Temporary Joining Device

Abstract

A technique is provided for preventing the positional relationship between two objects to be joined from being lost before joining. [Solution] The temporary joining device is an apparatus that temporarily joins two objects to be joined using laser light, and includes a table, a pressure joining unit, a laser light source that emits laser light, and a control unit. The table is provided with a through hole through which the laser light passes. The pressure joining unit has a pressure joining surface that applies pressure to a local area of ​​the two objects to be joined on the table that overlaps with the through hole, from the side opposite the table. The control unit then applies pressure to the local area using the pressure joining unit while the two objects to be joined are in contact with each other, and, while maintaining the state in which pressure is applied to the local area, irradiates the contact point of the two objects to be joined through the through hole corresponding to the local area with laser light.

Description

[Technical field]

[0001] The present invention relates to a joining technique using laser light. [Background technology]

[0002] One of the manufacturing techniques for semiconductor devices (such as MEMS) is to bond two wafers using a eutectic reaction between two metals. Specifically, this technique involves forming a metal layer containing one of the two metals that cause a eutectic reaction as a main component and a metal layer containing the other metal as a main component on the bonding surfaces of the two wafers, respectively, and bonding the two wafers using the eutectic reaction that occurs when these metal layers come into contact and are heated. As an example, this technique is used to seal sensors (such as gyro sensors and biosensors) and waveguides inside devices.

[0003] In such a bonding technique using a eutectic reaction, it is necessary to heat the contact point of the two metal layers in a state where the two metal layers are in contact with each other without any gaps to a temperature at which the eutectic reaction occurs. Conventionally, the two wafers are pressed together and the entire two wafers are heated together with the sensors to be sealed (for example, see Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 11-220141 [Patent Document 2] China Utility Model No. 210223961 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the conventional bonding technology described above, the sensor being sealed is also heated, which may cause damage to the sensor, and therefore the sensors that can be sealed in the device using this technology are limited to those with high heat resistance.

[0006] In response to this, a technology has been proposed in recent years that uses laser light to locally heat the contact point between two metal layers (see Patent Document 2). Specifically, this technology presses two wafers, one above the other, placed on a bonding stage with a quartz plate (i.e., the two wafers are sandwiched between the bonding stage and the quartz plate), and in this state, irradiates the contact point between the two metal layers with laser light through the quartz plate, causing a eutectic reaction at the contact point.

[0007] According to such a bonding technique using laser light, the contact point of the two metal layers is heated locally, so that the thermal effect on the sensor is reduced, and as a result, it becomes possible to seal a sensor with low heat resistance in a device. In addition, since the bonding point of the two metal layers can be heated intensively with laser light, the temperature of the bonding point can be quickly raised to a temperature at which a eutectic reaction occurs, and as a result, it becomes possible to shorten the time required for the bonding process. In addition, the above-mentioned bonding technique using laser light is effective not only for bonding using a eutectic reaction (eutectic bonding), but also for various bonding methods that require local heating, such as solder bonding and welding bonding.

[0008] On the other hand, when two wafers are sandwiched between two press planes (the surface of the bonding stage and the surface of the quartz plate) and pressed, in order to bring the two metal layers into contact without any gaps, it is necessary to crush and plastically deform the two metal layers (especially the softer one of them) to fill the gaps, which requires a large pressure. Therefore, a large load is required to fill the gaps between the two metal layers over the entire area of ​​the wafer; for example, a load of 3 to 6 tons is required for a wafer with a diameter of 200 mm. For this reason, the quartz plate had to be designed to be thick enough to withstand the pressure applied during bonding (i.e., not to break when pressure is applied).

[0009] In addition, the two wafers to be bonded may be adjusted and stacked in a separate device before the above-mentioned bonding, and then transported and placed on the bonding stage. However, if the two wafers are transported in a merely stacked state, there is a risk that the adjusted positional relationship between the two wafers may be lost due to vibrations that occur during transportation.

[0010] Therefore, an object of the present invention is to provide a technique for preventing the positional relationship between two objects to be joined from being lost before joining. [Means for solving the problem]

[0011] The temporary joining device according to the present invention is a device for temporarily joining two objects to be joined using laser light, and includes a table, a pressure joining unit, a laser light source that emits laser light, and a control unit. The table is provided with a through hole through which the laser light passes. The pressure joining unit has a pressure joining surface that applies pressure to a local portion of the two objects to be joined on the table that overlaps with the through hole from the opposite side to the table. Then, with the two objects to be joined in contact with each other, the control unit applies pressure to the local portion using the pressure joining unit, and while maintaining the state in which pressure is applied to the local portion, irradiates the contact portion of the two objects to be joined through the through hole corresponding to the local portion with laser light.

[0012] The bonding apparatus related to the present invention is an apparatus for bonding the bonding surfaces of two objects to be bonded together by bonding a first metal layer and a second metal layer formed on the bonding surfaces of the two objects to be bonded together using a laser beam, and includes a table, a pressurizing mechanism, a laser light source that emits a laser beam, and a control unit. Here, the table is transparent to the laser beam, and the two objects to be bonded are placed on the table with the first metal layer and the second metal layer facing each other. The pressurizing mechanism has a diaphragm and is capable of applying pressure to the back surfaces of the objects to be bonded from the opposite side to the table. Then, the control unit applies pressure to the back surfaces of the objects to be bonded using the diaphragm while the two objects to be bonded are placed on the table, thereby bringing the first metal layer and the second metal layer into contact with each other, and further irradiates the contact point between the first metal layer and the second metal layer with a laser beam through the table while maintaining the contact state.

[0013] In the above bonding device, when pressure is applied to the back surface of the bonding object, the diaphragm can flexibly change in accordance with the shape of the back surface, so that it can apply uniform pressure in close contact with the back surface of the bonding object, and the bonding object can be deformed by the pressure. In addition, the diaphragm can continue to apply uniform pressure to the back surface by following the shape change of the back surface accompanying the deformation of the bonding object. Therefore, by applying uniform pressure to the back surface of the bonding object by the diaphragm, even if the pressure is relatively small, the bonding object can be deformed so that there is no gap between the first metal layer and the second metal layer, and the state can be maintained. Therefore, even with a relatively small pressure, the first metal layer and the second metal layer can be brought into contact with each other without any gaps over a wide area. Then, by irradiating the contact points between the first metal layer and the second metal layer with laser light in this state, the first metal layer and the second metal layer can be bonded by bonding using the laser light over a wide area. Effect of the Invention

[0014] According to the present invention, it is possible to prevent the positional relationship between two objects to be joined from being lost before joining. Also, according to the joining device related to the present invention, it is possible to reduce the pressure required for bringing two types of metal into contact without gaps in a joining technique using laser light. [Brief description of the drawings]

[0015] [Figure 1] FIG. 2 is a conceptual diagram illustrating two objects to be joined by the joining device. [Diagram 2] 1A and 1B are a cross-sectional view and a plan view showing an example in which a first metal layer and a second metal layer are patterned. [Diagram 3] FIG. 1 is a conceptual diagram showing a joining device according to a first embodiment. [Figure 4] FIG. 11 is a conceptual diagram showing a modified example of the joining device according to the first embodiment. [Diagram 5] FIG. 11 is a conceptual diagram showing a joining device according to a second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] The present invention will be specifically described with reference to a case where it is applied to a joining technique using a laser beam, particularly a joining technique utilizing a eutectic reaction.

[0017] FIG. 1 is a conceptual diagram illustrating two bonding objects 101 and 102 to be bonded by a bonding device described below. The bonding objects 101 and 102 are, for example, semiconductor wafers, and a first metal layer 201 and a second metal layer 202 are formed on their bonding surfaces 101a and 102a, respectively. Here, the first metal layer 201 is a layer containing one of two types of metals that cause a eutectic reaction as a main component, and the second metal layer 202 is a layer containing the other metal as a main component. Examples of combinations of two types of metals include a combination of aluminum (Al) and germanium (Ge), a combination of copper (Cu) and tin (Sn), a combination of silver (Ag) and tin (Sn), and a combination of indium (In) and tin (Sn). In addition, these layers are formed by vapor deposition or application of metal to the bonding surfaces 101a and 102a, but are not particularly limited thereto.

[0018] FIG. 1 shows a schematic example in which the first metal layer 201 is formed over the entire bonding surface 101a, and the second metal layer 202 is formed over the entire bonding surface 101a. In an actual manufacturing process of a semiconductor device (such as MEMS), the first metal layer 201 and the second metal layer 202 are patterned into various shapes according to the shape and use of the device. FIGS. 2(A) and 2(B) are a cross-sectional view and a plan view showing an example of the pattern shape of the first metal layer 201 and the second metal layer 202. Note that FIG. 2(B) is a plan view of only the first metal layer 201. In this example, the first metal layer 201 and the second metal layer 202 are formed in a rectangular frame shape surrounding each sensor 103 so that each sensor 103 can be sealed in the device. Note that the pattern shape of the first metal layer 201 and the second metal layer 202 is not limited to a rectangular frame shape, and can be appropriately changed according to the shape and use of the device.

[0019] The bonding device described below bonds the bonding surfaces 101a and 102a of the two bonding objects 101 and 102 by utilizing a eutectic reaction (i.e., eutectic bonding using laser light) that occurs when the contact points between the first metal layer 201 and the second metal layer 202 are heated with laser light, thereby bonding the metal layers together.

[0020] [1] First embodiment [1-1] Configuration of the joining device Fig. 3 is a conceptual diagram showing the bonding apparatus according to the first embodiment. As shown in Fig. 3, the bonding apparatus of this embodiment includes a chamber mechanism 1, a pressurizing mechanism 2, a laser light source 3, and a control unit 9A. The configuration of each unit will be specifically described below.

[0021] <Chamber mechanism 1> The chamber mechanism 1 has a first chamber component part 11, a second chamber component part 12, a drive part 13, and an exhaust part .

[0022] The first chamber component 11 and the second chamber component 12 are parts that constitute an enclosed space (hereinafter referred to as "chamber 10") for performing the bonding process, and are configured so that the chamber 10 can be selectively formed and opened by moving closer and farther apart relative to one another in the vertical direction.

[0023] In this embodiment, the first chamber component 11 is composed of a first cylindrical portion 111 arranged with its central axis aligned vertically, and a table 112 supported horizontally and without gaps inside the first cylindrical portion 111. Here, the table 112 is a table that is transparent to laser light, and is a portion on which the two bonding targets 101 and 102 are placed with the first metal layer 201 and the second metal layer 202 facing each other (see FIG. 1 and FIG. 2(A)). As an example, the table 112 is a table made of quartz. The second chamber component 12 is composed of a second cylindrical portion 121 arranged coaxially with the first cylindrical portion 111 above the first cylindrical portion 111, and a top plate 122 that covers the upper end of the second cylindrical portion 121. The upper end of the first cylindrical portion 111 and the lower end of the second cylindrical portion 121 are in contact with each other without any gap, so that the chamber 10 is formed between the table 112 and the top plate 122.

[0024] The drive unit 13 is a part that moves at least one of the first chamber component 11 and the second chamber component 12 in the vertical direction, thereby moving these components relatively closer to or farther apart from each other.

[0025] The exhaust unit 14 is a part that reduces the air pressure in the chamber 10 (specifically, the space in the chamber 10 between a diaphragm 21 and a table 112, which will be described later) until a vacuum state is reached. The exhaust unit 14 uses an air pressure adjusting device such as a vacuum pump. The chamber mechanism 1 may further include a gas supply unit that supplies a processing gas (such as argon (Ar) gas) into the chamber 10.

[0026] <Pressure mechanism 2> The pressure mechanism 2 has a diaphragm 21, and is a mechanism capable of applying pressure to the back surface 102b of the joining target 102 by the diaphragm 21 from the side opposite to the table 112. In this embodiment, the pressure mechanism 2 is composed of the diaphragm 21 and a driving unit 22 that operates the diaphragm 21. Specifically, it is as follows.

[0027] The diaphragm 21 is supported tightly inside the second cylindrical portion 121 so as to contact the back surface 102b of the upper joining object 102 of the two joining objects 101 and 102 placed on the table 112 when the chamber 10 is formed.

[0028] The driving unit 22 operates the diaphragm 21 by transmitting pressure to the diaphragm 21 using the pressure medium 221. More specifically, the pressure medium 221 is filled between the diaphragm 21 and the top plate 122 in the second chamber component 12, and the driving unit 22 operates the diaphragm 21 via the pressure medium 221 by changing the pressure applied to the pressure medium 221. Here, the pressure medium 221 may be a liquid or a gas.

[0029] <Laser light source 3> The laser light source 3 is a part that emits laser light. In this embodiment, the laser light source 3 is disposed below the table 112, and can irradiate the laser light toward the objects to be joined 101 and 102 on the table 112, while scanning the laser light in a horizontal plane along the pattern shapes of the first metal layer 201 and the second metal layer 202. The laser light source 3 can also focus the laser light on the contact point between the first metal layer 201 and the second metal layer 202.

[0030] <Control unit 9A> The control unit 9A is composed of a processing device such as a CPU (Central Processing Unit) or a microcomputer, and controls various operating units (such as the chamber mechanism 1, the pressurizing mechanism 2, and the laser light source 3) included in the bonding apparatus. Specifically, it is as follows.

[0031] When performing the bonding process, the control unit 9A forms the chamber 10 by bringing the first chamber component 11 and the second chamber component 12 close to each other and combining them, with the two bonding targets 101 and 102 placed on the table 112. Then, the control unit 9A controls the exhaust unit 14 to reduce the air pressure in the chamber 10 (specifically, the space in the chamber 10 between the diaphragm 21 and the table 112) until a vacuum is created inside the chamber 10. The control unit 9A also supplies a process gas (such as argon (Ar) gas) into the chamber 10 as necessary.

[0032] Thereafter, the control unit 9A controls the pressure mechanism 2 to apply pressure to the back surface 102b of the joining target 102 by the diaphragm 21.

[0033] Here, when pressure is applied to the back surface 102b of the bonding object 102, the diaphragm 21 can flexibly change in accordance with the shape of the back surface 102b, and can apply uniform pressure in close contact with the back surface 102b of the bonding object 102, and can deform (including elastically deform) the bonding object 102 with the pressure. In addition, the diaphragm 21 can continue to apply uniform pressure to the back surface 102b by following the shape change of the back surface 102b accompanying the deformation of the bonding object 102. Therefore, by applying uniform pressure to the back surface 102b of the bonding object 102 by the diaphragm 21, even if the pressure is relatively small, the bonding object 102 can be deformed so that there is no gap between the first metal layer 201 and the second metal layer 202, and the state can be maintained. Therefore, even with a relatively small pressure, the first metal layer 201 and the second metal layer 202 can be contacted with each other without any gaps over a wide area. That is, it is possible to reduce the pressure required to bring first metal layer 201 and second metal layer 202 into contact with each other without any gaps by applying pressure with diaphragm 21. For example, when bonding objects 101 and 102 are wafers having a diameter of 200 mm, a load of 3 to 6 tons is required when they are clamped and pressed with a press plane as in Patent Document 2, but by applying pressure with diaphragm 21, the load can be reduced to 2 tons or less.

[0034] After the first metal layer 201 and the second metal layer 202 are brought into contact with each other without any gaps by applying pressure to the back surface 102b of the joining object 102 with the diaphragm 21, the control unit 9A controls the laser light source 3 while maintaining the state, thereby irradiating the contact portion between the first metal layer 201 and the second metal layer 202 with a laser beam through the table 112. The control unit 9A also scans the laser beam in a horizontal plane along the pattern shapes of the first metal layer 201 and the second metal layer 202. This allows the first metal layer 201 and the second metal layer 202 to be bonded by eutectic bonding over the entire area of ​​the joining objects 101 and 102. In this way, the joining surfaces 101a and 102a of the two joining objects 101 and 102 are bonded to each other.

[0035] Furthermore, by applying pressure with diaphragm 21 as described above, the required pressure can be reduced, and therefore the strength required for table 112 (the strength to withstand the pressure applied during bonding) is also reduced, and as a result, the thickness of table 112 can be made relatively small.

[0036] [1-2] Variations FIG. 4 is a conceptual diagram showing a modified example of the bonding apparatus according to the first embodiment. As shown in FIG. 4, the bonding apparatus may further include a heater 4 for heating the bonding objects 101 and 102. In this embodiment, the heater 4 is a heat exchanger including a heat exchanger 41 made of a material with high thermal conductivity (such as aluminum (Al)), a heat medium 42 for providing heat to the heat exchanger 41, and a temperature adjustment unit 43 for adjusting the temperature of the heat medium 42. The heater 4 is disposed on the opposite side of the diaphragm 21 from the table 112. Specifically, the heat exchanger 41 is disposed on the inner surface of the top plate 122, and the heat medium 42 circulates between the heat exchanger 41 and the temperature adjustment unit 43 through holes provided in the top plate 122. According to this configuration, a pressure medium 221 is interposed between the heat exchanger 41 and the diaphragm 21, and heat exchange is performed between the heat exchanger 41 and the diaphragm 21 through the pressure medium 221. That is, the heat of the heater 4 is transmitted to the diaphragm 21 via the pressure medium 221 .

[0037] Then, when the control unit 9A irradiates the contact portion between the first metal layer 201 and the second metal layer 202 with the laser light, the control unit 9A controls the temperature adjustment unit 43 to heat the bonding objects 101 and 102 via the heat exchange unit 41. At this time, the control unit 9A heats the bonding objects 101 and 102 at a temperature lower than the temperature (eutectic temperature) required for eutectic bonding. This makes it possible to reduce the temperature range increased by heating with the laser light by the amount of the temperature increase at the contact portion between the first metal layer 201 and the second metal layer 202 due to heating with the heater 4. As an example, when the combination of two types of metals is a combination of aluminum (Al) and germanium (Ge), the temperature (eutectic temperature) required for eutectic bonding is about 450°C. Therefore, by heating the bonding objects 101 and 102 to, for example, about 90°C with the heater 4, the temperature range increased by heating with the laser light can be reduced to about 360°C (=450°C-90°C). That is, the heater 4 assists the heating of the contact points by the laser light, which makes it possible to reduce the laser output to save energy and to increase the processing speed of the joining process.

[0038] In addition, heating by the heater 4 can also be used for an annealing process to relieve distortion of the objects to be joined 101 and 102 that occurs during bonding (specifically, deformation of the objects to be joined 102 due to pressure applied by the diaphragm 21 that remains after bonding).

[0039] In such a configuration including the heater 4, it is preferable that the pressure medium 221 is a liquid rather than a gas. This is because a liquid has a higher thermal conductivity than a gas, and therefore the efficiency of heat exchange between the heat exchanger 41 and the diaphragm 21 via the pressure medium 221 increases, and as a result, the heat of the heater 4 is more easily transferred to the diaphragm 21.

[0040] Moreover, the heat medium 42 is preferably constant temperature water adjusted to a predetermined temperature (for example, 90° C.) by the temperature adjustment unit 43. This is because the constant temperature water can keep the temperature of the heat exchange unit 41 constant, and therefore not only can it supplementarily heat the objects to be joined 101 and 102, but also can cool them when the temperatures of the objects to be joined 101 and 102 rise too much due to heating with the laser beam (prevention of overheating).

[0041] [2] Second embodiment The bonding apparatus described in the first embodiment is an apparatus that does not have either a chuck mechanism that individually holds the objects to be bonded 101 and 102, or an alignment mechanism that adjusts their positional relationship. Therefore, the two objects to be bonded 101 and 102 are overlapped and their positional relationship is adjusted by another apparatus before being bonded by the bonding apparatus, and then transported and placed on the table 112. However, if the two objects to be bonded 101 and 102 are transported in a merely overlapped state, there is a risk that the adjusted positional relationship between the objects to be bonded 101 and 102 will be lost due to vibrations that occur during transportation, etc.

[0042] Therefore, in this embodiment, a different bonding apparatus is described which adjusts the positional relationship between two objects to be bonded 101 and 102 and performs temporary bonding to maintain the positional relationship after the adjustment, before bonding (main bonding) by the bonding apparatus described in the first embodiment. Here, the temporary bonding is performed by bonding the first metal layer 201 and the second metal layer 202 at several points by utilizing eutectic bonding using laser light.

[0043] Fig. 5 is a conceptual diagram showing a bonding device according to the second embodiment. As shown in Fig. 5, the bonding device of this embodiment includes a chuck mechanism 5, an alignment mechanism 6, a pressure mechanism 7, a laser light source 8, and a control unit 9B. The configuration of each unit will be specifically described below.

[0044] <Chuck mechanism 5 and pressure mechanism 7> The chuck mechanism 5 has a first chuck portion 51 and a second chuck portion 52 .

[0045] The first chuck portion 51 is a table having an adsorption surface 51a for adsorbing the back surface 101b of one of the two objects to be joined 101 and 102, and adsorption grooves 51b are formed over the entire area of ​​the adsorption surface 51a. The object to be joined 101 is placed on the adsorption surface 51a with the back surface 101b facing down, and in this state, the air pressure in the adsorption grooves 51b is reduced by vacuum suction or the like, whereby the back surface 101b of the object to be joined 101 can be adsorbed to the adsorption surface 51a.

[0046] Furthermore, through holes 51c for passing laser light are formed in a plurality of locations (for example, five locations; FIG. 5 illustrates three of these locations) on the chucking surface 51a of the first chuck portion 51. Also, a quartz block 511 for correcting spherical aberration of the laser light is embedded in each of the through holes 51c.

[0047] The second chuck portion 52 has an adsorption surface 52a for adsorbing the back surface 102b of the other of the two objects to be joined 102, of the two objects to be joined 101 and 102, and is disposed in a state in which the adsorption surface 52a faces the adsorption surface 51a of the first chuck portion 51. In this embodiment, the second chuck portion 52 has a base body 521 serving as its foundation, and each portion of the lower surface 521a of the base body 521 facing the through hole 51c is configured as a pressure contact surface 71a of the pressure mechanism 7. Also, the adsorption grooves 52b are formed in the pressure contact surface 71a. More specifically, it is as follows.

[0048] The pressure mechanism 7 has a pressure contact part 71 having a pressure contact surface 71a, and a drive part 72. The pressure contact part 71 is provided at each of the locations of the second chuck part 52 facing the through hole 51c. The pressure contact part 71 is provided so as to be movable in a direction perpendicular to the lower surface 521a of the base body 521 (here, the vertical direction), and can move from the lower surface 521a of the base body 521 to a protruding position where the pressure contact surface 71a protrudes downward. The drive part 72 is, for example, an air cylinder, and enables pressure to be applied to an object in contact with the pressure contact surface 71a. In this embodiment, the drive part 72 urges the pressure contact part 71 downward to move the pressure contact part 71 to the protruding position.

[0049] Then, the pressure contact surface 71a is brought into contact with the back surface 102b of the joining object 102, and in this state, the air pressure in the suction grooves 52b is reduced by vacuum suction or the like, thereby suctioning the back surface 102b of the joining object 102 to the pressure contact surface 71a. In this manner, in this embodiment, the suction surface 52a of the second chuck portion 52 is configured by the pressure contact surface 71a provided with the suction grooves 52b.

[0050] More specifically, the two objects to be joined 101 and 102 are held (adsorbed) by the first chuck portion 51 and the second chuck portion 52 as follows. Before the object to be joined 101 is adsorbed by the first chuck portion 51, the object to be joined 102 is first placed on the first chuck portion 51 with its back surface 102b facing upward. Then, by moving at least one of the first chuck portion 51 and the second chuck portion 52 in the vertical direction (for example, by lowering the second chuck portion 52), the pressure contact surface 71a (adsorption surface 52a) is brought into contact with the back surface 102b of the object to be joined 102, and in this contact state, the air pressure in the adsorption groove 52b is reduced by vacuum suction or the like, thereby adsorbing the back surface 102b of the object to be joined 102 to the pressure contact surface 71a. Thereafter, the first chuck portion 51 and the second chuck portion 52 are separated from each other (for example, the second chuck portion 52 is raised), and then the joining object 101 is adsorbed to the first chuck portion 51.

[0051] After the two objects to be joined 101 and 102 are held (adsorbed) to the first chuck portion 51 and the second chuck portion 52, the positional relationship between the two objects to be joined 101 and 102 is adjusted by the alignment mechanism 6 described below, and then at least one of the first chuck portion 51 and the second chuck portion 52 is moved in the vertical direction (for example, by lowering the second chuck portion 52) to bring the two objects to be joined 101 and 102 (specifically, the first metal layer 201 and the second metal layer 202) into contact with each other. Then, by bringing the first chuck portion 51 and the second chuck portion 52 even closer to each other against the biasing force of the drive portion 72 (for example, by further lowering the second chuck portion 52), pressure is applied to the back surface 102b of the object to be joined 102 via the pressure contact portion 71.

[0052] In this manner, the pressure mechanism 7 can apply pressure to a local area overlapping with the through-hole 51c of the back surface 102b of the joining target 102 attracted to the second chuck portion 52. This allows the first metal layer 201 and the second metal layer 202 to come into contact with each other without any gaps at that local area.

[0053] <Alignment mechanism 6> The alignment mechanism 6 is a mechanism for adjusting the positional relationship between the two objects to be joined 101 and 102, in a state in which the two objects to be joined 101 and 102 are held (adsorbed) by the first chuck portion 51 and the second chuck portion 52, so that the first metal layer 201 and the second metal layer 202 face each other. Specifically, the alignment mechanism 6 can adjust the position of at least one of the first chuck portion 51 and the second chuck portion 52 in a horizontal plane, thereby adjusting the positional relationship between the two objects to be joined 101 and 102 held (adsorbed) by them.

[0054] <Laser light source 8> The laser light source 8 is a part that emits laser light. In this embodiment, the laser light source 8 is disposed below the first chuck portion 51, and irradiates the laser light toward the joining objects 101 and 102 on the first chuck portion 51 through the through hole 51c. Here, the laser light source 8 may be one that simultaneously passes the laser light through a plurality of through holes 51c provided in the first chuck portion 51, or may be one that can move in a horizontal plane and passes the laser light through the through holes 51c one by one in order. In addition, the laser light source 3 can focus the laser light on the contact point between the first metal layer 201 and the second metal layer 202.

[0055] <Control unit 9B> The control unit 9B is composed of a processing device such as a CPU (Central Processing Unit) or a microcomputer, and controls various operating units (such as the chuck mechanism 5, the alignment mechanism 6, the pressure mechanism 7, and the laser light source 8) of the bonding device. Specifically, it is as follows.

[0056] When performing the temporary bonding process, the control unit 9B controls the alignment mechanism 6 while the two bonding objects 101 and 102 are held (adsorbed) by the first chuck portion 51 and the second chuck portion 52, to adjust the positional relationship between the two bonding objects 101 and 102 so that the first metal layer 201 and the second metal layer 202 face each other. After adjusting the positional relationship by the alignment mechanism 6, the control unit 9B moves at least one of the first chuck portion 51 and the second chuck portion 52 in the vertical direction while maintaining the positional relationship, thereby bringing the two bonding objects 101 and 102 held (adsorbed) thereto closer to each other, thereby bringing the first metal layer 201 and the second metal layer 202 into contact with each other. As a result, pressure is applied via the pressure contact unit 71 to a local area of ​​the back surface 102b of the joining object 102 that overlaps with the through hole 51c, and as a result, the first metal layer 201 and the second metal layer 202 come into contact with each other without any gaps at that local area. At this time, the control unit 9B may adjust the pressure applied to the local area by controlling the pressure mechanism 7 (specifically, the driving unit 72) while the first metal layer 201 and the second metal layer 202 are in contact with each other.

[0057] After the first metal layer 201 and the second metal layer 202 are brought into contact with each other without any gaps at the local area in this manner, the control unit 9B maintains this state and controls the laser light source 3 to irradiate the contact area between the first metal layer 201 and the second metal layer 202 with laser light through the through hole 51c corresponding to the local area. This allows the first metal layer 201 and the second metal layer 202 to be bonded by eutectic bonding at several locations on the bonding objects 101 and 102. In this manner, the bonding surfaces 101a and 102a of the two bonding objects 101 and 102 are bonded to each other.

[0058] In this way, by performing temporary joining of the two objects to be joined 101 and 102 before joining (main joining) by the joining device described in the first embodiment, the positional relationship between the two objects to be joined 101 and 102 adjusted by the alignment mechanism 6 is fixed, and as a result, the positional relationship between the two objects to be joined 101 and 102 is less likely to be disturbed even if vibrations or the like occur during transportation.

[0059] [3] Third embodiment In the bonding apparatus according to the first embodiment described above, the table 112 and the diaphragm 21 may have suction surfaces for individually suctioning the two bonding objects 101 and 102. The bonding apparatus may further include an alignment mechanism for adjusting the positional relationship between the two bonding objects 101 and 102 held (suctioned) by the table 112 and the diaphragm 21. Here, the alignment mechanism adjusts the positional relationship between the two bonding objects 101 and 102 suctioned to the table 112 and the diaphragm 21 by adjusting the position of at least one of the first chamber component 11 and the second chamber component 12 in a horizontal plane.

[0060] In this case, the control unit 9A controls the alignment mechanism while the two bonding objects 101 and 102 are held (adsorbed) on the table 112 and the diaphragm 21, thereby adjusting the positional relationship between the two bonding objects 101 and 102 so that the first metal layer 201 and the second metal layer 202 face each other. After adjusting the positional relationship by the alignment mechanism, the control unit 9A forms the chamber 10 by bringing the first chamber component 11 and the second chamber component 12 close to each other and combining them while maintaining the positional relationship. This makes it possible to bring the two bonding objects 101 and 102 held (adsorbed) on the table 112 and the diaphragm 21 close to each other, thereby bringing the first metal layer 201 and the second metal layer 202 into contact (including closeness).

[0061] Thereafter, the control unit 9A applies pressure to the rear surface 102b of the joining target 102 by using the diaphragm 21 by controlling the pressure mechanism 2 while the first metal layer 201 and the second metal layer 202 are in contact (including close proximity), thereby bringing the first metal layer 201 and the second metal layer 202 into contact with each other without any gaps. Then, while maintaining this state, the control unit 9A controls the laser light source 3 to irradiate the contact points between the first metal layer 201 and the second metal layer 202 with laser light via the table 112. The control unit 9A also scans the laser light in a horizontal plane along the pattern shapes of the first metal layer 201 and the second metal layer 202.

[0062] According to the bonding device of this embodiment, the temporary bonding described in the second embodiment is not necessary, and the entire system used for bonding can be simplified.

[0063] The above-mentioned description of the embodiment should be considered as illustrative in all respects and not restrictive. The scope of the present invention is indicated by the claims, not by the above-mentioned embodiment. Furthermore, the scope of the present invention is intended to include all modifications within the meaning and scope of the claims.

[0064] For example, the above-described bonding apparatus is not limited to bonding using a eutectic reaction (eutectic bonding), and can be applied to various bonding methods that require localized heating, such as solder bonding and welding bonding. [Explanation of symbols]

[0065] 1. Chamber mechanism 2. Pressure mechanism 3 Laser light source 4 Heater 5 Chuck mechanism 6 Alignment mechanism 7. Pressurizing mechanism 8 Laser light source 9A, 9B Control section 10. Chamber 11 First chamber component 12 Second chamber component 13 Drive unit 14 Exhaust section 21 Diaphragm 22 Drive unit 41 Heat exchange section 42 Heat medium 43 Temperature adjustment section 51 First chuck part 51a Adsorption surface 51b Suction groove 51c through hole 52 Second chuck part 52a Adsorption surface 52b Suction groove 71 Pressure Welding Part 71a Pressure contact surface 72 Drive unit 101, 102 Joint target 101a, 102a joint surface 101b, 102b back 103 Sensors 111 First cylindrical part 112 Table 121 Second cylindrical section 122 Tabletop 201 1st metal layer 202 2nd metal layer 221 Pressure medium 511 Quartz Block 521 Base body 521a Bottom side

Claims

1. An apparatus for temporarily joining two objects to be joined using laser light, a table having a through hole through which the laser light passes, and a quartz block for correcting optical aberration of the laser light embedded in the through hole; a pressure welding portion having a pressure welding surface that applies pressure to a local portion of the two objects to be joined that overlaps with the through hole from an opposite side to the table; a laser light source that emits the laser light; a control unit that applies pressure to the local area by the pressure welding unit while the two objects to be joined are in contact with each other, and irradiates the contact point of the two objects to be joined through the through hole corresponding to the local area while maintaining the state in which the pressure is applied to the local area; A temporary bonding device comprising:

2. the table includes a first chuck portion having an adsorption surface that adsorbs a back surface of one of the two objects to be joined, the adsorption surface being provided with the through hole; a second chuck portion having an adsorption surface for adsorbing a back surface of the other of the two objects to be joined; an alignment mechanism for adjusting a positional relationship between the two objects to be joined while the two objects to be joined are attracted to the first chuck portion and the second chuck portion; Further comprising:

2. The temporary joining device according to claim 1, wherein the control unit brings the two objects to be joined into contact after adjusting the positional relationship by the alignment mechanism, and applies pressure to the local area and irradiates the laser light while the two objects to be joined are in contact.

3. 3. The temporary joining device according to claim 2, wherein the pressure joining surface of the pressure joining portion is a surface capable of adsorbing a back surface of the one of the objects to be joined, and constitutes at least a part of the adsorption surface of the second chuck portion.

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