Apparatus and method for producing resin bonded body

Abstract

Provided are a resin joined body production device and a resin joined body production method which enable production of a resin joined body exhibiting a strong joining force without using an adhesive while preventing deterioration in optical characteristics and mechanical strength of resin members. This resin joined body production device produces a resin joined body by joining two or more resin members, and is provided with a surface treatment mechanism and a joining mechanism. The surface treatment mechanism has an electrode unit for generating plasma, and a member holding mechanism which is disposed with a gap from the electrode unit and which holds the resin members. By means of plasma generated by the electrode unit, to-be-joined surfaces of the resin members held by the member holding mechanism are activated. The joining mechanism causes two or more resin members, in which at least one of the opposing to-be-joined surfaces is activated by the surface treatment mechanism, to be attached together at the to-be-joined surfaces.

Description

[Technical Field]

[0001] The present invention relates to an apparatus and method for producing a resin bonded body having high quality and high bonding strength. [Background technology]

[0002] Technologies for joining various components without using adhesives (hereinafter referred to as adhesiveless joining) are being investigated for the purpose of further miniaturizing semiconductor devices and improving the optical properties of optical devices. Among these, lamination technology, which is widely used for adhesiveless joining of resins, involves bringing the resin joining surfaces into contact and then heating them to the resin's melting temperature to weld them together. However, this method has the problem that the crystallinity and molecular structure of the entire resin component change (thermal transformation) when heated, adversely affecting its optical properties and mechanical strength. Therefore, as an adhesiveless method for joining resins to obtain strong bonding strength without causing thermal damage, a method is being considered in which the joining surfaces of two resin components to be joined are surface treated, and then the joining surfaces are glued together and pressurized at low temperature. Patent Document 1 discloses a method for joining resin members by irradiating the joining surfaces of the resin members with ultraviolet light having a wavelength of 10 to 200 nm in an atmosphere with an oxygen concentration lower than the oxygen concentration in the atmosphere, and then applying pressure while heating the resin members at a temperature below the softening temperature of the resin members. Furthermore, Patent Document 2 discloses that a strong bonding force can be obtained without altering the resin members by bringing the joining surfaces of the resin members into contact with an ionized gas, then placing water between the joining surfaces and bonding and pressing them together at a temperature of 70°C or higher. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2018-65376 [Patent Document 2] Japanese Patent Application Laid-Open No. 2013-132822 Summary of the Invention [Problem to be solved by the invention]

[0004] However, with the method of Patent Document 1, ultraviolet rays penetrate deep into the resin member, which causes the layer of resin modified by ultraviolet rays to become deep, resulting in problems such as deterioration of optical properties such as yellowing and a decrease in mechanical strength. In addition, in the method of Patent Document 2, the surface treatment means is changed from ultraviolet light to ionized gas in order to suppress the above problems, but because the resin member is supported by one of two opposing electrodes and the joining surface of the resin member is in contact with the ionized gas, there is a problem that the resin member may be altered by collisions of charged particles in the ionized gas and heating due to charge accumulation, and therefore, a sufficient effect of suppressing deterioration of the optical properties and mechanical strength of the resin member cannot be obtained. The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide an apparatus and method for producing an adhesiveless resin joined body having strong joining strength without deteriorating the optical properties or reducing the mechanical strength of the resin members. [Means for solving the problem]

[0005] The apparatus for manufacturing a resin bonded body of the present invention, which solves the above-mentioned problem, is an apparatus for manufacturing a resin bonded body in which two or more resin members are bonded together, and includes: an electrode unit that generates an ionized gas; and a member holding mechanism that is arranged at a position separated by a space from the electrode unit and holds the resin members. The apparatus is also equipped with: a surface treatment mechanism that activates the joining surfaces of the resin members held by the member holding mechanism by the ionized gas generated by the electrode unit; and a joining mechanism that bonds together, at their joining surfaces, two or more resin members, at least one of which is opposed to one another and activated by the surface treatment mechanism. Furthermore, the present invention provides a method for producing a resin joined body that solves the above-described problems. The method is a method for producing a resin joined body in which two or more resin members are joined together, and includes a surface treatment step of generating an ionized gas and applying the ionized gas to joining surfaces of the resin members that are located at a position separated by a space from the place where the ionized gas is generated, to activate the joining surfaces; and a joining step of bonding together the two or more resin members, at least one of whose opposing joining surfaces has been activated in the surface treatment step, at their joining surfaces. [Effects of the Invention]

[0006] According to the present invention, there are provided an apparatus for manufacturing a resin bonded body having high quality and high bonding strength, and a method for manufacturing a resin bonded body. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic diagram showing an example of an apparatus for producing a resin joined body of the present invention. [Figure 2] FIG. 2 is a schematic diagram showing another example of the apparatus for producing a resin joined body of the present invention. [Figure 3] FIG. 3 is a schematic diagram showing another example of the apparatus for producing a resin joined body of the present invention. [Figure 4] FIG. 4 is a schematic diagram showing another example of the apparatus for producing a resin joined body of the present invention. [Figure 5] FIG. 5 is a schematic diagram showing another example of the apparatus for producing a resin joined body of the present invention. [Figure 6] FIG. 6 is a schematic diagram showing another example of the apparatus for producing a resin joined body of the present invention. [Figure 7] FIG. 7 is a schematic diagram showing another example of the apparatus for producing a resin joined body of the present invention. [Figure 8] FIG. 8 is a schematic diagram showing another example of the apparatus for producing a resin joined body of the present invention. [Figure 9] FIG. 9 is a schematic diagram showing another example of the apparatus for producing a resin joined body of the present invention. [Figure 10] FIG. 10 is a schematic diagram showing another example of the apparatus for producing a resin joined body of the present invention. [Figure 11] FIG. 11 is a schematic diagram showing an example of the method for producing a resin joined body of the present invention. [Figure 12] FIG. 12 is a schematic diagram showing another example of the method for producing a resin joined body of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0008] [First embodiment of the apparatus for manufacturing a resin bonded body] Hereinafter, examples of embodiments of the present invention will be described with reference to the drawings. Fig. 1 is a schematic diagram showing a first embodiment of an apparatus for manufacturing a resin joined body of the present invention. As shown in Fig. 1, the manufacturing apparatus 101 of the first embodiment has a surface treatment mechanism 4 that activates a surface 3 of the first resin member 1 that is to be joined with the second resin member 2 and / or a surface 3' of the second resin member 2 that is to be joined with the first resin member 1, and a joining mechanism 5 that, after surface treatment by the surface treatment mechanism 4, bonds the first resin member 1 and the second resin member 2 together at their respective joining surfaces 3, 3'.

[0009] The first resin member 1 and the second resin member 2 can be made of polyimide (PI), silicone resin (SI), epoxy resin (EP), phenolic resin (PF), polyurethane resin (PU), melamine resin (MF), polyethylene (PE), polyamide (PA), polyacetal (POM), polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), polyether ether ketone (PEEK), polytetrafluoroethylene (PTFE), or other suitable materials depending on the application. However, thermoplastic resins such as polypropylene (PP) and polyethylene terephthalate (PET) are preferred over thermosetting resins such as polyimide and epoxy resin. In particular, amorphous thermoplastic resins such as polyvinyl chloride (PVC), polystyrene (PS), acrylonitrile butadiene styrene (ABS), polymethyl methacrylate (PMMA), polycarbonate (PC), polyetherimide (PEI), and polyamide-imide (PAI) are preferred. This is because thermoplastic and amorphous materials have higher thermal mobility of molecular chains, resulting in greater molecular diffusion at the bonding interface between the first resin member 1 and the second resin member 2. The greater this molecular diffusion, the stronger the intermolecular force at the bonding interface, improving the bonding strength. Furthermore, although the first resin member 1 and the second resin member 2 may be different types, it is preferable that they are the same type from the viewpoint of molecular diffusion.

[0010] The surface treatment mechanism 4 and the joining mechanism 5 will be described below. [Surface treatment organization] First, the surface treatment mechanism 4 will be described. The surface treatment mechanism 4 includes an electrode unit 7 and a component holding mechanism 8 that holds the first resin member 1. The component holding mechanism 8 shown in FIG. 1 holds the first resin member 1, but it may hold the second resin member 2 instead of the first resin member 1, or it may hold the first resin member 1 and the second resin member 2 simultaneously. Furthermore, after the surface treatment of the first resin member 1, the component holding mechanism 8 may hold the second resin member 2. The electrode unit 7 is composed of an anode 13 , a cathode 14 arranged with a space provided between it and the anode 13 , and at least one gas supply nozzle 16 . An ionized gas generating power supply 11 is connected to the anode 13 and the cathode 14. After supplying any ionized gas generating gas from a gas supply nozzle 16, the ionized gas generating power supply 11 is used to apply a voltage equal to or greater than the breakdown voltage (electric field) between the anode 13 and the cathode 14, thereby generating the ionized gas 9. Furthermore, it is preferable that the gas supply nozzle 16 is electrically insulated from the cathode 14. This electrical insulation prevents a high cathode 14 voltage from being applied to the gas supply nozzle 16, thereby suppressing abnormal discharge that may occur at the gas supply port of the gas supply nozzle 16. Suppressing this abnormal discharge allows for stable gas supply, thereby enabling continuous activation of the bonding surface 3 of the first resin member 1 and / or the bonding surface 3' of the second resin member 2. Furthermore, the gas supply port of the gas supply nozzle 16 may be slit-shaped in the depth direction, or multiple supply ports may be provided. In the present invention, "ionized gas 9" refers to a gas containing ions and electrons, which are charged particles, radicals and excitons, which are active species, and neutrons. Furthermore, "radicals" refer to atoms and molecules that have highly reactive unpaired electrons.

[0011] The type of gas for generating the ionized gas is not particularly limited, but examples include rare gases such as argon and helium, and non-polymerizable gases such as oxygen, water vapor, and nitrogen. Two or more different gases may be mixed. In the surface treatment mechanism 4, the charged particles in the ionized gas 9 generated between the anode 13 and the cathode 14 do not diffuse, and active species and neutrons mainly diffuse to the outside of the electrode unit 7. Then, the active species in the diffused gas adhere to the bonding surface 3 of the first resin member 1, which is disposed across a space from the electrode unit 7, causing a chemical reaction with the bonding surface 3, which is activated. The surface treatment mechanism 4 may be used to perform surface treatment on only one of the joining surface 3 of the first resin member 1 or the joining surface 3' of the second resin member 2, or may be used to perform surface treatment on both the joining surface 3 and the joining surface 3'. In the following explanation of the surface treatment mechanism 4, unless otherwise specified, the case where surface treatment is performed on the joining surface 3 of the first resin member 1 will be described. When performing surface treatment on the joining surface 3' of the second resin member 2, the resin member 1 can be read as the resin member 2 and the joining surface 3 as the joining surface 3'.

[0012] In the present invention, "activation" means chemically reacting the bonding surface 3 with an active species to cut the molecular chains on the surface of the bonding surface 3 and / or to add functional groups. By cutting the molecular chains, it is possible to increase the thermal mobility of the molecular chains present on the bonding surface 3 (lower the softening temperature). By adding functional groups, it is possible to generate polar functional groups such as hydroxyl groups. The thermal mobility of the molecular chains can be measured using a nanothermal microscope (nanoTA) or the like. Furthermore, the type and amount of polar functional groups generated can be confirmed by infrared absorption spectroscopy (IR) or the like. The activity of the bonding surface 3 can be easily controlled by changing the type of gas used, the gas flow rate, the output of the ionized gas generating power source 11, and the like.

[0013] The ionized gas generating power supply 11 can be selected from a DC power supply or an AC power supply. In the present invention, "AC" refers to a power supply whose voltage and current values ​​constantly change over time. The values ​​generally change sinusoidally over time, but other examples include power supplies whose values ​​change in a rectangular or pulsed waveform. The power supply frequency of an AC power supply is not particularly specified, but examples include low frequencies on the order of several kHz to high frequencies on the order of several tens of MHz, and microwaves on the order of several GHz. It is preferable to select an electrode material with a low sputtering rate, such as stainless steel or titanium, for the material of the anode 13 and the cathode 14 in the electrode unit 7. This makes it possible to suppress sputtering of the electrode material and prevent impurities from adhering to the bonding surface 3. Furthermore, in order to suppress the amount of current flowing into the ionized gas generating power supply 11, the surfaces of the anode 13 and the cathode 14 may be coated with a dielectric material, such as alumina.

[0014] The surface treatment mechanism 4 is preferably provided with a process monitoring means 10 for monitoring the process. By providing this process monitoring means 10, abnormalities during surface treatment can be detected early. For example, by providing an optical emission spectrometer that can measure the light emission state of the ionized gas 9, the type of gas in the ionized gas 9 and the degree of ionization can be determined from the emission peak and wavelength. Furthermore, by providing a radical monitor, the amount of radicals can be measured. Furthermore, by inserting various probes such as a curling probe, the density of the ionized gas 9 can be measured. These monitoring means may be other than those described here and may be changed as appropriate depending on the object to be monitored. The component holding mechanism 8 holds the first resin member 1 so that the bonding surface 3 of the first resin member 1 faces the space between the anode 13 and the cathode 14 where the ionized gas 9 is generated, across a space. The specific mechanism and installation location of the component holding mechanism 8 are not particularly limited as long as it can hold the first resin member 1 in this manner. The component holding mechanism 8 may hold both the first resin member 1 and the second resin member 2, or only one of them. Two or more component holding mechanisms 8 may also be provided. In the surface treatment mechanism 4 according to the first embodiment, the first resin member 1 is held by the component holding mechanism 8 located across a space from the electrode unit 7, rather than on the electrode. This suppresses charged particle collisions and thermal loads on the bonding surface 3, thereby reducing deterioration of the optical properties and mechanical strength of the first resin member 1. The same applies to activating the bonding surface 3' of the second resin member 2.

[0015] [Joining mechanism] Next, we will explain the joining mechanism 5. The joining mechanism 5 is a means for bonding the joining surface 3 of the first resin member 1 and the joining surface 3′ of the second resin member 2 together, and is exemplified by heating and pressurizing means such as a heat press machine 12. By bonding the bonding surface 3 of the first resin member 1 and the bonding surface 3' of the second resin member 2 together using the bonding mechanism 5, entanglement of molecular chains at the interface (hereinafter referred to as molecular diffusion) and a condensation reaction between polar functional groups (hereinafter referred to as covalent bond formation) progress, resulting in the development of a bonding strength between the bonding surface 3 of the first resin member 1 and the bonding surface 3' of the second resin member 2. This allows the production of a resin bonded body 6 with strong bonding strength. Note that at least one of the bonding surfaces of three or more resin members may be activated in the surface treatment mechanism 4, and then the members may be stacked and bonded together. The bonding mechanism 5 preferably includes a heating means. Heating the first resin member 1 and the second resin member 2 promotes molecular diffusion and covalent bond formation, thereby further improving the bonding strength of the resin bonded body 6. The heating means is not particularly limited and may be an infrared heater, a microwave heater, an ultrasonic heater, a hot air generator, a heating furnace, or the like.

[0016] The joining mechanism 5 preferably includes a pressure applying means. By applying pressure after joining the joining surface 3 of the first resin member 1 and the joining surface 3' of the second resin member 2 together, it is possible to eliminate gaps between the joining surface 3 of the first resin member 1 and the joining surface 3' of the second resin member due to waviness or the like. This increases the actual contact area between the joining surfaces 3 and 3', improving the joining strength of the resin joined body 6. When the joining mechanism 5 is a heat press 12, the press surface 15 is preferably made of a soft rubber material such as silicone rubber or urethane rubber. This improves cushioning properties and allows pressure to be applied uniformly to the press surface 15. This increases the actual contact area between the joining surface 3 of the first resin member 1 and the joining surface 3' of the second resin member 1, further improving the joining strength of the resin joined body 6. Furthermore, a cushioning material made of a rubber material (not shown) may be placed between the first resin member 1 and / or the second resin member 2 and the press surface 15. The bonding mechanism 5 preferably includes a post-heating mechanism (not shown). After bonding the resin bonded body 6, post-heating the resin bonded body 6 using a post-heating means promotes molecular diffusion at the bonding interface, further improving the bonding strength of the resin bonded body 6. The post-heating means may be an infrared heater, a microwave heater, an ultrasonic heater, a hot air generator, a heating furnace, or the like, and is not particularly limited.

[0017] [Second embodiment of the apparatus for manufacturing a resin bonded body] 2 is a schematic diagram showing a second embodiment of the apparatus for producing a resin bonded body according to the present invention. The difference between the apparatus 101 of the first embodiment and the apparatus 102 of the second embodiment is the electrode unit 7 of the surface treatment mechanism 4. As shown in FIG. 2 , in the manufacturing apparatus 102 of the second embodiment, the gas supply nozzle 16 of the electrode unit 7 is positioned so that the ionized gas generating gas can be supplied toward the bonding surface 3 of the first resin member 1 held by the member holding mechanism 8 through the space between the anode 13 and the cathode 14 where the ionized gas 9 is generated. By passing the ionized gas generating gas through the space between the anode 13 and the cathode 14 in this manner, the efficiency of gas decomposition by the ionized gas 9 can be increased. This allows a large amount of activated species required to activate the bonding surface 3 to be generated, enabling high-speed processing. Furthermore, by positioning the gas supply nozzle 16 so that the ionized gas generating gas is supplied toward the member holding mechanism 8, the gas flow can efficiently transport the activated species in the ionized gas 9 to the bonding surface 3 of the first resin member 1, allowing the bonding surface 3 to be activated quickly.

[0018] The anode 13 and the cathode 14 are preferably plate-shaped, and the length h1 of the anode 13 in the gas supply direction and the length h2 of the cathode 6 in the gas supply direction are both longer than the distance w between the anode 13 and the cathode 14. By making the lengths h1 and h2 longer than the distance w and spreading the ionized gas 9 in the gas supply direction, the distance that the ionized gas generating gas passes through the ionized gas 9 is increased, and gas decomposition by the ionized gas 9 is promoted. This allows a large amount of activated species to be generated, and the activation speed for the bonding surface 3 can be increased. Furthermore, the length h1 of the anode 13 in the gas supply direction and the length h2 of the cathode 14 in the gas supply direction do not necessarily have to be the same, but it is preferable that they are the same. For example, if h1 is shorter than h2 and the anode 13 and cathode 14 are aligned on the gas supply nozzle 16 side, the gap between the anode 13 and the first resin member 1 will be wider than the gap between the cathode 14 and the first resin member 1, which could lead to the ionized gas generating gas passing through the ionized gas 9 along the anode 13 and the cathode 14 diffusing through this gap into the device. If h1 and h2 are the same length, the ionized gas generating gas can pass efficiently through the ionized gas 9 without diffusing into the device.

[0019] Furthermore, the anode 13 and the cathode 14 do not necessarily have to be parallel, but are preferably arranged substantially parallel. When the anode 13 and the cathode 14 are arranged substantially parallel, a uniform electric field can be formed between the anode 13 and the cathode 14, thereby stably activating the bonding surface 3 without inducing abnormal discharge due to localized electric field concentration. Here, "substantially parallel" means that the anode 13 and the cathode 14 are designed to be parallel, and even if they deviate slightly from parallel due to manufacturing errors, this is considered to be "substantially parallel." On the other hand, if the anode 13 and the cathode 14 are designed not to be parallel, this is not considered to be "substantially parallel." It is preferable that the distance d1 between the bonding surface 3 of the first resin member 1 and the anode 13 and the distance d2 between the bonding surface 3 of the first resin member 1 and the cathode 14 are approximately the same, and the distances d1 and d2 may be adjusted as appropriate while remaining approximately the same, taking into account charged particle collisions from the ionized gas 9 and thermal load.

[0020] [Third embodiment of the apparatus for manufacturing a resin bonded body] 3 is a schematic diagram showing a third embodiment of the apparatus for producing a resin bonded body according to the present invention. The difference between the production apparatus 102 of the second embodiment and the production apparatus 103 of this third embodiment is that the surface treatment mechanism 4 is provided with a rectifying plate. As shown in FIG. 3, the surface treatment mechanism 4 is provided with a rectifying plate 17 that surrounds the space between the component holding mechanism 8 and the electrode unit 7. By providing the rectifying plate 17 that surrounds the space between the component holding mechanism 8 and the electrode unit 7, active species are efficiently supplied to the bonding surface 3 of the first resin member 1, and the activation speed for the bonding surface 3 can be increased. This further increases the bonding strength of the resin bonded body 6. Furthermore, since the inflow of impurities other than the ionized gas generating gas (air, moisture, etc.) is suppressed, the unintended generation of functional groups on the bonding surface 3 can be reduced, and the activity can be increased. This further increases the bonding strength of the resin bonded body 6. The rectifying plate 17 may also be provided with a second gas supply nozzle 28. By arranging a plurality of gas supply nozzles 28 on the rectifying plate 17 and supplying gas from the wall surface, the active species are prevented from heading toward the wall surface of the rectifying plate 17, and the number of active species that are not supplied to the bonding surface 3 and instead adhere to the wall surface can be reduced. This makes it possible to supply a large amount of active species to the bonding surface 3. It is preferable that the rectifying plate 17 be electrically insulated from the anode 13 and the cathode 14 so that it is at an electrically floating potential. This makes it possible to suppress the attraction of charged particles by the electric field and to suppress collisions of charged particles with the junction surface 3. The current plate 17 does not necessarily have to surround the entire space between the member holding mechanism 8 and the electrode unit 7, but may surround only the space between the first resin member 1 and the electrode unit 7.

[0021] [Fourth embodiment of the apparatus for manufacturing a resin bonded body] 4 is a schematic diagram showing a fourth embodiment of the apparatus for producing a resin bonded body according to the present invention. The difference between the production apparatus 102 of the second embodiment and the production apparatus 104 of this fourth embodiment is the electrode unit 7 of the surface treatment mechanism 4. As shown in FIG. 4, the electrode unit 7 is provided with a magnet 18 inside the cathode 14, which forms a magnetron magnetic field in the space between the cathode 14 and the anode 13. The magnet 18 may be an electromagnet, but may also be a permanent magnet such as a ferrite magnet or a neodymium magnet. The magnets 18 provided inside the cathode 14 are permanent magnets, and are arranged so that a central magnet 18a is surrounded by peripheral magnets 18b. The polarities of the central magnet 18a and the peripheral magnets 18b are opposite to each other.

[0022] In FIG. 4, the surface polarity of the central magnet 18a of the cathode 14 as viewed from the anode 13 side is an S pole, and the surface polarity of the peripheral magnets 18b is an N pole. However, these polarities may be reversed. By arranging the magnets 18 in this manner, a magnetron magnetic field is generated in the space between the cathode 14 and the anode 13. This magnetron magnetic field localizes the charged particles in the ionized gas 9, thereby suppressing the diffusion and collision of the charged particles with the bonding surface 3 of the first resin member 1 and further reducing the deterioration of the optical properties and mechanical strength of the first resin member 1. Furthermore, the magnetron magnetic field localizes the charged particles, improving the decomposition efficiency of the ionized gas generating gas and increasing the density of the ionized gas 9. This reduces the discharge impedance between the cathode 14 and the anode 13, thereby lowering the discharge voltage applied to the cathode 14. This reduction in discharge voltage reduces the discharge voltage applied to the cathode 14, so that the energy of ions and sputtered particles bouncing off the surface of the cathode 14 decreases, reducing damage when they collide with the bonding surface 3.

[0023] Furthermore, with the improvement in the decomposition efficiency of the ionized gas generating gas, a large amount of activated species can be generated, which makes it possible to activate the bonding surface 3 at high speed. It is also preferable that cooling water channels (not shown) be formed between the magnets 18. Any cooling means other than water can be used. By cooling the magnets 18, it is possible to prevent the magnets 18 from being demagnetized by heat. The magnetron magnetic field formed by the central magnet 18a and the peripheral magnet 18b can be measured on the surface of the cathode 14 using a magnetic flux density measuring device such as a gaussmeter, and the higher the magnetic flux density, the higher the density of the ionized gas 9 can be.

[0024] [Fifth embodiment of the apparatus for manufacturing a resin bonded body] 5 is a schematic diagram showing a fifth embodiment of the apparatus for producing a resin bonded body according to the present invention. The difference between the apparatus 104 of the fourth embodiment and the apparatus 105 of the fifth embodiment is the electrode unit 7 of the surface treatment mechanism 4. As shown in Figure 5, two anodes 13 and 13' are arranged with a space between them, sandwiching the cathode 14, and ionized gases 9 and 9' are generated on both sides of the cathode 14. By generating ionized gases 9 and 9' on both sides of the cathode 14 in this way, the magnetron magnetic field can be effectively utilized, and a large amount of activated species can be generated by the highly densified ionized gas. This allows the bonding surface 3 to be activated even more quickly.

[0025] [Sixth embodiment of the apparatus for manufacturing a resin bonded body] 6 is a schematic diagram showing a sixth embodiment of the apparatus for producing a resin bonded body according to the present invention. The difference between the apparatus 105 of the fifth embodiment and the apparatus 106 of the sixth embodiment is that the surface treatment mechanism 4 is provided with a metal mesh. As shown in FIG. 6, in the surface treatment mechanism 4, grounded metal meshes 19, 19' are arranged in the space between the cathode 14 and the anode 13, 13' and in the space between the cathode 14 and the anode 13, 13' and the first resin member 1 and / or the second resin member 2. By arranging the grounded metal meshes 19, 19', charged particles leaking from the electrode unit 7 can be attracted by an electric field. This suppresses collisions of charged particles with the bonding surface 3 of the first resin member 1, and further reduces decreases in mechanical strength and deterioration of optical properties. Furthermore, by arranging the metal meshes 19, 19', sputtered electrode material can be captured, preventing foreign matter from adhering to the bonding surface 3.

[0026] In the embodiment shown in FIG. 6, there are two spaces, one between the anode 13 and the cathode 14, and one between the anode 13' and the cathode 14. Metal meshes 19, 19' are disposed between both spaces and the first resin member 1 and / or the second resin member 2. However, disposing one mesh in only one of these spaces can still achieve some degree of suppression of charged particle leakage. Disposing one mesh in both spaces is preferable because it can sufficiently suppress charged particle leakage. In the embodiment shown in FIG. 6, metal meshes 19, 19' are disposed between the anode 13 and the cathode 14, and between the anode 13' and the cathode 14, respectively. However, a configuration in which each space is blocked by a single metal mesh may also be used. The metal meshes 19, 19' are not particularly limited and may be made of a mesh of woven metal wires or a punched metal plate with holes.

[0027] [Seventh embodiment of the apparatus for manufacturing a resin bonded body] 7 is a schematic diagram showing a seventh embodiment of the apparatus for producing a resin bonded body according to the present invention. The difference between the apparatus 101 of the first embodiment and the apparatus 107 of the seventh embodiment is that the surface treatment mechanism 4 is disposed in a chamber 20, and the chamber 20 is evacuated to a vacuum by a vacuum pump 21. By creating a vacuum in the surface treatment environment, the distance (mean free path) that active species in the ionized gas 9 travel before colliding with other active species or neutrons is increased. This reduces the amount of recombination loss of the active species before they reach the bonding surface 3 of the first resin member 1, enabling the bonding surface 3 to be activated quickly. Furthermore, since the bonding surface 3 of the first resin member 1 can be activated even when the distances d1 and d2 between the electrode unit 7 and the bonding surface 3 of the first resin member 1 are increased, the thermal load from the ionized gas 9 can be further reduced by increasing the distances d1 and d2. This further reduces the decrease in mechanical strength and the deterioration of optical properties. In the present invention, "vacuum" refers to a gas pressure lower than atmospheric pressure. The degree of vacuum within the chamber 20 can be confirmed with a vacuum gauge 22 such as a differential pressure gauge, a Pirani vacuum gauge, or an ionization vacuum gauge.

[0028] [Eighth embodiment of the apparatus for manufacturing a resin bonded body] 8 is a schematic diagram showing an eighth embodiment of the resin bonded body manufacturing apparatus of the present invention. The manufacturing apparatus 108 of this eighth embodiment includes a resin member transport mechanism 23 for automatically transporting the first resin member 1 and / or the second resin member 2 to the bonding mechanism 5. The resin member transport mechanism 23 is not particularly limited, and examples thereof include a belt conveyor that rotates a circular belt on a cart to transport the first resin member 1 and / or the second resin member 2, and a transport robot that travels independently between processes to transport the first resin member 1 and / or the second resin member 2 in a transport direction 24.

[0029] [Ninth embodiment of the apparatus for manufacturing a resin bonded body] 9 is a schematic diagram showing a ninth embodiment of a manufacturing apparatus for a resin bonded body according to the present invention. The manufacturing apparatus 109 of this ninth embodiment includes a resin member transport mechanism 23 that is composed of unwinding rolls 23a and 23a', a winding roll 23b, and transporting rolls 23c and 23d, and that transport the resin bonded body 6 to the bonding mechanism 5. The unwinding roll 23a unwinds the first resin member 1, the unwinding roll 23a' unwinds the second resin member 2, the transporting roll 23c transports the first resin member 1 and the second resin member 2, the transporting roll 23d transports the resin bonded body 6, and the winding roll 23b winds up the resin bonded body 6. The electrode unit 7 is used to surface-treat the joining surface 3 of the first resin member 1 and / or the joining surface 3' of the second resin member 2, which are held by a resin member holding mechanism 8 consisting of four conveyor rolls 23c, while the first resin member 1 and / or the second resin member 2 are being conveyed. The joining surface 3 of the first resin member 1 and the joining surface 3' of the second resin member 2 are then bonded to each other by the joining mechanism 5. This allows for continuous production of the resin joined body 6 if the first resin member 1 and the second resin member 2 are thin, long members. This allows for higher productivity of the resin joined body 6 compared to batch processing. Furthermore, the resin joined body 6 may be conveyed intermittently depending on the processing time for each process.

[0030] [Tenth embodiment of the apparatus for manufacturing a resin bonded body] FIG. 10 is a schematic diagram showing a tenth embodiment of a resin bonded body manufacturing apparatus according to the present invention. This tenth embodiment of the manufacturing apparatus 110 includes electrode units 7, 7′ and ionized gas generating power supplies 11, 11′, which separately perform surface treatment on the first resin member 1 and the second resin member 2 during transport. The electrode units 7, 7′ and ionized gas generating power supplies 11, 11′ are provided for the first resin member 1 and the second resin member 2, respectively, which are held by a member holding mechanism 8 comprised of unwinding rolls 23a, 23a′ and transport roll 23c. By changing the surface treatment conditions for each, the activity of the bonding surface 3 of the first resin member 1 and the bonding surface 3′ of the second resin member 2 can be individually controlled. By optimizing the activity of the bonding surfaces 3 and 3′, respectively, the bonding strength can be further improved.

[0031] [First embodiment of method for producing resin bonded body] Next, a method for producing a resin bonded body of the present invention will be described. Fig. 11 is a schematic diagram showing a first embodiment of the method for producing a resin bonded body of the present invention. As shown in Fig. 11, the method for producing a resin bonded body of the first embodiment includes a surface treatment step 25 and a bonding step 26.

[0032] [Surface treatment process] The surface treatment step 25 will now be described. In the surface treatment step 25, an arbitrary ionized gas generating gas is supplied from the gas supply nozzle 16, and then the ionized gas 9 is generated by the ionized gas generating mechanism 27. Active species from the generated ionized gas 9 are applied to the joining surface 3 of the first resin member 1 and / or the joining surface 3' of the second resin member 2, which are located at a position separated by a space from the location where the ionized gas 9 is generated, to activate the joining surfaces 3, 3'. In this way, the active species and neutrons in the ionized gas 9 generated by the ionized gas generation mechanism 27 diffuse to the outside of the generation space of the ionized gas 9. Then, the active species among the neutrons and active species in the diffused gas adhere to the bonding surface 3 of the first resin member 1, which is disposed across a space from the ionized gas 9, causing a chemical reaction with the bonding surface 3, activating the bonding surface 3. This suppresses charged particle collisions and thermal loads on the bonding surface 3, and reduces deterioration of the optical properties and mechanical strength of the first resin member 1. The same applies to activating the bonding surface 3' of the second resin member 2.

[0033] The type of gas for generating the ionized gas is not particularly limited, but examples include rare gases such as argon and helium, and non-polymerizable gases such as oxygen, water vapor, and nitrogen. Two or more different gases may be mixed. The ionized gas generation mechanism 27 is not particularly limited as long as it is a means that can ionize the gas that is the raw material for the ionized gas 9 by applying energy such as an electric field, heat, or light, but the electrode unit 7 is preferred because it can locally generate the ionized gas 9 by applying an electric field to the space between the cathode 14 and the anode 13. The space where ionized gas 9 is generated refers to a region to which energy such as an electric field, heat, or light is applied by ionized gas generation mechanism 27. For example, in the case of electrode unit 7, it refers to the space between cathode 14 and anode 13. In the surface treatment step 25, the surface treatment may be performed on either the joining surface 3 of the first resin member 1 or the joining surface 3' of the second resin member 2, or on both. Surface treatment of both the joining surfaces 3 and 3' is preferable because it increases the joining strength of the resin joined body 6 after the subsequent joining step.

[0034] [Joining process] The bonding step 26 will now be described. In the bonding step 26, the bonding surface 3 of the first resin member 1 and the bonding surface 3' of the second resin member 2, one or both of which have been activated by the surface treatment step 25, are brought face to face and bonded together. By bonding them together, molecular diffusion and covalent bond formation progress at the interface between the bonding surface 3 of the first resin member 1 and the bonding surface 3' of the second resin member 2, and a bonding strength is developed between the bonding surface 3 of the first resin member 1 and the bonding surface 3' of the second resin member 2, making it possible to produce a resin bonded body 6 having a strong bonding strength. Furthermore, it is preferable to apply pressure to the first resin member 1 and the second resin member 2 using a heat press 12 or the like to prevent voids from forming at the bonding interface due to undulations or the like on the bonding surface 3 of the first resin member 1 and the bonding surface 3' of the second resin member 2. This increases the actual contact area between the first resin member 1 and the second resin member 2, improving the bonding strength of the resin bonded body 6.

[0035] Furthermore, the higher the temperatures of the first resin member 1 and the second resin member 2 in the bonding process 26, the more molecular diffusion and covalent bond formation at the bonding interface of the resin bonded body 6 are promoted. On the other hand, if the temperatures of the first resin member 1 and the second resin member 2 exceed the Tg of the resin constituting each resin member, the molecular structure of the resin constituting each resin member changes (thermal alteration), which may deteriorate the mechanical and optical properties of the first resin member 1 and the second resin member 2. Therefore, it is preferable to keep the temperatures of the entire first resin member 1 and the entire second resin member 2 in the bonding process 26 below the glass transition temperature (Tg). This allows for the production of a high-quality resin bonded body 6 without changing the molecular structure of the resin constituting the first resin member 1 and the second resin member 2. The temperatures of the first resin member 1 and the second resin member 2 in the bonding process 26 may be different.

[0036] The means for heating the first resin member 1 and the second resin member 2 in the joining step 26 is not particularly limited, and may be an infrared heater, a microwave heater, an ultrasonic heater, a hot air generator, a heating furnace, or the like. Furthermore, after producing the resin bonded body 6 in the bonding step 26, the resin bonded body 6 may be post-heated. This promotes molecular diffusion at the bonding interface, further improving the bonding strength of the resin bonded body 6. The post-heating method may be an infrared heater, a microwave heater, an ultrasonic heater, a hot air generator, a heating furnace, or the like, and is not particularly limited. Furthermore, from the viewpoint of preventing thermal deterioration, the post-heating temperature is preferably lower than the glass transition temperature (Tg) of the first resin member 1 and the second resin member 2. Three or more resin members may be stacked and bonded together in the bonding step 26. When three or more resin members are stacked together, only one of the opposing bonding surfaces may have been surface treated in the surface treatment step 25, or both of the opposing bonding surfaces may have been surface treated.

[0037] [Second embodiment of method for producing resin bonded body] FIG. 12 is a schematic diagram illustrating a second embodiment of the method for producing a resin bonded body of the present invention. In this second embodiment, gas is sprayed toward the bonding surface 3 of the first resin member 1 from the opposite side of the ionized gas 9 generation space from the first resin member 1, so as to pass through the ionized gas 9. By passing the gas through the space between the anode 13 and the cathode 14 in this manner, the efficiency of gas decomposition by the ionized gas 9 can be increased. This allows a large amount of activated species required to activate the bonding surface 3 to be generated, enabling high-speed processing. Furthermore, by spraying the gas toward the bonding surface 3 of the first resin member 1, the gas flow efficiently transports the activated species in the ionized gas 9 to the bonding surface 3 of the first resin member 1, allowing the bonding surface 3 to be activated quickly. [Example]

[0038] The method and apparatus for producing the resin bonded body 6 of the present invention will be described below with reference to examples, but the present invention is not limited to these examples.

[0039] [Example 1] A resin bonded body 6 was manufactured by batch processing each step using a resin bonded body manufacturing apparatus 107 shown in FIG. 7. A 100 μm-thick polymethyl methacrylate (PMMA) film (Technoloy (registered trademark) S000, glass transition temperature 100°C) was used for both the first resin member 1 and the second resin member 2 (hereinafter, the first resin member 1 will be referred to as PMMA1 and the second resin member as PMMA2). The surface roughness (arithmetic mean roughness Ra) of PMMA1 and PMMA2 was measured using a laser microscope (Olympus Corporation: OLS4100), and was found to be 12 nm for both. The electrode unit 7 of the surface treatment mechanism 4 will now be described. The cathode 14 and anode 13 of the electrode unit 7 were made of SUS304 metal plates, and were arranged so that their surfaces were parallel to each other. Nitrogen gas was supplied at 100 sccm from a gas supply nozzle 16 (A type) disposed between the electrode unit 7 and the member holding mechanism 8, and the pressure inside the chamber 20 was adjusted to 5 Pa by an exhaust pump 21. A 13.56 MHz high-frequency power supply 11 was used as the ionized gas generating power supply 11 connected to the electrode unit 7. The output of the high-frequency power supply 11 was adjusted to 100 W, and a high-frequency voltage was applied to generate the ionized gas 9, which was then treated for 10 seconds on the bonding surface 3 of PMMA1 to activate it. The bonding surface 3' of PMMA2 was also treated under the same conditions. Next, the joining mechanism 5 will be described. A heat press 12 was used in the joining mechanism 5, and the joining surface 3 of PMMA1 and the joining surface 3' of PMMA2 were bonded together for 10 minutes to produce a resin joined body 6. During this process, the substrate temperatures of PMMA1 and PMMA2 were adjusted to 91°C, and a pressing pressure of 2 MPa was applied. The substrate temperatures were confirmed using a radiation thermometer (SATOTECH DT-8855).

[0040] The bonding strength of the resin bonded body 6 prepared above was evaluated by a 90-degree peel test using a peel tester (Nidec-Shimpo Corporation: FGS-50E). The peel speed was 5 cm / min. The resulting bonding strength of the resin bonded body 6 was 0.7 N / cm. The yellowness index (YI) values ​​of PMMA1 and PMMA2 after surface treatment were evaluated using a spectrophotometer (SE2000, Nippon Denshoku Industries Co., Ltd.). The yellowness index (YI) values ​​of both PMMA1 and PMMA2 were 0.46. Furthermore, the yellowness index (YI) values ​​of PMMA1 and PMMA2 without surface treatment were both 0.45, indicating that the yellowness index of the PMMA1 and PMMA2 prepared above was 2.2%. In this example, the "yellowing index" refers to the percentage change in the yellowness index of the resin member before and after surface treatment, calculated as follows: (yellowing index of the resin member after surface treatment - yellowing index of the resin member before surface treatment) / yellowing index of the resin member before surface treatment × 100. The difference in yellowing index before and after surface treatment was 0.01, which is within the measurement error range, and it is believed that the resin member was not damaged by the surface treatment.

[0041] [Example 2] A resin bonded body 6 of PMMA1 and PMMA2 was produced under the same bonding conditions as in Example 1, except that the gas supplied from the gas supply nozzle 16 was arranged so that it passed between the cathode 14 and the anode 13 and hit the first resin member 1 and the second resin member 2 held by the member holding mechanism 8 (Type B). The bonding strength of the resin bonded body 6 produced above was 1.6 N / cm. After the surface treatment, the yellowness index YI value of PMMA1 and PMMA2 was both 0.46, and the yellowing index was both 2.2%. The bonding strength of the resin bonded body 6 was improved by approximately 2.2 times compared to Example 1. This improvement in bonding strength is thought to be due to the fact that the gas supplied from the gas supply nozzle 16 of the surface treatment mechanism 4 passes between the cathode 14 and the anode 13 and is then impinged on the PMMA1 and PMMA2 held by the member holding mechanism 8, increasing the amount of active species supplied to the bonding surfaces 3, 3' of the PMMA1 and PMMA2, thereby improving activity. The difference in yellowness index before and after the surface treatment was the same.

[0042] [Example 3] A resin bonded body 6 of PMMA1 and PMMA2 was produced using the same bonding apparatus and bonding conditions as in Example 2, except that a magnet 18 for generating a magnetron magnetic field was provided inside the cathode 14. The bonding strength of the resin bonded body 6 produced as described above was 3.0 N / cm or more, and fracture occurred during peeling. Furthermore, the yellowness index YI value of both PMMA1 and PMMA2 after the surface treatment was 0.46, and the yellowing index was 2.2% for both. The bonding strength of the resin bonded body 6 was improved by more than 1.8 times compared to Example 2. The cathode 14 of the surface treatment mechanism 4 was equipped with a magnet 18 for generating a magnetron magnetic field, and the magnetron magnetic field generated between the cathode 14 and the anode 13 presumably localized and densified the ionized gas 9. This accelerated gas decomposition, increasing the amount of activated species supplied to the bonding surfaces 3, 3' of the PMMA1 and PMMA2, further improving activity. The difference in yellowness index before and after the surface treatment was the same.

[0043] [Example 4] A resin bonded body 6 of PMMA1 and PMMA2 was produced using the same bonding apparatus and bonding conditions as in Example 3, except that in the surface treatment process in the surface treatment mechanism 4, only PMMA2 was surface treated and PMMA1 was not surface treated. The resin bonded body 6 produced as described above had a bonding strength of 3.0 N / cm or more and broke during peeling. The yellowness index YI value of PMMA2 after the surface treatment was 0.46, and the yellowing index was 2.2%. No difference in the bonding strength of the resin bonded body 6 was observed compared to Example 3, and even when only the bonding surface 3' of the PMMA 2 was surface-treated, a strong bonding strength was obtained that caused the bond to break during peeling. Thus, it is thought that activating only one of the bonding surfaces 3 or 3' by surface treatment promotes molecular diffusion and covalent bond formation at the bonding interface, thereby generating bonding strength. However, the reason why there was no difference in the bonding strength of the resin bonded body 6 between this example and example 3 is that both were bonded so strongly that they broke during peeling. If they had not broken during peeling, it is presumed that the bonded body 6 of example 3, in which the surface treatment was applied to both the bonding surface 3 of PMMA1 and the bonding surface 3' of PMMA2, would have had a higher bonding strength.

[0044] [Example 5] A resin bonded body 6 of PMMA1 and PMMA2 was produced using the same bonding device and bonding conditions as in Example 3, except that in the bonding process in the bonding mechanism 5, the temperature of the PMMA1 and PMMA2 components was adjusted to 135°C, which is above the glass transition temperature (100°C), and pressure was applied. The bonding strength of the resin bonded body 6 produced as described above was 3.0 N / cm or more, and fracture occurred during peeling. Furthermore, the yellowness index YI value of both PMMA1 and PMMA2 after the surface treatment was 0.46, and the yellowing index was 2.2% for both. No difference was observed in the bonding strength of the resin bonded body 6 compared to Example 3. This is because, as in Example 3, the bonding strength of the resin bonded body 6 produced in this example was improved to the point where it broke during peeling, and no difference could be observed. The difference in yellowness before and after the surface treatment was the same. However, the yellowness index of the resin bonded body 6 was 1.21 in this example, while it was 0.89 in Example 3. This is thought to be because the temperature of the PMMA1 and PMMA2 members rose from 91°C to 135°C during the bonding process, and the temperature of the PMMA1 and PMMA2 members rose above their glass transition temperatures, causing thermal deterioration.

[0045] [Example 6] A 100 μm-thick polyethylene terephthalate (PET) film (Lumirror (registered trademark) T60, glass transition temperature 70°C) was used as the first resin member 1 and the second resin member 2 (hereinafter, the first resin member 1 will be referred to as PET1 and the second resin member as PET2). The temperatures of PET1 and PET2 were adjusted to 65°C in the bonding mechanism 5. A resin bonded body 6 of PET1 and PET2 was produced using the same bonding device and bonding conditions as in Example 3, except for these. The resin bonded body 6 formed by bonding PET1 and PET2 using the bonding device had a bonding strength of 0.6 N / cm. The yellowness index YI values ​​of both PET1 and PET2 before the surface treatment were 2.01. After the surface treatment, the yellowness index YI values ​​of both PET1 and PET2 were 2.02, and the yellowing index was 0.5%. The bonding strength of the resin bonded body 6 was reduced to 0.2 times that of Example 3. This is thought to be because the first resin member 1 and the second resin member 2 were changed from amorphous materials, PMMA 1 and 2, to crystalline materials, PET 1 and 2, which reduced the thermal mobility of molecular chains and reduced molecular diffusion at the bonding interfaces 3 and 3'.

[0046] [Comparative Example 1] Resin bonded body 6 of PMMA1 and PMMA2 was produced using the same bonding device and under the same bonding conditions as in Example 1, except that PMMA1 and PMMA2 were placed in the space between anode 13 and cathode 14 of electrode unit 7. The bonding strength of the resin bonded body 6 prepared above was 3.0 N / cm or more, and fracture occurred during peeling. Furthermore, the yellowness index YI value of both PMMA1 and PMMA2 after the surface treatment was 0.57, and the yellowing index was 26.7%. Compared to Example 1, the bonding strength of the resin bonded body 6 was improved by more than 4.2 times. This is thought to be because PMMA1 and PMMA2 were placed in the space between the anode 13 and the cathode 14 where the ionized gas 9 was generated, which increased the number of active species and charged particle collisions supplied to the bonding surfaces 3 and 3', thereby improving activity. Meanwhile, the difference in yellowness index before and after the surface treatment was 1.2 times greater. This is thought to be due to the application of charged particle collisions and thermal load to the bonding surfaces 3 and 3' of PMMA1 and PMMA2, which deepened the modified layers at the bonding surfaces 3 and 3' and caused thermal alteration.

[0047] Comparative Example 2 Resin bonded body 6 of PMMA1 and PMMA2 was produced using the same bonding device and bonding conditions as in Example 1, except that neither PMMA1 nor PMMA2 was subjected to surface treatment. The bonding strength of the resin bonded body 6 produced as described above was 0.0 N / cm. In this example, since no surface treatment was performed, the yellowness index YI value of PMMA1 and PMMA2 was both 0.45, and the yellowing index was both 0.0%. The joining conditions for each example and comparative example are summarized in Table 1, and the results are summarized in Table 2. In Table 2, the bonding strength is indicated as follows: 3.0 N / cm or more: ◎, 1.0 N / cm or more but less than 3.0 N / cm: ◯, 0.5 N / cm or more but less than 1.0 N / cm: △, and less than 0.5 N / cm: ×. The yellowing rate is indicated as 0.0% or more but less than 5.0%: ◎, and 5.0% or more: ×.

[0048] [Table 1]

[0049] [Table 2] [Industrial Applicability]

[0050] By using the apparatus and method for producing a resin bonded body of the present invention, it is possible to easily obtain an adhesiveless resin bonded body having high bonding strength without altering the optical properties and mechanical properties, and the bonded body can be applied to, for example, optical films and microfluidic devices, but the range of applications is not limited to these. [Explanation of symbols]

[0051] 1. First resin member 2 Second resin member 3, 3' joint surface 4. Surface treatment mechanism 5 Joining mechanism 6 Resin joint 7, 7' electrode unit 8. Component holding mechanism 9, 9' Ionized gas 10, 10' Process monitoring means 11, 11' Power supply for generating ionized gas 12 Heat press machine 13, 13' Anode 14, 14' cathode 15 Press surface 16, 16' Gas Supply Nozzle 17 Rectifier plate 18 Magnet 18a Central magnet 18b Peripheral magnet 19, 19' metal mesh 20 chambers 21 Vacuum pump 22 Vacuum gauge 23 Transport mechanism 23a, 23a' Unwinding roll 23b Winding roll 23c, 23d Transport roll 24 Conveying direction 25 Surface treatment process 26 Joining process 27 Ionized gas generation mechanism 28 Second gas supply nozzle 101~110 Manufacturing equipment for resin bonded bodies h1 Length of the anode in the gas supply direction h2 Cathode length in the gas supply direction d1 Distance from the anode to the joining surface of the resin material d2 Distance from the cathode to the joining surface of the resin material

Claims

1. An apparatus for producing a resin bonded body in which two or more resin members are bonded, comprising: an electrode unit that generates an ionized gas; and a member holding mechanism that is disposed at a position separated by a space from the electrode unit and holds the resin member, the member holding mechanism activating a joining surface of the resin member held by the member holding mechanism with active species contained in the ionized gas generated by the electrode unit; a bonding mechanism for bonding two or more of the resin members, at least one of which is activated by the surface treatment mechanism, together at their respective bonding surfaces; The electrode unit is an opposing anode and a cathode, the surface treatment mechanism includes a current plate surrounding a space between the electrode unit and the member holding mechanism, the current plate being electrically insulated from the electrode unit; Manufacturing equipment for resin joints.

2. The member holding mechanism holds the space between the anode and the cathode where the ionized gas is generated and the joining surface of the resin member so as to face each other across a space, 2. The apparatus for manufacturing a resin joined body according to claim 1, wherein the electrode unit has a gas supply nozzle that supplies an ionized gas generating gas through a space between the anode and the cathode in a direction toward the resin member held by the member holding mechanism.

3. 3. The apparatus for producing a resin joined body according to claim 2, wherein the cathode has a magnet therein for forming a magnetron magnetic field in a space between the cathode and the anode.

4. 4. The apparatus for producing a resin joined body according to claim 2, further comprising a grounded metal mesh provided between a space between the anode and the cathode and the resin member held by the member holding mechanism.

5. A method for producing a resin joined body in which two or more resin members are joined, comprising the steps of: a surface treatment process in which an ionized gas is generated between an anode and a cathode, and active species contained in the ionized gas are applied to a joining surface of the resin member disposed at a position separated by a space from a place where the ionized gas is generated, to activate the joining surface, while the space is surrounded by a current plate electrically insulated from the anode and the cathode; A bonding process is performed in which two or more of the resin members, at least one of which is opposed to each other and has been activated in the surface treatment process, are bonded to each other at their respective bonding surfaces. A method for producing a resin bonded body.

6. 6. The method for producing a resin joined body according to claim 5, wherein in the surface treatment step, an ionized gas generating gas is supplied toward the joining surfaces of the resin members through a place where the ionized gas is generated, and the ionized gas is applied to the joining surfaces.

7. 7. The method for producing a resin joined body according to claim 5, wherein in the joining step, a temperature of the entire resin members to be joined is set to be lower than a glass transition temperature of each of the resins constituting the resin members.

8. The method for producing a resin joined body according to claim 7 , wherein each of the resins constituting the resin members is a thermoplastic resin.

9. The method for producing a resin joined body according to claim 8 , wherein each of the resins constituting the resin members is amorphous.

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