion of the base layer is divided into a first region and a second region based on a void region formed inside the coil pattern, the coil pattern includes a coil pattern 1 formed in the first region, a coil pattern 2 formed in the second region, and a coil pattern 3 connecting the coil pattern 1 and the coil pattern 2, the coil pattern 3 includes a coil pattern 3a, a coil pattern 3b connecting the coil pattern 1 and the coil pattern 3a, and a coil pattern 3c connecting the coil pattern 2 and the coil pattern 3a, an area of ​​the coil pattern 2 is larger than an area of ​​the coil pattern 1, and the coil pattern 3c is formed non-parallel to the coil pattern 2 and the coil pattern 3a, The width of each pattern constituting the coil pattern 1 is different from the width of each pattern constituting the coil pattern 2, and the width of each pattern constituting the coil pattern 3c gradually changes.

[0021] The housing may be a camera actuator housing.

[0022] The magnetic body may be symmetrical on both sides with respect to the void region of the coil substrate.

[0023] Specific details of other embodiments are included in the detailed description and drawings. Effect of the Invention

[0024] The present invention provides a coil substrate having an asymmetric structure and an electronic device including the same, thereby achieving the following effects.

[0025] First, it is possible to provide a coil substrate capable of controlling electrical characteristics such as electromagnetic force and resistance within a limited area.

[0026] Secondly, by designing the structure of the electronic device taking into consideration the relationship between the coil substrate of the present invention and adjacent magnetic bodies, etc., it is possible to efficiently control the strength of the electromagnetic force, the amount of change in the electromagnetic force, and the balance between resistance and current, etc.

[0027] Third, the structural design of the coil substrate according to the present invention and the adjacent magnetic bodies can be modified in various ways to maximize the performance of electronic devices according to their applications. [Brief description of the drawings]

[0028] [Figure 1] FIG. 2 is a cross-sectional view of a coil substrate according to an embodiment of the present invention. [Diagram 2] 2 is a plan view of a coil pattern constituting a coil substrate according to an embodiment of the present invention; FIG. [Diagram 3] FIG. 2 is a first exemplary view illustrating an installation form of a coil pattern constituting a coil substrate according to an embodiment of the present invention. [Figure 4] 11 is a second exemplary view illustrating an installation form of a coil pattern constituting a coil substrate according to an embodiment of the present invention. FIG. [Diagram 5] 13 is a third exemplary view illustrating an installation form of a coil pattern constituting a coil substrate according to an embodiment of the present invention. FIG. [Figure 6] 13 is a fourth exemplary view illustrating an installation form of a coil pattern constituting a coil substrate according to an embodiment of the present invention. FIG. [Figure 7] 5 is a fifth exemplary view illustrating an installation form of a coil pattern constituting a coil substrate according to an embodiment of the present invention. FIG. [Figure 8] 13 is a sixth exemplary view illustrating an installation form of a coil pattern constituting a coil substrate according to an embodiment of the present invention. FIG. [Figure 9]7 is a seventh exemplary view illustrating an installation form of a coil pattern constituting a coil substrate according to an embodiment of the present invention. FIG. [Figure 10] 4 is an exemplary view for explaining a structure of a coil pattern constituting a coil substrate according to an embodiment of the present invention; FIG. [Figure 11] 1A to 1C are first exemplary views illustrating various shapes of coil patterns constituting a coil substrate according to an embodiment of the present invention. [Figure 12] 5A to 5C are second exemplary views illustrating various shapes of coil patterns constituting a coil substrate according to an embodiment of the present invention. [Figure 13] 11A to 11C are third exemplary views illustrating various shapes of coil patterns constituting a coil substrate according to an embodiment of the present invention. [Figure 14] 4 is a fourth exemplary view illustrating various shapes of the coil pattern constituting the coil substrate according to an embodiment of the present invention. FIG. [Figure 15] 5 is a fifth exemplary view illustrating various shapes of a coil pattern constituting a coil substrate according to an embodiment of the present invention. FIG. [Figure 16] FIG. 11 is a cross-sectional view of a coil substrate according to another embodiment of the present invention. [Figure 17] 11 is a cross-sectional view of a coil substrate according to still another embodiment of the present invention. [Figure 18] 1 is an experimental example comparing the prior art with the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0029] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Advantages and features of the present invention, as well as methods for achieving the same, will become apparent from the following detailed description of the embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and may be realized in various different forms. The present embodiments are provided merely to complete the disclosure of the present invention and to fully inform those skilled in the art of the present invention of the scope of the invention, and the present invention is defined only by the scope of the claims. The same reference symbols refer to the same elements throughout the specification.

[0030] When elements or layers are referred to as "on" or "on" another element or layer, this includes not only directly on the other element or layer, but also when there are other layers or elements in between. Conversely, when an element is referred to as "directly on" or "directly above" it means that there are no other elements or layers in between.

[0031] Spatially relative terms such as "below," "beneath," "lower," "above," "upper," and the like, are used to facilitate describing the relationship of one element or component to another element or component as depicted in the drawings. Spatially relative terms should be understood to include different orientations of the elements in use or operation in addition to the orientation depicted in the drawings. For example, if an element depicted in the drawings is flipped over, an element described as "below" or "beneath" another element may be placed "above" the other element. Thus, the exemplary term "below" can include both an orientation of below and above. Elements may be oriented in other directions, so the spatially relative terms can be interpreted accordingly.

[0032] Although the terms "first" and "second" are used to describe various elements, components, and / or sections, it is understood that these elements, components, and / or sections are not limited by these terms. These terms are used merely to distinguish one element, component, or section from another element, component, or section. Thus, it is understood that a first element, first component, or first section referred to below may be a second element, second component, or second section within the technical spirit of the present invention.

[0033] The terms used in the present specification are for the purpose of describing the embodiments and are not intended to limit the present invention. In the present specification, the singular form includes the plural form unless otherwise specified in the context. When used in the specification, "comprises" and / or "comprising" refer to a referenced component, step, operation and / or element, and does not exclude the presence or addition of one or more other components, steps, operations and / or elements.

[0034] Unless otherwise defined, all terms (including technical and scientific terms) used herein are used in the sense commonly understood by those having ordinary skill in the art to which the present invention belongs. Furthermore, terms defined in commonly used dictionaries are not idealized or overly interpreted unless specifically and explicitly defined.

[0035] Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, the same reference numbers will be given to the same or corresponding components regardless of the drawing numbers, and duplicate descriptions related thereto will be omitted.

[0036] The present invention relates to a coil substrate having an asymmetric structure and an electronic device including the same. The coil substrate of the present invention may have an asymmetric structure in which the area of ​​the coil pattern included in a first region is different from the area of ​​the coil pattern included in a second region based on a virtual axis. The area of ​​the coil pattern means (1) the cross-sectional area of ​​the coil pattern in one direction, (2) the area of ​​the top or side surface that is not in contact with the substrate layer described below, (3) the sum of the area of ​​(1) or (2) and the area of ​​the substrate layer exposed between the coil patterns, etc.

[0037] The present invention will be described in detail below with reference to the drawings.

[0038] FIG. 1 is a cross-sectional view of a coil substrate according to an embodiment of the present invention.

[0039] According to FIG. 1, the coil substrate 100 may include a base layer 110, a coil pattern 120, and a protective layer .

[0040] The base layer 110 refers to a base film and may be formed to have a flat plate shape and a predetermined thickness (for example, 5 μm to 100 μm). The base layer 110 may be formed of any one of a flexible film, a rigid film, and a rigid flexible film.

[0041] The base layer 110 may be made of at least one material selected from various polymer materials, such as polyimide, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate, epoxy, and glass fiber.

[0042] A seed layer (not shown) or an under layer made of a conductive material may be formed on one or both sides of the substrate layer 110. The seed layer may be formed on the substrate layer 110 using at least one conductive material selected from metals such as nickel (Ni), chromium (Cr), copper (Cu), and gold (Au), and may be formed on the substrate layer 110 using a physical or chemical method such as deposition, adhesion, and plating. Meanwhile, the seed layer does not have to be formed on the substrate layer 110.

[0043] The coil pattern 120 is for inducing electromagnetic force when a current flows through it. The coil pattern 120 may be formed by being wound in a spiral shape on the base layer 110.

[0044] The coil pattern 120 may be formed on the base layer 110 using a conductive material. The coil pattern 120 may be formed on the base layer 110 using at least one conductive material selected from metals such as silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), platinum (Pt), and copper (Cu).

[0045] The coil pattern 120 may be formed on the base layer 110 using various techniques such as plating, printing, coating, etc. When the coil pattern 120 is formed on the base layer 110 using plating, it may be formed on the base layer 110 by performing plating one or more times, and at this time, one or more boundary lines may be formed on the cross section of the coil pattern 120 depending on the number of plating times, plating conditions, etc.

[0046] When the coil pattern 120 is formed on the base layer 110 by plating, either one of electrolytic plating and electroless plating can be used. When the coil pattern 120 is formed on the base layer 110 by electrolytic plating, it can be formed in a portion where a resist pattern layer (not shown) is not formed.

[0047] The resist pattern layer is a resin layer made of an insulating material, and may be formed on the base layer 110 prior to the coil pattern 120. The coil pattern 120 may be formed on the base layer 110 to have the same thickness as the resist pattern layer, or may be formed on the base layer 110 to have a thickness thinner than that of the resist pattern layer. When the coil pattern 120 is formed as described above, it is possible to prevent plating from being concentrated on the upper portion, and it is possible to form the widths of the upper portion and the lower portion uniformly.

[0048] Meanwhile, the resist pattern layer may be removed on the base layer 110 after the coil pattern 120 is formed on the base layer 110. At this time, the resist pattern layer may be removed on the base layer 110 before the protective layer 130 is formed on the coil pattern 120.

[0049] The protective layer 130 is formed to cover the upper part of the coil pattern 120 in order to protect the coil pattern 120. The protective layer 130 may be formed on the coil pattern 120 after the resist pattern layer is removed.

[0050] The protective layer 130 may be formed of a material having insulating properties. For example, the protective layer 130 may be formed of a solder resist. However, the present embodiment is not limited thereto. The protective layer 130 may be formed of the same material as the base layer 110.

[0051] Meanwhile, the protective layer 130 may be formed on the coil pattern 120 using various techniques such as printing, coating, photolithography, and the like.

[0052] As described above, the coil pattern 120 may be formed by being wound in a spiral shape on the base layer 110. Such a coil pattern 120 is divided into a first region 210 and a second region 220 with respect to the reference axis R as the center, as shown in FIG.

[0053] 2 is a plan view of a coil pattern constituting a coil substrate according to an embodiment of the present invention. The following description will refer to FIG.

[0054] When the coil pattern 120 is formed by being wound in a spiral shape on the base layer 110, a void region (V) may be formed inside the coil pattern 120 with a predetermined area on one surface of the base layer 110. Here, the void region V refers to an open space formed between the innermost coil patterns 121 and 122 of the first region 210 and the second region 220, and may overlap a pad portion (not shown) of the coil pattern 120. That is, the void region V corresponds to the center region of the coil pattern 120 or is a region including the center region.

[0055] The reference axis R refers to a line segment extending in the first direction 10 within the void region V, and the first direction 10 is the major axis direction of the coil pattern 120, i.e., the longitudinal direction of the void region V. In the present invention, the reference axis R extending in the first direction 10 so as to cross the width direction of the void region V is described as an example, but is not limited thereto, and may also be the minor axis direction of the coil pattern 120 or the width direction of the void region V.

[0056] The first region 210 refers to a region occupied by the coil pattern 120 formed on one side of the base layer 110 around the reference axis R. The second region 220 refers to a region occupied by the coil pattern 120 formed on the other side of the base layer 110 around the reference axis R.

[0057] The first region 210 and the second region 220 can be symmetrically formed on the base material layer 110 around the reference axis R. The first region 210 can be formed to have the same width as the second region 220 as shown in FIG. 3 (W1 = W2). As described above, having the same width means that the distance from one side of the innermost coil patterns 121 and 122 of the first region 210 and the second region 220 to one side of the outermost coil patterns 123 and 124 is the same or at an equivalent level.

[0058] In this case, the reference axis R within the void region V at the first position can be regarded as the center C of the coil pattern 120, and more specifically, it is assumed to be a line segment crossing the short-axis center of the void region V. FIG. 3 is a first exemplary diagram for explaining the installation form of the coil pattern constituting the coil substrate according to an embodiment of the present invention.

[0059] However, this embodiment is not limited thereto. Although the line segment crossing the short-axis center of the void region V is used as the reference axis R, it is also possible that one of the outermost coil patterns in either the first region or the second region is separated so that the first region 210 and the second region 220 have different widths from each other.

[0060] The first region 210 can be formed to have a wider width than the second region 220 as shown in FIG. 4, for example (W1>W2). Or, the first region 210 can be formed to have a narrower width than the second region 220 as shown in FIG. 5 (W1<W2). FIG. 4 is a second exemplary diagram for explaining the installation form of the coil pattern constituting the coil substrate according to an embodiment of the present invention, and FIG. 5 is a third exemplary diagram for explaining the installation form of the coil pattern constituting the coil substrate according to an embodiment of the present invention.

[0061] In the above case, the purpose is to reduce the resistance strength of the coil pattern or improve the strength of the electromagnetic force, but it can be applied when the region where the coil pattern can be extended in the substrate is limited, and a balance with the magnetic material described later can be ensured.

[0062] 6, the innermost coil pattern and the outermost coil pattern of the first region 210 and the second region 220 may be spaced apart at the same distance or at the same level to form a void region V at the second position. That is, the area of ​​the coil pattern may be expanded or reduced compared to the embodiment shown in FIG.

[0063] Further, as shown in Fig. 7, a void region V is formed at a second position, but either one of the outermost coil patterns of the first region 210 and the second region 220 may be spaced apart so that the sizes of both regions are different. Fig. 6 is a fourth exemplary view illustrating an installation form of a coil pattern constituting a coil substrate according to an embodiment of the present invention, and Fig. 7 is a fifth exemplary view illustrating an installation form of a coil pattern constituting a coil substrate according to an embodiment of the present invention.

[0064] Meanwhile, the first region 210 cannot be formed beyond the outer circumferential surface of the base layer 110. That is, the outermost portion 230 of the coil pattern 120 formed on the first region 210 may be disposed inside the outer circumferential surface of the base layer 110 as shown in Fig. 8, or may be disposed on the same line as the outer circumferential surface of the base layer 110 as shown in Fig. 9. Fig. 8 is a sixth exemplary view illustrating an installation form of the coil pattern constituting the coil substrate according to an embodiment of the present invention, and Fig. 9 is a seventh exemplary view illustrating an installation form of the coil pattern constituting the coil substrate according to an embodiment of the present invention.

[0065] The reference axis R shown in FIGS. 3 to 7 may be the same as or different from the center of the base layer 110.

[0066] Similarly, the second region 220 cannot be formed beyond the outer circumferential surface of the base layer 110. That is, the outermost portion 240 of the coil pattern 120 formed on the second region 220 can be disposed inside the outer circumferential surface of the base layer 110 as shown in Fig. 8, or can be disposed on the same line as the outer circumferential surface of the base layer 110 as shown in Fig. 9.

[0067] In addition, the outermost portions of the first region 210 and the second region 220 may be disposed inward from the outer circumferential surface of the base layer 110 at the same or different distances.

[0068] On the other hand, when the outermost portion 230 of the coil pattern 120 formed on the first region 210 is positioned inside the outer peripheral surface of the base layer 110 as shown in FIG. 8, the outermost portion 240 of the coil pattern 120 formed on the second region 220 can be positioned on the same line as the outer peripheral surface of the base layer 110 as shown in FIG. 9.

[0069] In addition, when the outermost portion 230 of the coil pattern 120 formed on the first region 210 is positioned on the same line as the outer peripheral surface of the base layer 110 as shown in FIG. 9, the outermost portion 240 of the coil pattern 120 formed on the second region 220 can be positioned inside the outer peripheral surface of the base layer 110 as shown in FIG. 8.

[0070] Furthermore, even in the embodiments including the above-mentioned FIGS. 8 and 9, the widths of the first region 210 and the second region 220 may be the same or different depending on the position of the void region V or the reference axis line R as in the above-mentioned FIGS.

[0071] When the coil pattern 120 is formed by winding a spiral on the base layer 110, it may be configured to include n straight portions and m bend portions. The straight portion refers to a coil pattern formed from one end to the other end where the direction of travel is not changed, and the bend portion refers to a coil pattern connecting two straight portions formed in different directions.

[0072] FIG. 10 is an exemplary view for explaining the structure of a coil pattern constituting a coil substrate according to an embodiment of the present invention.

[0073] According to FIG. 10, the coil pattern 120 includes a first straight portion 310. (Equivalent to "coil pattern 1") , second straight section 320 (Equivalent to "coil pattern 2") , third straight section 330 (corresponding to "coil pattern 3a") , fourth straight section 340, first inflection section 350 (corresponding to "coil pattern 3b") , second inflection part 360 (Equivalent to "coil pattern 3c"), a third inflection portion 370 and a fourth inflection portion 380. Coil pattern 3 may be configured by coil pattern 3a (330), coil pattern 3b (350), and coil pattern 3c (360).

[0074] The first linear portion 310 refers to a coil pattern formed in a linear shape on the first region 210. A plurality of such first linear portions 310 may be formed on the first region 210 in the first direction 10.

[0075] The second linear portion 320 refers to a coil pattern formed in a linear shape on the second region 220. A plurality of such second linear portions 320 may be formed on the second region 220 in the same direction as the first linear portion 310 (i.e., the first direction 10).

[0076] The third straight portion 330 and the fourth straight portion 340 are formed in a linear shape on the first region 210 and the second region 220, and each refers to a coil pattern that connects the first straight portion 310 and the second straight portion 320. Such third straight portion 330 and fourth straight portion 340 may be formed in plurality on the first region 210 and the second region 220 in a direction perpendicular to the first straight portion 310 and the second straight portion 320 (i.e., the second direction 20).

[0077] The first bend portion 350 refers to a coil pattern formed in a diagonal line shape on the first region 210. Such a first bend portion 350 may connect the first straight portion 310 and the third straight portion 330 to each other on the first region 210. The number of first bend portions 350 may be the same as the number of at least one straight portion of the first straight portion 310 and the third straight portion 330.

[0078] The second bend portion 360 refers to a coil pattern formed in a diagonal line shape on the second region 220. Such second bend portion 360 may connect the second straight portion 320 and the third straight portion 330 to each other on the second region 220. The number of second bend portions 360 may be the same as the number of at least one straight portion of the second straight portion 320 and the third straight portion 330.

[0079] The third inflection portion 370 may be formed in a diagonal shape on the second region 220 to interconnect the second straight portion 320 and the fourth straight portion 340, and the fourth inflection portion 380 may be formed in a diagonal shape on the first region 220 to interconnect the fourth straight portion 340 and the first straight portion 310. Like the first inflection portion 350 and the second inflection portion 360, the third inflection portion 370 and the fourth inflection portion 380 may also be formed in the same number as at least one straight portion of both the straight portions that are interconnected.

[0080] Furthermore, in the present invention, the first inflection portion 350 to the fourth inflection portion 380 are shown as straight diagonal lines, but they may also be formed as a circular arc type (⌒) having a bend, or may be formed as different types from each other.

[0081] The first straight portion 310, the second straight portion 320, the third straight portion 330, the fourth straight portion 340, the first inflection portion 350, the second inflection portion 360, the third inflection portion 370, and the fourth inflection portion 380 may be formed in a plurality on the first region 210 and the second region 220, respectively. In this case, the first straight portion 310 to the fourth straight portion 340 and the first inflection portion 350 to the fourth inflection portion 380 may all be formed to have the same width. However, this embodiment is not limited thereto. The first straight portion 310 to the fourth straight portion 340 and the first inflection portion 350 to the fourth inflection portion 380 may all be formed to have different widths. Meanwhile, some of the first straight portion 310 to the fourth straight portion 340 and the first inflection portion 350 to the fourth inflection portion 380 may be formed to have the same width, and the other some may be formed to have different widths.

[0082] Meanwhile, the plurality of first straight portions 310 may all be formed to have the same width. However, this embodiment is not limited thereto. The plurality of first straight portions 310 may all be formed to have different widths. Meanwhile, some of the plurality of first straight portions 310 may be formed to have the same width, and the other some may be formed to have different widths.

[0083] Meanwhile, the plurality of second straight portions 320, the plurality of third straight portions 330, the plurality of fourth straight portions 340, the plurality of first inflection portions 350, the plurality of second inflection portions 360, the plurality of third inflection portions 370, the plurality of fourth inflection portions 380, etc. are of course formed in the same manner as the plurality of first straight portions 310.

[0084] In this embodiment, the first straight portion 310, the first inflection portion 350, and the fourth inflection portion 380 on the first region 210, and the second straight portion 320, the second inflection portion 360, and the third inflection portion 370 on the second region 220, etc. may be formed in partially identical or different shapes, and the cross-sectional area of ​​the coil pattern 120 on the first region 210 may be smaller than the cross-sectional area of ​​the coil pattern 120 on the second region 220. Therefore, in this embodiment, the position of the void region V inside the coil pattern 120 may be separated or the size may be expanded or reduced.

[0085] In the following, the advantages of the present invention will be described in detail, in that by providing a coil substrate 100 formed in an asymmetric structure according to the above-mentioned configuration of the present invention, it is possible to control electromagnetic force, resistance, etc. with a coil substrate 100 of a limited area, and the performance of an electronic device to which the coil substrate 100 is applied is maximized.

[0086] (I) When the number of turns of the coil pattern 120 formed on the first region 210 is the same as the number of turns of the coil pattern 120 formed on the second region 220 (i) When the pattern width of the second straight portion 320 is wider than the pattern width of the first straight portion 310 When the width of the second straight portion 320 is wider than that of the first straight portion 310, a width W3 formed by the second straight portion 320 is wider than a width W4 formed by the first straight portion 310 (W3>W4) as shown in Fig. 11. When the plurality of first straight portion 310 and the plurality of second straight portion 320 are thus formed on the first region 210 and the second region 220, respectively, the area of ​​the coil pattern 120 on the second region 220 may be larger than the area of ​​the coil pattern 120 on the first region 210. Fig. 11 is a first exemplary view illustrating various shapes of coil patterns constituting a coil substrate according to an embodiment of the present invention.

[0087] In the above case, the area of ​​the coil pattern 120 on the second region 220 can be expanded in the minor axis direction, thereby lowering the resistance and smoothing the flow of current, thereby obtaining the effect of strengthening the strength of the electromagnetic force.

[0088] (ii) When the pattern width of at least one of the second straight portion 320, the fourth straight portion 340, the second inflection portion 360, and the third inflection portion 370 is wider than the pattern width of the first straight portion 310. When the pattern width of at least one of the second straight portion 320, the fourth straight portion 340, the second inflection portion 360, and the third inflection portion 370 is wider than the pattern width of the first straight portion 310, for example, as shown in Fig. 12, when the pattern width of the second straight portion 320 and the second inflection portion 360 is wider than the pattern width of the first straight portion 310, the width W3 formed by the second straight portion 320 and the second inflection portion 360 is wider than the width W4 formed by the first straight portion 310 (W3>W4), and therefore the area of ​​the coil pattern 120 on the second region 220 may be larger than the area of ​​the coil pattern 120 on the first region 210. Fig. 12 is a second exemplary view illustrating various shapes of coil patterns constituting a coil substrate according to an embodiment of the present invention.

[0089] In this case, as in the case of (i), only the area of ​​the coil pattern 120 on the second region 220 is expanded in the minor axis direction, so that the resistance is reduced, and the current flow is increased, thereby enhancing the strength of the electromagnetic force. In addition, the coil substrate 100 can be relatively well symmetrical from the top to the bottom compared to the case of (i), and the balance with the magnetic body described later in the electronic device can also be secured.

[0090] Meanwhile, in the above case, the pattern width of the second straight portion 320, the fourth straight portion 340, the second inflection portion 360, or the third inflection portion 370 may be gradually expanded in a direction from one end to the other end, thereby preventing a sudden change in current flow and thus preventing voltage fluctuation.

[0091] (iii) When the interval between at least one of the patterns of the second straight portion 320, the fourth straight portion 340, the second inflection portion 360, and the third inflection portion 370 is wider than the interval between the patterns of the first straight portion 310. When the interval between at least one of the patterns of the second straight portion 320, the fourth straight portion 340, the second inflection portion 360, and the third inflection portion 370 is wider than the interval between the patterns of the first straight portion 310, for example, when the interval between the patterns of the second straight portion 320 and the second inflection portion 360 is wider than the interval between the patterns of the first straight portion 310 as shown in Fig. 13, the width W3 formed by the second straight portion 320 is wider than the width W4 formed by the first straight portion 310 (W3>W4), and therefore the area of ​​the second region 220 may be larger than the area of ​​the first region 210. Fig. 13 is a third exemplary view illustrating various shapes of coil patterns constituting a coil substrate according to an embodiment of the present invention.

[0092] In the above case, the effects of leakage current and signal interference between patterns in the second region 220 can be suppressed, thereby reducing resistance, and furthermore, it is designed to be adjacent to other components such as lenses disposed inside the electronic device described below, thereby reducing electrical error problems that occur between the coil substrate 100 according to the present invention.

[0093] (II) When the number of turns of the coil pattern 120 formed on the first region 210 is different from the number of turns of the coil pattern 120 formed on the second region 220 (i) When the number of windings in the second straight portion 320 is greater than the number of windings in the first straight portion 310 When the number of windings of the second straight portion 320 is greater than the number of windings of the first straight portion 310, even if the intervals between the patterns of the straight portions are the same, the width W3 is wider than the width W4 (W3>W4) as shown in Fig. 14. In this case, the electromagnetic force can be strengthened by increasing the number of windings of the coil substrate 100. Fig. 14 is a fourth exemplary view illustrating various shapes of the coil patterns constituting the coil substrate according to an embodiment of the present invention.

[0094] On the other hand, if the interval between the second straight portions 320 is wider than the interval between the first straight portions 310, the width W3 is wider than the width W4 (W3>W4) as shown in Fig. 14. This ensures an enhanced electromagnetic force and can add the resistance effect described in (I)(iii). Fig. 15 is a fifth exemplary view illustrating various shapes of coil patterns constituting a coil substrate according to an embodiment of the present invention.

[0095] Meanwhile, even if the interval between the second straight portions 320 is narrower than the interval between the first straight portions 310, if the pattern width of the second straight portion 320 is wider than the pattern width of the first straight portion 310, the area of ​​the coil pattern 120 on the second region 220 is larger than the area of ​​the coil pattern 120 on the first region 210, and thus a resistance reduction effect can be obtained. However, in this case, it should be noted that the level at which the interval between the second straight portions 320 is narrowed should be designed taking into consideration influencing factors such as leakage current and heat generation.

[0096] On the other hand, when the number of windings of the first straight portion 310 is greater than the number of windings of the second straight portion 320, the above-mentioned case where the number of windings of the second straight portion 320 is greater, i.e., (II)(i) can of course also be applied.

[0097] Meanwhile, it goes without saying that the effects of (I) and (II) can be applied to the third straight portion 330, the fourth straight portion 340, the first inflection portion 350 to the fourth inflection portion 380, etc., at the same or similar levels.

[0098] The coil substrate 100 described above may include one coil pattern 120 on one base layer 110 with reference to Fig. 2. However, the present embodiment is not limited thereto. The coil substrate 100 may also be configured to include a plurality of coil patterns 120 on one base layer 110.

[0099] When the coil substrate 100 includes a plurality of coil patterns 120, the plurality of coil patterns 120 may be formed on one side of the base layer 110, and at least one coil pattern 120 may be formed on each side of the base layer 110. In this case, in the present embodiment, at least one of the plurality of coil patterns 120 may be formed in accordance with the various embodiments described with reference to FIGS.

[0100] When a plurality of coil patterns 120 are formed on one surface of the base layer 110, the plurality of coil patterns 120 may be stacked in the thickness direction of the pattern or arranged in a row in the width direction.

[0101] In addition, when a plurality of coil patterns 120 are stacked on one surface of the base layer 110, an interlayer insulating layer may be formed between two adjacent coil patterns 120. For example, as shown in Fig. 16, the base layer 110, the first coil pattern 120a, the interlayer insulating layer 140, the second coil pattern 120b, and the protective layer 130 may be stacked in this order. Fig. 16 is a cross-sectional view of a coil substrate according to another embodiment of the present invention.

[0102] Although not shown in FIG. 16, each coil pattern may be connected in the form of a via, a conductive pad, or the like.

[0103] When at least one coil pattern 120 is formed on each side of the substrate layer 110, the coil patterns may be arranged facing each other in the lengthwise or widthwise direction, or may be arranged sequentially along the outer circumferential surface of the substrate layer 110. For example, when two coil patterns 120 are arranged on parallel outer circumferential surfaces of the substrate layer 110, the two coil patterns may receive separate signals or may be connected to each other by a wiring pattern (not shown) and receive the same signal. In particular, when the two coil patterns are connected to each other by a wiring pattern and arranged in mirror symmetry with respect to one axis, electromagnetic forces act in the same direction inside an electronic device described below, thereby enhancing the overall electromagnetic force of the coil substrate.

[0104] The coil patterns described above may be formed to have the same shape or partially different structures.

[0105] Meanwhile, when at least one coil pattern 120 is formed on both sides of the base layer 110, the same number of coil patterns 120 may be formed on both sides of the base layer 110, or different numbers of coil patterns 120 may be formed. When a plurality of coil patterns 120 are formed on at least one of the two sides of the base layer 110, the plurality of coil patterns 120 may be stacked in the thickness direction or arranged in the width direction, and an interlayer insulating layer may be formed between two adjacent coil patterns 120. For example, when one coil pattern 120 is formed on each side of the base layer 110, the coil substrate 100 may be stacked in the order of a first protective layer 130a, a first coil pattern 120a, a base layer 110, a second coil pattern 120b, and a second protective layer 130b, as shown in FIG. 17. FIG. 17 is a cross-sectional view of a coil substrate according to another embodiment of the present invention.

[0106] Furthermore, the coil substrate 100 according to the present invention may further include, on one or both sides of the base layer 110, not only the coil pattern 120, but also other external elements such as sensors, filters, inductors, ICs, etc., or wiring patterns (not shown) that connect to the external elements and transmit signals, and may be connected to the coil substrate 100.

[0107] Various embodiments of the coil substrate 100 have been described above with reference to Figures 1 to 17. The coil substrate 100 described above will be described below as being applied to a camera actuator among various electronic devices, and may be provided inside a housing of the actuator together with a magnetic body (e.g., a magnet). In this case, the magnetic body may be formed symmetrically on both sides with respect to the same axis as the coil substrate 100 formed symmetrically with respect to the central axis of the coil pattern.

[0108] Since the lens driving performance of the actuator can be affected by the distance between the coil substrate 100 and the magnetic body, whether the central axis is the same, etc., the present invention provides a coil substrate according to one embodiment, and an electronic device designed taking into consideration the relationship between the coil substrate and the magnetic body.

[0109] Fig. 18 shows an experimental example comparing the lens driving performance and resistance due to the correlation between the magnet and the coil substrate (case (ii) of (I)) according to the conventional technology and one embodiment of the present invention. This makes it possible to derive the optimal design of the coil substrate and magnetic material (magnet) for the camera actuator.

[0110] The control group of this experiment refers to an example in which the first region 210 and the second region 220 of the coil pattern are formed symmetrically with the same size around the reference axis R, and the reference axis R coincides with the central axis of the magnetic body.

[0111] Experimental group 1 refers to an example in which the first region 210 and the second region 220 of the coil pattern are formed in different sizes around the reference axis R, for example, the first region 210 is formed to be the same or similar to the first region 210 of the control group, and the second region 220 is formed to be larger in size. Therefore, the reference axis R can coincide with the central axis of the magnetic body.

[0112] Experimental group 2 refers to an example in which the first region 210 and the second region 220 of the coil pattern are formed symmetrically with the same size around the reference axis R, or are formed to be expanded compared to the size of the first and second regions of the control group. Therefore, since the positions of the void regions are separated, the position of the reference axis R is also different from that of the control group, and does not coincide with the central axis of the magnetic body.

[0113] Experimental group 3 is an example in which the first region 210 and the second region 220 of the coil pattern and the reference axis R are the same as those of experimental group 1, except that the reference axis R does not coincide with the central axis of the magnetic body.

[0114] (1) Electromagnetic force strength: Control group > Experimental group 1 > Experimental group 3 > Experimental group 2 (2) Change in electromagnetic force according to magnet position (Min / Max, amount of movement): Control group < Experimental group 1 < Experimental group 2 < Experimental group 3 (3) Resistance: Control group > Experimental group 1 > Experimental group 2 Since the camera actuator corrects the lens position by changing the magnetic field in response to the movement of the magnet, the strength of the electromagnetic force does not change suddenly while the magnet is moving, and the stronger the strength, the better, and the appropriate level of low resistance can be maintained to maximize its performance. Therefore, the coil board and magnet designs suitable for the camera actuator were in the order of experimental group 1, experimental group 3, experimental group 2, and the control group, and for experimental group 1 and experimental group 2, the strength of the electromagnetic force differed depending on whether the center with the magnet was aligned or not, and the change in the electromagnetic force (amount of movement) differed depending on whether the first and second regions were symmetrical or not.

[0115] However, since the difference in electromagnetic force strength was greater than the difference in the amount of movement between experimental group 1 and experimental group 2, it can be said that experimental group 1, i.e., the design of the coil substrate according to one embodiment of the present invention, is effective for the camera actuator.

[0116] Meanwhile, in the case of experimental group 1 and experimental group 3, the symmetry of the first and second areas was the same, but because the centers of the magnets were not aligned or not, the results for electromagnetic force, electromagnetic force change, and resistance were different. Experimental group 1 had stronger electromagnetic force, but experimental group 3 showed smaller resistance. It was confirmed that experimental group 1 was relatively more effective in terms of electromagnetic force change than experimental group 3, but the difference was small.

[0117] In the above experimental example, the inventor further investigated the electromagnetic force, change in electromagnetic force, and resistance according to the degree of misalignment with the central axis of the magnet in experimental group 3, and confirmed that all the results were excellent when the central axis of the magnet was located within the void region V in experimental group 3. In other words, in light of the trends of experimental groups 1 and 3, which applied the coil substrate according to the present invention, it was confirmed that the asymmetric structure can ensure performance suitable for a camera actuator, and in particular, effective effects can be achieved only when the central axis of the magnet and the reference axis R are aligned or the central axis of the magnet is located within the void region V of the coil substrate.

[0118] Furthermore, in the case of a coil substrate applied to a camera actuator, a surplus space is formed on most of the base material in the lens direction when considering A / M, the coupling area with other components, the wiring area, etc. Therefore, it can be said that another effect of the present invention is that the central axis with the magnet is maintained and expanded to one side, thereby balancing the strength and change of the electromagnetic force and improving the actuator performance.

[0119] Although the embodiment of the present invention has been described above with reference to the accompanying drawings, those skilled in the art will understand that the present invention can be embodied in other specific forms without changing the technical idea or essential features of the present invention. Therefore, it should be understood that the above embodiment is illustrative in all respects and is not limiting. [Industrial Applicability]

[0120] The present invention can be applied to a coil substrate and an electronic device including a coil substrate (for example, a camera actuator).

Claims

1. A substrate layer; and A coil pattern is included which is wound in a spiral shape on the base layer, an upper portion of the base layer is divided into a first region and a second region based on a void region formed inside the coil pattern; the coil pattern includes a coil pattern 1 formed in the first region, a coil pattern 2 formed in the second region, and a coil pattern 3 connecting the coil pattern 1 and the coil pattern 2, The coil pattern 3 includes a coil pattern 3a, a coil pattern 3b connecting the coil pattern 1 and the coil pattern 3a, and a coil pattern 3c connecting the coil pattern 2 and the coil pattern 3a, The area of ​​the coil pattern 2 is larger than the area of ​​the coil pattern 1, the coil pattern 3c is formed non-parallel to the coil pattern 2 and the coil pattern 3a, A coil substrate in which the width of each pattern constituting the coil pattern 1 is different from the width of each pattern constituting the coil pattern 2, and the width of each pattern constituting the coil pattern 3c gradually changes.

2. The first region and the second region are separated based on a reference axis line formed along a longitudinal direction of the void region from one end of the base material layer to the other end of the base material layer, The coil substrate of claim 1 , wherein the reference axis is formed across a center of a minor axis of the void region.

3. The coil pattern is a plurality of first linear portions formed in the first region; a plurality of second linear portions formed in the second region; a plurality of third linear portions formed in the first region and the second region and on both sides of the first linear portions and the second linear portions; a plurality of first inflection portions formed in the first region and connecting the first linear portion and the third linear portion; and a plurality of second inflection portions formed in the second region and connecting the second linear portion and the third linear portion; Where: Each of the first linear portions is a pattern that constitutes the coil pattern 1, The second straight line portions are patterns that configure the coil pattern 2, The plurality of third straight line portions are patterns that configure the coil pattern 3 a, The plurality of first inflection portions are patterns that configure the coil pattern 3b, The coil substrate according to claim 1 , wherein each of the second inflection portions is a pattern that constitutes the coil pattern 3 c.

4. The first linear portion is formed along a longitudinal direction of the first region, The second linear portion is formed parallel to the first linear portion, the third linear portion is formed perpendicular or obliquely to the first linear portion and the second linear portion, The coil substrate according to claim 3 , wherein the first inflection portion and the second inflection portion are formed in an oblique line shape or an arc shape.

5. The coil substrate according to claim 3 , wherein a width of the second straight portions is greater than a width of the first straight portions.

6. a width of the third straight portions is equal to a width of the first straight portions; The coil substrate according to claim 5 , wherein a width of the second bend portions is expanded from the third straight portion in a direction toward the second straight portion.

7. The coil substrate according to claim 5 , wherein the number of turns of the second straight portion is equal to or greater than the number of turns of the first straight portion.

8. A coil substrate as described in claim 3, wherein the number of windings of the second straight section is greater than that of the winding section of the first straight section.

9. The coil substrate according to claim 1 , further comprising a protective layer formed on the coil pattern to protect the coil pattern.

10. The coil pattern is formed on one surface of the base layer, or at least one coil pattern is formed on each of both surfaces of the base layer, The coil substrate according to claim 1 , wherein when a plurality of the coil patterns are formed on one surface of the base layer, an interlayer insulating layer is formed between two adjacent coil patterns.

11. housing; A coil substrate provided inside the housing; and a magnetic body provided inside the housing and spaced apart from the coil substrate; The coil substrate is A substrate layer; and A coil pattern is included which is wound in a spiral shape on the base layer, an upper portion of the base layer is divided into a first region and a second region based on a void region formed inside the coil pattern; the coil pattern includes a coil pattern 1 formed in the first region, a coil pattern 2 formed in the second region, and a coil pattern 3 connecting the coil pattern 1 and the coil pattern 2, The coil pattern 3 includes a coil pattern 3a, a coil pattern 3b connecting the coil pattern 1 and the coil pattern 3a, and a coil pattern 3c connecting the coil pattern 2 and the coil pattern 3a, The area of ​​the coil pattern 2 is larger than the area of ​​the coil pattern 1, the coil pattern 3c is formed non-parallel to the coil pattern 2 and the coil pattern 3a, An electronic device, wherein the width of each pattern constituting the coil pattern 1 is different from the width of each pattern constituting the coil pattern 2, and the width of each pattern constituting the coil pattern 3c gradually changes.

12. The electronic device of claim 11 , wherein the housing is a camera actuator housing.

13. The electronic device according to claim 11 , wherein the magnetic body is symmetrical on both sides with respect to the same basis as the void region of the coil substrate.

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