Multilayer wiring board having an LC resonant circuit, and electronic component package using the multilayer wiring board having an LC resonant circuit

Abstract

Provided are a multi-layer wiring board having an LC resonance circuit exhibiting an enhanced resonance characteristic and an enhanced signal attenuation characteristic, and an electronic component package using the multi-layer wiring board having the LC resonance circuit. For this purpose, the multi-layer wiring board having the LC resonance circuit with conductive layers and insulating resin layers being alternately stacked on both surfaces of a core board is provided with: a first set of wires constituting both ends of the LC resonance circuit and formed in a first one of the conductive layers; a set of vias penetrating the insulating resin layers; and a second set of wires connected to the input / output terminals of the LC resonance circuit and formed in a second one of the conductive layers, wherein the first set of wires are connected to the second set of wires by way of the set of vias.

Description

[Technical field]

[0001] The present invention relates to a multilayer wiring board having an LC resonant circuit, and an electronic component package using a multilayer wiring board having an LC resonant circuit. [Background technology]

[0002] As mobile devices become more sophisticated, the electronic components inside them are becoming more dense and compact. From the perspective of high performance, in order to carry out high-speed, large-volume data communications, multiple frequency bands from MHz to GHz are used in adjacent states, and even higher frequencies are being used. In this environment, signals are filtered in the high-frequency front-end module through switch elements within the device, and are divided into several blocks for signal processing. Thus, the mobile field requires appropriate filters that have the ability to accurately acquire the frequency band to be used and block adjacent frequency bands.

[0003] The transmission and reception methods of mobile devices are broadly divided into FDD and TDD, and in recent front-end modules, they are sometimes used in combination. Devices using the FDD method use surface-mounted filters such as BAW filters and SAW filters that have steep attenuation characteristics and select a narrow band of 20 to 100 MHz. On the other hand, TDD requires filters with a passband of 500 to 900 MHz. It is said that BAW and SAW filters are difficult to cover the relatively wide band of 400 MHz to 900 MHz required for TDD at sub-6 GHz (3.7 / 4.5 GHz) and above. Surface-mounted LTCC filters are components that have the characteristics to filter a wide band, but the attenuation characteristics of the stopband are relatively gradual. For these reasons, filters with steeper attenuation characteristics that can reliably block adjacent bands are desired.

[0004] In the front-end module mentioned above, many passive components including filters and active components are mounted on the front-end module board. It is expected that the number of these components will increase in the future as high-speed, large-capacity communications will be performed using various frequency bands. In light of this, a proposal has been made to incorporate passive components consisting of inductors and capacitors, as well as filter components, into the wiring board, thereby reducing the number of components occupying the board surface and contributing to a smaller size and lower height. By incorporating the above-mentioned elements into the board, it is possible to shorten the wiring length and at the same time reduce reflections at the junctions with different materials such as solder. This is therefore advantageous for boards that handle high frequencies.

[0005] As a method for incorporating a capacitor, which is a passive component, inside a substrate, in addition to a method for burying the capacitor component inside the substrate, a method has been proposed in which a capacitor is formed inside the substrate using thin film technology, taking advantage of the structure of the conductive layers and insulating resin stacked in the multilayer wiring substrate.

[0006] Furthermore, recent advances in through-hole formation technology have made it possible to precisely form small through-holes with a diameter of 100 μm or less at a pitch of 150 μm or less in a 300 μm-thick glass material. After forming through-holes in a glass substrate using this technology, an electric current is applied to electrically connect the conductive layers on the front and back of the glass substrate, forming an element in the shape of a tiny solenoid inductor. These elements are less likely to have an electromagnetic effect on the surroundings, and are also less susceptible to electromagnetic influence from the surroundings, because the center of the magnetic flux is generated parallel to the plane direction of the glass.

[0007] Furthermore, glass substrates have excellent flatness and smoothness, and have properties similar to silicon substrates in forming fine wiring, and can provide high insulation in terms of electrical properties. Taking advantage of the flatness and smoothness, it is possible to form thin films of 200 nm or less, making it an advantageous material for forming minute, large-capacity capacitor structures. These properties have attracted attention for use in semiconductor interposers and in the high-frequency field. Forming capacitor structures and inductor structures on glass substrates can be applied as a technology for obtaining small, low-profile high-frequency front-end module substrates. Patent Document 1 discloses a technology for obtaining a frequency filter by combining such inductor structures and capacitor structures. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Patent application No. 2018-99705 Summary of the Invention [Problem to be solved by the invention]

[0009] In many of the wiring connections of the inductors and capacitors formed on the glass substrate disclosed in Patent Document 1, the wiring itself is shared with the wiring constituting part of the resonator in order to efficiently shorten the wiring length. Therefore, a phenomenon occurs in which the current flowing in the LC parallel resonator at the resonant frequency also flows through the main signal line (called the main line). The path through which the resonant current flows is mixed into part of the main line, deteriorating the filter characteristics. A structure in which multiple resonators are connected accumulates signal degradation.

[0010] The present invention has been made in consideration of such problems, and aims to provide a multilayer wiring board having an LC resonant circuit with improved resonance characteristics and signal attenuation characteristics, and an electronic component package using a multilayer wiring board having an LC resonant circuit. [Means for solving the problem]

[0011] In order to solve the above-mentioned problems, one of the representative multilayer wiring boards having an LC resonant circuit of the present invention separates the path through which the resonant current flows in a resonant circuit composed of a capacitor and an inductor by an interlayer via formed between the layers, thereby separating the path through which the high-frequency current flows near the resonant frequency. Effect of the Invention

[0012] According to the present invention, it is possible to provide a multilayer wiring board having an LC resonant circuit with improved resonance characteristics and signal attenuation characteristics, and an electronic component package using a multilayer wiring board having an LC resonant circuit. Problems, configurations and effects other than those described above will become apparent from the description of the following embodiments. [Brief description of the drawings]

[0013] [Figure 1-a] FIG. 1-a is a detailed top view of a parallel resonant circuit (main line to GND) having a bundling via 8 according to an embodiment of the present invention. [Figure 1-b] FIG. 1-b is a top view of a parallel resonant circuit having a bonding via 8 according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a cross-sectional view of a multilayer wiring board having bundling vias 8 according to an embodiment of the present invention. [Figure 3-a] FIG. 3-a is a detailed top view of a conventional parallel resonant circuit. [Figure 3-b] FIG. 3-b is a top view of a conventional parallel resonant circuit. [Figure 4] FIG. 4 is a cross-sectional view of a conventional multilayer wiring board. [Diagram 5] 5A to 5C are cross-sectional views showing a manufacturing process of a multilayer wiring board having bundling vias 8 according to an embodiment of the present invention. [Figure 6] 6A to 6C are cross-sectional views showing a manufacturing process of a multilayer wiring board having bundling vias 8 according to an embodiment of the present invention. [Figure 7] 7A to 7C are cross-sectional views showing a process for manufacturing a multilayer wiring board having bundling vias 8 according to an embodiment of the present invention. [Figure 8]8A to 8C are cross-sectional views showing a manufacturing process of a multilayer wiring board having bundling vias 8 according to an embodiment of the present invention. [Figure 9] 9A to 9C are cross-sectional views showing a manufacturing process of a multilayer wiring board having bundling vias 8 according to an embodiment of the present invention. [Figure 10] 10A to 10C are cross-sectional views showing a manufacturing process of a multilayer wiring board having bundling vias 8 according to an embodiment of the present invention. [Figure 11] 11A to 11C are cross-sectional views showing a manufacturing process of a multilayer wiring board having bundling vias 8 according to an embodiment of the present invention. [Figure 12] 12A to 12C are cross-sectional views showing a manufacturing process of a multilayer wiring board having bundling vias 8 according to an embodiment of the present invention. [Figure 13] 13A to 13C are cross-sectional views showing a manufacturing process of a multilayer wiring board having bundling vias 8 according to an embodiment of the present invention. [Figure 14] FIG. 14 is a cross-sectional view showing a process of forming a capacitor structure 12 on a core substrate 1 according to the embodiment of the present invention. [Figure 15] FIG. 15 is a cross-sectional view showing a process of forming a capacitor structure 12 on a core substrate 1 according to an embodiment of the present invention. [Figure 16] FIG. 16 is a cross-sectional view showing a process of forming a capacitor structure 12 on a core substrate 1 according to an embodiment of the present invention. [Figure 17] FIG. 17 is a cross-sectional view showing a process of forming a capacitor structure 12 on a core substrate 1 according to an embodiment of the present invention. [Figure 18] FIG. 18 is a cross-sectional view showing a process of forming a capacitor structure 12 on a core substrate 1 according to an embodiment of the present invention. [Figure 19] FIG. 19 is a cross-sectional view showing a process of forming a capacitor structure 12 on a core substrate 1 according to an embodiment of the present invention. [Figure 20] FIG. 20 is a cross-sectional view showing a process of forming a capacitor structure 12 on a core substrate 1 according to an embodiment of the present invention. [Figure 21] FIG. 21 is a cross-sectional view showing a process for forming a multilayer wiring board according to an embodiment of the present invention. [Figure 22]FIG. 22 is a cross-sectional view showing a process for forming a multilayer wiring board according to an embodiment of the present invention. [Figure 23-a] Figure 23-a is the equivalent circuit of a two-pole bandpass filter. [Figure 23-b] Figure 23-b is the equivalent circuit of a two-pole bandpass filter. [Figure 24-a] FIG. 24-a is an equivalent circuit of a low-pass filter having an attenuation pole. [Figure 24-b] FIG. 24-b is an equivalent circuit of a low-pass filter having an attenuation pole. [Figure 25-a] FIG. 25-a is a top view of a parallel resonant circuit having a bonding via 8 according to an embodiment of the present invention. [Figure 25-b] FIG. 25-b is a top view of a conventional parallel resonant circuit. [Figure 26] FIG. 26 is a graph showing the transmission characteristics at the resonance frequency. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Note that the present invention is not limited to the embodiment. In addition, in the description of the drawings, the same parts are denoted by the same reference numerals.

[0015] In the two-pole bandpass filter using the resonator shown in Figure 23-a, at least two LC parallel resonators are used. In this circuit, the parallel resonator near the resonant frequency has a high impedance, and the current flowing into the GND line is rapidly reduced. Therefore, the main line has bandpass filter characteristics.

[0016] If you want to obtain a larger attenuation characteristic of a parallel resonator at a given frequency, it is effective to give it a higher impedance at the resonant frequency. The phase difference between the current and voltage of the capacitor and coil is shifted by 90 degrees and -90 degrees. For this reason, for example, in a parallel connection, a shift of 180 degrees occurs at the connection point, resulting in an open state at high frequencies. Taking advantage of this, in the embodiment of the present invention, a connection method is adopted that separates the resonator from the main line, as shown in Figure 23-b.

[0017] 1-a to 4 are top views and cross-sectional views of the simplest LC parallel resonant circuit as an example of an LC resonant circuit. Fig. 1-a and Fig. 1-b are top views of an LC parallel resonant circuit according to an embodiment of the present invention, and Fig. 3-a and Fig. 3-b are top views of an LC parallel resonant circuit in which the path of the resonant current is not separated. In each circuit, the size of the elements is the same, but the binding parts are different.

[0018] Fig. 2 is a cross-sectional view of an LC parallel resonant circuit according to an embodiment of the present invention. Wiring formed on the lower conductive layer 3, which connects the inductor and capacitor constituting the resonator, is connected to wiring formed on the upper conductive layer 10, which connects to the input / output terminals, using bundling vias 8. Fig. 4 is a cross-sectional view of an LC parallel resonant circuit in which the path of the resonant current is not separated. Wiring connected to the input / output terminals is branched off from the wiring formed on the lower conductive layer 3, which connects the inductor and capacitor constituting the resonator.

[0019] The multilayer wiring board 15 according to this embodiment has an inductor 13 inside the board and a capacitor 12 on the lamination surface, and serves as an electronic component having an LC resonant circuit for use in wireless communication in mobile devices and the like.

[0020] Multilayer wiring board 15 has a glass substrate as core substrate 1. Through holes 2 are formed in core substrate 1 in the lamination direction. If the upper surface of core substrate 1 is the front surface and the lower surface is the back surface in a cross section, conductive layers and insulating resin layers are alternately laminated on the front surface and back surface, respectively. Through holes 2 are formed in core substrate 1 as a portion for electrically connecting adjacent conductor layers, and capacitor upper electrode vias 6, interlayer vias 7, and bundling vias 8 are provided in insulating resin layer 9.

[0021] Next, the manufacturing process of the multilayer wiring board will be described with reference to the cross-sectional views of Fig. 5 to Fig. 13. A through hole 2 is formed in the glass core substrate 1 of Fig. 5, as shown in Fig. 6. A plating seed layer 303 is formed on the inner wall surface of this through hole 2, as shown in Fig. 7. The plating seed layer is also formed on the front and back surfaces 301 and 302 of the glass substrate.

[0022] In Fig. 8, a resist 151 is used to form an opening for forming a plating pattern at a predetermined location. In Fig. 9, copper plating 304 is applied to the opening in Fig. 8 to make the film thickness uniform on the front and back surfaces of the glass. A location for forming a capacitor structure 12 is provided at a predetermined location. Separately from this, a through hole 2 is used to provide a plating wiring pattern so as to wrap around the core substrate 1, forming a solenoid-type inductor structure 13.

[0023] 10, the resist 151 is removed to leave the wiring pattern of the plating seed layer and the lower conductive layer 3. Then, in FIG. 11, the plating seed layers 301 and 302 formed in unnecessary portions are removed, and insulating resin layers 901 to 903 are formed.

[0024] 12, insulating resin 9 is laminated, and an MIM capacitor is formed inside it. The MIM capacitor further has a capacitor upper electrode via 6 formed therein for connection to an upper conductive layer 10. Also, an interlayer via 7 for connecting a wiring pattern formed on the lower conductive layer 3 to the upper conductive layer 10, or a bundling via 8 according to an embodiment of the present invention, is formed.

[0025] In FIG. 13, an upper conductive layer 10 is formed on an insulating resin, and a multilayer wiring board 15 can be constructed by stacking any number of layers from this.

[0026] Next, the material, shape, physical properties, and preferable performance of each element will be explained.

[0027] Possible materials for the core substrate 1 include glass, ceramic, organic resin, semiconductor, and composite materials thereof, but any material can be used as long as it is a substrate on which a resonant circuit of an inductor structure 13 and a capacitor structure 12 is formed.

[0028] It is necessary to use a core substrate 1 having excellent dimensional stability. The linear expansion coefficient is preferably -0.5 ppm / K or more and 15.0 ppm / K or less. In addition, since the multilayer wiring substrate of the present embodiment can also be used for mounting semiconductor components, the linear expansion coefficient is preferably about 4 ppm / K, which is the same as that of a silicon chip.

[0029] Furthermore, it is necessary to use a material with low hygroscopicity for the core substrate 1. If the inside of the core substrate 1 absorbs moisture, outgassing occurs, which reduces the reliability of interlayer connections within the substrate.

[0030] Glass substrates are inexpensive, have excellent surface flatness and insulating properties, and are suitable for forming high-frequency circuits. Examples of glass include non-alkali glass, alkali glass, borosilicate glass, quartz glass, sapphire glass, and photosensitive glass.

[0031] In this embodiment, non-alkali glass is used in consideration of high frequency applications. Regarding the core substrate 1 using the glass handled in this embodiment, the method of producing the base material may be any method and is not limited to a specific method. In addition, functions such as strength and antistatic properties may be imparted by surface treatment or the like.

[0032] The thickness of the core substrate 1 is preferably 0.08 mm or more and 0.8 mm or less in consideration of the process of forming the through holes 2 and handling during manufacturing. Regarding handling of the core substrate 1, the multilayer wiring substrate 15 of the present invention may be manufactured in a state where the core substrate 1 is bonded to a support substrate. The material of the support substrate is not limited to a specific one.

[0033] Next, the through hole 2 in the core substrate 1 in Fig. 6 is formed by a laser, a chemical treatment, an electric discharge machining, or a combination of these. As shown in Fig. 7, a plating seed layer 303 is applied to the wall surface by, for example, a sputtering process. In addition, the wall surface may be subjected to a chemical treatment for the purpose of smoothing after the through hole 2 is formed.

[0034] As a method for forming the through hole 2, in addition to laser processing and electric discharge processing, when a photosensitive resist material is used, sandblasting processing, dry etching processing, chemical etching processing using hydrofluoric acid or the like may be used as a process. Laser processing and electric discharge processing are preferable because they are simple and have good throughput. The laser that can be used can be selected from CO2 laser, UV laser, picosecond laser, and femtosecond laser. From a structural standpoint, it is preferable that the opening diameter is smaller than the width of the wiring formed in the lower conductive layer 3 formed on the front and back sides of the core substrate 1. More preferably, from the perspective of the processing accuracy of the hole drilling and the accuracy of photolithography, it is desirable that an opening with a diameter 10 μm or more smaller than the end of the wiring is arranged at the connection part with the wiring of the lower conductive layer 3.

[0035] In FIG. 7, plating seed layers 301, 302, and 303 act as power supply layers and adhesive layers for electrolytic plating carried out when forming a wiring pattern in a semi-additive process.

[0036] The plating seed layer is formed on the front and back surfaces 301 and 302 of the glass and on the inner wall 303 of the through hole 2 by a sputtering method or a CVD method. For example, copper, nickel, titanium, aluminum, chromium, molybdenum, tungsten, tantalum, gold, palladium, iridium, ruthenium, platinum, or a combination of a plurality of these may be used. Furthermore, electroless copper plating and electroless nickel plating are applied onto the plating seed layer.

[0037] From the viewpoints of electrical properties, ease of manufacture, and cost, it is preferable to form a copper layer on a titanium layer by sputtering the plating seed layers 301, 302, and 303 shown in Fig. 7. For the adhesion of the plating seed layer on the glass substrate, the film thickness is preferably 1 μm or less in the formation of fine wiring by the semi-additive method.

[0038] In FIG. 8, after plating seed layers 301, 302, and 303 are formed, a photoresist pattern 151 is formed. As an example of a method for forming the photoresist pattern 151, the photoresist to be formed may be a negative dry film resist, a negative liquid resist, or a positive liquid resist. In this embodiment, a negative dry film resist is used. For a negative dry film resist, a roll lamination method or a vacuum lamination method may be used. For a liquid resist, slit coating, curtain coating, die coating, spray coating, electrostatic painting inkjet, gravure coating, screen coating, etc. may be used. The method for forming these photoresists is not limited to the above, and may be used.

[0039] 9, a resist pattern 151 is formed by using a general photolithography technique so that the portion of the photoresist layer where the conductor layer is to be formed is exposed. The thickness of the resist layer 151 depends on the thickness of the conductive layer, and is preferably 5 μm or more and 25 μm or less.

[0040] Electroless plating layers 301 to 303 in Fig. 7 can be made of electroless copper plating, electroless nickel plating, etc., but electroless nickel plating is preferred because of its good adhesion to glass materials, titanium layers, and copper. If the electroless nickel plating is too thick, not only will it be difficult to form fine wiring, but it will also lead to a decrease in adhesion due to film stress and an increase in electrical resistance. Any material can be used as long as it has low resistance loss and can provide adhesion to the core substrate.

[0041] In addition, as a method for applying electricity to the through hole 2, other methods besides the sputtering process can be used, such as forming a primer film as a catalyst to improve adhesion with the glass, increasing the wettability inside the hole, and then wet-depositing copper on the wall surface.

[0042] 9, a current is applied to further thicken the wall of the through hole 2 in this embodiment, forming a copper plating layer 304. At this time, the copper material preferably has a thickness of 3 μm or more from the wall toward the center of the hole. When handling high frequencies of 2 GHz or more, the influence of the skin effect becomes significant, resulting in significant signal attenuation, so a thickness of 6 μm or more is more preferable. The current application in the through hole 2 may be in a filled shape filled with a conductive material or in a conformal shape. Possible current application methods include sputtering, electroless plating, electrolytic plating, filling, use of a surface treatment solution, printing, coating, and a combination of these, but the method is not limited.

[0043] In FIG. 9, the lower conductive layer 3 on the front and back of the core may be made of a metal material such as nickel, chromium, palladium, gold, or titanium. The conductive layer is formed by electrolytic copper plating or the like. In addition to electrolytic copper plating, electrolytic nickel plating, electrolytic chromium plating, electrolytic palladium plating, electrolytic gold plating, or the like may be used. The wiring material constituting the wiring pattern is mainly copper, but may be other metal materials such as nickel, chromium, palladium, gold, or titanium. The thickness of the conductive layer deposited by electrolytic copper plating is desirably 3 μm or more and 30 μm or less.

[0044] 10, the photoresist 151 is removed, leaving the wiring pattern 304 and plating seed layer 301, and exposing the plating seed layers 301, 302 on the front and back surfaces of the glass that were directly under the resist pattern 151. The method for removing the resist is not limited here, but a common method is to remove it using an alkaline aqueous solution.

[0045] 11, the plating seed layers 301, 302 in the exposed portions formed on the front and back of the core substrate 1 are removed, and a wiring pattern is formed on the lower conductive layer 3. To remove the plating seed layers, chemical etching is used for electroless nickel, copper, and titanium in that order. There are no particular limitations on the plating seed layer removal method and type of chemical solution.

[0046] 12 shows a state in which a capacitor structure 12 is formed on an insulating resin layer 9. A method for forming a MIM (Metal-Insulator-Metal) capacitor in this embodiment will be described in detail later.

[0047] At the same time as the opening is formed on the capacitor structure 12, an opening is formed that penetrates the insulating resin layer 9 and reaches the lower conductive layer 3. When the insulating resin is a non-photosensitive resin, a laser can be used to form the opening. The laser that can be used can be selected from CO2 laser, UV laser, picosecond laser, and femtosecond laser. Preferably, a UV laser or a CO2 laser is used because it is simple and convenient. In FIG. 12, if the insulating resin layer 9 is a photosensitive resin, it can be formed using photolithography. After the via opening is formed, a desmear process is appropriately performed using a permanganate solution to roughen and clean the resin surface and the inside of the opening in the resin. This can improve the adhesion with the metal layer used in the current application process. Alternatively, the resin surface and the inside of the opening may be cleaned by plasma treatment.

[0048] In Fig. 13, an electric current is applied to the opening formed in the insulating resin layer 9 in Fig. 12. The insulating resin layer 9, the opening, and the upper conductive layer 10 are formed by a known semi-additive process or subtractive process. This process may be repeated to form a layer on the upper conductive layer 10.

[0049] 12 is formed by sequentially stacking a plating seed layer 301, a copper plating layer 304, an adhesion layer 401, a dielectric layer 402, an adhesion layer 501, and a plating seed layer 502. A method for forming the capacitor structure 12 will be described with reference to FIGS.

[0050] The method for forming the thin film conductor which is the plating seed layer 301 in Fig. 14 may be a general method such as vacuum deposition, sputtering, ion plating, MBE, laser ablation, or CVD. The plating seed layer 301 is used as a power supply layer for forming the copper plating layer 304 by a semi-additive method. The plating seed layer 301 may be made of, for example, copper, nickel, titanium, aluminum, chromium, molybdenum, tungsten, tantalum, gold, palladium, iridium, ruthenium, platinum, or a combination of a plurality of these. Copper is more preferable because it simplifies the subsequent etching removal process.

[0051] The thickness of the plating seed layer 301 in FIG. 14 is preferably 10 nm or more and 5 μm or less. If the thickness of the plating seed layer is less than 10 nm, there is a concern that poor conduction may occur in the subsequent electrolytic copper plating process. If the thickness is 5 μm or more, it takes time to etch the parts to be removed in patterning. More preferably, the thickness is 100 nm or more and 500 nm or less.

[0052] In FIG. 15, titanium or the like is sputtered onto the lower electrode formed of the copper plating layer 304 to form an adhesion layer 401. The adhesion layer 401 is provided to improve the adhesion between the metal and the dielectric layer to increase the reliability of the MIM capacitor, and may not be formed if sufficient adhesion is ensured. The adhesion layer 501 also serves the same purpose and is formed as necessary. Furthermore, a thin film layer of silicon nitride, for example, is formed as the dielectric layer 402 of the MIM capacitor in FIG. 15. The dielectric layer 402 can be selected from alumina, silica, silicon nitride, tantalum oxide, titanium oxide, calcium titanate, barium titanate, and strontium titanate in terms of insulation properties and relative dielectric constant.

[0053] The thickness of the dielectric layer 402 is preferably 10 nm or more and 1 μm or less. If it is 10 nm or less, it is difficult to maintain insulation, and it may not function as a capacitor. Also, to achieve a thickness of 1 μm or more, it takes time to form a thin film. Therefore, it is more preferable that the dielectric thickness is 50 nm or more and 500 nm or less.

[0054] Next, a plating seed layer 502 is formed on the adhesion layer 501 as a power supply layer for forming the intermediate conductive layer 503 by a semi-additive method. The plating seed layer 502 may be made of, for example, copper, nickel, aluminum, titanium, chromium, molybdenum, tungsten, tantalum, gold, iridium, ruthenium, palladium, platinum, or a combination of a plurality of these. Copper is more preferable because it simplifies the subsequent etching removal process. The thickness of the plating seed layer 502 is preferably 10 nm or more and 5 μm or less. If the thickness of the plating seed layer is less than 10 nm, there is a concern that poor conduction may be caused in the subsequent electrolytic copper plating process. Also, if the thickness is 5 μm or more, it takes time to etch the removed portion in patterning. More preferably, the thickness is 100 nm or more and 500 nm or less.

[0055] Next, a resist pattern 152 is formed in FIG. 16. Electrolytic plating is performed on the openings of the resist via a plating seed layer 502. Examples of electrolytic plating include nickel electrolytic plating, copper electrolytic plating, chromium electrolytic plating, palladium electrolytic plating, and gold electrolytic plating, but a material that is easy to process, inexpensive, and has good electrical properties is preferred. An intermediate conductive layer 503 that becomes the upper electrode of the capacitor is composed of a copper plating layer. As a formation method, copper electrolytic plating is desirable because it is easy to form, inexpensive, and has high electrical conductivity. In addition to copper, nickel, chromium, palladium, gold, iridium, etc. may also be used.

[0056] 17, the unnecessary resist 152 is removed, and the upper electrode formed of the intermediate conductive layer 503 and the plating seed layer 502 are exposed on the substrate. The resist 152 can be removed by a chemical method using an alkaline solution or dry etching, but the removal method is not limited thereto.

[0057] 18, the periphery of the patterned plating seed layer 502 and copper plating layer 503 are covered with photoresist 153. Then, as shown in Fig. 19, unnecessary parts of adhesion layer 501, dielectric layer 402, and adhesion layer 401 laminated on the surface layer of core substrate 1 are removed, leaving the parts covered with photoresist 153. The removal method is not limited to this and may be a chemical method or a dry etching method.

[0058] 19, since the dielectric layer 402 is thin, a short circuit or the like is likely to occur between the ends of the lower electrode adhesion layer 401 and the upper electrode adhesion layer 501. Therefore, a method may be adopted in which the ends of the adhesion layer 501 are partially removed as necessary to prevent a short circuit with the adhesion layer 401.

[0059] The capacitor structure 12 shown in Fig. 20 is obtained by the above steps. The lower electrode, dielectric, and upper electrode of the capacitor structure 12 formed in this embodiment are formed by plating, etching, or the like using a resist pattern. However, the electrode shape and the dielectric shape are not limited as long as the conductor electrode area and dielectric volume calculated to obtain the desired capacitance value can be obtained. In this embodiment, the electrode shape is circular, but it may be polygonal or any other free shape.

[0060] To form the multilayer wiring board 15 of Fig. 21, conductive layers and insulating resin layers 9 are alternately laminated. The insulating resin may be made of epoxy resin, polyimide, maleimide, polyethylene terephthalate, polyphenylene oxide, liquid crystal polymer, or a composite material thereof, or may be made of photosensitive polyimide resin, photosensitive polybenzoxazole, or photosensitive acrylic-epoxy resin. The method for forming the insulating resin layer 9 is not limited. If the material is in sheet form, a vacuum lamination method, a vacuum press, a roll lamination method, or the like may be used.

[0061] If the insulating resin layer 9 is a liquid material, it can be selected from slit coating, curtain coating, die coating, spray coating, electrostatic painting, inkjet coating, gravure coating, screen printing, gravure offset printing, spin coating, doctor coating, etc. Also, a solder resist may be used in the outermost layer.

[0062] In forming the interlayer vias 7 in the insulating resin layer 9 in FIG. 22, if the resin is non-photosensitive, the via holes can be opened using laser processing. The same process can be used to open the upper electrode vias 6 of the capacitor and the bundling vias 8. Examples of the laser include CO2 lasers, UV lasers, picosecond lasers, and femtosecond lasers. If the insulating resin is a photosensitive material, the via holes can be formed using a photolithography method. This is not a limitation as long as the method can uniformly open the insulating resin and form via holes that can electrically connect the lower conductor layer and the upper conductor layer.

[0063] After the opening is formed, a desmear process is performed using a permanganic acid solution to roughen the resin surface and clean the inside of the via hole. This improves the adhesion of the interface between the copper plating layer and the insulating resin layer. A plasma process may be used to improve adhesion and clean the inside of the hole.

[0064] The interlayer vias 7 and the bundling vias 8 are interlayer connectors that electrically connect the wiring formed on the lower conductive layer 3 and the upper conductive layer 10. The bundling vias 8 are connected to a wiring pattern on the lower conductive layer 3 that has one end of an inductor that forms an LC resonant circuit and a lower electrode of a capacitor that forms the LC resonant circuit.

[0065] The formation of the insulating resin layer 9, the via holes, and the plating layers may be repeated using known techniques to form the multilayer wiring board 15.

[0066] In the process of laminating the lower conductive layer 3 on the core substrate 1 and forming a wiring pattern, an inductor structure 13 constituting the LC resonant circuit of the embodiment of the present invention is formed. The inductor is formed by alternately connecting the upper and lower layers of the core substrate 1 in series with a wiring pattern consisting of the through hole 2 in the core substrate 1 and the lower conductive layer 3 formed on the front and back sides of the core substrate 1. The wiring pattern may be formed into a planar spiral inductor. A solenoid type or a spiral type may be formed three-dimensionally in the insulating resin layer using the interlayer via 7. Any structure may be used as long as it has an inductance value. When the inductor and the capacitor constitute an LC resonant circuit, one end of the connection wiring of the inductor is located on the wiring pattern on the lower conductive layer 3, and is electrically connected to the capacitor by the wiring pattern on the lower conductive layer 3.

[0067] The inductance value of the inductance structure 13 depends on the number of turns, the cross section, and the inductance length, but in the case of a solenoid coil, the value can be controlled by using a magnetic material for the winding core.

[0068] In order to obtain a desired capacitance value, two capacitor structures 12 may be connected in series or in parallel, and the connection is performed using a wiring pattern formed on the lower conductive layer 3 or a wiring pattern formed on the upper conductive layer 10. When the inductor and the capacitor form an LC resonant circuit, the lower electrode of the capacitor formed on the lower conductive layer 3 is electrically connected to one end of the inductor formed on the lower conductive layer 3 by the wiring pattern formed on the lower conductive layer 3.

[0069] In the interlayer vias 7 and bundling vias 8 according to the embodiment of the present invention, via hole openings are formed in the insulating resin 9 from the upper layer side by a laser or the like, and electrical current is applied by plating filling.

[0070] In order to keep the high frequency current in the resonant state on the path closest to the LC resonant circuit, in this embodiment, the bundling vias 8 are arranged on the outer arc of a circle whose diameter is one end of the inductor and one end of the capacitor. In this embodiment, they are arranged on a circle with a diameter of 400 μm. The opening diameter of the upper electrode via 6 is 35 μm in this embodiment. The opening diameter is smaller than the lower electrode or upper electrode to which the via is connected, and is preferably 15 μm to 50 μm.

[0071] In this embodiment, the wiring pattern of the upper conductive layer 10 connected to the parallel resonant circuit through the bundling via 8 is directly connected to the input / output terminal. In the case of FIG. 23 where a filter is configured using a plurality of resonant circuits, the bundling parts that connect the resonant circuits with wiring patterns can be increased. In the case of FIG. 24 where a filter is configured using a resonant circuit on the main line, the bundling parts that connect the resonant circuits with wiring patterns can be used. There are cases where the parallel resonant circuit and the series resonant circuit are connected to GND at high frequency, and a method of connection using bundling vias 8 may be used.

[0072] As described above, in the embodiment of the present invention, at the portion where the element ends of the LC resonant circuit are connected, the LC resonant circuit and the main line are separated by the bundling via 8, thereby creating a point where the potentials match and separating the paths of the high frequency current. Also, even in a configuration in which multiple LC resonant circuits are arranged in a circuit, the individual current paths are separated by the bundling via 8.

[0073] This provides the effect of improving frequency selection characteristics, and enables a filter component with high frequency selectivity to be formed within a multilayer wiring board.

[0074] The bundling vias 8 can be formed simultaneously in the process of forming the upper electrode vias 6 and the interlayer vias 7. The wiring connecting the bundling vias 8 to the input / output terminals 601 to 604 can also be formed simultaneously in the process of forming wiring in the upper conductive layer 10. Therefore, there is no need to add a new process. EXAMPLES

[0075] Example 1 Figures 25-a and 25-b are top views of the simplest LC parallel resonant circuit constructed on a multilayer wiring board. The capacitor structure 12 and the inductor structure 13 are the same, and the dimensions of the elements are also the same. The circuit is designed so that the resonant frequency is about 5 GHz. The series and parallel resonant frequencies of L and C are: F=1 / (2π√(LC)) In order to obtain a resonance frequency of about 5 GHz, a capacitor structure of about 1 pF and an inductance of about 1 nH are arranged three-dimensionally.

[0076] Fig. 25-a shows a circuit having bundling vias 8 of the present invention. The wiring of the lower electrode layer is pulled out from the upper conductive layer 10 to the input / output terminals via bundling vias 8. On the other hand, Fig. 25-b shows a circuit in which the wiring of the lower wiring layer is pulled out directly to the input / output terminals. All wiring is covered with insulating resin 9 between layers.

[0077] 25-a and 25-b are assumed to have the cross sections of Fig. 2 and Fig. 4, respectively. EN-A1 (300 μm thick) manufactured by Asahi Glass Co., Ltd. was used as the core substrate 1. Glass with a thickness of 300 μm was prepared, and a through hole 2 was formed using a laser. At this time, the through hole 2 was designed to be cylindrical with a diameter of 80 μm.

[0078] Titanium and copper were formed by sputtering as a plating seed layer 301 for forming the lower conductive layer 3, and then electroless nickel plating was performed. The thicknesses of titanium / copper / nickel were 50 nm / 300 nm / 80 nm.

[0079] Next, a photosensitive dry film resist is applied by roll lamination, and then a resist pattern is formed by photolithography. A patterning of 7 μm of the lower conductive layer 3 is performed by copper plating, and the resist pattern is peeled off in an alkaline solution. The nickel, which is the plating seed layer, is removed using a nitric acid-hydrogen peroxide mixed etching solution, the copper is removed using a sulfuric acid-hydrogen peroxide mixed etching solution, and the titanium layer is removed using a potassium hydroxide-hydrogen peroxide etching solution, to form the desired inductance structure. The wiring width used for the inductance structure 13 is 110 μm, and the pitch of the through holes 2 is 385 μm in the radial direction of the inductor and 145 μm in the longitudinal direction, forming an inductance of 1.5 turns. The width of the wiring formed on the lower conductive layer may be 110 μm or more in accordance with the electrode dimensions.

[0080] Furthermore, silicon nitride is formed as a dielectric on the upper layer of the lower conductive layer to a thickness of 200 nm to form the capacitor structure 12. In this embodiment, titanium is not provided as an adhesive layer on the lower electrode. The upper electrode of the capacitor has a diameter of 111 μm and is circular, and two capacitors are formed on the upper conductive layer 10, and are connected in series through a wiring pattern with a wiring width of 110 μm and a via 6 on the upper electrode. After forming 50 nm of titanium as an adhesive layer 501 of the intermediate conductive layer 5 by sputtering, a 2 μm intermediate conductive layer 5 is formed by electrolytic copper plating, and this is used as the upper electrode of the MIM capacitor.

[0081] Build-up resin GX-T31 (manufactured by Ajinomoto Fine Techno Co., Ltd.) was used for the insulating resin layer 9. The interlayer via hole diameter was set to 35 μm. After desmear processing and electroless copper plating, a dry film resist with a thickness of 25 μm was formed on the front and back of the substrate.

[0082] After forming the capacitor structure 12, an insulating resin layer 9 is formed, and then via hole openings are formed using a UV laser processing machine. Then, a copper plating process is performed to energize the bundling vias 8, the interlayer vias 7, and the upper electrode vias 6.

[0083] After forming a resist pattern by photolithography, a conductor layer with a thickness of 7 μm is formed on the plating seed layer by electrolytic copper plating. The wiring width is set to 110 μm, and is partially enlarged to match the size of the electrodes. By repeating the above steps, the structure of the multilayer wiring board 15 can be obtained.

[0084] (LC parallel resonant circuit) The results of a three-dimensional electromagnetic field analysis performed using the above structure by simulation are shown below. The electromagnetic field analysis software used was HFSS by ANSYS. As an evaluation method, the transmission characteristics at the resonance frequency are shown in the graph of FIG. 26, with the transmission characteristics of input / output terminals 601 to 602 in FIG. 25 being "φ35 μm diameter bundling vias" and the transmission characteristics of input / output terminals 603 to 604 being "without bundling". As a result, in the models with and without bundling vias 8, the frequency shift of the resonance frequency is 10 MHz or less, and the model with bundling vias 8 can obtain a higher impedance at the resonance frequency, and can obtain a higher attenuation amount without a shift in the resonance frequency compared to the configuration without bundling vias.

[0085] Although the embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the gist of the present invention. [Explanation of symbols]

[0086] Reference Signs List 1...core substrate, 2...through hole, 3...lower conductive layer, 4...dielectric layer, 5...intermediate conductive layer, 6...via on upper electrode of capacitor, 7...interlayer via, 8...bonding via, 9...insulating resin layer, 10...upper conductive layer, 101...upper conductive layer GND, 12...capacitor structure, 121...capacitor unit, 13...inductor structure, 14...resonant circuit connection portion, 15...multilayer wiring substrate, 151...resist, 152...resist, 153...resist, 301...surface plating seed layer (lower conductive layer 3), 302...back Surface plating seed layer (lower conductive layer 3), 303...through hole inner plating seed layer, 304...copper plating layer (lower conductive layer 3), 401...lower electrode adhesion layer (titanium, etc.), 402...dielectric layer (alumina, silicon nitride, etc.), 501...upper electrode adhesion layer, 502...plating seed layer, 503...thick film layer of intermediate conductive layer, 601...input / output terminal, 602...input / output terminal, 603...input / output terminal, 604...input / output terminal, 901...insulating resin layer, 902...insulating resin layer, 903...insulating resin layer.

Claims

1. A multilayer wiring board having an LC parallel resonant circuit, the multilayer wiring board being formed by alternately laminating conductive layers and insulating resin layers on both sides of a core substrate, a first set of wirings that connect both ends of an inductor constituting the LC parallel resonant circuit to both ends of a capacitor constituting the LC parallel resonant circuit and that are formed on the conductive layer that is directly laminated on the core substrate; a set of vias penetrating the insulating resin layer; a second set of wiring connected to an input / output terminal of the LC parallel resonant circuit and formed on the conductive layer directly above the conductive layer laminated on the core substrate; a multilayer wiring board having an LC parallel resonant circuit in which the first set of wirings is connected to the second set of wirings through the set of vias;

2. 2. A multilayer wiring board having the LC parallel resonant circuit according to claim 1, a capacitor constituting the LC parallel resonant circuit, the capacitor being formed by laminating a dielectric layer and an upper electrode on a lower electrode formed on the conductive layer directly laminated on the core substrate.

3. 2. A multilayer wiring board having the LC parallel resonant circuit according to claim 1, The inductor constituting the LC parallel resonant circuit is a plurality of wirings formed on the conductive layer laminated directly on both sides of the core substrate; The multilayer wiring board has an LC parallel resonant circuit, which is a solenoid inductor in which a plurality of through holes, each of which is a hole penetrating the core board and has a conductive layer formed on the side wall of the hole, are connected in series.

4. An electronic component package using a multilayer wiring board having the LC parallel resonant circuit according to any one of claims 1 to 3, An electronic component package comprising a multilayer wiring substrate having the LC parallel resonant circuit and a passive component or an active component mounted or built into the multilayer wiring substrate.

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